JP2006245325A - Laminated substrate, laminated body, and manufacturing method thereof - Google Patents

Laminated substrate, laminated body, and manufacturing method thereof Download PDF

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JP2006245325A
JP2006245325A JP2005059399A JP2005059399A JP2006245325A JP 2006245325 A JP2006245325 A JP 2006245325A JP 2005059399 A JP2005059399 A JP 2005059399A JP 2005059399 A JP2005059399 A JP 2005059399A JP 2006245325 A JP2006245325 A JP 2006245325A
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substrate
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Takashi Fukui
隆史 福井
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Fujifilm Holdings Corp
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Fuji Photo Film Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To store various information about each laminated substrate into information storage parts in two or more substrates, and to certainly read the information in the information storage part which becomes the inner layer side in the laminated substrate. <P>SOLUTION: Two or more first to third laminated substrates 12, 14 and 16 comprise plate-shaped transparent insulators 18a-18c, and conductive foil 20a-20c stuck on the surface of the insulators 18a-18c. The first to third substrates 12, 14 and 16 are respectively provided with first to third information storage region 24, 26 and 28 wherein information at the time of exposure processing is respectively recorded. Further, in the second substrate 14 laminated on the upper portion of the first substrate 12, a first window 62 used as an opening is formed at the position used as the upper part of the first information storage region 24. In the third substrate 16 laminated on the upper portion of the second substrate 14, a second window 64 is formed in a position used as the upper part of the first and second information storage regions 24 and 26. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、積層基板、積層体及びその製造方法に関し、一層詳細には、複数の基板に情報が記録された積層基板、積層体及びその製造方法に関する。   The present invention relates to a laminated substrate, a laminated body, and a manufacturing method thereof, and more particularly to a laminated substrate, a laminated body, and a manufacturing method thereof in which information is recorded on a plurality of substrates.

例えば、露光装置において、感光材料からなるシート体を露光ステージに位置決め固定し、この露光ステージをシート体と共に移動させる一方、レーザビームを所望の画像パターンに従い変調してシート体を露光走査することにより、液晶ディスプレイ、プラズマディスプレイ等のフィルタや多層プリント配線基板等を製造するための技術開発が進められている。   For example, in an exposure apparatus, a sheet body made of a photosensitive material is positioned and fixed to an exposure stage, and the exposure stage is moved together with the sheet body, while a laser beam is modulated according to a desired image pattern and the sheet body is exposed and scanned. Technological development for manufacturing filters such as liquid crystal displays and plasma displays, multilayer printed wiring boards, and the like is underway.

ところで、例えば、特許文献１には、半導体ＬＳＩのパターンが露光された半導体チップに対してそれぞれ各種番号や名称等が書き込まれたチップ個別情報領域が設けられ、前記半導体チップに、万が一、不良が生じた場合には、前記チップ個別情報を読み取ることにより解析を行い、製造工程において生じた半導体チップの不具合箇所や原因の特定を行う方法が開示されている。   By the way, for example, Patent Document 1 includes a chip individual information area in which various numbers, names, and the like are written on a semiconductor chip on which a pattern of a semiconductor LSI is exposed. When it occurs, a method is disclosed in which analysis is performed by reading the individual chip information, and a defective portion or cause of the semiconductor chip generated in the manufacturing process is specified.

特開２００３−１４２３７９号公報JP 2003-142379 A

近年、上述したようなプリント配線基板では、その回路面積を増大させる目的で回路が形成された複数の基板層と絶縁材料からなる絶縁層とを交互に積層し、前記基板層及び絶縁層をプレスを介して圧着することにより１枚の基板とした積層基板が採用されている。この場合、積層基板は、各基板層同士が電気的に接続されている。   In recent years, in a printed wiring board as described above, a plurality of substrate layers on which a circuit is formed and an insulating layer made of an insulating material are alternately laminated for the purpose of increasing the circuit area, and the substrate layer and the insulating layer are pressed. A laminated substrate that is a single substrate is used by pressure bonding through the substrate. In this case, in the laminated substrate, the substrate layers are electrically connected to each other.

ところで、このような積層基板において、特許文献１に開示された情報領域を設けようとした場合に、前記積層基板では下層に配置された基板層が、上層となるように配置された他の基板層によって覆われているため、下層となる基板層に設けられた情報領域が他の基板層によって覆われ、前記情報領域の情報を読み取ることが困難となる不都合がある。   By the way, in such a laminated substrate, when an information region disclosed in Patent Document 1 is to be provided, another substrate is arranged such that the substrate layer arranged in the lower layer is the upper layer in the laminated substrate. Since it is covered with the layer, the information area provided in the lower substrate layer is covered with another substrate layer, which makes it difficult to read the information in the information area.

本発明は、前記の種々の課題を考慮してなされたものであり、積層基板において積層された複数の導電層の情報記録部に様々な情報をそれぞれ記録し、前記情報記録部の情報を容易且つ確実に、しかも、迅速に読み取ることが可能な積層基板、積層体及びその製造方法を提供することを目的とする。   The present invention has been made in consideration of the various problems described above, and various information is recorded on the information recording portions of a plurality of conductive layers stacked on the multilayer substrate, so that the information on the information recording portion can be easily obtained. It is another object of the present invention to provide a laminated substrate, a laminated body, and a method for manufacturing the same that can be reliably and quickly read.

前記の目的を達成するために、本発明は、複数の基板が積層された積層基板において、
少なくとも第１絶縁層を有する第１基板と、透過性を有する第２絶縁層を備えた第２基板とを有し、
前記第１基板には、前記第１絶縁層に設けられて回路が形成される第１導電層と、前記第１絶縁層の表面に設けられ、前記回路が形成される際の情報及び前記回路に固有の情報の少なくともいずれか一方が記録された第１情報記録部とを備え、
前記第２基板には、前記第１情報記録部と対向する開口部が設けられ、
前記第１基板に対して前記第２基板が積層された際に、前記第１情報記録部の情報が、前記第２基板の開口部を介して読み取り可能であることを特徴とする。 In order to achieve the above object, the present invention provides a laminated substrate in which a plurality of substrates are laminated,
A first substrate having at least a first insulating layer, and a second substrate having a second insulating layer having transparency;
The first substrate includes a first conductive layer provided on the first insulating layer to form a circuit, information provided when the circuit is formed on the surface of the first insulating layer, and the circuit. A first information recording unit in which at least one of the unique information is recorded,
The second substrate is provided with an opening facing the first information recording unit,
When the second substrate is stacked on the first substrate, the information in the first information recording unit can be read through the opening of the second substrate.

