JP2006252922A - Manufacturing method of display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of display panel capable of improving productivity. <P>SOLUTION: The manufacturing method of a display panel, forming a barrier rib by forming a barrier rib forming material layer on a back side glass plate 1 on which an address electrode is formed and by grinding it by a sand blast method, comprises a process of sticking an electrode protecting DFR 5 formed by photosensitive material on a part of the glass plate where a draw-out electrode Da is exposed, before a grinding process of sand blast method; a process of making an exposing mask 6, made of transmissive material on which a light-dispersing surface treatment is applied, face on the electrode protecting DFR 5; and an exposing process exposing the electrode protecting DFR 5 through the exposing mask 6 after the above process. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a display panel.

  Two substrates on which required electrodes are arranged are opposed to each other through a sealed space, and by driving these electrodes, phosphors colored in three primary colors of red, green, and blue are selectively emitted to generate an image. In general, a flat display panel such as a plasma display panel (PDP) is formed on a substrate (back substrate) in which a sealed space between two substrates is disposed on the back side of the panel. A partition is provided for each pixel or cell by a partition wall.

  As a method for forming partition walls in such a flat display panel, a sandblast method is generally used.

  The sand blasting method used in the manufacture of this display panel is a pattern in which a layer formed by applying a glass paste or the like on a back substrate on which a required electrode is formed and drying is patterned to be a sand blast resistant mask. A partition wall having a required shape is formed on the back substrate by blasting with an abrasive through the substrate.

  Here, for example, external connection terminals (extraction electrode portions) for connection with the drive circuit of the electrodes formed on the back substrate are formed before the glass paste layer or this glass paste layer is formed. When the sandblasting process is performed in order to prevent the exposed part of the electrode from being damaged in the process of forming the partition wall, it is exposed from the insulating layer that covers the electrode that is applied. It is necessary to protect the exposed part of this electrode.

  Conventionally, as a method for protecting the electrode during the sandblasting process of the partition wall, a method of shielding the exposed portion of the electrode with a protective plate attached to a display panel manufacturing apparatus (for example, see Patent Document 1), For example, there is a method in which a dry film resist (hereinafter referred to as DFR) is attached to a portion where the exposed portion of the electrode on the substrate is formed to protect the exposed portion of the electrode (for example, see Patent Document 2).

  The protection method of the electrode by the protection plate described above is that the abrasive is caught between the protection plate and the substrate during the sandblasting process, and the electrode is damaged or foreign matter such as abrasives or grinding waste of the glass paste layer is formed on the electrode. There is a possibility of adhesion, and there is a problem that the manufacturing cost rises because high maintainability is required such as crushing of abrasives by the protective plate, life of the protective plate, and accuracy of the mounting position of the protective plate. is doing.

  For this reason, before the sandblasting process of the partition wall is performed, a method of protecting the electrode by attaching the DFR for electrode protection to the exposed portion of the electrode on the substrate can utilize the existing equipment. For reasons, it is considered promising.

  However, the method of protecting the electrodes during the sandblasting process of the partition walls by attaching the DFR also has the following problems.

  That is, the DFR for protecting the electrode attached on the substrate is peeled off together with the resist mask for forming the partition wall in the resist stripping step after the sandblasting process of the partition wall. Since it is affixed on an electrode and a glass substrate, adhesiveness becomes higher than DFR affixed on the partition formation material layer, and peelability is not so good in a resist peeling process.

  For this reason, in order to improve productivity, it becomes a subject to improve the releasability of this DFR for electrode protection. Therefore, it is necessary to enhance the apparatus for peeling the DFR or use a strong stripping solution. This causes problems such as an increase in installation space and lead time, an increase in equipment costs due to an increase in the size of manufacturing equipment, a decrease in worker safety due to the use of a high concentration stripping solution, and the environment. Problems such as adverse effects on

JP 2001-222946 A JP 2000-100367 A

  An object of the present invention is to solve the problems in the conventional display panel manufacturing method as described above.

