JP2006244769A - Laminated sheet, manufacturing method of back substrate for plasma display panel, back substrate for the plasma display panel and the plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated sheet used for simultaneously and integrally forming a dielectric layer and a barrier rib, without generating cracks or the like, to provide a manufacturing method of a back substrate for a plasma display panel capable of markedly reducing manufacturing processes by using the laminated sheet and superior in production efficiency, to provide a back substrate for a plasma display panel manufactured by the method, and to provide a plasma display panel that uses the back substrate. <P>SOLUTION: This laminated sheet is so structured that a viscoelastic layer is stacked on one surface side of a glass resin composition layer, containing inorganic powder and a binder resin; and the weight reduction rate of the viscoelastic layer in baking it, until a baking temperature becomes 400°C is 96% or lower and is used for integrally forming the dielectric layer and the barrier rib on a glass substrate having electrodes. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a laminated sheet used for integrally forming a dielectric layer and a barrier rib, a method for producing a rear substrate for a plasma display panel using the laminated sheet, a rear substrate for a plasma display panel, and a plasma display panel.

  In recent years, plasma display panels (hereinafter also referred to as “PDPs”) have attracted attention as liquid crystal displays as thin flat large displays.

  FIG. 1 shows an example of a three-electrode surface discharge type PDP. In FIG. 1, a sustain electrode (display electrode) 2 made of a transparent conductive film is formed on a front glass substrate 1 serving as a display surface, and a bus electrode made of a narrow metal film that supplements conductivity is formed on the sustain electrode 2. 3 is formed. Further, a dielectric layer 4 is formed so as to cover the sustain electrode 2 and the bus electrode 3, and an MgO film (protective layer) 5 is formed so as to cover the dielectric layer 4.

  On the other hand, an address electrode (data electrode) 7 made of a metal film is formed on the rear glass substrate 6, and a dielectric layer 8 is formed on the address electrode 7. Barrier ribs 9 are formed between the address electrodes 7 to keep the distance between the front glass substrate 1 and the rear glass substrate 6 constant and to maintain a discharge space. Further, a phosphor layer 10 of three primary colors of red, green and blue is formed so as to cover the dielectric layer 8 and the barrier rib 9. A rare gas is sealed in the discharge space, and each intersection of the address electrode 7 and the sustain electrode 2 forms a pixel cell.

  As a method of forming the dielectric layer 8, a film-forming material layer is formed by directly applying a paste-like composition containing glass powder, a binder resin and a solvent to the surface of a glass substrate on which an electrode is fixed. The method of forming a dielectric material layer on the surface of the said glass substrate by baking a layer is mentioned. In addition, a paste-form composition containing glass powder, an acrylate resin and a solvent is applied onto a support film to form a film-forming material layer, and the film-forming material layer formed on the support film A method of forming a dielectric layer on the surface of the glass substrate by transferring the film forming material layer onto the surface of the fixed glass substrate and firing the transferred film forming material layer is disclosed (Patent Documents 1 to 4).

  The barrier rib 9 that holds the discharge space is required to be a high barrier in order to make the discharge space as large as possible to obtain high-luminance light emission, and usually requires a height of about 100 to 300 μm. Conventionally, the barrier rib 9 forms a glass resin composition layer by applying a glass paste on the dielectric layer 8 by screen printing using a printing plate for rib pattern formation, and repeating the drying step ten or more times. It was formed by sintering the glass resin composition layer. Here, when the film thickness per one time by the screen printing is increased, the peripheral portion of the coating film sags and causes a shape defect, so that the film thickness per time is about 10 to 30 μm. For this reason, the method for forming the barrier ribs requires the screen printing of the glass paste and the subsequent drying to be repeated, which has the problem that the formation accuracy of the barrier ribs is poor and the productivity is poor.

  As a method of solving the above problem, a dry glass paste film having a thickness of 100 to 300 μm in an uncured state and a dry photoresist film are laminated on a glass substrate, and the dry photoresist film is interposed through a rib pattern mask. Exposure and development. Thereafter, the dry glass paste film is sandblasted using the exposed and developed dry photoresist film as a mask to form a recess for forming a discharge space, and the dry photoresist film is removed and the dry glass paste film is baked. A method of forming a rib is disclosed (Patent Document 5).

  Further, the barrier forming layer is transferred onto a glass substrate from a transfer sheet having a barrier forming layer on the base film, a resist pattern is formed on the upper surface of the transferred barrier forming layer, and a barrier at the opening of the resist pattern is formed. The forming material is removed by sandblasting. Thereafter, a method is disclosed in which the remaining resist on the barrier forming material is peeled off and the barrier forming material is sintered by baking to form a barrier (Patent Document 6).

  In addition, a method for forming a barrier rib is disclosed in which a barrier rib adhesive sheet is attached to a rear glass substrate, pre-fired at 150 to 350 ° C., then formed into a barrier rib shape by sandblasting, and further fired at 400 to 750 ° C. (Patent Document 7).

  In addition, the transfer includes a base film, a transfer layer provided on the base film so as to be peelable, and a stress absorption layer provided on the transfer layer, and can form a highly accurate film thickness pattern such as a barrier. A sheet is disclosed (Patent Document 8).

  Further, a metal paste containing crystallized glass is formed on the substrate corresponding to the pattern of the address electrode, a low melting glass paste is formed on almost the entire surface of the substrate containing the metal paste, and the low melting glass paste is further formed on the low melting glass paste. A barrier material layer of low-melting glass is formed at a predetermined position, and then the metal paste, the low-melting glass paste, and the low-melting glass barrier material layer are fired at the same time, whereby an address electrode and a dielectric are formed on the substrate. A method for manufacturing a rear substrate for a plasma display panel, characterized in that a laminate of layers and barrier ribs is formed (Patent Document 9).

  Furthermore, a first step of forming a dielectric layer forming layer on the substrate, a second step of forming a barrier forming layer on the dielectric layer forming layer, and a third step of forming a resist pattern on the barrier forming layer The fourth step of removing the barrier forming layer at the opening of the resist pattern by sandblasting, the fifth step of removing the resist pattern on the barrier forming layer, and simultaneously sintering the dielectric layer forming layer and the barrier forming layer by firing A method for forming a plasma display panel comprising a sixth step is disclosed (Patent Document 10).

  However, the rib forming methods described in Patent Documents 5 to 7 are methods in which a dielectric layer is first formed on a rear glass substrate on which electrodes are fixed, and then a rib is formed on the dielectric layer. Two steps, a step of forming a body layer and a step of forming a rib, are essential. Although a certain degree of productivity improvement can be expected by the above rib forming method, the two steps of forming the dielectric layer and the step of forming the rib are essential as in the conventional case, so that the sufficient productivity improvement is not possible. I can't expect. Further, the transfer sheet described in Patent Document 8 is used to independently form an electrode pattern, a dielectric layer, or a barrier (barrier rib), and the dielectric layer and the barrier rib are simultaneously and integrally formed. It is not used to form.

