JP2006237308A - Method for reinforcing solder bump, process for producing electronic component, and process for producing aggregate of electronic components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reinforce solder bumps in an electronic component through a simple process without causing poor conduction. <P>SOLUTION: An electronic component is formed by cutting an aggregate of electronic components. The electronic component comprises a body 21, and a plurality of solder bumps 25 connected with the body 21. The body 21 has a surface 21a arranged with the solder bumps 25 wherein the solder bumps 25 are arranged to project from the surface 21a arranged the bumps. The method for reinforcing the solder bumps 25 comprises steps of: forming a resin layer of uncured insulating resin 26R on the surface 21a arranged with the bumps by screen printing such that the solder bumps 25 are not covered but the root of the solder bumps 25 for the body 21 is surrounded; and curing the resin layer and forming a reinforcing layer of the solder bumps 25 composed of cured rein layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for reinforcing a solder bump for reinforcing a solder bump in an electronic component having a solder bump, a method for manufacturing an electronic component having a solder bump, and an electronic component assembly that is an assembly of a plurality of electronic components having solder bumps. The present invention relates to a method for manufacturing a body.

  One method for mounting an electronic component such as a semiconductor component on a substrate having a patterned conductor layer is a flip chip mounting method. When mounting an electronic component by a flip chip mounting method, a protruding electrode called a bump is formed on the electronic component. In the flip chip mounting method, the electronic component is disposed such that the surface of the electronic component having the bump faces the substrate, and the bump and the conductor layer of the substrate are electrically connected directly or via a conductive substance.

  In the flip chip mounting method, one method of connecting the bump and the conductor layer of the substrate is to connect the bump formed by solder (hereinafter referred to as a solder bump) and the conductor layer of the substrate by soldering. is there.

  In recent years, lead-free solder has been used in place of conventional lead-containing solder as solder for forming solder bumps in consideration of the environment. However, lead-free solder has a problem that its strength is lower than that of lead-containing solder. For this reason, solder bumps formed using lead-free solder are more rapid than those formed using lead-containing solder, such as when a device including electronic components is dropped or in thermal shock tests. There is a problem that cracks are likely to occur especially at the base portion of the solder bump due to the temperature change.

  Therefore, for example, after connecting the solder bump and the conductor layer of the substrate, it is conceivable that an insulating resin called an underfill is filled between the substrate and the electronic component, and the solder bump is reinforced by this insulating resin.

  Further, in Patent Document 1, an adhesive film is disposed between a semiconductor element and a substrate, and after these are pressure-bonded, the solder bumps of the semiconductor element are reflowed to solder-bond the solder bumps to the conductor layer of the substrate. The technology is described. The adhesive film exhibits a flux function at the solder bonding stage and functions as an underfill after the solder bonding.

  Further, Patent Document 2 describes a technique for mounting solder bumps on a substrate by solder bonding using a curable flux. The curable flux acts as a flux at the time of solder bonding, and is cured after the solder bonding to become a reinforcing material for the solder bonding portion.

  Patent Document 3 describes a technique for forming a resin layer that covers a side surface of a bump. Patent Document 3 describes the following methods as a method for forming a resin layer. In the first method, the side surfaces of the bumps are covered with a resin paste, and the resin paste is cured by heat treatment to form a resin layer. In the second method, the bump is immersed in the resin paste and taken out, and then the resin paste is cured by heat treatment to form a resin layer, and then the resin layer is polished until the bump is exposed. In the third method, a resin paste is printed on the entire surface of the electronic component on which the bumps are arranged, then the resin paste is cured by heat treatment to form a resin layer, and then the electronic component to which the bump is connected is formed. Holes are formed in the resin layer by etching so that the electrodes are exposed, and then bumps are formed in the holes on the electrodes. In the fourth method, before forming solder bumps on the conductor foil, a resin paste is applied by screen printing so that the surface of the conductor foil is exposed, a resin layer is formed, and then heat treatment is performed. A solder paste is applied on the conductor foil, and then heat treated to form solder bumps.

  Further, in Patent Document 4, after a film of a resin material for a mask is formed on the upper hemisphere of a solder bump, a reinforcing resin material is supplied, and the reinforcing resin material is cured, and a resin is applied to the base of the solder bump. Techniques for forming films are described.

