JP2006253507A - Device with compound substrate and method for packaging substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide such a structure that a shield case is not separated easily from the ground. <P>SOLUTION: In a compound substrate device where a high frequency electronic component 21 is mounted on a module substrate 20 and the module substrate 20 is mounted on a mother board substrate 10, the electronic component 21 is covered with a shield case 30. A ground electrode 12 is formed on the surface of the mother board 10 and a ground electrode 22 is formed on the surface of the module substrate 20 and then the shield case 30 is connected with the ground electrodes 12 and 22 by soldering. Since the shield case 30 is connected with both the mother board 10 and the module substrate 20, the mechanical strength is enhanced. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a composite substrate device and a substrate mounting method.

In recent years, information processing devices having a wireless communication function are increasing.
In such an information processing device, an electronic component group that processes high frequency is mounted on a module substrate, and the module substrate is mounted on a motherboard. A group of electronic components that process high frequencies is shielded by a shield case.

In Patent Document 1 below, a plurality of protrusions are provided on a shield case, the protrusions are inserted into through holes of a motherboard electrically connected to the ground, and soldered to connect the shield case to the ground. ing. That is, the shield case is fixed to the motherboard.
JP-A-11-97876

  The shield case protects electronic components on the module substrate from external noise and prevents electromagnetic waves from being radiated to the outside from the module substrate. The role of the shield case is important and is required to be properly connected to ground. However, in Patent Document 1, since the shield case is only fixed to the motherboard, the mechanical strength is weak, and there is a high risk that the shield case is separated from the motherboard and the module substrate. At this time, the module substrate is also separated from the motherboard. It becomes easy. In addition, the contact area of the ground is small and the shielding performance is not good.

  It is an object of the present invention to provide a composite substrate device and a substrate mounting method that can securely fix a shield case, reduce the risk of the shield case being separated from the ground, and have good shielding performance.

In order to achieve the above object, a composite substrate apparatus according to the first aspect of the present invention provides:
A first substrate on which an electronic component is mounted and a ground electrode is formed on the surface;
A second substrate on which the first substrate is mounted and a ground electrode is formed in the vicinity of the first substrate on the surface;
It is composed of a conductive member, is soldered to the ground electrode of the first substrate and the ground electrode of the second substrate, covers the electronic component mounted on the surface of the first substrate, and encloses it inside. A shield case to stop,
It is characterized by providing.

  By adopting such a configuration, the shield case is soldered to the ground electrode of the first substrate and the ground electrode of the second substrate, so that the mechanical strength is increased.

  A recess may be formed on the surface of the second substrate, and the first substrate may be accommodated in the recess.

The shield case includes a cylindrical case base frame that surrounds the area where the electronic component is mounted on the first substrate, and a cylindrical one end that is detachably attached to the case base frame. With a couch top
The case base frame may be soldered to the ground electrode of the first substrate and the ground electrode of the second substrate.

  The shield case protrudes inside the shield case and is soldered to the ground electrode of the first substrate; and the second substrate protrudes outside the shield case. And a second convex portion soldered to the ground electrode.

In order to achieve the above object, a substrate mounting method according to a second aspect of the present invention includes:
A first substrate on which an electronic component is mounted and a ground electrode is formed on the surface is formed, and a first electrode is mounted on the surface and a ground electrode is formed in the vicinity of the first substrate on the surface. A substrate mounting process to be mounted on the second substrate,
A shield case made of a conductive member is soldered to the ground electrode of the first substrate and the ground electrode of the second substrate, and is mounted on the surface of the first substrate by the shield case. A shield case treatment covering the electronic component;
It is characterized by including.

A recess is formed on the surface of the second substrate,
In the substrate mounting process, the first substrate may be accommodated in the recess.