  In addition, the manufacturing method of the rear substrate for PDP described in Patent Document 9 includes firing the metal paste, the low-melting glass paste, and the low-melting glass partition material layer at the same time, so that the address electrode, the dielectric layer, and the partition are formed on the substrate. Since a laminate can be formed, productivity can be improved to some extent. However, since a process of applying and drying a low-melting glass paste after electrode pattern formation and a process of forming a low-melting glass partition material on the low-melting glass paste are necessary, the manufacturing process is not greatly shortened. .

  In the method for forming a plasma display panel described in Patent Document 10, the dielectric layer and the barrier layer can be simultaneously formed on the substrate by simultaneously sintering the dielectric layer forming layer and the barrier forming layer. Therefore, productivity improvement can be expected to some extent. However, since the first step of forming the dielectric layer forming layer on the substrate and the second step of forming the barrier forming layer on the dielectric layer forming layer are required, the manufacturing process is not greatly shortened. Furthermore, when using a transfer sheet for forming a barrier forming layer, a plasticizer is added to the barrier forming layer forming material in order to improve the transferability of the sheet. In order to prevent the influence on the resist pattern and to improve the shape of the barrier forming layer, a process of removing the plasticizer by heating after transfer is necessary, and the manufacturing process becomes complicated.

  On the other hand, the present inventors have developed a laminated sheet used to simultaneously and integrally form a dielectric layer and a barrier rib on a glass substrate having electrodes in order to solve the above-described problems of the prior art ( Not disclosed at the time of filing.

However, when the dielectric layer and the barrier rib are formed simultaneously and integrally using the laminated sheet, there is a problem that a crack occurs in the dielectric layer.
JP-A-9-102273 Japanese Patent Laid-Open No. 11-35780 Japanese Patent Laid-Open No. 2001-185024 International Publication No. 00/42622 Pamphlet JP-A-8-222135 JP-A-8-273536 JP 11-185603 A JP 11-260250 A Japanese Patent Laid-Open No. 2003-223851 JP-A-10-144206

  The present invention solves such problems of the prior art, and provides a laminated sheet used for forming a dielectric layer and a barrier rib simultaneously and integrally without causing defects such as cracks. The purpose is to do. Moreover, it aims at providing the manufacturing method of the back substrate for plasma display panels which is excellent in the production efficiency which reduced the manufacturing process significantly by using this laminated sheet. Furthermore, it aims at providing the back substrate for plasma display panels manufactured by the said method, and the plasma display panel using this back substrate.

  As a result of intensive studies to solve the above problems, the present inventors have found that the above object can be achieved by the laminated sheet shown below, and have completed the present invention.

  That is, in the present invention, a viscoelastic layer is laminated on one side of a glass resin composition layer containing an inorganic powder and a binder resin, and the viscoelastic layer is fired until the firing temperature reaches 400 ° C. Is a laminated sheet used for integrally forming a dielectric layer and a barrier rib on a glass substrate having an electrode, the weight reduction rate of which is 96% or less.

  The laminated sheet preferably has a base film laminated on the other surface side of the glass resin composition layer. The laminated sheet preferably has a photoresist layer laminated between the glass resin composition layer and the base film.

  The manufacturing method of the back substrate for PDP of the present invention is a bonding step of bonding the viscoelastic layer of the laminated sheet according to claim 1 on a glass substrate having electrodes, and forming a resist pattern on the surface of the glass resin composition layer A pattern forming step, a sandblasting step of integrally forming a barrier rib forming partition and a dielectric layer forming film covering the electrode by sandblasting the glass resin composition layer in the opening of the resist pattern, and a barrier rib forming partition And a firing step of integrally forming the barrier rib and the dielectric layer by sintering the dielectric layer forming film.

  The manufacturing method of the back substrate for PDP of this invention is an electrode pattern formation process which forms the electrode pattern which consists of metal pastes on a glass substrate, The viscoelasticity of the lamination sheet of Claim 1 on the glass substrate which has an electrode pattern A bonding step of laminating layers, a pattern forming step of forming a resist pattern on the surface of the glass resin composition layer, a sandblast treatment of the glass resin composition layer in the opening of the resist pattern, and a barrier rib-forming partition wall; An electrode is formed by sintering a sandblasting process for integrally forming a dielectric layer forming film covering the electrode pattern, an electrode pattern, a barrier rib forming partition wall, and a dielectric layer forming film, and the barrier rib and the dielectric layer Including a baking step of integrally forming the substrate.

  Another manufacturing method of the back substrate for PDP of the present invention is a pasting step of bonding the viscoelastic layer of the laminated sheet according to claim 2 on a glass substrate having electrodes, a peeling step of peeling the base film from the laminated sheet, A pattern forming step of forming a resist pattern on the surface of the glass resin composition layer, a barrier rib-forming partition wall and a dielectric layer covering the electrode by sandblasting the glass resin composition layer at the opening of the resist pattern It includes a sand blasting process for integrally forming the film, and a firing process for integrally forming the barrier rib and the dielectric layer by sintering the barrier rib forming partition wall and the dielectric layer forming film.

  The manufacturing method of the back substrate for another PDP of the present invention includes an electrode pattern forming step of forming an electrode pattern made of a metal paste on a glass substrate, and the viscoelasticity of the laminated sheet according to claim 2 on the glass substrate having the electrode pattern. A step of attaching the layers, a peeling step of peeling the base film from the laminated sheet, a pattern forming step of forming a resist pattern on the surface of the glass resin composition layer, and a glass resin composition layer at the opening of the resist pattern. By sandblasting, the barrier rib forming partition and the dielectric layer forming film that covers the electrode pattern are integrally formed by a sand blasting process, the electrode pattern, the barrier rib forming partition, and the dielectric layer forming film are sintered. And a firing step of integrally forming the barrier rib and the dielectric layer. That.

  In the manufacturing method, in the pattern formation step, a photoresist layer and a pattern formation mask are stacked on the glass resin composition layer, and the photoresist layer is exposed and developed through the pattern formation mask to form a resist pattern. It is preferable that it is a process to perform.

  Another manufacturing method of the back substrate for PDP of the present invention includes a pasting step of bonding the viscoelastic layer of the laminated sheet according to claim 3 on a glass substrate having electrodes, a peeling step of peeling the base film from the laminated sheet, A pattern forming step of forming a resist pattern on the surface of the glass resin composition layer, a barrier rib-forming partition wall and a dielectric layer covering the electrode by sandblasting the glass resin composition layer at the opening of the resist pattern It includes a sand blasting process for integrally forming the film, and a firing process for integrally forming the barrier rib and the dielectric layer by sintering the barrier rib forming partition wall and the dielectric layer forming film.