  In order to achieve the above object, a manufacturing method of a display panel according to the present invention is a material for forming a required structure on a substrate having an electrode formed on the surface, with a part of the electrode exposed. In a manufacturing method of a display panel in which a layer having a desired shape is formed by grinding a layer by sandblasting, the material layer is coated with a photosensitive material before the step of grinding the material layer by sandblasting. A step of forming a protective film on a portion of the substrate where the electrode is exposed is opposed to an exposure mask formed on the protective film by a transparent material and subjected to a surface treatment for scattering light on the surface. An exposure step of exposing the protective film through an exposure mask, and a step of grinding the exposure step and the material layer by a sandblast method. After the completion, it is characterized in that it includes a release step of peeling the protective film stuck on the substrate.

  In the present invention, an electrode formed on a glass substrate is covered with a dielectric layer in a state in which an extraction electrode portion at an end thereof is exposed on the substrate, and further, for example, a PDP discharge is formed on the dielectric layer. A resist layer is formed by forming a material layer for forming a structure such as a partition wall that divides a space by a sandblasting method, and the material layer is formed of a photosensitive material and formed into a molding pattern of a required structure by exposure. In a manufacturing process of a display panel such as a PDP in which a component having a required shape is formed on a substrate and an electrode by grinding through a mask, before the material layer is subjected to a sandblasting grinding process, an extraction electrode of the electrode A step of applying a protective film formed of a photosensitive material to a portion on the glass substrate where the portion is exposed, and a protective layer, for example, a pear ground or a lattice A method of forming a fine unevenness or the like, a process of facing an exposure mask that has been subjected to a surface treatment that scatters light irradiated on the surface, and a protective film together with the resist mask of the material layer through this exposure mask The display panel manufacturing method including the step of exposing and the peeling step of peeling the protective layer from the substrate after the material layer grinding step is the best embodiment.

  The display panel manufacturing method according to this embodiment includes a circuit outside the electrodes exposed on the substrate when the material layer is ground by the sandblast method and a structure having a required shape is formed on the substrate. The lead electrode part for connecting the lead electrode part is protected by a protective film attached to the part on the substrate where the lead electrode part is exposed, so that the lead electrode part is damaged or the lead electrode part is damaged. It is prevented that grinding scraps of the material layer adhere to the part.

  Then, when the protective film of this electrode is exposed together with the resist mask of the material layer, the light irradiated from the exposure lamp is irradiated by the surface treatment applied to the exposure mask facing the protective film. The amount of light that is scattered by the exposure mask and transmitted to the protective film through the exposure mask is reduced compared to the amount of light that is applied to the resist mask of the material layer, so that the protective film adheres to the glass substrate and the extraction electrode. As a result, when the protective film is peeled off from the glass substrate, peeling can be easily performed without requiring a large peeling device or using a strong or high concentration peeling solution. In addition, it is not necessary to perform the protective film exposure step separately from the resist mask of the material layer.

  Hereinafter, the first example of the embodiment of the present invention will be described in detail with reference to the drawings.

  The present invention can be applied to various flat panel display manufacturing methods in which a structure such as a partition wall is further formed on an electrode formed on a substrate by a sand blasting method. As an example, PDP will be described.

  FIG. 1 is a side view showing a state of the rear glass substrate during the partition molding in the PDP manufacturing process, and FIG. 2 is a partial plan view showing the state of the address electrodes formed on the rear glass substrate.

  1 and 2, the manufacturing process of the PDP is first formed on the rear glass substrate 1 positioned on the back side of the PDP, on a plurality of address electrodes D arranged in parallel with each other and on the peripheral portion of the panel. A lead electrode Da for connecting the address electrode D to the driving circuit of the PDP, which is positioned in the non-display area, is integrally formed.

  Next, as shown in FIG. 2, a dielectric material paste such as glass paste is applied on the rear glass substrate 1 on which the address electrode D and the extraction electrode Da are formed, whereby the address electrode protection layer 2 is formed. After being formed, the address electrode D is covered.

  At this time, the address electrode protection layer 2 is not formed in the portion where the extraction electrode Da is formed, and the extraction electrode Da is not covered with the address electrode protection layer 2 and is exposed on the rear glass substrate 1. It has become.

  Each of the extraction electrodes Da is grouped by a required number and arranged in a non-display area portion on the rear glass substrate 1.

  Next, a partition wall forming material layer 3 such as glass paste is applied on the address electrode protective layer 2 to form a partition wall forming material layer 3. Further, on the partition wall forming material layer 3, a photosensitive material is used. The formed partition forming DFR (dry film resist) 4 is attached.

