JP2006247081A - Capsule type apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a capsule type apparatus incorporating a printed board which can automatically be bent to be in a prescribed shape though a worker does not fold it by manual work. <P>SOLUTION: A circuit board 5 incorporates shape memory members 21 and 22 which bend the whole of the circuit board 5 to be in the prescribed shape suitable for being housed in a capsule by generating drawing force among the respective circular plates 5a to 5c of the circuit board 5 by shrinking to be in the prescribed shape in the case of being heated to a prescribed temperature. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a capsule device that is introduced into a body cavity of a subject and wirelessly transmits information obtained by examining the inside of the body cavity to the outside of the body of the subject.

  As is well known, there is an electronic endoscope system as a system for observing the inside of the digestive tract of a subject. This electronic endoscope system includes an electronic endoscope having a flexible tubular insertion portion in which an imaging device for imaging a subject is incorporated at the tip thereof, and an image signal output from the electronic endoscope. A processor device for performing processing and a monitor for displaying an image based on an image signal processed by the processor device are provided. When actually observing the digestive tract of a subject using such an electronic endoscope system, the insertion portion of the electronic endoscope is orally introduced into the body cavity (digestive tract) of the subject. It must be, but for the subject, the state where the tube constituting the insertion portion was inserted into the throat was very painful and unbearable.

  Therefore, in recent years, in order to eliminate the pain of the subject due to the insertion of the insertion part of the electronic endoscope into the throat, the subject swallows the body cavity of the subject (in the digestive tract) 2. Description of the Related Art A capsule endoscope system has been developed that includes a capsule endoscope introduced into the body and an extracorporeal unit disposed outside the body of a subject (see Patent Document 1).

  Similarly, in order to perform various inspections, a capsule-type device incorporating another inspection device in place of the above-described imaging function has also been developed.

Such a capsule-type device is designed with a small size as a top priority, so the electrical circuit is built in a narrow space inside the capsule, so the lead circuit and connector are not required. Wiring between each circuit component is made through a single flexible printed circuit board. And this flexible substrate is stuffed inside the capsule by being folded three-dimensionally.
JP 2001-95775 A

  However, since the printed circuit board used for the capsule-type device is small in size, it is difficult for the assembly operator to fold the printed circuit board after folding each circuit board. As a result, it was impossible to avoid variations in assembly accuracy depending on the ability of the operator.

  Although it is conceivable to fold the circuit board in advance before mounting the circuit components, there is no change in the situation that the folding work is difficult due to the small size of the printed circuit board, and the printed circuit board has a crease. The work of mounting circuit components becomes difficult on the contrary, so it is difficult to adopt.

  The present invention has been made in view of the above-described problems in the related art, and the problem is that the circuit component is flat when mounted, so that it is easy to mount the circuit component. Is to provide a capsule-type device incorporating a printed circuit board that automatically bends into a predetermined shape without being manually folded.

The capsule-type device endoscope of the present invention devised to solve the above problems includes a circuit for wirelessly transmitting information obtained by examining the inside of the body cavity of a subject to the outside. A capsule-type device including a circuit board that is mounted in the capsule in a state in which at least a part of the circuit is mounted and bent into a predetermined shape. A capsule-type device, wherein a shape memory member is incorporated which is bent into the predetermined shape by being deformed into a predetermined shape when heated to the above temperature.

  With this configuration, even if the circuit board is mounted on the surface after the circuit board is flattened at room temperature, the shape memory member incorporated in the circuit board is then heated to a predetermined temperature. For example, when the shape memory member is deformed into a predetermined shape, the entire circuit board is deformed into a predetermined shape suitable for being accommodated in the capsule. Therefore, it is not necessary to perform a precise and complicated work in which the operator manually folds the circuit board after mounting the circuit components, thereby improving work efficiency.

  According to the capsule-type device of the present invention, it is easy to mount the circuit component because it is flat when the circuit component is mounted. However, after the circuit component is mounted, the operator does not need to manually fold the circuit component. Because it bends automatically, work efficiency is improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present embodiment shows an example in which the capsule device according to the present invention is implemented as a capsule endoscope including an illumination device and an imaging device.

  The capsule endoscope 1 in the present embodiment is an apparatus that is orally introduced into a body cavity of a subject and images the body cavity and wirelessly transmits an image signal obtained by imaging the body cavity. FIG. 1 is a sectional view showing a longitudinal section along the central axis in order to represent the internal configuration of the capsule endoscope 1. In order to simplify the following description, the left side of FIG. 1 is defined as “front side” and the right side of FIG. 1 is defined as “rear side”.