The shield case includes a cylindrical case base frame that surrounds the area where the electronic component is mounted on the first substrate, and a cylindrical one end that is detachably attached to the case base frame. With a couch top
In the shield case process, the case base frame with the top plate removed is placed at a position surrounding a region of the first substrate on which the electronic component is mounted, and the case base frame and the case base frame You may solder to the ground electrode of a 1st board | substrate and the ground electrode of a said 2nd board | substrate.

The shield case includes a first protrusion protruding inward and a second protrusion protruding outward,
In the shield case process, solder is attached to the ground electrode of the first substrate and the ground electrode of the second substrate, and the shield case surrounds the electronic component and the ground electrode of the first substrate. The first convex portion and the ground electrode of the first substrate are connected by reflow of the solder and the second convex portion and the ground electrode of the second substrate are May be connected.

  According to the present invention, since the shield case is soldered and fixed to both the ground electrode formed on the first substrate and the ground electrode formed on the second substrate, resistance to shock and vibration is enhanced. There is little risk that the shield case will leave the ground electrode. This can also prevent the first substrate and the second substrate from being easily separated. Furthermore, since the contact area of the ground can be secured, a certain shielding performance can be secured.

[First Embodiment]
FIG. 1 is a sectional view showing a composite substrate apparatus according to the first embodiment of the present invention.
This composite substrate device includes a motherboard 10 and a module substrate 20 incorporated in the motherboard 10.

  A plurality of electronic components 11 are mounted on the motherboard 10. On the surface of the mother board 10, a ground electrode 12 is formed, and a recess 13 in which the module substrate 20 is accommodated is formed. An electrode 14 is formed on the bottom surface of the recess 13.

  A plurality of high frequency electronic components 21 are mounted on the surface of the module substrate 20. A plurality of ground electrodes 22 are formed in the vicinity of the outer edge of the surface of the module substrate 20. The electronic component 21 mounted on the module substrate 20 is connected to the electrode 14 on the bottom surface of the recess 13 through the electrode 23 formed on the back surface of the module substrate 20.

  The module substrate 20 is lowered in height by being accommodated in the recess 13, and the height of the surface of the module substrate 20 is the same as the height of the surface of the motherboard 10.

The electronic component 21 on the surface of the module substrate 20 is covered with a shield case 30.
The shield case 30 includes a metal case base frame 31 and a top plate 32. The case base frame 31 has a cylindrical shape, and one end of the cylindrical shape is in contact with the surface of the module substrate 20 or the motherboard 10. The inner peripheral surface of the case base frame 31 surrounds a region where the electronic component 21 and the ground electrode 22 are formed.

  The case base frame 31 is connected and fixed to the ground electrode 12 of the mother board 10 with solder S1. Furthermore, the case base frame 31 is connected and fixed to the ground electrode 22 of the module substrate 20 by solder S2.

A recess 31 a is formed on the outer peripheral surface of the case base frame 31 over the entire periphery.
The top plate 32 abuts against the other end of the case base frame 31 and has a plate-like lid portion 32a that seals the electronic component 21, and is erected vertically from the edge of the lid portion 32a toward the motherboard 10 side. And a locking portion 32b. The other end side of the case base frame 31 is inserted into the locking portion 32b. The locking portion 32b is formed with a convex portion 32c, the convex portion 32c is fitted into the concave portion 31a of the case base frame 31, and the top plate 32 is detachably locked to the case base frame 31.

FIG. 2 is an assembled perspective view of the composite substrate device of FIG.
Here, a procedure for assembling the composite substrate apparatus of FIG. 1 will be described.
The electronic component 11 is mounted on the motherboard 10, and the electronic component 21 is mounted on the module substrate 20. Cream solder is attached to the electrode 14 formed on the bottom surface of the recess 13 of the mother board 10, the module substrate 20 on which the electronic component 21 is mounted is inserted into the recess 13, and the cream solder on the recess 13 is positioned. The electrode 23 on the back surface of the module substrate 20 is made to contact.

