JP2007115855A - Assembly panel of printed wiring board, unit sheet for mounting of printed wiring board, rigid-flexible board, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of the assembly panel of a printed wiring board of high material yield and high percentage for fair quality in a simple process. <P>SOLUTION: A pre-fabricated unit printed wiring board is arranged in a frame for specified positional relationship, and the printed wiring boards are fixed to each other while the printed wiring boards and the frame are fixed together. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an assembly panel of a printed wiring board, a unit sheet for mounting the printed wiring board, a rigid-flexible board, and a manufacturing method thereof, in particular, a rigid-flexible board in which the rigid board and the flexible board are connected, The present invention relates to an assembly panel of a printed wiring board, a unit sheet for mounting, and a manufacturing method thereof, which can be produced efficiently with little material loss.

  For example, in the case where a rigid substrate is disposed across a bent portion in a housing of an electrical device, the rigid substrate is divided into a plurality of pieces, and the divided rigid substrates are integrally connected with a flexible substrate. Rigid-flexible substrates are used.

  Such a rigid-flexible substrate is manufactured, for example, as a multi-circuit printed wiring board by the following method.

  (1) A multi-piece flexible substrate is formed in which a wiring pattern corresponding to a plurality of unit flexible substrates and a wiring pattern as an inner layer plate of a plurality of unit rigid substrates in the same layer are formed.

  (2) One surface laminated on the upper surface or the lower surface of the composite flexible substrate is a copper layer to form a multi-piece rigid substrate in which a portion corresponding to the unit flexible substrate is punched.

  (3) The rigid substrate of (2) is laminated on one side of the flexible substrate of (1) with a release film and a cover disposed on the punched portion, and integrated by heating and pressing.

  (4) The rigid substrate of (2) is laminated on the other surface of the flexible substrate of (1) with a release film and a cover arranged in order on the punched portion, and integrated by heating and pressurizing. And

  (5) The release film and the cover are removed and separated into unit sheets for use in the mounting process.

  (6) After the mounting process is finished, the individual rigid-flexible substrates are separated from the unit sheet.

  In the present specification, the “unit substrate” is a substrate that is a minimum unit at the time of manufacture, and the “composite substrate” constitutes one substrate by integrating different types of unit substrates. The “mounting unit sheet” is a board on which a plurality of unit boards or a plurality of composite boards are assembled as a unit for mounting, and the “assembly panel” is the final In the case of a single substrate, multiple substrates used as a single substrate, or multiple unit sheets are assembled, and after the manufacturing process, individual unit substrates, composite It is a board | substrate isolate | separated into a board | substrate or the unit sheet for mounting. Further, in this specification, “horizontal wiring portion” indicates intra-layer wiring in a wiring board, and “vertical wiring portion” indicates an interlayer connection portion for connecting different wiring layers in a single substrate or a composite substrate. The “connection terminal” indicates a terminal provided for electrically connecting the substrates. Examples of connection terminals include conductor bumps and pads provided for substrate connection, a part of the horizontal wiring portion, and the like.

  However, in such a conventional method for manufacturing a printed wiring board assembly panel, one flexible substrate of the same size is required to produce one assembly panel. Due to its high price, it was a major cause of high production costs.

  In addition, in the conventional printed wiring board manufacturing method, many parts are discarded by punching, and a handling frame part is required for each printed wiring board of a large number of pieces. Eventually, the material was cut off and discarded, so there was a problem that the utilization efficiency of the material was low.

  In addition, since the conventional assembly panel has many printed wiring boards in the final form as products in a large board, if a defect occurs in one of the unit boards in the middle of the process, multiple printed wiring boards are taken. There is a problem that the entire substrate may become unusable and the product yield is low.

  As described above, the conventional rigid-flexible board assembly panel requires a whole flexible board of the same size to manufacture one sheet, which increases the production cost. .

  In addition, in the conventional method for manufacturing a printed wiring board assembly panel, a lot of parts are discarded by punching, and a handling frame part is required for each printed wiring board of a large number. Since the frame portion is eventually cut off and discarded, there is a problem that the utilization efficiency of the material is low.

  Furthermore, the conventional printed wiring board assembly panel has many final printed wiring boards that are products in a large board, so if one of the unit boards fails during the process, The entire panel may become unusable and the product yield is low.

  The present invention has been made to solve the above-described problems, and an assembly panel for a printed wiring board according to the present invention includes a frame and a plurality of unit substrates arranged at predetermined positions in the frame. Each unit substrate is provided with a plurality of protrusions on the periphery, and is bonded to the adjacent unit substrate and / or the frame body and the protrusions, so that the frame body and the respective substrates are integrally fixed. It is characterized by being.

  In the printed wiring board assembly panel of the present invention, it is desirable that each unit board is arranged in the frame body and fixed integrally with the frame body so that the mounting surface is the same plane. As a result, it is possible to improve the accuracy of the printing of the solder paste for mounting and the automatic mounting and improve the working efficiency of the mounting.

  The printed wiring board assembly panel of the present invention is not limited to the same type of printed wiring board, but can be applied to a composite board such as a rigid-flexible board.

  That is, the printed wiring board assembly panel includes a frame, and a plurality of rigid boards and a plurality of flexible boards arranged at predetermined positions in the frame, and each of the composite boards includes: A plurality of protrusions are provided on the periphery of the rigid substrate, and are bonded to the adjacent composite substrate and / or the frame body and the protrusion portion, so that the frame body and each composite substrate are fixed integrally. It is characterized by.

  This composite substrate has, for example, a structure in which a connection terminal of a rigid substrate and a connection terminal of a flexible substrate are directly connected.

  In addition, it is desirable that each composite substrate is also disposed in the frame so that the mounting surface is the same plane. As a result, it is possible to improve the accuracy of the printing of the solder paste for mounting and the automatic mounting and improve the working efficiency of the mounting.

  Further, the composite substrate may have a structure in which a plurality of rigid substrates arranged in a row are connected by a series of flexible substrates.

  Furthermore, the unit sheet for mounting the printed wiring board of the present invention includes a frame and a plurality of unit boards arranged at predetermined positions in the frame, and the unit board has a plurality of protrusions on the periphery. And the unit substrate and / or the frame body and the protrusion are bonded to each other so that the frame body and each unit substrate are integrally fixed.

  In this mounting unit sheet, the interval (length) between a pair of opposing sides is set to a length that matches the specifications of the mounting machine.

  It is desirable that the mounting unit sheet is also disposed in the frame so that the mounting surface is the same plane. As a result, it is possible to improve the accuracy of the printing of the solder paste for mounting and the automatic mounting and improve the working efficiency of the mounting.

  Further, the mounting unit sheet also includes a frame, and a composite substrate including at least one rigid substrate and at least one flexible substrate arranged at a predetermined relationship position in the frame, and each of the composite substrates includes: A plurality of protrusions are provided on the periphery of the rigid board, and are bonded to at least the frame body so that the frame body and the rigid board are integrally fixed. It is desirable that the connection terminals of the substrate be directly connected.

  As for the unit sheet for mounting the composite substrate, it is preferable that each composite substrate is disposed in the frame so that the mounting surface is the same plane.

