JP2006235010A - Electro-optical display device and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical display device of which the yield and the quality are improved by suppressing intrusion of a sealing material into a liquid crystal in a display region and reducing operational malfunction of the liquid crystal, and a method for manufacturing the same. <P>SOLUTION: The electro-optical display device is equipped with a TFT substrate 1, a counter substrate bonded to the TFT substrate via a predetermined liquid crystal gap with the sealing material 3 of which the pattern has no liquid crystal injection port, the liquid crystal 5 held in a gap between the TFT substrate and the counter substrate, a first peripheral frame 2b surrounding the display region, and a second peripheral frame 2a surrounding the first peripheral frame, wherein the sealing material is applied to the outside of the second peripheral frame, and at the same time, the liquid crystal is held inside the first peripheral frame. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electro-optical display device and a manufacturing method thereof. Specifically, a plurality of peripheral frames are formed inside the seal area, liquid crystal is dropped on the inner area of the innermost peripheral frame, and a sealant and a common material are applied to the outer side of the outermost peripheral frame. Thus, the present invention relates to an electro-optic display device and a method for manufacturing the electro-optic display device which attempts to suppress the intrusion of the sealing material into the liquid crystal region.

As shown in the flowchart of FIG. 12, the conventional transmissive liquid crystal display device is manufactured by forming a plurality of drive substrates (hereinafter referred to as TFT substrates) on a glass substrate and forming the glass substrate at the time of forming the TFT substrate. After removing the film of SiO ₂ , SiNx, WSi, etc. formed on the back surface of the substrate by back surface optical polishing, for example, polyimide alignment film formation, rubbing treatment, predetermined cleaning, common material applied, and glass-based substrate A counter substrate on which a plurality of counter substrates such as a plurality of color filters, microlens arrays, and black masks are formed is superposed on a surface that has been subjected to, for example, polyimide alignment film formation, rubbing treatment, predetermined cleaning, and sealing material application. 13 is a so-called surface liquid crystal assembling method in which liquid crystal injection sealing is performed by scribe break after forming an empty cell, and the flowchart of FIG. As shown in, forming a plurality of TFT substrate to the glass-based substrate, SiO _2, which is formed on the back surface of the glass based substrate during the formation of the TFT substrate SiNx, after removal by the back surface optically polished film such as WSi , Dicing and cleaning to create a single TFT substrate, and dicing and cleaning the counter substrate on which a plurality of counter substrates such as a plurality of color filters, microlens arrays, and black masks are formed on a glass substrate. Create a counter substrate in a state, and perform, for example, polyimide alignment film formation, rubbing treatment, predetermined cleaning, common material application (TFT substrate), seal material application (counter substrate) on each non-defective TFT substrate and counter substrate, Then, there is a so-called single liquid crystal assembly method in which empty cells are formed by superposition and liquid crystal injection sealing is performed.

  However, in the above-described surface liquid crystal assembly method, there are problems such as a decrease in overlay accuracy, liquid crystal gap unevenness, damage due to a scribe break after overlay (decrease in reliability of the seal portion, etc.), substrate chipping and cracking, Since the glass substrate on which the TFT substrate is formed and the glass substrate on which the counter substrate is formed are overlapped with each other, the yield will be reduced as a whole even if only one of them is defective. It is difficult to improve.

  Further, when the back surface is optically polished, a warp is generated in a concave shape due to the compressive stress of the film on the surface of the glass substrate on which the TFT substrate is formed, and the glass substrate on which the counter substrate is formed also has ITO (indium When a transparent conductive film such as a tin-based transparent conductive film is formed, a warp is generated in a concave shape due to the compressive stress of the film. The combined liquid crystal gap tends to be convex, and there is a problem in liquid crystal gap uniformity.

  Furthermore, when the glass substrate on which the TFT substrate is formed is quartz glass or neo-ceram material, it is difficult to cut a diamond cutter or a carbide cutter. When blade dicing, cutting water enters from the liquid crystal inlet of the empty cell. There is a problem.

  On the other hand, in the single liquid crystal assembling method described above, it is possible to prevent defects at the time when the non-defective TFT substrate and the counter substrate are superimposed, but after each glass substrate is subjected to blade dicing, for example, polyimide alignment film formation or rubbing treatment is performed. For this reason, defective adhesion of dust due to blade dicing, defective glass chipping adhesion of the TFT substrate and the opposite substrate end, deterioration of workability, unevenness of the alignment film, and variation in alignment are caused.

Therefore, as shown in the flowchart of FIG. 14, a plurality of TFT substrates are formed on a glass substrate, and a film of SiO ₂ , SiNx, WSi or the like formed on the back surface of the glass substrate at the time of forming the TFT substrate is formed on the back surface. After removal by optical polishing, for example, polyimide alignment film formation, rubbing treatment, blade dicing, and cleaning to create a single TFT substrate, and multiple counter substrates such as multiple color filters, microlens arrays, and black masks are formed For example, polyimide alignment film formation, rubbing treatment, blade dicing, and washing are performed on the glass substrate to create a single counter substrate, and a common material is applied to each non-defective TFT substrate. A so-called single-surface liquid that is applied with a sealing material and then superposed to form empty cells to seal liquid crystal injection. Assembly method has been proposed (e.g., see Patent Document 1.).

  Since this method forms a polyimide alignment film on a glass substrate and is rubbed, uniform alignment characteristics can be obtained with good productivity, and an empty cell is formed by superimposing a non-defective TFT substrate and a counter substrate. Easy to remove, yield and quality are improved.

  Furthermore, as shown in Patent Document 2, a so-called chip mount liquid crystal assembling method in which a plurality of TFT substrates are formed on a glass substrate and a counter substrate divided into a single body is bonded to the TFT substrate may be employed. This chip mount method is said to be easy to obtain high productivity, advanced cell thickness control and high bonding accuracy.

  However, as described above, when the back surface optical polishing is performed, a concave warpage occurs due to the compressive stress of the film on the surface of the glass substrate on which the TFT substrate is formed, and the glass substrate on which the counter substrate is formed is also on the surface. When a transparent conductive film such as ITO, a microlens array, or a black mask is formed on the substrate, a warp is generated in a concave shape due to the compressive stress of the film, and a glass-based substrate on which a TFT substrate is formed and a counter substrate are formed. Since the back surface of the glass-based substrate is rubbed by a polyimide coating device, a bubbling device, or the like, and particularly scratched or adhered to the center portion of the substrate, LCD panel cleaning or LCD panel back surface optical polishing is required.

  Further, when the dust-proof glass is bonded to the LCD panel, the dust-proof glass is bonded to a single LCD panel, which causes problems such as scratches on the dust-proof glass, dust adhesion, and an increase in the number of panel cleaning steps.

  In addition, for the purpose of improving productivity in particular, when an in-line automatic liquid crystal assembly apparatus is introduced from overlaying to mold resin fixing for attaching an LCD panel to a metal frame, (1) a single TFT substrate and a counter substrate Work (cleaning, stacking, etc.) and single LCD panel work (liquid crystal injection sealing, dustproof glass bonding, metal frame attachment, etc.), the handling mechanism of the inline automatic liquid crystal assembly device is complicated, and the device (2) The handling of single TFT substrate, counter substrate, and LCD panel causes surface scratches due to vacuum suction pads and foreign matter adhesion failure, yield and quality. (3) The in-line automatic liquid crystal assembling apparatus composed of many complicated mechanisms has a relatively high failure rate, and maintenance Nsu man-hours is there is a problem of low productivity and the like is large.

  Further, in the chip mount liquid crystal assembly method, since the glass substrate is held and fixed to the stage, the stress generated in the glass substrate is reduced by heating the stage, and a means for suppressing warpage during alignment is adopted. When a heat combined ultraviolet irradiation curable sealing material is applied to a glass substrate TFT substrate, liquid crystal gap unevenness is likely to occur due to accelerated curing of the sealing material by stage heating. For this reason, it is necessary to apply a sealing material to the counter substrate in a single state, which causes handling problems and low productivity problems. Further, the counter substrate is handled by a vacuum suction quartz head with a plurality of apertures and is superposed on the TFT substrate. At this time, the back surface of the counter substrate is likely to be scratched and image quality defects are likely to occur.

  The above-described surface liquid crystal assembling method, single liquid crystal assembling method, surface single liquid crystal assembling method and chip mount liquid crystal assembling method are all formed after the TFT substrate and the counter substrate are overlapped to form an empty cell, and then the liquid crystal injection port. In this method, liquid crystal is injected.

  On the other hand, recently, a liquid crystal dropping / vacuum bonding method (ODF: One Drop Fill) has attracted attention in order to improve liquid crystal gap accuracy and productivity. This is because liquid crystal is dropped directly on the TFT substrate on which columnar spacers are formed using spacer dispersion or general-purpose photolithography technology, and a heat combined ultraviolet irradiation curing sealant and a common material are applied to the opposite substrate. , Hold both substrates with electrostatic chuck that holds the substrates by electrostatic adsorption, send them to the vacuum bonding device, evacuate the bonding device and place it up and down with the chamber inside at a constant vacuum pressure After positioning and aligning the TFT substrate and the counter substrate, UV irradiation is performed so that positional displacement does not occur in the bonding apparatus, and the sealing material and the common material are temporarily fixed and cured. Return to atmospheric pressure, carry out, pressurize uniformly to the cell gap determined by the spacer diameter or columnar spacers and the amount of liquid crystal dropped by atmospheric pressure, and then A sealing material and a common material is intended that the present cured in furnace, is to adopt one of the so-called surface faces the liquid crystal assembly method.

  However, such a method has a problem that the liquid crystal is easily contaminated with the sealing material because the uncured sealing material comes into contact with the liquid crystal when performing the vacuum superposition. In particular, when micropearls are mixed with a fiber corresponding to a liquid crystal gap or a common material in the sealing material, it is necessary to pay attention to liquid crystal contamination in the fibers and micropearls.

  To solve such a problem, a single peripheral frame is formed so as to surround the display area and the drive circuit area in which pixels are formed on the drive substrate of the reflective LCD, and a plurality of frames are included in the peripheral frame including the display area. OCS (On-Chip Spacer) is provided, liquid crystal is dropped inside the peripheral frame and the opposite substrate is bonded to hold the liquid crystal composition in the peripheral frame and seal with the same width outside the peripheral frame A technique of filling a material has been proposed (for example, see Patent Document 3).

  In addition, the contact angle between the liquid crystal droplets of the same material and the liquid crystal as the peripheral frame material is 35 ° or more, and an organic substance made of a silicon resin or a fluorine resin mixture insoluble in the liquid crystal is used, and the liquid crystal is dropped inside the peripheral frame. There has been proposed a technique in which a counter substrate is made to face with a sealant of a photo-curing adhesive outside the peripheral frame, and the both substrates are bonded by light irradiation and cured (see, for example, Patent Document 4).

Japanese Patent No. 3250411 JP 2003-66401 A JP 2003-177388 A Japanese Patent No. 3020068

  However, the peripheral frame described in Patent Document 3 described above may serve as a stopper for the sealing material and can be expected to prevent the uncured sealing material from coming into contact with the liquid crystal and contaminating the liquid crystal with the sealing material. However, the liquid crystal and the sealing material may be contacted and mixed with each other through the peripheral frame due to the pressurization at the time of bonding the counter substrate, so that it cannot be said that the prevention of contamination is perfect. In addition, the OCS alignment film formed in the display region and the alignment process are insufficient, and liquid crystal operation problems such as light leakage are likely to occur, resulting in a decrease in image quality.

  Further, in the technique described in Patent Document 4 described above, the liquid crystal and the peripheral frame material are prevented from being mixed, but the peripheral frame material is not cured in advance. Since the material may come into contact with the liquid crystal through the peripheral frame material, the prevention of contamination is not perfect.

  The present invention has been devised in view of the above points, and is an electro-optical display device capable of suppressing the intrusion of the sealing material into the liquid crystal in the display region, reducing the malfunction of the liquid crystal, and realizing an improvement in quality. And it aims at providing the manufacturing method.

  In order to achieve the above object, an electro-optical display device according to the present invention includes a TFT substrate having a display region and a peripheral region including a liquid crystal driving circuit, a video signal control and processing circuit, and the TFT substrate and a predetermined region. A counter substrate bonded with a sealing material or a sealing material and a common material having a liquid crystal injection hole-less pattern through a gap, a liquid crystal held in the gap between the TFT substrate and the counter substrate, and at least a display area surrounding the display area An electro-optic display device comprising a peripheral frame of one and a second peripheral frame surrounding the first peripheral frame, wherein the sealing material or the sealing material and the common material are outside regions of the second peripheral frame And the liquid crystal is held in the inner region of the first peripheral frame.

  Here, the liquid crystal is held at least in the inner region of the first peripheral frame surrounding the display region, and the sealing material or the sealing material and the common material are disposed in the outer region of the second peripheral frame surrounding the first peripheral frame. That is, that is, an outer region of the second peripheral frame is formed by forming at least two peripheral frames between the application region of the sealing material or the sealing material and the common material and the liquid crystal holding region. It becomes very difficult for the sealing material or the sealing material and the common material applied to the liquid crystal held inside the first peripheral frame via the second peripheral frame and the first peripheral frame, It can suppress that the bad influence of the liquid-crystal contamination by a sealing material or a sealing material, and a common material reaches the liquid crystal of the inner side area | region of a 1st peripheral frame.