JP 2004-244486 A JP 2004-90021 A JP-A-8-236654 JP 10-335336 A

  Conventionally, there are various methods for reinforcing solder bumps as described above. However, the conventional methods have the following problems.

  First, in the method of filling the underfill between the board and the electronic component after connecting the solder bump and the conductor layer of the board, the work of filling the underfill is complicated.

  In the method described in Patent Document 1, an adhesive film remains between the solder bump and the conductor layer of the substrate, and there is a possibility that poor conduction occurs between the solder bump and the conductor layer of the substrate. If the adhesive film is made thin, it is possible to suppress the occurrence of poor conduction, but the function of reinforcing the solder bumps is reduced.

  In the method described in Patent Document 2, it is difficult to form a reinforcing material having a sufficient thickness to reinforce the solder bumps.

  In the first method described in Patent Document 3, the work of covering the side surface portion of the bump with the resin paste is complicated. In the second or third method described in Patent Document 3, the number of steps is increased. Moreover, in the 4th method described in patent document 3, a part of resin layer covers on conductor foil, and there exists a possibility that a conduction | electrical_connection defect may generate | occur | produce between conductor foil and a solder bump.

  In the method described in Patent Document 4, the number of steps is increased, and if the film of the resin material for mask is not removed, there is a possibility that poor conduction occurs between the solder bump and the conductor layer of the substrate.

  The present invention has been made in view of the above problems, and its purpose is to reinforce the solder bumps in the electronic component in a simple process and without causing poor conduction, An object of the present invention is to provide an electronic component manufacturing method and an electronic component assembly manufacturing method.

  A method for reinforcing a solder bump according to the present invention is an electronic component including a main body having a bump arrangement surface on which solder bumps are arranged, and a solder bump arranged so as to protrude from the bump arrangement surface and connected to the main body. This is a method for reinforcing solder bumps.

The method of reinforcing the solder bump of the present invention is as follows.
Forming a resin layer made of an insulating resin before curing on the bump arrangement surface so as to surround the periphery of the base portion of the solder bump with respect to the main body without covering the solder bump by screen printing;
A step of curing the resin layer and forming a reinforcing layer made of the cured resin layer and reinforcing the solder bumps.

  An electronic component manufactured by the first or second method for manufacturing an electronic component of the present invention has a main body having a bump arrangement surface on which solder bumps are arranged, and is arranged so as to protrude from the bump arrangement surface, and is attached to the main body. Connected solder bumps.

The first electronic component manufacturing method of the present invention includes:
Forming solder bumps on the body;
After the step of forming the solder bump, the bump placement surface is made of an insulating resin before curing so as to surround the base portion of the solder bump with respect to the main body without covering the solder bump by screen printing. Forming a resin layer;
A step of curing the resin layer and forming a reinforcing layer made of the cured resin layer and reinforcing the solder bumps.

The second electronic component manufacturing method of the present invention is
An electronic component comprising a plurality of planned electronic component portions each serving as an electronic component, and a planned cutting portion that is arranged between adjacent planned electronic component portions and indicates a position to be cut when separating each planned electronic component portion Manufacturing the assembly;
A step of cutting the electronic component assembly at the planned cutting portion, separating the individual electronic component planned portions, and forming an electronic component comprising the separated electronic component planned portions.

  In the second method of manufacturing an electronic component according to the present invention, the electronic component planned portion is disposed so as to protrude from the bump placement surface and connected to the main body having a bump placement surface on which the solder bumps are placed. It has solder bumps. In addition, the manufacturing process of the electronic component assembly includes the steps of forming the solder bumps on the main body and the steps of forming the solder bumps, and without covering the solder bumps and the planned cutting portion by screen printing. Forming a resin layer made of an insulating resin before curing on the bump arrangement surface so as to surround the periphery of the base portion of the solder bump. In addition, the step of manufacturing the electronic component assembly or the step of forming the electronic component includes a step of curing the resin layer and forming a reinforcing layer that is made of the cured resin layer and reinforces the solder bumps. .

  An electronic component assembly manufactured by the method of manufacturing an electronic component assembly of the present invention is arranged between a plurality of electronic component scheduled portions each serving as an electronic component and an adjacent electronic component scheduled portion, and each electronic component scheduled portion And a scheduled cutting portion indicating a position to be cut when separating the. The electronic component planned portion has a main body having a bump arrangement surface on which solder bumps are arranged, and a solder bump arranged so as to protrude from the bump arrangement surface and connected to the main body.