  Moreover, the rigid board | substrate in a composite board | substrate can be made into the structure where two or more were connected by a series of flexible substrates.

  The mounting unit sheet of the printed wiring board of the present invention uses a grid-like frame body in which a plurality of mounting unit sheet frames are connected in a planar manner, and a plurality of mounting unit sheets are assembled. After the assembly panel is manufactured, it is manufactured by separating it into unit sheets.

  The frame used in the present invention functions as a template for arranging the unit substrates to be described later, and also holds the unit substrate in a planar or spatial relationship at a constant position, and is common to the subsequent unit substrates. It enables simultaneous processing and simultaneous mounting on a unit substrate as a unit sheet. Further, it functions as a printing base material for printing a gripping part for handling, a product number, and the like, and further, as a positioning member at the time of mounting by drilling a guide hole.

  The frame used in the present invention is usually a rectangular frame type frame having a size that allows the pre-mounting process to be performed at the same time. However, when the size of the unit sheet that can be mounted on the mounting apparatus is smaller than this, a lattice-like form in which the frame bodies of a plurality of unit sheets are connected may be used. In addition, when the unit substrate is a non-rectangular shape, for example, a parallelogram, a shape in which a long square is meandered, a circle, an ellipse, or the like, a frame shape in which these unit substrates are fitted may be used. . When the printing process is included in the subsequent processing steps, the thickness of the frame body is desirably equal to or thinner than the thickness of the unit substrate disposed in the frame body. The frame does not necessarily need to be made of the same material as the unit substrate, and may be made of a highly durable material so that it can be used repeatedly. In each case, it is cheaper than the unit substrate. A simple substrate may be used.

  As the unit substrate arranged in the frame of the frame, for example, a rigid substrate or a flexible substrate is used. Rigid substrates include, for example, substrates such as glass fabrics, aramid fiber nonwoven fabrics, paper, and other substrates that are laminated with prepregs impregnated with uncured epoxy resin, polyimide resin, phenolic resin, etc. Examples of the flexible printed circuit board include a double-sided flexible board using a liquid crystal polymer or a polyimide resin as an interlayer insulating layer and a single-layer flexible board using a polyimide film as an insulating layer.

  The unit substrate is fixed to the frame, for example, as follows.

  That is, while forming a projection around the unit substrate, the frame body has a recess that fits with the projection, positioned on the base of the mounting machine, and temporarily fixed using, for example, a weak adhesive, Each unit substrate is sequentially arranged at a predetermined spatial position in the frame by the mounting machine. If necessary, the unit substrate, the frame, and the unit substrates are partially temporarily fixed with an instantaneous adhesive or an ultraviolet curable adhesive, and then fixed together by, for example, heating and pressing.

  In the printed wiring board assembly panel manufactured in this way, each unit board is related to the frame and the relative position, so that the subsequent mounting process can be performed simultaneously on all the unit boards.

  The unit substrate constituting the composite substrate can be fixed to the frame, for example, as follows.

  (1) A plurality of unit rigid boards and unit flexible boards each having a connection terminal at a corresponding position are prepared, and the unit rigid board with the connection terminal facing up is arranged at a predetermined relation position in the frame. At the same time, the unit rigid board is temporarily fixed between adjacent unit rigid boards, and the unit flexible board with the connection terminal facing down is placed across the unit rigid board temporarily fixed in the frame pair. Connect to each connection terminal.

  (2) A plurality of unit rigid boards each having a connection terminal at a corresponding position and a flexible board covering the entire length of the frame are prepared, and a unit rigid board with the connection terminals facing upwards at predetermined intervals in the frame is predetermined. The flexible substrate is placed along the entire unit rigid substrate, the corresponding connection terminals are connected, and the rigid substrates are fixed by the flexible substrate.

  (3) Prepare a rigid board and a plurality of unit flexible boards over the entire length of the frame having connection terminals at corresponding positions, and fix the rigid board with the connection terminals up to the frame. In addition, the unit flexible boards with the connection terminals on the lower side are arranged at predetermined positions, the corresponding connection terminals are connected to each other, and the flexible boards are fixed with a rigid board.

  (4) Prepare a rigid board that covers the entire length of the frame that has connection terminals at corresponding positions, and a flexible board that covers the entire length of the frame, and place the corresponding connection terminals so that they face each other. Then, both are integrated and each connection terminal is connected.

  In the above (1) to (4), the vertical relationship between the rigid substrate and the flexible substrate may be reversed. In other words, the flexible substrate may be on the top or the rigid substrate may be on the top.

  In the rigid-flexible substrate according to the present invention, the rigid substrate and the flexible substrate are laminated and integrated through an insulating layer, and the horizontal wiring portions of both substrates are electrically connected by the vertical wiring portion penetrating the insulating layer. A rigid-flexible substrate, wherein the vertical wiring portion is formed in a horizontal wiring portion of the flexible substrate, and the tip of the vertical wiring portion abuts against the horizontal wiring portion of the rigid substrate through the insulating layer. The conductive bump is plastically deformed, and the flexible substrate is exposed to the outermost layer. Since the conductor bump is formed on the flexible substrate side and its tip is brought into contact with the rigid substrate side to be plastically deformed, the bottom surface side of the conductor bump is always the flexible substrate side. If the conductor bumps before plastic deformation are made into a substantially conical shape, the conductor bumps after contact and plastic deformation have a substantially truncated cone shape with a large diameter on the flexible substrate side and a small diameter on the rigid substrate side. Thereby, the effect that the connection reliability of a rigid board | substrate and a flexible substrate becomes high is acquired.

  In the rigid-flexible substrate according to the present invention, the vertical wiring portion may be irradiated with a laser beam from the outside of the flexible substrate to penetrate the insulating layer together with the flexible substrate so that the horizontal wiring portion of the rigid substrate is exposed. A laser skip via made of a conductor layer formed along an opening provided in the substrate may be used.

  In the rigid-flexible substrate according to the present invention, the vertical wiring portion is filled with a conductor in a through hole provided in the insulating layer corresponding to a connection terminal of the rigid wiring substrate and a horizontal wiring portion of the flexible substrate, The conductor may be electrically connected to the connection terminal by heating and pressing.

  In the method for manufacturing a rigid-flexible substrate according to the present invention, the rigid substrate and the flexible substrate are laminated and integrated via an insulating layer, and the horizontal wiring portions of both substrates are electrically connected by the vertical wiring portion penetrating the insulating layer. Connected rigid-flexible substrate manufacturing method, wherein a horizontal wiring portion is provided on at least one outer layer surface, and a conductor bump serving as a vertical wiring portion is formed at a predetermined position of the horizontal wiring portion A substrate was prepared, and an uncured heat-fusible resin sheet was stacked on the conductive bump forming surface of the rigid substrate and heated and pressurized, and the tip of the conductor bump was exposed from the uncured heat-fusible resin sheet. A rigid substrate was created, and a horizontal wiring portion and a connection terminal corresponding to the vertical wiring portion of the rigid substrate connected to the horizontal wiring portion were formed on at least one outer layer surface A step of preparing a flexible substrate, and laminating the rigid substrate and the flexible substrate with the conductor bumps and the connection terminals facing each other, and applying heat and pressure so that the tips of the conductive bumps that penetrated and exposed are on the other substrate And a step of abutting and plastically deforming the connection terminal to electrically connect and mechanically integrate the connection terminal.