  In order to achieve the above object, a method of manufacturing an electro-optical display device according to the present invention includes a first peripheral frame that forms a plurality of TFT substrates on a base and surrounds at least a display region of each TFT substrate; A step of forming a second peripheral frame surrounding the first peripheral frame, a step of forming a liquid crystal alignment film corresponding to each TFT substrate or a step of forming a liquid crystal alignment film and a liquid crystal alignment process, and a step corresponding to each counter substrate Liquid crystal alignment film formation or liquid crystal alignment film formation and liquid crystal alignment treatment, and sealing of liquid crystal inlet-less pattern in the seal area or seal area and common area outside the second peripheral frame of the TFT substrate formed on the substrate After applying a material or a seal material and a common material, and dropping a predetermined amount of liquid crystal on the inner region of the first peripheral frame, the TFT substrate and the counter substrate face each other with a predetermined gap To adjust the position of the counter substrate formed on the substrate relative to each other, and superimpose them in a vacuum device (for example, a vacuum bonding device) having a predetermined degree of vacuum with a predetermined gap, and if necessary A step of curing the temporary seal with a predetermined amount of UV irradiation, and returning the inside of the vacuum device to the atmospheric pressure to perform bonding with uniform pressurization of the atmospheric pressure, curing the sealing material and the common material, A step of forming a liquid crystal gap LCD panel, and a step of dividing the substrate on which the TFT substrate is formed and the substrate on which the counter substrate is formed for each LCD panel.

  In addition, the method for manufacturing an electro-optic display device according to the present invention includes forming a plurality of counter substrates on a base, and forming a first peripheral frame and an area on each counter substrate corresponding to a region surrounding at least the display region of the TFT substrate. A step of forming a second peripheral frame surrounding the first peripheral frame, a step of forming a liquid crystal alignment film corresponding to each counter substrate, a step of forming a liquid crystal alignment film and a liquid crystal alignment process, and a step corresponding to each TFT substrate Liquid crystal alignment film formation or liquid crystal alignment film formation and liquid crystal alignment treatment, and sealing of liquid crystal inlet-less pattern in the seal area or seal area and common area outside the second peripheral frame of the counter substrate formed on the substrate After applying a material or a seal material and a common material, and dropping a predetermined amount of liquid crystal on the inner region of the first peripheral frame, the TFT substrate and the counter substrate face each other through a predetermined gap. In this way, the TFT substrate formed on the substrate is adjusted relative to each other, and is superposed in a vacuum apparatus with a predetermined degree of vacuum at a predetermined gap, and temporarily fixed with a predetermined amount of UV irradiation as necessary. A step of curing the seal, and a step of returning the inside of the vacuum device to the atmospheric pressure to perform bonding by uniform pressurization of the atmospheric pressure, and curing the sealing material and the common material to form an LCD panel having a predetermined liquid crystal gap And a step of dividing the base on which the TFT substrate is formed and the base on which the counter substrate is formed for each LCD panel.

  Here, a sealing material and a common material having a liquid crystal injection hole-less pattern are applied to the outer sealing region and the common region of the second peripheral frame of the TFT substrate formed on the substrate, and the inner region of the first peripheral frame is applied to the inner region of the first peripheral frame. After dropping a predetermined amount of liquid crystal, the counter substrate formed on the base is positioned relative to the TFT substrate and the counter substrate so that the TFT substrate and the counter substrate face each other with a predetermined gap. The first peripheral frame and the first peripheral are formed in each region of the counter substrate corresponding to the region surrounding at least the display region of the TFT substrate. Forming a second peripheral frame surrounding the frame, applying a sealant and a common material of a liquid crystal injection-free pattern to the seal region and the common region of the counter substrate, and applying a predetermined amount to the inner region of the first peripheral frame; Liquid crystal was dropped In addition, the TFT substrate formed on the base is positioned relative to each other so that the TFT substrate and the counter substrate face each other with a predetermined gap, and are stacked in a vacuum device having a predetermined vacuum degree with a predetermined gap. A seal applied to the outer region of the second peripheral frame by combining, ie, forming at least a double peripheral frame inside the seal region and dropping liquid crystal on the inner region of the inner peripheral frame It becomes very difficult for the material or the sealing material and the common material to come into contact with the liquid crystal dropped inside the first peripheral frame via the second peripheral frame and the first peripheral frame, and the sealing material or the sealing material In addition, it is possible to suppress the adverse effect of the liquid crystal contamination due to the common material on the liquid crystal in the inner region of the first peripheral frame.

  In the electro-optic display device to which the present invention is applied and the manufacturing method thereof, at least the peripheral frame is formed in a double layer so that the sealing material and the common material can be formed by applying pressure such as vacuum superposition of substrates and bonding of atmospheric pressure. Even if the outer peripheral frame exceeds the outer peripheral frame, a sealing material layer or a mixed layer of liquid crystal and sealing material overflowing from the inner peripheral frame may be formed between the outer peripheral frame and the inner peripheral frame. However, since the sealing material and common material do not exceed the inner peripheral frame, and the contamination of the sealing material and common material into the liquid crystal in the display area can be prevented, liquid crystals such as point defects, image sticking, light leakage, and responsiveness deterioration are observed. Operational problems are prevented and the quality of the electro-optic display device can be improved.

Also, by making the peripheral frame quadruple, an overflowing sealing material layer is formed between the outermost peripheral frame and the peripheral frame located second from the outside, and the innermost peripheral frame and second from the inner side. An overflowed liquid crystal layer is formed between the peripheral frames positioned, and a substantially vacuum layer, an overflowed liquid crystal layer, and an overflowing sealing material are provided between the peripheral frame positioned second from the outside and the peripheral frame positioned second from the inside. When a layer or a mixed layer of overflowing liquid crystal and overflowing sealing material is formed, the adverse effect of the sealing material does not reach the liquid crystal in the inner region of the peripheral frame located on the innermost side, and it faces the TFT substrate. A peripheral frame that functions as multiple stoppers is formed between the substrates, preventing liquid crystal operation problems such as point defects, burn-in, light loss, and poor response. Narazu, moisture infiltration from outside can be sufficiently suppressed, confidentiality of electro-optical display device (sealing property) can be improved.
In this way, by making the peripheral frame multiplex such as quadruple, sixfold, and eightfold, it is possible to prevent mixing of the sealing material into the liquid crystal, and to prevent contamination and moisture intrusion into the liquid crystal. Quality and reliability are improved.
At this time, since there are multiple peripheral frames according to the present invention, it is possible to prevent a seal pass symptom when the atmospheric pressure is released, so that it is not necessary to apply a dummy seal material on the outermost periphery of the TFT substrate or the counter substrate, thereby improving productivity and reducing costs. I can plan.

  In addition, immediately after a predetermined amount of liquid crystal is dropped with a dispenser in the area surrounded by the inner peripheral frame, the laser sensor senses the amount of dripping and the presence / absence of dripping, for example, by irradiating with laser and sensing the fluctuation of reflected light If the determination is made by moving the optical sensor in a step-and-repeat manner in synchronization with the dispenser, it is possible to prevent liquid crystal dripping and liquid crystal dripping amount shortage and improve yield, quality and productivity. it can.

  Further, the substrate on which the counter substrate corresponding to the external extraction electrode portion of the TFT substrate is formed (hereinafter referred to as the counter substrate) is left by 50 to 100 μm by, for example, blade dicing or UV pulse laser dicing, and deep cut dicing is performed. After performing full-cut dicing of the opposing substrate with a recess formed by cutting, for example, 200 to 300 μm up to the substrate on which the TFT substrate is formed (hereinafter referred to as TFT substrate), the portion subjected to deep-cut dicing is broken to form the opposing substrate. By dividing each counter substrate, yield and quality are improved.

  In addition, when forming an inorganic alignment film such as a SiOx oblique deposition film using a metal mask, there are problems such as misalignment of the metal mask, adhesion of dust and scratches, cleaning of the metal mask, etc. An inorganic alignment film such as a SiOx oblique vapor deposition film is formed on the entire surface without using it, and the upper part of each TFT substrate in the TFT substrate, the common part, the external extraction electrode part, etc. and the opposite substrate in the opposite substrate By etching an SiOx oblique deposition film having a thickness of about 30 to 50 nm formed on the upper part of the seal part, the common part, etc. with, for example, a wavelength 355 nm UV pulse laser by third harmonic modulation of a wavelength 1064 nm YAG laser, the sealing property and common Electro-optical display device with improved electrical conductivity and no need for metal mask and metal mask cleaning Reduction of manufacturing cost can be realized.

  Also, after dropping the liquid crystal, applying vacuum bonding, and optically polishing the back surface, for example, a protective glass large plate with a low reflection film is superimposed on the back surface of the opposite substrate on which the UV adhesive is spin-coated or dispensed, and a predetermined vacuum is applied. After UV-curing and bonding immediately before or after returning to atmospheric pressure after defoaming at a degree, a protective glass large plate with a low reflection film and a counter substrate, and further a protective glass large plate with a low reflection film, a counter substrate and a TFT When the substrate is solid laser or gas laser or laser dicing or blade dicing combining solid and gas laser, the productivity is improved and the manufacturing cost is reduced.

  Further, for example, a counter substrate having a thickness of, for example, 2.0 mm, which is obtained by adding 1.0 mm thickness of the counter substrate and 1.0 mm thickness of the protective glass large plate with a low reflection film, transparent ITO or IZO or the like on one side of the counter substrate. Forming a conductive film, forming a low-reflection film on the other surface, and forming a liquid crystal alignment film on the side on which the transparent conductive film is formed eliminates the work of attaching protective glass with a low-reflection film. This improves productivity and reduces manufacturing costs.

  Also, liquid crystal dropping and vacuum bonding in units of TFT substrate and counter substrate, bonding of large and small protective glass on the incident and exit sides, liquid crystal gap inspection and image inspection, UV irradiation curing and fixing annealing of sealing materials and common materials, liquid crystal By performing a series of operations such as orientation heat treatment and optical back surface polishing, the handling is easy and the productivity is good.

  Also, by removing the TFT formation film on the back side of the TFT substrate and further optically removing scratches and dirt on the back side of the counter substrate, cleaning work for the TFT substrate constituting the LCD panel and the back surface of the counter substrate becomes unnecessary, yield and quality. Improvements in production, significant man-hour reduction, and reduction in manufacturing cost due to improved productivity.

  Also, after double-sided optical polishing, LCD panel unit liquid crystal gap inspection and image inspection are performed in units of LCD panels, and only the LCD panel that has passed is bonded to the entrance and exit side protective glass chips with a transparent adhesive to protect There is no glass dust trapping defect and bubble defect, eliminating the need for cleaning work, improving yield and quality, drastically reducing man-hours, and reducing manufacturing costs by improving productivity.

  When full cut blade dicing of the TFT substrate with the protective glass chip bonded to the counter substrate is performed, if the dicing tape is applied to the protective glass chip of the counter substrate, the height of the protective glass chip is as if V-cut. Or, it corresponds to a U-cut groove, and there is no need for V-cut or U-cut dicing on the back side of the TFT substrate, and full-cut blade dicing without tape cut, reducing adhesion dust and dirt defects caused by tape glue during dicing. Yield and quality are improved.

  Further, when a protective glass chip for UV tape protection is bonded to the TFT substrate of the TFT substrate and the counter substrate, there is no adhesion dust and dirt defects due to tape glue at the time of blade dicing of the TFT substrate, and the yield and quality are improved. Furthermore, the flexible glass is attached to the LCD panel on which the protective glass chip for protecting the UV tape is attached, so that the protective glass is not damaged and dust is not adhered, and the yield and quality are improved.

  In addition, since handling is performed in units of TFT substrates or opposing substrates, the handling mechanism can be simplified and inexpensive manufacturing devices (for example, liquid crystal dropping / vacuum bonding devices, protective glass large plate bonding devices, image inspection devices, liquid crystal gap inspections). Device, image quality inspection device, etc.). Further, problems such as chipping, scratches, and dust adhesion of the TFT substrate, the counter substrate and the protective glass chip due to handling are solved, so that yield and quality are improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings to provide an understanding of the present invention.

[A] Projector Transmission LCD with TFT Substrate and Opposite Substrate Made of Quartz Glass Material FIG. 1 shows the steps of a method for manufacturing a projector transmission LCD as an example of a method for manufacturing an electro-optic display device to which the present invention is applied. It is a flow.
Hereinafter, a method for manufacturing a projector-use transmissive LCD will be described along the process flow shown in FIG.

In a method for manufacturing a transmissive LCD for a projector to which the present invention is applied, first, a plurality of TFT substrates are formed on a TFT substrate made of quartz glass material having a 12-inch diameter and a thickness of 1.2 mm. TFT substrate that maintains high flatness, leaving SiO ₂ , SiNx, a light-shielding transition metal silicide film (tungsten silicide; WSi ₂ , molybdenum silicide; MoSi ₂ , titanium silicide; TiSi _2, etc.) formed on the back surface In addition, as shown in FIG. 3A, each TFT substrate 1 in the TFT substrate 10 is patterned on a photosensitive resin by using a general-purpose lithography technique to form at least a double peripheral frame 2, For example, a double peripheral frame having a peripheral frame width of 50 μm, a distance between the peripheral frames of 100 μm, and a height corresponding to a liquid crystal gap of 2.5 μm is formed. First peripheral frame 2a formed by the peripheral frame, the peripheral frame formed inside the second peripheral frame 2b to.

