JP2006237049A - Wiring substrate for mounting light-emitting element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an easily manufactured wiring substrate for mounting a light-emitting element in which a sealing resin firmly adheres in a cavity having a light-emitting element mounted thereon, and a light from the light-emitting element is efficiently reflected. <P>SOLUTION: The wiring board 1 for mounting a light-emitting element includes: a substrate body 2 having a front surface 3 and a rear surface 4 and consisting of a ceramic (insulating material); a cavity 5 opened on the front surface 3 of the substrate body 2 and having a light-emitting diode (light-emitting device) 8 mounted on a bottom surface 7; a light reflecting layer 12 formed on a cylindrical side surface 6 of the cavity 5; and a pair of grooves 10 formed on the side surface 6, and dividing the optical reflecting layer 12 along a thickness direction of the substrate body 2 and exposing the ceramic. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a light emitting element mounting wiring board for mounting a light emitting element such as a light emitting diode.

In a wiring board on which a light emitting element is mounted, a light reflecting layer made of metal is formed on the side surface of the cavity where the light emitting element is mounted on the bottom surface, and the sealing resin is made flat in the cavity. By filling, the light emitted from the light emitting element can be made clear.
By the way, the sealing resin that fills the cavity has low adhesion strength with the metal light reflection layer, so that the mounted light emitting element and the bonding wire connected thereto are pulled along with peeling from the cavity. There was a problem of peeling off.
In order to solve the above problem and prevent the sealing resin from peeling off from the cavity and firmly adhere to the cavity, a ring-shaped step is provided at the middle position of the through-hole that becomes a substantially conical cavity, and the step There has been proposed a light emitting element mounting package in which a protrusion and a groove recessed outward are formed on the upper side (see, for example, Patent Document 1).

JP 2004-327504 A (pages 1 to 10, FIGS. 1 to 6)

  However, in the light emitting element mounting package, light from the light emitting element is reflected at a portion directly above the step where the insulating material such as ceramic is exposed in the metal light reflecting layer coated on the inner peripheral surface of the through hole. The reflection efficiency is reduced. Moreover, there is a problem that the formation of the protrusions and grooves is difficult and requires a complicated manufacturing process.

  The present invention solves the problems in the background art, the sealing resin is firmly attached in the cavity in which the light emitting element is mounted, can efficiently reflect the light from the light emitting element, and can be easily manufactured. It is an object to provide an element mounting wiring board.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-mentioned problems, the present invention was conceived in that a groove in which an insulating material forming the substrate body is exposed on the side surface of the cavity is formed along the thickness direction of the substrate body. is there.
That is, the wiring board for mounting a light emitting element of the present invention (Claim 1) has a substrate body having a front surface and a back surface and made of an insulating material, and the light emitting element is mounted on the bottom surface of the substrate body. A cavity, a light reflecting layer formed on a side surface of the cavity, a groove formed on the side surface of the cavity, dividing the light reflecting layer along the thickness direction of the substrate body, and exposing the insulating material; It is characterized by including.

According to this, a groove for dividing the light reflecting layer along the thickness direction of the substrate body and exposing the insulating material is formed on the side surface of the cavity. For this reason, when the light emitting element is mounted on the bottom surface of the cavity and the cavity is filled with the sealing resin and solidified, the solidified sealing resin and the insulating material exposed in the groove are strong. Close contact with. Moreover, since the groove can divide the light reflection layer with a small area, the reflection efficiency of light from the light emitting element does not decrease. In addition, such a groove may be formed at the same time when a single-layer or multiple-layer insulating layer (for example, a green sheet) for forming the cavity is obtained in the substrate body and when the insulating layer is punched. Is possible.
Therefore, the sealing resin to be filled later adheres firmly inside the cavity, and the light from the light emitting element can be reflected efficiently, and the manufacture is facilitated.