  In the method for manufacturing a rigid-flexible substrate according to the present invention, the conductor bumps serving as the vertical wiring portions may be provided on the flexible substrate side or on the rigid substrate side.

  In the method for manufacturing a rigid-flexible substrate according to the present invention, the vertical wiring portion may be provided by a laser via hole, a laser skip via, or the like.

  According to the assembly board of the printed wiring board, the unit sheet for mounting the printed wiring board, the rigid-flexible board and the manufacturing method thereof according to the present invention, since the unit board manufactured in advance is used, it is acceptable at the stage of the unit board. Can be determined. Therefore, since only good products can be placed in the frame, the defect rate can be reduced. Further, when the frame is reused, the loss of the material can be reduced, and when it is discarded after use, the material cost can be reduced by using an inexpensive material substrate.

  Further, when a composite substrate is manufactured, unit substrates can be formed from different printed wiring substrates manufactured separately, so that the number of punched portions is reduced, and material loss can be greatly reduced. In particular, in the case of the manufacturing method of (1) described above, an expensive flexible substrate can be used only for a portion that requires the original flexible substrate, so that the material cost can be greatly reduced.

  Next, the best mode for carrying out the present invention will be described with reference to the drawings.

  FIGS. 1-34 is a figure for demonstrating embodiment which applied this invention to the assembly panel of the composite rigid board | substrate which connected two rigid board | substrates with the flexible substrate.

  FIG. 1 shows an example in which 50 unit rigid boards 1a are manufactured as an assembly panel 1 for one rigid board, and FIG. 2 shows 162 unit flexible boards 2a assembled to one flexible board. FIG. 3 shows an example in which 110 unit rigid substrates 3 a are manufactured as one assembly panel 3.

  The rigid board assembly panels 1 and 3 shown in FIGS. 1 and 3 are eight-layer multilayer printed wiring boards, and the assembly panel 2 shown in FIG. 2 is a double-sided flexible board, and each has an outer layer wiring. The pattern and the protective layer thereon are integrally formed simultaneously, and are used by being divided into unit rigid substrates 1a, 3a or unit flexible substrates 2a along the grid lines in each figure.

  As will be described later, a plurality of conductor bumps are formed in the horizontal wiring portion in the vicinity of both ends of the unit flexible substrate 2a, and a layer of heat-fusible resin is formed in the base portion.

  Each unit rigid substrate 1a, 3a is formed with a connection terminal at a position in contact with the conductor bump of the unit flexible substrate 2a.

  FIG. 4 shows a frame 4 for assembling a target assembly panel, and has a lattice shape in which six frame units 4a for mounting unit sheets are joined in a plane.

  As shown in FIG. 5, each of the unit boards 1a to 3a in FIGS. 1 to 3 is arranged in the frame 4, that is, in the frame 4a for each mounting unit sheet, on the periphery of each of the rigid boards 1a and 3a. The unit rigid substrates and the unit rigid substrate and the frame body are temporarily bonded to each other by an instantaneous adhesive or the like at the provided protrusion B.

  Further, a plurality of temporarily fixed assembly panels are stacked and arranged between the heating plates and integrated by heating and pressing, and conductor bumps (not shown) of each unit flexible substrate 2a are each unit rigid substrate 1a. , 3a are pressed against and electrically connected to corresponding connecting terminals (not shown), and the portion is also mechanically and firmly integrated. As shown in FIG. 6, this assembly panel is divided into mounting unit sheets 4a before shipment.

  Next, a manufacturing method of each flexible substrate and each rigid substrate, a manufacturing method of an assembly panel and a mounting unit sheet of the present invention, and a rigid-flexible substrate that is a composite substrate in which the rigid substrate and the flexible substrate are connected A manufacturing method will be described.

  The following description will be given as a method for manufacturing a unit substrate or a unit composite substrate. Usually, the unit substrate is manufactured as an assembly panel shown in FIGS. 1 to 4 and divided into unit sheets for mounting before shipment.

(Create flexible substrate)
First, as shown in FIG. 7, through-holes 7 are formed at predetermined positions of a double-sided polyimide flexible substrate in which an electrolytic copper foil (6) having a thickness of 18 μm is adhered to both surfaces of a polyimide film 5 having a thickness of 25 μm. The electrolytic copper foil (6) on both sides is etched to form the horizontal wiring portion 8, and the protective film 9 is coated thereon and etched to expose the terminal portion 10 formed simultaneously with the horizontal wiring portion 8 and flexible. A substrate was prepared (FIG. 7: the reference numerals in parentheses in the following drawings indicate members before processing).

  On one side of the terminal portion 10 on one side of the flexible substrate, a polymer type silver conductive paste (trade name, thermosetting conductive paste MSP-812, Mitsui Chemicals KK) is used to form a substantially conical shape by the following method. Conductive bumps (connection terminals) 11 were formed (FIG. 8).

  That is, a metal mask having a 0.35 mm diameter hole is prepared at a predetermined location of a stainless steel plate having a thickness of 300 μm, and the conductive mask is printed by positioning and arranging the metal mask on one side of the flexible substrate. After the conductive paste was dried, printing was repeated three times by the method of printing again at the same position using the same mask to form a mountain-shaped (substantially conical) conductive bump 11 having a height of 200 to 300 μm. Next, a glass-epoxy prepreg (synthetic resin sheet) 12 having a thickness of 60 μm is brought into contact with the conductor bump 11 and placed between a hot plate kept at, for example, 100 ° C. via an aluminum foil and a rubber sheet. The flexible substrate 13 in which the tip of the conductor bump 11 protrudes from the glass-epoxy prepreg (synthetic resin sheet) 12 was created by heating and pressing at 1 MPa for about 1 minute.

(Rigid board creation)
A rigid substrate 14 schematically shown in FIG. 9 was manufactured by a method known as B ² it (registered trademark), for example, described in JP-A-8-204332. In the figure, reference numeral 15 is a horizontal wiring portion formed by patterning of an electrolytic copper foil having a thickness of 18 μm, and 16a and 16b are polymer-type silver-based conductive materials formed on the electrolytic copper foil or the horizontal wiring portion. Vertical wiring portion 17 formed of a mountain-shaped conductor bump having a height of 200 to 300 μm and made of a cured product of a conductive paste (trade name, thermosetting conductive paste MSP-812, Mitsui Chemicals KK) has a thickness of 60 μm An insulating layer 18, which is a cured product of a glass-epoxy prepreg (synthetic resin sheet), is a protective coating coated on the wiring pattern 15 of the outer layer. In the vicinity of the connecting portion of the rigid substrate 14 to the flexible substrate and the portion inside thereof, vertical wiring portions 16a and 16b are formed so as to penetrate in the vertical direction so as to penetrate both surfaces of the substrate. These vertical wiring portions 16a and 16b can be used as inspection terminals for inspecting whether or not the connection is complete.