Simultaneously with the formation of the peripheral frame as required, a plurality of OCSs 7 having a height corresponding to a liquid crystal gap between the display region 6 of the TFT substrate and the second peripheral frame (for example, 2 to 3 μmφ, A liquid crystal gap of a height corresponding to 2.5 μm).
At this time, the OCS 7 having a height corresponding to the liquid crystal gap may be formed around the plurality of pixel openings in the display area 6 within a range that does not adversely affect the image quality, thereby enhancing the liquid crystal gap control.
An organic liquid crystal alignment film (hereinafter also referred to as an alignment film) such as polyimide or polyamide is formed on the entire surface of the TFT substrate or for each TFT substrate, and photo-alignment or ion beam is applied by bubbling alignment or linearly polarized ultraviolet irradiation at a predetermined angle. Liquid crystal alignment treatment (hereinafter also referred to as alignment treatment) such as alignment or laser alignment, or oblique deposition film formation at a predetermined deposition angle such as SiOx or directional sputtering film at a predetermined sputtering angle such as SiOx After forming or forming an inorganic liquid crystal alignment film such as a DLC (Diamond Like Carbon) film formed by ion beam alignment treatment with argon or the like at a predetermined angle, organic cleaning using IPA (isopropyl alcohol) or the like as necessary To do.
In the case of an inorganic liquid crystal alignment film such as SiOx, UV irradiation cleaning and atmospheric pressure plasma cleaning may be performed alone or in combination with organic cleaning.

  Here, the TFT substrate is a quartz glass substrate composed of a plurality of TFT substrates and scribe lines, and the TFT substrate is a peripheral circuit unit such as a display unit, a liquid crystal driving circuit and a video signal control and processing circuit, and a seal unit (common). Switching element such as TFT, ITO (Indium Tin Oxide: mixed transparent conductive film of indium oxide and tin oxide), IZO (Indium Zinc Oxide; mixed of indium oxide and zinc oxide) A transparent pixel electrode made of a transparent conductor such as a transparent conductive film, wiring, an external extraction electrode, and the like are formed.

When forming an organic alignment film such as polyimide or polyamide, a solution of polyimide, polyamide or the like is applied to the entire surface of the TFT substrate by spin coating, bar coating, dip coating, etc., and a solvent is obtained by pre-baking (80 ° C., 10 minutes). Is volatilized and then baked at 180 ° C. for 1 hour to form a film of polyimide, polyamide or the like in the range of 5 to 50 nm, preferably about 30 to 50 nm. At this time, organic alignment films such as polyimide and polyamide are also formed in the common area of the TFT substrate. However, organic micro-pearls of the gold plating resin in the common agent are applied with pressure when superposed, such as polyimide and polyamide. The alignment film is pierced to electrically connect the transparent conductive film of the counter substrate and the transparent conductive film of the TFT substrate. Furthermore, an organic alignment film such as polyimide and polyamide is also formed on the external extraction electrode portion of the TFT substrate, but the filler in the anisotropic conductive film of the flexible substrate is thermocompression-bonded and organic alignment such as polyimide and polyamide is performed. The external lead electrode part and the flexible substrate are electrically connected by breaking through the film.
At this time, in order to reduce the electric resistance between the measurement terminal and the flexible substrate in the image inspection, the organic alignment film on the seal and the common part and the external extraction electrode part may be removed by laser etching using an excimer laser or the like. .
Further, in the state of the LCD panel, the organic alignment film of the external extraction electrode portion may be removed by atmospheric pressure plasma etching.

  Alternatively, each TFT substrate in the TFT substrate is applied by roll coating with a printing plate, and the solvent is volatilized by pre-baking (80 ° C., 10 minutes), followed by baking at 180 ° C. for 1 hour to form a film of polyimide, polyamide, or the like. 5-50 nm, preferably about 30-50 nm. At this time, since an organic alignment film such as polyimide or polyamide is not formed in the seal region, common region, and external electrode lead-out portion, electrical conduction is easy.

Depending on the inorganic alignment film thickness such as SiOx, it is difficult to penetrate the inorganic alignment film such as SiOx by pressure bonding of the gold plating resin micropearl in the common agent. Therefore, as shown in FIG. It is preferable to remove the inorganic alignment film such as SiOx on the sealing portion and the common portion of the substrate by laser etching with a UV pulse laser having a wavelength of 355 nm, which is the third harmonic modulation of a wavelength 1064 nm YAG laser. Similarly, depending on the inorganic orientation film thickness such as SiOx, it is difficult to electrically connect the anisotropic conductive film of the flexible substrate by thermocompression bonding. It is preferable to remove the inorganic alignment film by laser etching with a UV pulse laser having a wavelength of 355 nm, which is the third harmonic modulation of a 1064 nm YAG laser similar to the above. In this case, for example, the UV pulse laser having a beam spot size of 50 to 200 μmΦ and a laser power of 10 to 100 W (10 KHz) is applied in the X-Y direction (in FIG. 2, laser beam A indicates scanning irradiation in the X direction. Laser beam B indicates scanning irradiation in the Y direction.) Multiple reciprocating scanning irradiations are applied to the sealing portion of the TFT substrate, the common portion, the upper portion of the external extraction electrode portion, 30 to 50 nm thick SiOx, etc. The inorganic alignment film is removed. In the etching on the external extraction electrode portion, it is necessary to adjust the UV pulse laser power and the number of times of reciprocating scanning so that the external extraction electrode portion is not etched.
At this time, simultaneously with the etching of the inorganic alignment film such as SiOx, the glass in the sealing region of the TFT substrate is also slightly etched to form surface irregularities, but the adhesion with the sealing material is improved and the sealing performance is enhanced.
In addition, if necessary, the inorganic component such as SiOx or the like melted by causing the vacuum suction port to follow in synchronization with the laser irradiation so that the inorganic component such as SiOx or the like melted by the laser does not adhere and cause defects due to dust. Dust measures such as removal are necessary.
Note that only the inorganic alignment film such as SiOx on the common part and the external extraction electrode part may be etched by selective spot laser irradiation.

  It should be noted that the sealing material for the TFT substrate, the common material application region, and the external extraction electrode portion of the TFT substrate may be masked so that the inorganic alignment film such as SiOx is not formed. There are problems such as misalignment, adhesion of dust and scratches, and metal mask cleaning.

Also, a counter substrate composed of a plurality of counter substrates of quartz glass material or crystallized glass material having a thickness of 12 inches and a thickness of 1.1 mm is formed, and an organic liquid crystal alignment film such as polyimide or polyamide is formed in the same manner as the TFT substrate. Then, liquid alignment such as buffing alignment or linearly polarized ultraviolet light irradiation or ion beam alignment or laser alignment is performed at a predetermined angle, or oblique vapor deposition film formation at a predetermined deposition angle such as SiOx or SiOx is predetermined. After forming an inorganic liquid crystal alignment film such as a directional sputtering film formation at a sputtering angle or a DLC film formation by ion beam alignment treatment with argon or the like at a predetermined angle, organic cleaning using IPA or the like as necessary To do.
In the case of an inorganic liquid crystal alignment film such as SiOx, UV irradiation cleaning and atmospheric pressure plasma cleaning may be performed alone or in combination with organic cleaning.

  Here, the counter substrate is a quartz glass or crystallized glass substrate composed of a plurality of counter substrates and scribe lines, and the counter substrate is a microlens array substrate or a black mask substrate (a light shielding film is formed in addition to the pixel openings, On the entire surface, a transparent conductive film such as ITO or IZO without pattern) or a solid transparent conductive film substrate (transparent conductive film such as ITO or IZO without pattern) is formed.

When forming an organic alignment film such as polyimide or polyamide, a solvent such as polyimide or polyamide is applied to the entire opposing substrate by spin coating, bar coating, dip coating, or the like, and the solvent is pre-baked (80 ° C., 10 minutes). Is volatilized and then baked at 180 ° C. for 1 hour to form a film of polyimide, polyamide or the like in the range of 5 to 50 nm, preferably about 30 to 50 nm. At this time, an organic alignment film such as polyimide or polyamide is also formed in the common area of the counter substrate, but the organic plating film such as polyimide and polyamide is applied by the pressure applied when the gold plating resin micropearl in the common agent is superposed. The alignment film is pierced to electrically connect the transparent conductive film of the counter substrate and the transparent conductive film of the TFT substrate.
At this time, in order to reduce the electric resistance of the common portion, the organic alignment film in the common region may be removed by laser etching using an excimer laser or the like.

  Or after applying a solvent such as polyimide or polyamide by roll coating with a printing plate on each counter substrate in the counter substrate, volatilizing the solvent by pre-baking (80 ° C., 10 minutes), and baking at 180 ° C. for 1 hour, A film made of polyimide, polyamide or the like is formed to have a thickness of 5 to 50 nm, preferably about 30 to 50 nm. At this time, since the organic alignment film such as polyimide or polyamide is not formed in the common region, electrical conduction is easy.

Depending on the inorganic alignment film thickness such as SiOx, it is difficult to penetrate the inorganic alignment film such as SiOx by pressure bonding of the gold plated resin micropearl in the common material. The inorganic alignment film such as SiOx on the seal portion and the common portion of each counter substrate in the counter substrate is removed by laser etching using, for example, a UV pulse laser with a wavelength of 355 nm which is the third harmonic modulation of the wavelength 1064 nm YAG laser. preferable.
The SiOx oblique vapor deposition film formed on the TFT substrate and the counter substrate has a coarse particle size, low density and low hermeticity as compared with the glass-based substrate. It is preferable to perform laser etching on the upper SiOx oblique deposition film at the same time because the sealing property is improved and the quality and reliability are improved.
In addition, if necessary, the inorganic component such as SiOx that has been melted by laser by tracking the vacuum suction port in synchronization with the laser irradiation so that the inorganic component such as SiOx that has been melted by laser does not adhere and cause defects due to dust. Dust measures such as removal are necessary.
Note that only the inorganic alignment film such as SiOx above the common portion may be etched by selective spot laser irradiation.

  In addition, it is possible to mask the sealing material and the common agent application region of the counter substrate so that an inorganic alignment film such as SiOx is not formed. However, in the case of masking, the metal mask is misaligned, dust and scratches are attached, There are problems such as metal mask cleaning.

Next, as shown in (b) of FIG. 3A, for example, a seal material (hereinafter also referred to as a seal material) of a heat combined type ultraviolet irradiation curable adhesive is provided outside the peripheral frame 2a formed on the outside of the TFT substrate. ) 3 is dispensed within the seal width of 500 μm, and at the same time, a common material (hereinafter also referred to as “common material”) of heat combined ultraviolet irradiation curing adhesive is dispensed with a coating diameter of about 200 μm, and the periphery formed inside A predetermined amount of the liquid crystal 5 is dispensed inside the frame 2b.
At this time, for example, the sealing material 3 is dispensed on the outer side of the peripheral frame 2a of the TFT substrate within a seal width of 500 μm, and the common material 4 is dispensed in an area corresponding to the common portion of the counter substrate at a coating diameter of about 200 μm at least at two locations. It may be applied.

Here, the amount of liquid crystal to be dropped is, for example, about 0.1 mg is repeated eight times in the vicinity of the center of the display area of the 0.79 type TFT substrate, and about 0.8 mg is dispensed, and the height is the second. It is necessary to prevent the liquid crystal from becoming insufficient as the amount of liquid crystal that is slightly raised by the surface tension of the peripheral frame 2b. Then, the seal material is dispensed at about 1500 to 1600 μm ² near the center of the seal portion, the common material is dispensed at a coating diameter of about 200 μm at least at two locations, and the second material jumps over the first peripheral frame 2a. It is necessary not to flow inside the peripheral frame 2b.

Further, as shown in FIG. 3A (b), the liquid crystal dispenser 8 and the laser sensor 9 are moved by a step-and-repeat method without moving the TFT substrate, and immediately after a predetermined amount of liquid crystal is dropped. Laser irradiation and sensing with fluctuation of reflected light, or without moving the laser sensor 9 and the liquid crystal dispenser 8, the TFT substrate is moved in a step-and-repeat manner, and the laser is synchronized immediately after a predetermined amount of liquid crystal is dropped. It is desirable to perform irradiation and sense by fluctuation of reflected light to optimize the presence / absence of liquid crystal dripping and the amount of liquid crystal dripping in the second peripheral frame.
Note that a method may be used in which an image is captured by a CCD and whether or not liquid crystal is dropped and whether the amount of liquid crystal is dropped is determined appropriately.
Thus, for example, when there is no liquid crystal dropping or shortage due to a liquid crystal dispenser failure, the liquid crystal dropping amount is optimized immediately after the failure is detected, so that the liquid crystal unfilling failure due to liquid crystal shortage can be prevented.
Here, the sealing material and common material application and liquid crystal dropping are performed on the TFT substrate side, but the sealing material application and liquid crystal dropping may be performed on the TFT substrate side and the common material application may be performed on the counter substrate side.

  By the way, there are screen printing method and dispenser method for applying the sealing material, but the former screen printing method is the latter dispenser method because the screen fabric is in contact with the alignment film surface and the orientation force varies and mesh marks are easily generated. Is desirable. The dispenser method applies the sealing material while extruding the sealing material in the syringe with compressed air.

  Further, in order to establish electrical continuity between the TFT substrate and the counter substrate, a common material mixed with micropearls of gold-plated resin in a syringe is applied by a dispenser to at least two common pad portions of the TFT substrate with a dispenser.

  Here, the sealing material and the common material are a visible light irradiation curable adhesive, a visible light irradiation curable adhesive used in combination with heat curing, or an ultraviolet irradiation curable adhesive, an ultraviolet irradiation curable adhesive combined with heat curing, and a thermosetting. Any of the mold adhesives may be used, but the same type is preferable in view of characteristics and work surface.

  Specific seal materials and common materials include, for example, modified acrylate oligomers that exhibit basic characteristics after curing with the main components of the seal materials and common materials, acrylate monomers that adjust the viscosity of the liquid, and curing visible light or UV cured portions. Filler composed of photoinitiator, sealant and common material, epoxy resin that shows basic characteristics after curing, curing agent that hardens epoxy resin, etc. (Silica spheres, etc.), fibers corresponding to liquid crystal gaps (gap agents), and the like are included.