The insulating material forming the substrate body is, for example, a ceramic mainly composed of alumina, a glass-ceramic that is one of low-temperature fired ceramics, or various resins including an epoxy resin.
The cavity is formed by two members, an upper insulating layer having a light reflecting layer on the side surface of the through hole, and a lower insulating layer including an upper surface that becomes a bottom surface of the cavity. Such cavities include cylindrical, elliptical cylinder, or oval cylindrical sides (circumferential surfaces) as well as generally cylindrical, elliptical cylinder, or oval cylindrical forms, as well as circular, elliptical, or oval shapes. Also included is a configuration in which the entirety having a side surface (peripheral surface) that is inclined from the periphery of the bottom surface of the substrate and extends toward the surface of the substrate body has a substantially conical shape, a substantially elliptical cone shape, or a substantially long cone shape.
Furthermore, the groove includes a concave groove having a U-shaped cross section, an arc groove having a substantially semicircular cross section, or a plurality of right-angled triangles in a side view and each hypotenuse being continuous vertically.
The light reflecting layer includes a plating layer or a thin film layer such as Ag, Pt, Pd, and Rh that reflects light at least on the surface layer thereof. In addition, the light emitting element includes a semiconductor laser in addition to a light emitting diode.

According to the present invention, the cavity has a cylindrical shape, a long cylindrical shape, or an elliptical column shape, and the groove formed on the side surface of the cavity has the same cross-sectional shape along the thickness direction of the substrate body. The wiring board for mounting a light emitting element (Claim 2) is also included.
According to this, when the light emitting element is mounted on the bottom surface of the cavity and the sealing resin is filled into the cavity and solidified, the solidified sealing resin and the insulating material exposed in the groove are Adhere firmly. Moreover, since the groove can divide the light reflection layer with a small area, the reflection efficiency of light from the light emitting element does not decrease. In addition, such a groove can be formed simultaneously with the punching process performed on the insulating layer when obtaining a single-layer or multi-layer insulating layer for forming a cavity in the substrate body. Accordingly, the sealing resin is firmly adhered in the cavity, and the light of the light emitting element can be reflected efficiently, and the manufacture can be performed easily and reliably.

Further, according to the present invention, the cavity has a substantially conical shape, a substantially long conical shape, or a substantially elliptical cone shape, and the groove formed on the side surface of the cavity is along the thickness direction of the substrate body. A light emitting element mounting wiring board (claim 3) formed in a step shape is also included.
According to this, when the light emitting element is mounted on the bottom surface of the cavity and the sealing resin is filled into the cavity and solidified, the solidified sealing resin and the insulating material exposed in the groove are Adhere firmly. Further, since the groove is formed in a stepped manner in a multi-layered insulating layer for forming a substantially conical cavity or the like, it is also possible to secure a space for the internal wiring arranged between the insulating layers. . Therefore, the sealing resin adheres firmly in the cavity, and the light from the light emitting element can be reflected efficiently, and the manufacture is easy.

  In addition, when obtaining the multilayer insulating layer for forming a cavity having a substantially conical shape or the like, the groove is punched through a clearance of a required width for each insulating layer, and the obtained conical shape or the like is obtained. It can be formed by laminating each insulating layer after the through hole is cut out along the axial direction. Alternatively, a punching process through a minimum clearance for each insulating layer, a molding step of inserting and pressing a die such as a cone into each cylindrical through-hole obtained, and each through-hole such as a cone Can be formed by laminating each insulating layer after cutting out along the axial direction. In addition, in the above lamination, the upper and lower grooves formed by the notches also serve as alignment marks.

In other words, the present invention may include a wiring board for mounting a light emitting element in which a pair of grooves formed on the side surface of the cavity is formed on the side surface. Furthermore, the present invention may include a light emitting element mounting wiring board in which a pair of grooves formed on the side surface of the cavity is formed substantially symmetrically on the side surface.
In these cases, a pair of conductor layers (for example, pads) formed on the bottom surface of the cavity and individually connected to the light emitting element can be electrically connected to the pair of light reflecting layers divided by the pair of grooves. It becomes. In the case where the pair of conductor layers are part of different circuits, the pair of divided light reflecting layers is insulated from each other by the pair of grooves. As a result, it is not necessary to provide a space for insulating the light reflecting layer and the conductor layer, and the light emitting element mounting wiring board itself can be miniaturized.