  Next, the electrode protection DFR5 formed of a photosensitive material is attached to the exposed portion of the extraction electrode Da on the rear glass substrate 1, and the extraction electrode Da is covered with the electrode protection DFR5.

  Then, an exposure mask for forming a barrier rib pattern is opposed to the barrier rib forming DFR 4 and, as shown in FIG. 3, an exposure mask 6 made of a transparent material is opposed to the electrode protecting DFR 5. Is done.

  Fine irregularities are formed on the surface of the exposure mask 6 for the DFR 5 for electrode protection.

  Examples of the uneven shape formed on the exposure mask 6 for the DFR 5 for electrode protection include, for example, a so-called concavo-convex pattern (see FIG. 3) or a lattice pattern (see the exposure mask 6A in FIG. 4). Is mentioned.

  The unevenness of the surface of the exposure mask 6 is formed by a method such as processing the surface by sand blasting after forming the exposure mask 6 or forming unevenness on the surface at the same time as forming the exposure mask 6. .

  Next, an exposure process for the partition forming DFR 4 is performed by UV irradiation from an exposure lamp through a mask having a pattern corresponding to the shape of the partition to be formed, and the partition forming DFR 4 corresponds to the partition formation pattern. An exposed portion and an unexposed portion are formed.

  At the same time, the electrode protection DFR 5 attached on the extraction electrode Da is also exposed by UV irradiation from the exposure lamp via the exposure mask 6.

  Next, a development process of the partition wall forming DFR 4 is performed, and after unexposed portions of the partition wall forming DFR 4 that are not photocured are removed, sand blasting is performed through a sand blast mask formed by development of the partition wall forming DFR 4. A process is performed and the partition of a required shape is shape | molded.

  Thereafter, the sandblast mask on the partition walls is peeled off, and at the same time, the peeling process of the electrode protecting DFR5 is carried out.

  Here, in the above, when the exposure step of the DFR 5 for electrode protection is performed, the surface of the exposure mask 6 is formed with irregularities such as a pear-like shape or a lattice shape, as described above. The UV light from the exposure lamp irradiated to the protective DFR 5 is scattered by the irregularities on the surface of the exposure mask 6, thereby reducing the exposure amount of the electrode protective DFR 5 than the exposure amount of the partition wall forming DFR 4. Is done.

  The adhesiveness of the photosensitive resist changes depending on the exposure amount, and the adhesion amount increases as the exposure amount increases. As described above, the exposure amount of the electrode protecting DFR5 is higher than the exposure amount of the partition wall forming DFR4. By reducing, the adhesiveness of the DFR 5 for electrode protection to the rear glass substrate 1 and the extraction electrode Da is reduced. For example, the adhesiveness to the partition wall forming material layer 3 of the partition wall forming DFR 4 is equal to or more than that. Get smaller.

  As a result, the electrode protection DFR5 can be easily peeled off without requiring a large peeling device or using a strong or high-concentration stripping solution as in the past in the step of peeling the electrode protection DFR5. You will be able to

  As a method of reducing the exposure amount for the electrode protection DFR 5, a method of reducing the irradiation amount itself of UV light from the exposure lamp for the electrode protection DFR 5 can be considered, but the UV light for the partition formation DFR and the electrode protection DFR is also considered. Is normally performed simultaneously by the same exposure lamp. If the partition wall formation DFR and the electrode protection DFR are separately irradiated with UV light, two exposure lamps are prepared. In order to prevent the irradiation of the UV light to the DFR for use and the irradiation of the UV light to the electrode protection DFR, it is necessary to install a physical shielding means in the exposure apparatus, which causes a complicated manufacturing apparatus. Become.

  According to the above method for manufacturing a display panel, the adhesion force of the DFR 5 for electrode protection to the rear glass substrate 1 and the extraction electrode Da can be easily reduced without changing the existing manufacturing apparatus. The peeling process of the electrode protecting DFR 5 can be easily performed.

  In the above, all the extraction electrodes Da may be covered with a single electrode protection DFR, and the extraction electrodes Da may be covered with the electrode protection DFR for each group or every several groups. good.