本発明によれば、積層基板における第１基板には、回路が形成される際の情報及び前記回路に固有の情報の少なくともいずれか一方が記録された情報記録部が設けられると共に、透過性を有する第２絶縁層を備えた第２基板を前記第１基板に対して積層させた際に、外層側となる第２基板には、前記第１基板の情報記録部と対向する位置に開口部が形成されている。そして、第１基板の情報記録に記録された情報を、第２絶縁層を介して前記外層側となる第２基板の開口部から読み取る。   According to the present invention, the first substrate in the multilayer substrate is provided with the information recording unit in which at least one of information when the circuit is formed and information specific to the circuit is recorded, and the transparency is improved. When the second substrate having the second insulating layer is stacked on the first substrate, the second substrate on the outer layer side has an opening at a position facing the information recording portion of the first substrate. Is formed. Then, the information recorded in the information record of the first substrate is read from the opening of the second substrate on the outer layer side through the second insulating layer.

従って、複数の基板が積層された積層基板において、第１基板の情報記録部に記録された情報を作業者による目視やＸ線を用いた読取装置によって迅速且つ確実に読み取ることができるため、前記積層基板において不具合等が生じた場合に前記情報に基づいて不具合箇所や原因の特定を迅速に行うことが可能となる。   Therefore, in the laminated substrate in which a plurality of substrates are laminated, the information recorded in the information recording unit of the first substrate can be quickly and surely read by an operator's visual observation or a reader using X-rays. When a defect or the like occurs in the multilayer substrate, it becomes possible to quickly identify the defect location and the cause based on the information.

また、情報記録部に、第１導電層に対して露光処理が行われる際の露光条件を記録することにより、積層基板に不具合が生じた際に前記情報記録部から前記露光条件を読み取って解析を行うことにより、前記露光条件の設定に起因した不具合を解明することができる。   Further, by recording the exposure conditions when the exposure process is performed on the first conductive layer in the information recording unit, when the malfunction occurs in the laminated substrate, the exposure conditions are read from the information recording unit and analyzed. By performing the above, it is possible to elucidate a problem caused by the setting of the exposure conditions.

さらに、情報記録部は、第１導電層に対する露光処理によって回路を形成する際に、情報を記録するとよい。これにより、第１導電層に対して露光処理を行う際に併せて情報記録部の情報の記録作業を行うことができるため、前記積層基板を製造する際の生産性を向上させることが可能となる。   Furthermore, the information recording unit may record information when forming a circuit by exposure processing on the first conductive layer. As a result, when the exposure process is performed on the first conductive layer, it is possible to perform the information recording operation of the information recording unit, and thus it is possible to improve the productivity when manufacturing the laminated substrate. Become.

さらにまた、積層された少なくとも２つのパターン形成層を備えた積層体であって、
前記少なくとも２つのパターン形成層は、所望のパターンが形成されたパターン形成部と、
前記パターンが形成される際の情報及び前記パターンに固有の情報の少なくともいずれか一方が記録された情報記録部と、
をそれぞれ備え、
下層となるパターン形成層の前記情報記録部と上層となるパターン形成層の前記情報記録部とが、前記パターン形成層の積層方向と略直交する方向に互いにオフセットして配置されることを特徴とする。 Furthermore, a laminate comprising at least two pattern forming layers laminated,
The at least two pattern formation layers include a pattern formation portion in which a desired pattern is formed;
An information recording unit in which at least one of information when the pattern is formed and information unique to the pattern is recorded;
Each with
The information recording portion of the lower pattern forming layer and the information recording portion of the upper pattern forming layer are arranged offset from each other in a direction substantially perpendicular to the stacking direction of the pattern forming layers. To do.

本発明によれば、積層された少なくとも２つのパターン形成層には、所望のパターンを有するパターン形成部と、前記パターンが形成される際の情報や前記パターンに固有の情報が記録された情報記録部が形成され、前記情報記録部は、上層側となるパターン形成層と下層側となるパターン形成層とで積層方向と略直交方向にオフセットするように配置されている。   According to the present invention, at least two pattern formation layers that are stacked are an information record in which a pattern formation portion having a desired pattern and information when the pattern is formed and information unique to the pattern are recorded. The information recording part is arranged so that the pattern forming layer on the upper layer side and the pattern forming layer on the lower layer side are offset in a direction substantially orthogonal to the stacking direction.

従って、複数のパターン形成層が積層された積層体において、情報記録部同士が重なり合うことがなく、例えば、下層となるパターン形成層の情報記録部に記録された情報を作業者による目視やＸ線を用いた読取装置によって迅速且つ確実に読み取ることができる。その結果、積層体を構成するパターン形成層に何らかの不具合が生じた場合にも、前記情報記録部から情報を読み取って解析を行うことにより、前記不具合を解明することができる。   Therefore, in the laminated body in which a plurality of pattern formation layers are laminated, the information recording portions do not overlap each other. For example, the information recorded in the information recording portion of the lower pattern formation layer is visually or X-rayed by an operator. It can be read quickly and reliably by a reading device using the. As a result, even when some trouble occurs in the pattern forming layer constituting the laminate, the trouble can be solved by reading information from the information recording unit and performing analysis.

またさらに、本発明は、複数の基板が積層される積層基板を製造する積層基板の製造方法において、
第１基板の第１絶縁層に設けられる第１導電層に対して露光処理を行うことにより回路を焼き付けると共に、前記露光処理が行われた際の情報及び前記回路に固有の情報の少なくともいずれか一方が記録された第１情報記録部を形成する工程と、
前記第１基板に対して透過性を有する第２絶縁層を備えた第２基板を積層する工程と、
前記第２絶縁層の表面に形成された第２導電層に対して露光処理により回路を焼き付け、前記第２導電層にエッチング処理を行うことにより前記回路以外の不要な部分を除去して、前記第１情報記録部と対向する開口部を形成する工程と、
を有することを特徴とする。 Furthermore, the present invention provides a method for manufacturing a laminated substrate for producing a laminated substrate in which a plurality of substrates are laminated.
The circuit is baked by performing an exposure process on the first conductive layer provided on the first insulating layer of the first substrate, and at least one of information when the exposure process is performed and information unique to the circuit Forming a first information recording portion on which one is recorded;
Laminating a second substrate having a second insulating layer that is transparent to the first substrate;
A circuit is baked by an exposure process on the second conductive layer formed on the surface of the second insulating layer, an unnecessary part other than the circuit is removed by performing an etching process on the second conductive layer, Forming an opening facing the first information recording unit;
It is characterized by having.

本発明によれば、第１導電層に対して回路を焼き付ける露光処理時に、露光処理が行われた際の情報及び前記回路に固有の情報の少なくともいずれか一方を記録した情報記録部を形成し、透過性を有する第２絶縁層を有する第２基板を前記第１導電層を有する第１基板に対して積層した後に、前記回路以外の不要な部位を除去すると共に、前記情報記録部と対向する第２基板の第２導電層を除去して開口部を形成している。   According to the present invention, at the time of the exposure process for printing a circuit on the first conductive layer, an information recording unit is formed that records at least one of information when the exposure process is performed and information unique to the circuit. After the second substrate having the second insulating layer having transparency is laminated on the first substrate having the first conductive layer, unnecessary portions other than the circuit are removed and the information recording unit is opposed to the second substrate. The opening is formed by removing the second conductive layer of the second substrate.