In the following, the best mode for carrying out the present invention will be described.
FIG. 1 is a plan view showing a light-emitting element mounting wiring board (hereinafter simply referred to as a wiring board) 1 according to the present invention, and FIG. 2 is a cross-sectional view taken along the line XX in FIG. .
As shown in FIGS. 1 and 2, the wiring substrate 1 has a substrate body 2 having a front surface 3 and a back surface 4, and a light emitting diode (light emitting element) 8 that is open on the front surface 3 of the substrate body 2 and is mounted on the bottom surface 7. And a light reflecting layer 12 formed on the side surface 6 of the cavity 5, and a pair of concave grooves (grooves) 10 formed on the side surface 6 of the cavity 5.

The substrate body 2 is composed of an upper insulating layer S1 and a lower insulating layer S2 made of, for example, alumina ceramic (insulating material) which are integrally laminated, and is a square of about 5 mm × about 5 mm in plan view and about 1 mm in plan view. It has a thickness. The upper insulating layer S1 and the lower insulating layer S2 are obtained by firing a single-layer or multiple-layer green sheet. The upper insulating layer S1 and the lower insulating layer S2 have a wiring layer having a required pattern (not shown) inside and between them.
The insulating material forming the substrate body 2 may be various resins such as glass-ceramic, which is one of low-temperature fired ceramics, or epoxy resin.
As shown in FIGS. 1 and 2, the cavity 5 has a bottom surface 7 that is circular in plan view, and extends vertically from the periphery of the bottom surface 7 while penetrating the upper insulating layer S <b> 1 and on the surface 3 of the substrate body 2. A cylindrical side surface 6 that is open, and has a substantially cylindrical shape as a whole.

In addition, a pair of light reflecting layers 12 is formed in a substantially cylindrical shape on almost the entire side surface 6 of the cavity 5. The light reflecting layer 12 includes a metal layer made of W, Mo, Ag, or Cu in contact with the side surface 6, and an Ag plating layer that is formed on the Ni plating layer and the Au plating layer and serves as a surface layer (any one) (Not shown).
As shown in FIGS. 1 and 2, the pair of concave grooves 10 are formed on the side surface 6 of the cavity 5 and the pair of light reflecting layers 12 are separated from the cavity 5 so as to divide the light reflecting layer 12 along the thickness direction of the substrate body 2. Are formed symmetrically. The pair of concave grooves 10 have a U-shaped cross section, have the same rectangular cross section along the thickness direction of the substrate body 2, and the ceramic of the substrate body 2 is formed between the bottom surface and the pair of side surfaces. Exposed.

The cavity 5, the pair of concave grooves 10, and the pair of light reflecting layers 12 are formed as follows.
First, punching with a punch and a die with a minimum clearance is performed on a single-layer or multi-layer green sheet that is to be the upper insulating layer S1 after firing or an upper green sheet (laminated body) obtained from a large green sheet. A cylindrical through hole is formed by processing. A pair of ridges and grooves are formed in advance in the cylindrical punch and die receiving holes including the clearance. Next, a metal layer made of W, Mo, Ag, or Cu is coated with a conductive paste on the side surface (inner peripheral surface) of the through hole having the pair of concave grooves 10 in the upper green sheet. At this time, the openings of the pair of concave grooves 10 are covered with masking.

Next, a flat lower green sheet (laminated body) that becomes the lower insulating layer S <b> 2 is laminated by firing below the upper green sheet (upper insulating layer) to form the cavity 5. Further, by applying Ni plating, Au plating, Ag plating, or the like on the metal layer, the cavity 5, the concave groove 10, and the light reflecting layer 12 can be easily formed without requiring complicated steps.
The punching process is performed using a cylindrical punch without protrusions and a die receiving hole, and a cylindrical through hole is formed in the upper green sheet (laminated body), and W or the like is formed on the side surface of the through hole. After forming the metal layer comprising the metal layer, the side surface of the through-hole is cut out with a cutting tool and a receiving die including the metal layer, and then the respective plating is performed, whereby the cavity 5, the groove 10, and the light reflecting layer are formed. 12 can also be formed.