  The manufacturing method of the back substrate for PDP of this invention is an electrode pattern formation process which forms the electrode pattern which consists of metal pastes on a glass substrate, The viscoelasticity of the lamination sheet of Claim 3 on the glass substrate which has an electrode pattern A step of attaching the layers, a peeling step of peeling the base film from the laminated sheet, a pattern forming step of forming a resist pattern on the surface of the glass resin composition layer, and a glass resin composition layer at the opening of the resist pattern. By sandblasting, the barrier rib forming partition and the dielectric layer forming film that covers the electrode pattern are integrally formed by a sand blasting process, the electrode pattern, the barrier rib forming partition, and the dielectric layer forming film are sintered. And a firing step of integrally forming the barrier rib and the dielectric layer. That.

  In the above manufacturing method, the pattern formation step is preferably a step of laminating a pattern formation mask on the photoresist layer and exposing and developing the photoresist layer through the pattern formation mask to form a resist pattern. .

  In the manufacturing method of the back substrate for PDP of this invention, it is preferable to include the process of removing the resist pattern on a glass resin composition layer between a sandblasting process and a baking process.

  The present invention also relates to a PDP rear substrate manufactured by the above method.

  The present invention further relates to a PDP using the PDP back substrate.

  Hereinafter, the present invention will be described in detail.

  As shown in FIG. 2, the laminated sheet of the present invention is a glass in which a viscoelastic layer 12 is laminated on one side of a glass resin composition layer 11 containing an inorganic powder and a binder resin, and has an electrode. It is used to integrally form a dielectric layer and barrier ribs on a substrate. The laminated sheet of the present invention preferably has a base film 13 on the other surface side of the glass resin composition layer 11. By using the base film 13, the glass resin composition layer 11 can be easily formed. Moreover, since a lamination sheet can be collectively transferred onto the glass substrate surface which has an electrode or an electrode pattern (what turns into an electrode by sintering), it is preferable. The laminated sheet of the present invention preferably has a protective film 14 on the surface of the viscoelastic layer 12. By providing the protective film 14, a laminated sheet can be preserve | saved and supplied in the state wound up by roll shape.

  Furthermore, in the laminated sheet of the present invention, as shown in FIG. 3, a photoresist layer 15 may be laminated between the glass resin composition layer 11 and the base film 13. By providing the photoresist layer 15 on one side of the glass resin composition layer 11 in advance, the pattern forming process for forming a resist pattern on the surface of the glass resin composition layer 11 can be simplified.

  The glass resin composition layer 11 contains at least inorganic powder and a binder resin.

  Known inorganic powders can be used without particular limitation, and specific examples include silicon oxide, titanium oxide, aluminum oxide, calcium oxide, boron oxide, zinc oxide, and glass powder. The average particle size of the inorganic powder is preferably 0.1 to 30 μm.

In the present invention, glass frit is preferably used as the inorganic powder. Any known glass frit can be used without particular limitation. For example, 1) a mixture of zinc oxide, boron oxide, silicon oxide (ZnO—B ₂ O ₃ —SiO ₂ system), 2) zinc oxide, boron oxide, silicon oxide, aluminum oxide (ZnO—B ₂ O ₃ —SiO ₂₎ mixture of -al ₂ O ₃ system), 3) lead oxide, boron oxide, silicon oxide, a mixture of calcium oxide _{(PbO-B 2 O 3 -SiO} 2 -CaO -based), 4) lead oxide, boron oxide, silicon oxide , A mixture of aluminum oxide (PbO—B ₂ O ₃ —SiO ₂ —Al ₂ O ₃ system), 5) lead oxide, zinc oxide, boron oxide, silicon oxide (PbO—ZnO—B ₂ O ₃ —SiO ₂ system) 6) A mixture of lead oxide, zinc oxide, boron oxide, silicon oxide, aluminum oxide (PbO—ZnO—B ₂ O ₃ —SiO ₂ —Al ₂ O ₃ series), and the like. Further, if necessary, Na ₂ O, CaO, BaO, Bi ₂ O ₃ , SrO, TiO ₂ , CuO, or In ₂ O ₃ may be added thereto. The glass frit used preferably has a low melting point that is unlikely to be distorted due to the difference in thermal expansion coefficient with the glass substrate during sintering and can be sintered at a temperature that does not cause deformation of the glass substrate. Considering that the dielectric layer and the barrier rib are integrally formed by a sintering process, a glass frit having a softening point of 400 to 650 ° C. is preferable.

  The binder resin is not particularly limited and known ones can be used, but the dispersibility of the inorganic powder is good, the cohesiveness of the glass resin composition layer can be improved, and it is completely removed by thermal decomposition in the firing step. Are preferred. Specific examples include (meth) acrylic resins, cellulose resins, polyvinyl acetal resins, polyvinyl alkyl ether resins, and polyvinyl acetate derivative resins.

  The (meth) acrylic resin is a polymer of one type of acrylic monomer or methacrylic monomer, a copolymer of the monomer, or a mixture thereof. Specific examples of the monomer include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl ( (Meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) Alkyl (meth) such as acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate Acrylate, phenyl (meth) acrylate, aryl (meth) acrylates such as tolyl (meth) acrylate.

  Moreover, you may use the (meth) acrylic-type monomer which has polar groups, such as a hydroxyl group and a carboxyl group. Specific examples of the (meth) acrylic monomer having the polar group include (meth) acrylic acid, itaconic acid, (meth) acrylamide, N-methylol (meth) acrylamide, 2-hydroxyethyl (meth) acrylate, 2- Hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, polyethylene glycol mono (meth) acrylate 2- (meth) acryloyloxyethyl succinic acid, 2- (meth) acryloyloxyethyl phthalic acid, iminol (meth) acrylate and the like.

  Cellulose resins include cellulose esters such as cellulose acetate and cellulose butyrate, methyl cellulose, ethyl cellulose, hydroxyethyl cellulose, carboxymethyl cellulose, and the like.

  Examples of the polyvinyl acetal resin include polyvinyl formal and polyvinyl butyral, examples of the polyvinyl alkyl ether resin include polyvinyl methyl ether, and examples of the polyvinyl acetate derivative resin include polyvinyl acetate and polyvinyl alcohol.

  The binder resin is preferably added in an amount of 10 parts by weight or less, more preferably 8 parts by weight or less, and particularly preferably 5 parts by weight or less with respect to 100 parts by weight of the inorganic powder. When the added amount of the binder resin exceeds 10 parts by weight, the hardness of the glass resin composition layer is lowered, so that it becomes difficult to cut the glass resin composition layer in the sand blasting process, thereby reducing the efficiency of the sand blasting process. Therefore, it tends to be difficult to form a highly accurate barrier rib. Further, the binder resin is preferably added in an amount of 0.3 parts by weight or more, more preferably 0.5 parts by weight or more, and particularly preferably 0.7 parts by weight or more with respect to 100 parts by weight of the inorganic powder. . When the addition amount of the binder resin is less than 0.3 parts by weight, it tends to be difficult to form the glass paste composition into a sheet shape.

