JP2006250455A - Heat transport device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat transport device operated without depending on the attitude of the transport device nor providing a starter, and to provide electronic equipment with the device mounted thereon. <P>SOLUTION: A reservoir is arranged closer to a condenser 2 than to an evaporator 1 or the reservoir 13d is arranged in the condenser 2 to prevent operating fluid reserved in the reservoir 13d from flowing from the reservoir 13d to the evaporator 1 during non-operation of the heat transport device 10. Thus, the heat transport device is operated without the need of the starter while preventing the liquid-phase operating fluid from residing too much in the evaporator 1 with its weight. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heat transport device that absorbs heat of a heating element and transports heat by circulating a working fluid using a capillary force as a driving force, and an electronic device equipped with the heat transport device.

  In order to cool an electronic device such as a PC (Personal Computer), a CPL (Capillary Pumped Loop) or the like has been conventionally used as a device for transporting heat generated from a heat generating portion of the electronic device to a heat radiating portion. In these heat transport devices, the vapor-phase working fluid evaporated by the heat generated in the high-temperature heat generating part (or evaporating part) of the electronic equipment moves to the low-temperature heat dissipating part, and the heat dissipating part (or condensing part) It condenses into a liquid and releases heat, thereby cooling the heating element.

  CPL is a heat transport device using the principle of a heat pipe, and its shape is not limited to a pipe shape. For example, in CPL, an evaporator and a condenser are physically separated, and an evaporator and a condenser are a gas phase tube through which a gas phase working fluid flows and a liquid phase tube through which a liquid phase working fluid flows. There is a device connected by (see, for example, Patent Document 1). The CPL has an advantage that the influence of gravity is small because the pressure when the working fluid evaporates due to the heat of the heating element and the capillary force of the flow path are used as the driving force of the working fluid.

Many conventional heat transport devices are provided with a reservoir tank in the vicinity of a heat generating portion (evaporating portion), for example. In some cases, a reservoir tank is made to function as a check valve for hydraulic fluid in order to prevent the hydraulic fluid from flowing back (see, for example, Patent Document 2).
JP 2004-85186 A (paragraph [0041], FIG. 1) JP 7-127982 A (paragraph [0014], FIG. 1)

  However, even in the CPL system, the working fluid is likely to accumulate in the direction of gravity of the heat transport device due to the influence of gravity during non-operation when there is no heat load from the heating element. For example, when the evaporating unit is in a posture closer to the gravity center side (ground side) than the condensing unit, if the working fluid is excessively accumulated in the evaporating unit, the working fluid is difficult to evaporate, and there is a problem that it does not operate properly.

  In order to solve such problems, a method may be considered in which the heat transport device is provided with a starter such as a mechanical pump mechanism or a heating mechanism separate from the heating element, and these starters are operated at the time of startup. . However, if a starter is provided, there is a drawback that the apparatus becomes large and complicated.

  It is also conceivable to solve the problem by increasing the volume ratio of the internal volume by increasing the internal volume of the evaporation section with respect to the liquid-phase working fluid amount. However, when there is no space around the heating element, it is difficult to increase the internal volume of the evaporation section.

  In view of the circumstances as described above, an object of the present invention is to provide a heat transport device that operates without depending on the attitude of the heat transport device and without providing a starter, and an electronic apparatus equipped with the heat transport device.

  In order to achieve the above object, a heat transport device according to the present invention distributes a working fluid, absorbs heat by the evaporation of the working fluid, and distributes the working fluid to condense the working fluid. A condensing part for releasing heat by the first, a first flow path for flowing the working fluid evaporated in the evaporating part to the condensing part, and causing the working fluid condensed in the condensing part to flow to the evaporating part And a storage part that is disposed closer to the condensing part than the evaporation part and stores the working fluid.