  In this state, the module substrate 20 and the mother board 10 are placed in a solder reflow furnace and heated to naturally cool. By this heating, the cream solder is melted, and by cooling, the electrode 23 of the module substrate 20 and the electrode 14 of the recess 13 of the motherboard 10 are soldered, and the motherboard 10 and the module substrate 20 are integrated, The electronic component 21 is incorporated in the circuit of the motherboard 10.

  After the mother board 10 and the module substrate 20 are integrated, the case base frame 31 of the shield case 30 is placed at a predetermined position. That is, the case base frame 31 is placed so that the case base frame 31 surrounds the region where the electronic component 21 and the ground electrode 22 are formed. Then, the case base frame 31 and the ground electrode 12 are connected by the solder S1 using a soldering iron. Similarly, the case base frame 31 and the ground electrode 22 are connected by the solder S2 using a soldering iron. As described above, the case base frame 31 is soldered and fixed to both the mother board 10 and the module substrate 20.

  The case base frame 31 fixed to the mother board 10 and the module substrate 20 is covered with a top plate 32 from the side of the locking portion 32b, and the concave portion 31a of the case base frame 31 and the convex portion 32c of the locking portion 32b are fitted. . Thereby, the composite substrate apparatus of FIG. 1 is completed.

  As described above, in the composite substrate device according to the present embodiment, the case base frame 31 is soldered and fixed to the mother board 10 and the module substrate 20, so that the mechanical strength is increased and the shield case 30 is subjected to shock and vibration. This reduces the risk of leaving the ground electrode.

  Further, since the shield case 30 is composed of a case base frame 31 and a top plate 32, and the top plate 32 is detachable from the case base frame 31, in a state where the top plate 32 is not attached to the case base frame 31, The case base frame 31 and the ground electrode 22 of the shielding substrate 20 can be easily soldered with a soldering iron. In addition, since the top plate 32 can be removed from the case base frame 31 at any time, maintenance, inspection and the like are easy.

[Second Embodiment]
FIG. 3 is a sectional view showing a composite substrate apparatus according to the second embodiment of the present invention.
This composite substrate device includes a mother board 40 and a module substrate 50. The module substrate 50 is mounted on the mother board 40.

  On the surface of the mother board 40, a plurality of electronic components 41 are mounted and a ground electrode 42 is formed. The ground electrode 42 is disposed around the module substrate 50.

  A plurality of electronic components 51 are mounted and a ground electrode 52 is formed on the surface of the module substrate 50. The electronic component 51 constitutes a high-frequency signal processing circuit, for example. The ground electrode 52 is disposed along the outer edge of the module substrate 50.

  On the back surface of the module substrate 50, an electrode 53 for connecting a circuit formed on the module substrate 50 to the mother board 40 is formed. An electrode 43 facing the electrode 53 is formed on the mounting position of the module substrate 50 on the surface of the mother board 40, and the electrode 53 and the electrode 43 are connected by solder.

  A shield case 60 is placed on the surface of the mother board 40. The shield case 60 includes a conductive case base frame 61 and a top plate 62.

  The case base frame 61 has a cylindrical shape. One end of the case base frame 61 is in contact with the surface of the mother board 40, and the inner peripheral side of the case base frame 61 surrounds the module substrate 50. A convex portion 61a protruding outward is formed on the outer peripheral surface of the case base frame 61, and the convex portion 61a is soldered with the ground electrode 42 and the solder S3. On the inner peripheral surface of the case base frame 61, a convex portion 61b protruding inward is formed, and the convex portion 61b is soldered by the ground electrode 52 and the solder S4.

A recess 61 c is formed on the outer peripheral surface of the case base frame 61 over the entire periphery.
The top plate 62 abuts on the other end of the case base frame 61 to cover the upper side of the electronic component 51, and the top plate 62 is erected vertically from the edge of the lid portion 62a toward the mother board 40 side. And a locking portion 62b. The other end side of the case base frame 31 is inserted into the locking portion 62b. The locking part 62b is formed with a convex part 62c, the convex part 62c is fitted into the concave part 61a of the case base frame 61, and the top plate 62 is detachably locked to the case base frame 61.