As shown in FIGS. 1 and 2, a pair of pads (conductor layers) 14 and 15 made of W, Mo, Ag, or Cu and forming different circuits are provided on the bottom surface 7 of the cavity 5. The light emitting diodes 8 located at the center of the light emitting diode 8 are formed so as to be separated from each other with a mounting area therebetween.
A light emitting diode 8 is mounted above the bottom surface 7 of the cavity 5 via a brazing material 9 or an epoxy resin adhesive. At that time, the bonding wires w are individually connected between the light emitting diode 8 and the pair of pads 14 and 15. The cavity 5 is filled with a sealing resin j before solidification as shown by a one-dot chain line in FIG. 2, and its surface is solidified with the surface 3 of the substrate body 2. The brazing material 9 is made of a low melting point alloy such as Sn—Ag.

Further, as shown in FIGS. 1 and 2, via conductors 16 and 17 penetrating the lower insulating layer S2 are individually connected to the pads 14 and 15, and the via conductors 16 and 17 are respectively connected to the upper and lower insulations. It is individually connected to a wiring layer (not shown) formed inside the layers S1 and S2. The via conductors 16 and 17 are also individually connected to a pair of back surface electrodes 18 and 19 formed on the back surface 4 of the substrate body 2.
Note that the pad 14, the wiring layer (not shown), the via conductor 16, and the back electrode 18 located on the left side in FIG. 2 form a ground circuit, for example. Further, the pad 15, the wiring layer (not shown), the via conductor 17, and the back electrode 19 located on the right side in FIG. 2 form, for example, a signal circuit. The pads 14, 15, the wiring layer, the via conductors 16, 17, and the back electrodes 18, 19 are made of W, Mo, Ag, or Cu.

According to the wiring substrate 1 as described above, a pair of concave grooves 10 are formed on the side surface 6 of the substantially cylindrical cavity 5 so that the light reflecting layer 12 is divided along the thickness direction of the substrate body 2 and the ceramic is exposed. ing. For this reason, when the light emitting diode 8 is mounted on the bottom surface 7 of the cavity 5 and the cavity 5 is filled with the sealing resin j and solidified, the solidified sealing resin j and the concave grooves 10 are solidified. The exposed ceramic adheres firmly. In addition, the pair of concave grooves 10 divides the light reflecting layer 12 with a small area, and thus does not reduce the light reflection efficiency. Moreover, the concave groove 10 can be formed simultaneously with the punching of the insulating layer when obtaining a single or multiple insulating layer for forming the cavity 5 in the substrate body 2. .
Therefore, the sealing resin j to be filled later adheres firmly to the inside of the cavity 5, and the light from the mounted light emitting diode 8 can be efficiently reflected, and the manufacture is facilitated.

FIG. 3 is a plan view showing a wiring board 1 a which is a modification of the wiring board 1.
As shown in FIG. 3, the wiring substrate 1a includes a substrate main body 2a similar to the above, a cavity 5a that is open on the front surface 3 of the substrate main body 2a and in which the light emitting diode 8 is mounted on the bottom surface 7a, and a long cylinder of the cavity 5a. A light reflecting layer 12a formed on substantially the entire side surface 6a having a shape and a pair of concave grooves (grooves) 10a formed at the center of each long side of the side surface 6a are provided. In the following, parts different from the wiring board 1 will be described.
As shown in FIG. 3, the cavity 5a has an oval bottom surface 7a in plan view, and extends vertically from the periphery of the bottom surface 7a while penetrating through the upper insulating layer S1 and opening in the surface 3 of the substrate body 2a. And a substantially cylindrical side surface 6a.

  As shown in FIG. 3, a pair of concave grooves 10a are formed at the side surfaces 6a of the cavity 5a and the pair of light reflecting layers 12a are divided along the thickness direction of the substrate body 2a. And symmetric with respect to the cavity 5a. The pair of concave grooves 10a also have the same rectangular cross-sectional shape along the thickness direction of the substrate body 2a, and the ceramic of the substrate body 2 is exposed on the bottom surface and the pair of side surfaces. The cavity 5a, the pair of light reflecting layers 12a, and the pair of concave grooves 10a as described above are formed by the same method as described above.