  In this invention, since the storage part is arrange | positioned in the position near a condenser rather than an evaporator, it can prevent that a working fluid flows out from a storage part to an evaporation part as much as possible. For example, it is possible to prevent the working fluid from being excessively accumulated in the evaporation section due to gravity or centrifugal force when the heat transport device is not operating. Therefore, the heat transport device can operate without requiring a starter. The heat transport device according to the present invention may have a structure in which the evaporating unit and the condensing unit are physically separated, or may be a single plate.

  According to one form of this invention, the said heat transport apparatus may further comprise the plate which incorporates the said condensation part and the said storage part at least. When the plate includes the condensing unit and the storage unit and does not include the evaporation unit and the first and second flow paths, the heat transport device includes the plate, the second plate including the evaporation unit, What is necessary is just to provide the 1st pipe | tube for comprising 1 flow path, and the 2nd pipe | tube for comprising a 2nd flow path. In the case where the plate further incorporates the evaporation section and the first and second flow paths, the heat transport device is a single plate-shaped heat transport device.

  A heat transport device according to another aspect of the present invention includes an evaporator that circulates a working fluid and absorbs heat by an evaporation action of the working fluid, and a reservoir that stores the working fluid therein, A condenser for releasing heat by the condensing action of the fluid; and a first pipe connected between the evaporator and the condenser for circulating the working fluid evaporated in the evaporator to the condenser; And a second pipe connected between the evaporator and the condenser for allowing the working fluid condensed by the condenser to flow to the evaporator.

  In the present invention, since the reservoir is provided in the condenser, it is possible to prevent the working fluid from flowing from the reservoir to the evaporator as much as possible when not operating. In addition, since the reservoir is provided in the condenser, there is an advantage that the amount of the working fluid can be easily adjusted at the time of manufacturing the heat transport device. The reason is that the working fluid in the condenser is almost in a liquid phase, so that the volume of the reservoir in the condenser may be considered to directly affect the amount of working fluid in the liquid phase. That is, by adjusting the volume of the reservoir, the amount of working fluid can be adjusted, thereby setting the operating temperature range of the heat transport device, the maximum heat transport amount, and the like.

  In addition, if there is a reservoir, the internal volume can be increased, so there are variations in the amount of working fluid and the presence of non-condensable gases (for example, gas generated by a chemical reaction between the working fluid and the evaporator or condenser material). However, in the conventional reservoir, a liquid-phase working fluid and a gas-phase working fluid are mixed. In particular, when the reservoir is close to the evaporator, the temperature is high and the proportion of the gas phase increases, so the amount of liquid-phase working fluid in the condenser increases and the heat dissipation efficiency decreases. However, the temperature of the storage part of the heat transport device according to the present invention is close to the temperature of the heat dissipating part of the condenser, which becomes the lowest temperature in the heat transport device by being attached to the condenser, and is almost filled with the liquid phase. As a result, high robustness can be realized without reducing the condensation efficiency of the condenser.

  Further, if the amount of the liquid-phase working fluid in the condenser is reduced in order to maintain or improve the condensation efficiency, it has been easy to cause liquid breakage due to disturbance (vibration, etc.) in the past. Therefore, it is difficult for liquid to run out.

  In addition, the outer dimension of the heat transport device is often limited by the size of the electronic device on which the heat transport device is mounted, and the evaporator may have to be made smaller than the condenser. Even in such a case, the configuration of the heat transport device according to the present invention is effective.

  According to one aspect of the present invention, the condenser has a first flow path having a first flow path volume capable of circulating the working fluid while condensing the working fluid, and at least the first flow path. And a second flow path having a second flow path volume smaller than the first flow path volume. The channel volume is the volume of the channel per unit length in the direction in which the working fluid flows. The smaller the flow path volume, the greater the resistance of the working fluid to the working fluid. Therefore, the working fluid is less likely to flow in the second flow path than in the first flow path, and the working fluid flows from the reservoir to the evaporator during non-operation. Flowing out can be prevented as much as possible.

  According to one form of this invention, the said condenser has a capillary channel which guide | induces the said working fluid to the said storage part by capillary force. Thereby, it becomes possible to always store the working fluid in the storage section regardless of the posture of the heat transport device.