4 is an assembled perspective view of the composite substrate device of FIG. With reference to this FIG. 4, an example of the assembly procedure of the composite substrate apparatus of this embodiment is demonstrated.
Before incorporating the module substrate 50 into the motherboard 40, the electronic component 41 is mounted on the motherboard 40 and the electronic component 51 is mounted on the module substrate 50 in advance.

  Cream solder is applied and adhered to the electrode 43 on the surface of the mother board 40 on which the electronic component 41 is mounted using a metal mask or the like. The module substrate 50 is placed on the mother board 40 coated with cream solder so that the electrode 43 and the electrode 53 are opposed to each other through the cream solder. The mother board 40 on which the module substrate 50 is placed is put into a solder reflow furnace, heated, and then naturally cooled. The cream solder is melted by heating, and the electrodes 43 and 53 are connected by cooling. The motherboard 40 and the module substrate 50 are integrated, and the electronic component 51 is incorporated in the circuit of the motherboard 40.

  After the mother board 40 and the module substrate 50 are integrated, cream solders S3 and S4 are attached to the ground electrode 42 on the surface of the mother board 40 and the ground electrode 52 on the surface of the module substrate 50. After the cream solders S3 and S4 are attached, the case base frame 61 of the shield case 60 is placed at a predetermined position. That is, the case base frame 61 surrounds the outer periphery of the module substrate 50, the convex portion 61a of the case base frame 61 is opposed to the ground electrode 42 connected thereto with cream solder, and the convex portion 61b of the case base frame 61 is The case base frame 61 is placed so as to face the ground electrode 52 connected thereto with the cream solder interposed therebetween.

  After placing the case base frame 61, the mother board 40 is put in a solder reflow furnace and heated, and then naturally cooled. By this heating, the cream solder S4 between the ground electrode 52 and the convex portion 61b is dissolved, and by cooling, the solder S4 is solidified, and the ground electrode 52 and the convex portion 61b are connected. Further, the cream solder S3 between the ground electrode 42 and the convex portion 61a is dissolved by heating, and the solder S3 is solidified by cooling, and the ground electrode 42 and the convex portion 61a are connected.

  The case base frame 61 is fixed to both the mother board 40 and the module substrate 50 by connecting the convex portions 61 a and the convex portions 61 b of the case base frame 61 to the ground electrodes 42 and 52.

  The case base frame 61 fixed to the mother board 40 and the module substrate 50 is covered with the top plate 62 from the locking portion 62b side, and the concave portion 61c of the case base frame 61 and the convex portion 62c of the locking portion 32b are fitted. . Thereby, the composite substrate apparatus of FIG. 3 is completed.

  As described above, in the composite substrate device of the present embodiment, since the case base frame 61 is soldered and fixed to the mother board 40 and the module substrate 50 as in the first embodiment, the mechanical strength is increased. In addition, there is less risk that the shield case 60 will leave the ground due to impact or vibration.

  Since the shield case 60 includes a case base frame 61 and a top plate 62, and the top plate 62 is detachable from the case base frame 61, the top plate 62 is not attached to the case base frame 61. The case base frame 61 and the ground electrode 52 of the module substrate 50 can be easily soldered with a soldering iron. Since the top plate 62 can be removed from the case base frame 61 at any time, maintenance, inspection and the like are easy.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. Examples of such modifications include the following.

  (1) In the composite substrate device of the first embodiment, the case base frame 31 of the shield case 30 is provided with convex portions 61 a and 61 b similar to those of the second embodiment, and the case base frame 31 and the ground electrodes 12 and 22 are provided. The connection may be made by solder reflow.

  (2) In the second embodiment, a plurality of convex portions 61a and 61b are arranged on each side of the case base frame 61. However, the number of the convex portions 61a and 61b is arbitrary, for example, one convex portion on each side. 61a and 61b may be arranged. In this case, one convex portion 61 a is connected to a plurality of ground electrodes 42. In addition, one convex portion 61 b is connected to a plurality of ground electrodes 52.