  When preparing a transfer sheet in which a composition containing an inorganic powder and a binder resin is applied on a base film (support film) to form a glass resin composition layer, the transfer sheet can be uniformly applied on the base film. It is preferable to add a solvent to the composition.

  The solvent is not particularly limited as long as it has good affinity with inorganic powder and good solubility with binder resin. For example, terpineol, dihydro-α-terpineol, dihydro-α-terpinyl acetate, butyl carbitol acetate, butyl carbitol, isopropyl alcohol, benzyl alcohol, turpentine oil, diethyl ketone, methyl butyl ketone, dipropyl ketone, cyclohexanone N-pentanol, 4-methyl-2-pentanol, cyclohexanol, diacetone alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl Ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether , N-butyl acetate, amyl acetate, methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether acetate, ethyl-3-ethoxypropionate, 2,2,4-trimethyl-1,3-pentanediol-1 -Isobutyrate, 2,2,4-trimethyl-1,3-pentanediol-3-isobutyrate and the like. These may be used alone or in combination of two or more at any ratio.

  The amount of the solvent added is preferably 10 to 100 parts by weight with respect to 100 parts by weight of the inorganic powder.

  Moreover, you may add a plasticizer to a glass resin composition layer. By adding a plasticizer, the flexibility and flexibility of a transfer sheet in which a composition containing an inorganic powder and a binder resin is coated on a base film to form a glass resin composition layer, the glass resin composition layer The transfer property to the glass substrate can be adjusted.

  As the plasticizer, known ones can be used without particular limitation. For example, adipic acid derivatives such as diisononyl adipate, di-2-ethylhexyl adipate, dibutyl diglycol adipate, azelaic acid derivatives such as di-2-ethylhexyl azelate, sebacic acid derivatives such as di-2-ethylhexyl sebacate , Trimellitic acid derivatives such as tri (2-ethylhexyl) trimellitate, trioctyl trimellitate, triisononyl trimellitate, triisodecyl trimellitate, pyromellitic acid derivatives such as tetra- (2-ethylhexyl) pyromellitate, Examples include oleic acid derivatives such as propylene glycol monooleate and glycol plasticizers such as polyethylene glycol and polypropylene glycol.

  The addition amount of the plasticizer is preferably 5 parts by weight or less, more preferably 3 parts by weight or less, and particularly preferably 1 part by weight or less with respect to 100 parts by weight of the inorganic powder. When the addition amount of the plasticizer exceeds 5 parts by weight, the strength and hardness of the glass resin composition layer to be obtained are lowered, and it is difficult to cut the glass resin composition layer in the sandblast treatment, which is not preferable.

  In addition to the above components, various additives such as a dispersant, a silane coupling agent, a tackifier, a leveling agent, a stabilizer, and an antifoaming agent may be added to the glass resin composition layer. Further, a black pigment or a white pigment may be added in order to reduce external light reflection of the formed barrier rib and improve contrast.

  The viscoelastic layer 12 has a function of imparting flexibility to the laminated sheet to improve the transferability of the laminated sheet, a function of holding the glass resin composition layer 11 on a glass substrate having an electrode or an electrode pattern, and a glass resin. This is a layer having a function of forming a thin dielectric layer forming film covering the electrode or the electrode pattern on the glass substrate by sandblasting the composition layer 11.

  In the present invention, the viscoelastic layer needs to have a weight reduction rate of 96% or less when fired until the firing temperature reaches 400 ° C. When the weight reduction rate exceeds 96%, the barrier rib forming partition walls and the dielectric layer forming film are likely to be distorted during firing, and the dielectric layer is likely to be cracked. The reason is that the barrier rib-forming partition walls and dielectrics are affected by the structural change because the underlying viscoelastic layer is thermally decomposed and removed before the inorganic powder that forms the barrier rib-forming partition walls and dielectric layer forming film is softened. This is probably because the layer formation film cannot sufficiently follow. The weight reduction rate is preferably 60% or more. If it is less than 60%, the viscoelastic layer is hardly thermally decomposed and removed during firing, so that organic components remain on the glass substrate after firing, and the quality of the back substrate for PDP may be deteriorated.

  The material for forming the viscoelastic layer of the present invention is not particularly limited as long as the material satisfies the above characteristics. For example, various materials such as an acrylic adhesive, a synthetic rubber adhesive, a natural rubber adhesive, and a silicone adhesive are used. The pressure-sensitive adhesive composition (pressure-sensitive adhesive) or a heat-sensitive adhesive that does not exhibit tackiness at room temperature but exhibits tackiness upon heating can be used.

  The acrylic pressure-sensitive adhesive uses an acrylic polymer as a base polymer, and various types of alkyl acrylate can be used as a monomer used in the acrylic polymer. For example, acrylic acid alkyl ester (for example, methyl ester, ethyl ester, propyl ester, butyl ester, 2-ethylhexyl ester, isooctyl ester, isononyl ester, isodecyl ester, dodecyl ester, lauryl ester, tridecyl ester, pentadecyl C1-C20 alkyl ester such as ester, hexadecyl ester, heptadecyl ester, octadecyl ester, nonadecyl ester, eicosyl ester, etc.), and these can be used alone or in combination.

  Further, together with the alkyl acrylate, methacrylic acid alkyl ester; carboxyl group-containing monomers such as (meth) acrylic acid and itaconic acid; hydroxyl groups such as hydroxyethyl (meth) acrylate and hydroxypropyl (meth) acrylate Containing monomer; Amide group-containing monomer such as N-methylolacrylamide; Cyano group-containing monomer such as (meth) acrylonitrile; Epoxy group-containing monomer such as glycidyl (meth) acrylate; Vinyl acetate and the like Vinyl esters; styrene monomers such as styrene and α-methylstyrene can be used as copolymerization monomers. In particular, an acrylic copolymer monomer is preferably used in order to reduce the weight reduction rate to 96% or less. In addition, the polymerization method in particular of (meth) acrylic-type polymer is not restrict | limited, Well-known polymerization methods, such as solution polymerization, emulsion polymerization, suspension polymerization, and UV polymerization, are employable.

Examples of the base polymer of the rubber adhesive include natural rubber, isoprene rubber, styrene-butadiene rubber, recycled rubber, polyisobutylene rubber, styrene-isoprene-styrene rubber, and styrene-butadiene-styrene rubber. Etc.
Examples of the base polymer of the silicone pressure-sensitive adhesive include dimethylpolysiloxane and diphenylpolysiloxane.

  Examples of the base polymer of the heat sensitive adhesive include cellulose resin, ethylene-vinyl acetate copolymer, polyvinyl alcohol, butyral resin, polyester resin, polyethylene resin, polypropylene resin, butadiene-styrene copolymer, and the like.

  The weight average molecular weight of the base polymer is preferably 600 to 1,200,000 in order to provide transferability and appearance retention of the viscoelastic layer.