このように、積層基板の製造工程において、露光工程で第１基板に対して回路を形成する際の情報や前記回路に固有の情報を記録し、且つ、内層側となる別の導電層における情報記録部を読み取るための開口部をエッチング工程で外層側の第２基板に形成することができる。そのため、従来の積層基板の製造工程を利用して、前記情報記録部及び開口部を有し、内層側となる第１基板の情報を読み取り可能な積層基板を効率的に製造することができる。   As described above, in the manufacturing process of the laminated substrate, information on forming a circuit on the first substrate in the exposure process and information unique to the circuit are recorded, and information on another conductive layer on the inner layer side is recorded. An opening for reading the recording portion can be formed in the second substrate on the outer layer side by an etching process. Therefore, a conventional multilayer substrate manufacturing process can be used to efficiently manufacture a multilayer substrate having the information recording portion and the opening and capable of reading information on the first substrate on the inner layer side.

本発明によれば、以下の効果が得られる。   According to the present invention, the following effects can be obtained.

すなわち、積層基板における第１基板に、回路が形成される際の情報や前記回路に固有の情報が記録された情報記録部を設け、前記第１基板に対して透過性を有する絶縁層を備えた第２基板を積層した際に、前記第２基板に形成された開口部を介して該第２基板から第１基板における情報記録部の情報を読み取ることができる。そのため、複数の基板を有する積層基板においても、情報記録部に記録された情報を作業者による目視やＸ線を用いた読取装置によって確実に読み取ることができ、前記情報に基づいて積層基板の不具合箇所や原因の特定を迅速に行うことができる。   In other words, the first substrate in the multilayer substrate is provided with an information recording portion in which information when a circuit is formed or information unique to the circuit is recorded, and an insulating layer having transparency to the first substrate is provided. When the second substrate is stacked, the information in the information recording portion of the first substrate can be read from the second substrate through the opening formed in the second substrate. Therefore, even in a multilayer substrate having a plurality of substrates, the information recorded in the information recording unit can be reliably read by an operator's visual observation or by a reader using X-rays. The location and cause can be quickly identified.

本発明に係る積層基板の製造方法について前記製造方法によって形成される積層基板との関係において好適な実施の形態を挙げ、添付の図面を参照しながら以下詳細に説明する。   A preferred embodiment of the method for producing a laminated substrate according to the present invention will be described in detail below with reference to the accompanying drawings, with reference to preferred embodiments in relation to the laminated substrate formed by the production method.

図１〜図３において、参照符号１０は、本発明の実施の形態に係る積層基板を示す。なお、ここでは、３層からなる積層基板１０について説明する。   1 to 3, reference numeral 10 indicates a laminated substrate according to an embodiment of the present invention. Here, a laminated substrate 10 having three layers will be described.

この積層基板１０は、積層された複数の第１〜第３基板部１２、１４、１６からなり、前記第１〜第３基板部１２、１４、１６は、透明な樹脂製材料（例えば、エポキシ樹脂）からなるプレート状の絶縁部１８ａ〜１８ｃと、前記絶縁部１８ａ〜１８ｃの表面に張り付けられ、回路２２ａ〜２２ｃを形成し、金属製材料からなる導体箔２０ａ〜２０ｃ（図３参照）から構成されている。なお、積層基板１０では、第１基板部（第１基板）１２が最下層に設けられ、第３基板部（第２基板）１６が最上層となるように配設されている。   The laminated substrate 10 includes a plurality of laminated first to third substrate portions 12, 14, and 16. The first to third substrate portions 12, 14, and 16 are made of a transparent resin material (for example, epoxy). Resin) and plate-like insulating portions 18a to 18c, and pasted on the surfaces of the insulating portions 18a to 18c to form circuits 22a to 22c. It is configured. In the laminated substrate 10, the first substrate portion (first substrate) 12 is provided in the lowermost layer, and the third substrate portion (second substrate) 16 is provided in the uppermost layer.

第１〜第３基板部１２、１４、１６は、図４に示されるように、薄板材から略矩形状に形成され、前記第１〜第３基板部１２、１４、１６は略同一形状に形成されている。   As shown in FIG. 4, the first to third substrate portions 12, 14, and 16 are formed in a substantially rectangular shape from a thin plate material, and the first to third substrate portions 12, 14, and 16 have substantially the same shape. Is formed.

また、第１〜第３基板部１２、１４、１６の表面には、エッチング処理によって導体箔２０ａ〜２０ｃから所望のパターンとなる回路２２ａ〜２２ｃが形成されると共に、前記回路２２ａ〜２２ｃと隣接して前記第１〜第３基板部１２、１４、１６が露光処理された際の露光情報が記録された第１〜第３情報記録領域２４、２６、２８がそれぞれ設けられている。そして、前記第１〜第３基板部１２、１４、１６は、図示しない導電部材を介して互いに電気的に接続されている。   Further, circuits 22a to 22c having desired patterns are formed from the conductive foils 20a to 20c by etching treatment on the surfaces of the first to third substrate portions 12, 14, and 16, and adjacent to the circuits 22a to 22c. In addition, first to third information recording areas 24, 26, and 28 are provided in which exposure information when the first to third substrate portions 12, 14, and 16 are exposed is recorded. The first to third substrate portions 12, 14, and 16 are electrically connected to each other via a conductive member (not shown).

第１〜第３情報記録領域２４、２６、２８は、図２及び図３に示されるように、第１〜第３基板部１２、１４、１６を積層させた際に、前記第１〜第３情報記録領域２４、２６、２８が積層基板１０における鉛直方向に互いに重なり合わない位置に形成される。換言すれば、第１〜第３情報記録領域２４、２６、２８は、第１〜第３基板部１２、１４、１６の略水平面上に沿った位置がそれぞれ異なるように所定間隔離間してそれぞれ形成されている。   As shown in FIGS. 2 and 3, the first to third information recording areas 24, 26, and 28 are formed when the first to third substrate portions 12, 14, and 16 are stacked. The three information recording areas 24, 26, and 28 are formed at positions that do not overlap each other in the vertical direction on the laminated substrate 10. In other words, the first to third information recording areas 24, 26, and 28 are spaced apart from each other at predetermined intervals so that the positions along the substantially horizontal plane of the first to third substrate portions 12, 14, and 16 are different from each other. Is formed.

また、第１〜第３情報記録領域２４、２６、２８には、図５に示されるように、例えば、第１〜第３基板部１２、１４、１６の名称又は番号Ａ１〜Ａ３、露光工程における露光レーザ出力Ｂ１〜Ｂ３、アライメント誤差Ｃ１〜Ｃ３、焦点距離Ｄ１〜Ｄ３、雰囲気温度Ｅ１〜Ｅ３、露光日時Ｆ１〜Ｆ３が列記されるように記録されている。   Further, in the first to third information recording areas 24, 26, and 28, as shown in FIG. 5, for example, the names or numbers A1 to A3 of the first to third substrate parts 12, 14, and 16, exposure process, Exposure laser outputs B1 to B3, alignment errors C1 to C3, focal lengths D1 to D3, ambient temperatures E1 to E3, and exposure dates F1 to F3 are recorded.