  As shown in FIG. 1, the capsule endoscope 1 includes a cylindrical frame 2 that houses each circuit component, an objective unit 3 that is fitted to the front end of the frame 2, and a front end surface of the frame 2. A pair of light-emitting diodes 4 and 4 embedded on both sides of the objective unit 3 and a large number of circuit components are mounted, part of which is folded and accommodated in the frame 2, and the remaining part is the frame 2. A circuit board 5 (shown by a thick line in FIG. 1) wound around the outer peripheral surface, a spacer 6 that is a cylinder that supports the circuit board 5 folded in the frame 2, and a circuit board folded in the frame 2 5 is composed of a battery 7 sandwiched by 5 and a capsule 10 for storing these components inside and protecting them in a liquid-tight manner.

  The capsule 10 includes a cylindrical barrel portion 101 whose rear end portion is semispherical and a hemispherical transparent cover 102 that is liquid-tightly fitted to the front end of the barrel portion 101. Therefore, the capsule 10 has a so-called capsule shape as a whole. The transparent cover 102 serves as a dome port that keeps the distance from the objective unit 3 to the subject moderate.

  The frame 2 is made of injection-molded synthetic resin. The inside of the frame 2 is a small inner diameter portion 2a on the front side 1/5, and the rear side 4/5 is large via a step surface 2b orthogonal to the central axis. It is an inner diameter portion 2c. In addition, a plurality of rims 2d (in FIG. 1, the folded state is shown in the rear end edge of the circuit board 5 by being folded inward by plastic deformation. Projecting rearward), but is integrally formed. Further, a portion of the outer peripheral surface of the frame 2 that is in contact with the outside of the small inner diameter portion 2a is wound in an annular shape to reduce weight. Further, the pair of light emitting diodes 4 and 4 described above are embedded on both sides of the small inner diameter portion 2a on the front end surface of the frame 2 (see FIG. 2). Note that the tips of the electrodes 4a extending from the cathode and the anode of each light emitting diode 4 penetrate the frame 2 and are exposed to the stepped surface 2b. Although not shown in the drawing, they are electrically connected to the lands formed on the circuit board 5. The terminal for doing is formed.

  The objective unit 3 includes a lens barrel 8 which is slightly shorter than the axial length of the small inner diameter portion 2a and has an outer diameter substantially the same as the inner diameter of the small inner diameter portion 2a, and a plurality of lenses held in the lens barrel 8. And an objective optical system 9 comprising:

  FIG. 3 is a development view showing a state where the circuit board 5 is developed. As shown in FIG. 3, the circuit board 5 is mounted with circuit components to be described later, a wiring pattern (not shown) for connecting these circuit components, and the electrodes 4a of the light emitting diodes 4 and 4 described above. , 4a is a flexible printed circuit board on which a land (not shown) that is electrically connected to a terminal at the tip and an antenna 18 is formed, and includes a front circular plate 5a, an inner circular plate 5b, a rear circular plate 5c, and a side plate 5d. And rectangular connection plates 5e and 5f.

  Each of the front circular plate 5a, the inner circular plate 5b, and the rear circular plate 5c is a circular printed circuit board having substantially the same outer diameter as the inner diameter of the large inner diameter portion 2c of the frame 2, and each of the circular plates 5a to 5c. 5c is arrange | positioned in order from the front side (left side of FIG. 3). Further, the front circular plate 5a and the inner circular plate 5b are arranged in a straight line through the connection plate 5e, and the inner circular plate 5b and the rear circular plate 5c are arranged in a straight line through the connection plate 5f. Connected to each other. The sum of the lengths of both the connecting plates 5e and 5f in the longitudinal direction coincides with the axial length of the large inner diameter portion 2c of the frame 2. A rectangular side plate 5d is connected in parallel with each of the connection plates 5e and 5f at a position shifted by 90 degrees with respect to the connection plate 5f in the rear circular plate 5c.

  When the circuit board 5 is actually accommodated in the capsule 10, the connection plates 5e and 5f and the circular plates 5a to 5c are arranged so that the circular plates 5a to 5c are parallel and coaxial with each other. The border is bent at a right angle.

  The front circular plate 5 a is disposed so as to be inscribed in the stepped surface 2 b of the frame 2. A square window 5g is opened at the center of the front circular plate 5a, and the rear surface of the front circular plate 5a (front surface in FIG. 3) so that an imaging surface is desired for the window 5g. In addition, the image sensor 11 is mounted. Therefore, the center of the image pickup surface of the image pickup device 11 coincides with the optical axis of the objective optical system 9.