  According to one aspect of the present invention, the condenser includes a first end connected to the reservoir, and a second end disposed closer to the second pipe than the first pipe. A flow path having an end. For example, the liquid level may move due to vibrations of the heat transport device, and bubbles may be mixed into the second tube, or bubbles may be mixed into the second tube when the heat load is excessive. When bubbles are generated in this way, the supply resistance of the liquid-phase working fluid from the storage section becomes a resistance. According to the present invention, the liquid-phase working fluid is stably supplied from the storage section into the second pipe. be able to. In particular, it is preferable that the second pipe has a connection end connected to the condenser, and the second end is arranged in the vicinity of the connection end.

  An electronic apparatus according to the present invention has a heating element, a working fluid to circulate, an evaporation unit that absorbs heat of the heating element by an evaporating action of the working fluid, a working fluid to circulate, and the working fluid to condense A condensing part for releasing heat by the first, a first flow path for flowing the working fluid evaporated in the evaporating part to the condensing part, and causing the working fluid condensed in the condensing part to flow to the evaporating part And a storage part that is disposed closer to the condensing part than the evaporation part and stores the working fluid.

  Examples of the electronic device include a computer (in the case of a PC, a laptop type or a desktop type), a PDA (Personal Digital Assistance), an electronic dictionary, a camera, a display device, and an audio / visual device. Mobile phones and other electrical appliances. Examples of the heating element include an electronic component such as an IC (Integrated Circuit) and a resistor, a heat radiating fin (heat sink), and the like. The same applies hereinafter.

  An electronic apparatus according to another aspect of the present invention includes a heating element, an evaporator that circulates a working fluid and absorbs heat of the heating element by an evaporation action of the working fluid, and a storage unit that stores the working fluid. A condenser that is internally provided and releases heat by the condensing action of the working fluid, and is connected between the evaporator and the condenser, and distributes the working fluid evaporated by the evaporator to the condensing unit. And a second pipe connected between the evaporator and the condenser and for allowing the working fluid condensed in the condenser to flow to the evaporator.

  As described above, according to the present invention, the heat transport device can be operated without depending on the posture of the heat transport device and without providing a starter.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view of the heat transport device according to the first embodiment of the present invention. FIG. 2 is a side view of the heat transport device 10 shown in FIG. 3 is a cross-sectional view taken along the line AA shown in FIG. 1, and FIG. 4 is a cross-sectional view taken along the line BB shown in FIG.

  The heat transport apparatus 10 includes an evaporator 1 that evaporates the working fluid accommodated therein and absorbs heat of the heating element 15, and a condenser 2 that condenses the evaporated working fluid and releases heat. . For example, an IC such as a CPU (Central Processing Unit) is used as the heating element 15. Between the evaporator 1 and the condenser 2, a gas phase pipe 3 for circulating the working fluid evaporated in the evaporator 1 to the condenser 2, and a liquid for circulating the working fluid condensed in the condenser 2 to the evaporator 1. The phase tube 4 is connected. Two gas phase tubes 3 and two liquid phase tubes 4 are provided. Usually, these two are all used, but two are provided so that the heat transport device 10 can operate even if one of the two becomes unusable for some reason, such as dryout. .

  As the working fluid, for example, pure water, ethanol, methanol, acetone, isopropyl alcohol, alternative chlorofluorocarbon, ammonia or the like is used. As the gas phase tube 3, for example, a metal material such as copper, aluminum, or stainless steel is used, but the material is not necessarily limited to a metal and may be a resin material. The liquid phase tube 4 is also made of the same material as the gas phase tube 3.