  In addition, the common material applied to the common pad portion in the TFT substrate is mixed with micropearl of gold plating resin that is slightly larger than the liquid crystal gap (for example, if the liquid crystal gap is 2 μm, about 3 μm φ, which is about 1 μm larger than the liquid crystal gap). Thus, the micro pearl is crushed by the pressure applied when the TFT substrate and the counter substrate are overlapped, and the crushed gold plating resin can electrically connect both transparent conductive films. In addition, when there is a liquid crystal alignment film such as polyimide or polyamide in the sealing region, the material of micropearl so that the gold plating resin crushed through the film and the both transparent conductive films are electrically connected, It is necessary to devise the size.

  Furthermore, when an organic liquid crystal alignment film such as polyimide or polyamide is formed in the sealing area of the TFT substrate or / and the counter substrate by spin coating or the like, filling with a filler to prevent moisture from entering into the sealing material from the outside air The filler filling rate needs to be optimized depending on the size of the LCD panel. For example, a filler filling rate of about 10 to 30% is preferable for an LCD panel for projectors of about 1 inch size. It is preferable to determine the balance with the rate.

Next, as shown in FIG. 3 (B) (c), in a vacuum laminating apparatus having a predetermined degree of vacuum (for example, 1 to 3 Pa), electrostatic is performed by a ceramic type or polymer type electrostatic chuck stage 43. Required after positioning the X-, Y-, and θ-directions of the TFT substrate 10 held by the chuck and the opposite substrate 11 held similarly by the ceramic type or polymer type electrostatic chuck and overlapping them with a predetermined pressure at a predetermined gap. In order to prevent the positional deviation between the two substrates, for example, the temporary fixing seal is cured by a predetermined amount of UV irradiation through the temporary fixing light-shielding jig 12, and the substrates are bonded together by applying a uniform atmospheric pressure immediately after returning to atmospheric pressure. By performing the above, the fiber corresponding to the liquid crystal gap in the sealing material and the amount of liquid crystal dropped, and the liquid crystal gas controlled with high accuracy by the action of the double peripheral frames 2a and 2b of the present invention and the OCS 7 are used. LCD panels flop can be obtained.
At this time, since there is a double peripheral frame of the present invention, there is no seal path symptom when the atmospheric pressure is released, and it becomes unnecessary to apply a dummy seal material on the outermost periphery of the TFT substrate or the counter substrate.
At this time, since the transition metal silicide film (WSi ₂ , MoSi ₂ , TiSi _2, etc.) formed on the back surface of the TFT substrate remains, the TFT element is static even if the electrostatic chuck is performed. The liquid crystal gap non-uniformity can be reduced because the bonding is performed on the TFT substrate that is not damaged and maintains high flatness.
Then, the micro pearl in the common material is crushed by the atmospheric pressure or the rigid body press and the uniform pressure of the atmospheric pressure, and the transparent electrode of the counter substrate and the transparent electrode of the TFT substrate are electrically connected.

  Next, as shown in (d) of FIG. 3B, the TFT substrate is held by a vacuum suction stage 13 for inspecting a liquid crystal gap (also called Newton ring; NR), and sodium lamp irradiation is performed from the opposite substrate side. The NR inspection machine 14 is moved by the step-and-repeat method without moving the NR inspection vacuum suction stage, or the NR inspection vacuum suction stage holding the TFT substrate is moved without stepping the NR inspection machine. It moves by the repeat method, and the liquid crystal gap inspection (number of Newton rings and shape inspection) of each LCD panel is performed by an NR inspection machine equipped with a CCD camera to select the quality of the liquid crystal gap.

For example, when an LCD panel is viewed under irradiation of a sodium lamp (NaD line; 589.3 nm wavelength), a difference in brightness and contrast occurs in a portion where the liquid crystal gap is different, resulting in ring-shaped color unevenness of optical interference fringes. . The number and shape of the Newton rings are counted by a CCD camera in a non-contact manner to determine whether the liquid crystal gap is appropriate, and the defective LCD panel unit corrects the pressure.
Therefore, it is preferable that the liquid crystal gap immediately after vacuum bonding is set a little wider than the standard center within the standard so that the pressure can be corrected.
In addition to the fibers in the seal material, the liquid crystal gap control with high precision is possible by the action of multiple peripheral frames and OCS. Therefore, if necessary, temporary curing and main curing can be combined into batch UV irradiation curing. Further, a liquid crystal gap inspection of the extracted Newton ring (interference fringe) may be performed.

  Next, the entire area of the sealing material and the common material is fully cured by UV irradiation in a state where the entire area other than the sealing region is masked to reduce TFT damage as necessary, and then the NI point (Nematic Isotropic) of the liquid crystal is used. A phase transition temperature) of about 115 ° C. for about 1 hour, the sealing material and the common material are completely fixed, and the liquid crystal molecules are liquid crystal alignment film by rapidly cooling to below the NI point of the liquid crystal, for example, about 95 ° C. A heat treatment for completely aligning is performed.

Here, in the case of a transmissive LCD, the relationship between the alignment film, the alignment treatment, and the liquid crystal is preferably the following combinations.
[1] In the case of an organic alignment film such as polyimide or polyamide having a thickness of 5 to 50 nm, a TN (Twisted Nematic) mode liquid crystal having a positive dielectric anisotropy is used after bubbling.
[2] In the case of an organic alignment film to which a vertical alignment agent such as polyimide or polyamide having a thickness of 5 to 50 nm is added, a TN mode liquid crystal having a negative dielectric anisotropy and so-called VA (vertical alignment) mode liquid crystal is not required. Vertical alignment mode liquid crystal}.
[3] In the case of an organic alignment film such as polyimide or polyamide having a thickness of 5 to 50 nm, an ion beam is irradiated with an argon ion beam at an acceleration voltage of 300 to 400 eV from an angle of 15 to 20 ° with respect to the substrate. Beam alignment treatment is performed, and TN mode liquid crystal having positive dielectric anisotropy is used.
[4] In the case of an organic alignment film such as polyimide or polyvinyl cinnamate having a thickness of 5 to 50 nm, a positive dielectric anisotropy is obtained by photo-alignment treatment by irradiating the substrate with 257 nm linearly polarized ultraviolet rays perpendicularly. A TN mode liquid crystal is used.
[5] In the case of an organic alignment film such as polyimide or polyamide having a thickness of 5 to 50 nm, a positive dielectric difference is obtained by laser alignment treatment by irradiating a 266 nm YAG laser at an arbitrary angle (for example, 45 °) with respect to the substrate. An isotropic TN mode liquid crystal is used.
[6] In the case of a silane-based alignment film in which an alkyl group in which a silicon atom and an oxygen atom form a complex is bonded to a silicon atom, no alignment treatment is required, and a negative dielectric anisotropy TN mode (VA mode) ) Use liquid crystal.
[7] In the case of an aminosilane-based alignment film, a TN mode liquid crystal having a positive dielectric anisotropy is used after rubbing.
[8] In the case of an inorganic alignment film such as an obliquely evaporated SiOx film having a thickness of 10 to 30 nm, the alignment treatment is performed by adjusting the evaporation angle from the vertical direction of the substrate, and a TN mode having positive dielectric anisotropy Use liquid crystal.
[9] In the case of an inorganic alignment film such as SiOx having a thickness of 10 to 30 nm by vapor deposition or sputtering, an argon ion beam is irradiated with an ion beam at an acceleration voltage of 300 to 400 eV from an angle of 15 to 20 ° with respect to the substrate. TN mode liquid crystal having positive dielectric anisotropy is used.
[10] In the case of an inorganic alignment film such as SiOx having a thickness of 10 to 30 nm by mirrortron sputtering (directional sputtering), a TN mode liquid crystal having positive dielectric anisotropy is adjusted by adjusting the sputtering angle with respect to the substrate. Is used.
[11] In the case of an inorganic alignment film of DLC (Diamond Like Carbon) film having a thickness of 5 to 20 nm by a CVD method, the substrate is irradiated with an argon ion beam at an acceleration voltage of 300 to 400 eV from a direction of 45 °, for example. An ion beam alignment process is performed, and a TN mode liquid crystal having positive dielectric anisotropy is used.
[12] A second alignment film of PTFE (polytetrafluoroethylene) film having a thickness of about 50 nm is formed on the first alignment film subjected to the above-described treatments 1 to 11 by ion deposition, and has a positive dielectric anisotropy. A TN mode liquid crystal is used.
[13] A second alignment film of PE (polyethylene) film having a thickness of about 50 nm is formed on the first alignment film subjected to the above treatments 1 to 11 by ion vapor deposition, so that a TN mode liquid crystal having positive dielectric anisotropy is formed. Is used.
[14] A second alignment film polymerized with about 50 nm biphenyl-4,4′-dimethacrylate is formed by ion deposition on the first alignment film subjected to the treatments 1 to 11 described above, and is positive dielectric anisotropic TN mode liquid crystal is used.
[15] In the case of organic alignment films such as polyimide and polyamide, buffing alignment, photo-alignment of 257 nm linearly polarized UV irradiation, ion beam alignment of argon ion beam irradiation, laser alignment treatment of 266 nm YAG laser irradiation, etc. Ferroelectric (FLC) liquid crystal is used.
[16] In the case of an organic alignment film such as polyimide or polyamide having a thickness of 5 to 50 nm, buffing alignment, 257 nm linearly polarized UV irradiation photo-alignment, argon ion beam irradiation ion beam alignment, or 266 nm YAG laser irradiation laser alignment A field effect birefringence (ECB) type liquid crystal is used after processing.

In the case of reflective LCDs, TN mode liquid crystals with positive dielectric anisotropy and vertical alignment agents are added to organic alignment films such as polyimide and polyamide that have been subjected to horizontal alignment (homogeneous alignment) or tilt alignment by bubbling. A combination of TN mode so-called VA mode liquid crystal having negative dielectric anisotropy is used for organic alignment films such as polyimide and polyamide that have been subjected to vertical alignment (homeotropic alignment) treatment, and VA mode liquid crystal is preferably used for alignment films of chromium complexes.
In particular, the alignment film of the reflective LCD for projectors is preferably a light-resistant inorganic alignment film formed by, for example, SiOx oblique deposition film or directional sputtering, and used in combination with a VA mode liquid crystal.
When PDLC (polymer dispersion type liquid crystal) or GH (guest host type liquid crystal) is used for the reflection type LCD, the alignment film and the alignment treatment are unnecessary.

Next, as shown in FIG. 3B (e), the TFT substrate is vacuum-supported by the support stage 15, and the formation region of the external extraction electrode portion of the TFT substrate and the formation of the external extraction electrode portion are not formed by blade dicing. Deep-cut dicing is performed on the counter substrate in which 50 to 100 μm remains in the area of the counter substrate corresponding to the boundary area between the areas (indicated by reference numeral A in the figure), and the scribe line area (reference numeral B in the figure) of the other TFT substrate. In the region indicated by C, after the full cut dicing of the counter substrate is performed so as to form a 200-300 μm cut recess in the TFT substrate, the edge material is removed by impacting the deep cut dicing portion of the counter substrate. Then, the counter substrate is divided for each counter substrate 45.
Here, since the opposing substrate is quartz glass or crystallized glass and the TFT substrate is quartz glass, it is difficult to perform laser dicing, but it is possible to perform blade dicing, and liquid crystal Since it has already been sealed, the cutting water when performing blade dicing does not enter the inside and adversely affect it.

Subsequently, as shown in (f) of FIG. 3C, the polishing buff material 16 is rubbed against the counter substrate while being supplied with a polishing liquid containing ultrafine powder such as cerium oxide shown by D in the drawing. The back surface and the back surface of the TFT substrate are optically polished to a thickness of about 10 μm, for example, and the TFT of SiO ₂ , SiNx, transition metal silicide (WSi ₂ , MoSi ₂ , TiSi _2, etc.) formed on the back surface of the TFT substrate when the TFT substrate is formed. The formation film 17, and further, scratches and dirt during alignment film formation and alignment treatment, and further handling scratches during superposition are removed. Here, the optical polishing of the back surface of the counter substrate and the back surface of the TFT substrate is not limited to buff polishing, and may be performed by CMP or the like. In this optical polishing, it is necessary to adjust the pressure so as not to adversely affect the liquid crystal gap.

  For backside optical polishing, as described above, a wet optical polishing method in which a polishing liquid in which an appropriate amount of slurry (abrasive) containing ultrafine powder such as cerium oxide is dispersed in polishing water is supplied and the polishing buff is rubbed. In addition, there is a dry polishing method in which an abrasive cloth containing ultrafine powder such as cerium oxide is rubbed. In this case, any optical polishing method may be used.

  Next, as shown in (g) of FIG. 3C, the TFT substrate is held by the image inspection substrate support jig 18, and the image inspection substrate support jig 18 is moved without moving the image inspection substrate support jig. Move the machine 20 in a step-and-repeat manner, or move the image-inspecting substrate support jig holding the TFT substrate in a step-and-repeat manner without moving the illumination tube and the image inspecting device. Each time, an illumination tube with an electrical signal input terminal pressed against the external extraction electrode is set on the counter substrate side, the incident light 21 from the illumination tube is irradiated onto the LCD panel, and the emitted light 22 is detected by an image inspection machine. Then, an image is displayed, and an image inspection (DT; Display Test) is performed to determine whether the LCD panel in the TFT substrate is good or bad.

  By the way, in the case of a transmissive LCD for a projector, scratches and attached dust on the back surface of the counter substrate and the TFT substrate cause image quality defects. ) To prevent the effect of scratches and dust. In addition, by using a highly heat conductive glass as a protective glass for the counter substrate on the incident side in particular, the heat dissipation of the LCD panel is promoted to increase the brightness and extend the lifetime. In order to reduce the loss of incident light and outgoing light, the protective glass has an antireflection film or an antireflection film and an ultraviolet cut film formed on at least one surface.