  Further, in the above, an example is shown in which the partition wall forming DFR 4 and the electrode protection DFR 5 are separated, but the partition wall forming DFR and the electrode protection DFR are integrally formed, and the rear glass substrate and You may make it stick on the partition formation material layer form.

  In addition, as shown in FIG. 1, in order to avoid damage caused by sandblasting of the portion of the back glass substrate 1 that is not covered with the electrode protection DFR 5 during the sandblasting process, the back glass substrate is used. The non-display area part on 1 may be covered.

  Since the lead electrode Da of the address electrode D is protected by the electrode protection DFR 5, the protection plate 7 does not need to take into account the influence of the entrainment of the abrasive during the sandblasting process, so a simple protection plate may be used. Also, severe mounting position accuracy is not required.

  By providing this protective plate 7, the electrode protection DFR 5 is not required to have high blast resistance.

  FIG. 5 shows a second example of the embodiment of the present invention.

  In the following description, as in the case of the first embodiment, the display panel will be described by taking a PDP as an example.

  In the manufacturing process of the PDP, a partition wall forming material layer is formed on the address electrode protective layer with a partition wall forming material paste, and a partition wall forming DFR 4 is attached on the partition wall forming material layer, and as shown in FIG. The DFR 15 for electrode protection formed of a photosensitive material so as to cover all the extraction electrodes Da or the extraction electrodes Da for each group or every several groups in a portion which becomes a non-display area at the peripheral edge on the rear glass substrate 1. Affixed to the solid.

  The exposure mask 16 is opposed to the electrode protection DFR 15.

  As shown in FIG. 6, the exposure mask 16 is positioned between the portions facing the extraction electrodes Da arranged in parallel at a predetermined pitch when opposed to the electrode protection DFR 15. A band-shaped light shielding portion 16a formed of a material having no light transmittance and extending in parallel with the extraction electrode Da is formed.

  And the part except the light-shielding part 16a of this exposure mask 16 is formed with the material which has a light transmittance, and is the so-called pear-like shape on the surface similarly to the exposure mask 6 of 1st Example. Or fine irregularities, such as a lattice shape, are formed (in the example shown, a pear-like irregularity is formed).

  Next, an exposure step of the electrode protection DFR 15 is performed.

  At this time, the electrode protecting DFR 15 facing the portion where the surface of the exposure mask 16 is formed with irregularities such as a pear-like or lattice pattern is exposed by the UV light that has passed through the exposure mask 16. Although cured, the electrode protecting DFR 15 in the portion facing the light shielding portion 16a is not exposed and is not cured.

  Next, a developing process is performed. By this developing process, a portion that is not exposed in the exposure process of the electrode protecting DFR 15 is removed, so that each position facing the portion between the extraction electrodes Da of the electrode protecting DFR 15 is provided. A slit 15a extending in parallel with each extraction electrode Da is formed.

  In the above exposure process, the UV light irradiated from the exposure lamp to the electrode protection DFR 15 through the exposure mask 16 is scattered by the irregularities on the surface of the exposure mask 16, so that the exposure amount of the electrode protection DFR 15 is It is less than the exposure amount of the partition forming DFR 4.

  As a result, as in the case of the first embodiment, the adhesion force of the DFR 15 for electrode protection to the rear glass substrate 1 and the extraction electrode Da is reduced, and the electrode protection DFR 15 has a large size as in the past in the peeling process. Thus, the electrode protection DFR 15 can be easily peeled off without using a peeling device or using a strong or high concentration peeling solution.

  In this embodiment, the slit 15a is formed at each position facing the portion between the extraction electrodes Da of the DFR 15 for electrode protection, so that the stripping liquid is removed from the slit 15a during the stripping process. As the electrode penetrates and the swelling of the electrode protecting DFR 15 is promoted, the electrode protecting DFR 15 is more easily peeled off.

  In addition, since the electrode protection DFR 15 in this embodiment is connected to the portion covering each extraction electrode Da, the electrode protection DFR 15 is peeled off by connecting the remaining portions when peeling starts from one place. As a result, there is no risk of unpeeling.

  In the above, all the extraction electrodes Da may be covered with one electrode protection DFR, and the extraction electrodes Da may be covered with the electrode protection DFR for each group or every several groups. .