  As shown in FIG. 2, the evaporator 1 includes a rectangular upper substrate 11 and a lower substrate 12. The upper substrate 11 is made of glass, for example, Pyrex (registered trademark) glass is used. On the other hand, the lower substrate 12 is made of silicon. One end portions 3a and 4a of the gas phase tube 3 and the liquid phase tube 4 described above are inserted into and connected to a connection hole 11b (see FIG. 2) provided in the upper substrate 11. For example, the vapor phase tube 3 and the liquid phase tube 4 and the upper substrate 11 are joined by solder (not shown). On the side of the lower substrate 12 facing the upper substrate 11, a plurality of grooves 12 a constituting a flow path of the working fluid are formed along the longitudinal direction (X direction) of the liquid phase tube 4, for example. The grooves 12 a are respectively provided on both sides of the lower substrate 12 in the Y direction so as to correspond to the two liquid phase tubes 4. On the side of the upper substrate 11 that faces the lower substrate 12, a plurality of grooves 11a that form a flow path of the working fluid are formed in a direction (Y direction) orthogonal to the grooves 12a. Further, on the side of the lower substrate 12 facing the upper substrate 11, a space 12b is formed in a concave shape between the grooves 12a on both sides. During the operation of the heat transport device 10, the space 12b contains a gaseous working fluid that has evaporated through the groove 11a.

  The groove 12a of the lower substrate 12, the groove 11a of the upper substrate 11, the connection hole 11b, and the like are produced by, for example, photolithography, cutting, or laser processing.

  Like the evaporator 1, the condenser 2 includes a rectangular upper substrate 13 and a lower substrate 14. The upper substrate 13 is made of glass, for example, Pyrex (registered trademark) glass is used. On the other hand, the lower substrate 14 is made of silicon.

  As shown in FIGS. 1, 3, and 4, on the side of the upper substrate 13 facing the lower substrate 14, a flow path 13 a for circulating the working fluid flowing out from the other end 3 b of the gas phase tube 3, A space 13b constituting a path is formed. The flow path 13a is formed in a U-shape in order to circulate and condense the gas phase working fluid flowing out from the gas phase pipe 3b as long as possible. The upper substrate 13 is provided with a reservoir 13d for storing a liquid-phase working fluid. That is, the condenser 2 and the reservoir 13d are integrally provided. The reservoir 13 d communicates with a plurality of grooves 14 c formed in the lower substrate 14. As shown in FIG. 3, the groove 14c extends in the X direction so as to intersect the flow path 13a below the flow path 13a. The other end 4b of the liquid phase tube 4 is inserted into the connection hole 13e and joined to the upper substrate 13 by, for example, solder 16, and the groove 14c communicates with the connection hole 13e. The lower substrate 14 is formed with a plurality of grooves 14a serving as flow paths in a direction (Y direction) perpendicular to the grooves 14c, and the grooves 14a are also communicated with the space 13b. Further, the upper substrate 13 is provided with an injection hole 13c for injecting the working fluid into the condenser 2 when the heat transport device 10 is manufactured. The reservoir 13d communicates with the injection hole 13c. When the working fluid is injected from the injection hole 13c, the working fluid is stored in the reservoir 13d.

  On the upper surface of the upper substrate 13, a lid 5 for covering the injection hole 13c and sealing the inside of the condenser 2 is mounted. The lid 5 is attached to the upper substrate 13 by, for example, an adhesive or a screw (not shown). As a material of the lid 5, for example, a metal such as copper, aluminum, or stainless steel is used, but the material is not necessarily limited to a metal and may be a resin material.

  The flow path 13a, the space 13b, the connection hole 13e, the groove 14c, the reservoir 13d, and the like are provided in two each, corresponding to the fact that two liquid phase tubes 4 and two gas phase tubes 3 are provided, for example. ing. The groove 14a and groove 14c of the lower substrate 14, the flow path 13a, the space 13b, the connection hole 13e, the reservoir 13d, the injection hole 13c, and the like of the upper substrate 13 are produced by, for example, photolithography, cutting, or laser processing. .