The method for producing an electronic component assembly according to the present invention includes:
Forming solder bumps on the body;
After the process of forming the solder bumps, insulation before curing on the bump placement surface so that the periphery of the base part of the solder bumps with respect to the main body is surrounded by screen printing without covering the solder bumps and the portions to be cut. Forming a resin layer made of the above resin. The resin layer is cured later to become a reinforcing layer that reinforces the solder bumps.

  In the present invention, the reinforcing layer may be formed by curing the resin layer by applying heat or active energy rays to the resin layer using the insulating resin as a thermosetting resin or a photocurable resin.

  In the present invention, the insulating resin has a viscosity in the range of 1 to 500 Pa · s under the condition that the viscosity is measured with an E-type viscometer at a temperature of 25 ° C., and rotates at a rotation speed of 1 rpm. It is preferable that the value obtained by dividing the viscosity at several tens of rpm has a value in the range of 1 to 5.

  In the present invention, a resin layer made of an insulating resin before curing is formed on the bump arrangement surface so as to surround the periphery of the base portion of the solder bump with respect to the main body without covering the solder bump by screen printing, The resin layer is cured to form a reinforcing layer made of the cured resin layer. Therefore, according to the present invention, the solder bump can be reinforced by the reinforcing layer. Moreover, according to this invention, the resin layer used as a reinforcement layer can be formed in a simple process. Moreover, in this invention, after formation of a solder bump, a resin layer is formed so that a solder bump may not be covered. Therefore, according to the present invention, conduction failure occurs between the solder bump and the conductor layer in the electronic component connected to the solder bump and between the solder bump and the external conductor connected to the solder bump. Can be prevented. From the above, according to the present invention, it is possible to reinforce the solder bumps in the electronic component with a simple process and without causing poor conduction.

  In the second electronic component manufacturing method of the present invention or the electronic component assembly manufacturing method of the present invention, the resin layer is formed so as not to cover the planned cutting portion of the electronic component assembly. As a result, the occurrence of warpage of the electronic component assembly accompanying the curing of the resin layer can be suppressed, and the occurrence of chipping of the reinforcing layer when the electronic component assembly is cut can be prevented. .

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, the configuration of an electronic component manufactured by the method of manufacturing an electronic component according to an embodiment of the present invention will be described with reference to FIG. The electronic component 20 shown in FIG. 5 is a component that is flip-chip mounted on a wiring board or the like. The electronic component 20 is a semiconductor element, for example.

  As shown in FIG. 5, the electronic component 20 includes a main body 21, a plurality of solder bumps 25 connected to the main body 21, and a reinforcing layer 26 that reinforces the solder bumps 25. In the following description, “upper” or “lower” refers to upper or lower in the drawings.

  The main body 21 includes a substrate portion 22, a conductor layer 23, and a solder resist layer 24. The substrate unit 22 includes a predetermined element or circuit formed by, for example, a semiconductor manufacturing technique. The conductor layer 23 is disposed on one surface (upper surface in FIG. 5) 22 a of the substrate portion 22. The conductor layer 23 is connected to the element or circuit. Solder bumps 25 are connected to the conductor layer 23. The solder resist layer 24 is disposed on the surface 22 a and the upper surface of the conductor layer 23. The solder resist layer 24 has an opening that exposes a portion of the upper surface of the conductor layer 23 to which the solder bump 25 is connected.

  The solder bump 25 is connected to a portion of the upper surface of the conductor layer 23 exposed from the opening of the solder resist layer 24. The main body 21 has a bump placement surface 21a on which the solder bumps 25 are placed. Specifically, the bump placement surface 21 a is the upper surface of the solder resist layer 24. The solder bumps 25 are arranged so as to protrude from the bump arrangement surface 21a. The solder bump 25 is formed of solder, for example, lead-free solder.

  The reinforcing layer 26 is disposed on the bump placement surface 21 a so as not to cover the solder bump 25 and to surround the base portion of the solder bump 25 with respect to the main body 21. The base portion of the solder bump 25 with respect to the main body 21 is a portion in the vicinity of the bump arrangement surface 21a among the portions of the solder bump 25 protruding from the bump arrangement surface 21a. The reinforcing layer 26 is made of an insulating resin.