For example, in the case of a transmissive LCD for a projector, a high thermal conductivity glass having a thermal conductivity of 1 (W / m · K) or more that satisfies optical characteristics as a protective glass material, for example, quartz glass, transparent crystallized glass (neoceram, clear) Serum, Zerodur, etc.) Higher heat conductive glass such as highly translucent ceramic polycrystal {translucent oxide crystal fused MgO (cubic, equiaxed hexagonal), sintered MgO (cubic) Y ₂ O ₃ (yttria), CaO (calcia), single crystal sapphire (hexagonal), BeO (beryllia), ZrO ₂ (zirconia), polycrystalline sapphire, or the like, or a single crystal of a translucent double oxide crystal or polycrystalline YAG (Yttrium Aluminum Garnet), single crystal or polycrystalline MgAl ₂ O _{4 (spinel), 3Al 2 O 3 · 2SiO} 2, Al 2 O 3 · SiO 2, CaCO 3 Such as ZrSiO _4}, fluoride single crystal {calcium fluoride _(CaF 2), magnesium fluoride _(MgF 2), barium fluoride (BaF _2), etc.}, CVD diamond film coated high light-ceramic multi By attaching a transparent substrate such as a crystal body, transparent crystallized glass, and crystal to a counter substrate and a TFT substrate with a light-resistant transparent adhesive, a high heat dissipation effect is exerted against strong incident light to increase brightness, High definition and long life can be realized, and quality and reliability can be improved.

  For example, from the incident side, the structure of single crystal sapphire dustproof glass with antireflection film formed, counter substrate of single crystal sapphire, liquid crystal layer, TFT substrate of quartz glass, and single crystal sapphire dustproof glass with antireflection film formed, A higher heat dissipation effect can be expected by bonding with a light-resistant transparent adhesive.

A thin film having a different refractive index, such as a SiO ₂ film, a TiO ₂ film, a ZrO ₂ film, or an MgF ₂ film, having a quarter wavelength thickness (0.1 to 0.3 μm) is formed on at least one surface of these protective glasses. An antireflection film is formed by laminating as a thickness, and the reflectance of the antireflection film is preferably 0.8% or less (wavelength range of 450 to 630 nm).

  Furthermore, as shown in FIG. 4 (a), a protective glass chip 24 with a transparent protective tape 23 may be used to prevent scratches at the vacuum suction collet when the protective glass chip is bonded, scratches at the time of dicing, and dust adhesion. good. If a protective glass chip with a tape whose adhesive strength decreases when irradiated with ultraviolet rays is used as the transparent protective tape, there is no risk of dust and scratches from the vacuum suction collet at the time of bonding, and vacuum removal. There is no risk of dust and scratches during foaming.

  Moreover, since the adhesive strength is reduced by UV irradiation in advance to the adhesive strength that cannot be removed by vacuum suction of the hollow vacuum suction collet when the protective glass chip is bonded, there is no problem in the protective glass chip bonding operation. Furthermore, there is no problem in the UV tape peeling work of the TFT substrate side protective glass chip before the metal frame is attached or the UV tape peeling work of the counter substrate side protective glass before the parting plate is attached.

Now, as shown in (h) of FIG. 3 (C) and (i) of FIG. 3 (C), a specific method for laminating the protective glass chip is a substrate support stage for a dust-proof glass chip laminating apparatus ( In a manufacturing apparatus configured to hold a TFT substrate with a substrate support stage (not shown) and move the hollow vacuum suction collet 26 relative to the substrate support stage without moving the substrate support stage, the hollow vacuum suction is performed. Transparent adhesive (ultraviolet irradiation curable type) is applied to the back of the counter substrate and the back of the TFT substrate of a non-defective LCD panel that has passed the above-described image inspection in the TFT substrate by vacuum-adsorbing the periphery or end of the protective glass chip with a collet. Adhesives, thermosetting adhesives, ultraviolet and thermosetting adhesives, visible light curable adhesives, etc.) For example, ultraviolet irradiation curing adhesives are required (for example, 5 mg for 0.7 type LCD panels) After placing and overlaying a protective glass chip (for example, a protective glass chip with an antireflection film made of quartz glass material) that has been dispensed and then vacuum-adsorbed and held by a hollow vacuum adsorption collet, it is placed in a vacuum apparatus, The inside of the vacuum apparatus is set to a predetermined degree of vacuum (for example, 133 Pa or less), and the transparent adhesive is degassed by vacuum, and the thickness of the adhesive is equalized with a uniform pressure when returning to atmospheric pressure, and bonding is performed. Thereafter, defects in the transparent adhesive layer (for example, defects such as sandwiched dust in the transparent adhesive, shiny dust, insufficient spreading of the transparent adhesive, etc.) detected by visual inspection and / or image inspection are detected, and these transparent adhesive defects are detected. A light-shielding tape (for example, black tape) is attached to the protective glass chip, and the transparent adhesive of each protective glass chip is completely cured by irradiating ultraviolet rays from both surfaces of the TFT substrate and the counter substrate.
Here, the protective glass of the transparent adhesive layer defect can be reproduced by peeling off the protective glass chip by not UV curing with a black tape.

Next, as shown in (j) of FIG. 3 (D), the surface of the protective glass chip bonded to the back surface of the TFT substrate of the LCD panel is dicing tape whose adhesive strength is reduced by irradiating ultraviolet rays (hereinafter, referred to as “dicing tape”). This is referred to as a dicing UV tape.) In the state of being fixed in step 27, a full cut blade dicing process is performed in which the concave portion of the scribe line is tape cut-less from the surface of the TFT substrate.
Here, since the height of the protective glass chip bonded to the back surface of the TFT substrate corresponds to dicing for forming a V or a recess on the back surface of the TFT substrate, tape cutless dicing is realized, and foreign matter adhesion and contamination caused by the dicing tape are realized. Prevents and extends the life of the dicing blade. Further, since the concave portion is blade-diced, chipping can be reduced. Further, it is not always necessary to use a UV tape for dicing as the dicing tape, and repeated use is possible if a low-adhesion tape is used. In addition, it is necessary to use a dicing blade having a longer cutting edge than in the past.
In addition, the protective glass chip surface bonded to the back side of the opposing substrate of the LCD panel is fixed with dicing UV tape or low adhesive tape, and the concave part of the scribe line is tape cutless from the back side of the TFT substrate. Processing may be performed.

Here, when a protective glass chip to which a protective UV tape is bonded is used as a protective glass chip to be bonded to the TFT substrate and the counter substrate, as shown in FIG. With the surface of the protective glass chip with UV tape bonded to the back surface of the counter substrate fixed by the dicing vacuum suction jig 28, full cut blade dicing is performed from the back surface of the TFT substrate to the concave portion of the scribe line.
Here, when a protective glass chip to which a protective UV tape is bonded is employed, since there is no glass cutting dust adhesion, the yield and quality are improved, and further tapeless dicing can be performed, so that the tape cost can be reduced. Further, since full cut dicing is performed on the concave portion of the scribe line from the opposite surface, chipping can be reduced.

  Subsequently, when a protective glass chip to which a protective UV tape is bonded is adopted as a protective glass chip to be bonded to the TFT substrate and the counter substrate of the LCD panel, the protective UV tape is bonded. A flexible substrate 29 is attached to the external extraction electrode portion of the TFT substrate, the protective UV tape attached to the protective glass chip on the TFT substrate side is peeled off, and the TFT substrate and the counter substrate are attached to the metal frame 30, and the TFT substrate and the counter electrode are opposed to each other. The substrate and the metal frame are fixed with a high thermal conductive mold resin 31. Thereafter, the protective UV tape bonded to the protective glass chip on the counter substrate side is peeled off, the parting plate 32 is attached, and the image quality inspection is performed, so that the projector transmission as shown in (k) of FIG. Type liquid crystal display device can be obtained.

By the way, in the above-described embodiment, the case of the LCD panel in which the individual protective glass chip is bonded to the back surface of the TFT substrate and the counter substrate has been described as an example, but the optical back surface of the TFT base and the back surface of the counter substrate is described. After polishing, as shown in FIG. 4 (c), a predetermined amount of UV adhesive is dispensed on the back surface of all the counter substrates, and the protective glass large plate (1) 50 is overlaid, and on the back surface of the TFT substrate. Dispense or spin coat a predetermined amount of UV adhesive and overlay the protective glass plate (2) 51, and after UV degassing of the UV adhesive, UV is applied in a uniform pressure state immediately before or after returning to atmospheric pressure. The opposite substrate on which the protective glass chip (1) is blade-diced and the protective glass chip is bonded, the protective glass large plate (2), Protective glass chip FT substrate by blade dicing may form a LCD panel comprising a TFT substrate that is bonded.
Specifically, the area of the protective glass large plate (1) (area indicated by reference signs X, Y, and Z in the figure) is subjected to full-cut blade dicing to the same dimensions as the counter substrate, and the counter glass chip is bonded. A substrate was formed, and a scribe line area (area indicated by symbols Y and Z in the figure) of the TFT substrate and the protective glass large plate (2) was continuously subjected to full-cut blade dicing, and the protective glass chip was bonded. An LCD panel made of a TFT substrate may be formed.

[B] In the case of a transmissive LCD for EVF in which the TFT substrate is a quartz glass material and the counter substrate is a low strain point glass material FIG. 5 is an EVF (an example of a method for manufacturing an electro-optic display device to which the present invention is applied). It is a process flow of the manufacturing method of transmission type LCD for Electric View Finder).
Hereinafter, the manufacturing method of the transmissive LCD for EVF will be described along the process flow shown in FIG.

In the method for manufacturing an EVF transmissive LCD to which the present invention is applied, first, a plurality of TFT substrates are formed on a TFT substrate made of a quartz glass material having a thickness of 8 inches and a thickness of 0.8 mm. In the same manner as the above-mentioned transmissive LCD for a projector, the TFT substrate is left with a film of SiO ₂ , SiNx, transition metal silicide (WSi ₂ , MoSi ₂ , TiSi _2, etc.) formed on the back surface of the substrate remaining. The TFT substrate 1 in each of the TFTs 10 is patterned with a photosensitive resin by using a general-purpose lithography technique to form at least a double peripheral frame 2, for example, the peripheral frame width is 50 μm, the distance between the peripheral frames is 100 μm, and the liquid crystal gap 2 A double peripheral frame having a height of about 5 μm is formed, the peripheral frame formed on the outside is defined as the first peripheral frame 2a, and the peripheral frame formed on the inside is defined as the second peripheral frame 2b. .
After that, as in the above-described transmissive LCD for projector, formation of an organic alignment film such as polyimide and polyamide, liquid crystal alignment treatment, and cleaning using IPA or the like as necessary are performed.

  This TFT substrate has an OCCF (On Chip Color Filter) structure in which red, blue, and green color filter layers are formed on each pixel, and the counter substrate formed on the counter substrate has a structure of a solid ITO film without a pattern. To do. This may be achieved by using a counter substrate on which a counter substrate having a color filter layer formed corresponding to each pixel in the TFT substrate is formed. However, there are problems such as color unevenness, luminance decrease, and productivity decrease due to variations in overlay position accuracy. Therefore, an OCCF TFT substrate is preferable.

  Also, a solid transparent conductive film with no pattern such as ITO or IZO is formed on the entire surface of the opposing substrate made of a low strain point glass material (e.g., borosilicate glass, aluminosilicate glass, etc.) having a thickness of 8 inches and a thickness of 0.7 mm. Then, similarly to the above-mentioned transmissive LCD for projector, formation of an organic alignment film such as polyimide and polyamide, liquid crystal alignment treatment, and cleaning using IPA or the like as necessary are performed.

  Note that a counter substrate (also referred to as a counter black mask substrate) made of a black mask substrate (a substrate with a full transparent conductive film formed with a light shielding film other than the pixel openings) may be used as the counter substrate, if necessary.

For example, a seal material 3 of 1200 to 1300 μm ² within a seal width of 500 μm and a common material 4 having a coating diameter of about 200 μm at at least two locations are provided outside the first peripheral frame 2 a formed on the 0.5-type TFT substrate. It is applied, and about 0.1 mg is repeated five times in the center of the display area of the TFT substrate, and about 0.5 mg of liquid crystal is dispensed inside the second peripheral frame 2b (see FIG. 6 (a)). )reference.).
At this time, like the above-described transmissive LCD for a projector, the liquid crystal dispenser 8 and the laser sensor 9 are moved in a step-and-repeat manner without moving the TFT substrate, as shown in FIG. Immediately after dropping a predetermined amount of liquid crystal, laser irradiation is performed to sense the reflected light, or the TFT substrate is moved in a step-and-repeat manner without moving the laser sensor 9 and the liquid crystal dispenser 8, and the predetermined amount of liquid crystal is dispensed. It is desirable to optimize the presence / absence of liquid crystal dripping and the amount of liquid crystal dripping in the second peripheral frame by irradiating laser immediately after liquid crystal dripping and sensing by fluctuation of reflected light.
Note that a method may be used in which an image is captured by a CCD and whether or not liquid crystal is dropped and whether the amount of liquid crystal is dropped is determined appropriately.
In this way, for example, when there is no liquid crystal dripping or shortage due to a liquid crystal dispenser malfunction, the malfunction is detected immediately and the liquid crystal is dropped again to optimize the amount of liquid crystal. .
Here, the sealing material and common material application and liquid crystal dropping are performed on the TFT substrate side, but the sealing material application and liquid crystal dropping may be performed on the TFT substrate side and the common material application may be performed on the counter substrate side.