  As shown in FIGS. 3 and 4, the width p of one groove 14a of the lower substrate 14 is designed to be larger than the width q of one groove 14c. That is, the channel volume of the groove 14c is designed to be smaller than that of the groove 14a. Here, the flow path volume is the volume of the flow path per unit length in the direction in which the working fluid flows (when viewed from the groove 14a in FIG. 3 and the groove 14c in FIG. 4). Moreover, even if the flow path volume of the flow path 13a and the groove | channel 14c is compared, the flow path volume of the groove | channel 14c is designed small. Thus, since the channel volume of the groove 14c is designed to be smaller than that of the groove 14a and the channel 13a, the capillary force of the groove 14c is compared with that of the groove 14a and the channel 13a. Can be bigger.

  The operation of the heat transport device 10 configured as described above will be described.

  The heat generated by the heating element 15 is transmitted to the lower substrate 12, and the working fluid flowing through the groove 11a of the evaporator 1 is evaporated by this heat. The evaporated working fluid flows through the gas phase pipe 3 and flows into the flow path 13 a in the condenser 2. The working fluid flows through the flow path 13a and further accumulates in the space 13b via the groove 14a, thereby transferring heat to the upper substrate 13 and the lower substrate 14 to condense. When the upper substrate 13 is made of glass and the lower substrate 14 is made of silicon, the lower substrate 14 particularly contributes to heat conduction due to the difference in thermal conductivity between the two. The heat transmitted to the upper substrate 13 and the lower substrate 14 is released to the outside of the condenser 2. The liquid-phase working fluid accumulated in the space 13b flows into the connection hole 13e via the groove 14a and further flows into the liquid-phase tube 4.

  A part of the working fluid condensed through the flow path 13a flows through the groove 14c and flows into the reservoir 13d by a relatively large capillary force.

  The working fluid condensed in the condenser 2 flows through the liquid phase tube 4 and flows into the groove 12a in the evaporator 1, and the working fluid is again returned to the groove 11a by the capillary force generated in the working fluid, for example, in the groove 11a. Evaporates due to the heat of the heating element 15. In this way, the heat of the heating element 15 is transported to the condenser 2 side, and the operation as described above is repeated, whereby the heat generated by the heating element 15 is released to the outside of the condenser 2 to cool the heating element 15. can do.

  For example, when the heat transport device 10 is not operating (no heat load), if the evaporator is positioned so that 1 is located below the condenser 2, the liquid phase operation is conventionally performed in the evaporator 1. Fluid could accumulate due to gravity. Alternatively, the working fluid may move to the evaporator 1 side due to centrifugal force. However, the presence of the reservoir 13d in the condenser 2 as in the present embodiment prevents the working fluid stored in the reservoir 13d from flowing out of the reservoir 13d to the evaporator 1 when the heat transport apparatus 10 is not operating. Can be prevented. Thereby, it can prevent that the working fluid of a liquid phase accumulates in the evaporator 1 too much by gravity. As a result, the heat transport device can operate without requiring a starter.

  In particular, in the heat transport device 10 according to the present embodiment, as described above, the channel volume of the groove 14c is designed to be smaller than that of the groove 14a. Thereby, it is considered that the flow path resistance in the groove 14c is larger than that in the groove 14a. Therefore, it becomes difficult for the liquid-phase working fluid stored in the reservoir 13d to flow out to the evaporator 1 side through the groove 14c.

  The presence of the reservoir 13d in the condenser 2 has an advantage that the amount of the working fluid can be easily adjusted when the heat transport device 10 is manufactured. The reason is that since the working fluid in the condenser 2 is almost in the liquid phase, it may be considered that the volume of the reservoir 13d directly affects the amount of working fluid in the liquid phase state. That is, by adjusting the volume of the reservoir 13d, the amount of working fluid can be adjusted, whereby the operating temperature range of the heat transport device 10 and the maximum heat transport amount can be set.