  In the above example, the partition forming DFR 4 and the electrode protecting DFR 15 are shown as separate bodies. However, the partition forming DFR and the electrode protecting DFR are integrally formed, and the rear glass substrate and You may make it stick on the partition formation material layer form.

  Further, in this embodiment, as in the case of the first embodiment, in order to avoid damage caused by sandblasting in the portion not covered with the electrode protection DFR 15 of the back glass substrate 1 during the sandblasting process, May be used to cover the non-display area portion on the rear glass substrate 1.

  FIG. 7 shows a third example of the embodiment of the present invention.

  In the following description, as in the case of the first embodiment, the display panel will be described by taking a PDP as an example.

  In the manufacturing process of the PDP, a partition wall forming material layer is formed on the address electrode protective layer with a partition wall forming material paste, and a partition wall forming DFR 4 is attached on the partition wall forming material layer, and as shown in FIG. The electrode protecting DFR 25 is stuck on the lead electrode Da formed in the non-display area at the peripheral edge on the rear glass substrate 1.

  Then, an exposure mask 26 is opposed to each electrode protecting DFR 25.

  As shown in FIG. 8, the exposure mask 26 has a band-like portion (translucent portion) 26A including a portion facing each extraction electrode Da when opposed to the electrode protecting DFR 25. The other part (light-shielding part) 26B is formed of a material that does not have optical transparency.

  Then, on the surface of the translucent portion 26A formed of the light transmissive material of the exposure mask 26, as in the exposure mask 6 of the first embodiment, fine irregularities such as a so-called satin or grid pattern are formed. It is formed (in the illustrated example, a pear-like unevenness is formed).

  Next, an exposure process of the electrode protection DFR 25 is performed.

  At this time, the electrode protecting DFR 25 of the portion of the exposure mask 26 facing the light transmitting portion 26A is exposed and cured by the UV light passing through the light transmitting portion 26A, but faces the light shielding portion 26B. The part DFR 25 for electrode protection is not exposed and is not cured.

  Next, a developing process is performed to remove the portions that are not exposed except for the portion facing the extraction electrode Da of the DFR 25 for electrode protection and the belt-shaped portion around the periphery.

  In the above exposure process, the surface of the light transmitting portion 26A of the exposure mask 26 is formed with irregularities such as a pear-like shape or a lattice shape so that the electrode protection DFR 25 is irradiated from the exposure lamp through the light transmitting portion 26A. The UV light thus scattered is scattered by the irregularities on the surface of the translucent portion 26A, so that the exposure amount of the portion that covers the extraction electrode Da of the electrode protection DFR 25 is smaller than the exposure amount of the partition forming DFR 4.

  As a result, as in the case of the first embodiment, the adhesion force of the DFR 25 for electrode protection to the rear glass substrate 1 and the extraction electrode Da is reduced, so that the large size as in the prior art is used in the peeling process of the electrode protection DFR 25. Therefore, the electrode protecting DFR 25 can be easily peeled off without the need for a peeling device or using a strong or high concentration peeling solution.

  In this embodiment, since the DFR 25 for electrode protection formed in a strip shape is individually affixed on each extraction electrode Da, the adhering areas of the DFR 25 for electrode protection to the rear glass substrate 1 are first and second. Compared to the case of the embodiment, this makes it easier for the stripping solution to penetrate into each electrode protecting DFR 25 during the stripping step, and the swelling of the electrode protecting DFR 25 is promoted, so that the stripping of the electrode protecting DFR 25 is facilitated. Is more easily performed.

  In this embodiment, as in the case of the first embodiment, a protective plate is used in order to avoid damage caused by sandblasting of the portion of the back glass substrate 1 not covered by the electrode protection DFR 25 during the sandblasting process. It may be used to cover a non-display area portion on the rear glass substrate 1.

It is process explanatory drawing in 1st Example of embodiment of the manufacturing method by this invention. It is a top view which shows the formation state of the address electrode in the Example. In the Example, it is a top view which shows the state by which DFR for electrode protection and an exposure mask are affixed on the back glass substrate. It is a top view which shows the other example of the exposure mask in the Example. In 2nd Example of embodiment of the manufacturing method by this invention, it is a top view which shows the state by which DFR for electrode protection and the exposure mask are affixed on the back glass substrate. It is a top view which shows the exposure mask used in the Example. In 3rd Example of embodiment of the manufacturing method by this invention, it is a top view which shows the state by which DFR for electrode protection and the exposure mask are affixed on the back glass substrate. It is a top view which shows the exposure mask used in the Example.

