JP2006253662A - Semiconductor device, and its fabrication process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device of higher performance and higher reliability, and also to provide a technique for fabricating that semiconductor device inexpensively with high yield. <P>SOLUTION: A first conductive layer is formed, a first liquid repellent layer is formed on the first conductive layer, a layer for ejecting a composition containing a mask layer forming material is formed on the first liquid repellent layer, the first liquid repellent layer is patterned by using the mask layer, a second liquid repellent layer is formed, an insulation layer is formed on the first conductive layer and the second liquid repellent layer, and a second conductive layer is formed on the insulation layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to a semiconductor device and a method for manufacturing the semiconductor device.

  2. Description of the Related Art In recent years, attention has been focused on an individual recognition technique in which an ID (individual identification number) is given to an individual object to clarify information such as a history of the object and to be useful for production and management. Among them, development of semiconductor devices capable of transmitting and receiving data without contact is underway. As such a semiconductor device, RFID (Radio Frequency Identification) (ID tag, IC tag, IC chip, RF tag (Radio Frequency), wireless tag, electronic tag, wireless chip), etc. are especially used in the company, market, etc. Has begun to be introduced.

Many of these semiconductor devices have a circuit using a semiconductor substrate such as silicon (Si) (hereinafter also referred to as an IC (Integrated Circuit) chip) and an antenna, and the IC chip is a memory circuit (hereinafter also referred to as a memory). And a control circuit. In addition, organic thin film transistors (hereinafter also referred to as TFTs) using organic compounds for control circuits, memory circuits, and the like, organic memories, and the like have been actively developed (for example, Patent Document 1).
Japanese Unexamined Patent Publication No. 7-22669

However, in a memory circuit using an organic compound in which a memory element is formed by providing an organic compound between a pair of electrodes, current does not flow easily and the drive voltage increases depending on the film thickness of the organic compound layer and the size of the memory circuit. There is a problem of end up.

Therefore, an object of the present invention is also to provide a technique capable of manufacturing a higher performance and higher reliability semiconductor device at a lower cost and with a higher yield.

    A substance containing an insulating material becomes fluid when the temperature rises to the glass transition temperature of the material. Therefore, an insulating layer made of a substance containing an insulating material becomes a composition having fluidity that does not maintain a certain shape at a temperature equal to or higher than the glass transition temperature, and exhibits a behavior close to a liquid state. When it comes to fluidity, the wettability of the surface of the formation region, which was not significantly affected in the solid state, will affect its shape, which is greatly related to the direction and speed of flow of the composition. .

    The wettability of the solid surface, which is the formation material, is influenced by the chemical properties of the surface. If the material has low wettability with respect to the composition having fluidity, the surface thereof becomes a region having low wettability with respect to the composition having fluidity (hereinafter also referred to as low wettability region), and the flow is reversed. When the substance has high wettability with respect to the composition having the property, the surface thereof becomes a region with high wettability with respect to the composition having the fluidity (hereinafter also referred to as the high wettability region). In the present invention, the wettability of the surface of the region to be formed is formed so that the insulating layer is formed over regions having different wettability when the insulating layer becomes a glass transition temperature or higher after voltage application and changes to a fluid composition. Are controlled by materials and processing.

    A region having different wettability is a region having a difference in wettability with respect to a composition having fluidity, and a contact angle of the composition having fluidity is different. A region with a large contact angle of a composition having fluidity is a region with lower wettability (hereinafter also referred to as a low wettability region), and a region with a small contact angle is a region with high wettability (hereinafter referred to as a high wettability region). Say). When the contact angle is large, the composition having fluidity does not spread on the surface of the region and repels the composition, so that the surface is not wetted, but when the contact angle is small, the composition having fluidity spreads on the surface. This is because the surface is often wetted. Therefore, regions having different wettability also have different surface energies. The surface energy of the surface in the region with low wettability is small, and the surface energy at the surface of the region with high wettability is large.

    In the present invention, an insulating layer (also referred to as a memory layer) included in a memory element included in the semiconductor device is formed over the first conductive layer. When a voltage is applied between the first conductive layer and the second conductive layer, current flows through the insulating layer to generate heat. And if the temperature of an insulating layer rises to glass transition temperature, the material which forms an insulating layer will turn into a composition which has fluidity | liquidity. The surface of the first conductive layer is controlled to have regions having different wettability with respect to the composition having fluidity. Specifically, by forming a region having liquid repellency with low wettability with respect to a composition having selective fluidity on the surface of the first conductive layer, two types of regions having a difference in wettability ( High wettability region and low wettability region). Since the composition having fluidity moves toward the higher wettability, the composition having fluidity flows into the highly wettable region having high wettability without maintaining the solid state shape. Therefore, the thickness of the insulating layer becomes nonuniform, the insulating layer is deformed, and the first conductive layer and the second conductive layer are short-circuited. In some cases, the electric field concentrates on a thin region of the insulating layer, causing a dielectric breakdown to cause a short circuit between the first conductive layer and the second conductive layer. Therefore, the conductivity of the memory element before and after voltage application changes.

Note that in this specification, a memory layer included in a memory element called an insulating layer shows insulating properties in a bulk state, but a small amount of current flows in a thin film state. In this specification, a memory layer having a slight conductivity depending on the shape is called an insulating layer instead of such a complete insulator.

    The difference in wettability is the relative relationship between the two regions. By selectively forming a low wettability region on a layer having a rough surface, two types of regions having different wettability can be formed. . As a method for selectively forming the low wettability region, a mask layer is formed, and the mask layer is used to selectively form a low wettability material. A lowering surface treatment method or the like can be used. Further, after forming the low wettability region, a method of selectively eliminating the low wettability effect (removal or decomposition of a substance having low wettability) or the like can be used.

    As a method of changing and controlling the wettability of the surface, there is a method of changing the wettability by decomposing the surface material and modifying the surface of the region by the energy of light irradiation. As a substance having low wettability, a substance containing a fluorocarbon chain or a substance containing a silane coupling agent can be used. Since the silane coupling agent can form a monomolecular film, it can be efficiently decomposed and modified, and the wettability can be changed in a short time. The monomolecular film can also be said to be a self-assembled film. A silane coupling agent can be used because it exhibits low wettability by arranging not only one having a fluorocarbon chain but also one having an alkyl group on a substrate. Moreover, since the functional group contained in the silane coupling agent differs depending on the fluorocarbon group or the alkyl group in reducing the wettability, it can be appropriately set depending on the material so as to obtain the required wettability. Moreover, you may use a titanate coupling agent and an aluminate coupling agent as a substance with low wettability.

  Note that in this specification, a semiconductor device refers to a device that can function by utilizing semiconductor characteristics. A semiconductor device such as a multilayer wiring layer or a processor chip can be manufactured by using the present invention.

    According to one embodiment of the semiconductor device of the present invention, a first conductive layer, a liquid repellent layer on a part of the first conductive layer, an insulating layer on the first conductive layer and the liquid repellent layer, and an insulating layer A memory element including the second conductive layer;

    According to one aspect of the semiconductor device of the present invention, a first conductive layer, a liquid repellent layer that is in contact with and overlaps the inner periphery of the first conductive layer, an insulating layer on the first conductive layer and the liquid repellent layer, and an insulating layer A memory element including a second conductive layer is provided over the layer.

    According to one embodiment of the semiconductor device of the present invention, a first conductive layer, a monomolecular film on a part of the first conductive layer, an insulating layer on the first conductive layer and the monomolecular film, and an insulating layer A memory element including the second conductive layer;

    According to one aspect of the semiconductor device of the present invention, a first conductive layer, a monomolecular film that is in contact with and overlaps the inner periphery of the first conductive layer, an insulating layer on the first conductive layer and the monomolecular film, A memory element including a second conductive layer is provided over the layer.

    In one embodiment of the method for manufacturing a semiconductor device of the present invention, a first conductive layer is formed, a liquid repellent layer is selectively formed over the first conductive layer, and insulation is performed over the first conductive layer and the liquid repellent layer. A layer is formed, and a second conductive layer is formed over the insulating layer to form a memory element.

    In one embodiment of the method for manufacturing a semiconductor device of the present invention, a first conductive layer is formed, a first liquid repellent layer is formed on the first conductive layer, and a mask layer forming material is formed on the first liquid repellent layer. A composition containing the composition is discharged to form a mask layer, the first liquid repellent layer is processed using the mask layer, a second liquid repellent layer is formed, and the first conductive layer and the second liquid repellent layer are formed. An insulating layer is formed thereover, and a second conductive layer is formed over the insulating layer to form a memory element.

    In one embodiment of the method for manufacturing a semiconductor device of the present invention, a first conductive layer is formed, a monomolecular film is selectively formed over the first conductive layer, and insulation is performed over the first conductive layer and the monomolecular film. A layer is formed, and a second conductive layer is formed over the insulating layer to form a memory element.

    In one embodiment of the method for manufacturing a semiconductor device of the present invention, a first conductive layer is formed, a first monomolecular film is formed on the first conductive layer, and a mask layer forming material is formed on the first monomolecular film. A first monomolecular film is processed by using the mask layer, a second monomolecular film is formed, and the first conductive layer and the second monomolecular film are formed. An insulating layer is formed thereover, and a second conductive layer is formed over the insulating layer to form a memory element.

According to the present invention, a semiconductor device with higher performance and higher reliability can be manufactured at low cost with high yield.

  Embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below. Note that in structures of the present invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description thereof is not repeated.

(Embodiment 1)
In this embodiment, an example of a structure of a memory element included in the memory device of the present invention will be described with reference to drawings. More specifically, the case where the structure of the memory device is a passive matrix type will be described.

    The memory element and its operation mechanism of the present invention will be described with reference to FIG. In FIG. 1, a partition wall (insulating layer) 51 a and a partition wall (insulating layer) 51 b are provided so as to cover an end portion of the first conductive layer 50. The partition wall (insulating layer) 51a and the partition wall (insulating layer) 51b also function as partition walls that separate other memory elements. In the present embodiment, when the insulating layer 52 becomes a composition having fluidity at the glass transition temperature, a region having different wettability with respect to the composition is formed on the first conductive layer 50, so A liquid layer 56 is formed. Since the liquid repellent layer 56 exhibits low wettability with respect to the composition having a fluid of the material forming the insulating layer 52, the liquid repellent layer 56 on the first conductive layer has a surrounding first conductive property. Compared with the surface of the layer, it becomes a relatively low wettability region. Therefore, the surface of the surrounding first conductive layer where the liquid repellent layer 56 is not formed becomes a highly wettable region. An insulating layer 52 that is an insulating layer is formed over the partition wall (insulating layer) 51 a, the partition wall (insulating layer) 51 b, the first conductive layer 50, and the liquid repellent layer 56, and the second conductive layer 53 is formed over the insulating layer 52. Form.

    For the material of the first conductive layer 50 and the second conductive layer 53, a highly conductive element or compound is used. In this embodiment, a material whose crystal state, conductivity, and shape are changed by an electric action or an optical action is used as the material of the insulating layer 52. Since the conductivity of the memory element having the above configuration changes before and after voltage application, two values corresponding to “initial state” and “after conductivity change” can be stored. A change in conductivity of the memory element before and after voltage application will be described.

    A substance including an insulating material forming the insulating layer has fluidity when the temperature rises to the glass transition temperature of the material. Therefore, the insulating layer becomes a composition having fluidity that does not maintain a certain shape above the glass transition temperature, and behaves close to a liquid state. When it comes to fluidity, the wettability of the surface of the formation region, which was not significantly affected in the solid state, will affect its shape, which is greatly related to the direction and speed of flow of the composition. .

    The wettability of the solid surface, which is the formation material, is influenced by the chemical properties of the surface. If the material has low wettability with respect to the composition having fluidity, the surface becomes a low wettability region with respect to the composition having fluidity, and conversely, the wettability with respect to the composition having fluidity. If the substance is a high-concentration substance, the surface thereof becomes a highly wettable region with respect to the composition having fluidity. In the present invention, the wettability of the surface of the region to be formed is formed so that the insulating layer is formed over regions having different wettability when the insulating layer becomes a glass transition temperature or higher after voltage application and changes to a fluid composition. Are controlled by materials and processing. Specifically, regions having different wettability with respect to a composition having fluidity are formed on the surface of the first conductive layer.

    A region having different wettability is a region having a difference in wettability with respect to a composition having fluidity, and a contact angle of the composition having fluidity is different. A region where the contact angle of the composition having fluidity is large is a region with low wettability, and a region with a small contact angle is a region with high wettability. When the contact angle is large, the composition having fluidity does not spread on the surface of the region and repels the composition, so that the surface is not wetted, but when the contact angle is small, the composition having fluidity spreads on the surface. This is because the surface is often wetted. Therefore, regions having different wettability also have different surface energies. The surface energy of the surface in the region with low wettability is small, and the surface energy at the surface of the region with high wettability is large.

    In this embodiment mode, the insulating layer 52 included in the memory element included in the memory device is formed over the first conductive layer 50. When a voltage is applied between the first conductive layer 50 and the second conductive layer 53, current flows through the insulating layer 52 and heat is generated. And if the temperature of an insulating layer rises to glass transition temperature, the material which forms the insulating layer 52 will turn into a composition which has fluidity | liquidity. By forming the liquid repellent layer 56, the surface of the first conductive layer 50 is controlled so as to have regions having different wettability with respect to a composition having fluidity, and two types of regions having a difference in wettability ( High wettability region and low wettability region).

  Since the composition having fluidity moves to a higher wettability, the composition having fluidity does not maintain the solid state shape, and the wettability is shown as shown in the directions of the arrows 54a and 54b. It flows not only on the surface of the liquid-repellent layer having a low viscosity but also in the surrounding highly wettable region. Therefore, the thickness of the insulating layer becomes nonuniform, the insulating layer is deformed, and the first conductive layer 50 and the second conductive layer 53 are in contact with each other as in a region 55 illustrated in FIG. The first conductive layer 50 and the second conductive layer 53 are short-circuited. In some cases, the electric field concentrates on a thin region of the insulating layer, causing a dielectric breakdown to cause a short circuit between the first conductive layer and the second conductive layer. Therefore, the conductivity of the memory element before and after voltage application changes. Further, as in this embodiment, the partition (insulating layer) 51a and the partition (insulating layer) 51b also have a strong attracting force if the wettability to the fluid composition that forms the insulating layer 52 is high. The composition is preferable because it is more easily transferred.