Subsequently, in the same manner as the above-mentioned transmissive LCD for projector, a TFT substrate held by an electrostatic chuck with a ceramic type or polymer type electrostatic chuck stage in a vacuum bonding apparatus having a predetermined degree of vacuum (for example, 1 to 3 Pa). 10 and the opposite substrate 11 similarly held by a ceramic type or polymer type electrostatic chuck are positioned in the X direction, Y direction, and θ direction and overlapped by a predetermined pressure at a predetermined gap, If necessary, temporarily fix seal curing is performed with a predetermined amount of UV irradiation through a temporary light-blocking light-shielding jig 12 to prevent displacement of the substrate, and then applied with uniform atmospheric pressure immediately after returning to atmospheric pressure. By combining, the fiber corresponding to the liquid crystal gap in the sealing material and the amount of liquid crystal dropped were controlled with high precision by the action of the double peripheral frame and OCS of the present invention. It is possible to obtain an LCD panel of crystal gap.
At this time, since there is a double peripheral frame of the present invention, there is no seal path symptom when the atmospheric pressure is released, and it becomes unnecessary to apply a dummy seal material on the outermost periphery of the TFT substrate or the counter substrate.
At this time, even if electrostatic chucking is performed for the state in which a film of transition metal silicide (WSi ₂ , MoSi ₂ , TiSi _2, etc.) formed on the back surface of the TFT substrate remains, the TFT element Is not damaged by static electricity, and it is possible to reduce the liquid crystal gap unevenness because the bonding is performed on the TFT substrate maintaining high flatness.
Then, the micro pearl in the common material is crushed by the atmospheric pressure or the rigid body press and the uniform pressure of the atmospheric pressure, and the transparent electrode of the counter substrate and the transparent electrode of the TFT substrate are electrically connected.
Further, similar to the above-mentioned transmissive LCD for projector, after a liquid crystal gap inspection is performed by irradiating a sodium lamp and performing a Newton ring (interference fringe) of the LCD panel, the pressure is corrected as necessary to obtain a predetermined amount of UV. Full curing and baking are performed by irradiation to completely fix the sealing material and the common material, and the liquid crystal is aligned by rapid cooling of the heat treatment.
Therefore, it is preferable that the liquid crystal gap immediately after vacuum bonding is set a little wider than the standard center within the standard so that the pressure can be corrected.
In addition to the fibers in the seal material, the liquid crystal gap control with high precision is possible by the action of multiple peripheral frames and OCS. Therefore, if necessary, temporary curing and main curing can be combined into batch UV irradiation curing. Further, a liquid crystal gap inspection of the extracted Newton ring (interference fringe) may be performed.

Next, as shown in FIGS. 6B and 7, the TFT substrate is fixed by the laser cutting vacuum suction jig 33, and the formation region of the external extraction electrode portion of the TFT substrate and the non-formation region of the external electrode extraction portion are formed. Laser dicing, for example, a wavelength of 1064 nm YAG, along a region corresponding to the boundary region (region indicated by symbol A in the drawing) and a scribe line region (region indicated by symbols B and C in the drawing) of the TFT substrate that can be seen through the opposing substrate. A single substrate is cut by a solid laser such as a UV pulse laser having a wavelength of 355 nm, which is the third harmonic modulation of the laser, or a gas laser such as a CO ₂ laser, or a combined laser combining the solid laser and the gas laser. The counter substrate may be in a state. At this time, it is necessary to optimize the laser cutting conditions so as not to damage the wiring of the external extraction electrode portion of the TFT substrate.

  Next, in the same manner as in the above-described method for manufacturing a projector-use LCD, the back surface optical polishing and image inspection of the counter substrate and the TFT substrate are performed, and then the back surface of the counter substrate of the LCD panel is fixed with a UV tape for dicing. Tape-cutless blade dicing is performed from the back surface of the TFT substrate made of quartz glass.

  Here, since the height of the counter substrate corresponds to dicing of the V-cut groove or recess on the surface of the TFT substrate, tape cutless blade dicing with less chipping on the surface of the TFT substrate can be realized. In order to further suppress chipping on the surface of the TFT substrate, a V-cut groove or a recess is formed in the scribe line on the surface of the TFT substrate, and the back surface of the counter substrate is fixed from the back surface of the TFT substrate with a UV tape for dicing. Tape cutless full cut dicing is recommended.

Thereafter, a flexible substrate is attached to the external extraction electrode portion of the TTF substrate of the LCD panel by thermocompression bonding of an anisotropic conductive film, and a polarizing plate 35 is bonded to the back surface of the TFT substrate and the counter substrate, and the TFT substrate and the counter substrate are attached to the resin frame. The transmission substrate for the EVF as shown in FIG. 6 (c) can be obtained by attaching the TFT substrate and the counter substrate to the resin frame with a mold resin 37, and inspecting the image quality. .
In order to prevent deterioration of image quality due to foreign matter defects, dust adhesion, etc. on the polarizing plate, a module structure may be adopted in which the polarizing plate is attached to another transparent support at a position away from the TFT substrate and the counter substrate to blur the focus. .

In addition, after optically polishing the back surface, image inspection is performed, and a polarizing plate with a protective film is bonded only to the back surface of the TFT substrate and the counter substrate of a good LCD panel in the TFT substrate, and then the TFT substrate is divided for each LCD panel by blade dicing. Then, a flexible substrate is attached to the TFT substrate by thermocompression bonding of an anisotropic conductive film, the TFT substrate and the counter substrate, and the resin frame are fixed with a mold resin, and the protective film of the polarizing plate is peeled off to perform image quality inspection. May be.
At this time, since there is a protective film on the polarizing plate, there is no damage to the polarizing plate due to cutting water during blade dicing, and scratches and dirt on the polarizing plate can be prevented when the flexible substrate and resin frame are attached. And productivity is improved.

[C] In the case of a reflective LCD for a projector in which the TFT substrate is a silicon material and the counter substrate is a low strain point glass material FIG. 8 is a LCOS (Liquid Crystal On) which is still another example of an electro-optic display device to which the present invention is applied. It is a process flow of the manufacturing method of the reflection type LCD for projectors of a silicon type.
Hereinafter, a manufacturing method of a reflective LCD for an LCOS type projector will be described along the process flow shown in FIG.

In the manufacturing method of a reflective LCD for projectors of the LCOS type to which the present invention is applied, first, peripherals such as a liquid crystal driving circuit, a video signal control and processing circuit are provided on a TFT substrate 44 made of silicon having a thickness of 8 inches and a thickness of 0.8 mm. A plurality of BP (Back Plane) substrates having a circuit unit and a display unit 6 and a scribe line are formed, and films such as SiO ₂ and SiNx formed on the back surface of the TFT substrate are left while forming the BP substrate. In the state, similar to the above-described method for manufacturing a transmissive LCD for a projector, the BP substrate 38 in the TFT substrate is patterned with a photosensitive resin by using a general-purpose lithography technique to form at least a double peripheral frame 2, for example, A double peripheral frame having a peripheral frame width of 50 μm, a distance between the peripheral frames of 100 μm, and a height corresponding to a liquid crystal gap of 2.5 μm is formed on the outside. The made peripheral frame first peripheral frame 2a, a peripheral frame formed inside the second peripheral frame 2b.
Further, at the same time as forming the peripheral frame, if necessary, OCS 7 (2 to 3 μmφ, liquid crystal gap having a height corresponding to a plurality of liquid crystal gaps is formed between the display region 6 of the BP substrate and the second peripheral frame with the same photosensitive resin. A height corresponding to 2.5 μm).
At this time, the OCS 7 having a height corresponding to the liquid crystal gap may be formed around the plurality of pixel openings in the display area 6 within a range that does not adversely affect the image quality, thereby enhancing the liquid crystal gap control.
Thereafter, oblique deposition film formation at a predetermined deposition angle of SiOx or the like, directional sputtering film formation at a predetermined sputtering angle of SiOx or the like, or ion beam orientation treatment with argon or the like at a predetermined angle DLC (Diamond Like) After forming an inorganic liquid crystal alignment film such as a Carbon film, organic cleaning using IPA (isopropyl alcohol) or the like is performed as necessary.
In the case of an inorganic liquid crystal alignment film such as SiOx, UV irradiation cleaning and atmospheric pressure plasma cleaning may be performed alone or in combination with organic cleaning.

  The silicon TFT substrate is composed of a plurality of BP substrates and scribe lines. The BP substrate is a peripheral circuit portion such as a liquid crystal driving circuit, a video signal control and processing circuit, a display portion, a seal portion (including a common portion), an external portion. Consisting of a take-out electrode part, etc., a switching element such as a plurality of TFT elements, a reflective pixel electrode made of aluminum, aluminum-silicon alloy, silver, silver-bismuth alloy, silver-bismuth-neodymium alloy, multilayer wiring, external take-out electrode part Etc. are formed.

Here, as with the above-described method for manufacturing a projector-use transmissive LCD, depending on the inorganic alignment film thickness of SiOx or the like, it is difficult to penetrate the inorganic alignment film such as SiOx by pressure bonding of the gold plating resin micropearl in the common material. Etching the inorganic alignment film such as SiOx on the seal part and common part of each BP substrate in the TFT substrate with a laser pulse such as a UV pulse laser or excimer laser having a wavelength of 355 nm, which is the third harmonic modulation of a 1064 nm YAG laser. Is preferably removed. Similarly, depending on the inorganic orientation film thickness such as SiOx, it is difficult to electrically connect the anisotropic conductive film of the flexible substrate by thermocompression bonding. The inorganic alignment film such as SiOx is preferably removed by laser etching of a wavelength 355 nm UV pulse laser or excimer laser, which is the third harmonic modulation of a wavelength 1064 nm YAG laser, for example.
At this time, as shown in FIG. 2, for example, the UV pulse laser with a beam spot size of 50 to 200 μmΦ and a laser power of 10 to 100 W (10 KHz) is applied in the XY direction as in the method for manufacturing the projector-use transmissive LCD. A plurality of reciprocating scanning irradiations are performed to remove an inorganic alignment film such as SiOx having a thickness of 30 to 50 nm on the seal portion, common portion, and external extraction electrode portion of the BP substrate. In the etching on the external extraction electrode portion, it is necessary to adjust the UV pulse laser power and the number of reciprocating scanning so that the external extraction electrode portion is not etched.
However, compared to quartz glass, which transmits light, silicon has a large heat generation effect due to heat absorption for various types of lasers, so etching of inorganic alignment films such as SiOx with a relatively small laser power or a small number of reciprocating scans. I can do it.
At this time, simultaneously with the etching of the inorganic alignment film such as SiOx, the silicon in the sealing region of the BP substrate is also slightly etched to form surface irregularities, but the adhesion with the sealing material is improved and the sealing performance is enhanced.
In addition, if necessary, the inorganic component such as SiOx that has been melted by laser by tracking the vacuum suction port in synchronization with the laser irradiation so that the inorganic component such as SiOx that has been melted by laser does not adhere and cause defects due to dust. Dust measures such as removal are necessary.
Note that only the inorganic alignment film such as SiOx on the common part and the external extraction electrode part may be etched by selective spot laser irradiation.

  The sealing material and common material application region of the BP substrate and the external extraction electrode portion of the BP substrate may be masked so that the inorganic alignment film such as SiOx is not formed. There are problems such as misalignment, adhesion of dust and scratches, and metal mask cleaning.

Also, a plurality of counter substrates and scribe lines are formed on a counter substrate made of a low strain point optical glass having a thermal expansion coefficient close to that of silicon having a thickness of 8 mm and a thickness of 1.1 mm, such as borosilicate glass or aluminosilicate glass. Forming an obliquely deposited film at a predetermined deposition angle such as SiOx, or forming a directional sputtering film at a predetermined sputtering angle such as SiOx, or forming a DLC film by ion beam orientation treatment with argon or the like at a predetermined angle, etc. After forming the inorganic liquid crystal alignment film, organic cleaning using IPA or the like is performed as necessary.
In the case of an inorganic liquid crystal alignment film such as SiOx, UV irradiation cleaning and atmospheric pressure plasma cleaning may be performed alone or in combination with organic cleaning.

  The counter substrate is composed of a plurality of counter substrates and scribe lines, and a transparent conductive film such as ITO or IZO is formed on the entire surface of the counter substrate corresponding to the BP substrate.

Here, depending on the inorganic alignment film thickness such as SiOx, it is difficult to penetrate the inorganic alignment film such as SiOx by pressure bonding of gold-plated resin micropearl in the common agent. It is preferable to remove the inorganic alignment film such as SiOx on the upper portion of the part by laser etching of a wavelength 355 nm UV pulse laser which is the third harmonic modulation of a wavelength 1064 nm YAG laser, for example.
At this time, similarly to the method for manufacturing the projector-use transmissive LCD, as shown in FIG. 2, a UV pulse laser having a beam spot size of 50 to 200 μmΦ and a laser power of 10 to 100 W (10 KHz) is applied a plurality of times in the XY direction. Scanning irradiation is performed to remove the seal portion of the transparent conductive film such as ITO or IZO of the counter substrate and the inorganic alignment film such as SiOx having a thickness of 30 to 50 nm on the common portion.
Since the SiOx oblique deposition film formed on the BP substrate and the counter substrate has a coarse particle size, low density and low airtightness compared to the glass substrate, not only the common portion but also the seal portion with the UV pulse laser described above. It is preferable to perform laser etching on the upper SiOx oblique deposition film at the same time because the sealing property is improved and the quality and reliability are improved.
Note that only the inorganic alignment film such as SiOx above the common portion may be etched by selective spot laser irradiation.

  It should be noted that the seal of the counter substrate and the common material application region may be masked so that an inorganic alignment film such as SiOx is not formed. However, in the case of masking, the metal mask is misaligned, dust and scratches adhere, metal There are problems such as mask cleaning.