  Between the front circular plate 5a and the inner circular plate 5b, in order to secure a space for accommodating circuit components such as the image sensor 11, the outer diameter and the connection plate 5e substantially the same as the circular plates 5a and 5b. A spacer 6 having the same overall length is interposed. A plurality of other circuit components 12 are mounted on the surface of the inner circular plate 5b facing the image sensor 11.

  An anode contact portion 13 that is a land that contacts the anode of the battery 7 is formed on the opposite side surface of the inner circular plate 5b. A cathode contact portion 14, which is a spring-like electrode that contacts the cathode of the battery 220, is mounted on the surface of the rear circular plate 5 c that faces the inner circular plate 5 b. That is, the space between the inner circular plate 5b and the rear circular plate 5c is a battery accommodating space, and the battery 7 itself accommodated in the middle circular plate 5c is folded into the rear circular plate 5c bent as described above. It functions as a spacer for positioning by pressing.

  A switch circuit 15 is mounted on the opposite side surface of the rear circular plate 5c to close the circuit when the operation button 15a penetrating the center of the body 101 in a liquid-tight manner is pushed. The cathode contact portion 14 described above is electrically connected to the ground electrode of each circuit component (the image sensor 11 and other circuit components 12) through the switch circuit 15 and each circuit pattern on the circuit board. The circuit patterns on the circuit board 5 are electrically connected to the power supply electrodes of the circuit components (the image sensor 11 and other circuit components 12). A transmission circuit that modulates an image signal that is output from the image sensor 11 and appropriately processed by another circuit component 12 around the switch circuit 15 in the rear circular plate 5c and sends the image signal to an antenna 18 described later. 16 and a receiving circuit 17 for demodulating an operation signal received by the antenna 18 from a processor device (not shown).

  The antenna 18 is formed on the surface of the side plate 5d as a wiring pattern that reciprocates in the longitudinal direction. As described above, the side plate 5b is accommodated in the frame 2 together with the spacer 6 and the battery 7 in a state where the boundary between the circular plates 5a to 5c and the connection plates 5e to 5f is bent. 2 is wound around the outer peripheral surface.

  Hereinafter, two examples of the configuration adopted to automatically bend the boundary between the circular plates 5a to 5c and the connection plates 5e to 5f in the circuit board 5 will be described.

  The first embodiment 1 is an example in which the circuit board 5 is bent using the contraction force of the shape memory material storing the spring shape. In the first embodiment, as shown in FIG. 4 which is a plan view in which the side plate 5d is omitted and FIG. 5 which is a side view seen from the direction of arrow V in FIG. 4, each circular plate 5a in the circuit board 5 is provided. The shape memory members 20, 21 each storing the spring shape are spanned between ˜c. In other words, at the positions of the front circular plate 5a that are shifted by 90 degrees clockwise and counterclockwise from the position of the connection plate 5e, a pair that contracts in a spring shape at a temperature T1 that is higher than room temperature, although it takes a band shape at room temperature. One end of each first shape memory member 20 is fixed. Further, the other end of each first shape memory member 20 is fixed at a position shifted by 90 degrees clockwise and counterclockwise from the positions of the connection plates 5e and 5f on the inner circular plate 5b. In addition, on the back side of the connection position of each first shape memory member 20 on the inner circular plate 5b, a pair of second shape memory members that contract in a spring shape at a temperature T2 higher than the temperature T1, although taking a belt-like form at room temperature. One end of each 21 is fixed. Further, the other end of each second shape memory member 21 is fixed at a position shifted 90 degrees clockwise and counterclockwise from the position of the connection plate 5f on the rear circular plate 5c. Further, groove-like folds are integrally formed at the boundaries between the circular plates 5a to 5c and the connection plates 5e to 5f so that stress is concentrated.

  With the above configuration, when hot air having a temperature of T1 or higher is blown onto the circuit board 5 on which the wiring patterns are formed and the circuit components 11 to 17 have been mounted, the first shape memory members 20 contract in a spring shape. As a result, a traction force is generated between the inner circular plate 5b and the rear circular plate 5c. As shown in FIG. 6, the boundary between the inner circular plate 5b and the connection plate 5f, and the connection plate 5f and the rear plate are connected. The boundary between the side circular plates 5c is bent 90 degrees. Further, when the temperature of the hot air is increased to T2 or more, each second shape memory member 5e contracts in a spring shape, so that a traction force is generated between the front circular plate 5a and the inner circular plate 5b, and the front circular plate The boundary between 5a and the connection plate 5e and the boundary between the connection plate 5e and the inner circular plate 5b are bent 90 degrees, respectively.