  A crosslinking agent can be added to the pressure-sensitive adhesive. Examples of the crosslinking agent include polyisocyanate compounds, polyamine compounds, melamine resins, urea resins, and epoxy resins. Furthermore, a tackifier, a plasticizer, a filler, an antioxidant, an ultraviolet absorber, a silane coupling agent and the like can be appropriately used for the pressure-sensitive adhesive as necessary.

  The production method of the laminated sheet of the present invention is not particularly limited. For example, first, a composition containing an inorganic powder and a binder resin is applied onto the base film 13, and the solvent is removed by drying to form the glass resin composition layer 11. Form. Thereafter, a laminated sheet can be produced by directly applying a pressure-sensitive adhesive (adhesive) to the glass resin composition layer 11 and drying to form a viscoelastic layer (direct copying method). Alternatively, a viscoelastic layer 12 formed by applying a pressure-sensitive adhesive (adhesive) to a release liner and drying may be transferred and laminated on the glass resin composition layer 11 (transfer method). Alternatively, a viscoelastic layer 12 formed by applying a pressure-sensitive adhesive (adhesive) to the protective film 14 and drying may be bonded to the glass resin composition layer 11.

  Further, the glass resin composition layer 11 is formed on the release liner, and then the release liner is released. The viscoelastic layer 12 formed on the protective film is bonded to the surface of the glass resin composition layer 11 from which the release liner has been peeled, and the base film 13 is bonded to the other surface of the glass resin composition layer 11. A laminated sheet may be manufactured. The production method is effective when a photoresist layer is formed by bonding a dry film resist to the surface of the glass resin composition layer 11.

  The base film 13 is preferably a resin film having heat resistance and solvent resistance and having flexibility. When the base film has flexibility, a paste-like composition that is a material for forming the glass resin composition layer can be applied by a roll coater or the like, and the laminated sheet is stored in a rolled state, Can be supplied.

  Examples of the resin forming the base film 13 include polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, polyfluoroethylene, and other fluorine-containing resins, nylon, and cellulose. .

  The thickness of the base film 13 is not particularly limited, but is preferably about 25 to 100 μm.

  The surface of the base film 13 is preferably subjected to a mold release process. Thereby, the peeling operation of a base film can be easily performed in the process of transferring a lamination sheet on a glass substrate.

  Examples of a method for applying a paste-like composition, which is a material for forming a glass resin composition layer, on a base film include, for example, roll coaters such as gravure, kiss, and comma, die coaters such as slots and phantoms, A coating method such as a squeeze coater or a curtain coater can be adopted, but any method can be used as long as a uniform coating film can be formed on the base film.

  The thickness of the glass resin composition layer varies depending on the content of the inorganic powder, the type and size of the panel, the size of the discharge space (height of the barrier rib), etc., but is preferably 50 to 400 μm, more preferably. Is 80-300 μm.

  A protective film 14 may be provided on the surface of the viscoelastic layer 12. Examples of the material for forming the protective film include polyethylene terephthalate, polyester, polyethylene, and polypropylene. The laminated sheet covered with the protective film can be stored and supplied in a state of being rolled up. The surface of the protective film is preferably subjected to a mold release treatment.

  Although the thickness in particular of the protective film 14 is not restrict | limited, It is preferable that it is about 25-100 micrometers.

  As a method for applying a pressure-sensitive adhesive (adhesive), which is a material for forming the viscoelastic layer, onto the glass resin composition layer, the release liner, or the protective film, the above-described application method can be employed, but a uniform coating film Any method may be used as long as it can be formed.

  The thickness (dry film thickness) of the viscoelastic layer 12 is required for holding force (adhesive force) required to hold the glass resin composition layer on the glass substrate having the electrode, and for covering the electrode. Although it is appropriately determined according to the thickness of the dielectric layer forming film, it is usually preferably 0.5 to 20 μm, more preferably 1 to 10 μm, and particularly preferably 1 to 5 μm. When the thickness of the viscoelastic layer is less than 0.5 μm, the adhesive force is not sufficient, and therefore, when the laminated sheet is bonded to the glass substrate, peeling or floating tends to occur. Further, the flexibility of the laminated sheet becomes insufficient, and the transferability of the laminated sheet tends to decrease. Further, since the viscoelastic layer does not have sufficient viscoelasticity, the glass resin composition layer is cut more than necessary in the sandblasting process, and the thickness of the dielectric layer forming film becomes too thin. The thickness of the dielectric layer obtained by sintering tends to be insufficient, and desired dielectric properties tend not to be ensured. On the other hand, when the thickness of the viscoelastic layer exceeds 20 μm, organic components remain on the glass substrate after firing, and the quality of the back substrate for PDP tends to deteriorate. Moreover, since the intensity | strength of a viscoelastic layer becomes low, when bonding a laminated sheet to a glass substrate, it exists in the tendency for a bonding position to shift | deviate easily. Furthermore, since the viscoelasticity of the viscoelastic layer is increased, the glass resin composition layer tends to be difficult to be cut in the sandblast treatment. Therefore, it is difficult to form a high barrier rib (to ensure a sufficient discharge space), and the cutting efficiency of the glass resin composition layer tends to deteriorate.

  In the laminated sheet of the present invention, a photoresist layer 15 may be laminated between the glass resin composition layer 11 and the base film 13. The photoresist layer is used to form a resist pattern on the glass resin composition layer that cannot be removed by sandblasting by photolithography. The photoresist layer 15 is formed by applying and drying a paste composition containing a photosensitive resin on the base film 13 or the glass resin composition layer 11 or attaching a dry film that is a sheet-like photosensitive resin. It can be formed by combining them.

  A method for producing a PDP rear substrate using the laminated sheet will be described below. FIG. 4 is a production process diagram showing an example of a method for producing a PDP rear substrate according to the present invention.

  (1) in FIG. 4 is a diagram showing a structure of a glass substrate with an electrode in which an electrode 16a or an electrode pattern 16b is formed on the glass substrate 17. FIG. The method in particular of forming the electrode pattern 16b on the glass substrate 17 is not restrict | limited, A well-known method is employable. For example, a metal paste, which is an electrode forming material, is applied to a glass substrate by a screen printing method, and an electrode pattern is formed by applying a metal paste on a glass substrate by a known coating method and a photolithography method. The method of forming is mentioned. As the metal paste, conventionally used materials can be used without particular limitation, and examples thereof include a mixture of a metal serving as an electrode, an organic binder, an organic solvent, a low-melting glass powder, and the like. Examples of the metal include silver, copper, aluminum, and chromium. Examples of the organic binder include (meth) acrylic resins, vinyl resins, and cellulose resins.

  The method in particular of forming the electrode 16a on the glass substrate 17 is not restrict | limited, A well-known method is employable. For example, after forming an electrode pattern on a glass substrate by the above method, a method of forming an electrode by sintering the electrode pattern, a metal film is formed by a film formation method such as CVD or sputtering, an etching method or a lift-off method There is a method of patterning to form an electrode.