詳細には、第１〜第３基板部１２、１４、１６の名称又は番号Ａ１〜Ａ３は、第１〜第３情報記録領域２４、２６、２８を読み取る場合に複数の第１〜第３基板部１２、１４、１６のうちのどの基板部の情報であるかを認識するために記録され、露光レーザ出力Ｂ１〜Ｂ３は、露光装置４０における露光ヘッド５４ａ〜５４ｊから第１〜第３基板部１２、１４、１６へと出力されるレーザ出力の値であり、アライメント誤差Ｃ１〜Ｃ３は、前記露光装置４０の露光ステージ４８（後述する）における第１〜第３基板部１２、１４、１６の位置ずれ誤差を示すものである。さらに、焦点距離Ｄ１〜Ｄ３は、前記露光ヘッド５４ａ〜５４ｊから第１〜第３基板部１２、１４、１６へとレーザ光を出力する際のピントを示し、雰囲気温度Ｅ１〜Ｅ３は露光処理が行われる際の第１〜第３基板部１２、１４、１６周辺の雰囲気温度を示している。なお、露光日時Ｆ１〜Ｆ３は、露光処理が行われた日時を示している。   Specifically, the names or numbers A1 to A3 of the first to third substrate portions 12, 14, and 16 are a plurality of first to third substrates when the first to third information recording areas 24, 26, and 28 are read. In order to recognize which substrate portion of the portions 12, 14, 16 is recorded, the exposure laser outputs B1 to B3 are sent from the exposure heads 54a to 54j in the exposure apparatus 40 to the first to third substrate portions. This is a value of the laser output to be output to 12, 14 and 16, and the alignment errors C1 to C3 are those of the first to third substrate parts 12, 14, and 16 in the exposure stage 48 (described later) of the exposure apparatus 40. It shows a misalignment error. Further, the focal lengths D1 to D3 indicate the focus when laser light is output from the exposure heads 54a to 54j to the first to third substrate portions 12, 14, and 16, and the ambient temperatures E1 to E3 are the exposure processing. The ambient temperature around the first to third substrate parts 12, 14, 16 when being performed is shown. The exposure dates and times F1 to F3 indicate the dates and times when the exposure process was performed.

なお、第１〜第３情報記録領域２４、２６、２８に記録される情報は、上述した内容に限定されるものではなく、例えば、第１〜第３基板部１２、１４、１６の製造番号（シリアルナンバー）を記録するようにしてもよい。   The information recorded in the first to third information recording areas 24, 26, and 28 is not limited to the above-described contents, and for example, the serial numbers of the first to third substrate parts 12, 14, and 16. (Serial number) may be recorded.

本発明の実施の形態に係る積層基板１０は、基本的には以上のように構成されるものであり、次にその製造方法について説明する。なお、ここでは、積層基板１０において最下層となる第１基板部１２から順次形成する場合について図６を参照しながら説明する。   The multilayer substrate 10 according to the embodiment of the present invention is basically configured as described above. Next, a manufacturing method thereof will be described. Here, the case where the laminated substrate 10 is sequentially formed from the first substrate portion 12 which is the lowest layer will be described with reference to FIG.

先ず、絶縁部（第１絶縁層）１８ａの表面に導体箔（第１導電層）２０ａが張り付けられた第１基板部１２に感光剤（フォトレジスト）を塗布し、前記第１基板部１２を露光装置４０にセットして露光処理を行う。   First, a photosensitive agent (photoresist) is applied to the first substrate portion 12 in which the conductive foil (first conductive layer) 20a is pasted on the surface of the insulating portion (first insulating layer) 18a, and the first substrate portion 12 is attached. An exposure process is performed by setting the exposure apparatus 40.

この露光処理を行う露光装置４０は、図７に示されるように、複数の脚部４２によって支持された定盤４４を備え、この定盤４４上には、２本のガイドレール４６を介して露光ステージ４８が矢印方向に往復移動可能に設置される。そして、露光ステージ４８に、感光剤が塗布された基板（第１基板部１２）が吸着保持される。   As shown in FIG. 7, the exposure apparatus 40 that performs this exposure process includes a surface plate 44 supported by a plurality of legs 42, and on the surface plate 44 via two guide rails 46. An exposure stage 48 is installed so as to be able to reciprocate in the direction of the arrow. The substrate (first substrate unit 12) coated with a photosensitive agent is sucked and held on the exposure stage 48.

定盤４４の中央部には、ガイドレール４６を跨ぐようにして門型のコラム５０が設置され、前記コラム５０の一方の側部には、露光ステージ４８に保持された基板の位置を検出するＣＣＤカメラ５２が固定され、他方の側部には、前記基板に対して画像を露光記録する複数の露光ヘッド５４ａ〜５４ｊが保持されたスキャナ５６が設けられている。前記ＣＣＤカメラ５２には、ロッドレンズ５８を介してストロボ６０が装着されている。   A gate-shaped column 50 is installed at the center of the surface plate 44 so as to straddle the guide rail 46, and the position of the substrate held on the exposure stage 48 is detected on one side of the column 50. A CCD camera 52 is fixed, and a scanner 56 holding a plurality of exposure heads 54a to 54j for exposing and recording images on the substrate is provided on the other side. A strobe 60 is attached to the CCD camera 52 via a rod lens 58.

そして、このような露光装置４０の露光ステージ４８に第１基板部１２が保持された後に、前記第１基板部１２を露光ステージ４８と共にスキャナ５６側へと移動させ、前記スキャナ５６に設けられた複数の露光ヘッド５４ａ〜５４ｊから出力されるレーザ光によって前記第１基板部１２に対して所望のパターンとなる回路２２ａ〜２２ｃを記録する露光処理が行われる。   Then, after the first substrate unit 12 is held on the exposure stage 48 of such an exposure apparatus 40, the first substrate unit 12 is moved to the scanner 56 side together with the exposure stage 48, and is provided in the scanner 56. An exposure process for recording circuits 22a to 22c having a desired pattern is performed on the first substrate unit 12 by laser beams output from the plurality of exposure heads 54a to 54j.

その際、ストロボ６０の発光に伴ってＣＣＤカメラ５２で第１基板部１２が撮像され、前記第１基板部１２のアライメント誤差Ｃ１を検出する。   At this time, the first substrate unit 12 is imaged by the CCD camera 52 as the strobe 60 emits light, and the alignment error C1 of the first substrate unit 12 is detected.