As a result, writing can be performed with low power consumption.

  The difference in contact angle between the high wettability region and the low wettability region on the surface of the first conductive layer 50 with respect to the fluidized composition of the insulating material is preferably 30 degrees or more, and more preferably 40 degrees or more.

    The difference in wettability is the relative relationship between the two regions. By selectively forming a low wettability region on a layer having a rough surface, two types of regions having different wettability can be formed. . As a method for selectively forming the low wettability region, a mask layer is formed, and the mask layer is used to selectively form a low wettability material. A lowering surface treatment method or the like can be used. Further, after the low wettability region is formed, a method of selectively eliminating the low wettability effect (removal or decomposition of a substance having low wettability) or the like can be used.

    As a method of changing and controlling the wettability of the surface, there is a method of changing the wettability by decomposing the surface material and modifying the surface of the region by the energy of light irradiation. As a substance having low wettability, a substance containing a fluorocarbon chain or a substance containing a silane coupling agent can be used. Since the silane coupling agent can form a monomolecular film, it can be efficiently decomposed and modified, and the wettability can be changed in a short time. The monomolecular film can also be said to be a self-assembled film. A silane coupling agent can be used because it exhibits low wettability by arranging not only one having a fluorocarbon chain but also one having an alkyl group on a substrate.

  FIG. 3 shows a structural example of the memory device of the present invention, which is a bit line driver circuit including a memory cell array 722 in which memory cells 721 are provided in a matrix, a column decoder 726a, a read circuit 726b, and a selector 726c. 726, a word line driver circuit 724 having a row decoder 724a and a level shifter 724b, and an interface 723 having a write circuit and the like for performing exchange with the outside. Note that the structure of the memory device 716 shown here is merely an example, and other circuits such as a sense amplifier, an output circuit, and a buffer may be included, and a write circuit may be provided in the bit line driver circuit.

  The memory cell 721 includes a first conductive layer constituting the word line Wy (1 ≦ y ≦ n), a second conductive layer constituting the bit line Bx (1 ≦ x ≦ m), and an insulating layer. . The insulating layer is provided as a single layer or a stacked layer between the first conductive layer and the second conductive layer.

  2A is a top view of the memory cell array 722, and FIGS. 2B and 2C are cross-sectional views taken along line AB in FIG. 2A. In FIG. 2A, the insulating layer 752 and the insulating layer 754 are omitted and not shown, but are provided as shown in FIG.

  The memory cell array 722 includes a first conductive layer 751a, a first conductive layer 751b, a first conductive layer 751c, a partition wall (insulating layer) 755, a first conductive layer 751a, a first conductive layer 751a extending in the first direction. An insulating layer 752 provided to cover the conductive layer 751b, the first conductive layer 751c, and the partition wall (insulating layer) 755; a second conductive layer 753a extending in a second direction perpendicular to the first direction; 2 conductive layers 753b and second conductive layers 753c (see FIG. 2A). An insulating layer 752 is provided between the first conductive layer 751a, the first conductive layer 751b, the first conductive layer 751c, the second conductive layer 753a, the second conductive layer 753b, and the second conductive layer 753c. It has been. In addition, an insulating layer 754 serving as a protective film is provided so as to cover the second conductive layer 753a, the second conductive layer 753b, and the second conductive layer 753c (see FIG. 2B). A liquid repellent layer 756a, a liquid repellent layer 756b, and a liquid repellent layer 756c are formed over the first conductive layer 751a, the first conductive layer 751b, and the first conductive layer 751c. One conductive layer 751b and the surface of the first conductive layer 751c are controlled to have regions with different wettability. Note that the insulating layer 752 provided in each memory cell may be separated when there is a concern about the influence of a horizontal electric field between adjacent memory cells.

  FIG. 2C is a modification example of FIG. 2B, in which a memory cell 791, a first conductive layer 791a, a first conductive layer 791b, a first conductive layer 791c, and an insulating layer are formed over a substrate 790. 792, a second conductive layer 793b, and an insulating layer 794 which is a protective layer. A liquid repellent layer 796a, a liquid repellent layer 796b, and a liquid repellent layer 796c are formed over the first conductive layer 791a, the first conductive layer 791b, and the first conductive layer 791c, and the first conductive layer 791a, One conductive layer 791b and the surface of the first conductive layer 791c are controlled to have regions with different wettability. As in the first conductive layer 791a, the first conductive layer 791b, and the first conductive layer 791c in FIG. 2C, the first conductive layer may have a tapered shape, and the curvature radius may be continuous. The shape may change. Shapes such as the first conductive layer 791a, the first conductive layer 791b, and the first conductive layer 791c can be formed by a droplet discharge method or the like. When the curved surface has such a curvature, the insulating layer and the conductive layer to be stacked have good coverage.

  If the partition wall (insulating layer) is formed as described above and the wettability of the partition wall (insulating layer) with high fluidity is high, the attracting force works strongly, so that the composition is more easily moved, which is preferable. . 15A and 15B illustrate a structure in which the end portion of the first conductive layer is covered with a partition wall (insulating layer).

    In FIG. 15A, a liquid repellent layer 776a, a liquid repellent layer 776b, and a liquid repellent layer 776c made of a material with low wettability are formed over the first conductive layer 771a, the first conductive layer 771b, and the first conductive layer 771c. An example formed is shown below. In this embodiment, a partition wall (insulating layer) 775 to be a partition wall is formed in a tapered shape so as to cover end portions of the first conductive layer 771a, the first conductive layer 771b, and the first conductive layer 771c. Is done. The first conductive layer 771a, the first conductive layer 771b, the first conductive layer 771c, the liquid repellent layer 776a, the liquid repellent layer 776b, and the liquid repellent layer 776c provided over the substrate 770 are subjected to a dry process such as an evaporation method. Thus, an insulating layer 772, a second conductive layer 773b, and a partition wall (insulating layer) 774 are formed. In the memory device illustrated in FIG. 15B, the partition wall (insulating layer) 765 has a curvature, and the curvature radius thereof continuously changes. The first conductive layer 761a, the first conductive layer 761b, Two liquid repellent layers 766a, 766b, lyophobic layers 766c, lyophobic layers 766d, lyophobic layers 766e, and two lyophobic layers 766f are formed on the first conductive layer 761c. The first conductive layer 761a, the first conductive layer 761b, the first conductive layer 761c, the liquid repellent layer 766a, the liquid repellent layer 766b, the liquid repellent layer 766c, the liquid repellent layer 766d, and the liquid repellent which are provided over the substrate 760 An insulating layer 762, a second conductive layer 763b, and an insulating layer 764 are formed over the layer 766e and the liquid repellent layer 766f. As described above, a plurality of liquid repellent layers formed on the first conductive layer may be formed, and may be controlled so as to have regions having different wettability. What is necessary is just to determine according to a magnitude | size and the required characteristic. The liquid repellent layer may be a thin film having a thickness of several nanometers, and may not have continuity as a film depending on the formation method.

  Further, in this specification, the liquid repellent layer is a film having a property of exhibiting liquid repellency (repelling the fluidized material) with respect to the fluidized material when the insulating layer formed on the liquid repellent layer is fluidized. Meaning, a solid film that repels liquid. The liquid repellent layer may be provided between the first conductive layer and the second conductive layer, and may be formed in contact with the first conductive layer or in contact with the second conductive layer. It may be contained in the insulating layer.

  As a substance having low wettability, a substance containing a fluorocarbon group (fluorocarbon chain) or a substance containing a silane coupling agent can be used. Since the silane coupling agent can form a monomolecular film, it can be efficiently decomposed and modified, and the wettability can be changed in a short time. Silane coupling agents can be used because they exhibit low wettability by arranging not only those having a fluorocarbon group (fluorocarbon chain) but also those having an alkyl group on the substrate. is there. Moreover, since the functional group contained in the silane coupling agent differs depending on the fluorocarbon group or the alkyl group in reducing the wettability, it can be appropriately set depending on the material so as to obtain the required wettability.

As a substance having low wettability, a substance containing a fluorocarbon group (fluorocarbon chain) or a substance containing a silane coupling agent can be used. The silane coupling agent is represented by a chemical formula of Rn—Si—X _(4-n) (n = 1, 2, 3). Here, R is a substance containing a relatively inert group such as an alkyl group. X is a hydrolyzable group such as halogen, methoxy group, ethoxy group or acetoxy group, which can be bonded by condensation with a hydroxyl group on the substrate surface or adsorbed water.

    As a substance having low wettability, alkoxysilane which is a substance having an alkyl group can be used for R of the silane coupling agent. For example, octadecyltrimethoxysilane or the like can be used as an organic silane. As alkoxysilane, C2-C30 alkoxysilane is preferable. Typically, decyltrimethoxysilane, ethyltriethoxysilane, propyltriethoxysilane, octyltriethoxysilane, decyltriethoxysilane, dodecyltriethoxysilane, octadecyltriethoxysilane (ODS), eicosyltriethoxysilane, tria An example is contitriethoxysilane. A silane compound having a long-chain alkyl group is particularly preferable because it can reduce wettability. Further, decyltrichlorosilane, tetradecyltrichlorosilane, octadecyltrichlorosilane, eicosyltrichlorosilane, docosyltrichlorosilane, and the like can also be used.

Further, as a representative example of the silane coupling agent, wettability can be further reduced by using a fluorine-based silane coupling agent (fluoroalkylsilane (FAS)) having a fluoroalkyl group in R. R of FAS has a structure represented by (CF ₃ ) (CF ₂ ) _x (CH ₂ ) _y (x: an integer of 0 or more and 10 or less, y: an integer of 0 or more and 4 or less), and a plurality of R Alternatively, when X is bonded to Si, R and X may all be the same or different. Typical FASs include fluoroalkyls such as heptadecafluorotetrahydrodecyltriethoxysilane, heptadecafluorotetrahydrodecyltrichlorosilane, tridecafluorotetrahydrooctyltrichlorosilane, trifluoropropyltrimethoxysilane, and tridecafluorooctyltrimethoxysilane. Silane (hereinafter also referred to as FAS) can be given. In addition, a coupling agent such as tridecafluorooctyltrichlorosilane whose hydrolyzable group is halogen can also be used. Of course, the compounds are not limited to the exemplified compounds.

  Moreover, you may use a titanate coupling agent and an aluminate coupling agent as a substance with low wettability. For example, isopropyl triisooctanoyl titanate, isopropyl (dioctyl pyrophosphate) titanate, isopropyl tristearoyl titanate, isopropyl tris (dioctyl phosphate) titanate, isopropyl dimethacrylisostearoyl titanate, acetoalkoxy aluminum diisopropylate and the like can be mentioned.

  In order to form the low wettability substance as a film in the formation region, a vapor deposition method in which a liquid substance is evaporated and formed in the formation region (for example, a substrate) can be used. . A substance with low wettability can be formed by a spin coating method, a dip method, a droplet discharge method, a printing method (screen printing, offset printing, or the like), or a solution dissolved in a solvent.

As a solvent of a solution containing a substance having low wettability, water, alcohol, ketone, hydrocarbon solvent (aliphatic hydrocarbon, aromatic hydrocarbon, halogenated hydrocarbon, etc.), ether compound, and a mixture thereof Can be used. For example, methanol, ethanol, propanol, acetone, butanone, n-pentane, n-hexane, n-heptane, n-octane, n-decane, dicyclopentane, benzene, toluene, xylene, durene, indene, tetrahydronaphthalene, deca Hydronaphthalene, squalane, carbon tetrachloride, chloroform, methylene chloride, trichloroethane, diethyl ether, dioxane, dimethoxyethane, tetrahydrofuran, or the like is used. The concentration of the solution is not particularly limited, but may be in the range of 0.001 to 20 wt%.

  In addition, amines such as pyridine, triethylamine, dimethylaniline may be mixed with the substance having low wettability. Further, a carboxylic acid such as formic acid or acetic acid may be added as a catalyst.

  As described above, the processing temperature when forming a monomolecular film using a spin coating method or the like in which a low wettability substance is attached to a formation region in a liquid state is from room temperature (about 25 ° C.) to 150 ° C. The processing time may be several minutes to 12 hours. The treatment conditions may be appropriately set depending on the nature of the substance having low wettability, the concentration of the solution, the treatment temperature, and the treatment time.

  In addition, when a thin film to be formed (regardless of a formation method) is washed with a solvent that can be used when a solution containing a substance with low wettability is prepared, an unreacted substance with low wettability can be removed. In this case, an ultrasonic cleaner or the like may be used.

  The film containing a substance with low wettability that can be used in the present invention may be a thin film with a thickness of 0.3 nm to 10 nm. Note that a thin film of a material with low wettability formed using a spin coating method or the like in which a substance with low wettability is attached to a formation region in a liquid state is very thin, and the thickness is in a range of 0.3 nm to 10 nm. It can be a monomolecular film.

In addition, as an example of a composition that is controlled to reduce wettability and forms a low wettability region, a material having a fluorocarbon (fluorocarbon) group (fluorocarbon chain) (fluorine-based resin) can be used. . Examples of fluorine resins include polytetrafluoroethylene (PTFE; tetrafluoroethylene resin), perfluoroalkoxyalkane (PFA; tetrafluoroethylene perfluoroalkyl vinyl ether copolymer resin), and perfluoroethylene propene copolymer (PFEP; four fluoropolymer). Ethylene-hexafluoropropylene copolymer resin), ethylene-tetrafluoroethylene copolymer (ETFE; tetrafluoroethylene-ethylene copolymer resin), polyvinylidene fluoride (PVDF; vinylidene fluoride resin), polychlorotrifluoroethylene (PCTFE; trifluoroethylene chloride resin), ethylene-chlorotrifluoroethylene copolymer (ECTFE; trifluoroethylene chloride-ethylene copolymer resin), polytetrafluoroethylene-perfluorodioxide Rukoporima (TFE / PDD), polyvinyl fluoride (PVF; a vinyl fluoride resin), or the like can be used.

In addition, when an inorganic material or an organic material is treated with CF ₄ plasma or the like, wettability can be reduced. For example, a material obtained by mixing a water-soluble resin such as polyvinyl alcohol (PVA) in a solvent such as H ₂ O as an organic material can be used. Moreover, you may use combining PVA and another water-soluble resin.

