JP2006261673A5

JP2006261673A5 -

Info

Publication number: JP2006261673A5
Application number: JP2006071649A
Authority: JP
Filing date: 2006-03-15
Publication date: 2009-04-16

Claims

A first insulating film;
A first conductive pad pattern formed on the first insulating film and surrounding an extended portion of the first insulating film;
A second insulating film formed on the first conductive pad pattern;
A first plurality of conductive vias having a first array structure formed through the second insulating film and electrically connected to the first conductive pad pattern;
A second conductive pad pattern electrically connected to the first plurality of conductive vias, formed in the second insulating film and surrounding an extended portion of the second insulating film;
A third insulating film formed on the second conductive pad pattern;
A second plurality of conductive vias having a second arrangement structure formed through the third insulating film and electrically connected to the second conductive pad pattern;
A bonding pad structure comprising: a third conductive pad pattern electrically connected to the second plurality of conductive vias and formed in the third insulating film.

The bonding pad structure according to claim 1, wherein the first array structure and the second array structure are substantially the same.

The first conductive pad pattern surrounds a plurality of extended portions of the first insulating film, and the second conductive pad pattern surrounds a plurality of extended portions of the second insulating film. The bonding pad structure according to claim 1 or 2 .

Extended portions of the first insulating film has an open sequence structure, claims 1-3 extended portion of the second insulating film is characterized by having an open sequence structure The bonding pad structure according to any one of the above.

The extended portion of the first insulating film is about 15% of the area defined by the periphery of the first conductive pad structure, and the extended portion of the second insulating film is the second portion. The bonding pad structure according to any one of claims 1 to 4, wherein the bonding pad structure is about 15% of an area defined by a peripheral edge of the conductive pad structure.

The extended portion of the first insulating film, claims 1-5, characterized in that it is arranged to have a direction substantially perpendicular to the extended portion of the second insulating film The bonding pad structure according to any one of the above.

The extended portion of the first insulating film is disposed in a direction substantially perpendicular to the extended portion of the second insulating film and laterally offset. The bonding pad structure according to any one of 1 to 6 .

Said first plurality of conductive vias, according to any one of claims 1 to 7, characterized in that said has side to be disposed in a direction that is offset relative to the second plurality of conductive vias Bonding pad structure.

Said first plurality of conductive vias claim 1, wherein the superimposed vertically are arranged in a direction which is a side to offset 90% or less with respect to the second plurality of conductive vias 9. The bonding pad structure according to any one of 8 above.

Said first plurality of conductive vias claim 1, characterized in that the side surfaces to overlapped vertically below 50% are arranged in a direction that is offset relative to the second plurality of conductive vias The bonding pad structure according to any one of 9 .

Said first plurality of conductive vias claim 1, characterized in that the side surfaces to overlapped vertically below 10% are arranged in a direction that is offset relative to the second plurality of conductive vias The bonding pad structure according to any one of 10 .

The first plurality of conductive vias are disposed so as to be in contact with the first conductive pad pattern between portions adjacent to each other among the portions where the first insulating film is extended,
The second plurality of conductive vias are disposed so as to be in contact with the second conductive pad pattern between adjacent portions of the extended portion of the second insulating film. The bonding pad structure according to any one of claims 1 to 11 .

The first plurality of conductive vias are arranged in a mesh pattern;
The second plurality of conductive vias are arranged in a mesh pattern, and are in contact with the second conductive pad pattern between adjacent portions of the extended portion of the second insulating film. The bonding pad structure according to any one of claims 1 to 12 .