According to the wiring substrate 1a as described above, the pair of concave grooves 10a in which the light reflecting layer 12a is divided and the ceramic is exposed are formed on the side surface 6a of the substantially long cylindrical cavity 5a. Therefore, when the light emitting diode 8 is mounted on the bottom surface 7a of the cavity 5a and the sealing resin j is filled and solidified later, the sealing resin j and the ceramic exposed in each concave groove 10a are strengthened. In close contact. Further, since the pair of concave grooves 10a has a small area, the reflection efficiency of the light reflecting layer 12a is not lowered. Further, the concave groove 10a can be easily formed as described above.
Accordingly, the sealing resin j to be filled tightly adheres to the inside of the cavity 5a, and the light from the mounted light emitting diode 8 can be efficiently reflected, and the manufacture is facilitated.

FIG. 4 is a plan view showing a wiring board 1 b which is a different modification of the wiring board 1.
As shown in FIG. 4, the wiring substrate 1b includes a substrate main body 2b similar to the above, a cavity 5b that is open on the surface 3 of the substrate main body 2b and in which the light emitting diode 8 is mounted on the bottom surface 7b, and an elliptic cylinder of the cavity 5b. A light reflecting layer 12b formed on substantially the entire side surface 6b having a shape, and a pair of concave grooves (grooves) 10b formed at the center of each long arc side of the side surface 6b. In the following, parts different from the wiring board 1 will be described.
As shown in FIG. 4, the cavity 5b has an oval bottom surface 7b in plan view, and extends vertically from the periphery of the bottom surface 7b while penetrating the upper insulating layer S1 and opening in the surface 3 of the substrate body 2b. And a substantially cylindrical side surface 6b.

  As shown in FIG. 4, the pair of concave grooves 10b are formed on the side surface 6b of the cavity 5b and divide the pair of light reflecting layers 12b along the thickness direction of the substrate body 2b. It is formed in a central position and symmetrical with respect to the cavity 5b. The pair of concave grooves 10b also have the same rectangular cross-sectional shape along the thickness direction of the substrate body 2b, and the ceramic of the substrate body 2 is exposed on the bottom surface and the pair of side surfaces. The cavity 5b, the pair of light reflecting layers 12b, and the pair of concave grooves 10b as described above are formed by the same method as described above.

According to the wiring board 1b as described above, the pair of concave grooves 10b in which the light reflecting layer 12b is divided and the ceramic is exposed are formed on the side surface 6b of the substantially elliptical columnar cavity 5b. For this reason, when the light emitting diode 8 is mounted on the bottom surface 7b of the cavity 5b and the sealing resin j is filled and solidified, the sealing resin j and the ceramic exposed in each concave groove 10b are strengthened. In close contact. Further, since the pair of concave grooves 10b has a small area, the reflection efficiency of the light reflecting layer 12b is not lowered. Further, the concave groove 10b can be easily formed as described above.
Accordingly, the sealing resin j to be filled closely adheres inside the cavity 5b, and the light from the mounted light emitting diode 8 can be efficiently reflected, and the manufacture is facilitated.

FIG. 5 is a plan view showing a wiring board 20 of a different form, and FIG. 6 is a cross-sectional view taken along the line YY in FIG.
As shown in FIGS. 5 and 6, the wiring substrate 20 has a substrate body 22 having a front surface 23 and a back surface 24, and a light emitting diode (light emitting element) 8 that is open on the front surface 23 of the substrate body 22 and is mounted on the bottom surface 27. A cavity 25, a light reflection layer 32 formed on a side surface 26 of the cavity 25, and a pair of concave grooves (grooves) 30 formed on the side surface 26 of the cavity 25.
The substrate body 22 has the same size as the substrate body 2 and is composed of an upper insulating layer S1 and a lower insulating layer S2 made of the same ceramic (insulating material), and the upper insulating layer S1 is composed of two ceramic layers. It is a laminate of s1 and s2.