  As a method for processing the liquid repellent layer on the first conductive layer into a desired shape, light irradiation can be performed using a mask. A first conductive layer 601 is formed over a substrate 600, and a liquid repellent layer 602 made of a substance with low wettability is formed by a spin coating method or the like (see FIG. 16A). Light 606 emitted from the light source 603 passes through the substrate 604, and the metal film 605 formed on the substrate 604 serves as a mask. The light 606 that is not blocked by the mask decomposes the liquid repellent layer existing in the regions 607a, 607b, 607c, and 607d of the liquid repellent layer 602, and modifies the region (see FIG. 16B). Accordingly, the liquid repellent layer 608a, the liquid repellent layer 608b, and the liquid repellent layer 608c are formed over the first conductive layer 601 (see FIG. 16C).

    In order to improve the processing efficiency by light irradiation, a light absorber having an absorption region in the wavelength region of the light may be mixed in the liquid repellent layer. A light absorber having an absorption region in the wavelength region of light absorbs irradiated light and radiates (radiates) energy such as heat to the surroundings. The radiant energy acts on surrounding materials, and as a result, changes the physical properties of the materials and modifies them. When the present invention is used, a light absorber may be selected in accordance with the wavelength of light, so that the range of light selection is widened. Therefore, the wavelength of light can be selected, and light irradiation for performing surface modification with good controllability can be performed. In addition, since the light irradiation efficiency can be improved, sufficient processing can be performed even if the light itself has low energy. Therefore, since the apparatus and the process are simplified, cost and time can be reduced and productivity can be improved.

    As the light absorber, an organic material, an inorganic material, a substance containing an inorganic material, an organic material, or the like can be used. A material having an absorption region at the wavelength may be selected depending on the wavelength of light used. It may be a conductive material such as metal or an insulating material such as an organic resin. As the inorganic material, iron, gold, copper, silicon or germanium can be used, and as the organic material, plastic or pigment such as polyimide or acrylic can be used. For example, rhodamine can be used as the pigment corresponding to a light wavelength of 532 nm. Examples of pigments corresponding to light wavelengths of 300 nm to 400 nm such as B, eosin Y, methyl orange, and rose bengal include coumarins (coumarin 6H, coumarin 30, coumarin 102, coumarin 152, coumarin 153, coumarin 545T, etc.), Bis. MSB (l, 4-bis (abbreviation for o-methylstyryl) benzene) can be used. Further, as the coloring matter, black carbon black or a pigment-based black resin can be used. As other dyes, rhodamine 6G, dicyanomethylenepyran derivative (DCM), and the like can also be used.

    As the light absorber, a substance having a photocatalytic function (hereinafter simply referred to as a photocatalytic substance) can be used. Since the photocatalytic substance has photocatalytic activity, it can be activated by light irradiation and the substance surface can be modified by the energy.

Photocatalytic materials include titanium oxide (TiO _x ), strontium titanate (SrTiO ₃ ), cadmium selenide (CdSe), potassium tantalate (KTaO ₃ ), cadmium sulfide (CdS), zirconium oxide (ZrO ₂ ), niobium oxide ( Nb ₂ O ₅ ), zinc oxide (ZnO), iron oxide (Fe ₂ O ₃ ), tungsten oxide (WO ₃ ) and the like are preferable. These photocatalytic substances may be irradiated with light in the ultraviolet region (wavelength 400 nm or less, preferably 380 nm or less) to cause photocatalytic activity.

    The light used for the modification treatment is not particularly limited, and any one of infrared light, visible light, ultraviolet light, or a combination thereof can be used. For example, light emitted from an ultraviolet lamp, black light, halogen lamp, metal halide lamp, xenon arc lamp, carbon arc lamp, high pressure sodium lamp, or high pressure mercury lamp may be used. In that case, the lamp light source may be lit and irradiated for a necessary time, or may be irradiated multiple times.

    Laser light may be used. When laser light is used, a more precise pattern exposure process can be performed, so that an object to be formed can be highly fine. In this embodiment mode, a laser beam direct drawing apparatus is used in order to select and directly irradiate a processing region instead of selecting a region to be irradiated with laser light through a mask or the like. FIG. 17 shows this embodiment mode in which laser light is used for resist processing. A first conductive layer 611 is formed over a substrate 610, and a liquid repellent layer 612 made of a material with low wettability is formed by a spin coating method or the like (see FIG. 17A). A resist 613 is formed over the liquid repellent layer 612 and exposed with a laser beam 614 to expose the region 615. Since the resist 613 used in this embodiment is a negative resist, when it is processed with an etchant, only the exposed region 615 is formed as the resist 616 on the liquid-repellent layer 612 (see FIG. 17C). The liquid repellent layer 617 can be formed by processing the liquid repellent layer 612 into a desired shape using the resist 616 (see FIG. 17D). Since the liquid repellent layer is etched using a resist processed into a fine and accurate shape by laser light, the liquid repellent layer can be formed in a desired size and shape with good controllability.

As a laser oscillator of laser light, a laser oscillator that can oscillate ultraviolet light, visible light, or infrared light can be used. Examples of laser oscillators include excimer laser oscillators such as KrF, ArF, XeCl, and Xe, gas laser oscillators such as He, He—Cd, Ar, He—Ne, and HF, YAG, GdVO ₄ , YVO ₄ , YLF, and YAlO _3. A solid-state laser oscillator using a crystal doped with Cr, Nd, Er, Ho, Ce, Co, Ti, or Tm, and a semiconductor laser oscillator such as GaN, GaAs, GaAlAs, or InGaAsP can be used. In the solid-state laser oscillator, it is preferable to apply a fundamental wave, a second harmonic, and a third harmonic. In order to adjust the shape of the laser light emitted from the laser oscillator and the path of the laser light, an optical system including a reflector such as a shutter, a mirror or a half mirror, a cylindrical lens, or a convex lens may be installed.

    Further, the liquid repellent layer mask may be formed by a droplet discharge method. An example in which a mask is formed using a droplet discharge method is shown in FIG. A first conductive layer 621 is formed over a substrate 620, and a liquid repellent layer 622 made of a substance with low wettability is formed by a spin coating method or the like (see FIG. 18A). Next, a liquid composition containing a mask layer forming material is discharged onto the liquid repellent layer 622 from the droplet discharge device 623 to form a mask layer 624. Since the liquid composition has low wettability in the liquid-repellent layer, the mask layer 624 can be formed in a fine shape of a micro pattern without being wetted and spread on the surface of the liquid-repellent layer. The shape of the mask layer 624 may be controlled by the degree of wettability with the liquid repellent layer 622. Using the mask layer 624, the liquid repellent layer 622 can be processed into a desired shape to form the liquid repellent layer 625.

In the structure of the memory cell, as the substrate 750, the substrate 760, the substrate 770, and the substrate 790, a glass substrate, a flexible substrate, a quartz substrate, a silicon substrate, a metal substrate, a stainless steel substrate, or the like can be used. The flexible substrate is a substrate that can be bent (flexible), and examples thereof include a plastic substrate made of polycarbonate, polyarylate, polyethersulfone, or the like. It is also possible to use films (made of polypropylene, polyester, vinyl, polyvinyl fluoride, vinyl chloride, etc.), paper made of fibrous materials, substrate films (polyester, polyamide, inorganic vapor deposition film, papers, etc.), etc. it can. In addition, a memory cell array 722 may be provided above a field effect transistor (FET) formed on a semiconductor substrate such as Si or above a thin film transistor (TFT) formed on a substrate such as glass. it can.

  In addition, the first conductive layers 751a to 751c, the first conductive layers 761a to 761c, the first conductive layers 771a to 771c, the first conductive layers 791a to 791c, the second conductive layers 753a to 753c, the second For the conductive layer 763b, the second conductive layer 773b, and the second conductive layer 793b, an element, a compound, or the like with high conductivity is used. Typically, gold (Au), silver (Ag), platinum (Pt), nickel (Ni), tungsten (W), chromium (Cr), molybdenum (Mo), iron (Fe), cobalt (Co), From one element selected from copper (Cu), palladium (Pd), carbon (C), aluminum (Al), manganese (Mn), titanium (Ti), tantalum (Ta), etc. or an alloy containing a plurality of such elements A single layer or a laminated structure can be used. Examples of the alloy containing a plurality of the above elements include an alloy Al containing Al and Ti, an alloy containing Ti and C, an alloy containing Al and Ni, an alloy containing Al and C, and Al, Ni and C. An alloy containing Al or an alloy containing Al and Mo can be used.

  First conductive layers 751a to 751c, first conductive layers 761a to 761c, first conductive layers 771a to 771c, first conductive layers 791a to 791c, second conductive layers 753a to 753c, second conductive layers The 763b, the second conductive layer 773b, and the second conductive layer 793b can be formed by an evaporation method, a sputtering method, a CVD method, a dispenser method, a printing method, or a droplet discharge method.

  In this embodiment mode, data is written to the memory cell by applying an electric action or an optical action. When data is written by an optical action, the first conductive layers 751a to 751c, Conductive layers 761a to 761c, first conductive layers 771a to 771c, first conductive layers 791a to 791c, second conductive layers 753a to 753c, second conductive layers 763b, second conductive layers 773b, second One or both of the conductive layers 793b are provided so as to have a light-transmitting property. The light-transmitting conductive layer is formed using a transparent conductive material, or is formed with a thickness that allows light to pass even if it is not a transparent conductive material. As the transparent conductive material, other light-transmitting oxide conductive materials such as indium tin oxide (ITO), zinc oxide (ZnO), indium zinc oxide (IZO), gallium-doped zinc oxide (GZO), and the like are used. Is possible. Oxide conductivity formed using a target in which indium tin oxide containing ITO and silicon oxide (hereinafter referred to as ITSO) or indium oxide containing silicon oxide is mixed with 2 to 20 wt% zinc oxide (ZnO). A material may be used.

The insulating layer 752, the insulating layer 762, the insulating layer 772, and the insulating layer 792, which are memory layers, are an organic insulator, an organic compound whose conductivity is changed by an electric action or an optical action, an inorganic insulator, or an organic compound and an inorganic substance. It is formed of a layer formed by mixing with a compound. The insulating layer 752, the insulating layer 762, the insulating layer 772, and the insulating layer 792 may be provided as a single layer or a stack of a plurality of layers. Alternatively, a mixed layer of an organic compound and an inorganic compound and a layer formed of an organic compound whose conductivity is changed by another electric action or optical action may be provided.

Note that in this specification, a memory layer included in a memory element called an insulating layer shows insulating properties in a bulk state, but a small amount of current flows in a thin film state. In this specification, a memory layer having a slight conductivity depending on the shape is called an insulating layer instead of such a complete insulator.

As the inorganic insulator that can form the insulating layer 752, the insulating layer 762, the insulating layer 772, and the insulating layer 792, silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like can be used.

As an organic insulator that can form the insulating layer 752, the insulating layer 762, the insulating layer 772, and the insulating layer 792, an organic resin typified by polyimide, acrylic, polyamide, benzocyclobutene, epoxy, or the like is used. it can.

An organic compound that can form the insulating layer 752, the insulating layer 762, the insulating layer 772, and the insulating layer 792 and whose conductivity is changed by an electric action or an optical action is an organic compound having a high hole-transport property. A compound material or an organic compound material having a high electron transporting property can be used.

As an organic compound material having a high hole-transport property, 4,4′-bis [N- (1-naphthyl) -N-phenyl-amino] -biphenyl (abbreviation: α-NPD), 4,4′-bis [ N- (3-methylphenyl) -N-phenyl-amino] -biphenyl (abbreviation: TPD) or 4,4 ′, 4 ″ -tris (N, N-diphenyl-amino) -triphenylamine (abbreviation: TDATA) ), 4,4 ′, 4 ″ -tris [N- (3-methylphenyl) -N-phenyl-amino] -triphenylamine (abbreviation: MTDATA) and 4,4′-bis (N- (4- (N, N-di-m-tolylamino) phenyl) -N-phenylamino) biphenyl (abbreviation: DNTPD) and other aromatic amine-based compounds (that is, having a benzene ring-nitrogen bond) and phthalocyanines (abbreviation: H ₂ Pc), copper phthalo Phthalocyanine compounds such as cyanine (abbreviation: CuPc) and vanadyl phthalocyanine (abbreviation: VOPc) can be used. The substances described here are mainly substances having a hole mobility of 10 ⁻⁶ cm ² / Vs or higher. Note that other than the above substances, any substance that has a property of transporting more holes than electrons may be used.

Note that in the case where a mixed layer of an organic compound and an inorganic compound is provided, it is preferable to mix an organic compound material having a high hole-transport property and an inorganic compound material that easily receives electrons. By adopting such a structure, many hole carriers are generated in an organic compound that has essentially no intrinsic carrier, and exhibits extremely excellent hole injecting and hole transporting properties. As a result, the organic compound layer can obtain excellent conductivity.

  As an inorganic compound material that easily receives electrons, a metal oxide, metal nitride, or metal oxynitride of a transition metal in any of Groups 4 to 12 of the periodic table can be used. Specifically, titanium oxide (TiOx), zirconium oxide (ZrOx), vanadium oxide (VOx), molybdenum oxide (MoOx), tungsten oxide (WOx), tantalum oxide (TaOx), hafnium oxide (HfOx), niobium oxide (NbOx), cobalt oxide (Cox), rhenium oxide (ReOx), ruthenium oxide (RuOx), zinc oxide (ZnO), nickel oxide (NiOx), copper oxide ( CuOx) or the like can be used. Further, although oxides are given as specific examples here, these nitrides and oxynitrides may of course be used.

