JP2006253567A - Apparatus and method for analysis of aggregation - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for analysis of aggregation that can automatically graphically plot data of a visual inspection result by circuit boards, by components, and by lead terminals so as to quickly analyze a soldering defective state thereby implementing countermeasures. <P>SOLUTION: The apparatus for analysis of aggregation is provided with a soldered state visual inspection apparatus 1 for inspecting the propriety of a soldering state of electronic components 4 mounted on a circuit board 6, a data processor for storing and processing inspection result data obtained from the soldered state visual inspection apparatus 1, an aggregation processor for aggregating data processed by the data processing section, and a display processor for displaying a result of the aggregation of defect discrimination states by the lead terminals of the electronic components 4 on the basis of the processing result of the aggregation processing section. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention is used in, for example, a circuit board inspection process and the like, and provides a total analysis apparatus and a total analysis method for totaling and analyzing the quality of soldering of electronic components mounted on a circuit board.

Conventionally, the quality of soldered portions of a plurality of electronic components mounted on a circuit board has been inspected, and defects can be reduced by reflecting the inspection results on the production line. And, for example, the result data after inspection of the circuit board, that is, the defect data is held, the defect data is output for each circuit board, the defect data output for each circuit board is searched, and displayed on the monitor It has been proposed (see, for example, Patent Document 1). In addition, some visual inspections are performed to increase inspection accuracy. In order to automate such visual re-inspection, an automatic visual inspection machine and a moving probe type insert kit tester are combined to increase the inspection automation rate. A technique for improving the quality has been proposed (for example, see Patent Document 2).
JP-A-6-112295 JP-A-9-172300

However, the technique described in Patent Document 1 can only output defect data for each circuit board. For this reason, it is difficult to specify the cause of the failure of the data regarding the defective part of each electronic component, and there is a problem that the design change of the defective part and the inspection device cannot be reviewed.
In addition, the technology described in Patent Document 2 includes a file server that stores data of visual inspection results and visual inspection results, and is configured by connecting each device via a network. Since it is not possible to intuitively grasp the defective part, there is a problem that the defect can only be reduced while changing the design of the defective part.

  Therefore, the present invention enables automatic graphing for each circuit board, each component, and each lead terminal based on the appearance inspection result data, and the total analysis that can quickly analyze the soldering failure state and take countermeasures An object is to provide an apparatus and a total analysis method.

In order to achieve the above object, the invention described in claim 1 is a soldering state of an electronic component (for example, the electronic component 4 in the embodiment) mounted on a circuit board (for example, the circuit substrate 6 in the embodiment). Solder appearance inspection apparatus (for example, solder appearance inspection apparatus 1 in the embodiment) for inspecting pass / fail and a data processing unit (for example, data processing in the embodiment) for accumulating and processing inspection result data obtained from the solder appearance inspection apparatus Unit 30) and a totalization processing unit (for example, the totalization processing unit 31 in the embodiment) that totalizes the data processed by the data processing unit, and reads the electronic component based on the processing result of the totalization processing unit A display processing unit (for example, the display processing unit 32 in the embodiment) for displaying the total result of the defect determination state for each terminal is provided.
According to the fifth aspect of the present invention, the quality of the soldered state of the electronic component mounted on the circuit board is inspected by the solder appearance inspection device, and the inspection result data obtained from the solder appearance inspection device is stored by the data processing unit. The data is collected and displayed by the total processing unit, and the total result of the defect determination state is displayed for each lead terminal of the electronic component based on the processing result of the total processing unit.
By configuring in this way, it is possible to search for and input a defect determination state from the result data obtained from the solder appearance inspection apparatus, and thereby for each situation (for example, production line, circuit board, cause of failure, electronic component, lead terminal) Etc.) can be displayed.