As shown in FIG. 5 and FIG. 6, the cavity 25 has a circular bottom surface 27 in plan view, penetrates the upper insulating layer S <b> 1 while being inclined obliquely upward from the periphery of the bottom surface 27, and is formed on the surface 23 of the substrate body 22. And has a generally conical side surface 26 that is open and generally exhibits a generally conical shape. A pair of light reflecting layers 32 similar to those described above are formed in a substantially conical shape on substantially the entire side surface 26 of the cavity 25.
As shown in FIGS. 5 and 6, the pair of concave grooves 30 are formed on the side surface 26 of the cavity 25 and the pair of light reflecting layers 32 are separated from the cavity 25 so as to be divided along the thickness direction of the substrate body 22. Are formed symmetrically. The pair of concave grooves 30 are formed in a staircase shape in which two identical right-angled triangles are connected up and down at each hypotenuse along the thickness direction of the substrate body 22, and the inner surface including the intermediate step portion 31 is formed on the inner surface of the substrate body. The 22 ceramics are exposed.

The cavity 25, the pair of concave grooves 30, and the pair of light reflecting layers 32 are formed as follows.
First, a substantially conical through-hole is formed with a different inner diameter for each green sheet by punching with a punch and a die through a required clearance for each of the two green sheets that will be the upper insulating layer S1 after firing. . Alternatively, after forming through holes with different inner diameters by punching through a minimum clearance, by pushing a dedicated conical mold for each through hole, a substantially conical through hole, Each green sheet is formed with a different inner diameter.
Next, the same metal layer as described above is coated on the side surface (inner peripheral surface) of each substantially conical through hole in each green sheet.

Next, for each of the two green sheets, a part of the side surface of the through hole is individually cut with a cutting tool and a receiving die with respect to the inclined side surface including the metal layer of each through hole. Notches with right triangles in side view are individually formed.
Further, the two green sheets are laminated with conical concentric through-holes to obtain an upper green sheet (upper insulating layer). At this time, the notch of each green sheet also serves as a mark for alignment.

Then, a flat lower green sheet (laminated body) that becomes the lower insulating layer S <b> 2 is laminated by firing below the upper green sheet to form a substantially conical cavity 25. Finally, Ni plating, Au plating, Ag plating, or the like is performed on the metal layer.
As a result, the pair of concave grooves 30 having a step shape including the cavity 25, the step portion 31, and the pair of light reflecting layers 32 can be formed without requiring a complicated man-hour.
As shown in FIGS. 5 and 6, the same pads 14 and 15 are provided on the bottom surface 27 of the cavity 25, and the same via conductors 16 and 17 and wiring layers (not shown) are provided inside the substrate body 22. However, the back conductors 18 and 19 similar to the above are formed on the back surface 24 of the substrate body 22, respectively.

  According to the wiring board 20 as described above, a pair of concave grooves 30 in which the light reflecting layer 32 is divided along the thickness direction of the board body 32 and the ceramic is exposed are formed on the side surface 26 of the substantially conical cavity 25. ing. For this reason, when the light emitting diode 8 is mounted on the bottom surface 27 of the cavity 25 and the cavity 25 is filled and solidified with the sealing resin j, the solidified sealing resin j and the stepped concave grooves 30 Firmly adheres to the exposed ceramic. Further, since the concave groove 30 is stepped, in the substrate body 22, the space of the wiring layer formed between the ceramic layers s1 and s2 of the upper insulator S1 and between the upper insulator S1 and the lower insulating layer S2. Can be secured. Furthermore, since the concave groove 30 has a small area, the reflection efficiency of the light reflection layer 32 is not lowered. Moreover, the concave groove 30 is formed by individually punching two green sheets when the upper insulator S1 including the two ceramic layers s1 and s2 for forming the cavity 35 in the substrate body 2 is obtained. And it can form by laminating after cutting.