また、上述した露光処理が行われる際、前記回路２２ａに隣接するように第１情報記録領域（情報記録部）２４が形成され、前記第１情報記録領域２４では、この露光処理における様々な情報（例えば、第１基板部１２の名称Ａ１、露光処理時における露光レーザ出力Ｂ１、アライメント誤差Ｃ１、焦点距離Ｄ１、雰囲気温度Ｅ１、露光日時Ｆ１）が列記されるように順番に記録される。   Further, when the above-described exposure process is performed, a first information recording area (information recording unit) 24 is formed so as to be adjacent to the circuit 22a. In the first information recording area 24, various information in the exposure process is formed. (For example, the name A1 of the first substrate unit 12, the exposure laser output B1 during the exposure process, the alignment error C1, the focal length D1, the ambient temperature E1, and the exposure date and time F1) are recorded in order so as to be listed.

次に、露光処理が行われた第１基板部１２に対して現像処理が行われ、その後に、前記第１基板部１２に対して所望のパターンを有する回路２２ａを形成するためにエッチング処理が行われて前記回路２２ａ及び第１情報記録領域２４以外の不要となる導体箔２０ａが剥離される。これにより、第１基板部１２には、回路２２ａと第１情報記録領域２４のみが残存した状態となる。なお、この際に、第１情報記録領域２４の周囲を回路２２ａと所定間隔だけ離間するように導体箔２０ａを剥離しておくことにより、前記第１情報記録領域２４の位置を明確とすることができる。   Next, development processing is performed on the first substrate portion 12 that has been subjected to exposure processing, and then etching processing is performed to form a circuit 22a having a desired pattern on the first substrate portion 12. The unnecessary conductive foil 20a other than the circuit 22a and the first information recording area 24 is peeled off. As a result, only the circuit 22 a and the first information recording area 24 remain on the first substrate unit 12. At this time, the position of the first information recording area 24 is clarified by separating the conductive foil 20a so that the periphery of the first information recording area 24 is separated from the circuit 22a by a predetermined distance. Can do.

次いで、不要となった感光剤の除去を行うことにより絶縁部１８ａの表面に導体箔２０ａからなる回路２２ａを備えた第１基板部１２が形成される。   Next, the first substrate portion 12 including the circuit 22a made of the conductive foil 20a is formed on the surface of the insulating portion 18a by removing the unnecessary photosensitizer.

次に、第２基板部（第２基板）１４となる導体箔（第２導電層）２０ｂが表面に施された又は施されるべき絶縁部（第２絶縁層）１８ｂを第１基板部１２の上面に積層し、図示しない圧力プレス機によって第１基板部１２と第２基板部１４とを加熱した状態で熱圧着させることにより、前記第１及び第２基板部１２、１４が一体的に圧着される。この際、第１基板部１２と第２基板部１４との間には、第２基板部１４の絶縁部１８ｂが挟持されているため、前記第１基板部１２と第２基板部１４とが直接的に接触することがない。   Next, a conductive foil (second conductive layer) 20b to be a second substrate portion (second substrate) 14 is applied to the surface or an insulating portion (second insulating layer) 18b to be applied to the first substrate portion 12. The first and second substrate parts 12 and 14 are integrated with each other by thermocompression bonding with the first substrate part 12 and the second substrate part 14 heated by a pressure press (not shown). Crimped. At this time, since the insulating portion 18b of the second substrate portion 14 is sandwiched between the first substrate portion 12 and the second substrate portion 14, the first substrate portion 12 and the second substrate portion 14 are There is no direct contact.

そして、第２基板部１４に対して前記第１基板部１２と同様に感光剤の塗布、露光処理を行う。この際、第２基板部１４には、その表面に形成された回路２２ｂに隣接するように第２情報記録領域２６が形成される。換言すれば、この第２情報記録領域２６は、所望のパターンを有する回路２２ｂと予め重複しない位置に設けられる。   Then, similar to the first substrate unit 12, a photosensitive agent is applied and exposed to the second substrate unit 14. At this time, the second information recording area 26 is formed on the second substrate portion 14 so as to be adjacent to the circuit 22b formed on the surface thereof. In other words, the second information recording area 26 is provided at a position that does not overlap with the circuit 22b having a desired pattern in advance.

そして、前記第２情報記録領域２６には、この露光処理における様々な情報が記録される。   Various information in the exposure process is recorded in the second information recording area 26.

次に、現像処理が行われた後に、前記第２基板部１４に対してエッチング処理を行う。その際、第２基板部１４には、所望のパターンとなる回路２２ｂが形成されると共に、第１基板部１２の第１情報記録領域２４の上部側となる導体箔２０ｂがエッチング処理によって剥離され、前記第１情報記録領域２４の外形状より若干大きく開口した第１窓部（開口部）６２が形成される。すなわち、第２基板部１４における第１情報記録領域２４の上方にあたる位置には、予め回路２２ｂが形成されないようにそのパターンが形成されている。   Next, after the development processing is performed, the second substrate portion 14 is etched. At that time, a circuit 22b having a desired pattern is formed on the second substrate portion 14, and the conductive foil 20b on the upper side of the first information recording area 24 of the first substrate portion 12 is peeled off by an etching process. Thus, a first window (opening) 62 is formed that is slightly larger than the outer shape of the first information recording area 24. That is, the pattern is formed in advance at the position above the first information recording area 24 in the second substrate portion 14 so that the circuit 22b is not formed.

これにより、第２基板部１４と第１基板部１２との間に配設された絶縁部１８ｂが透明な樹脂製材料から形成されているため、前記第２基板部１４の表面に形成された第１窓部６２を介して第２基板部１４の上方から下層となる第１基板部１２の第１情報記録領域２４を読み取ることができる。   As a result, since the insulating portion 18b disposed between the second substrate portion 14 and the first substrate portion 12 is formed of a transparent resin material, the insulating portion 18b is formed on the surface of the second substrate portion 14. The first information recording area 24 of the first substrate portion 12 which is the lower layer can be read from above the second substrate portion 14 through the first window portion 62.

そして、第２基板部１４に塗布された感光剤を除去することにより、前記第２基板部１４が第１基板部１２に対して積層された状態で積層基板１０が形成される。なお、第２基板部１４の回路２２ｂは、図示しない導電部材を介して第１基板部１２の回路２２ａと電気的に接続されている。   Then, by removing the photosensitive agent applied to the second substrate part 14, the laminated substrate 10 is formed in a state where the second substrate part 14 is laminated on the first substrate part 12. The circuit 22b of the second substrate unit 14 is electrically connected to the circuit 22a of the first substrate unit 12 through a conductive member (not shown).