The invention described in claim 2 is a solder appearance inspection device for inspecting the quality of the soldering state of the electronic component mounted on the circuit board, and the quality of the soldering state of the portion determined to be defective by the solder appearance inspection device. Appearance visual inspection device (for example, visual appearance inspection device 10 in the embodiment), and a data processing unit that accumulates and processes inspection result data obtained from the solder appearance inspection device and the appearance visual inspection device And a totalization processing unit that totalizes the data processed by the data processing unit, and displays a totalization result of the defect determination state for each lead terminal of the electronic component based on the processing result of the totalization processing unit Is provided.
According to the sixth aspect of the present invention, the quality of the soldering state of the electronic component mounted on the circuit board is inspected by the solder appearance inspection device, and the quality of the soldering state of the portion determined to be defective by the solder appearance inspection device is determined. The visual inspection device is used to inspect the inspection result data obtained from the solder visual inspection device and the solder visual inspection device, the data processing unit accumulates and processes the data, and the data is collected and displayed by the total processing unit. According to the processing result of the processing unit, the total result of the defect determination state is displayed for each lead terminal of the electronic component.
By comprising in this way, the data total result can be displayed according to each condition by searching and inputting a defect determination state from the result data obtained from the solder appearance inspection device and the appearance visual inspection device.

The invention described in claims 3 and 7 is characterized in that the display processing unit displays the total result of the failure determination state obtained for each lead terminal of the electronic component in correspondence with the lead terminal position.
By comprising in this way, the total result of a defect determination state can be displayed according to the lead terminal of an electronic component.

The invention described in claims 4 and 8 is characterized in that the display processing unit displays an image of the electronic component together with the counting result.
With this configuration, the electronic component can be arranged as an image in the center of the screen, and the totalization result can be displayed in a graph at a portion corresponding to the lead terminal portion.

  According to the first and fifth aspects of the present invention, it is possible to display the data summarization result for each situation by searching and inputting the defect determination state from the result data obtained from the solder appearance inspection apparatus. This can be used for reviewing the tendency of soldering and reviewing the solder appearance inspection device, and can take measures by analyzing the failure status.

  According to the second and sixth aspects of the present invention, the defect determination state is searched and input from the result data obtained from the solder appearance inspection device and the appearance visual inspection device, so that each situation (for example, production line, circuit board, etc.) Data summarization results can be displayed on the cause of defects, electronic components, lead terminals, etc.), which can be used to review trends in solder defects, review of solder appearance inspection equipment, visual appearance inspection equipment, etc. This has the effect that measures can be taken.

  According to the third and seventh aspects of the invention, since it is possible to display the total result of the defect determination state for each lead terminal of the electronic component, it is possible to grasp the defect determination state for each lead terminal that has been unclear until now. Therefore, there is an effect that can be used for design change of a defective portion, circuit board and electronic component design (for example, design of a pattern and a lead terminal shape).

  According to the fourth and eighth aspects of the present invention, the electronic component can be arranged as an image in the center of the screen, and the tabulated result can be displayed in a graph at the portion corresponding to the lead terminal portion. It is possible to determine the defective state of the lead terminal portion and to take measures immediately.

Next, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows an embodiment of the present invention. Reference numeral 1 denotes a solder appearance inspection apparatus. This solder appearance inspection apparatus 1 is an apparatus for inspecting the appearance of a soldered portion of a circuit board 6 to which an electronic component 4 is soldered in each production line and judging whether soldering is good or bad. is there.

  The circuit board 6 transported through the production line and soldered with the plurality of electronic components 4 is transported to the solder appearance inspection apparatus 1 in a state of being accommodated in a rack (not shown). A personal computer 2 is connected to the solder appearance inspection apparatus 1, and a reader 3 such as a barcode is connected to the personal computer 2. The reader 3 reads the stored circuit board data (barcode) from the model management table attached to one surface of the rack. The data to be read includes the completion date of the circuit board 6, the production line number, the production quantity, and the model name of the product in which the circuit board is used.

The circuit board 6 accommodated in the rack is sequentially supplied to the solder appearance inspection apparatus 1, and as shown in FIG. 2, an inspection using an image, an appearance photograph, and a sectional photograph is performed. FIG. 2A shows the state of a non-defective image, appearance photograph, and sectional photograph, and FIG. 2B shows the image, appearance photograph, and sectional photograph state of a defective product. The lead terminal 5 of the electronic component 4 that is not sufficiently reflected in the image is determined as a poorly soldered portion (portion surrounded by an ellipse) with respect to the circuit board 6, and the lead terminal 5 (circle) appears slightly floating in the external photograph. (Part surrounded by) is determined to be a soldering defective portion, and in the cross-sectional photograph, the solder bulge portion 7 is displaced with respect to the joint 8 of the lead terminal 5 and thus determined to be a soldering defective portion.
Here, the image is obtained by moving the electronic component on a plane while irradiating the laser beam through the polygonal prism, and transmitting the reflected light from the soldered portion of the electronic component through the polygonal prism. It is obtained by receiving light. Further, the appearance photograph and the sectional photograph are taken by an equipped camera.