As an organic compound material having a high electron-transport property, tris (8-quinolinolato) aluminum (abbreviation: Alq ₃ ), tris (4-methyl-8-quinolinolato) aluminum (abbreviation: Almq ₃ ), bis (10-hydroxybenzo [ h] -quinolinato) beryllium (abbreviation: BeBq ₂ ), bis (2-methyl-8-quinolinolato)-(4-phenylphenolato) -aluminum (abbreviation: BAlq), etc., metal complexes having a quinoline skeleton or a benzoquinoline skeleton, etc. The material which consists of can be used. In addition, bis [2- (2-hydroxyphenyl) benzoxazolate] zinc (abbreviation: Zn (BOX) ₂ ), bis [2- (2-hydroxyphenyl) benzothiazolate] zinc (abbreviation: Zn (BTZ) A material such as a metal complex having an oxazole-based or thiazole-based ligand such as ₂ ) can also be used. In addition to metal complexes, 2- (4-biphenylyl) -5- (4-tert-butylphenyl) -1,3,4-oxadiazole (abbreviation: PBD), 1,3-bis [5- (P-tert-butylphenyl) -1,3,4-oxadiazol-2-yl] benzene (abbreviation: OXD-7), 3- (4-tert-butylphenyl) -4-phenyl-5- ( 4-biphenylyl) -1,2,4-triazole (abbreviation: TAZ), 3- (4-tert-butylphenyl) -4- (4-ethylphenyl) -5- (4-biphenylyl) -1,2, 4-triazole (abbreviation: p-EtTAZ), bathophenanthroline (abbreviation: BPhen), bathocuproin (abbreviation: BCP), and the like can be used. The substances mentioned here are mainly substances having an electron mobility of 10 ⁻⁶ cm ² / Vs or higher. Note that other than the above substances, any substance that has a property of transporting more electrons than holes may be used.

Note that in the case of providing a mixed layer of an organic compound and an inorganic compound, it is preferable to mix an organic compound material having a high electron-transport property and an inorganic compound material that easily gives electrons. By adopting such a structure, many electron carriers are generated in an organic compound that has essentially no intrinsic carrier, and exhibits extremely excellent electron injection properties and electron transport properties. As a result, the organic compound layer can obtain excellent conductivity.

  As the inorganic compound material that easily gives electrons, alkali metal oxides, alkaline earth metal oxides, rare earth metal oxides, alkali metal nitrides, alkaline earth metal nitrides, and rare earth metal nitrides can be used. Specifically, lithium oxide (LiOx), strontium oxide (SrOx), barium oxide (BaOx), erbium oxide (ErOx), sodium oxide (NaOx), lithium nitride (LiNx), magnesium nitride (MgNx), calcium nitride, yttrium nitride (YNx), lanthanum nitride (LaNx), or the like can be used.

  Furthermore, as the inorganic compound material, any inorganic compound material that easily receives electrons from an organic compound or inorganic compound material that easily gives electrons to an organic compound may be used. Aluminum oxide (AlOx), gallium oxide (GaOx), silicon In addition to oxide (SiOx), germanium oxide (GeOx), indium tin oxide (ITO), and the like, various metal oxides, metal nitrides, or metal oxynitrides can be used.

  In the case where the insulating layer 752, the insulating layer 762, the insulating layer 772, and the insulating layer 792 are formed using a compound selected from metal oxides or metal nitrides and a compound having a high hole-transport property, further steric hindrance It is good also as a structure which added the compound (having the structure which has a spatial extension unlike a plane structure) of large. As the compound having a large steric hindrance, 5,6,11,12-tetraphenyltetracene (abbreviation: rubrene) is preferable. However, besides this, hexaphenylbenzene, t-butylperylene, 9,10-di (phenyl) anthracene, coumarin 545T, and the like can also be used. In addition, dendrimers and the like are also effective.

Furthermore, 4-dicyanomethylene-2-methyl-6- [2- (1,1) is formed between a layer formed of an organic compound material having a high electron-transport property and an organic compound material layer having a high hole-transport property. 1,7,7-tetramethyljulolidin-9-yl) ethenyl] -4H-pyran (abbreviation: DCJT), 4-dicyanomethylene-2-tert-butyl-6- [2- (1,1,7, 7-tetramethyljulolidin-9-yl) ethenyl] -4H-pyran, periflanthene, 2,5-dicyano-1,4-bis [2- (10-methoxy-1,1,7,7-tetramethyljuro) Lysine-9-yl) ethenyl] benzene, N, N′-dimethylquinacridone (abbreviation: DMQd), coumarin 6, coumarin 545T, tris (8-quinolinolato) aluminum (abbreviation: Alq ₃ ), 9,9′-biant Ril, 9,10-diphenylanthracene (abbreviation: DPA), 9,10-bis (2-naphthyl) anthracene (abbreviation: DNA), 2,5,8,11-tetra-t-butylperylene (abbreviation: TBP) A luminescent material such as may be provided.

The insulating layer 752, the insulating layer 762, the insulating layer 772, and the insulating layer 792 can be formed using a material whose electric resistance changes by an optical action. For example, a conjugated polymer doped with a compound that generates an acid by absorbing light (a photoacid generator) can be used. As the conjugated polymer, polyacetylenes, polyphenylene vinylenes, polythiophenes, polyanilines, polyphenylene ethynylenes, and the like can be used. As the photoacid generator, arylsulfonium salts, aryliodonium salts, o-nitrobenzyl tosylate, arylsulfonic acid p-nitrobenzyl esters, sulfonylacetophenones, Fe-allene complex PF ₆ salts, and the like can be used. .

  The insulating layer 752, the insulating layer 762, the insulating layer 772, and the insulating layer 792 can be formed by an evaporation method, an electron beam evaporation method, a sputtering method, a CVD method, or the like. Moreover, the mixed layer containing an organic compound and an inorganic compound can be formed by simultaneously forming the respective materials. The co-evaporation method using resistance heating evaporation, the co-evaporation method using electron beam evaporation, and resistance heating. It can be formed by a combination of the same or different methods such as co-evaporation by vapor deposition and electron beam vapor deposition, film formation by resistance heating vapor deposition and sputtering, and film formation by electron beam vapor deposition and sputtering.

Note that the insulating layer 752, the insulating layer 762, the insulating layer 772, and the insulating layer 792 are formed to have thicknesses at which the conductivity of the memory element is changed by an electric action or an optical action.

    The partition walls (insulating layers) 51a and 51b, the partition wall (insulating layer) 755, the partition wall (insulating layer) 765, and the partition wall (insulating layer) 775 include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, and oxynitride. Aluminum or other inorganic insulating materials, acrylic acid, methacrylic acid and derivatives thereof, heat-resistant polymers such as polyimide, aromatic polyamide, polybenzimidazole, or siloxane materials may be used. . Note that the siloxane material corresponds to a resin including a Si—O—Si bond. Siloxane has a skeleton structure formed of a bond of silicon (Si) and oxygen (O). As a substituent, an organic group containing at least hydrogen (for example, an alkyl group or an aromatic hydrocarbon) is used. A fluoro group may be used as a substituent. Alternatively, an organic group containing at least hydrogen and a fluoro group may be used as a substituent. Further, a resin material such as a vinyl resin such as polyvinyl alcohol or polyvinyl butyral, an epoxy resin, a phenol resin, a novolac resin, an acrylic resin, a melamine resin, or a urethane resin is used. Alternatively, an organic material such as benzocyclobutene, parylene, or polyimide, a compound material made by polymerization of a siloxane polymer, a composition material containing a water-soluble homopolymer and a water-soluble copolymer, or the like may be used. As a manufacturing method, a vapor deposition method such as a plasma CVD method or a thermal CVD method, or a sputtering method can be used. Also, a dispenser method, a droplet discharge method, or a printing method (a method for forming a pattern such as screen printing or offset printing) can be used. A coating film obtained by a coating method can also be used.

    Further, after a conductive layer, an insulating layer, or the like is formed by discharging a composition by a droplet discharge method, the surface may be flattened by pressing with a pressure in order to improve the flatness. As a pressing method, unevenness may be reduced by scanning a roller-shaped object on the surface, or the surface may be pressed vertically with a flat plate-like object. A heating step may be performed when pressing. Alternatively, the surface may be softened or dissolved with a solvent or the like, and the surface irregularities may be removed with an air knife. Further, polishing may be performed using a CMP method. This step can be applied when the surface is flattened when unevenness is generated by the droplet discharge method.

  In this embodiment, in the above structure, the first conductive layers 751a to 751c, the first conductive layers 761a to 761c, the first conductive layers 771a to 771c, and the first conductive layers 791a to 791c are insulated from each other. A rectifying element may be provided between the layer 752, the insulating layer 762, the insulating layer 772, and the insulating layer 792. The element having a rectifying property is a transistor or a diode in which a gate electrode and a drain electrode are connected. Thus, by providing a diode having a rectifying property, current flows only in one direction, so that an error is reduced and a read margin is improved. Note that the rectifying element includes the insulating layer 752, the insulating layer 762, the insulating layer 772, the insulating layer 792, the second conductive layers 753a to 753c, the second conductive layer 763b, the second conductive layer 773b, and the second layer. The conductive layer 793b may be provided.

    With the memory element of the present invention, the driving voltage at the time of data writing can be reduced. As a result, a memory device and a semiconductor device with low power consumption can be provided at low cost with high yield.

(Embodiment 2)
In this embodiment, a memory device having a structure different from that in Embodiment 1 is described. Specifically, a case where the structure of the memory device is an active matrix type will be described.

  FIG. 5 shows an example of a structure of the memory device described in this embodiment. A bit line including a memory cell array 232 in which memory cells 231 are provided in a matrix, a column decoder 226a, a read circuit 226b, and a selector 226c. It has a driver circuit 226, a word line driver circuit 224 having a row decoder 224a and a level shifter 224b, an interface 223 having a write circuit and the like for performing exchanges with the outside. Note that the structure of the memory device 217 shown here is merely an example, and other circuits such as a sense amplifier, an output circuit, and a buffer may be included, and a writing circuit may be provided in the bit line driver circuit.

  The memory cell array 232 includes a first wiring configuring the word line Wy (1 ≦ y ≦ n), a second wiring configuring the bit line Bx (1 ≦ x ≦ m), a transistor 210a, and a storage element 215b. And a memory cell 231. The memory element 215b has a structure in which an insulating layer is sandwiched between a pair of conductive layers.

  4A is a top view of the memory cell array 232, and FIG. 4B is a cross-sectional view taken along line EF in FIG. 4A. In FIG. 4A, the insulating layer 212 and the insulating layer 214 are omitted and not shown, but are provided as shown in FIG. 4B.

  The memory cell array 232 includes a first wiring 205a and a first wiring 205b extending in a first direction and a second wiring 202 extending in a second direction perpendicular to the first direction in a matrix. It has been. The first wiring is connected to the source electrode or the drain electrode of the transistors 210a and 210b, and the second wiring is connected to the gate electrodes of the transistors 210a and 210b. Further, the first conductive layer 206a and the first conductive layer 206b are connected to the source or drain electrodes of the transistor 210a and the transistor 210b which are not connected to the first wiring, respectively. A memory element 215a and a memory element 215b are provided by a stacked structure of one conductive layer 206b, an insulating layer 212, and a second conductive layer 213. A partition wall (insulating layer) 207 is provided between each adjacent memory cell 231, and an insulating layer 212 and a second conductive layer 213 are stacked over the first conductive layer and the partition wall (insulating layer) 207. Yes. An insulating layer 214 serving as a protective layer is provided over the second conductive layer 213. Thin film transistors are used as the transistors 210a and 210b (see FIG. 4B). The memory device in FIG. 4B is provided over a substrate 200, and includes an insulating layer 201a, an insulating layer 201b, an insulating layer 208, an insulating layer 209, an insulating layer 211, a semiconductor layer 204a included in the transistor 210a, and a gate electrode layer. 202a, a wiring 205a also serving as a source electrode layer or a drain electrode layer, a wiring 205b also serving as a source electrode layer or a drain electrode layer, a semiconductor layer 204b included in the transistor 210b, and a gate electrode layer 202b. A liquid repellent layer 216a and a liquid repellent layer 216b are formed over the first conductive layer 206a and the first conductive layer 206b, respectively. The liquid repellent layer 216a and the liquid repellent layer 216b have a circular shape in the top view because the mask layer used for processing is formed by a droplet discharge method.

    In this embodiment, the liquid repellent layer 216a and the liquid repellent layer 216b, which are regions having low wettability with respect to the composition having selectively fluidity, are formed on the surfaces of the first conductive layer 206a and the first conductive layer 206b. As a result, two types of regions having a difference in wettability (a high wettability region and a low wettability region) are formed. The composition having fluidity does not stay on the liquid-repellent layer 216a and liquid-repellent layer 216b having low wettability, but moves to the higher wettability, so that the composition having fluidity maintains a solid state shape. Without flowing, it flows to a highly wettable region with high wettability. Therefore, the thickness of the insulating layer 212 is not uniform, the insulating layer 212 is deformed, and the first conductive layer and the second conductive layer are short-circuited. In some cases, the electric field concentrates on a thin region of the insulating layer, causing a dielectric breakdown to cause a short circuit between the first conductive layer and the second conductive layer. Therefore, the conductivity of the memory element before and after voltage application changes.

    In this embodiment, the insulating layer 212 is formed in contact with the first conductive layer 206a and a partition wall (insulating layer) 207 that covers an end portion of the first conductive layer. Therefore, if the wettability with respect to the fluid composition composed of the material of the insulating layer 212 is higher on the surface of the partition wall (insulating layer) 207 than on the surface of the first conductive layer 206a, the fluidity is higher. The composition is preferable because it is easy to move.

As a result, writing can be performed with low power consumption.

  Further, as illustrated in FIG. 6, a memory element 265 a and a memory element 265 b may be connected to the field effect transistor 260 a and the field effect transistor 260 b provided over the single crystal semiconductor substrate 250. Here, an insulating layer 270 is provided so as to cover the source or drain electrode layers 255a to 255d of the field effect transistor 260a and the field effect transistor 260b, and the first conductive layer 256a and the first conductive layer are provided over the insulating layer 270. The memory element 265a and the memory element 265b are formed by 256b, the partition wall (insulating layer) 267, the insulating layer 262a, the insulating layer 262b, and the second conductive layer 263. As for the insulating layer 262a and the insulating layer 262b, the insulating layer 262 may be selectively provided only in each memory cell using a mask or the like. In addition, the memory device illustrated in FIG. 6 also includes an element isolation region 268, an insulating layer 269, an insulating layer 261, and an insulating layer 264. Two liquid repellent layers 266a and 266b, two liquid repellent layers 266c, and two liquid repellent layers 266d are formed on the first conductive layer 256a and the first conductive layer 256b, respectively.