(Rigid-Flexible board creation)
In the state of the assembly panel before being divided into individual rigid boards, or after being divided into individual unit rigid boards, a countersink process is performed in the vicinity of the vertical wiring portion 16a connected to the flexible board of each rigid board 17. Then, a rigid substrate 14a having a stepped portion S where the vertical wiring portion 16a is exposed is formed deeper than the thickness of the flexible substrate 13 to be connected (FIG. 10).

  Next, the unit rigid board | substrate 14a and the unit flexible board | substrate 13 which were divided | segmented separately are arrange | positioned so that it may become a final form in a frame.

  The conductor bumps of the part to be countersunk here may be sandwiched between copper wirings, but in consideration of the precision of the countersink in the depth direction, the countersink part may have no copper wiring in order to expose the conductor bump part on the surface. . Further, in order to obtain a stepped shape, it is also possible to form the step by laminating a portion to be a step in a rigid substrate forming process by removing in advance by router processing or the like.

  FIGS. 11 to 13 show another method for manufacturing a rigid substrate having such a stepped portion, and a laminated plate 50a above the stepped portion S and a laminated plate constituting a portion below the stepped portion S in advance. 50b are separately prepared (FIG. 11), and when laminated with the laminated plate 50b at the end of the laminated plate 50a, the portion that becomes the step S of the laminated plate 50b is cut (FIG. 12), and these are positioned. A rigid substrate 50 having a stepped portion S can be formed by heating and pressing (FIG. 13).

  In FIG. 14, a rigid substrate 14a having a step S formed therein is arranged in a frame so that the steps S face each other, and the flexible substrate 13 is arranged across the step S that each rigid substrate 14a faces. The conductive bumps 11 are brought into contact with the vertical wiring portions 16 a and are electrically connected by heating and pressurization, and are mechanically integrated by the glass-epoxy prepreg 12.

  In this embodiment, the vertical wiring portion 16a can be used as an inspection terminal for inspecting the connection between the unit flexible substrate 13 and the unit rigid substrate 14a in addition to the connection with the horizontal wiring portion 15, and the vertical wiring portion 16b It can be used as an inspection terminal for inspecting the quality of connection between each layer of the rigid substrate 14a.

  In the above embodiment, the example in which the vertical wiring portion 14a to which the unit flexible substrate 13 is connected is formed by the conductor bump 11 has been described. However, the present invention is not limited to this embodiment, and the via hole shown in FIG. It is also possible to fill the conductive paste 16d in the 16c. Also, as shown in FIG. 16, the conductor bumps 11a are formed by high-temperature solder (for example, solder having a melting point of about 200 ° C. to 240 ° C.) and solder-connected to the terminals 27 formed on the step S of the rigid substrate 14a. Also good.

  The above is a method of connecting the unit rigid board and the unit flexible board, but the unit rigid board 14a and the frame 4 are fixed by the method shown in FIGS.

  In the embodiment shown in FIGS. 17 to 18, a T-shaped protrusion 19 a is formed on the side of the unit rigid substrate 14 a adjacent to the frame 4, and the frame 4 has a recess 20 a into which the protrusion 19 a is fitted. Each unit rigid substrate is temporarily fixed by fitting its projection 19a into the recess 20a of the frame 4. In the example shown in FIGS. 19 to 21, a gap D is provided between the protrusion 19 b and the recess 20 b, and the adhesive 21 is disposed in the gap D and temporarily fixed by fitting the protrusion 19 b and the recess 20 b. Is fixed by the adhesive 21.

  Furthermore, in the example shown in FIGS. 22 to 24, the recess 20c of the frame body includes a bottom portion that supports the protrusion 19c of the unit rigid substrate 14, and there is a gap D between the protrusion 19c and the recess 20c of the frame body. The adhesive 21 is disposed in the gap D, and the protrusion 19c and the recess 20c of the frame body 4 are fixed. Moreover, you may make it adhere | attach both on the contact surface of the protrusion 19c and the recessed part 20c of the frame 4. FIG. In FIG. 25, the protrusions 19d on the peripheral edge of the unit rigid board are formed in a dovetail shape, and the recesses 20d of the frame body 4 are formed in a dovetail shape to ensure fitting fixing. In this example, the engaging portion is located between the frame body 4 and the unit rigid board 14a.

  26 to 28 are views showing a state in which the alignment mark M for positioning with respect to the mounting is provided in the vicinity of the fixing portion of the frame body 4 and the unit rigid board 14a.

  FIG. 26 shows an example in which the alignment mark M is provided at the corner portion of the unit rigid substrate 14a fixed to the corner portion of the frame body 4. In this example, the surface of the frame body is not used and high positional accuracy is provided. Is obtained. However, since the surface of the product is used, the area efficiency of the product is deteriorated. FIG. 27 shows an example in which the alignment mark M is provided on the T-shaped protrusion 19 a of the unit rigid substrate 14 a fixed to the corner portion of the frame body 4. In this example, the accuracy on the mounting surface is high, but the width of the frame is widened because it is placed in the fitting portion. FIG. 28 is an example in which the alignment mark M is provided on the frame 4 at the corner portion, and neither the product surface nor the fitting portion is used, but the fitting error affects the accuracy.

  29 to 31 are examples in which the frame 4b and the unit rigid board 14b and the unit rigid boards 14b are fixed by another method. In this example, protrusions 21 b are formed on the outer periphery of the unit rigid substrate 14 b, and the protrusions 22 b or protrusions 22 b provided on the peripheral surface without the frame body 4 are fixed by the adhesive 21. 30 and 31 are enlarged views of the circled portions in FIG.

  In this way, after the plurality of unit rigid substrates 14a and the flexible substrate 13 are held and fixed in the positional relationship to be the final form, they are stacked and integrated into the frame body 4 by heating and pressing. A fixed rigid-flexible substrate is obtained.

  Next, another embodiment of the present invention will be described with reference to FIGS.

  In addition, in the following figures, about the part corresponding to FIGS. 7-10, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

  In this embodiment, instead of the flexible substrate 13 shown in FIG. 29, one having a length sufficient to constitute the outer layer of the rigid substrates adjacent to each other is used (FIG. 32). In order to avoid an obstacle during mounting, the flexible substrate 13a preferably covers the entire rigid substrate. On this flexible substrate, a layer of a heat-fusible resin (synthetic resin-based sheet) 12 made of a conductive bump 11 and a glass-epoxy prepreg is formed on the side to be joined to the rigid substrate 14 by the method described in FIG. The

  As shown in FIG. 33, the flexible substrate 13a applies the conductor bump 11 penetrating the heat-fusible resin layer 12 to the terminal portion (horizontal wiring portion) 15 provided on the upper portion of the unit rigid substrate 14. The conductor bumps 11 are plastically deformed by heating and pressurization to electrically connect the conductor bumps 11 and the terminal portions 15 and are integrally connected by the heat-fusible resin layer 12. The heat-fusible resin layer 12 is cured to form an insulating layer 17 made of a cured glass-epoxy prepreg, and a rigid-flexible substrate in which the rigid substrate and the flexible substrate are electrically connected and mechanically integrated is obtained. (FIG. 34).

