JP2006245323A - Sheet unit for printed circuit boards and substrate attachment method using this - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet unit for printed circuit boards capable of mounting processing by securing flatness of FPC as well as capable of reducing the cost by suppressing working hours and raising usability, and to provide a substrate attachment method using this. <P>SOLUTION: The sheet unit for printed circuit boards is interposed between a printed circuit board and a jig for holding the board so that the both may be connected detachably. It comprises a sheet shaped base member, an adhesive layer formed in one surface of the base member, and a weak adhesive layer formed in the other surface of the above base member in which adhesive power is weaker than the adhesive layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a printed wiring board sheet unit that is interposed between a printed wiring board and a jig that holds the printed wiring board and is detachably connected to the printed wiring board, and a board mounting method using the same.

  As is well known, printed wiring boards are currently used in all electronic devices. In general, this printed wiring board has a structure having a conductor pattern on the surface of the insulating substrate. However, in recent years, the surface of the insulating substrate in the form of a film is provided with a conductor pattern in order to cope with the reduction in size and weight of electronic devices. A flexible printed wiring board (hereinafter referred to as “FPC”) is also provided. A holding and conveying jig that holds the FPC is also provided.

For example, Patent Document 1 proposes a technique relating to a holding and conveying jig that forms a weak adhesive layer over the entire surface of an insulating substrate having heat resistance and holds an FPC on the surface of the adhesive layer. Yes.
JP-A 63-204695

However, in the past, it is very difficult to directly arrange and bond the weakly adhesive adhesive to a predetermined portion of the holding and conveying jig. In general, weakly adhesive adhesives have a high elongation rate, and deformation and bending easily occur. Therefore, dedicated equipment and equipment are required for disposing the weakly adhesive adhesive, and there are problems of increased work time and high cost.
Further, conventionally, there is a problem that unevenness is likely to occur on the surface of the weak adhesive adhesive bonded to the holding and conveying jig, which is an obstacle to securing the flatness of the FPC.

  Therefore, the present invention can reduce the working time, reduce the cost, increase the convenience, and ensure the flatness of the FPC and perform the mounting process, and the board using the same An object is to provide an attachment method.

  The invention according to claim 1 is a seal unit for a printed wiring board that is interposed between a printed wiring board and a jig that holds the printed wiring board, and detachably connects the board and the jig. Base member, a first pressure-sensitive adhesive layer formed on one surface of the base member, and an adhesive force formed on the other surface of the base member and equal to or less than the first pressure-sensitive adhesive layer And a second pressure-sensitive adhesive layer.

  According to this invention, by using a member having a predetermined strength for the base member, it is possible to suppress deformation and bending of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer, and to maintain a constant shape. Handleability can be greatly improved. Since it can hold | maintain to a fixed shape with the said base member, it can process to a substantially arbitrary shape easily and can improve versatility. Therefore, the sheet unit can be disposed on the jig without using special equipment. Therefore, the working time can be reduced, the cost can be reduced, and the convenience can be enhanced. Further, by providing a protective member that protects the outer surface of the first pressure-sensitive adhesive layer or the second pressure-sensitive adhesive layer, the sheet unit disposing step and the printed wiring board disposing step are separated. Easy to do in place. That is, after the protective member is peeled off from the sheet unit and bonded to the jig, the protective member is left without peeling until the step of bonding to the printed board is performed. It is possible to move the location of the sheet unit bonded to the jig while maintaining the adhesive force of the adhesive layer covered with.

The invention according to a second aspect is the one according to the first aspect, wherein the base member is made of at least one of a glass epoxy material, a stainless steel material, an aluminum material, and a polyimide material.
According to this invention, since the base member can be made of at least one of the glass epoxy material, stainless steel material, aluminum material, and polyimide material, a certain strength can be secured to the base member. Elongation of the layer and the weak pressure-sensitive adhesive layer can be suppressed, and handling is easy. Furthermore, the base member can be cut into an arbitrary shape, and the cost can be reduced. Here, it is preferable that the thickness of the base member is set to a thickness that can be easily cut out. Specifically, in the case of the glass epoxy material, the thickness is 0.05 to 0.3 mm, and in the case of the stainless steel material or the aluminum material, the thickness is 0.01 to 0.2 mm. In the case of a material, it is preferable to set the thickness to 0.01 to 0.3 mm. The glass epoxy material may have a structure in which multiple layers are laminated, or may be constituted by a single layer.