Therefore, according to the wiring board 20, the sealing resin j to be filled later adheres firmly to the inside of the cavity 25, and the light from the light emitting diode 8 can be efficiently reflected and the manufacture is facilitated.
Note that the ceramic layer forming the upper insulator S1 may be three or more layers, and the concave groove 30 having two or more step portions 31 may be used.
Further, according to the method described above, the cavity has a substantially long cone shape or elliptic cone shape in plan view, and the light reflecting layer 32 is arranged in the thickness direction of the substrate body 22 at the center of each long side or the center of the long arc side. It is also possible to obtain a wiring board in which stepped concave grooves 30 that are divided along the step are formed. Such a wiring board also has the same effect as the wiring board 20.

The present invention is not limited to the embodiments described above.
Instead of the ceramic upper and lower insulating layers S1 and S2 forming the substrate body, a glass-ceramic (insulating material) layer or a resin (insulating material) layer such as BT resin or epoxy resin may be used. good. The glass-ceramic is a glass-ceramic which is one of low-temperature fired ceramics such as a glass-alumina system having a firing temperature of 1000 ° C. or less.
Further, at least one of the concave grooves 10 and 30 may be formed on the side surfaces 6 and 26 of the cavities 5 and 25, or three or more may be formed at substantially equal intervals.
Furthermore, instead of the concave grooves 10 and 30, a groove having a substantially semicircular cross section may be used in the same manner as described above.

Further, when the pair of grooves are formed symmetrically on the side surface of the cavity, a pair of conductor layers provided on the bottom surface of the cavity and forming different circuits, and a pair of light reflecting layers divided by the pair of grooves are provided. , They may be conducted in parallel. In this case, the pair of grooves ensures insulation between the pair of light reflecting layers forming different circuits. The pair of conductor layers may be formed symmetrically on the bottom surface of the cavity and enter the inside of the substrate body along the bottom surface to form a part of the wiring layer. One or both of the pair of conductor layers may extend to the lower side of the light-emitting diode (light-emitting element) 8 and be directly connected to the light-emitting diode (light-emitting element) 8.
Furthermore, a plurality of cavities may be formed on a single substrate body. Alternatively, cavities having different shapes may be provided on the same substrate body.
In addition, the light emitting element may be a semiconductor laser instead of the light emitting diode.

The top view which shows the wiring board of one form in this invention. Sectional drawing along the arrow of the XX in FIG. The top view similar to FIG. 1 which shows the deformation | transformation form of the said wiring board. The top view similar to FIG. 1 which shows the different deformation | transformation form of the said wiring board. The top view which shows the wiring board of a different form. Sectional drawing along the arrow of the YY line in FIG.

Explanation of symbols

1, 1a, 1b, 20 ..... Light-emitting element mounting wiring board 2, 2a, 2b, 22 ..... Board body 3, 23 ............... Surface 4, 24 ..... ………………… Back 5, 5, 5a, 5b, 25 ………… Cavity 6, 6a, 6b, 26 ………… Side 7, 7a, 7b, 27 ………… Bottom 8 …………… …………………… Light Emitting Diode (Light Emitting Element)
10, 30 ………………………… concave groove (groove)
12, 12a, 12b, 32 ... Light reflecting layer S1, S2 ..... Upper and lower insulating layers (insulating material)
s1, s2 ……………………… Ceramic layer (insulating material)

Claims (3)

A substrate body having a front surface and a back surface and made of an insulating material;
A cavity that is open on the surface of the substrate body and on which the light emitting element is mounted on the bottom surface;
A light reflecting layer formed on a side surface of the cavity;
A groove formed on a side surface of the cavity and dividing the light reflecting layer along a thickness direction of the substrate body and exposing the insulating material.
A wiring board for mounting a light-emitting element. The cavity has a cylindrical shape, a long cylindrical shape, or an elliptical cylindrical shape, and the groove formed on a side surface of the cavity is formed with the same cross-sectional shape along the thickness direction of the substrate body.
The wiring board for mounting a light emitting element according to claim 1. The cavity has a substantially conical shape, a substantially long conical shape, or a substantially elliptical cone shape, and the groove formed on a side surface of the cavity is formed in a step shape along the thickness direction of the substrate body. ,
The wiring board for mounting a light emitting element according to claim 1.

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