  Step (a) is a pasting step in which the viscoelastic layer 12 of the laminated sheet is bonded onto the glass substrate 17 having the electrode 16a or the electrode pattern 16b. In the case of the transmissive PDP, the electrode is a display electrode, and in the case of the reflective PDP, the electrode is an address electrode. When the said laminated sheet has a protective film, after peeling a protective film, a viscoelastic layer is bonded together. After laminating the viscoelastic layer, when the laminated sheet has a base film, the base film is peeled off from the laminated sheet and transferred. The transfer conditions are, for example, a laminator surface temperature of 25 to 100 ° C., a roll linear pressure of 0.5 to 15 kg / cm, and a moving speed of 0.1 to 5 m / min, but are not limited to these conditions. The glass substrate may be preheated, and the preheating temperature is about 50 to 150 ° C.

  Steps (b) to (d) are pattern forming steps for forming a resist pattern on the surface of the glass resin composition layer 11. Step (b) is a step of laminating a photoresist layer 15 on the surface of the glass resin composition layer 11. The photoresist layer can be formed by applying a paste composition containing a photosensitive resin on the surface of the glass resin composition layer and drying it, or by laminating a dry film resist. However, when a laminated sheet in which a photoresist layer is previously laminated on the glass resin composition layer is used, the step (b) is unnecessary. The photoresist layer may be positive or negative. In the case of the positive type, the exposed portion is removed by development. In the case of the negative type, the unexposed portion is removed by development. The manufacturing process diagram of the back substrate for PDP in FIG. 4 illustrates the case where a negative type photoresist is used. In order to prevent the glass resin composition layer from being adversely affected during resist development, it is preferable to use a water development type or alkaline aqueous solution development type photoresist.

  Step (c) is a step of overlaying the pattern forming mask 18 on the photoresist layer 15 and exposing the photoresist layer 15 through the pattern forming mask 18.

  Step (d) is a step of developing the photoresist layer 15 to form a resist pattern. By developing, an unexposed part is removed and an exposed part remains. As described above, the resist pattern can be formed on the surface of the glass resin composition layer by the steps (b) to (d), but it is also possible to directly pattern the surface of the glass resin composition layer by screen printing. In that case, steps (b) to (d) are unnecessary. However, when patterning is performed with a large area and high accuracy, it is preferably formed by a photolithography method.

  Step (e) is a sandblasting step of integrally forming the barrier rib-forming partition wall 19 and the dielectric layer forming film 20 covering the electrode or electrode pattern by sandblasting the glass resin composition layer at the opening of the resist pattern. It is. Sandblasting is a method for forming barrier ribs in general. Specifically, a resist pattern that cannot be cut by sandblasting is formed on a glass resin composition layer, and alumina and glass beads are formed on the entire surface of the glass resin composition layer. This is a method of forming barrier rib partition walls by cutting a glass resin composition layer not covered with a resist pattern by spraying fine powder (abrasive material) such as calcium carbonate.

  In the present invention, a viscoelastic layer is provided between the glass resin composition layer and the glass substrate having the electrode or electrode pattern, and the barrier rib-forming partition and the electrode or electrode pattern are covered by the characteristics of the viscoelastic layer. The dielectric layer forming film can be integrally formed. As described above, in the production of the conventional PDP rear substrate, the electrode on the glass substrate is first coated with the dielectric layer, and then the barrier rib is formed on the dielectric layer. That is, since the formation of the dielectric layer and the formation of the barrier ribs were performed separately, the manufacturing process was long and the production efficiency was very poor. According to the manufacturing method of the present invention, the barrier rib forming partition wall and the dielectric layer forming film can be integrally formed at the same time, so that the manufacturing process can be greatly reduced and the production efficiency can be improved. is there. The reason why such a remarkable effect appears is not clear, but the following reasons can be considered.

  In other words, at the initial stage of the sandblast treatment, the surface of the glass resin composition layer to be cut is hard, brittle, and hardly elastic (no cushioning property). The entire layer cannot be absorbed, and the impact energy is concentrated on the contact portion of the glass resin composition layer surface with the abrasive. Therefore, it is considered that the glass resin composition layer is well cut at the initial stage of the sandblast treatment. However, as the final stage of the sandblasting process is approached, the impact energy of the abrasive is dispersed due to the viscoelastic (cushioning) viscoelastic layer under the thin glass resin composition layer. And the impact energy of the contact part with the abrasive | polishing agent of the glass resin composition layer surface will be relieved. Therefore, it is considered that the glass resin composition layer is difficult to cut, and a thin film to be a dielectric layer forming film is formed.

  The spray pressure of the abrasive in the sandblasting treatment is not particularly limited, but it is 0.05 to 0.2 MPa from the viewpoint of forming cutting efficiency and high-precision barrier rib-forming partition walls and a dielectric layer-forming film having a suitable thickness. It is preferable that it is 0.08 to 0.15 MPa.

  The height of the barrier rib-forming partition wall is not particularly limited, but is usually 50 to 400 μm, preferably 80 to 300 μm. Moreover, although the line width of the upper part of the barrier rib-formed partition wall is not particularly limited, it is usually 30 to 100 μm, and preferably 30 to 70 μm.

  The thickness of the dielectric layer forming film covering the electrode or electrode pattern is not particularly limited, but is preferably 1 to 30 μm, more preferably 5 to 20 μm in consideration of the thickness of the dielectric layer after sintering. is there.

  Step (f) is a step of removing the resist pattern on the glass resin composition layer. The method for removing the resist pattern is not particularly limited, and a known method can be adopted. For example, a peeling method using a peeling solution and a peeling method may be mentioned. In the present invention, the resist pattern may be thermally decomposed and removed when the barrier rib-forming partition wall and the dielectric layer-forming film are sintered, but it is preferably removed in advance before the firing step.

  Step (g) is a firing step in which the barrier rib 21 and the dielectric layer 22 are integrally formed by sintering the barrier rib forming partition wall 19 and the dielectric layer forming film 20 formed by the above method. When the electrode pattern 16b is formed on the glass substrate, when the barrier rib-forming partition wall 19 and the dielectric layer forming film 20 are sintered, the electrode pattern 16b is simultaneously sintered to form the electrode 16a. According to the production method of the present invention, the electrode, the barrier rib, and the dielectric layer can be formed by a single firing step, and thus the production efficiency is extremely excellent.

  If the barrier rib and the dielectric layer covering the electrode can be integrally formed, the sintering method is not particularly limited, and a known method can be adopted. For example, by disposing a glass substrate having a barrier rib-forming partition wall, a dielectric layer forming film, a viscoelastic layer, and an electrode or an electrode pattern created by the above method in an atmosphere of 200 to 450 ° C., preferably 300 to 420 ° C. If there is a barrier rib-forming partition wall, dielectric layer-forming film, and organic material (binder resin, residual solvent, various additives, etc.), viscoelastic layer, and resist pattern in the electrode pattern, the resist is thermally decomposed and removed. . Thereafter, the inorganic powder in the barrier rib forming partition walls and the dielectric layer forming film is melted and sintered at 450 to 600 ° C., preferably 540 to 585 ° C. When the electrode pattern contains an inorganic powder such as a low melting glass powder, it is simultaneously melted and sintered.