The invention according to claim 3 is the invention according to claim 1 or 2, wherein the first pressure-sensitive adhesive layer is an acrylic pressure-sensitive adhesive, a silicon-based pressure-sensitive adhesive, or a self-adhesive silicon. The second adhesive layer is made of a resin or a fluororesin, and the second adhesive layer is made of a silicone resin or a fluororesin having self-adhesiveness.
According to the present invention, the first pressure-sensitive adhesive layer is composed of an acrylic pressure-sensitive adhesive or a silicon-based pressure-sensitive adhesive, so that the heat resistance can be improved as compared with a rubber-based pressure-sensitive adhesive generally used. Thereby, durability can be improved. Further, by forming the second pressure-sensitive adhesive layer with silicon resin or fluororesin having self-adhesiveness, it is possible to increase the adhesion to the printed wiring board, thereby increasing the holding power, After the substrate mounting process, it can be easily peeled off from the substrate, and workability can be improved.

The invention according to claim 4 is a board mounting method using the printed wiring board sheet unit according to any one of claims 1 to 3, wherein the jig is interposed via the first adhesive layer. It adheres to the printed wiring board through the second pressure-sensitive adhesive layer in a state where it is adhered to the printed wiring board.
According to this invention, the sheet unit can be disposed at a predetermined position of the jig by being held in a fixed shape by the base member, and at this time, the first pressure-sensitive adhesive layer By adhering to the jig, the adhesive force can be applied to the jig so that the displacement from the predetermined position is regulated. At this time, since the shape of the second pressure-sensitive adhesive layer is maintained substantially constant by the base member, the printed circuit board is held while suppressing the occurrence of dents and bulges on the surface of the second pressure-sensitive adhesive layer. be able to. Therefore, since the printed circuit board can be held on substantially the entire surface of the second pressure-sensitive adhesive layer, the flatness of the printed circuit board can be ensured. In addition, by adhering to the printed wiring board through the second adhesive layer, the printed wiring board can be held in a stable posture on the jig, and the processing on the jig can be performed. Easy to do. Furthermore, since the printed wiring board can be easily peeled off from the second pressure-sensitive adhesive layer after the above process is completed, the printed wiring board can be quickly transferred to the next process. .

The invention according to claim 5 is the invention according to claim 4, wherein a plurality of sheets having different thicknesses of the base member when the printed wiring board having different thicknesses depending on the part is held in the jig. The unit is arranged on the jig in accordance with a portion of the printed wiring board.
According to this invention, since the thickness of the sheet unit can be changed while setting the thickness of the second pressure-sensitive adhesive layer to be substantially the same, the pressure-sensitive adhesive force is substantially the same regardless of the portion of the printed circuit board. And the deformation and distortion of the printed wiring board due to the difference in adhesive force can be prevented. Further, by disposing a plurality of sheet units having different thicknesses on the jig so as to cancel the difference in thickness depending on the portion of the printed wiring board, the flatness of the surface of the printed wiring board is ensured. It becomes possible to hold, and the work load of the mounting process can be reduced. Thereby, it is possible to contribute to improvement of reliability after the mounting process while increasing the degree of freedom of design of the printed wiring board.

The invention according to a sixth aspect is the one according to the fourth or fifth aspect, wherein when the printed wiring board having a different thickness depending on a part is held in the jig, the second adhesive layer A plurality of sheet units having different thicknesses are arranged on the jig in accordance with a portion of the printed wiring board.
According to this invention, since the adhesive force can be adjusted according to the thickness of the second pressure-sensitive adhesive layer, the thickness is different so that the adhesive force according to the portion of the printed wiring board acts. By disposing a plurality of sheet units on the jig, mounting processing can be performed in a stable posture even with the printed wiring board having a complicated shape. Thereby, it is possible to contribute to improvement of reliability after the mounting process while increasing the degree of freedom of design of the printed wiring board.