最後に、第３基板部１６となる導体箔２０ｃが表面に施された又は施されるべき絶縁部１８ｃを第２基板部１４の上部に積層し、図示しない圧力プレス機によって第３基板部１６が積層された第１及び第２基板部１２、１４に対して熱圧着させる。これにより、第１及び第２基板部１２、１４に対して第３基板部１６が一体的に圧着されて積層基板１０が形成される。   Finally, an insulating portion 18c having or to be provided with a conductive foil 20c to be the third substrate portion 16 is laminated on the upper portion of the second substrate portion 14, and the third substrate portion 16 is subjected to a pressure press machine (not shown). Is thermocompression-bonded to the first and second substrate portions 12 and 14 laminated. As a result, the third substrate portion 16 is integrally bonded to the first and second substrate portions 12 and 14 to form the laminated substrate 10.

そして、第３基板部１６に対して前記第１及び第２基板部１２、１４と同様に感光剤の塗布、露光処理、現像処理が順番に行われ、その後に、前記第３基板部１６に対してエッチング処理が行われる。この際、第３基板部１６には、露光処理において所望のパターンとなる回路２２ｃが形成されると共に、前記回路２２ｃに隣接して第３情報記録領域２８が形成される。   Then, similar to the first and second substrate portions 12 and 14, the third substrate portion 16 is sequentially subjected to the application of the photosensitive agent, the exposure processing, and the development processing. On the other hand, an etching process is performed. At this time, a circuit 22c having a desired pattern in the exposure process is formed on the third substrate unit 16, and a third information recording area 28 is formed adjacent to the circuit 22c.

次に、第１及び第２基板部１２、１４における第１及び第２情報記録領域２４、２６の上部側となる部位がエッチング処理によって剥離されて第２窓部（開口部）６４が形成される。前記第２窓部６４は、前記第１及び第２情報記録領域２４、２６の外形状より若干大きく開口して形成されている。なお、第１及び第２情報記録領域２４、２６の上部側となる部位に形成される第２窓部６４は単一の場合に限定されるものではなく、第１情報記録領域２４と第２情報記録領域２６に対応した一組の窓部をそれぞれ設けるようにしてもよい。   Next, the upper and lower portions of the first and second information recording regions 24 and 26 in the first and second substrate portions 12 and 14 are peeled off by an etching process to form a second window portion (opening) 64. The The second window portion 64 is formed to be opened slightly larger than the outer shape of the first and second information recording areas 24 and 26. The second window 64 formed in the upper portion of the first and second information recording areas 24 and 26 is not limited to a single case, and the first information recording area 24 and the second information recording area 24 and the second information recording area 24 and the second information recording area 24 and 26 are not limited to a single case. A set of windows corresponding to the information recording area 26 may be provided.

すなわち、第３基板部１６における第１及び第２情報記録領域２４、２６の上方にあたる位置には、予め回路２２ｃが形成されないようにそのパターンが形成されている。   That is, the pattern is formed in advance so that the circuit 22c is not formed at a position above the first and second information recording areas 24 and 26 in the third substrate portion 16.

そして、第３基板部１６に塗布された感光剤を除去することにより、前記第３基板部１６が第１及び第２基板部１２、１４に対して積層された積層基板１０が形成される。なお、この第３基板部１６の回路２２ｃは、図示しない導電部材を介して第１及び第２基板部１２、１４の回路２２ａ、２２ｂと電気的に接続されている。   Then, by removing the photosensitive agent applied to the third substrate unit 16, the laminated substrate 10 in which the third substrate unit 16 is laminated on the first and second substrate units 12 and 14 is formed. The circuit 22c of the third substrate unit 16 is electrically connected to the circuits 22a and 22b of the first and second substrate units 12 and 14 via a conductive member (not shown).

このように第１〜第３基板部１２、１４、１６が互いに絶縁部１８ｂ、１８ｃを挟んだ状態で略平行に積層され、一体的に積層された第１〜第３基板部１２、１４、１６を含む積層基板１０が形成される。   As described above, the first to third substrate portions 12, 14, and 16 are stacked substantially in parallel with each other with the insulating portions 18b and 18c interposed therebetween, and the first to third substrate portions 12, 14, A laminated substrate 10 including 16 is formed.

また、上述した積層基板１０の製造方法では、第１基板部１２を形成した後に、該第１基板部１２の上部に第２基板部１４を積層した状態で回路２２ｂを形成し、その後に、積層された第１及び第２基板部１２、１４に対して第３基板部１６を積層して回路２２ｃを形成するようにしているが、第１〜第３基板部１２、１４、１６に対してそれぞれ回路２２ａ〜２２ｃをそれぞれ別個に形成した後に、前記第１〜第３基板部１２、１４、１６を積層させて熱圧着によって積層基板１０としてもよい。   Moreover, in the manufacturing method of the laminated substrate 10 described above, after forming the first substrate portion 12, the circuit 22b is formed in a state where the second substrate portion 14 is laminated on the upper portion of the first substrate portion 12, and then, The third substrate unit 16 is stacked on the stacked first and second substrate units 12 and 14 to form the circuit 22c, but the first to third substrate units 12, 14, and 16 are formed. After forming the circuits 22a to 22c separately, the first to third substrate parts 12, 14, and 16 may be laminated and the laminated substrate 10 may be formed by thermocompression bonding.

なお、この積層基板１０は、例えば、プリント配線基板（ＰＷＢ：Ｐｒｉｎｔｅｄ Ｗｉｒｉｎｇ Ｂｏａｒｄ）、液晶表示装置（ＬＣＤ）の製造用のカラーフィルタ、ＴＦＴ、プラズマ・ディスプレイ・パネル（ＰＤＰ）等に好適に用いることができる。   The multilayer substrate 10 is preferably used for, for example, a printed wiring board (PWB), a color filter for manufacturing a liquid crystal display (LCD), a TFT, a plasma display panel (PDP), and the like. Can do.

以上のように、本実施の形態では、第１〜第３基板部１２、１４、１６を順次積層させて積層基板１０を形成する際に、前記第１〜第３基板部１２、１４、１６に設けられ、各基板部における露光情報が記録された第１〜第３情報記録領域２４、２６、２８を略水平方向に互いにオフセットするように形成している。換言すれば、第１〜第３情報記録領域２４、２６、２８は略鉛直方向に重なり合うことがないように形成している。   As described above, in the present embodiment, when the laminated substrate 10 is formed by sequentially laminating the first to third substrate portions 12, 14, and 16, the first to third substrate portions 12, 14, and 16 are formed. The first to third information recording areas 24, 26, and 28 in which exposure information in each substrate portion is recorded are formed so as to be offset from each other in a substantially horizontal direction. In other words, the first to third information recording areas 24, 26, and 28 are formed so as not to overlap in a substantially vertical direction.

また、第２基板部１４には、最下層となる第１基板部１２の第１情報記録領域２４の上方となるように第１窓部６２が形成され、第３基板部１６には、第１及び第２基板部１２、１４の第１及び第２情報記録領域２４、２６の上方となる位置に第２窓部６４が形成されている。   The second substrate unit 14 is formed with a first window 62 so as to be above the first information recording area 24 of the first substrate unit 12 which is the lowest layer. A second window portion 64 is formed at a position above the first and second information recording areas 24 and 26 of the first and second substrate portions 12 and 14.