  In this manner, by providing the insulating layer 270 and forming the memory element, the first conductive layer can be freely arranged. In other words, in the structure in FIG. 4B, the memory element 215a and the memory element 215b need to be provided in a region where the source electrode layer or the drain electrode layer of the transistor 210a and the transistor 210b are avoided. For example, the memory element 215a and the memory element 215b can be formed above the transistors 210a and 210b. As a result, the storage device 217 can be more highly integrated.

  Further, the transistor 210a and the transistor 210b may have any structure as long as they can function as switching elements. As the semiconductor layer, various semiconductors such as an amorphous semiconductor, a crystalline semiconductor, a polycrystalline semiconductor, and a microcrystalline semiconductor can be used, and an organic transistor may be formed using an organic compound. FIG. 4A illustrates an example in which a planar thin film transistor is provided over an insulating substrate; however, a transistor can be formed with a staggered structure, an inverted staggered structure, or the like.

    FIG. 7 shows an example using a thin film transistor having an inverted staggered structure. Over the substrate 280, transistors 290a and 290b which are thin film transistors having an inverted staggered structure are provided. The transistor 290a includes an insulating layer 288, a gate electrode layer 281, an amorphous semiconductor layer 282, a semiconductor layer 283a having one conductivity type, a semiconductor layer 283b having one conductivity type, a source or drain electrode layer 285, The source electrode layer or the drain electrode layer is a first conductive layer 286a and a first conductive layer 286b included in the memory element. A partition wall (insulating layer) 287 is stacked so as to cover end portions of the first conductive layer 286a and the first conductive layer 286b, and the first conductive layer 286a, the first conductive layer 286b, and the partition wall (insulating layer) 287 are stacked. An insulating layer 292, a second conductive layer 293, and an insulating layer 294 which is a protective layer are formed over the memory element 295a and the memory element 295b. A liquid repellent layer 296a and a liquid repellent layer 296b are formed over the first conductive layer 286a and the first conductive layer 286b, respectively.

    In this embodiment, the liquid repellent layer 296a and the liquid repellent layer 296b which are regions having low wettability with respect to the composition having selective fluidity are formed on the surfaces of the first conductive layer 286a and the first conductive layer 286b. As a result, two types of regions having a difference in wettability (a high wettability region and a low wettability region) are formed. The composition having fluidity does not stay on the liquid-repellent layer 296a and the liquid-repellent layer 296b having low wettability, and moves to the higher wettability, so that the composition having fluidity maintains a solid state shape. Without flowing, it flows to a highly wettable region with high wettability. Accordingly, the thickness of the insulating layer 292 becomes nonuniform, the insulating layer 292 is deformed, and the first conductive layer 286a, the first conductive layer 286b, and the second conductive layer 293 are short-circuited. In addition, an electric field may be concentrated on a thin region of the insulating layer 292, causing dielectric breakdown, which may cause a short circuit between the first conductive layer and the second conductive layer. Therefore, the conductivity of the memory element before and after voltage application changes.

    In this embodiment, the insulating layer 292 is formed in contact with the first conductive layer 286a and a partition wall (insulating layer) 287 that covers an end portion of the first conductive layer 286b. Therefore, if the wettability with respect to the fluid composition composed of the material of the insulating layer 292 is higher on the surface of the partition wall (insulating layer) 287 than on the surface of the first conductive layer 286a, the fluidity is higher. The composition is preferable because it is easy to move.

As a result, writing can be performed with low power consumption.

  In the memory device illustrated in FIG. 7, the gate electrode layer 281, the source or drain electrode layer 285, the first conductive layer 286a, the first conductive layer 286b, and the partition wall (insulating layer) 287 are formed by a droplet discharge method. Form. The droplet discharge method is a method in which a composition containing a composition forming material that is a fluid is discharged (jetted) as droplets to form a desired pattern shape. A droplet containing a component forming material is discharged onto a region where the component is to be formed, and fixed by firing, drying, or the like to form a component having a desired pattern.

    One mode of a droplet discharge apparatus used for the droplet discharge method is shown in FIG. The individual heads 1405 and 1412 of the droplet discharge means 1403 are connected to the control means 1407, which can be drawn in a pre-programmed pattern under the control of the computer 1410. The drawing timing may be performed with reference to a marker 1411 formed on the substrate 1400, for example. Alternatively, the reference point may be determined based on the edge of the substrate 1400. This is detected by the imaging means 1404, converted into a digital signal by the image processing means 1409, is recognized by the computer 1410, a control signal is generated, and sent to the control means 1407. As the imaging unit 1404, a charge coupled device (CCD), an image sensor using a complementary metal oxide semiconductor, or the like can be used. Of course, the information on the pattern to be formed on the substrate 1400 is stored in the storage medium 1408. Based on this information, a control signal is sent to the control means 1407, and each head 1405 of the droplet discharge means 1403 is sent. The heads 1412 can be individually controlled. The material to be discharged is supplied from the material supply source 1413 and the material supply source 1414 to the head 1405 and the head 1412 through piping.

    The inside of the head 1405 has a structure having a space filled with a liquid material as indicated by a dotted line 1406 and a nozzle that is a discharge port. Although not shown, the head 1412 has the same internal structure as the head 1405. When the nozzles of the head 1405 and the head 1412 are provided in different sizes, different materials can be drawn simultaneously with different widths. With one head, conductive material, organic material, inorganic material, etc. can be discharged and drawn respectively. When drawing in a wide area like an interlayer film, the same material is used from multiple nozzles to improve throughput. It is possible to discharge and draw at the same time. In the case of using a large substrate, the head 1405 and the head 1412 can freely scan on the substrate in the direction of the arrow to freely set a drawing area, and a plurality of the same pattern can be drawn on a single substrate. it can.

    In the case of forming a conductive layer by using a droplet discharge method, a conductive layer is formed by discharging a composition containing a conductive material processed into a particulate form and fusing or fusion-bonding and solidifying by firing. In such a conductive layer (or insulating layer) formed by discharging and baking a composition containing a conductive material, the conductive layer (or insulating layer) formed by sputtering or the like is mostly a columnar structure. In many cases, a polycrystalline state having many grain boundaries is exhibited.

  Further, any structure of a semiconductor layer included in the transistor may be used. For example, an impurity region (including a source region, a drain region, and an LDD region) may be formed, or a p-channel type or an n-channel may be formed. You may form with either type | mold. Further, an insulating layer (side wall) may be formed so as to be in contact with the side surface of the gate electrode, or a silicide layer may be formed on one or both of the source and drain regions and the gate electrode. As a material for the silicide layer, nickel, tungsten, molybdenum, cobalt, platinum, or the like can be used.

  The materials and formation methods of the first conductive layers 206a, 206b, 256a, 256b, 286a, and 286b and the second conductive layers 213, 263, and 293 described in this embodiment are the same as those described in Embodiment 1. And any of the formation methods.

  The insulating layers 212, 262a, 262b, and 292 can be provided using a material and a formation method similar to those of the insulating layer 752 described in Embodiment 1.

  Further, a rectifying element may be provided between the first conductive layers 206a, 206b, 256a, 256b, 286a, 286b and the insulating layers 212, 262a, 262b, 292. The element having a rectifying property is a transistor or a diode in which a gate electrode and a drain electrode are connected. For example, a PN junction diode provided by stacking an N-type semiconductor layer and a P-type semiconductor layer can be used. Thus, by providing a diode having a rectifying property, current flows only in one direction, so that an error is reduced and a read margin is improved. Note that when a diode is provided, a diode having another structure such as a diode having a PIN junction or an avalanche diode may be used instead of a diode having a PN junction. Note that a rectifying element may be provided between the insulating layers 212, 262 a, 262 b, and 292 and the second conductive layers 213, 263, and 293.

    With the memory element of the present invention, the driving voltage at the time of data writing can be reduced. As a result, a memory device and a semiconductor device with low power consumption can be provided at low cost with high yield.

(Embodiment 3)
In this embodiment, an example of a semiconductor device including the memory device described in the above embodiment will be described with reference to drawings.

  The semiconductor device described in this embodiment is characterized in that data can be read and written in a non-contact manner. A data transmission format is an electromagnetic which performs communication by mutual induction with a pair of coils arranged opposite to each other. There are roughly divided into a coupling system, an electromagnetic induction system that communicates using an induction electromagnetic field, and a radio system that communicates using radio waves, but any system may be used. In addition, there are two types of antennas used for data transmission. When one antenna is provided on a substrate on which a plurality of elements and memory elements are provided, the other is provided with a plurality of elements and memory elements. In some cases, a terminal portion is provided over the substrate, and an antenna provided over another substrate is connected to the terminal portion.

  First, a structure example of a semiconductor device in the case where an antenna is provided over a substrate provided with a plurality of elements and memory elements will be described with reference to FIGS.

  FIG. 10 illustrates a semiconductor device having a memory device formed of an active matrix type. A transistor portion 330 including transistors 310a and 310b over a substrate 300, a transistor portion 340 including transistors 320a and 320b, an insulating layer 301a, An element formation layer 335 including 301b, 308, 309, 311, 316, and 314 is provided, and a storage element portion 325 and a conductive layer 343 functioning as an antenna are provided above the element formation layer 335.

  Note that here, the case where the memory element portion 325 or the conductive layer 343 functioning as an antenna is provided above the element formation layer 335 is shown; however, the structure is not limited thereto, and the memory element portion 325 or the conductive layer 343 functioning as an antenna is provided. Can be provided below the element formation layer 335 or in the same layer.

  The memory element portion 325 includes memory elements 315a and 315b. The memory element 315a has a partition wall (insulating layer) 307a, a partition wall (insulating layer) 307b, an insulating layer 312 and a second conductive layer on the first conductive layer 306a. The memory element 315b includes a partition wall (insulating layer) 307b, a partition wall (insulating layer) 307c, an insulating layer 312 and a second conductive layer 313 which are stacked over the first conductive layer 306b. Is provided. In addition, an insulating layer 314 that covers the second conductive layer 313 and functions as a protective film is formed. The first conductive layer 306a and the first conductive layer 306b in which the plurality of memory elements 315a and 315b are formed are connected to the source electrode layer or the drain electrode layer of each of the transistors 310a and 310b. That is, each memory element is connected to one transistor. In addition, although the insulating layer 312 is formed over the entire surface so as to cover the first conductive layers 306a and 306b and the partition walls (insulating layers) 307a, 307b, and 307c, the insulating layer 312 may be selectively formed in each memory cell. . Note that the memory elements 315a and 315b can be formed using any of the materials and manufacturing methods described in the above embodiment modes. On the first conductive layer 306a and the first conductive layer 306b, a liquid repellent layer 326a and a liquid repellent layer 326b, which are low wettability regions, are formed, respectively, and the first conductive layer 306a and the first conductive layer 306b are formed. The surface of the layer 306b has regions with different wettability.

  In the memory elements 315a and 315b, the surface of the liquid repellent layer 326a and the liquid repellent layer 326b has the fluidity of the material forming the insulating layer 312 from the surrounding first conductive layer 306a and first conductive layer 306b. Low wettability to objects. Accordingly, the composition having fluidity of the material forming the insulating layer 312 moves from the liquid repellent layer 326a and the liquid repellent layer 326b, and the film thickness of the insulating layer 312 becomes nonuniform, so that the memory elements 315a and 315b have Short circuit.

  In addition, as shown in the above embodiment mode, the memory element 315a has a rectifying property between the first conductive layer 306a and the insulating layer 312 or between the insulating layer 312 and the second conductive layer 313. An element may be provided. The above-described elements having a rectifying property can also be used. The same applies to the memory element 315b.

  Here, the conductive layer 343 functioning as an antenna is formed over the conductive layer 341 formed using the same layer as the first conductive layers 306 a and 306 b and the conductive layer 342 formed using the same layer as the second conductive layer 313. Is provided. Note that a conductive layer functioning as an antenna may be formed using the same layer as the second conductive layer 313. The conductive layer 341 is connected to the source electrode layer or the drain electrode layer of the transistor 320a.

  As a material of the conductive layer 343 functioning as an antenna, gold (Au), platinum (Pt), nickel (Ni), tungsten (W), molybdenum (Mo), cobalt (Co), copper (Cu), aluminum (Al ), Manganese (Mn), titanium (Ti), or the like, or an alloy containing a plurality of such elements can be used. As a method for forming the conductive layer 343 functioning as an antenna, vapor deposition, sputtering, a CVD method, a dispenser method, various printing methods such as screen printing and gravure printing, a droplet discharge method, and the like can be used.

  The transistors 310a, 310b, 310c, and 310d included in the element formation layer 335 can be provided using a p-channel TFT, an n-channel TFT, or a combination of these. Further, any structure of the semiconductor layer included in the transistors 310a, 310b, 310c, and 310d may be used. For example, an impurity region (including a source region, a drain region, and an LDD region) may be formed. The p channel type or the n channel type may be used. Further, an insulating layer (side wall) may be formed so as to be in contact with the side surface of the gate electrode, or a silicide layer may be formed on one or both of the source and drain regions and the gate electrode. As a material for the silicide layer, nickel, tungsten, molybdenum, cobalt, platinum, or the like can be used.

  Alternatively, the transistors 310a, 310b, 310c, and 310d included in the element formation layer 335 may be organic transistors in which a semiconductor layer included in the transistor is formed using an organic compound. In this case, the element formation layer 335 including an organic transistor can be formed over the flexible substrate such as plastic as the substrate 300 by using a direct printing method, a dispenser method, a droplet discharge method, or the like. By using a printing method, a droplet discharge method, or the like, a semiconductor device can be manufactured at lower cost.

  Further, as described above, the element formation layer 335, the memory elements 315a and 315b, and the conductive layer 343 functioning as an antenna are formed by evaporation, sputtering, CVD, dispenser, printing, droplet discharge, or the like. be able to. Note that a different method may be used depending on each place. For example, a transistor that requires high-speed operation is provided by crystallizing by heat treatment after forming a semiconductor layer made of Si or the like on a substrate, and then a transistor that functions as a switching element above the element formation layer is dispenser method, An organic transistor can be provided by a printing method or a droplet discharge method.

Note that a sensor connected to the transistor may be provided. Examples of the sensor include an element that detects temperature, humidity, illuminance, gas (gas), gravity, pressure, sound (vibration), acceleration, and other characteristics by physical or chemical means. The sensor is typically formed of a semiconductor element such as a resistance element, a capacitive coupling element, an inductive coupling element, a photovoltaic element, a photoelectric conversion element, a thermoelectric element, a transistor, a thermistor, or a diode.