  Of the circuit boards 6 that have been inspected by the solder appearance inspection apparatus 1, the circuit board 6 determined to be a non-defective product is set to the non-defective product rack, and the circuit board 6 'determined to be defective is set to the reserved product rack. The reason why the circuit board 6 determined to be defective is set in the reserved rack is because the final determination of whether or not the circuit board 6 is defective is made in the next visual inspection.

  Next, the visual circuit inspection device 10 inspects the circuit board 6 ′ accommodated in the reserved product rack. The visual appearance inspection device 10 is an erroneously determined product based on an image displayed on a monitor 11a of a personal computer 11 described later, an enlarged image using a microscope 14, and a 3D image of a circuit board 6 ′ determined to be defective by the solder visual inspection device 1. This is to determine whether the product is defective.

A personal computer 11 is also connected to the visual inspection apparatus 10, and a bar code reader 12 is connected to the personal computer 11. The reader 12 reads the barcode of the external viewer and reads the stored circuit board data in the model management table attached to one surface of the reserved product rack. The data to be read are the completion date, the production line number, the number of units produced, and the barcode of the model name of the product in which the circuit board is used, as in the solder appearance inspection apparatus 1 described above.
When the data is read in this way, the inspection data is displayed on the monitor 11a of the personal computer 11, and the defective portion of the circuit board 6 determined to be defective is indicated.

Next, when the circuit board 6 ′ stored in the hold product rack is set in the visual inspection apparatus 10 and each circuit board 6 ′ is transported, the camera automatically moves to a place where it is determined as defective, An image is displayed on the monitor 11a. It is determined whether the inspector is defective by looking at this image, and is divided into an erroneously determined product and a defective product.
For erroneously determined products, the erroneous determination is input to the personal computer 11 for the data of the circuit board 6 ′, and the target portion of the circuit board 6 ′ is marked, and then stored in a non-defective product rack of the same product and delivered to the next process. .

On the other hand, for defective products, the defective items are input to the personal computer 11 in the data of the circuit board 6 ′, the barcode is printed out by the barcode printer 13, and special marking is performed on the corresponding defective portion, and the target circuit. A bar code is attached to the substrate 6 'and paid out to the adjustment process. In the adjustment process, any one of repair, replacement, and disposal of the corresponding electronic component is selected and processed.
Here, as shown in FIG. 1, the solder appearance inspection apparatus 1 and the appearance visual inspection apparatus 10 are connected to a file server 20 in a network format via a hub 9.

  As shown in FIG. 3, the file server 20 includes a monitor 20a, and includes a data processing unit 30 that accumulates and processes the electronic component data from the solder visual inspection apparatus 1 and the visual visual inspection apparatus 10 described above. The data processing unit 30 accumulates and processes the inspection result data regardless of whether the product is non-defective or defective. For example, based on the circuit board name, circuit board completion date, production line number, production number, and model name of the product in which this circuit board is used, the electronic part name, pass / fail according to the lead terminal number of each electronic part, In the case of a defect, the cause of the defect is accumulated. In addition, image data of electronic parts is also stored.

Further, the data processing unit 30 is connected to a totaling processing unit 31, and the data processed by the data processing unit 30 is totaled by the totaling processing unit 31. Specifically, the data stored in the data processing unit 30 in the database format is provided with a data string that is aggregated according to the corresponding item, and the aggregated result is obtained when the data is searched later. It has come to be obtained. A display processing unit 32 is connected to the totalization processing unit 31 so that a defect determination state (result) can be recognized at a glance for each lead terminal together with an image of an electronic component displayed at the center of the screen by the display processing unit 32. It can be displayed on the monitor 20a of the file server 20.
Here, as shown in FIG. 6, an image of only the outer frame 40 of the electronic component can be displayed on the electronic component image, or an actual image can be displayed. When displaying the image of only the outer frame 40, in addition to the display area 41 for the name of the electronic component, the number of times (NTF number) determined to be defective by the display area 42 for the extraction condition and the solder appearance inspection apparatus 1, Areas 43 and 44 for displaying the number of times determined to be defective by the visual appearance inspection device 10 (number of TFs) are secured.