  Here, as described with reference to FIG. 8, the conductor bump 11 is made of a substantially conical conductive paste formed in the horizontal wiring portion on the flexible substrate side. That is, the bottom surface side of the conductor bump is directed to the flexible substrate side, and the tip side thereof is directed to the rigid substrate side. Both sides of the conductor bump 11 that is the vertical wiring portion are horizontal wiring portions formed of the same copper foil, but the substrate on which the horizontal wiring portion is formed is harder on the rigid substrate than on the flexible substrate. Accordingly, the conductive bump 11 formed on the flexible substrate side is plastically deformed at the tip side by abutting the tip on the rigid substrate side, and the flexible substrate side has a large diameter and the rigid substrate side has a small diameter as shown in FIG. It becomes a truncated cone shape. In this way, the conductor bumps are formed in the horizontal wiring portion on the flexible substrate side, and the conductor bumps are brought into contact with the horizontal wiring portion on the rigid substrate side to be plastically deformed so that the connection is ensured. That is, since the large-diameter base is directly formed on the relatively soft horizontal wiring portion on the flexible substrate side and the small-diameter tip portion of the conductor bump is pressed against the rigid substrate side, the flexible substrate side is deformed by stress. On the contrary, the tip of the copper-carrying bump that contacts the rigid substrate side is easily plastically deformed to form a truncated cone-shaped vertical wiring portion. Therefore, the effect that the connection reliability between the conductor bump rigid substrate and the flexible substrate is improved can be obtained.

  If the insulating layer 17 is flexible or has a small amount of bending as a product, the insulating layer 17 can be provided with a structure including a portion that is not stacked on a rigid substrate as shown in FIGS. When the insulating layer 17 does not have flexibility or the amount of bending as a product is large, as shown in FIGS. 35 and 36, only the flexible substrate is laminated on the uncured glass-epoxy prepreg 12 layer. The portion to be formed (the portion on which the rigid substrate is not laminated) may be previously deleted by router processing, punching processing, or the like, and the conductor bumps 11 may be brought into contact with each other and heated and pressed to be integrated. By doing in this way, about the part which a rigid board | substrate and a flexible substrate laminate | stack via an insulating layer, in addition to the effect demonstrated in FIGS. 33-34, the part (the flexible substrate only) where the rigid board | substrate is not laminated | stacked is acquired. With respect to the portion (ii), the flexibility of the flexible substrate can be fully utilized as long as there is no extra prepreg layer.

  The frame body and the rigid board are connected by, for example, the method shown in FIGS. 17 to 28 described above, and thereafter divided into mounting unit sheets.

  Next, still another embodiment of the present invention will be described with reference to FIGS. In principle, reference numerals and descriptions of points that overlap the above examples are omitted.

  Also in this embodiment, a flexible substrate having a length sufficient to be an outer layer of the rigid substrates adjacent to each other is used as in the case shown in FIGS. 32 to 36, but the reverse of that shown in FIGS. The difference is that conductor bumps to be vertical wiring portions are formed on the rigid substrate side (FIG. 39). That is, conductor bumps are formed not on the flexible substrate side but on the rigid substrate side, and the heat-fusible resin layer 12 made of glass-epoxy prepreg is superimposed on the leading end side of the conductor bump, and heated and pressed to form the conductor bump 11. After the rigid substrates 31a and 31b protruding through the heat-fusible resin layer 12 were obtained, these were placed in the frame so as to be in the final form, and the conductor bumps 11 were placed on the flexible substrate side. While being brought into contact with the connection terminal 10 and being electrically connected by heating and pressing, it is mechanically integrated by the heat-fusible resin layer 12.

Also in this example, for example, the rigid substrate 31 is prepared by the B ² it method described above, while the flexible substrate 32 having a length sufficient to be an outer layer of the adjacent rigid substrates is prepared.

In this example, the rigid board 31 is a four-layer board having four wiring layers as shown in FIG. 37, and the interlayer connection of each layer is performed by the B ² it method. The flexible board 32 is as shown in FIG. A double-sided board having wiring layers on both sides is connected to each other by through holes 7.

  The number of wiring layers of the rigid substrate 31 may be any number, and the interlayer connection method is not limited, but the interlayer connection inside the rigid substrate is performed before the connection between the rigid substrate and the flexible substrate. In this way, the rigid substrate is multilayered and connected to the flexible substrate after the interlayer connection, thereby reducing the effects of deformation on the relatively soft flexible substrate compared to the case where the rigid substrate is sequentially stacked on the flexible substrate. can do.

The flexible substrate 32 may be a double-sided board or a single-sided board, but at least one wiring layer is required. If a double-sided board is used, the wiring area can be increased compared to a single-sided board. When a single-sided board is used, the wiring area is smaller than that of a double-sided board, but a through hole for interlayer connection is not necessary, and flexibility and cost reduction can be achieved. When the flexible substrate 32 is a double-sided board, interlayer connection can be made through the through hole 7 as shown in FIGS. The through hole 7 has a hole penetrating both surfaces of the flexible substrate 32 and its inner wall is covered with a conductor plating. Further, interlayer connection may be made by laser via holes 33 as shown in FIG. 41, or interlayer connection may be made by conductor bumps by a B ² it method as shown in FIG. The laser via hole 33 is formed by irradiating a laser beam from the outside of the flexible substrate 32 to provide an opening through which the connection terminal 10 of the flexible substrate 32 is exposed, and covering the inside with a conductor plating. Thus, the interlayer connection structure of the flexible substrate 32 does not matter. An example of a rigid-flexible substrate according to the present invention when the flexible substrate 32 is a single-sided plate is shown in FIG. When the flexible substrate is a single-sided plate as shown in the figure, the interlayer connection structure is not necessary.

In the example of FIGS. 37 to 43, the example in which the electrical connection between the horizontal wiring portion of the rigid substrate and the horizontal wiring portion of the flexible substrate is performed by the conductor bump by the B ² it method has been described. In addition, the rigid substrate and the flexible substrate may be connected by the laser skip via 34. The laser skip via 34 irradiates a laser beam from the outside of the flexible substrate 32 to provide an opening for exposing the connection terminal 15 to the insulating layer 17 which is a cured product of the glass-epoxy prepreg together with the flexible substrate 32. It is covered with conductor plating so as to be along the portion. As described above, when the rigid board and the flexible board are connected by the laser skip via 34, if the double-sided wiring board that is not interlayer-connected is used as the flexible board, both the interlayer connection and the connection between the rigid board and the flexible board are possible. Since the same processing can be performed almost simultaneously, there is an advantage that it is not necessary to perform interlayer connection of the flexible substrate in a separate process.

  When the rigid board and the flexible board are connected by the laser skip via 34, a single-sided wiring board can also be used as the flexible board. In this case, however, the wiring side of the flexible board is placed outside as opposed to FIG. Good. In this way, component mounting on the flexible surface side becomes possible (not shown). In any case, by irradiating a laser beam from the outside of the flexible substrate, providing an opening (hole) through which the opposing horizontal wiring portion (connection terminal) is exposed, and providing a conductor layer along the hole by plating or the like Thus, the laser skip via 34 can be used to electrically connect the wiring layer of the flexible substrate and the wiring layer of the rigid substrate. In addition, a laser beam that can be delicately processed can be used.