  Thereby, on the glass substrate which has an electrode, the barrier rib which consists of inorganic sintered bodies, and a dielectric material layer are integrally formed by the same process. The dielectric layer completely covers the electrodes on the glass substrate and has no defects such as cracks.

  The thickness of the dielectric layer covering the electrode is not particularly limited, but is preferably 1 to 20 μm, more preferably 5 to 10 μm. When the thickness of the dielectric layer covering the electrode is less than 1 μm, desired dielectric characteristics tend not to be ensured. On the other hand, when the thickness exceeds 20 μm, the discharge space becomes small and the luminance tends to decrease.

  The height of the barrier rib after firing is not particularly limited, but is usually 50 to 300 μm, preferably 80 to 200 μm.

  The rear substrate for PDP of the present invention is then manufactured by forming a phosphor layer on the barrier rib and the dielectric layer. The manufacturing method of the back substrate for PDP can be applied to manufacturing all types of back substrates for PDP provided with barrier ribs and dielectric layers.

  The PDP rear substrate can be suitably used for a surface discharge type or a counter discharge type AC type PDP.

  Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited thereto.

(Measurement of weight average molecular weight)
The weight average molecular weight of the produced polymer was measured by GPC (gel permeation chromatography) and converted by standard polystyrene.
GPC device: manufactured by Tosoh Corporation, HLC-8220GPC
Column: manufactured by Tosoh Corporation, TSKgel Super HZM-H, H-RC, HZ-H
Flow rate: 0.6ml / min
Concentration: 0.2 wt%
Injection volume: 20 μl
Column temperature: 40 ° C
Eluent: THF
(Measurement of weight loss rate of viscoelastic layer)
The weight loss rate (%) of the produced viscoelastic layer was raised from room temperature to 400 ° C. under a condition of 10 ° C./min using a TG-DTA measuring device (TG / DTA 220, manufactured by SSI Technology). The value at was measured.

Example 1
[Creation of glass resin composition layer]
100 parts by weight of glass frit (RFW-401C, manufactured by Asahi Glass Co., Ltd.), 2.5 parts by weight of polyvinyl butyral (Denka butyral, degree of polymerization: about 2000, PVB ratio = about 80%), and trioctyl trimellitic acid as a plasticizer (TOTM) 0.3 part by weight is added to 35 parts by weight of a solvent (mixed solvent of α-terpineol / n-butyl carbitol acetate = 9/1 (weight ratio)) and preliminarily used with a disper (rotary propeller type stirrer). After dispersion, the dispersion was performed using a three-roll disperser to prepare a uniformly mixed glass paste composition. The prepared glass paste composition is applied on a base film obtained by subjecting a polyethylene terephthalate (PET) film to a release agent treatment, and the solvent is removed by drying the coating film at 140 ° C. for 5 minutes. A glass resin composition layer (thickness: 160 μm) was formed. Thereafter, a protective film (PET) was covered on the glass resin composition layer to prepare a glass resin composition layer with a film, which was wound into a roll.

(Creation of viscoelastic layer)
The monomer weight composition ratio is butyl acrylate / acrylic acid = 100/5, and a crosslinking agent (Coronate L, manufactured by Nippon Polyurethane Co., Ltd.) is added to an ethyl acetate solution containing 40% by weight of an acrylic copolymer having a weight average molecular weight of 1,000,000. An acrylic pressure-sensitive adhesive composition was prepared by adding 05 parts by weight. The prepared acrylic pressure-sensitive adhesive composition is applied on a release liner (protective film) obtained by subjecting a polyethylene terephthalate (PET) film to a release agent treatment, and the coating film is dried at 80 ° C. for 3 minutes. Thus, the solvent was removed to form a viscoelastic layer (thickness: 10 μm, weight reduction rate: 82%) made of an acrylic pressure-sensitive adhesive. Thereafter, a viscoelastic layer with a film was formed by covering a protective film (PET) on the viscoelastic layer, and the film was wound into a roll.

[Creation of laminated sheet]
The protective film was peeled off from the glass resin composition layer with a film. Moreover, the protective film was peeled from the viscoelastic layer with a film. Then, the glass resin composition layer and the viscoelastic layer on the release surface are overlapped so as to come into contact with each other, and are pressure-bonded using a roll laminator, and consist of a base film, a glass resin composition layer, a viscoelastic layer, and a protective film. A laminated sheet was created.

[Creation of rear substrate for PDP]
The laminated sheet was cut into a predetermined size, and the protective film was peeled off. And the viscoelastic layer of this lamination sheet was piled up on the glass substrate (Asahi Glass Co., Ltd. product, PD200) which has an electrode, and it crimped | bonded using the roll-type laminator. Then, the laminated sheet which consists of a glass resin composition layer and a viscoelastic layer was transcribe | transferred by peeling a base film, and the glass substrate with a laminated sheet was created.

  Then, as a photoresist layer, a dry film resist (manufactured by Tokyo Ohka Kogyo Co., Ltd., Audil series) was laminated on the glass resin composition layer of the glass substrate with a laminated sheet using a heat roll. Next, a pattern forming mask having a line width of 50 μm and a pitch of 300 μm was aligned and laminated on the glass resin composition layer, and the photoresist layer was exposed to ultraviolet rays through the pattern forming mask.

  After the exposure, development was performed with a sodium carbonate developer to remove the unexposed resist. Next, the glass resin composition layer at the opening of the resist pattern is sandblasted (abrasive: calcium carbonate particles # 600, spraying pressure: 0.04 MPa) to form barrier rib-forming partition walls and dielectric layer-forming film (thickness: 10 μm). Thereafter, the resist on the glass resin composition layer was peeled off from the end. Glass frit did not adhere to the resist, and the surface of the glass resin composition layer was flat. The line width in the upper part of the barrier rib-formed partition wall was 50 μm and the height was 160 μm.

  Next, the glass substrate on which the barrier rib forming partition walls and the dielectric layer forming film are formed is placed in a firing furnace, and is baked at a furnace temperature of 400 ° C. for 30 minutes, and the organic material in the barrier rib forming partition walls and the dielectric layer forming film is baked. (Binder resin, residual solvent, various additives, etc.) and the viscoelastic layer were pyrolyzed and removed. Thereafter, the glass frit was melted and sintered by firing at 560 ° C. for 30 minutes. As a result, barrier ribs (line width at the top: 40 μm, height: 110 μm) and a dielectric layer (thickness of the covering portion of the electrode: 7 μm) were integrally formed on the glass substrate. When the surface of the produced back substrate for PDP was observed with a microscope (Japan Hightech Co., magnification: 200 times), the dielectric layer had no defects such as cracks.