  Next, a solder bump reinforcing method, an electronic component manufacturing method, and an electronic component assembly manufacturing method according to the present embodiment will be described with reference to FIGS. FIG. 1 is a cross-sectional view showing one step in the method of manufacturing an electronic component according to the present embodiment. In the electronic component manufacturing method according to the present embodiment, first, as shown in FIG. The wafer 1 is disposed between a plurality of planned electronic component parts 2P that become the substrate part 22 of the electronic component 20 and the adjacent planned electronic component part 2P, and is cut when the individual planned electronic part parts 2P are separated. And a scheduled cutting portion 3P indicating the position to be cut. The planned cutting portion 3P is called a dicing line. Next, the conductor layer 23 and the solder resist layer 24 are formed in order on each electronic component planned part 2P. The solder resist layer 24 has an opening that exposes a portion of the upper surface of the conductor layer 23 to which the solder bump 25 is connected. In this way, an assembly including the main bodies 21 of the plurality of electronic components 20 is obtained. The main body 21 has a bump arrangement surface 21 a that is the upper surface of the solder resist layer 24.

  Next, as shown in FIG. 2, a plurality of solder bumps 25 are formed on each main body 21. The solder bump 25 is formed so as to be connected to a portion of the upper surface of the conductor layer 23 exposed from the opening of the solder resist layer 24.

  Next, as shown in FIGS. 3 and 4, a resin layer 26P made of an insulating resin before curing is formed on the bump placement surface 21a by screen printing. FIG. 3 shows a state in which screen printing is performed, and FIG. 4 shows a state after printing. As shown in FIG. 3, in this screen printing, first, the screen 31 is arranged on the aggregate shown in FIG. In this screen 31, the eyes in the portion disposed above the solder bump 25 and the portion disposed above the planned cutting portion 3P are closed. Next, an insulating resin 26 </ b> R before curing is placed on the screen 31. Next, the resin 26 </ b> R is placed on the assembly through the screen 31 using the squeegee 32. Thereby, as shown in FIG. 4, the resin layer 26P made of the resin 26R is formed. The resin layer 26P is formed so as to surround the base portion of the solder bump 25 with respect to the main body 21 without covering the solder bump 25 and the planned cutting portion 3P.

  As the resin 26R, a thermosetting resin or a photocurable resin is used. Examples of the thermosetting resin used as the resin 26R include an epoxy resin, an imide resin, an amide resin, a urethane resin, a phenol resin, and an acrylic resin. Examples of the photocurable resin used as the resin 26R include a photosensitive acrylic resin and a photosensitive polyimide resin.

  The resin 26R preferably has a viscosity and thixotropy suitable for screen printing. Specifically, the resin 26R has a viscosity in the range of 1 to 500 Pa · s under the condition that the viscosity is measured by an E-type viscometer at a temperature of 25 ° C., and the thixotropy rotates the viscosity at a rotation speed of 1 rpm. It is preferable that the value obtained by dividing the viscosity at several tens of rpm has a value in the range of 1 to 5.

  Next, the resin layer 26P is cured, and the reinforcing layer 26 made of the cured resin layer 26P and reinforcing the solder bumps 25 is formed. When the resin 26R is a thermosetting resin, heat is applied to the resin layer 26P to cure the resin layer 26P. The condition in this case is, for example, that the resin layer 26P is heated at 180 ° C. for 60 minutes. When the resin 26R is a photocurable resin, the resin layer 26P is cured by applying active energy rays such as light and ultraviolet rays to the resin layer 26P. In addition, when the resin 26R is a thermosetting resin having negative photosensitivity, the resin layer 26P may be cured by applying an active energy ray or heat to the resin layer 26P, or the resin layer 26P After providing the active energy ray, the resin layer 26P may be cured by further applying heat.

  At this time, the resin layer 26P may be cured after cutting the assembly without curing the resin layer 26P.