  The deformation temperatures T1 and T2 of the first and second shape memory members 20 and 21 may be the same temperature, but if different temperatures are used, each step is performed by sequentially heating at a temperature corresponding to each step. It is possible to bend the parts according to each.

  The second embodiment is characterized in that the circuit board 5 itself is formed from a shape memory material. That is, in the second embodiment, the circuit board 5 is composed of upper and lower two layers of shape memory material, and as shown in FIG. 8, the completed shape (that is, each of the circular plates 5a to 5c and each of the connection plates). After the upper and lower layers are bonded to each other in a state in which the shape between each of 5e and f is bent 90 degrees is stored, they are flattened as shown in FIG. In this state, a wiring pattern is formed on the surface and circuit components 11 to 17 are mounted. Thereafter, when hot air having a temperature equal to or higher than the deformation temperature is blown onto the circuit board 5, the circuit board 8 is restored to the shape shown in FIG. In the second embodiment, not only a single shape memory material is used as the circuit board 8, but a shape is memorized in two shape memory materials stacked on each other and then bonded to each other. Therefore, in restoring the memorized shape, the stress due to tension and expansion accompanying the restoration of the shape of each layer is concentrated and acts on the crease, so that the shape is restored with a stronger force and each crease has a sharp shape. Bends.

  Next, an example of the configuration adopted for winding the side plate 5d in the circuit board 5 will be described.

  As described above, since the side plate 5d is bent with a uniform curvature over the entire area, it is not necessary to apply a strong force locally as in the second embodiment described above. Therefore, as shown in FIG. 10A, it is sufficient to form the side plate 5d from a shape memory material made of a single layer. Since the cylindrical shape is stored in advance on the side plate 5d as shown in FIG. 10 (b), hot air is blown on the boundary between each circular plate 5a-c and each connection plate 5e-f. simultaneous. Alternatively, after the circular plates 5a to 5c whose shapes have been restored previously are accommodated in the frame 2, if hot air is blown onto the side plates 5d, as shown in FIG. Restore to the wrapping shape.

  As the shape memory material constituting each layer of the shape memory members 21, 22 in Example 1 and the circuit board 5 in Examples 2 and 3, specifically, nickel titanium alloy, styrene-butadiene are used. Copolymer, polyurethane polymer, polynobornene polymer, radiation-treated resin (eg, polylactic acid), polyolefin, elastic neoprene, fluoroplastic cainer, fluoroplastic cainer, and polytetrafluoroethylene. it can.

The longitudinal cross-sectional view of the capsule endoscope which is embodiment of this invention Cross-sectional view along line II-II in FIG. Development of circuit board The detailed top view which shows the state of each circular board and connection board before the heating of the circuit board by Example 1 Side view seen from the direction of arrow V in FIG. Side view showing state heated at temperature T1 Side view showing state heated at temperature T2 The side view which shows the state before the heating of the circuit board by Example 2 The side view which shows the state after the heating of the circuit board by Example 2 The figure which shows the side plate by Example 3.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Capsule endoscope 5 Circuit board 5a Front side circular board 5b Inner circular board 5c Rear side circular board 5d Side view 20 1st shape memory member 21 2nd shape memory member

Claims (5)

A capsule-type device in which a circuit for wirelessly transmitting information obtained by examining the inside of a body cavity of a subject to the outside is built in a capsule,
The circuit board is housed in the capsule in a state where at least a part of the circuit is mounted and bent into a predetermined shape,
A capsule-type device, wherein a shape memory member for bending the circuit board into the predetermined shape by being deformed into a predetermined shape when heated to a predetermined temperature is incorporated in the circuit board. The shape memory member has a belt-like shape whose both ends are fixed at two locations on the edge of the circuit board at room temperature, and is deformed into the predetermined shape when heated to the predetermined temperature. The capsule-type device according to claim 1, wherein the capsule-type device contracts by the operation. 2. The capsule device according to claim 1, wherein the circuit board itself is made of the shape memory member. 4. The capsule device according to claim 3, wherein the circuit board is formed of a plurality of layers of shape memory members bonded to each other. The capsule-type device according to claim 1, wherein the shape memory member is made of a shape memory resin.