Next, for example, the seal material 3 and the common material 4 are dispensed within the seal width 500 μm outside the first peripheral frame 2a formed on the 0.79 type BP substrate, and the second periphery formed inside the seal material 3 and the common material 4 is applied. A predetermined amount of the liquid crystal 5 is dispensed inside the frame 2b (see (a) of FIG. 9A).
Here, the amount of liquid crystal to be dropped is about 0.1 mg repeated around the center of the display area in the BP substrate eight times, and about 0.8 mg of liquid crystal is dropped and the height is the second peripheral frame. It is necessary to prevent the liquid crystal from becoming insufficient as the amount of liquid crystal that is slightly raised by the surface tension than 2b.
Similarly, about 1500 to 1600 μm ² is dispensed in the vicinity of the center within the seal width of 500 μm, and the common material to be coated is dispensed with a coating diameter of about 200 μm at at least two locations. It is necessary not to jump over one peripheral frame 2a and flow into the second peripheral frame 2b.
Further, as shown in FIG. 3A (b), the liquid crystal dispenser 8 and the laser sensor 9 are moved in a step-and-repeat manner without moving the TFT substrate, and laser irradiation is performed immediately after a predetermined amount of liquid crystal is dropped. The sensing is performed by fluctuation of reflected light, or the laser sensor 9 and the liquid crystal dispenser 8 are not moved, but the TFT substrate is moved by a step-and-repeat method, and laser irradiation is performed immediately after a predetermined amount of liquid crystal is dropped. It is desirable to sense by fluctuation and optimize the presence / absence of liquid crystal dripping and the amount of liquid crystal dripping in the second peripheral frame.
Note that a method may be used in which an image is captured by a CCD and whether or not the liquid crystal is dropped and whether the liquid crystal is dropped appropriately is determined.
In this way, for example, when there is no liquid crystal dripping or shortage due to a liquid crystal dispenser malfunction, the malfunction is detected immediately and the liquid crystal is dropped again to optimize the amount of liquid crystal. .
Here, the sealing material and common material application and liquid crystal dropping are performed on the TFT substrate side, but the sealing material application and liquid crystal dropping may be performed on the TFT substrate side and the common material application may be performed on the counter substrate side.

Subsequently, in the same manner as the above-mentioned transmissive LCD for projector, a TFT substrate held by an electrostatic chuck with a ceramic type or polymer type electrostatic chuck stage in a vacuum bonding apparatus having a predetermined degree of vacuum (for example, 1 to 3 Pa). After positioning the X-, Y-, and θ-directions of the opposite substrate held in the same ceramic-type or polymer-type electrostatic chuck and superimposing them with a predetermined pressure in a predetermined gap, In order to prevent misalignment, the temporary fixing seal is cured by a predetermined amount of UV irradiation through the temporary fixing light-shielding jig 12 as necessary, and then bonded by applying a uniform atmospheric pressure immediately after returning to atmospheric pressure. The liquid crystal gap is controlled with high accuracy by the action of the fiber corresponding to the liquid crystal gap in the sealing material and the amount of dropped liquid crystal, and the double peripheral frame and OCS of the present invention. LCD panels-up can be obtained.
At this time, since there is a double peripheral frame of the present invention, there is no seal path symptom when the atmospheric pressure is released, and it becomes unnecessary to apply a dummy seal material on the outermost periphery of the TFT substrate or the counter substrate.
Further, at this time, even if electrostatic chucking is performed in order to superimpose the film such as SiO ₂ or SiNx formed when the BP substrate is formed on the back surface of the TFT substrate, the BP substrate made of silicon is used. The TFT element is not damaged by static electricity, and the liquid crystal gap unevenness can be reduced because the bonding is performed on the TFT substrate while maintaining high flatness.
The micro pearl in the common material is crushed by the atmospheric pressure or the rigid body press and the atmospheric pressure, and the transparent electrode of the counter substrate and the electrode of the BP substrate are electrically connected.
In addition, the liquid crystal gap is inspected with a Newton ring (interference fringe) on the LCD panel by irradiating with a sodium lamp. After correcting the pressure as necessary, the seal material and the common material are fully cured by a predetermined amount of UV irradiation. Further, baking is performed to completely fix the sealing material and the common material, and the liquid crystal is aligned by heat treatment.
Therefore, it is preferable that the liquid crystal gap immediately after vacuum bonding is set a little wider than the standard center within the standard so that the pressure can be corrected.
In addition to the fiber in the sealant and the amount of liquid crystal dropped, the multiple peripheral frames and OCS enable high-precision liquid crystal gap control, so that temporary curing and main curing are performed together according to the quality specifications. Then, it is possible to carry out collective UV irradiation curing, and further to perform a liquid crystal gap inspection of a drawn Newton ring (interference fringe).

  Next, like the above-described transmissive LCD for projector, the TFT substrate is vacuum-supported by the support stage 15, and the external extraction electrode portion of the BP substrate is removed by blade dicing so that the wiring of the external extraction electrode portion is not damaged. Deep cut dicing is performed on the counter substrate where 50 to 100 μm remains in the region corresponding to the boundary region between the formation region and the non-formation region of the external extraction electrode portion (the region indicated by reference symbol A in the figure), and the other BP substrate is scribed. The line region (regions indicated by symbols B and C in the figure) is an end material by impacting the portion subjected to deep cut dicing after performing full cut dicing of the opposing substrate forming a 200 to 300 μm cut recess in the TFT substrate. Removal is performed, and the opposing substrate is divided into opposing substrates (see FIG. 9A, (b)).

  Alternatively, as shown in FIG. 10A, for example, the third harmonic modulation of a YAG laser with a wavelength of 1064 nm so that the wiring of the external extraction electrode portion is not damaged when the TFT substrate is fixed with a dicing vacuum suction jig. 50 to 100 μm remains in the region corresponding to the boundary region between the formation region of the external extraction electrode portion of the BP substrate and the non-formation region of the external extraction electrode portion (region indicated by symbol A in the figure) with a UV pulse laser having a wavelength of 355 nm Deep cut dicing was performed on the opposing substrate, and the scribe line region (regions indicated by symbols B and C in the figure) of the other BP substrate was subjected to full cut dicing of the opposing substrate having a 200 to 300 μm cut recess formed in the TFT substrate. Later, the cut material is removed by impacting the deep cut dicing part, and the counter substrate is divided into counter substrates. To do.

As shown in FIGS. 6B and 7 of the above-mentioned EVF transmissive LCD, the TFT substrate is fixed with a vacuum cutting jig for laser cutting, and the external extraction electrode portion forming area of the BP substrate and the external electrode Along the area corresponding to the boundary area of the non-formation area of the extraction portion (area indicated by symbol A in the figure) and the scribe line area (area indicated by signs B and C in the figure) of the TFT substrate that can be seen through the counter substrate. Alternatively, the counter substrate may be cut into a single counter substrate by a solid laser such as a YAG laser, a gas laser such as a CO ₂ laser, or a combined laser combining a solid laser and a gas laser. At this time, it is necessary to optimize the laser cutting conditions so as not to damage the wiring of the external extraction electrode portion.

Subsequently, as shown in (c) of FIG. 9B, while supplying an abrasive containing ultrafine powder such as cerium oxide shown by D in the figure, at least the back surface of the counter substrate is made, for example, by the polishing buff material 16. About 10 μm is optically polished to remove scratches and dirt during alignment film formation and alignment treatment, scratches and dirt during dicing, and handling scratches.
Unlike a transmissive LCD, a reflective LCD has a film such as SiO ₂ or SiNx during formation of a BP substrate, alignment film formation and alignment processing flaws, dirt, and handling flaws. Since it is irrelevant, optical polishing of the back surface of the TFT substrate is not always necessary.

  Here, it is necessary to adjust the pressure so that the liquid crystal gap is not adversely affected during the optical back surface polishing. Further, when taking measures against scratches and dust such as liquid crystal dropping and vacuum bonding with the protective tape attached to the back surface of the counter substrate, optical polishing of the back surface of the counter substrate is not necessary.

  Subsequently, in the same manner as the above-mentioned transmissive LCD for projector, after image inspection, protective glass chip bonding (on the opposite substrate side only), and cutting the TFT substrate, the BP substrate and the opposite substrate are attached to the metal frame, The BP substrate and the counter substrate are fixed to the metal frame with a high thermal conductive mold resin. After that, by attaching a parting plate and performing an image quality inspection, an LCOS type reflective liquid crystal display device for a projector as shown in (d) of FIG. 9B can be obtained.

In the case of a reflective LCD for a projector, as a dust-proof glass material for forming an antireflection film on the incident side, a high thermal conductivity glass having a thermal conductivity of 1 (W / m · K) or more that satisfies optical characteristics, such as quartz glass, transparent Crystallized glass (such as neo-serum, clear serum, zerodure), borosilicate / aluminosilicate glass (such as Corning # 1737 and Eagle 2000, HOYA NA-35 and NA-32), higher thermal conductivity glass such as Highly translucent ceramic polycrystal {transfused oxide crystal fused MgO (cubic, equiaxed hexagonal), sintered MgO (cubic), Y ₂ O ₃ (yttria), CaO (calcia) , single crystal sapphire (hexagonal), BeO (beryllia), ZrO ₂ (zirconia), polycrystalline sapphire, etc., or a single or poly a translucent double oxide crystals Crystal YAG (Yttrium Aluminum Garnet), single crystal or polycrystalline MgAl ₂ O _{4 (spinel),} and _{3Al 2 O 3 · 2SiO 2,} Al 2 O 3 · SiO 2, CaCO 3, ZrSiO 4}, fluoride monocrystal {Calcium fluoride (CaF ₂ ), Magnesium fluoride (MgF ₂ ), Barium fluoride (BaF ₂ ), etc.} Highly translucent ceramic polycrystals and transparent crystallized glass, crystal, etc. coated with vapor phase synthetic diamond film Bonding a transparent substrate with a light-resistant transparent adhesive exhibits a high heat dissipation effect against strong incident light, realizing high brightness, high definition, and long life, and quality and reliability Can be increased.
Note that a dustproof glass having no birefringence is preferable for the reflective LCD.

For example, a single crystal or polycrystalline YAG dustproof glass formed with an antireflection film from the incident side, and a low strain optical glass close to the thermal expansion coefficient of silicon, such as the above-mentioned counter substrate of borosilicate / aluminosilicate glass, liquid crystal layer and silicon A single-crystal or polycrystalline YAG dust-proof glass and an anti-borosilicate / alumino-silicate glass counter substrate with an antireflection film bonded to each other with a light-resistant low-distortion transparent adhesive, and A high heat dissipation effect can be expected by bonding a silicon BP substrate and a metal frame together with a low distortion high thermal conductivity and a conductive adhesive.
A thin film having a different refractive index, such as a SiO ₂ film, a TiO ₂ film, a ZrO ₂ film, or an MgF ₂ film, is formed on at least one surface of the dustproof glass by a quarter wavelength thickness (0.1 to 0.3 μm). ) To form an antireflection film, and the reflectance of the antireflection film is preferably 0.8% or less (wavelength range of 450 to 630 nm).

By the way, in the above-described embodiment, the case where the individual protective glass chip is bonded to the counter substrate has been described as an example. However, as shown in FIG. After polishing, the protective glass large plate (1) 50 was placed on the back of the counter substrate on which a predetermined amount of UV adhesive was dispensed, and the UV adhesive was defoamed at a predetermined degree of vacuum (eg, 133 Pa or less). Immediately after or after returning to atmospheric pressure, a uniform atmospheric pressure is applied and UV irradiation is cured and bonded, and then the protective glass large plate (1) 50 is laser diced to bond the protective glass chip. An LCOS reflective LCD panel comprising the counter substrate thus formed and a BP substrate formed by further laser dicing the TFT substrate may be formed.
Specifically, an area of the protective glass large plate (1) (area indicated by symbols X, Y, and Z in the figure) having the same dimensions as the counter substrate is, for example, UV having a wavelength of 355 nm which is the third harmonic modulation of a wavelength 1064 nm YAG laser. Full-cut dicing is performed with a pulse laser to form a counter substrate on which a protective glass chip is bonded, and the scribe line area (area indicated by symbols Y and Z in the figure) of the TFT substrate is continuously cut with the above laser. The BP substrate may be formed to form an LCOS reflective LCD panel composed of a counter substrate on which a protective glass chip is bonded and a BP substrate.

Further, in the above embodiment, a large protective glass plate is bonded to the counter substrate, but a counter substrate having a thickness of 2.0 mm, which is the sum of the thickness of the counter substrate of 1.0 mm and the thickness of the protective glass of 1.0 mm, is used. As a result, the work of bonding the protective glass of the counter substrate becomes unnecessary. In this case, a transparent conductive film such as ITO or IZO is formed on one surface of the opposing substrate, a low reflection film is formed on the other surface, and an inorganic surface such as SiOx is formed on the surface on which the transparent conductive film is formed. A system alignment film will be formed.
In this case, since the low-reflection film is formed on the back surface of the counter substrate, it is not possible to polish the back surface of the counter substrate. It is preferable to combine and divide.
In this case, the counter substrate in the region corresponding to the boundary region between the formation region of the external extraction electrode portion of the BP substrate and the non-formation region of the external electrode extraction portion is subjected to, for example, a wavelength 355 nm UV pulse which is the third harmonic modulation of the wavelength 1064 nm YAG laser. Perform deep-cut dicing with 50 to 100 μm left by laser dicing, and further oppose along the scribe line region of the BP substrate that can be seen through the opposing substrate, for example, with a 355 nm wavelength UV pulse laser that is the third harmonic modulation of a 1064 nm YAG laser The substrate and the TFT substrate are fully cut dicing, the end material is removed by impacting the deep cut dicing portion, the opposing substrate is divided into each opposing substrate, and the LCOS composed of the protective glass / opposing substrate and the BP substrate is divided. An LCD panel may be formed.