  Next, a structure example of a semiconductor device in the case where a terminal portion is provided over a substrate provided with a plurality of elements and memory elements and an antenna provided over another terminal is connected to the terminal portion is described with reference to FIG. I will explain.

  FIG. 11 illustrates a semiconductor device having a passive matrix memory device, in which an element formation layer 385 is provided over a substrate 350, a memory element portion 375 is provided above the element formation layer 385, and the substrate 396 is provided. A conductive layer 393 functioning as an antenna is provided so as to be connected to the element formation layer 385. Note that here, the case where the memory element portion 375 or the conductive layer 393 functioning as an antenna is provided above the element formation layer 385 is shown; however, the present invention is not limited to this structure, and the memory element portion 375 is provided below the element formation layer 385. A conductive layer 393 functioning as an antenna can be provided below the element formation layer 385 in the same layer.

  In FIG. 11, an element formation layer 385 including a transistor portion 380 having transistors 360a and 360b on a substrate 350, a transistor portion 390 having transistors 370a and 370b, and insulating layers 351a, 351b, 358, 359, 361, 366, and 364. Is provided.

  The memory element portion 375 includes memory elements 365a and 365b. In the memory element 365a, partition walls (insulating layers) 357a and 357b, an insulating layer 362a, and a second conductive layer 363a are stacked over the first conductive layer 356. In the memory element 365b, partition walls (insulating layers) 357b and 357c, an insulating layer 362b, and a second conductive layer 363b are stacked over the first conductive layer 356. In addition, an insulating layer 364 that functions as a protective film is formed so as to cover the second conductive layers 363a and 363b. In addition, the first conductive layer 356 in which the plurality of memory elements 365a and 365b are formed is connected to one source electrode layer or drain electrode layer of the transistor 360b. That is, the memory element is connected to the same single transistor. In addition, although the insulating layers 362a and 362b are provided with partition walls (insulating layers) 357a, 357b, and 357c for separating the insulating layers for each memory cell, the influence of the electric field in the lateral direction is exerted on the adjacent memory cells. If there is no concern, it may be formed on the entire surface. Note that the memory elements 365a and 365b can be formed using the material or the manufacturing method described in the above embodiment modes. On the first conductive layer 356, a liquid repellent layer 376a and a liquid repellent layer 376b, which are low wettability regions, are formed, and the surface of the first conductive layer 356 has regions with different wettability. .

  In the memory elements 365a and 365b, the surfaces of the liquid repellent layer 376a and the liquid repellent layer 376b are wetted by the composition having fluidity of the material forming the insulating layers 362a and 362b from the surrounding first conductive layer 356. The nature is low. Accordingly, the fluid composition of the material forming the insulating layers 362a and 362b moves from the liquid repellent layer 376a and the liquid repellent layer 376b, and the film thickness of the insulating layers 362a and 362b becomes nonuniform. 365a and 365b are short-circuited.

  A substrate including the element formation layer 385 and the memory element portion 375 and a substrate 396 provided with a conductive layer 393 functioning as an antenna are attached to each other with a resin 395 having adhesiveness. The conductive layer 393 is provided over the conductive layer 391 formed using the same layer as the first conductive layer 356 and the conductive layer 392 formed using the same layer as the second conductive layers 363a and 363b. The conductive layer 391 is connected to the source electrode layer or the drain electrode layer of the transistor 370a. The element formation layer 385 and the conductive layer 393 are electrically connected through conductive fine particles 394 contained in the resin 395. In addition, a conductive layer such as a silver paste, a copper paste, or a carbon paste or a method of performing solder bonding is used to provide a substrate including the element formation layer 385 and the memory element portion 375, and a conductive layer 393 that functions as an antenna. The substrate 396 may be attached.

  In this manner, a semiconductor device including a memory device and an antenna can be formed. In this embodiment mode, an element formation layer can be provided by forming a thin film transistor over a substrate, or by forming a field effect transistor over a substrate using a semiconductor substrate such as Si as the substrate. A layer may be provided. Alternatively, an SOI substrate may be used as a substrate, and an element formation layer may be provided thereover. In this case, the SOI substrate may be formed by using a method of bonding wafers or a method called SIMOX in which an insulating layer is formed inside by implanting oxygen ions into the Si substrate.

Further, the memory element portion may be provided on a substrate provided with a conductive layer functioning as an antenna. A sensor connected to the transistor may be provided.

Note that this embodiment can be freely combined with the above embodiment. In addition, the semiconductor device manufactured in this embodiment can be provided over a flexible substrate by being separated from the substrate by a separation process and bonded onto a flexible substrate, so that a flexible semiconductor device can be obtained. Can do. Flexible substrate means film made of polypropylene, polyester, vinyl, polyvinyl fluoride, vinyl chloride, paper made of fibrous material, substrate film (polyester, polyamide, inorganic vapor deposition film, paper, etc.) and adhesiveness It corresponds to a laminated film with a synthetic resin film (acrylic synthetic resin, epoxy synthetic resin, etc.). The film is subjected to heat treatment and pressure treatment by thermocompression bonding. When the heat treatment and pressure treatment are performed, the film is either an adhesive layer provided on the outermost surface of the film or the A layer (not an adhesive layer) provided in the outer layer is melted by heat treatment and bonded by pressure. Further, an adhesive layer may be provided on the substrate, or an adhesive layer may not be provided. The adhesive layer corresponds to a layer containing an adhesive such as a thermosetting resin, an ultraviolet curable resin, an epoxy resin adhesive, or a resin additive.

    With the memory element of the present invention, the driving voltage at the time of data writing can be reduced. As a result, a memory device and a semiconductor device with low power consumption can be provided at low cost with high yield.

(Embodiment 4)
In this embodiment mode, reading or writing of data in the semiconductor device having the above structure is described.

  Data writing to the semiconductor device having the above structure can be performed by applying an optical action or an electrical action. First, a case of writing data by applying an electrical action will be described (see FIG. 3).

  In the case where data is written by applying an electrical action, one memory cell 721 is selected by the row decoder 724a, the column decoder 726a, and the selector 726c, and then data is stored in the memory cell 721 using a writing circuit. Write. Specifically, a large voltage is selectively applied to the desired portion of the insulating layer 752 to flow a large current, thereby short-circuiting the first conductive layer 751b and the second conductive layer 753b.

  The shorted portion has a significantly lower electrical resistance than the other portions. In this manner, data is written by utilizing the change in the electrical resistance between the two conductive layers by applying an electrical action. For example, in a case where an insulating layer to which no electrical action is applied is set to “0” data, when writing “1” data, a large voltage is selectively applied to a desired portion of the insulating layer to generate a large current. By flowing, the electrical resistance is reduced by short-circuiting.

  Next, a case where data is written by applying an optical action will be described (see FIGS. 8A to 8C).

  In the case where data is written by applying an optical action, the insulating layer 752 is irradiated with laser light from the light-transmitting conductive layer side (here, second conductive layers 753a, 753b, and 753c). Here, the insulating layer 752 is destroyed by selectively irradiating a desired portion of the insulating layer 752 with laser light. Since the destroyed insulating layer is carbonized and insulated, the electric resistance is significantly increased as compared with other portions. In this manner, data is written by utilizing the change in electrical resistance of the insulating layer 752 due to laser light irradiation. For example, in the case where an insulating layer not irradiated with laser light is set to “0” data, when writing “1” data, the insulating layer in a desired portion is selectively irradiated with laser light to be destroyed. Increase the electrical resistance.

  In order to perform writing, the resistance value of the memory element has only to be changed before and after writing. Therefore, the resistance value of the memory element may be changed by an optical action or an electrical action. For example, the shape of the first conductive layer or the second conductive layer in the memory element changes due to energy (heat, etc.) due to light irradiation, and the first conductive layer and the second conductive layer approach, and the change Accordingly, the insulating layer may be deformed and the resistance value may be changed.

In the case of laser light irradiation, the change in the electrical resistance of the insulating layer 752 depends on the size of the memory cell 721, but by irradiation of the laser light with a beam spot diameter reduced to μm or nm using an optical system such as a lens. Realize. For example, when a laser beam having a diameter of 1 μm passes at a linear velocity of 10 m / sec, the time during which the insulating layer included in one memory cell 721 is irradiated with laser light is 100 nsec. In order to change the phase within a short time of 100 nsec, the laser power is preferably 10 mW and the power density is 10 kW / mm ² . In the case of selectively irradiating laser light, it is preferable to use a pulsed laser irradiation apparatus.

  Here, an example of a laser irradiation apparatus will be briefly described with reference to FIG. A laser irradiation apparatus 1001 includes a computer (hereinafter, referred to as a PC) 1002 that executes various controls when irradiating laser light, a laser oscillator 1003 that outputs laser light, a power source 1004 of the laser oscillator 1003, and laser light. An optical system (ND filter) 1005 for attenuating light, an acousto-optic modulator (AOM) 1006 for modulating the intensity of the laser light, and a lens and an optical path for reducing the cross section of the laser light An optical system 1007 composed of a mirror for changing the angle, a moving mechanism 1009 having an X-axis stage and a Y-axis stage, a D / A conversion unit 1010 for digital-analog conversion of control data output from the PC, Acousto-optic modulator 10 according to the analog voltage output from the D / A converter A driver 1011 for controlling the 6, a driver 1012 for outputting a driving signal for driving the movement mechanism 1009 is provided with an auto-focus mechanism 1013 for focusing the laser beam on the irradiated object.

As the laser oscillator 1003, a laser oscillator that can oscillate ultraviolet light, visible light, or infrared light can be used. Laser oscillators include excimer laser oscillators such as KrF, ArF, KrF, XeCl, and Xe, gas laser oscillators such as He, He—Cd, Ar, He—Ne, and HF, YAG, GdVO ₄ , YVO ₄ , YLF, and YAlO. Cr crystal such as _{3, Nd, Er, Ho,} Ce, Co, solid-state laser oscillator using a crystal doped with Ti or Tm, can be used GaN, GaAs, GaAlAs, a semiconductor laser oscillator of InGaAsP or the like. In the solid-state laser oscillator, it is preferable to apply the fundamental wave or the second to fifth harmonics.

  Next, an irradiation method using a laser irradiation apparatus will be described. When the substrate 750 provided with the insulating layer 752 is attached to the moving mechanism 1009, the PC 1002 detects the position of the insulating layer 752 to be irradiated with laser light by a camera (not shown). Next, the PC 1002 generates movement data for moving the movement mechanism 1009 based on the detected position data.

  Thereafter, the PC 1002 controls the output light amount of the acousto-optic modulator 1006 via the driver 1011, so that the laser light output from the laser oscillator 1003 is attenuated by the optical system 1005 and then the acousto-optic modulator 1006. The light amount is controlled so as to be a predetermined light amount. On the other hand, the laser light output from the acousto-optic modulator 1006 is changed in optical path and beam spot shape by the optical system 1007, condensed by a lens, and then irradiated onto the substrate 750.

  At this time, according to the movement data generated by the PC 1002, the movement mechanism 1009 is controlled to move in the X direction and the Y direction. As a result, laser light is irradiated to a predetermined place, the light energy density of the laser light is converted into thermal energy, and the insulating layer provided over the substrate 750 can be selectively irradiated with the laser light. Note that, here, an example in which the moving mechanism 1009 is moved and laser light irradiation is performed is shown; however, the laser light may be moved in the X direction and the Y direction by adjusting the optical system 1007.

  Next, an operation for reading data from the memory element will be described (see FIG. 9). Here, the reading circuit 726 b includes a resistance element 746 and a sense amplifier 747. Note that the structure of the reading circuit 726b is not limited to the above structure, and may have any structure.

  Data is read by applying voltage between the first conductive layer 751b and the second conductive layers 753a, 753b, and 753c to read the electrical resistance of the insulating layer 752. For example, as described above, when data is written by applying an electrical action, the resistance value Ra1 when no electrical action is applied, and when the two conductive films are short-circuited by applying an electrical action. The resistance value Rb1 satisfies Ra1> Rb1. Data is read by electrically reading such a difference in resistance value.

  In addition, as described above, when data is written by irradiating the insulating layer with laser light, the resistance value Ra2 when the laser light is not irradiated and when the insulating layer is destroyed by irradiating the laser light Resistance value Rb2 satisfies Ra2 <Rb2. Data is read by electrically reading such a difference in resistance value.

  For example, when data is read from a plurality of memory cells 721 included in the memory cell array 722 to the memory cell 721 arranged in the xth column and the yth row, first, the row decoder 724a, the column decoder 726a, and the selector 726c The bit line Bx in the column and the word line Wy in the y row are selected. Then, the insulating layer included in the memory cell 721 and the resistance element 746 are connected in series. Thus, when a voltage is applied across the two resistance elements connected in series, the potential of the node α becomes a resistance-divided potential according to the resistance value Ra or Rb of the insulating layer 752. The potential of the node α is supplied to the sense amplifier 747, and the sense amplifier 747 determines whether it has information “0” or “1”. Thereafter, a signal including information of “0” and “1” determined by the sense amplifier 747 is supplied to the outside.

  According to the above method, the state of the electrical resistance of the insulating layer is read as a voltage value using the difference in resistance value and resistance division. However, a method of comparing current values may be used. This is because, for example, the current value Ia1 when no electrical action is applied to the insulating layer and the resistance value Ib1 when the electrical action is applied to short-circuit the two conductive films satisfy Ia1 <Ib1. It is what you use. Further, when data is written by irradiating the insulating layer with laser light, the current value Ia2 when the laser light is not irradiated and the current value Ib2 when the insulating layer is destroyed by irradiating the laser light are: , Ia2> Ib2. In this way, data may be read by electrically reading the difference in current value.

  Since the memory element having the above structure and the semiconductor device including the memory element are nonvolatile memories, a battery for holding data may not be mounted. A small, thin, and lightweight semiconductor device can be provided. In addition, data can be written (added) by using the insulating material used in the above embodiment as an insulating layer, but data cannot be rewritten. Therefore, it is possible to provide a semiconductor device that prevents forgery and ensures security.

  Note that in this embodiment, a passive matrix memory element with a simple structure of a memory circuit and a semiconductor device including the memory element are described as examples; however, an active matrix memory circuit is provided. Even in this case, data can be written or read in the same manner.