  Further, when there is the reservoir 13d, the internal volume in the condenser 2 can be increased, so that the heat with respect to the variation in the amount of working fluid and the presence of non-condensable gas (for example, gas generated by a chemical reaction between the working fluid and silicon). Although the robustness of the transport device 10 is improved, in the conventional reservoir 13d, a liquid-phase working fluid and a gas-phase working fluid are mixed. When the reservoir is close to the evaporator, the temperature is high and the proportion of the gas phase increases, so the amount of the liquid phase working fluid in the condenser 2 increases and the heat dissipation efficiency decreases. However, the temperature of the reservoir 13d of the heat transport device 10 according to the present embodiment is the temperature of the heat dissipating part (for example, the lower substrate 14) of the condenser 2 that becomes the lowest temperature in the heat transport device 10 by being attached to the condenser 2. It will be near and will be almost filled with a liquid phase. As a result, high robustness can be realized without reducing the condensation efficiency of the condenser 2.

  Alternatively, if the amount of the liquid-phase working fluid in the condenser 2 is reduced in order to maintain or improve the condensation efficiency, it has been easy to cause liquid breakage due to disturbance (vibration or the like) in the past. Since 13d is in the condenser 2, it is difficult for the liquid to run out.

  Further, as described above, the flow path volume of the groove 14c has a larger capillary force than other parts. For example, the working fluid flowing through the flow path 13a can be guided to the groove 14c and guided to the reservoir 13d. It becomes. Thereby, it becomes possible to always store the working fluid in the storage section regardless of the posture of the heat transport device 10.

  Further, the groove 14c extends to the vicinity of the end portion 4b of the liquid phase tube 4 or just below the end portion 4b. That is, the groove 14c extends from one end (first end) communicating with the reservoir 13d, and the other end (second end) is disposed in the vicinity of the end 4b of the liquid phase tube 4. Is formed. For example, the heat transport device 10 may vibrate due to a disturbance, the liquid level moves and bubbles are mixed in the liquid phase tube 4, or bubbles are mixed in the liquid phase tube 4 when the heat load is excessive. is there. When bubbles are generated in this manner, the supply resistance of the liquid phase working fluid from the reservoir 13d becomes a resistance. However, according to the present embodiment, the liquid phase working fluid is stably supplied from the reservoir 13d through the groove 14c. It can be supplied into the liquid phase tube 4.

  FIG. 5 is a perspective view showing a heat transport device according to the second embodiment of the present invention. FIG. 6 is a plan view of the heat transport device 20 shown in FIG. 7 is a cross-sectional view taken along the line CC shown in FIG. In the following description, including the second embodiment, the description of the same members and functions of the heat transport apparatus 10 according to the first embodiment will be simplified or omitted, and different points will be mainly described. explain.

  The heat transport device 20 includes, for example, two substrates 21 and 22. The upper substrate 21 is made of, for example, glass, and the lower substrate 22 is made of, for example, silicon. The heat transport device 20 integrally includes an evaporation unit 25, a gas phase channel 26 through which a gas phase working fluid flows, a condensing unit 27, and a liquid phase channel 28 through which a liquid phase working fluid flows. Yes.

  FIG. 8 is a plan view showing only the lower substrate 22. As shown in FIG. 8, a space 22b is formed in the lower substrate 22, and a plurality of walls 22d are erected from the bottom surface of the space 22b. As shown in FIG. 7, the wall 22d is in contact with the upper substrate 21 at its upper end. These walls 22d form a working fluid flow path 22a. Within the heat transport device 20, among the evaporating unit 25, the gas phase channel 26, the condensing unit 27, and the liquid phase channel 28, for example, the liquid phase channel 28 is formed so that the channel width of the channel 22 a is the narrowest. Has been. This is because the capillary force is increased in the liquid phase channel 28 compared to other parts, and the pulling force of the liquid phase working fluid into the evaporation unit 25 is increased. Note that the working fluid flows in the direction of the arrow shown in FIG.

  As shown in FIG. 7, a reservoir 21 d is provided at a position near the condensing part 27 of the upper substrate 21. A hole for injecting a working fluid (not shown) communicates with the reservoir 21d, and this hole is covered with, for example, a lid (not shown) from the upper surface side of the upper substrate 21, so that the inside of the heat transport device 20 is sealed. A channel 22 c is provided between the reservoir 21 d and the condensing unit 27. The flow path volume of the flow path 22c is designed to be smaller than the flow paths of other parts. Even with such a configuration, it is possible to obtain the same effect as that of the heat transport device 10.