  The display processing unit 32 described above corresponds to lead terminal positions (terminal numbers are attached) that are set in plural on each side of the image of the electronic component that is to be displayed based on the counting result of the counting processing unit 31. Then, it is displayed how many defects have occurred within the specified total range (total result). Specifically, for example, a state in which the color is changed between the case where the solder appearance inspection apparatus 1 determines that the defect is inferior (NTF number) and the case where the appearance visual inspection apparatus 10 determines that the defect is inferior (TF number). Display in bar graph format (outlined and filled in drawings). Note that, as described above, it is a case where it is determined to be defective by the visual appearance inspection apparatus 10 when it is really defective.

  Therefore, according to this embodiment, from the result data obtained from the solder visual inspection device 1 and the visual visual inspection device 10, for example, by inputting a search condition such as a defect determination state, the data aggregation result is filed for each situation. It can be displayed on the monitor 20a of the server 20. Here, the data string processed by the data processing unit 30 can be displayed on the monitor 20 a, the status aggregated by the aggregation processing unit 31 can be displayed, and the display processing unit 32 can process the data. It is also possible to display an image that has been graphed. The contents displayed on the monitor 20a are displayed on the monitor 2a of the personal computer 2 of the solder visual inspection apparatus 1, the monitor 11a of the personal computer 11 of the visual visual inspection apparatus 10 or other monitors connected via the hub 9. It can also be displayed.

  Specifically, as shown in FIG. 4, the search start data to be entered in the narrowed search form, that is, the start date to be input with a certain width (start date and end date) on the completion date of the circuit board An input field 50 and an end date input field 51 are displayed together with a calendar 52, and a production line number, a circuit board name, an electronic component name, and a model name of a product in which the circuit board is used are displayed in a narrowing condition field 53. ~ 57 are displayed. In addition, each input field for pass / fail according to the lead terminal number and the cause of the defect is displayed on an input form for each lead terminal (not shown).

  When necessary items are input in the input fields 50, 51, and 54 to 57 of these forms and the search button S is pressed, for example, the defect rate for each circuit board and the defect rate for each electronic component that are tabulated for each production line. , Defect rate by cause of failure, defect rate by lead terminal, defect rate by production line totaled by circuit board, defect rate by electronic component, defect rate by cause of failure, defect rate by lead terminal Failure rate by production line, failure rate by circuit board, failure rate by failure cause, failure rate by lead terminal, and failure by each production line, aggregated by failure cause The rate, the failure rate for each circuit board, the failure rate for each electronic component, and the failure rate for each lead terminal can be automatically displayed on a graph.

  FIG. 5 is an example in which the defective product rate by production line, the defective rate by electronic component (including the failure status), and the defective rate by failure cause are displayed. As the defect rate for each production line, the defect rate for each model (A model, B model, C model point,...) Produced on a specific production line is displayed. Further, the defect rate for each electronic component is displayed as the defect rate for each electronic component (A component, B component, C component,...). The defect rate for each cause of failure is displayed for each cause (cause A, cause B, cause C...). In this example, the defect rate is a percentage display of a value obtained by dividing the number of defective products (number of NTFs) by the number of non-defective products.

In addition to the above display, the number of productions, the number of NTFs, the NTF rate (ratio of the number of NTFs relative to the total number), the number of TFs, and the TF rate (ratio of the number of TFs relative to the total number) are displayed. The causes of defects (cause A, cause B, cause C ...) include abnormal solder distribution, bridge between leads, inappropriate solder length, inappropriate lead terminal height, bridge around the land, unknown lead position, lead misalignment. can give.
Further, by inputting necessary information into the input form for each lead terminal, as shown in FIG. 6, the defect status (including the defect rate) for each lead terminal of the electronic component is read together with an image of only the outer frame of the electronic component. A bar graph is displayed at the position corresponding to the terminal. In the outer frame of the electronic component, the name of the electronic component, the number of NTFs, and the number of TFs are displayed, and the terminal number is attached to the position corresponding to each lead terminal, and the NTF number and TF number are displayed in a bar graph from the position of the terminal board number. The integrated value corresponding to is displayed.