  Here, in the case of the active matrix type, a case where data in the memory element portion is read by an electrical action will be described with reference to FIG.

  FIG. 14 shows a current-voltage characteristic 951 of the memory element unit in which data “0” is written to the memory element unit, a current-voltage characteristic 952 of the memory element unit in which data “1” is written, and a resistance element A current-voltage characteristic 953 of H.246 is shown. Here, a case where a transistor is used as the resistance element 246 is shown. Further, a case where 3 V is applied between the first conductive layer and the second conductive layer as an operation voltage when reading data will be described.

  In FIG. 14, in a memory cell having a memory element portion in which data of “0” is written, an intersection 954 between the current-voltage characteristic 951 of the memory element part and the current-voltage characteristic 953 of the transistor serves as an operating point. The potential of the node α is V2 (V). The potential of the node α is supplied to the sense amplifier 247. In the sense amplifier 247, the data stored in the memory cell is determined as “0”.

  On the other hand, in a memory cell having a memory element portion in which data of “1” is written, an intersection 955 between the current-voltage characteristic 952 of the memory element part and the current-voltage characteristic 953 of the transistor serves as an operating point. The potential of α is V1 (V) (V1 <V2). The potential of the node α is supplied to the sense amplifier 247. In the sense amplifier 247, the data stored in the memory cell is determined as “1”.

  As described above, the data stored in the memory cell can be determined by reading the resistance-divided potential in accordance with the resistance value of the memory element portion 241.

Note that this embodiment can be freely combined with the structures of the memory element and the semiconductor device including the memory element described in the above embodiment.
(Embodiment 5)

The configuration of the semiconductor device of this embodiment will be described with reference to FIG. As shown in FIG. 12, the semiconductor device 20 of the present invention has a function of communicating data without contact, and controls the power supply circuit 11, the clock generation circuit 12, the data demodulation / modulation circuit 13, and other circuits. A circuit 14, an interface circuit 15, a memory circuit 16, a data bus 17, an antenna (antenna coil) 18, a sensor 21, and a sensor circuit 22 are included.

The power supply circuit 11 is a circuit that generates various power supplies to be supplied to each circuit inside the semiconductor device 20 based on the AC signal input from the antenna 18. The clock generation circuit 12 is a circuit that generates various clock signals to be supplied to each circuit inside the semiconductor device 20 based on the AC signal input from the antenna 18. The data demodulation / modulation circuit 13 has a function of demodulating / modulating data communicated with the reader / writer 19. The control circuit 14 has a function of controlling the memory circuit 16. The antenna 18 has a function of transmitting and receiving an electromagnetic field or a radio wave. The reader / writer 19 controls communication and control with the semiconductor device and processing related to the data. The semiconductor device is not limited to the above-described configuration, and may be a configuration in which other elements such as a power supply voltage limiter circuit and hardware dedicated to cryptographic processing are added.

The memory circuit 16 includes a memory element in which an insulating layer or a phase change layer is sandwiched between a pair of conductive layers. Note that the memory circuit 16 may include only a memory element in which an insulating layer or a phase change layer is interposed between a pair of conductive layers, or may include a memory circuit having another structure. The memory circuit having another configuration corresponds to, for example, one or more selected from DRAM, SRAM, FeRAM, mask ROM, PROM, EPROM, EEPROM, and flash memory.

The sensor 21 is formed of a semiconductor element such as a resistance element, a capacitive coupling element, an inductive coupling element, a photovoltaic element, a photoelectric conversion element, a thermoelectric element, a transistor, a thermistor, or a diode. The sensor circuit 22 detects a change in impedance, reactance, inductance, voltage or current, performs analog / digital conversion (A / D conversion), and outputs a signal to the control circuit 14.
(Embodiment 6)

According to the present invention, a semiconductor device that functions as a processor chip (also referred to as a wireless chip, a wireless processor, a wireless memory, or a wireless tag) can be formed. The semiconductor device of the present invention has a wide range of uses. For example, banknotes, coins, securities, certificates, bearer bonds, packaging containers, books, recording media, personal items, vehicles, foods, clothing It can be used in health supplies, daily necessities, medicines and electronic devices.

Banknotes and coins are money that circulates in the market, and include those that are used in the same way as money in a specific area (cash vouchers), commemorative coins, and the like. Securities refer to checks, securities, promissory notes, and the like, and can be provided with a processor chip 90 (see FIG. 13A). The certificate refers to a driver's license, a resident's card, and the like, and can be provided with a processor chip 91 (see FIG. 13B). Personal belongings refer to bags, glasses, and the like, and can be provided with a processor chip 97 (see FIG. 13C). Bearer bonds refer to stamps, gift cards, and various gift certificates. Packaging containers refer to wrapping paper such as lunch boxes, plastic bottles, and the like, and can be provided with a processor chip 93 (see FIG. 13D). Books refer to books, books, and the like, and can be provided with a processor chip 94 (see FIG. 13E). The recording medium refers to DVD software, a video tape, or the like, and can be provided with a processor chip 95 (see FIG. 13F). The vehicles refer to vehicles such as bicycles, ships, and the like, and can be provided with a processor chip 96 (see FIG. 13G). Foods refer to food products, beverages, and the like. Clothing refers to clothing, footwear, and the like. Health supplies refer to medical equipment, health equipment, and the like. Livingware refers to furniture, lighting equipment, and the like. Chemicals refer to pharmaceuticals, agricultural chemicals, and the like. Electronic devices refer to liquid crystal display devices, EL display devices, television devices (TV receivers, flat-screen TV receivers), mobile phones, and the like.

The semiconductor device of the present invention is fixed to an article by being mounted on a printed board, pasted on a surface, or embedded. For example, a book is embedded in paper, and a package made of an organic resin is embedded in the organic resin, and is fixed to each article. Since the semiconductor device of the present invention realizes a small size, a thin shape, and a light weight, the design of the article itself is not impaired even after being fixed to the article. In addition, by providing the semiconductor device of the present invention in bills, coins, securities, bearer bonds, certificates, etc., an authentication function can be provided, and if this authentication function is utilized, counterfeiting can be prevented. it can. In addition, by providing the semiconductor device of the present invention in packaging containers, recording media, personal items, foods, clothing, daily necessities, electronic devices, etc., the efficiency of a system such as an inspection system can be improved.

Next, one mode of an electronic device in which the semiconductor device of the present invention is mounted will be described with reference to the drawings. An electronic device illustrated here is a mobile phone, which includes housings 2700 and 2706, a panel 2701, a housing 2702, a printed wiring board 2703, operation buttons 2704, and a battery 2705 (see FIG. 12B). The panel 2701 is detachably incorporated in the housing 2702, and the housing 2702 is fitted on the printed wiring board 2703. The shape and dimensions of the housing 2702 are changed as appropriate in accordance with the electronic device in which the panel 2701 is incorporated. A plurality of packaged semiconductor devices are mounted on the printed wiring board 2703, and the semiconductor device of the present invention can be used as one of them. The plurality of semiconductor devices mounted on the printed wiring board 2703 have any one function of a controller, a central processing unit (CPU), a memory, a power supply circuit, a sound processing circuit, a transmission / reception circuit, and the like.

The panel 2701 is connected to the printed wiring board 2703 through the connection film 2708. The panel 2701, the housing 2702, and the printed wiring board 2703 are housed in the housings 2700 and 2706 together with the operation buttons 2704 and the battery 2705. A pixel region 2709 included in the panel 2701 is arranged so as to be visible from an opening window provided in the housing 2700.

As described above, the semiconductor device of the present invention is characterized in that it is small, thin, and lightweight, and the limited space inside the housings 2700 and 2706 of the electronic device can be effectively used due to the above characteristics. .

In addition, since the semiconductor device of the present invention includes a memory element having a simple structure in which an insulating layer is sandwiched between a pair of conductive layers, an electronic device using an inexpensive semiconductor device can be provided. In addition, since the semiconductor device of the present invention can be easily integrated, an electronic device using the semiconductor device including a large-capacity memory circuit can be provided.

In addition, a memory device included in the semiconductor device of the present invention writes data by an optical action or an electrical action, is nonvolatile, and can additionally write data. With the above feature, forgery due to rewriting can be prevented, and new data can be added and written. Therefore, an electronic device using a semiconductor device that achieves high functionality and high added value can be provided.

Note that the housings 2700 and 2706 are examples of the appearance of a mobile phone, and the electronic device according to this embodiment can be changed into various modes depending on functions and uses.

(Embodiment 7)
In this embodiment mode, reading or writing of data in the semiconductor device having the above structure is described.

  20 shows an example of a structure of the semiconductor device of the present invention. A memory cell array 1722 in which memory cells 1721 are provided in a matrix, a circuit 1726 having a reading circuit and a writing circuit, a decoder 1724, and a decoder 1723 are included. Have. Note that the structure of the memory device 1716 shown here is just an example, and other circuits such as a sense amplifier, an output circuit, a buffer, and an interface for exchanging with the outside may be included.

  The memory cell 1721 includes a first conductive layer connected to the bit line Bx (1 ≦ x ≦ m), a second conductive layer connected to the word line Wy (1 ≦ y ≦ n), an insulating layer, Have The insulating layer is provided as a single layer or a stacked layer between the first conductive layer and the second conductive layer.

  First, operation when data is written to a memory element in a passive matrix memory device will be described with reference to FIGS. Data writing is performed by optical action or electrical action. First, the case of writing data by electrical action will be described. Writing is performed by changing the electrical characteristics of the memory cell. The initial state of the memory cell (the state where no electrical action is applied) is data “0”, and the state where the electrical characteristic is changed is “1”. To do.

  When writing data “1” to the memory cell 1721, first, the memory cell 1721 is selected by the decoders 1723 and 1724 and the selector 1725. Specifically, the decoder 1724 applies a predetermined voltage V2 to the word line W3 connected to the memory cell 1721. In addition, the bit line B 3 connected to the memory cell 1721 is connected to the circuit 1726 by the decoder 1723 and the selector 1725. Then, the write voltage V1 is output from the circuit 1726 to the bit line B3. Thus, the potential (voltage) Vw = V1−V2 is applied between the first conductive layer and the second conductive layer included in the memory cell 1721. By appropriately selecting the potential Vw, the insulating layer provided between the conductive layers is changed physically or electrically, and data “1” is written. Specifically, at the read operation voltage, the electrical resistance between the first conductive layer and the second conductive layer in the data “1” state is significantly smaller than that in the data “0” state. It is good to change as follows. For example, it may be appropriately selected from the range of (V1, V2) = (0V, 5-15V), or (3-5V, -12--2V). The potential Vw may be 5 to 15 V, or −5 to −15 V.

  Note that data “1” is controlled not to be written in the memory cell connected to the non-selected word line and the non-selected bit line. For example, unselected word lines and unselected bit lines may be set in a floating state. The first conductive layer and the second conductive layer constituting the memory cell must have characteristics such as diode characteristics that can ensure selectivity.

  On the other hand, when data “0” is written to the memory cell 1721, it is not necessary to apply an electrical action to the memory cell 1721. In the circuit operation, for example, as in the case of writing “1”, the memory cells 1721 are selected by the decoders 1723 and 1724 and the selector 1725, but the output potential from the circuit 1726 to the bit line B3 is changed to the selected word line. The voltage is set to the same level as the potential of W3 or the potential of the non-selected word line and does not change the electrical characteristics of the memory cell 1721 between the first conductive layer and the second conductive layer constituting the memory cell 1721 (for example, −5 to 5 V) may be applied.

  Next, a case where data is written by optical action will be described. In this case, the second conductive layer needs to transmit laser light. The insulating layer is irradiated with laser light from the light-transmitting conductive layer side. Here, the insulating layer is destroyed by selectively irradiating a desired portion of the insulating layer with laser light. Since the destroyed insulating layer is insulated, the electric resistance is significantly increased as compared with other portions. In this manner, data is written by utilizing the change in electrical resistance between two conductive films provided with an insulating layer interposed therebetween by laser light irradiation. For example, in the case where an insulating layer not irradiated with laser light is set to “0” data, when writing “1” data, the insulating layer in a desired portion is selectively irradiated with laser light to be destroyed. Increase the electrical resistance.

  In addition, when a conjugated polymer doped with a compound that generates acid by absorbing light (photoacid generator) is used as the insulating layer, when irradiated with laser light, only the irradiated portion increases conductivity. However, the unirradiated part does not have conductivity. Therefore, data is written by utilizing the change in the electrical resistance of the insulating layer by selectively irradiating a desired portion of the insulating layer with laser light. For example, in the case where an insulating layer not irradiated with laser light is set to “0” data, when writing “1” data, a desired portion of the insulating layer is selectively irradiated with laser light to make conductivity. increase.

  With the structure of the present invention in which data is written by laser light irradiation, a large number of memory devices can be easily manufactured. Therefore, an inexpensive memory device and semiconductor device can be provided.

  Next, an operation in reading data from a memory element in a passive matrix memory device will be described (see FIG. 20). In reading data, the electrical characteristics between the first conductive layer and the second conductive layer constituting the memory cell are different between the memory cell having data “0” and the memory cell having data “1”. Use it. For example, the effective electrical resistance between the first conductive layer and the second conductive layer constituting the memory cell having data “0” (hereinafter simply referred to as the electrical resistance of the memory cell) is R0 at the read voltage. A method of reading data by using the difference in electric resistance when the electric resistance of the memory cell having data “1” is R1 in the read voltage will be described. Note that R1 << R0. As the reading / writing circuit, for example, a circuit 1726 using a resistance element 1746 and a differential amplifier 1747 shown in FIG. The resistance element 1746 has a resistance value Rr, and R1 <Rr <R0. A transistor 1748 may be used instead of the resistance element 1746, and a clocked inverter 1749 may be used instead of the differential amplifier (FIG. 20C). The clocked inverter 1749 receives a signal φ or an inverted signal φ that becomes Hi when reading is performed and becomes Lo when it is not performed. Of course, the circuit configuration is not limited to FIG.