  As another method of using a conductive paste for the vertical wiring portion for electrically connecting the horizontal wiring portion of the rigid substrate and the horizontal wiring portion of the flexible substrate, the following method can also be adopted without using the conductive bumps. . That is, after temporarily sticking a heat-fusible resin layer on the horizontal wiring portion of either the rigid substrate or the flexible substrate so as to cover the horizontal wiring portion, the heat-fusible resin on the horizontal wiring portion Vertical wiring is achieved by drilling holes in the layer to expose the horizontal wiring part, embedding conductive paste there by screen printing, positioning it on the horizontal wiring part of the other board and thermocompression bonding A part can also be formed. The vertical wiring portion 35 is formed by this method, and the horizontal wiring portion 15 of the rigid board and the horizontal wiring portion 10 of the flexible board are electrically connected and mechanically integrated to form a rigid-flexible board. An example is shown in FIG.

  46a is a plan view schematically showing a mounting unit sheet in which about three rigid-flexible substrates shown in FIG. 34, 36, 40, 41, 42, 43, 44 or 45 are arranged on the frame 4. FIG. It is. FIG. 46b is a plan view of the same viewed from the opposite side (flexible substrate side). Thus, in these embodiments, the flexible substrate is the outermost layer and covers the rigid substrate.

  As described above, in the rigid-flexible substrate in which the flexible substrate covers the rigid substrate and becomes the outermost layer, the flexibility of the flexible substrate cannot be utilized for the portion covering the rigid substrate, but the step is not provided in the connection portion of the rigid substrate. Since the flatness of the substrate can be ensured without providing the portion, the rigid-flexible substrate can be manufactured by a relatively simple method using the existing equipment.

  In this way, in the method of manufacturing a rigid-flexible substrate in which the flexible substrate covers the rigid substrate and becomes the outermost layer, lamination and fixation of the rigid substrate and the flexible substrate can be performed as follows. That is, (1) A method of laminating both a rigid substrate and a flexible substrate as a panel, and (2) A method of attaching a flexible substrate piece to a rigid substrate panel by making the rigid substrate into a panel, making the flexible substrate into pieces (small pieces). (3) A rigid substrate and a flexible substrate are made into pieces, a rigid substrate piece is fixed to an outer frame panel, and then a flexible substrate piece is fixed; (4) a rigid substrate is made into a piece, a flexible substrate is made into a panel, Any of the methods of attaching a rigid substrate piece to a flexible substrate panel can be employed. In the case of the method (1), the amount of material used is the same as other current methods, but it can be manufactured with existing equipment. In the case of the method (2), the usage amount of the flexible substrate can be reduced. In the case of the method (3), the amount of use can be reduced for both the rigid substrate and the flexible substrate. In the case of the method (4), the amount of use of the rigid substrate can be reduced.

In addition, in FIGS. 34-45, what was shown with the code | symbol 9 is a coverlay (protective film). Although not particularly shown in the figure, the following variations are conceivable for forming the coverlay. When components are not mounted on the flexible substrate surface, which is the outermost layer, and when connecting with conductor bumps by the B ² it method, (1) Insulating the rigid substrate and the flexible substrate with an insulating layer without sandwiching the film coverlay (2) A method of laminating a rigid substrate and a flexible substrate with an insulating layer interposed therebetween, and (3) A rigid substrate and a flexible substrate with a photosensitive cover lay interposed therebetween. Any one of the three methods can be employed. When connecting a rigid board and a flexible board with laser skip vias, or when connecting the whole board with a through hole, (4) Insulating layer between the rigid board and the flexible board with a film cover lay across the entire surface The method of laminating through can also be taken. In addition, when mounting a component or the like on the surface of the flexible substrate that is the outermost layer, (5) a method of forming the outer layer of the flexible substrate with a photosensitive coverlay, (6) a flexible substrate with a film coverlay and a photosensitive coverlay Either of the two methods of forming the outer layer can be adopted.

  In the above-described embodiment, an example in which the frame of the unit sheet for mounting is connected in a plurality of planes in a lattice shape has been described as the frame, but the present invention is limited to such an embodiment. Instead of this, a single square frame may be used.

  In the present invention, once a unit substrate is created, it is assembled into a multi-piece printed wiring board within a frame, so that defective products can be removed at the stage of each unit substrate, and the yield is improved. In addition, when producing a composite substrate of a unit rigid substrate and a unit flexible substrate, in particular, the yield of the flexible substrate can be greatly improved, and the production cost can be greatly reduced.

FIG. 2 is a plan view schematically showing a multi-piece rigid substrate. The top view which shows typically the flexible substrate of multi-piece picking. Sectional drawing which shows the rigid board | substrate of multi-piece taking typically. The top view which shows a frame. The top view which shows the state which has arrange | positioned the unit rigid board | substrate and the unit flexible board | substrate in the frame. The top view which shows the unit sheet for mounting. The top view which shows typically the principal part of the flexible substrate of multi-piece picking. The top view which shows typically the principal part of the rigid board | substrate of multi-piece picking which formed the bump. Sectional drawing which shows the principal part of the rigid board | substrate of multi-piece picking. Sectional drawing which shows the principal part of the rigid board | substrate of multi-sheet picking which provided the step part. Sectional drawing which shows the manufacturing method of the rigid board | substrate which has a step part. Sectional drawing which shows the manufacturing method of the rigid board | substrate which has a step part. Sectional drawing which shows the manufacturing method of the rigid board | substrate which has a step part. Sectional drawing which shows typically the state which connected the rigid board | substrate and the flexible substrate of many sheets. Sectional drawing which shows typically the other example of the connection of a rigid board | substrate of a large number of sheets, and a flexible substrate. Sectional drawing which shows typically the further another example of the connection of a rigid board | substrate of multiple picking and a flexible substrate. The top view which shows the connection method of a frame and a unit rigid board | substrate. FIG. 18 is a cross-sectional view taken along line AA in FIG. The top view which shows the other connection method of a frame and a unit rigid board | substrate. Sectional drawing along the BB line of FIG. Sectional drawing along the BB line of FIG. The top view which shows the further another connection method of a frame and a unit rigid board | substrate. FIG. 23 is a cross-sectional view taken along line CC in FIG. 22. FIG. 23 is a cross-sectional view taken along line CC in FIG. 22. The top view which shows the further another connection method of a frame and a unit rigid board | substrate. The top view which shows the alignment mark provided in the corner part of a unit rigid board | substrate. The top view which shows the alignment mark provided in the projection part of the unit rigid board | substrate. The top view which shows the aligned mark provided in the corner part of a frame. The top view which shows the further another connection method of a frame and a unit rigid board | substrate. The top view which expands and shows the connection part of FIG. The top view which expands and shows the connection part of FIG. The top view which shows typically the flexible substrate of multi-piece picking. Sectional drawing which shows typically the condition where a unit rigid board | substrate and a unit flexible board | substrate are connected by a conductor bump (example in which a heat-fusible layer is provided entirely on the flexible board side). FIG. 34 is a cross-sectional view schematically showing a state where the thing of FIG. 33 is connected. Sectional drawing which shows the situation where a unit rigid board | substrate and a unit flexible board | substrate are connected by a conductor bump (The example which removes the part which is not laminated | stacked on a rigid board | substrate beforehand among the heat-fusible layers provided in the flexible board side, and connects ). The sectional view showing typically the state where the thing of Drawing 35 was connected. Sectional drawing which shows a unit rigid board | substrate typically. Sectional drawing which shows a unit flexible substrate typically. Sectional drawing which shows typically the condition which connects a unit rigid board | substrate and a unit flexible board | substrate with the conductor bump formed in the rigid board | substrate side (example in which the unit flexible board | substrate was interlayer-connected by the conductor bump with the double-sided board). FIG. 40 is a cross-sectional view schematically showing a state where the device of FIG. 39 is connected. Sectional drawing which shows the state which the unit rigid board | substrate and the unit flexible board | substrate were connected by the conductor bump formed in the rigid board | substrate side typically (example in which the unit flexible board | substrate was interlayer-connected by the laser via hole with the double-sided board). Sectional drawing which shows typically the state by which the unit rigid board | substrate and the unit flexible board | substrate were connected by the conductor bump formed in the rigid board | substrate side (example in which the unit flexible board | substrate was interlayer-connected by the conductor bump with the double-sided board). Sectional drawing which shows the state in which the unit rigid board and one unit flexible board covering the whole length are connected by the conductor bump formed on the rigid board side (an example in which the unit flexible board is a single-sided board and does not require interlayer connection) ). Sectional drawing which shows the state where two unit rigid board | substrates and one unit flexible board | substrate covering the full length were connected by the laser skip via (The example which the unit flexible board | substrate was interlayer-connected by the laser via hole by the double-sided board) . The sectional view showing typically the state where two unit rigid boards and one unit flexible board covering the full length were connected by the perpendicular wiring part of other embodiments using conductive paste. The top view which shows typically the state which has arrange | positioned the unit rigid board | substrate and the unit flexible board | substrate in the frame. The top view which shows typically a mode that the state which has arrange | positioned the unit rigid board | substrate and the unit flexible board | substrate in the frame was seen from the opposite side to FIG. 46a.