  When the resin layer 26P or the reinforcing layer 26 is formed, the electronic component assembly 10 according to the present embodiment is completed. Therefore, the steps so far correspond to the steps of manufacturing the electronic component assembly in the method of manufacturing the electronic component according to the present embodiment and the method of manufacturing the electronic component assembly according to the present embodiment. The electronic component assembly 10 is disposed between a plurality of planned electronic component parts 2 each serving as the electronic component 20 and the adjacent planned electronic component part 2, and is a position that is cut when the individual electronic component planned parts 2 are separated. The cutting scheduled part 3 which shows this is provided. The planned electronic component part 2 corresponds to the planned electronic part 2P in FIGS. 1 to 3, and the planned cutting part 3 corresponds to the planned cutting part 3P in FIGS. The electronic component planned portion 2 includes a main body 21 having a bump arrangement surface 21a on which solder bumps 25 are arranged, a solder bump 25 arranged so as to protrude from the bump arrangement surface 21a and connected to the main body 21, and a solder bump. The reinforcing layer 26 or the resin layer 26P disposed on the bump placement surface 21a is provided so as to surround the base portion of the solder bump 25 with respect to the main body 21 without covering the body 25.

  Next, as shown in FIG. 5, the electronic component assembly 10 is cut at the planned cutting portion 3 to separate the individual electronic component planned portions 2, and the electronic component 20 including the separated electronic component planned portions 2. Form.

  Next, a process of mounting the electronic component 20 on a substrate such as a wiring board will be described with reference to FIGS. 6 and 7 show a state in the process of mounting the electronic component 20 on the substrate 40, and FIG. 8 shows a state after the electronic component 20 is mounted on the substrate 40. The substrate 40 includes an insulating support layer 41, a patterned conductor layer 42 exposed on the upper surface of the support layer 41, and an insulating layer 43 disposed on the upper surface of the support layer 41 and the upper surface of the conductor layer 42. And have. In the insulating layer 43, an opening for exposing a connection portion connected to the solder bump 25 of the electronic component 20 on the upper surface of the conductor layer 42 is formed.

  When the electronic component 20 is mounted on the substrate 40, first, as shown in FIG. 6, a solder paste 44 is applied on the connection portion of the conductor layer 42 on the substrate 40 by, for example, printing. Next, the electronic component 20 is held so that the solder bumps 25 face downward, and the electronic component 20 and the substrate 40 are aligned so that each solder bump 25 faces the connection portion of the conductor layer 42 connected thereto. .

  Next, as shown in FIG. 7, the electronic component 20 is placed on the substrate 40 so that each solder bump 25 is in contact with the solder paste 44 on the connection portion of the conductor layer 42 connected thereto.

  Next, as shown in FIG. 8, the solder bumps 25 and the solder paste 44 are reflowed to solder the solder bumps 25 and the conductor layer 42 together. The condition at this time is, for example, that the electronic component 20 and the substrate 40 are passed through a reflow furnace at a temperature of 260 to 280 ° C. over 30 seconds. In this way, the electronic component 20 is mounted on the substrate 40.

  If the resin layer 26P is not cured at the time of manufacturing the electronic component assembly 10, the resin layer 26P is cured after the electronic component assembly 10 is cut and before the electronic component 20 is mounted on the substrate 40. The reinforcing layer 26 may be formed, or after the electronic component 20 is mounted on the substrate 40, the resin layer 26P may be cured to form the reinforcing layer 26. When the resin layer 26P is cured after the electronic component assembly 10 is cut and before the electronic component 20 is mounted on the substrate 40, as in the case where the resin layer 26P is cured at the time of manufacturing the electronic component assembly 10, The resin layer 26P is cured by applying heat or active energy rays to the resin layer 26P. When the resin layer 26P is cured after the electronic component 20 is mounted on the substrate 40, the resin layer 26P is cured by heating the electronic component 20 and the substrate 40, for example.

  The solder bump reinforcing method according to the present embodiment includes the steps from the formation of the solder bump 25 to the formation of the reinforcing layer 26 among the steps described so far.

  As described above, in the present embodiment, the screen before printing does not cover the solder bumps 25 and surrounds the base portion of the solder bumps 25 with respect to the main body 21 on the bump placement surface 21a before being cured. A resin layer 26P made of an insulating resin 26R is formed, the resin layer 26P is cured, and a reinforcing layer 26 made of the cured resin layer 26P is formed. Therefore, according to the present embodiment, the solder bump 25 can be reinforced by the reinforcing layer 26. As a result, it is possible to prevent cracks from occurring particularly at the base portion of the solder bump 25 due to a sudden temperature change in an impact or a thermal shock test when the device including the electronic component 20 is dropped.