Explanation of symbols

1 ... Back glass substrate (substrate)
2 ... Address electrode protective layer (dielectric layer)
3 ... partition wall forming material layer (material layer)
4 ... DFR (resist film) for barrier rib formation
5.5A, 15, 25 ... DFR (protective film) for electrode protection
6, 6A, 16, 26 ... exposure mask 7 ... protective plate (protective member)
15a ... slits 16a and 26B ... light shielding part 26A ... translucent part D ... address electrode (electrode)
Da: Extraction electrode (exposed part of electrode)

Claims (17)

A material layer for forming a required structure is formed on a substrate having an electrode formed on the surface with a part of the electrode exposed, and the material layer is ground by a sand blast method. In a manufacturing method of a display panel that forms a structure having a shape,
Before the step of grinding the material layer by the sand blast method, forming a protective film made of a photosensitive material on the portion where the electrode on the substrate is exposed;
On the protective film, facing the exposure mask formed of a transmissive material and subjected to a surface treatment that scatters light on the surface;
After this step, an exposure step of exposing the protective film through an exposure mask,
After the completion of the exposure step and the step of grinding the material layer by the sandblast method, a peeling step of peeling off the protective film attached on the substrate,
A display panel manufacturing method characterized by comprising:   The method for manufacturing a display panel according to claim 1, wherein the surface treatment applied to the exposure mask is a treatment for forming irregularities on the surface of the protective film.   The method for manufacturing a display panel according to claim 2, wherein the unevenness of the surface of the exposure mask is formed in a pear-like shape.   The method for manufacturing a display panel according to claim 2, wherein the unevenness of the surface of the exposure mask is formed by a lattice pattern.   The protective film so that all exposed portions of the plurality of electrodes arranged on the substrate are covered, or the exposed portions of the plurality of electrodes grouped into a required group are covered for each group. The method of manufacturing a display panel according to claim 1, wherein: is formed.   6. The method of manufacturing a display panel according to claim 5, wherein slits are respectively formed in portions of the protective film facing positions between exposed portions of adjacent electrodes.   The method for manufacturing a display panel according to claim 6, wherein portions of the exposure mask that face the slits of the protective layer are each formed of a material that does not have translucency.   The method for manufacturing a display panel according to claim 1, wherein the protective film is formed so that the exposed portions of the plurality of electrodes arranged on the substrate are individually covered for each electrode.   9. The method for manufacturing a display panel according to claim 8, wherein a portion other than a portion facing the protective layer formed individually for each electrode of the exposure mask is formed of a material that does not have translucency.   The method for manufacturing a display panel according to claim 1, wherein a resist film for sandblasting is attached on the material layer, and the resist film and the protective film are integrally formed.   The method for manufacturing a display panel according to claim 1, wherein a resist film for sandblasting is attached on the material layer, and the resist film and the protective film are formed separately.   The method for manufacturing a display panel according to claim 1, wherein a resist film for sandblasting is affixed on the material layer, and the resist film exposure step and the protective film exposure step are simultaneously performed by the same exposure lamp.   The display panel is a plasma display panel, and the material layer formed on the substrate divides a discharge space formed between the two substrates facing each other for each unit light emitting region. The method of manufacturing a display panel according to claim 1.   14. The display according to claim 13, wherein a dielectric layer covering a portion other than the exposed portion of the electrode formed on the substrate is formed on the substrate, and a material layer for forming a partition wall is formed on the dielectric layer. Panel manufacturing method.   The method for manufacturing a display panel according to claim 13, wherein the exposed portion of the electrode formed on the substrate is a lead electrode portion for connecting the electrode to the outside.   14. The method of manufacturing a display panel according to claim 13, wherein the substrate is a rear substrate of the plasma display panel, and the electrodes are address electrodes extending in the column direction of the plasma display panel and arranged in parallel in the row direction.   The method for manufacturing a display panel according to claim 1, wherein when a step of grinding the material layer by a sandblast method is performed, the upper portion of the portion of the substrate where the protective film is attached is covered with a protective member.

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