Explanation of symbols

  1, 3 ... Rigid board assembly panel, 1a, 3a ... Unit rigid board, 2 ... Printed wiring board assembly panel, 2a ... Unit flexible board, 4 ... Frame body, 4a ... Mounting unit sheet Frame 5: Polyimide film, (6) ... Electrolytic copper foil, 7 ... Through hole, 8 ... Horizontal wiring part, 9 ... Protective film, 10 ... Terminal part, 11 ... Conductor bump (Connection terminal) 12... Glass-epoxy prepreg (synthetic resin sheet), 13, 32... Flexible substrate, 14, 31, 31a, 31b... Rigid substrate, 15. Wiring portion, 17 ... insulating layer made of a cured product of glass-epoxy prepreg, 18 ... protective coating, 19, 19a ... projection, 20, 20a ... recess, 21 ... adhesive, M ... alignment mark 27 ... ... Connection terminal, 33... Laser via hole, 34... Laser skip via, 35... Vertical wiring portion made of hardened conductive paste buried in through hole of insulating layer.

Claims (27)

A frame,
A plurality of unit substrates arranged in a predetermined relative position in the frame,
Each unit substrate has a plurality of protrusions on the periphery, and is bonded to the adjacent unit substrate and / or the frame body and the protrusion portion, so that the frame body and each substrate are integrally fixed. Printed wiring board assembly panel characterized by   2. The printed circuit board assembly panel according to claim 1, wherein each of the unit boards is arranged in the frame so that a mounting surface thereof is the same plane. A frame,
Provided with a plurality of composite substrates consisting of a rigid substrate and a flexible substrate arranged in a predetermined relative position in the frame,
Each composite substrate includes a plurality of protrusions on the periphery of the rigid substrate, and is bonded to the adjacent composite substrate and / or the frame body and the protrusion portion so that the frame body and each composite substrate are integrated. A printed circuit board assembly panel characterized by being fixed.   4. The printed wiring board assembly panel according to claim 3, wherein the composite board is directly connected to a connection terminal of a rigid board and a connection terminal of a flexible board.   5. The printed wiring board assembly panel according to claim 3, wherein each of the composite substrates is arranged in the frame so that a mounting surface thereof is the same plane. 6.   6. The printed wiring board assembly panel according to claim 3, wherein the composite substrate includes at least one rigid substrate and at least one flexible substrate. A frame,
A plurality of unit substrates arranged in a predetermined relative position in the frame,
The unit substrate has a plurality of protrusions on the periphery, and is bonded to the adjacent unit substrate and / or the frame body and the protrusion portion, so that the frame body and each unit substrate are fixed integrally. A unit sheet for mounting a printed wiring board characterized by the above.   8. The unit sheet for mounting a printed wiring board according to claim 7, wherein each of the unit boards is disposed in the frame so that the mounting surface is the same plane. A frame,
A composite substrate comprising at least one rigid substrate and at least one flexible substrate disposed in a predetermined relative position in the frame;
Each of the composite substrates includes a plurality of protrusions on the periphery of a rigid substrate, and is bonded to at least the frame body, and the frame body and the rigid substrate are fixed integrally. Unit sheet for mounting circuit boards.   The printed circuit board mounting unit sheet according to claim 9, wherein the composite board is directly connected to a connection terminal of a rigid board and a connection terminal of a flexible board.   11. The unit sheet for mounting a printed wiring board according to claim 9, wherein each of the composite substrates is disposed in the frame body so that a mounting surface thereof is on the same plane.   The unit sheet for mounting a printed wiring board according to any one of claims 9 to 11, wherein a plurality of rigid boards in the composite board are connected by a series of flexible boards. In the frame body, a plurality of unit substrates are arranged, and each unit substrate and the printed circuit board manufacturing method in which the unit substrate and the frame body are fixed integrally,
While preparing the frame,
Preparing the plurality of unit substrates;
Arranging the plurality of unit substrates in the frame so as to be in a predetermined relational position;
Assembling the printed wiring board, comprising: fixing the plurality of unit boards and / or the unit board and the frame, and integrating the frame and the unit boards. Panel manufacturing method. In the frame body, a plurality of sets of unit rigid boards and unit flexible boards constituting the composite board are arranged, and each unit board and the assembly of the printed wiring board in which each unit board and the frame body are fixed integrally A method of manufacturing a panel,
While preparing the frame,
A step of preparing a plurality of units each of which is a unit rigid substrate and a unit flexible substrate constituting the composite substrate and each having a terminal that can be directly connected to each other;
Placing the unit rigid board and the unit flexible board in the frame body at a predetermined relationship position and corresponding terminals facing each other; and
Fixing each unit rigid board and unit flexible board, and the frame and each rigid board, and electrically connecting the terminals of the unit rigid board and the unit flexible board to each other. A printed wiring board assembly panel manufacturing method, comprising: An assembly in which a plurality of unit sheets for mounting are assembled by the method according to claim 13 or 14 using a composite frame body in which a plurality of frame bodies of mounting unit substrates are connected in a planar manner as the frame body. Manufacturing the panel;
Separating the assembly panel into individual mounting unit sheets;
A method of manufacturing a unit sheet for mounting a printed wiring board, comprising: A rigid-flexible substrate in which a rigid substrate and a flexible substrate are laminated and integrated via an insulating layer, and a horizontal wiring portion of both substrates is electrically connected by a vertical wiring portion penetrating the insulating layer,
The vertical wiring portion is a conductive bump formed in the horizontal wiring portion of the flexible substrate, penetrating through the insulating layer, and its tip abutting and plastically deforming the horizontal wiring portion of the rigid substrate,
The rigid-flexible substrate, wherein the flexible substrate is exposed in an outermost layer. The rigid substrate according to claim 16, wherein the flexible substrate is a double-sided wiring board having wiring layers on both sides, and electrical connection between the wiring layers is performed by through holes, laser beam via holes, or conductor bumps. Flexible substrate. The rigid-flexible substrate according to claim 16, wherein the flexible substrate is a single-sided wiring board. A rigid-flexible substrate in which a rigid substrate and a flexible substrate are laminated and integrated via an insulating layer, and a horizontal wiring portion of both substrates is electrically connected by a vertical wiring portion penetrating the insulating layer,