  (3) The mother board 10 of the first embodiment and the mother board 40 of the second embodiment may be constituted by a double-sided board, but may be constituted by a multilayer board such as a four-layer board or an eight-layer board.

  (4) The module substrate 40 of the first embodiment and the module substrate 50 of the second embodiment may be configured by a double-sided substrate, but may be configured by a multilayer substrate such as a four-layer substrate or an eight-layer substrate. May be.

It is sectional drawing which shows the composite substrate apparatus which concerns on the 1st Embodiment of this invention. It is an assembly perspective view of the composite substrate apparatus of FIG. It is sectional drawing which shows the composite substrate apparatus which concerns on the 2nd Embodiment of this invention. FIG. 4 is an assembled perspective view of the composite substrate device of FIG. 3.

Explanation of symbols

10, 40 Motherboard 11, 41 Electronic component 12, 42 Ground electrode 13 Recess 20, 50 Module board 21, 51 Electronic component 22, 52 Ground electrode 30, 60 Shield case 31, 61 Case base frame 31a, 61c Recess 32, 62 Top plate 32b, 62b Locking part 32c, 62c Convex part 61a, 61b Convex part S1-S4 Solder

Claims (8)

A first substrate on which an electronic component is mounted and a ground electrode is formed on the surface;
A second substrate on which the first substrate is mounted and a ground electrode is formed in the vicinity of the first substrate on the surface;
A shield case composed of a conductive member and soldered to the ground electrode of the first substrate and the ground electrode of the second substrate;
A composite substrate device comprising:   2. The composite substrate device according to claim 1, wherein a concave portion is formed on a surface of the second substrate, and the first substrate is accommodated in the concave portion. The shield case includes a cylindrical case base frame surrounding an area where the electronic component is mounted on the first substrate, and a ceiling that is detachably attached to the case base frame and covers one end of the cylindrical case. With a board,
The composite substrate apparatus according to claim 1, wherein the case base frame is soldered to a ground electrode of the first substrate and a ground electrode of the second substrate.   The shield case protrudes inside the shield case to be soldered to the ground electrode of the first substrate, and protrudes outside the shield case to the ground of the second substrate. The composite substrate device according to claim 1, further comprising a second convex portion soldered to the electrode. A first substrate on which an electronic component is mounted and a ground electrode is formed on the surface is formed. A first electrode is mounted on the surface and a ground electrode is formed in the vicinity of the first substrate on the surface. A substrate mounting process to be mounted on the second substrate,
A shield case made of a conductive member is soldered to the ground electrode of the first substrate and the ground electrode of the second substrate, and is mounted on the surface of the first substrate by the shield case. A shield case treatment covering the electronic component;
A substrate mounting method comprising: A recess is formed on the surface of the second substrate,
6. The substrate mounting method according to claim 5, wherein, in the substrate mounting process, the first substrate is accommodated in the recess. The shield case includes a cylindrical case base frame surrounding an area where the electronic component is mounted on the first substrate, and a ceiling that is detachably attached to the case base frame and covers one end of the cylindrical case. With a board,
In the shield case process, the case base frame with the top plate removed is placed at a position surrounding a region of the first substrate on which the electronic component is mounted, and the case base frame and the case base frame 7. The substrate mounting method according to claim 5, wherein soldering is performed to the ground electrode of the first substrate and the ground electrode of the second substrate. The shield case includes a first protrusion protruding inward and a second protrusion protruding outward,
In the shield case process, solder is attached to the ground electrode of the first substrate and the ground electrode of the second substrate, and the shield case surrounds the electronic component and the ground electrode of the first substrate. The first convex portion and the ground electrode of the first substrate are connected by reflow of the solder and the second convex portion and the ground electrode of the second substrate are The board mounting method according to claim 5 or 6, characterized in that:

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