これにより、積層基板１０において最上層となる第３基板部１６の上方から第１及び第２窓部６２、６４、第１〜第３基板部１２、１４、１６の間に挟持された透明体からなる絶縁部１８ｂ、１８ｃを介して第１及び第２情報記録領域２４、２６に記録された情報を確実に読み取ることができる。また、第３情報記録領域２８は、最上層に設けられた第３基板部１６に設けられているため上方から直接読み取ることができる。   Accordingly, the transparent body sandwiched between the first and second window portions 62 and 64 and the first to third substrate portions 12, 14, and 16 from above the third substrate portion 16 that is the uppermost layer in the multilayer substrate 10. The information recorded in the first and second information recording areas 24 and 26 can be reliably read through the insulating portions 18b and 18c. Further, since the third information recording area 28 is provided on the third substrate portion 16 provided in the uppermost layer, it can be read directly from above.

以上のように、前記第１〜第３情報記録領域２４、２６、２８に記録された第１〜第３基板部１２、１４、１６の露光情報を作業者による目視やＸ線を用いた読取装置によって読み取ることができるため、積層基板１０において、万が一、不具合等が生じた場合に前記情報に基づいて解析を行い、前記第１〜第３基板部１２、１４、１６における不具合箇所や原因の特定を迅速且つ確実に行うことが可能となる。   As described above, the exposure information of the first to third substrate portions 12, 14, and 16 recorded in the first to third information recording areas 24, 26, and 28 is read by an operator using visual observation or X-rays. Since it can be read by the apparatus, in the unlikely event that a defect or the like occurs in the laminated substrate 10, an analysis is performed based on the information, and the location and cause of the defect in the first to third substrate parts 12, 14, and 16 are analyzed. Identification can be performed quickly and reliably.

また、何らかの理由により露光不良が生じた第１〜第３基板部１２、１４、１６に対し、前記露光情報に基づいてその後の処理を行わないようにすることも可能である。特に、長尺状の基板に対して順次処理を行うような場合に有効である。   It is also possible not to perform subsequent processing based on the exposure information for the first to third substrate parts 12, 14, and 16 in which the exposure failure has occurred for some reason. This is particularly effective when processing is performed sequentially on a long substrate.

なお、上述した実施の形態では、第１〜第３基板部１２、１４、１６の３層からなる積層基板１０について説明したが、少なくとも２枚以上の基板部が積層された構成であれば特に基板部の数量には限定されるものではない。   In the above-described embodiment, the laminated substrate 10 including the first to third substrate portions 12, 14, and 16 has been described. However, as long as at least two or more substrate portions are laminated, it is particularly preferable. The number of substrate parts is not limited.

一方、第１〜第３基板部１２、１４、１６の第１〜第３情報記録領域２４、２６、２８に製造番号をそれぞれ記録し、前記製造番号を通じて図示しない管理サーバに送信することにより積層基板１０を一元的に管理するようにしてもよい。   On the other hand, the production numbers are recorded in the first to third information recording areas 24, 26, and 28 of the first to third substrate sections 12, 14, and 16, respectively, and are stacked by transmitting to the management server (not shown) through the production numbers. You may make it manage the board | substrate 10 centrally.

詳細には、単一の積層基板１０における各製造工程（露光、現像、エッチング、積層プレス）における様々な情報を前記管理サーバに送信することにより、製造番号に基づいた積層基板１０の工程及び第１〜第３基板部１２、１４、１６の露光情報を一括管理することができる。また、第１〜第３基板部１２、１４、１６において何らかの不具合が生じた場合に、前記管理サーバに問い合わせ及び／又は確認することにより、前記第１〜第３基板部１２、１４、１６のいずれの基板部に不具合が生じているかを迅速且つ確実に把握することができる。   Specifically, by transmitting various information in each manufacturing process (exposure, development, etching, laminating press) in the single laminated substrate 10 to the management server, the process of the laminated substrate 10 based on the production number and the first The exposure information of the first to third substrate portions 12, 14, and 16 can be collectively managed. In addition, when any trouble occurs in the first to third substrate parts 12, 14, and 16, the inquiry of the management server and / or confirmation is performed, whereby the first to third substrate parts 12, 14, and 16 are It is possible to quickly and reliably grasp which substrate portion has a defect.

そして、上述した不具合が生じている箇所に応じて装置（例えば、露光装置４０）側の調整、補修を行うことが可能となり、前記不具合の再発を防止することができる。   And it becomes possible to perform adjustment and repair on the apparatus (for example, exposure apparatus 40) side according to the location where the above-mentioned malfunction occurs, and the recurrence of the malfunction can be prevented.

なお、積層基板１０では、下層となる第１及び第２基板部１２、１４における第１及び第２情報記録領域２４、２６を読み取るために導体箔２０ｂ、２０ｃを剥離して第１及び第２窓部６２、６４を形成する場合に限定されるものではなく、予め第１及び第２情報記録領域２４、２６の上部側を導体箔２０ｂ、２０ｃで覆うことないように第２及び第３基板部１４、１６の回路パターンを形成するようにしてもよい。この場合にも、第２及び第３基板部１４、１６の下部に設けられた透明な絶縁部１８ｂ、１８ｃを通じて第１及び第２情報記録領域２４、２６を確実に読み取ることが可能となる。   In the multilayer substrate 10, the first and second conductive foils 20 b and 20 c are peeled off in order to read the first and second information recording regions 24 and 26 in the first and second substrate portions 12 and 14 which are lower layers. The second and third substrates are not limited to the case where the window portions 62 and 64 are formed, and the upper portions of the first and second information recording regions 24 and 26 are not covered with the conductor foils 20b and 20c in advance. The circuit patterns of the portions 14 and 16 may be formed. Also in this case, the first and second information recording regions 24 and 26 can be reliably read through the transparent insulating portions 18b and 18c provided under the second and third substrate portions 14 and 16.

さらに、積層基板１０における第１〜第３基板部１２、１４、１６の露光情報の記録手段としては、導体箔２０ａ〜２０ｃより形成された第１〜第３情報記録領域２４、２６、２８に限定されるものではなく、例えば、前記第１〜第３基板部１２、１４、１６における露光情報をそれぞれバーコードに変換し、前記バーコードを第１〜第３基板部１２、１４、１６に対して貼着するようにしてもよい。この場合にも、第１及び第２基板部１２、１４に貼着されたバーコードを第１及び第２窓部６２、６４を通じて第３基板部１６の上方より確実に読み取ることができる。   Further, as means for recording exposure information of the first to third substrate portions 12, 14, and 16 in the laminated substrate 10, the first to third information recording regions 24, 26, and 28 formed of the conductive foils 20a to 20c are used. For example, the exposure information in the first to third substrate portions 12, 14, and 16 is converted into a barcode, and the barcode is converted into the first to third substrate portions 12, 14, and 16, for example. You may make it stick on it. Also in this case, the barcode attached to the first and second substrate portions 12 and 14 can be reliably read from above the third substrate portion 16 through the first and second window portions 62 and 64.