According to the invention which concerns on Claim 1, while being able to hold down working time, cost can be reduced and the convenience can be improved.
According to the invention which concerns on Claim 2, it can handle easily and can hold down cost.

According to the invention which concerns on Claim 3, durability can be improved and workability | operativity can be improved, improving adhesiveness.
According to the invention which concerns on Claim 4, the flatness of the said printed circuit board can be ensured, and the process on the said jig | tool can be performed easily.

According to the invention of claim 5, since the deformation and distortion of the printed wiring board due to the difference in adhesive force can be prevented, the reliability after the mounting process is improved while increasing the degree of freedom in designing the printed wiring board. Can contribute.
According to the invention of claim 6, since the mounting process can be performed in a stable posture with the printed wiring board having a complicated shape, the reliability after the mounting process is improved while increasing the degree of freedom of design of the printed wiring board. It can contribute to improvement of sex.

Hereinafter, a printed wiring board sheet unit and a board mounting method using the same according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view of a printed wiring board sheet unit to which the present invention is applied. As shown in the figure, the sheet unit 1 in the present embodiment is formed on a sheet-like base member 2, an adhesive layer 4 formed on the back surface of the base member 2, and the surface of the base member 2. A weak pressure-sensitive adhesive layer 3. The weak pressure-sensitive adhesive layer 3 has a weaker adhesive force than the pressure-sensitive adhesive layer 4. And while the outer surface of the weak adhesive layer 3 is covered with the protective film 5, the outer surface (back surface) of the adhesive layer 4 is covered with the release paper 6. FIG.

  Base member 2 in the present embodiment is made of a glass epoxy material (glass epoxy material). This glass epoxy material is a material produced by laminating and pressing a glass nonwoven fabric into an epoxy resin. By using such a material, a certain strength can be secured to the base member 2.

The weak pressure-sensitive adhesive layer 3 in the present embodiment is made of a self-adhesive silicon resin. By using such a self-adhesive silicon resin, adhesion to a printed wiring board 8 (see FIG. 2) described later is improved, and thereby the printed wiring board 8 is held while maintaining a weak adhesive force. Holding power can be increased. Therefore, it can be easily peeled off from the printed wiring board 8 after the mounting process of the printed wiring board 8, and workability can be improved. In addition, you may comprise the weak adhesive layer 3 with the fluororesin which has self-adhesiveness.
Moreover, the adhesive layer 4 is comprised with the acrylic adhesive. The durability can be enhanced by using an acrylic pressure-sensitive adhesive. In addition, you may comprise the adhesive layer 4 with a silicon-type adhesive.

Since the pressure-sensitive adhesive layer 4 is covered with the release paper 6 and the weak pressure-sensitive adhesive layer 3 is covered with the protective film 5, the pressure-sensitive adhesive layer 4 and the weak pressure-sensitive adhesive layer 3 can be protected from the outside air, and drying is prevented. be able to. Therefore, a place can be moved in the state which maintained each adhesive force.
Further, after the release paper 6 is peeled from the sheet unit 1 and bonded to the jig 7, the protective film 5 is left without being peeled until the step of bonding to the printed circuit board 8 is performed. 3, the place of the jig 7 and the sheet unit 1 can be moved while maintaining the adhesive force of 3.

  Further, since the base member 2 has a certain strength, it can be held in a certain shape while suppressing the deformation and bending of the pressure-sensitive adhesive layer 4 and the weak pressure-sensitive adhesive layer 3. Accordingly, the pressure-sensitive adhesive layer 4 and the weak pressure-sensitive adhesive layer 3 can be easily cut and processed into an arbitrary shape while being covered with the protective film 5 or the release paper 6. As a result, versatility with respect to the material and shape of the printed wiring board 8 can be enhanced, and the handleability of the weak adhesive layer 3 can be greatly improved.