  FIG. 9 is a plan view showing a heat transport device according to still another embodiment, which is a modification of the heat transport device 10 of FIGS.

  The reservoir 13 d in the condenser 62 of the heat transport device 60 is provided near the end 4 b of the liquid phase tube 4. A groove 14c extends from the reservoir 13d to the vicinity of the end 4b of the liquid phase tube 4. The groove 14c has a smaller flow path volume than other parts, as in the heat transport device 10. Even with such a configuration, the same effect as the heat transport device 10 can be obtained.

  FIG.10 and FIG.11 is a top view which respectively shows the heat-transport apparatus which concerns on another embodiment.

  A heat transport device 40 shown in FIG. 10 includes an evaporator 41, a condenser 42, and a reservoir 43 connected to the condenser 42 via a supply pipe 6. As described above, the reservoir 43 and the condenser 42 may be formed of different containers. Even with such a configuration, it is possible to prevent the heat transport apparatus 40 from flowing out of the reservoir 43 to the evaporator 41 as much as possible. Thereby, it can prevent that the working fluid of a liquid phase accumulates in the evaporator 41 too much by gravity.

  A heat transport device 50 shown in FIG. 11 includes an evaporator 51, a condenser 52, and a reservoir 53 connected to the condenser 52 via a supply pipe 6, and further in the condenser 52 of the supply pipe 36. The connection end 36 a is provided so as to be as close as possible to the connection end 4 b in the condenser 52 of the liquid phase tube 4. Even with such a configuration, it is possible to prevent the heat transport device 50 from flowing out of the reservoir 53 to the evaporator 51 as much as possible, and to prevent the liquid-phase working fluid from being accumulated in the evaporator 51 due to gravity. Can do. Furthermore, since the connection end 36a of the supply pipe 36 and the connection end 4b of the liquid phase pipe 4 are close to each other, the liquid phase can be stably transferred from the reservoir 53 into the liquid phase pipe 4 through the flow path 58 in the condenser 52, for example. Phase working fluid can be supplied.

  The present invention is not limited to the embodiment described above, and various modifications are possible.

  For example, the patterns and cross-sectional shapes of the flow paths and grooves in the evaporator 1 and the condenser 2 are not limited to the above-described embodiments, and various types are conceivable.

  In the first and second embodiments, the reservoirs 13d and 21d are formed on the upper substrate 13 and the like. However, the reservoir 13d or the like may be formed on the lower substrate 14 or the like, or may be formed on both the upper and lower substrates.

  In the first and second embodiments, the configuration in which the flow path (groove) 14c and the like communicating with the reservoir 13d and the like is provided is shown. The groove 14c or the like may have a structure in which the capillary force gradually increases as it approaches the reservoir 13d. This is realized by, for example, a structure in which the surface area of the groove 14c in contact with the working fluid gradually increases as it approaches the reservoir 13d. Gradually includes the meaning of continuously, stepwise, or a combination thereof.

  10 and 11, the reservoir 43 and the like are shown to be disposed in substantially the same plane as the evaporator 41 and the condenser 42. However, the reservoir 43 or the like does not have to be in the same plane as the evaporator 41 or the like. For example, the reservoir 43 can be provided obliquely with respect to the evaporator 41 or the condenser 42. Alternatively, the reservoir 43 and the condenser 42 may be arranged so that the reservoir 43 is arranged on the upper surface of the condenser 42, that is, in a direction perpendicular to the paper surface of FIG.