  When data is read from the memory cell 1721, first, the memory cell 1721 is selected by the decoders 1723 and 1724 and the selector 1725. Specifically, a predetermined voltage Vy is applied to the word line Wy connected to the memory cell 1721 by the decoder 1724. In addition, the bit line Bx connected to the memory cell 1721 is connected to the terminal P of the circuit 1726 by the decoder 1723 and the selector 1725. As a result, the potential Vp of the terminal P becomes a value determined by resistance division by the resistance element 1746 (resistance value Rr) and the memory cell 1721 (resistance value R0 or R1). Therefore, when the memory cell 1721 has data “0”, Vp0 = Vy + (V0−Vy) × R0 / (R0 + Rr). When the memory cell 1721 has data “1”, Vp1 = Vy + (V0−Vy) × R1 / (R1 + Rr). As a result, in FIG. 20B, Vref is selected to be between Vp0 and Vp1, and in FIG. 20C, the changing point of the clocked inverter is selected to be between Vp0 and Vp1. Thus, Lo / Hi (or Hi / Lo) is output as the output potential Vout according to the data “0” / “1”, and reading can be performed.

  For example, the differential amplifier is operated at Vdd = 3V, and Vy = 0V, V0 = 3V, and Vref = 1.5V. Assuming that R0 / Rr = Rr / R1 = 9, when the memory cell data is “0”, Vp0 = 2.7 V and Vout is Hi, and when the memory cell data is “1”, Vp1 = 0.3V and Lo is output as Vout. Thus, the memory cell can be read.

  According to the above method, the state of the electrical resistance of the insulating layer is read as a voltage value using the difference in resistance value and resistance division. Of course, the reading method is not limited to this method. For example, in addition to using the difference in electrical resistance, reading may be performed using the difference in current value. In addition, when the electrical characteristics of the memory cell have data “0” and “1” and diode characteristics with different threshold voltages, reading may be performed using the threshold voltage difference.

  Next, an operation when data is written to the memory element in the active matrix memory device is described (see FIG. 21).

  FIG. 21 illustrates a configuration example of the memory device described in this embodiment, which includes a memory cell array 1232 in which a memory cell array 1232 is provided in a matrix, a circuit 1226, a decoder 1224, and a decoder 1223. The circuit 1226 includes a reading circuit and a writing circuit. Note that the structure of the memory device 1217 shown here is merely an example, and may include other circuits such as a sense amplifier, an output circuit, a buffer, and an interface for external communication.

  The memory cell 1231 includes a first wiring connected to the bit line Bx (1 ≦ x ≦ m), a second wiring connected to the word line Wy (1 ≦ y ≦ n), a transistor 1210a, and a memory element 1215b. And a memory cell 1231. The memory element 1215b has a structure in which an insulating layer is sandwiched between a pair of conductive layers. The gate electrode of the transistor is connected to the word line, either the source electrode or the drain electrode is connected to the bit line, and the other is connected to one of the two terminals of the memory element. The remaining one terminal of the memory element is connected to a common electrode (potential Vcom).

  First, an operation when data is written by electrical action will be described. Writing is performed by changing the electrical characteristics of the memory cell. The initial state of the memory cell (the state where no electrical action is applied) is data “0”, and the state where the electrical characteristic is changed is “1”. To do.

  Here, a case where data is written to the memory cell 1231 in the nth row and the mth column will be described. When data “1” is written to the memory cell 1231, first, the memory cell 1231 is selected by the decoders 1223 and 1224 and the selector 1225. Specifically, the decoder 1224 applies a predetermined voltage V22 to the word line Wn connected to the memory cell 1231. In addition, the bit line Bm connected to the memory cell 1231 is connected to the circuit 1226 having a reading circuit and a writing circuit by the decoder 1223 and the selector 1225. Then, the write voltage V21 is output from the circuit 1226 to the bit line B3.

  Thus, the transistor 1210a included in the memory cell is turned on, the bit line is electrically connected to the memory element 1215b, and a potential (voltage) of approximately Vw = Vcom−V21 is applied. Note that one electrode of the memory element 1215b is connected to a common electrode of the potential Vcom. By appropriately selecting the potential Vw, the insulating layer provided between the conductive layers is changed physically or electrically, and data “1” is written. Specifically, at the read operation voltage, the electrical resistance between the first conductive layer and the second conductive layer in the data “1” state is significantly smaller than that in the data “0” state. It may be changed as described above, or it may be simply short-circuited. The potential may be appropriately selected from the range of (V21, V22, Vcom) = (5-15V, 5-15V, 0V), or (-12 to 0V, -12 to 0V, 3 to 5V). The potential Vw may be 5 to 15 V, or −5 to −15 V.

  Note that data “1” is controlled not to be written in the memory cell connected to the non-selected word line and the non-selected bit line. Specifically, a potential (for example, 0 V) for turning off the transistor of the memory cell to be connected is applied to the non-selected word line, and the non-selected bit line is in a floating state or approximately equal to Vcom. A potential may be applied.

  On the other hand, when data “0” is written in the memory cell 1231, it is not necessary to apply an electrical action to the memory cell 1231. In the circuit operation, for example, as in the case of writing “1”, the memory cells 1231 are selected by the decoders 1223 and 1224 and the selector 1225, but the output potential from the circuit 1226 to the bit line B3 is set to the same level as Vcom. Alternatively, the bit line B3 is brought into a floating state. As a result, a small potential (for example, −5 to 5 V) or a voltage (potential) is not applied to the memory element 1215b, so that electrical characteristics do not change and data “0” writing is realized.

  Next, a case where data is written by optical action will be described. In this case, the insulating layer is irradiated with laser light from the light-transmitting conductive layer side with a laser irradiation apparatus. As the laser irradiation device, a passive matrix storage device similar to that described with reference to FIG. 8 may be used.

  In the case where an organic compound material is used for the insulating layer, the insulating layer is oxidized or carbonized and insulated by laser light irradiation. Then, the resistance value of the memory element irradiated with the laser light increases, and the resistance value of the memory element not irradiated with the laser light does not change. Further, when a conjugated polymer material doped with a photoacid generator is used, conductivity is imparted to the insulating layer by laser light irradiation. That is, conductivity is given to the memory element irradiated with the laser beam, and conductivity is not given to the memory element not irradiated with the laser beam.

  Next, an operation when data is read by electrical action will be described. Here, the circuit 1226 includes a resistance element 1246 and a differential amplifier 1247. Note that the structure of the circuit 1226 is not limited to the above structure, and may have any structure.

  Next, an operation when data is read by an electrical action in an active matrix memory device will be described. Data is read by utilizing the fact that the electrical characteristics of the memory element 1215b are different between the memory cell having the data “0” and the memory cell having the data “1”. For example, the electrical resistance of the memory element constituting the memory cell having data “0” is R0 at the read voltage, and the electrical resistance of the memory element constituting the memory cell having data “1” is R1 at the read voltage. A method of reading using the difference will be described. Note that R1 << R0. As the reading / writing circuit, for example, a circuit 1226 using a resistance element 1246 and a differential amplifier 1247 shown in FIG. The resistance element has a resistance value Rr, and R1 <Rr <R0. A transistor 1249 may be used instead of the resistance element 1246, and a clocked inverter 1248 may be used instead of the differential amplifier (FIG. 21C). Of course, the circuit configuration is not limited to FIG.

  When data is read from the memory cell 1231 in the xth row and the yth column, first, the memory cell 1231 is selected by the decoders 1223 and 1224 and the selector 1225. Specifically, the decoder 1224 applies a predetermined voltage V24 to the word line Wy connected to the memory cell 1231 to turn on the transistor 1210a. In addition, the bit line Bx connected to the memory cell 1231 is connected to the terminal P of the circuit 1226 by the decoder 1223 and the selector 1225. As a result, the potential Vp of the terminal P becomes a value determined by resistance division by the resistance element 1246 (resistance value Rr) and the memory element 1215b (resistance value R0 or R1) of Vcom and V0. Therefore, when the memory cell 1231 has data “0”, Vp0 = Vcom + (V0−Vcom) × R0 / (R0 + Rr). When the memory cell 1231 has data “1”, Vp1 = Vcom + (V0−Vcom) × R1 / (R1 + Rr). As a result, in FIG. 21B, Vref is selected to be between Vp0 and Vp1, and in FIG. 21C, the change point of the clocked inverter is selected to be between Vp0 and Vp1. Thus, Lo / Hi (or Hi / Lo) is output as the output potential Vout according to the data “0” / “1”, and reading can be performed.

  For example, the differential amplifier is operated at Vdd = 3V, and Vcom = 0V, V0 = 3V, and Vref = 1.5V. Assuming that R0 / Rr = Rr / R1 = 9 and the on-resistance of the transistor 1210a can be ignored, when the data in the memory cell is “0”, Vp0 = 2.7V and Vout is output as Hi. When the data of “1” is “1”, Vp1 = 0.3 V and Lo is output as Vout. Thus, the memory cell can be read.

  According to the above method, the voltage value is read by utilizing the difference in resistance value of the memory element 1215b and the resistance division. Of course, the reading method is not limited to this method. For example, in addition to using the difference in electrical resistance, reading may be performed using the difference in current value. In addition, when the electrical characteristics of the memory cell have data “0” and “1” and diode characteristics with different threshold voltages, reading may be performed using the threshold voltage difference.

  Since the memory element having the above structure and the memory device including the memory element are nonvolatile memories, there is no need to incorporate a battery for holding data, and a small, thin, lightweight memory device and semiconductor device Can be provided. In addition, data can be written (added) by using the insulating material used in the above embodiment as an insulating layer, but data cannot be rewritten. Therefore, it is possible to provide a storage device and a semiconductor device that prevent forgery and ensure security.

  Note that this embodiment can be freely combined with the structures of the memory element, the memory device including the memory element, and the semiconductor device described in the above embodiment.

The conceptual diagram explaining this invention. 3A and 3B illustrate a memory device of the present invention. 3A and 3B illustrate a memory device of the present invention. 3A and 3B illustrate a memory device of the present invention. 3A and 3B illustrate a memory device of the present invention. 3A and 3B illustrate a memory device of the present invention. 3A and 3B illustrate a memory device of the present invention. 3A and 3B illustrate a memory device of the present invention. 3A and 3B illustrate a memory device of the present invention. 6A and 6B illustrate a semiconductor device of the present invention. 6A and 6B illustrate a semiconductor device of the present invention. 8A to 8D illustrate a method for manufacturing a semiconductor device of the present invention. 6A and 6B illustrate a semiconductor device of the present invention. 3A and 3B illustrate a memory device of the present invention. 3A and 3B illustrate a memory device of the present invention. 8A and 8B illustrate a method for manufacturing a memory device of the present invention. 8A and 8B illustrate a method for manufacturing a memory device of the present invention. 8A and 8B illustrate a method for manufacturing a memory device of the present invention. 2A and 2B illustrate a structure of a droplet discharge device that can be applied to the present invention. 3A and 3B illustrate a memory device of the present invention. 3A and 3B illustrate a memory device of the present invention.

Claims (20)

    A first conductive layer; a liquid repellent layer on a part of the first conductive layer; an insulating layer on the first conductive layer and the liquid repellent layer; and a second conductive layer on the insulating layer A semiconductor device comprising: a memory element including:     A first conductive layer, a liquid repellent layer that is in contact with and overlaps the inner periphery of the first conductive layer, an insulating layer on the first conductive layer and the liquid repellent layer, and a second layer on the insulating layer. A semiconductor device having a memory element including a conductive layer.     3. The semiconductor device according to claim 1, wherein a plurality of the liquid repellent layers are provided.     4. The semiconductor device according to claim 1, wherein the liquid repellent layer includes a substance having a fluorocarbon group.     4. The semiconductor device according to claim 1, wherein the liquid repellent layer includes a substance containing a silane coupling agent. 5.     6. The semiconductor device according to claim 5, wherein the silane coupling agent has an alkyl group.     A first conductive layer; a monomolecular film on a part of the first conductive layer; an insulating layer on the first conductive layer and the monomolecular film; and a second conductive layer on the insulating layer A semiconductor device comprising: a memory element including:     A first molecular layer, a monomolecular film overlapping and contacting the inner periphery of the first conductive layer, an insulating layer on the first conductive layer and the monomolecular film, and a second layer on the insulating layer. A semiconductor device having a memory element including a conductive layer.     9. The semiconductor device according to claim 7, wherein the semiconductor device includes a plurality of the monomolecular films.     The semiconductor device according to claim 7, wherein the monomolecular film is a silane coupling agent.     11. The semiconductor device according to claim 1, wherein the insulating layer includes an organic material. Forming a first conductive layer;
Selectively forming a liquid repellent layer on the first conductive layer;
Forming an insulating layer on the first conductive layer and the liquid repellent layer;
A method for manufacturing a semiconductor device, wherein a memory element is formed by forming a second conductive layer over the insulating layer. Forming a first conductive layer;
Forming a liquid repellent layer on the first conductive layer;
A mask layer is formed by discharging a composition containing a mask layer forming material on the liquid repellent layer,
Removing part of the liquid repellent layer using the mask layer;
Forming an insulating layer on the first conductive layer and the liquid-repellent layer from which the part has been removed;
A method for manufacturing a semiconductor device, wherein a memory element is formed by forming a second conductive layer over the insulating layer.     14. The method for manufacturing a semiconductor device according to claim 12, wherein the liquid repellent layer includes a substance having a fluorocarbon group.     14. The method for manufacturing a semiconductor device according to claim 12, wherein the liquid repellent layer includes a substance containing a silane coupling agent.     16. The method for manufacturing a semiconductor device according to claim 15, wherein the silane coupling agent has an alkyl group. Forming a first conductive layer;
Selectively forming a monomolecular film on the first conductive layer;
Forming an insulating layer on the first conductive layer and the monomolecular film;
A method for manufacturing a semiconductor device, wherein a memory element is formed by forming a second conductive layer over the insulating layer. Forming a first conductive layer;
Forming a monomolecular film on the first conductive layer;
A mask layer is formed by discharging a composition containing a mask layer forming material on the monomolecular film,
Removing a portion of the monolayer using the mask layer;
Forming an insulating layer on the first conductive layer and the monomolecular film from which the part has been removed;
A method for manufacturing a semiconductor device, wherein a memory element is formed by forming a second conductive layer over the insulating layer.     The method for manufacturing a semiconductor device according to claim 17, wherein the monomolecular film uses a silane coupling agent.     20. The method for manufacturing a semiconductor device according to claim 12, wherein the insulating layer includes an organic material.

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