  In addition, since the base member 2 has a predetermined strength, the pressure-sensitive adhesive layer 4 and the weak pressure-sensitive adhesive layer 3 can be held in a certain shape while suppressing deformation and bending, so that the pressure-sensitive adhesive layer 4 and the weak pressure-sensitive adhesive layer 3 can be held. The handleability of the agent layer 3 can be greatly improved. Therefore, the sheet unit 1 can be disposed on the jig 7 without using special equipment. Therefore, the working time can be reduced, the cost can be reduced, and the convenience can be enhanced.

In addition, in FIG. 1, although the sheet | seat unit 1 of the structure which has thickness increased in order of the adhesive layer 4, the base member 2, and the weak adhesive layer 3, these thickness is set arbitrarily. Can do. Details will be described later.
FIG. 2 is a first cross-sectional explanatory view showing a state in which the printed circuit board is attached to a jig using the printed wiring board sheet unit shown in FIG. This figure shows a state where the printed wiring board 8 and the jig 7 are bonded using a plurality of sheet units 1a to 1d (1) having different thicknesses. The thickness of the printed wiring board 8 shown in FIG. More specifically, the bottom surface 9c protrudes downward from the bottom surfaces 9a and 9d of the substrate 8, and the bottom surface 9b protrudes downward.

  Further, FIG. 7 is a comparative view with respect to FIG. This figure shows a state in which the printed circuit board 108 is attached to the jig 107 using only the weak adhesive layer 103. If comprised in this way, when arrange | positioning and adhere | attaching the weak adhesive layer 103 on the jig | tool 107, it is difficult to maintain the shape of the weak adhesive layer 103, and the bottom face 109a-109d (109) When a printed wiring board 108 having a different thickness is disposed, if a protrusion or a depression is generated on the surface of the weak adhesive layer 103, the flatness of the printed wiring board 108 cannot be ensured.

  On the other hand, the plurality of sheet units 1a to 1d shown in FIG. 2 are set to have substantially the same size as the bottom surfaces 9a to 9d of the printed wiring board 8 in plan view. In each of the sheet units 1a to 1d, the thicknesses of the pressure-sensitive adhesive layers 4a to 4d (4) and the weak pressure-sensitive adhesive layers 3a to 3d (3) are set to be substantially the same. On the other hand, in the sheet units 1a to 1d, the base members 2a to 2d (2) are set to have different thicknesses. As for the thickness of each base member 2a-2d, the base members 2a and 2d are the thickest, then the base member 2c, and finally the base member 2b are thinned in this order. That is, the thickness of each of the base members 2a to 2d is set so as to cancel the difference in thickness due to the bottom surfaces 9a to 9d of the printed wiring board 8.

  As described above, the sheet units 1a to 1d shown in FIG. 2 change the thickness of the sheet units 1a to 1d while setting the thicknesses of the weak adhesive layers 3a to 3d to be substantially the same. The substantially same adhesive force can be applied regardless of the bottom surfaces 9a to 9d. Therefore, deformation and distortion of the printed wiring board 8 due to the difference in adhesive force can be prevented. Further, the difference in thickness between the bottom surfaces 9 a to 9 d of the printed wiring board 8 is canceled by disposing the sheet units 1 a to 1 d having different thicknesses on the jig 7. For this reason, it becomes possible to ensure and hold the flatness of the surface of the printed wiring board 8, and to reduce the work load of the mounting process. As a result, the degree of freedom of design of the printed wiring board 8 can be increased and the reliability after the mounting process can be improved.

  FIG. 3 is a second cross-sectional explanatory view showing a state in which the printed circuit board is attached to a jig using the printed wiring board sheet unit shown in FIG. In the sheet units 1A to 1D shown in the figure, the thicknesses of the pressure-sensitive adhesive layers 4A to 4D (4) are set to be substantially the same. On the other hand, in the sheet units 1A to 1D, the base members 2A to 2D (2) and the weak adhesive layers 3A to 3D (3) are set to different thicknesses, and thus the weak adhesive layers 3A to 3D. The adhesive strength can be adjusted according to the thickness of the film. Therefore, even with a printed wiring board 8 having a complicated shape as shown in the figure, the mounting process can be performed in a stable posture. As a result, the degree of freedom of design of the printed wiring board 8 can be increased and the reliability after the mounting process can be improved.