  Moreover, according to this Embodiment, the resin layer 26P used as the reinforcement layer 26 can be formed with an easy process. In the present embodiment, after the solder bumps 25 are formed, the resin layer 26P is formed so as not to cover the solder bumps 25. Therefore, according to this embodiment, between the solder bump 25 and the conductor layer 23 in the electronic component 20 connected thereto, and between the solder bump 25 and the external conductor portion 42 connected thereto. In either case, the occurrence of poor conduction can be prevented.

  From the above, according to the present embodiment, it is possible to reinforce the solder bumps 25 in the electronic component 20 with a simple process and without causing poor conduction.

  In the present embodiment, the resin layer 26 </ b> P is formed so as not to cover the planned cutting portion 3 of the electronic component assembly 10. Thereby, the occurrence of warpage of the electronic component assembly 10 accompanying the curing of the resin layer 26P can be suppressed, and the occurrence of chipping of the reinforcing layer 26 when the electronic component assembly 10 is cut can be prevented. .

  In addition, this invention is not limited to the said embodiment, A various change is possible. For example, in the embodiment, when the electronic component assembly 10 is cut to manufacture a plurality of electronic components 20, an example in which the reinforcing layer 26 or the resin layer 26P is formed in the process of manufacturing the electronic component assembly 10 is shown. ing. However, in the present invention, the reinforcing layer 26 may be formed by forming the resin layer 26P for one electronic component and curing it.

It is sectional drawing which shows 1 process in the manufacturing method of the electronic component which concerns on one embodiment of this invention. FIG. 2 is a cross-sectional view showing a step that follows the step shown in FIG. 1. FIG. 3 is a cross-sectional view showing a step that follows the step shown in FIG. 2. FIG. 4 is a cross-sectional view showing a step that follows the step shown in FIG. 3. FIG. 5 is a cross-sectional view showing a step that follows the step shown in FIG. 4. It is sectional drawing which shows the state in the middle of the process of mounting the electronic component shown in FIG. 5 on a board | substrate. It is sectional drawing which shows the state in the middle of the process of mounting the electronic component shown in FIG. 5 on a board | substrate. It is sectional drawing which shows the state after mounting the electronic component shown in FIG. 5 on the board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Wafer, 2, 2P ... Electronic component plan part, 3, 3P ... Cutting plan part, 10 ... Electronic component assembly, 20 ... Electronic component, 21 ... Main body, 21a ... Bump arrangement surface, 22 ... Substrate part, 23 ... Conductor layer, 24 ... solder resist layer, 25 ... solder bump, 26 ... reinforcing layer, 26P ... resin layer, 26R ... resin.

Claims (12)