Comparative Example 1
In the preparation of the viscoelastic layer of Example 1, the monomer composition was butyl acrylate / acrylic acid = 100/5, and instead of the acrylic copolymer having a weight average molecular weight of 1 million, the monomer composition was 100% lauryl methacrylate. A PDP rear substrate was prepared in the same manner as in Example 1 except that a methacrylic copolymer having a weight average molecular weight of 500,000 was used. The weight loss rate of the viscoelastic layer was 97%. When the surface of the manufactured back substrate for PDP was observed with a microscope (manufactured by Japan High-Tech, magnification: 200 times), many cracks were generated in the dielectric layer.

The perspective view which shows the structure of 3 electrode surface discharge type PDP. An example of sectional drawing of the lamination sheet of this invention. The other example of sectional drawing of the lamination sheet of this invention. Process drawing which shows an example of the manufacturing method of the back substrate for PDP of this invention.

Explanation of symbols

1: Front glass substrate 2: Sustain electrode (display electrode)
3: Bus electrodes 4, 8, 22: Dielectric layer 5: MgO film (protective layer)
6: Rear glass substrate 7: Address electrode (data electrode)
9, 21: barrier rib 10: phosphor layer 11: glass resin composition layer 12: viscoelastic layer 13: base film 14: protective film 15: photoresist layer 16a: electrode 16b: electrode pattern 17: glass substrate 18: pattern formation Mask 19: barrier rib forming partition 20: dielectric layer forming film

Claims (14)

A viscoelastic layer is laminated on one side of a glass resin composition layer containing an inorganic powder and a binder resin, and the viscoelastic layer has a weight reduction rate of 96 when fired until the firing temperature reaches 400 ° C. % Or less, a laminated sheet used for integrally forming a dielectric layer and a barrier rib on a glass substrate having an electrode. The laminated sheet according to claim 1, wherein a base film is laminated on the other surface side of the glass resin composition layer. The laminated sheet according to claim 2, wherein a photoresist layer is laminated between the glass resin composition layer and the base film. A pasting step of bonding the viscoelastic layer of the laminated sheet according to claim 1 on a glass substrate having electrodes, a pattern forming step of forming a resist pattern on the surface of the glass resin composition layer, an opening of the resist pattern By sandblasting the glass resin composition layer, a sandblasting process in which the barrier rib-forming partition and the dielectric layer forming film covering the electrode are integrally formed, and by sintering the barrier rib-forming partition and the dielectric layer forming film A method of manufacturing a rear substrate for a plasma display panel, comprising a firing step of integrally forming a barrier rib and a dielectric layer. The electrode pattern formation process which forms the electrode pattern which consists of metal pastes on a glass substrate, the sticking process which bonds the viscoelastic layer of the lamination sheet of Claim 1 on the glass substrate which has an electrode pattern, The glass resin composition layer A pattern forming process for forming a resist pattern on the surface, and a glass-resin composition layer at the opening of the resist pattern is sandblasted to integrally form a barrier rib-forming partition and a dielectric layer forming film covering the electrode pattern A back surface for a plasma display panel, comprising: a sand blasting step, an electrode pattern, a barrier rib-forming partition wall, and a firing step of forming an electrode by sintering a dielectric layer-forming film and integrally forming the barrier rib and the dielectric layer A method for manufacturing a substrate. A bonding step of bonding the viscoelastic layer of the laminated sheet according to claim 2 on a glass substrate having electrodes, a peeling step of peeling the base film from the laminated sheet, and forming a resist pattern on the surface of the glass resin composition layer A sandblasting process for integrally forming a barrier rib forming partition and a dielectric layer forming film covering the electrode by sandblasting the glass resin composition layer at the opening of the resist pattern; A method for manufacturing a back substrate for a plasma display panel, comprising a firing step of integrally forming a barrier rib and a dielectric layer by sintering a body layer forming film. An electrode pattern forming step of forming an electrode pattern made of a metal paste on a glass substrate, an attaching step of bonding the viscoelastic layer of the laminated sheet according to claim 2 on the glass substrate having the electrode pattern, and a base film from the laminated sheet Stripping step for peeling, pattern forming step for forming a resist pattern on the surface of the glass resin composition layer, sandblasting the glass resin composition layer at the opening of the resist pattern, thereby forming barrier rib-forming partition walls and electrode patterns The electrode is formed by sintering the sandblasting process for integrally forming the dielectric layer forming film to be covered, the electrode pattern, the barrier rib forming partition wall, and the dielectric layer forming film, and the barrier rib and the dielectric layer are integrally formed. The manufacturing method of the back substrate for plasma display panels including the baking process to perform. The pattern forming step is a step of laminating a photoresist layer and a pattern forming mask on the glass resin composition layer, and exposing and developing the photoresist layer through the pattern forming mask to form a resist pattern. Item 8. A method for producing a rear substrate for a plasma display panel according to any one of Items 4 to 7. A bonding step of bonding the viscoelastic layer of the laminated sheet according to claim 3 on a glass substrate having electrodes, a peeling step of peeling the base film from the laminated sheet, and forming a resist pattern on the surface of the glass resin composition layer A sandblasting process for integrally forming a barrier rib forming partition and a dielectric layer forming film covering the electrode by sandblasting the glass resin composition layer at the opening of the resist pattern; A method for manufacturing a back substrate for a plasma display panel, comprising a firing step of integrally forming a barrier rib and a dielectric layer by sintering a body layer forming film. An electrode pattern forming step of forming an electrode pattern made of a metal paste on a glass substrate, a bonding step of bonding the viscoelastic layer of the laminated sheet according to claim 3 on the glass substrate having the electrode pattern, and a base film from the laminated sheet Stripping step for peeling, pattern forming step for forming a resist pattern on the surface of the glass resin composition layer, sandblasting the glass resin composition layer at the opening of the resist pattern, thereby forming barrier rib-forming partition walls and electrode patterns The electrode is formed by sintering the sandblasting process for integrally forming the dielectric layer forming film to be covered, the electrode pattern, the barrier rib forming partition wall, and the dielectric layer forming film, and the barrier rib and the dielectric layer are integrally formed. The manufacturing method of the back substrate for plasma display panels including the baking process to perform. 11. The plasma according to claim 9, wherein the pattern forming step is a step of forming a resist pattern by laminating a pattern forming mask on the photoresist layer and exposing and developing the photoresist layer through the pattern forming mask. A method for manufacturing a rear substrate for a display panel. The manufacturing method of the back substrate for plasma display panels in any one of Claims 4-11 including the process of removing the resist pattern on a glass resin composition layer between a sandblasting process and a baking process. The back substrate for plasma display panels manufactured by the method in any one of Claims 4-12. A plasma display panel using the back substrate for a plasma display panel according to claim 13.

Images