  FIG. 4 is a third cross-sectional explanatory view showing a state in which the printed board is attached to a jig using the printed wiring board sheet unit shown in FIG. As shown in the figure, the printed wiring board 8 has a bottom surface 9b protruding downward from the bottom surfaces 9a and 9d. The jig 7 is formed with a counterbore 10 that can accommodate the bottom surface 9b of the printed wiring board 8 that is formed to protrude.

  FIG. 8 is a comparative view with respect to FIG. 4 and FIG. 5 described later, and is a cross-sectional explanatory view showing a state in which the printed circuit board is attached to the jig using only the weak adhesive layer. As shown in the figure, only by disposing the weak adhesive layer 103 on the surface of the jig 107, the adhesive force between the printed wiring board 108 and the jig 107 does not act on the spot portion 110, and the jig 107 is stable. There is a possibility that it may be difficult to perform the work.

  On the other hand, in the structure shown in FIG. 4, not only the weak adhesive layer 11 is disposed between the jig 7 and the printed wiring board 8, but also the sheet unit 1 b (1) is disposed in the counterbore portion 10. is doing. By doing so, an adhesive force can be applied between the substrate 8 and the jig 7 even at the spot portion 10 portion, and it is easy to perform a stable operation.

  FIG. 5 is a fourth cross-sectional explanatory view showing a state in which the printed board is attached to a jig using the printed wiring board sheet unit shown in FIG. As shown in the figure, the printed wiring board 8 has a bottom surface 9b protruding downward from the bottom surfaces 9a and 9d. On the other hand, the jig | tool 7 and the wiring board 8 are adhere | attached using the several sheet unit 1a, 1b, 1d from which thickness differs. In this way, in both cases where the counterbore 10 is formed on the jig 7 or not formed, an adhesive force can be applied between the jig 7 and the wiring board 8 to increase the degree of freedom in design. be able to.

FIG. 6 is a fifth cross-sectional explanatory view showing a state in which the printed board is attached to a jig using the printed wiring board sheet unit shown in FIG. This figure shows a case where the work is performed with the outer peripheral portion of the wiring board 8 exposed to the outside.
FIG. 9 is a cross-sectional explanatory view showing a state where the printed circuit board is attached to the jig using only the weak adhesive layer, and is a comparison view with respect to FIG. As shown in the figure, since it is difficult to maintain the shape with only the weak pressure-sensitive adhesive layer 103, if the protrusion 111 occurs on the surface of the weak pressure-sensitive adhesive layer 103, the flatness of the surface of the weak pressure-sensitive adhesive layer 103 is reduced. It cannot be ensured, and it becomes difficult to apply a sufficient adhesive force to the printed circuit board 108.

On the other hand, as shown in FIG. 6, when the printed circuit board 8 and the jig 7 are bonded via the sheet unit 1, the printed circuit board 8 can be held on substantially the entire surface of the weak adhesive layer 3. Therefore, the flatness of the printed circuit board 8 can be ensured.
Further, the printed wiring board 8 can be held on the jig 7 in a stable posture by bonding to the printed wiring board 8 through the weak adhesive layer 3. Therefore, the processing on the jig 7 can be easily performed. Furthermore, since the printed wiring board 8 can be easily peeled from the weak pressure-sensitive adhesive layer 3 after the above process is completed, the printed wiring board 8 can be quickly transferred to the next process. it can.