A method of reinforcing a solder bump in an electronic component comprising a main body having a bump arrangement surface on which solder bumps are arranged, and a solder bump arranged so as to protrude from the bump arrangement surface and connected to the main body. And
A step of forming a resin layer made of an insulating resin before curing on the bump arrangement surface by screen printing so as to surround the periphery of the base portion of the solder bump with respect to the main body without covering the solder bump. When,
A method of reinforcing a solder bump, comprising: a step of curing the resin layer and forming a reinforcing layer that is made of a cured resin layer and reinforces the solder bump. The insulating resin is a thermosetting resin or a photocurable resin,
2. The method for reinforcing a solder bump according to claim 1, wherein in the step of forming the reinforcing layer, the resin layer is cured by applying heat or active energy rays to the resin layer.   The insulating resin has a viscosity in the range of 1 to 500 Pa · s under the condition that the viscosity is measured by an E-type viscometer at a temperature of 25 ° C., and the viscosity at a rotation speed of 1 rpm is the viscosity at a rotation speed of 10 rpm. 3. The method for reinforcing a solder bump according to claim 1, wherein the divided value has a property of a value in the range of 1-5. A method of manufacturing an electronic component comprising a main body having a bump arrangement surface on which solder bumps are arranged, and a solder bump arranged so as to protrude from the bump arrangement surface and connected to the main body,
Forming the solder bumps on the body;
After the step of forming the solder bump, insulation before curing is provided on the bump arrangement surface so as to surround the base portion of the solder bump with respect to the main body by screen printing without covering the solder bump. A step of forming a resin layer made of a conductive resin,
A method of manufacturing an electronic component comprising: a step of curing the resin layer and forming a reinforcing layer made of the cured resin layer and reinforcing the solder bump. The insulating resin is a thermosetting resin or a photocurable resin,
5. The method of manufacturing an electronic component according to claim 4, wherein the step of forming the reinforcing layer includes curing the resin layer by applying heat or active energy rays to the resin layer.   The insulating resin has a viscosity in the range of 1 to 500 Pa · s under the condition that the viscosity is measured by an E-type viscometer at a temperature of 25 ° C., and the viscosity at a rotation speed of 1 rpm is the viscosity at a rotation speed of 10 rpm. 6. The method of manufacturing an electronic component according to claim 4, wherein the divided value has a property of becoming a value within a range of 1 to 5. A method of manufacturing an electronic component comprising a main body having a bump arrangement surface on which solder bumps are arranged, and a solder bump arranged so as to protrude from the bump arrangement surface and connected to the main body,
An electronic device comprising: a plurality of planned electronic component parts each serving as the electronic component; and a planned cutting part that is disposed between adjacent planned electronic component parts and indicates a position to be cut when separating each planned electronic component part. A process of manufacturing a component assembly;
Cutting the electronic component assembly at the planned cutting portion, separating individual electronic component planned portions, and forming an electronic component comprising the separated electronic component planned portions,
The electronic component planned portion has a main body having a bump arrangement surface on which solder bumps are arranged, and a solder bump arranged so as to protrude from the bump arrangement surface and connected to the main body,
The step of manufacturing the electronic component assembly includes:
Forming the solder bumps on the body;
After the step of forming the solder bump, on the bump arrangement surface so as to surround the base portion of the solder bump with respect to the main body without covering the solder bump and the planned cutting portion by screen printing. Including a step of forming a resin layer made of an insulating resin before curing,
The step of manufacturing the electronic component assembly or the step of forming the electronic component includes a step of curing the resin layer and forming a reinforcing layer made of the cured resin layer. Production method. The insulating resin is a thermosetting resin or a photocurable resin,
8. The method of manufacturing an electronic component according to claim 7, wherein in the step of forming the reinforcing layer, the resin layer is cured by applying heat or active energy rays to the resin layer.   The insulating resin has a viscosity in the range of 1 to 500 Pa · s under the condition that the viscosity is measured by an E-type viscometer at a temperature of 25 ° C., and the viscosity at a rotation speed of 1 rpm is the viscosity at a rotation speed of 10 rpm. 9. The method of manufacturing an electronic component according to claim 7, wherein the divided value has a property of becoming a value within a range of 1 to 5. A plurality of planned electronic component portions each serving as an electronic component, and a planned cutting portion that is disposed between adjacent planned electronic component portions and indicates a position to be cut when separating each planned electronic component portion; The component scheduled portion manufactures an electronic component assembly having a main body having a bump arrangement surface on which solder bumps are arranged, and a solder bump arranged so as to protrude from the bump arrangement surface and connected to the main body. A method,
Forming the solder bumps on the body;
After the step of forming the solder bump, on the bump arrangement surface so as to surround the base portion of the solder bump with respect to the main body without covering the solder bump and the planned cutting portion by screen printing. And a step of forming a resin layer made of an insulating resin before curing,
The method of manufacturing an electronic component assembly, wherein the resin layer is cured later to become a reinforcing layer for reinforcing the solder bumps. The insulating resin is a thermosetting resin or a photocurable resin,
The method of manufacturing an electronic component assembly further includes a step of forming the reinforcing layer by curing the resin layer by applying heat or active energy rays to the resin layer. 10. A method for producing an electronic component assembly according to 10. The insulating resin has a viscosity in the range of 1 to 500 Pa · s under the condition that the viscosity is measured by an E-type viscometer at a temperature of 25 ° C., and the viscosity at a rotation speed of 1 rpm is the viscosity at a rotation speed of 10 rpm. 12. The method of manufacturing an electronic component assembly according to claim 10 or 11, wherein the divided value has a property of becoming a value within a range of 1 to 5.

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