The vertical wiring part is formed along an opening provided so that the horizontal wiring part of the rigid substrate is exposed by irradiating a laser beam from the outside of the flexible substrate to penetrate the insulating layer together with the flexible substrate. A laser skip via made of a conductive layer,
The rigid-flexible substrate, wherein the flexible substrate is exposed in an outermost layer. A rigid-flexible substrate in which a rigid substrate and a flexible substrate are laminated and integrated via an insulating layer, and a horizontal wiring portion of both substrates is electrically connected by a vertical wiring portion penetrating the insulating layer,
The vertical wiring part fills a through hole provided in the insulating layer corresponding to the connection terminal of the horizontal wiring part of the rigid substrate and the flexible substrate, and heats and presses the connection terminal to electrically A conductor connected to
The rigid-flexible substrate, wherein the flexible substrate is exposed in an outermost layer. The rigid-flexible substrate according to any one of claims 16 to 20, wherein the flexible substrate is formed so as to cover an entire surface of one surface of the rigid substrate. A rigid-flexible substrate manufacturing method in which a rigid substrate and a flexible substrate are laminated and integrated via an insulating layer, and the horizontal wiring portion of both substrates is electrically connected by a vertical wiring portion penetrating the insulating layer. And
Prepare a rigid substrate having a horizontal wiring portion provided on at least one outer layer surface and conductor bumps formed as vertical wiring portions at predetermined positions of the horizontal wiring portion, and uncured on the conductive bump formation surface of the rigid substrate And heat and pressurize the heat-fusible resin sheet, to create a rigid substrate in which the tip of the conductor bump is exposed from the uncured heat-fusible resin sheet,
Preparing a flexible substrate having a horizontal wiring portion and a connection terminal corresponding to the vertical wiring portion of the rigid substrate formed on at least one outer layer surface and connected to the horizontal wiring portion;
The rigid substrate and the flexible substrate are laminated with the conductor bumps and the connection terminals facing each other, and the tips of the conductive bumps that are penetrated and exposed by heating and pressing are brought into contact with the connection terminals of the other substrate and are plastically deformed. And a step of electrically connecting and mechanically integrating the rigid-flexible substrate manufacturing method. A rigid-flexible substrate manufacturing method in which a rigid substrate and a flexible substrate are laminated and integrated via an insulating layer, and the horizontal wiring portion of both substrates is electrically connected by a vertical wiring portion penetrating the insulating layer. And
A flexible substrate is prepared in which a horizontal wiring portion is provided on at least one outer layer surface, and a conductor bump is formed at a predetermined position of the horizontal wiring portion to be a vertical wiring portion, and the conductive bump forming surface of the flexible substrate is uncured. And heat and pressurize the heat fusible resin sheet, to create a flexible substrate in which the tip of the conductor bump is exposed from the uncured heat fusible resin sheet,
Preparing a rigid board on at least one outer surface of which a horizontal wiring part and a connection terminal corresponding to the vertical wiring part of the flexible board connected to the horizontal wiring part are formed;
The rigid substrate and the flexible substrate are laminated with the conductor bumps and the connection terminals facing each other, and the tips of the conductive bumps that are penetrated and exposed by heating and pressing are brought into contact with the connection terminals of the other substrate and are plastically deformed. And a step of electrically connecting and mechanically integrating the rigid-flexible substrate manufacturing method. A rigid-flexible substrate manufacturing method in which a rigid substrate and a flexible substrate are laminated and integrated via an insulating layer, and the horizontal wiring portion of both substrates is electrically connected by a vertical wiring portion penetrating the insulating layer. And
While preparing a flexible substrate provided with a horizontal wiring portion on at least one outer layer surface,
Preparing a rigid substrate having a connection terminal formed at a position connected to the horizontal wiring portion and the flexible substrate on at least one outer layer surface; and
The insulating substrate made of uncured heat-fusion resin is overlaid on the surface of the rigid substrate on which the connection terminals are formed, the flexible substrate is laminated with the outer layer surface on which the horizontal wiring portion is provided facing outside, and heating Pressurizing and integrating, and
A laser beam is radiated from the outside of the flexible substrate to penetrate the insulating layer together with the flexible substrate to provide an opening through which the connection terminal of the rigid substrate is exposed, and a conductor layer is formed to cover the opening. And a step of electrically connecting the horizontal wiring portions of the two substrates by means of a laser skip via serving as a vertical wiring portion. 25. The method of manufacturing a rigid-flexible substrate according to claim 24, wherein the flexible substrate is a double-sided wiring board, and the electrical connection between the wiring layers is performed by a laser beam via hole simultaneously with the connection by the laser skip via. A rigid-flexible substrate manufacturing method in which a rigid substrate and a flexible substrate are laminated and integrated via an insulating layer, and the horizontal wiring portion of both substrates is electrically connected by a vertical wiring portion penetrating the insulating layer. And
On at least one outer layer surface, a horizontal wiring portion, and a flexible substrate having a connection terminal formed at a position where the horizontal wiring portion and the rigid substrate are connected by a vertical wiring portion, are prepared.
Preparing a rigid substrate in which a connection terminal is formed at a position where a horizontal wiring portion and the horizontal wiring portion and the flexible substrate are connected by a vertical wiring portion on at least one outer layer surface;
Forming at least one of the rigid substrate and the flexible substrate with a heat-welding insulating layer having a through hole at a position corresponding to a connection terminal and having a conductor filled in the through hole;
The rigid substrate and the flexible substrate are laminated with the conductor and the connection terminal facing each other, and heated and pressed to bring the exposed portion of the filled conductor into contact with the connection terminal of the other substrate. Connecting and mechanically integrating the steps, a method for manufacturing a rigid-flexible substrate.   27. The method of manufacturing a rigid-flexible substrate according to any one of claims 22 to 26, wherein the flexible substrate is formed so as to cover an entire surface of one surface of the rigid substrate.

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