Needless to say, the content of the present invention is not limited to the above-described embodiment. For example, the pressure-sensitive adhesive layer 4 can be formed of a pressure-sensitive adhesive having a fluororesin or a silicone resin as a main component. Moreover, durability can also be improved by designing the adhesive layer 4 to a silicone resin type or acrylic resin with high heat resistance. Alternatively, using a rubber-based adhesive is advantageous in terms of cost. Moreover, you may comprise the adhesive layer 4 with a silicone resin or a fluororesin which has self-adhesiveness. In this case, the pressure-sensitive adhesive layer 4 has an adhesive force equivalent to that of the weak pressure-sensitive adhesive layer 3.
The material of the base member 2 is not limited to the glass epoxy material, and may be any material having a certain strength and durability such as an aluminum material, a stainless steel material, and a glass cloth. Moreover, although the case where the counterbore part 10 was formed in the jig | tool 7 was demonstrated, it is not restricted to this, For example, it can apply also to the jig | tool with which the hole was formed, the taper, the chamfering etc. it can.

It is sectional drawing of the sheet unit for printed wiring boards in embodiment of this invention. It is the 1st section explanatory view showing the state where the printed circuit board was attached to the jig using the printed wiring board sheet unit shown in FIG. It is the 2nd section explanatory view showing the state where the printed circuit board was attached to the jig using the printed wiring board sheet unit shown in FIG. FIG. 7 is a third cross-sectional explanatory diagram illustrating a state in which the printed circuit board is attached to a jig using the printed wiring board sheet unit illustrated in FIG. 1. It is the 4th section explanatory view showing the state where the printed circuit board was attached to the jig using the printed wiring board sheet unit shown in FIG. FIG. 10 is a fifth cross-sectional explanatory diagram illustrating a state in which the printed circuit board is attached to a jig using the printed wiring board sheet unit illustrated in FIG. 1. FIG. 4 is a cross-sectional explanatory view showing a state where a printed circuit board is attached to a jig using only a weak pressure-sensitive adhesive layer, and is a comparison view with respect to FIGS. 2 and 3. It is sectional explanatory drawing which shows the state which attached the printed circuit board to the jig | tool only using the weak adhesive layer, and is a comparison figure with respect to FIG. 4, FIG. FIG. 7 is a cross-sectional explanatory view showing a state in which a printed circuit board is attached to a jig using only a weak adhesive layer, and is a comparison view with respect to FIG.

Explanation of symbols

1 (1A-1D, 1a-1d) ... Printed wiring board sheet unit 2 (2A-2D, 2a-2d) ... Base member 3 (3A-3D, 3a-3d) ... Weak adhesive layer (second adhesive) Agent layer)
4 (4A to D, 1a to 1d) ... pressure-sensitive adhesive layer (first pressure-sensitive adhesive layer)

Claims (6)

A printed wiring board sealing unit that is interposed between a printed wiring board and a jig holding the printed wiring board and detachably connects the board and the jig,
A sheet-like base member;
A first pressure-sensitive adhesive layer formed on one surface of the base member;
A printed wiring board sheet unit, comprising: a second adhesive layer formed on the other surface of the base member and having an adhesive strength equal to or less than that of the first adhesive layer.   2. The printed wiring board sheet unit according to claim 1, wherein the base member is made of at least one of a glass epoxy material, a stainless steel material, an aluminum material, and a polyimide material.   The first pressure-sensitive adhesive layer is composed of an acrylic pressure-sensitive adhesive, a silicon pressure-sensitive adhesive, or a self-adhesive silicon resin or a fluororesin, and the second pressure-sensitive adhesive layer has a self-adhesive property. The sheet unit for printed wiring boards according to claim 1, wherein the sheet unit is made of silicon resin or fluorine resin. A board mounting method using the printed wiring board sheet unit according to any one of claims 1 to 3,
In a state of being bonded to the jig through the first pressure-sensitive adhesive layer,
Bonding to the printed wiring board through the second pressure-sensitive adhesive layer.   When holding a printed wiring board having a different thickness depending on the part to the jig, a plurality of sheet units having different thicknesses of the base member are arranged on the jig according to the part of the printed wiring board. The board mounting method according to claim 4, wherein the board mounting method is provided. When holding the printed wiring board having a different thickness depending on the part to the jig, a plurality of sheet units having different thicknesses of the second pressure-sensitive adhesive layer are attached to the jig according to the part of the printed wiring board. The board mounting method according to claim 4 or 5, wherein the board mounting method is provided on a tool.

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