It is a top view which shows the heat transport apparatus which concerns on the 1st Embodiment of this invention. It is a side view of the heat transport apparatus shown in FIG. It is the sectional view on the AA line shown in FIG. It is the BB sectional view taken on the line shown in FIG. It is a perspective view which shows the heat transport apparatus which concerns on the 2nd Embodiment of this invention. It is a top view of the heat transport apparatus shown in FIG. It is CC sectional view taken on the line shown in FIG. It is the top view which showed only the lower board | substrate of the heat transport apparatus of FIG. It is a top view which shows the modification of the heat transport apparatus shown in FIG. It is a top view which shows the heat transport apparatus which concerns on another embodiment of this invention. It is a top view which shows the heat transport apparatus which concerns on another embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 41, 51 ... Evaporator 2, 42, 52, 62 ... Condenser 3 ... Gas phase tube 4 ... Liquid phase tube 3a, 4a ... One end part 3b, 4b ... Other end part 6, 36 ... Supply pipe 10, 20 , 40, 50, 60 ... heat transport device 11a, 12a, 13a, 14a, 14c, 22a, 22c, 58 ... groove (flow path)
12b, 13b, 22b ... space (flow path)
13d, 21d, 43, 53 ... Reservoir 15 ... Heating element 25 ... Evaporating section 26 ... Gas phase flow path 27 ... Condensing section 28 ... Liquid phase flow path 36a ... Connection end

Claims (10)

An evaporating section that circulates the working fluid and absorbs heat by the evaporating action of the working fluid;
A condensing part for circulating the working fluid and releasing heat by the condensing action of the working fluid;
A first flow path for circulating the working fluid evaporated in the evaporation section to the condensation section;
A second flow path for circulating the working fluid condensed in the condensing unit to the evaporating unit;
A heat transport apparatus, comprising: a storage section that is disposed closer to the condensing section than the evaporation section and stores the working fluid. The heat transport device according to claim 1,
The heat transport apparatus further comprising a plate containing at least the condensing part and the storage part. The heat transport device according to claim 2,
The heat transport apparatus according to claim 1, wherein the plate further includes the evaporation section and the first and second flow paths. An evaporator that circulates the working fluid and absorbs heat by the evaporation of the working fluid;
A condenser having a reservoir for storing the working fluid therein, and releasing heat by the condensing action of the working fluid;
A first pipe connected between the evaporator and the condenser for circulating the working fluid evaporated in the evaporator to the condenser;
A heat transport device, comprising: a second pipe connected between the evaporator and the condenser and configured to circulate the working fluid condensed in the condensing unit to the evaporator. The heat transport device according to claim 4,
The condenser is
A first flow path having a first flow path volume capable of flowing while condensing the working fluid;
And a second channel having a second channel volume smaller than the first channel volume and provided between at least the first channel and the reservoir. apparatus. The heat transport device according to claim 4,
The heat transport device according to claim 1, wherein the condenser includes a capillary passage that guides the working fluid to the reservoir by a capillary force. The heat transport device according to claim 4,
The condenser has a flow path having a first end connected to the reservoir, and a second end disposed at a position closer to the second pipe than the first pipe. A heat transport device characterized by. The heat transport device according to claim 7,
The second pipe has a connecting end connected to the condenser;
The heat transport device according to claim 1, wherein the second end of the flow path is disposed in the vicinity of the connection end. A heating element;
An evaporating section that circulates the working fluid and absorbs heat of the heating element by the evaporating action of the working fluid;
A condensing part for circulating the working fluid and releasing heat by the condensing action of the working fluid;
A first flow path for circulating the working fluid evaporated in the evaporation section to the condensation section;
A second flow path for circulating the working fluid condensed in the condensing unit to the evaporating unit;
An electronic apparatus comprising: a storage unit that is disposed closer to the condensing unit than the evaporation unit and stores the working fluid. A heating element;
An evaporator that circulates the working fluid and absorbs the heat of the heating element by the evaporation of the working fluid;
A condenser having a reservoir for storing the working fluid therein, and releasing heat by the condensing action of the working fluid;
A first pipe connected between the evaporator and the condenser for circulating the working fluid evaporated in the evaporator to the condenser;
An electronic apparatus comprising: a second pipe connected between the evaporator and the condenser and configured to circulate the working fluid condensed in the condensing unit to the evaporator.

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