本発明の実施の形態に係る積層基板の外観斜視図である。1 is an external perspective view of a multilayer substrate according to an embodiment of the present invention. 図１の積層基板を上方から見た平面図である。It is the top view which looked at the laminated substrate of FIG. 1 from upper direction. 図１の積層基板の縦断面図である。It is a longitudinal cross-sectional view of the laminated substrate of FIG. 図１の積層基板において積層された第１〜第３基板部を分解した状態を示す分解斜視図である。FIG. 3 is an exploded perspective view illustrating a state in which first to third substrate portions stacked in the stacked substrate of FIG. 1 are disassembled. 図１の積層基板における第１〜第３基板部に設けられた第１〜第３情報記録領域の拡大平面図である。It is an enlarged plan view of the 1st-3rd information recording area | region provided in the 1st-3rd board | substrate part in the laminated substrate of FIG. 図１の積層基板を製造する際の概略製造フロー図である。FIG. 2 is a schematic manufacturing flowchart for manufacturing the laminated substrate of FIG. 1. 図１の積層基板において露光作業を行うための露光装置の外観斜視図である。FIG. 2 is an external perspective view of an exposure apparatus for performing an exposure operation on the multilayer substrate of FIG. 1.

符号の説明Explanation of symbols

１０…積層基板 １２…第１基板部
１４…第２基板部 １６…第３基板部
１８ａ〜１８ｃ…絶縁部 ２０ａ〜２０ｃ…導体箔
２２ａ〜２２ｃ…回路 ２４…第１情報記録領域
２６…第２情報記録領域 ２８…第３情報記録領域
４０…露光装置 ４８…露光ステージ
５４ａ〜５４ｊ…露光ヘッド ６２…第１窓部
６４…第２窓部 DESCRIPTION OF SYMBOLS 10 ... Laminated substrate 12 ... 1st board | substrate part 14 ... 2nd board | substrate part 16 ... 3rd board | substrate part 18a-18c ... Insulation part 20a-20c ... Conductive foil 22a-22c ... Circuit 24 ... 1st information recording area 26 ... 2nd Information recording area 28 ... Third information recording area 40 ... Exposure apparatus 48 ... Exposure stages 54a to 54j ... Exposure head 62 ... First window 64 ... Second window

Claims (5)

複数の基板が積層された積層基板において、
少なくとも第１絶縁層を有する第１基板と、透過性を有する第２絶縁層を備えた第２基板とを有し、
前記第１基板には、前記第１絶縁層に設けられて回路が形成される第１導電層と、前記第１絶縁層の表面に設けられ、前記回路が形成される際の情報及び前記回路に固有の情報の少なくともいずれか一方が記録された情報記録部とを備え、
前記第２基板には、前記情報記録部と対向する開口部が設けられ、
前記第１基板に対して前記第２基板が積層された際に、前記情報記録部の情報が、前記第２基板の開口部を介して読み取り可能であることを特徴とする積層基板。 In a laminated substrate in which a plurality of substrates are laminated,
A first substrate having at least a first insulating layer, and a second substrate having a second insulating layer having transparency;
The first substrate includes a first conductive layer provided on the first insulating layer to form a circuit, information provided when the circuit is formed on the surface of the first insulating layer, and the circuit. An information recording unit in which at least one of the information unique to
The second substrate is provided with an opening facing the information recording unit,
When the second substrate is laminated on the first substrate, the information in the information recording unit can be read through the opening of the second substrate. 請求項１記載の積層基板において、
前記情報記録部には、前記第１導電層に対して露光処理を行う際の露光条件が記録されることを特徴とする積層基板。 The laminated substrate according to claim 1,
The multilayer substrate according to claim 1, wherein an exposure condition for performing an exposure process on the first conductive layer is recorded in the information recording unit. 請求項１又は２記載の積層基板において、
前記情報記録部には、前記第１導電層に対する露光処理によって前記回路が形成される際に、前記情報が記録されることを特徴とする積層基板。 In the laminated substrate according to claim 1 or 2,
The information recording section records the information when the circuit is formed by an exposure process on the first conductive layer. 積層された少なくとも２つのパターン形成層を備えた積層体であって、
前記少なくとも２つのパターン形成層は、所望のパターンが形成されたパターン形成部と、
前記パターンが形成される際の情報及び前記パターンに固有の情報の少なくともいずれか一方が記録された情報記録部と、
をそれぞれ備え、
下層となるパターン形成層の前記情報記録部と上層となるパターン形成層の前記情報記録部とが、前記パターン形成層の積層方向と略直交する方向に互いにオフセットして配置されることを特徴とする積層体。 A laminate comprising at least two pattern forming layers laminated,
The at least two pattern formation layers include a pattern formation portion in which a desired pattern is formed;
An information recording unit in which at least one of information when the pattern is formed and information unique to the pattern is recorded;
Each with
The information recording portion of the lower pattern forming layer and the information recording portion of the upper pattern forming layer are arranged offset from each other in a direction substantially perpendicular to the stacking direction of the pattern forming layers. Laminated body. 複数の基板が積層される積層基板を製造する積層基板の製造方法において、
第１基板の第１絶縁層に設けられる第１導電層に対して露光処理を行うことにより回路を焼き付けると共に、前記露光処理が行われた際の情報及び前記回路に固有の情報の少なくともいずれか一方が記録された情報記録部を形成する工程と、
前記第１基板に対して透過性を有する第２絶縁層を備えた第２基板を積層する工程と、
前記第２絶縁層の表面に形成された第２導電層に対して露光処理により回路を焼き付け、前記第２導電層にエッチング処理を行うことにより前記回路以外の不要な部分を除去して、前記情報記録部と対向する開口部を形成する工程と、
を有することを特徴とする積層基板の製造方法。 In the manufacturing method of a laminated substrate for producing a laminated substrate in which a plurality of substrates are laminated,
The circuit is baked by performing an exposure process on the first conductive layer provided on the first insulating layer of the first substrate, and at least one of information when the exposure process is performed and information unique to the circuit Forming an information recording portion on which one is recorded;
Laminating a second substrate having a second insulating layer that is transparent to the first substrate;
A circuit is baked by an exposure process on the second conductive layer formed on the surface of the second insulating layer, an unnecessary part other than the circuit is removed by performing an etching process on the second conductive layer, Forming an opening facing the information recording unit;
A method for producing a laminated substrate, comprising:
JP2005059399A 2005-03-03 2005-03-03 Laminated substrate, laminated body, and manufacturing method thereof Pending JP2006245325A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014143395A (en) * 2012-12-26 2014-08-07 Canon Inc Flexible printed circuit board and electronic apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014143395A (en) * 2012-12-26 2014-08-07 Canon Inc Flexible printed circuit board and electronic apparatus

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