As a result, in this embodiment, since the data tabulation result can be displayed for each situation, it can be used for the tendency of solder failure, the review of the solder appearance inspection apparatus 1 and the appearance visual inspection apparatus 10, etc. Measures can be taken.
In addition, since it is possible to display the total result of the failure determination state for each lead terminal of the electronic component 4, it is possible to grasp the failure determination state for each lead terminal, which has been unclear until now, and to change the design of the defective portion, circuit It can be used for the design of the substrate 6 and the electronic component 4 (for example, the design of patterns and lead terminal shapes).
In particular, the electronic component 4 can be arranged as an image in the center of the screen, and the aggregation result can be displayed in a graph on the portion corresponding to the lead terminal portion, so that the defective state of the lead terminal portion of the electronic component can be determined more intuitively at a glance, Measures can be taken immediately.

In addition, this invention is not restricted to the said embodiment, For example, you may give the function of the file server 20 to the external appearance visual inspection apparatus 10 or the personal computer 11 of this external appearance inspection apparatus 10. FIG.
The monitor 2a of the personal computer 2 connected to the barcode reader 3 of the solder appearance inspection apparatus 1 may be used as the display means. In this case, the data of the file server 20 can be sent to the personal computer 2 using the network to display the defective state. Similarly, the monitor 11a of the personal computer 11 to which the barcode reader 12 of the visual appearance inspection apparatus 10 is connected may be used as the display means.

1 is an overall configuration diagram of an embodiment of the present invention. It is a figure which shows the test | inspection result in a solder external appearance inspection apparatus, FIG. 2 (a) shows the case where it determines with a non-defective product, FIG.2 (b) shows the case where it determines with a defective product. 1 is a block diagram of an embodiment of the present invention. It is a figure which shows the input screen for performing a narrowing-down total. It is a figure which shows the display content at the time of performing a narrowing-down test | inspection. It is a figure which shows the display content of the test result for every terminal of an electronic component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solder external appearance inspection apparatus 4 Electronic component 6 Circuit board 10 Appearance visual inspection apparatus 30 Data processing part 31 Total processing part 32 Display processing part

Claims (8)

  A solder appearance inspection device for inspecting the quality of soldering state of electronic components mounted on a circuit board, a data processing unit for accumulating and processing inspection result data obtained from the solder appearance inspection device, and the data processing unit A totalization processing unit that totalizes the processed data, and a display processing unit that displays the totalization result of the defect determination state for each lead terminal of the electronic component based on the processing result of the totalization processing unit Aggregation analysis device.   Solder appearance inspection device for inspecting the quality of the soldering state of electronic components mounted on the circuit board, and visual inspection for visually inspecting the quality of the soldering state of the part determined to be defective by the solder appearance inspection device An apparatus, a data processing unit for accumulating and processing inspection result data obtained from the solder appearance inspection device and the appearance visual inspection device, and a totalization processing unit for aggregating data processed by the data processing unit, A tabulation analysis apparatus comprising a display processing unit for displaying a tabulation result of a defect determination state for each lead terminal of the electronic component based on a processing result of the tabulation processing unit.   The total analysis apparatus according to claim 1, wherein the display processing unit displays a total result of defect determination states obtained for each lead terminal of the electronic component in association with a lead terminal position.   The total analysis apparatus according to claim 1, wherein the display processing unit displays an image of the electronic component together with the total result.   The solder appearance inspection device inspects the quality of the electronic components mounted on the circuit board using the solder appearance inspection device, and the inspection result data obtained from the solder appearance inspection device is stored and processed by the data processing unit. The total analysis method is characterized in that the total analysis result is displayed for each lead terminal of the electronic component based on the processing result of the total processing unit.   The electronic component mounted on the circuit board is inspected by a solder visual inspection device for the soldering state, and the solder visual inspection device is inspected by a visual visual inspection device for a portion determined to be defective by the solder visual inspection device. Inspection result data obtained from the solder appearance inspection device and the solder appearance inspection device is accumulated and processed by the data processing unit, collected and displayed by the aggregation processing unit, and based on the processing result of the aggregation processing unit A tabulation analysis method characterized by displaying a tabulation result of a defect judgment state for each lead terminal of an electronic component.   The total analysis method according to claim 5 or 6, wherein when the total result of the defect determination state is displayed for each lead terminal of the electronic component, the total result is displayed for each lead terminal at a position corresponding to the lead terminal.   The total analysis method according to claim 5, wherein an image of the electronic component is displayed together with the total result.

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