  In the method for manufacturing an electro-optical display device to which the present invention described in [A], [B], and [C] described above is applied, by double the peripheral frame, as shown in FIG. Between the first peripheral frame and the second peripheral frame, a mixed portion 39 of overflowed liquid crystal and overflowed sealing material is formed, and the adverse effect of liquid crystal contamination of the sealing material and the common material 3 is inside the second peripheral frame. Therefore, the liquid crystal operation failure such as light leakage does not occur.

In the above-described embodiment, the case where a double peripheral frame is formed has been described as an example. However, for example, a quadruple peripheral frame is formed as shown in FIG. A quadruple peripheral frame having a width of 50 μm, a distance between the peripheral frames of 50 μm, and a height of the peripheral frame corresponding to the liquid crystal gap of 2.5 μm) is formed outside the first peripheral frame 2a formed on the outermost side. When the seal material and the common material 3 are applied within a seal width of 500 μm, and a predetermined amount of liquid crystal is dispensed inside the second peripheral frame 2b formed on the innermost side, the first peripheral frame and the outside An overflowing sealing material layer 40 is formed between the second third peripheral frame 2c, and an overflowed liquid crystal layer 41 is formed between the second peripheral frame and the second fourth peripheral frame 2d from the inside. A vacuum is formed between the third peripheral frame and the fourth peripheral frame. Alternatively, since the mixed layer 42 of the liquid crystal and the sealing material is formed, the adverse effect of the liquid crystal contamination of the sealing material and the common material 3 on the liquid crystal inside the second peripheral frame is larger than that of the double peripheral frame. Since it does not reach further, liquid crystal operation defects such as point defects, image sticking, light loss, and responsiveness deterioration do not occur as compared with the case where double peripheral frames are formed.
Here, since multiple peripheral frames, which are stoppers as well as the sealing material, are formed between the TFT substrate or the BP substrate and the counter substrate, problems such as moisture intrusion from outside and liquid crystal contamination can be suppressed. . At this time, as the peripheral frame is multiplexed with 6, 8 or 10 layers, the mixing of the liquid crystal and the sealing material can be suppressed, and problems such as moisture intrusion from outside and liquid crystal contamination can be suppressed.
In the embodiment described above, multiple peripheral frames are formed on the TFT substrate or BP substrate side, sealing material and common material are applied outside the outermost peripheral frame, and liquid crystal is dropped inside the innermost peripheral frame. Alternatively, multiple peripheral frames are formed on the TFT substrate or BP substrate side, a sealing material is applied to the outside of the outermost peripheral frame, a liquid crystal is dropped inside the innermost peripheral frame, and a common material is applied to the opposite substrate side. In the bonding apparatus, the TFT substrate or BP substrate side and the counter substrate side are bonded to each other, but conversely, a plurality of peripheral frames are formed on the counter substrate side, and a sealing material and an outer periphery of the outermost peripheral frame are formed. Apply common material and drop liquid crystal inside the innermost peripheral frame, or form multiple peripheral frames on the counter substrate side, apply sealant outside the outermost peripheral frame and inside the innermost peripheral frame TF with liquid crystal dripping And common material applied to the substrate or the BP substrate side, it goes without saying that may be a method of bonding the opposing substrate and the TFT substrate or the BP substrate side vacuum bonding the device.

6 is a process flow of a manufacturing method of a transmissive LCD for a projector, which is an example of a manufacturing method of an electro-optic display device to which the present invention is applied. It is a schematic diagram for demonstrating the laser etching of inorganic type alignment films, such as SiOx which is an example of the manufacturing method of the electro-optical display apparatus to which this invention is applied. It is a schematic diagram (1) for demonstrating the manufacturing method of the transmissive LCD for projectors which is an example of the manufacturing method of the electro-optical display apparatus to which this invention is applied. It is a schematic diagram (2) for demonstrating the manufacturing method of the transmissive LCD for projectors which is an example of the manufacturing method of the electro-optical display apparatus to which this invention is applied. It is a schematic diagram (3) for demonstrating the manufacturing method of the transmissive LCD for projectors which is an example of the manufacturing method of the electro-optical display apparatus to which this invention is applied. It is a schematic diagram (4) for demonstrating the manufacturing method of the transmissive LCD for projectors which is an example of the manufacturing method of the electro-optical display apparatus to which this invention is applied. It is typical sectional drawing for demonstrating the modification of the manufacturing method of the transmissive LCD for projectors which is an example of the manufacturing method of the electro-optical display apparatus to which this invention is applied. It is a process flow of the manufacturing method of the transmissive LCD for EVF which is another example of the manufacturing method of the electro-optical display apparatus to which this invention is applied. It is a schematic diagram for demonstrating the manufacturing method of the transmissive LCD for EVF which is another example of the manufacturing method of the electro-optical display apparatus to which this invention is applied. It is a schematic diagram for demonstrating laser cutting. It is a process flow of the manufacturing method of the reflection type LCD for LCOS type projectors which is still another example of the electro-optic display device to which the present invention is applied. It is a schematic diagram (1) for demonstrating the manufacturing method of the reflection type LCD for LCOS type projectors which is another example of the electro-optical display apparatus to which this invention is applied. It is a schematic diagram (2) for demonstrating the manufacturing method of LCOS type reflective LCD for projectors which is another example of the electro-optical display apparatus to which this invention is applied. It is a schematic diagram for demonstrating laser cutting. It is typical sectional drawing for demonstrating the multiple periphery frame effect of the electro-optical display apparatus to which this invention is applied. It is a flowchart explaining the example of a surface liquid crystal assembly in order. It is a flowchart explaining the example of a single liquid crystal assembly in order. It is a flowchart explaining the example of a plane single liquid crystal assembly in order.

Explanation of symbols

1 TFT substrate (quartz)
2 peripheral frame 2a first peripheral frame 2b second peripheral frame 2c third peripheral frame 2d fourth peripheral frame 3 sealing material 4 common material 5 liquid crystal 6 display area 7 OCS
8 Liquid crystal dispenser 9 Laser sensor 10 TFT substrate (quartz)
11 Opposing substrate (quartz)
12 Temporary fixing light shielding jig 13 Vacuum suction stage for liquid crystal gap inspection 14 NR inspection machine 15 Vacuum suction support stage 16 Polishing buff material 17 TFT formation film (or BP formation film)
DESCRIPTION OF SYMBOLS 18 Substrate support jig for image inspection 19 Illumination cylinder 20 Image inspection machine 21 Incident light 22 Emission light 23 Transparent protective tape 24 Protective glass chip 26 Hollow vacuum suction collet 27 Dicing tape 28 Dicing vacuum suction jig 29 Flexible substrate 30 Metal Frame 31 High thermal conductive mold resin 32 Parting plate 33 Vacuum suction jig for laser cutting 35 Polarizing plate 36 Resin frame 37 Mold resin 38 BP substrate (silicon)
39 Mixed portion of overflowed liquid crystal and overflowed sealing material 40 Overflowed sealing material layer 41 Overflowed liquid crystal layer 42 Vacuum layer or mixed layer of liquid crystal and sealing material 43 Electrostatic chuck stage 44 TFT substrate (silicon)
45 Opposing substrate (low strain point glass)
50 Protection glass large plate (1)
51 Protective glass plate (2)

Claims (17)

A drive substrate having a display area and a peripheral area;
A counter substrate bonded to the drive substrate with a sealant having a liquid crystal injection hole-free pattern through a predetermined gap;
Liquid crystal held in the gap between the drive substrate and the counter substrate;
A first peripheral frame surrounding at least the display area;
An electro-optic display device comprising a second peripheral frame surrounding the first peripheral frame,
The sealing material is applied to an outer region of the second peripheral frame;
An electro-optic display device in which the liquid crystal is held in an inner region of the first peripheral frame. The electro-optical display device according to claim 1, wherein at least one of the first peripheral frame or the second peripheral frame has a liquid crystal gap height. The electro-optical display device according to claim 1, wherein a mixed layer of liquid crystal and a sealing material, an overflow layer of a liquid crystal or a sealing material, or a vacuum layer is formed between the first peripheral frame and the second peripheral frame. Forming a plurality of driving substrates on a base, and forming a first peripheral frame surrounding at least a display region of each driving substrate and a second peripheral frame surrounding the first peripheral frame;
Forming a liquid crystal alignment film corresponding to each drive substrate or performing a liquid crystal alignment film formation and a liquid crystal alignment treatment;
A step of performing liquid crystal alignment film formation or liquid crystal alignment film formation and liquid crystal alignment treatment corresponding to each counter substrate;
After applying a sealing material having a pattern without a liquid crystal injection hole to a seal region outside the second peripheral frame of the driving substrate formed on the base, and dropping a predetermined amount of liquid crystal on the inner region of the first peripheral frame The position of the counter substrate formed on the base is adjusted relative to each other so that the drive substrate and the counter substrate face each other with a predetermined gap therebetween, and the vacuum substrate having a predetermined vacuum degree is set in the predetermined gap. And the process of superimposing
A step of returning the inside of the vacuum device to atmospheric pressure and performing bonding by uniform pressure of atmospheric pressure, curing the sealing material to form an LCD panel with a predetermined liquid crystal gap;
And a step of dividing the base body on which the driving substrate is formed and the base body on which the counter substrate is formed for each LCD panel. 5. The electro-optical display device according to claim 4, further comprising a step of performing at least back optical polishing of the counter substrate or at least back optical polishing of the base on which the driving substrate is formed after forming the LCD panel. Manufacturing method. Immediately after dropping a predetermined amount of liquid crystal on the inner region of the first peripheral frame, the base on which the driving substrate is formed or the base on which the counter substrate is formed is not moved, and the optical sensor is moved in a step-and-repeat manner. Move the substrate on which the driving substrate is formed or the substrate on which the counter substrate is formed without moving the optical sensor in a step-and-repeat manner, and move the substrate to the inner region of the first peripheral frame by the optical sensor. The method for manufacturing an electro-optic display device according to claim 4, further comprising a step of determining whether or not the dropped liquid crystal is dropped and optimizing the amount of dropped liquid crystal. Immediately after dropping a predetermined amount of liquid crystal on the inner area of the first peripheral frame, the substrate on which the driving substrate is formed or the substrate on which the counter substrate is formed is not moved and the liquid crystal dispenser and the optical sensor are synchronized. The substrate on which the driving substrate is formed or the substrate on which the counter substrate is formed is moved in a step-and-repeat manner without moving the optical sensor and the liquid crystal dispenser. The electro-optic display according to claim 4, further comprising a step of determining whether or not the liquid crystal is dropped on the inner region of the first peripheral frame and optimizing the liquid crystal drop amount by an optical sensor synchronized with the dropping. Device manufacturing method. A bottom scribe line is formed in a region of the opposing substrate corresponding to a boundary region between a region where the external extraction electrode portion is formed and a region where the external extraction electrode portion is not formed on the drive substrate, and the scribe line of the substrate on which the drive substrate is formed The drive substrate is subjected to an impact on the region where the recess is formed after full-cut dicing of the counter substrate until a cut recess having a predetermined depth is formed in the substrate on which the drive substrate is formed from the side of the counter substrate along The electro-optic display device according to claim 4, further comprising: a step of dividing the base on which the counter substrate is formed by removing a region of the counter substrate corresponding to the external extraction electrode portion of each of the counter substrates. Manufacturing method. The electric circuit according to claim 8, further comprising: a step of dividing the base on which the drive substrate is formed for each drive substrate by dicing the recess formation region of the cut from the front surface or the back surface side of the drive substrate. Manufacturing method of optical display device. Each of the opposing surfaces in the substrate on which the sealing region of each driving substrate in the substrate on which the driving substrate is formed, the inorganic alignment film or the organic alignment film formed on the common region and the external extraction electrode portion, and the counter substrate are formed The method of manufacturing an electro-optic display device according to claim 4, further comprising a step of laser etching an inorganic alignment film or an organic alignment film formed on the seal region and the common region of the substrate. A plurality of counter substrates are formed on the base, and a first peripheral frame and a second peripheral frame surrounding the first peripheral frame are formed in each counter substrate region corresponding to a region surrounding at least the display region of the drive substrate. Forming, and
A step of performing liquid crystal alignment film formation or liquid crystal alignment film formation and liquid crystal alignment treatment corresponding to each counter substrate;
Forming a liquid crystal alignment film corresponding to each drive substrate or performing a liquid crystal alignment film formation and a liquid crystal alignment treatment;
After applying a sealing material having a liquid crystal injection hole-less pattern to a seal region outside the second peripheral frame of the counter substrate formed on the substrate, and dropping a predetermined amount of liquid crystal on the inner region of the first peripheral frame The position of the drive substrate formed on the base is adjusted relative to each other so that the drive substrate and the counter substrate face each other with a predetermined gap, and the inside of the vacuum apparatus having a predetermined degree of vacuum at the predetermined gap is adjusted. And the process of superimposing
A step of returning the inside of the vacuum device to atmospheric pressure and performing bonding by uniform pressure of atmospheric pressure, curing the sealing material to form an LCD panel with a predetermined liquid crystal gap;
And a step of dividing the base body on which the driving substrate is formed and the base body on which the counter substrate is formed for each LCD panel. The electro-optical display device according to claim 11, further comprising a step of performing at least back optical polishing of the counter substrate or at least back optical polishing of a base on which the driving substrate is formed after forming the LCD panel. Manufacturing method. Immediately after dropping a predetermined amount of liquid crystal on the inner region of the first peripheral frame, the optical sensor is moved in a step-and-repeat manner without moving the substrate on which the counter substrate is formed, or the optical sensor is moved. Without moving the substrate on which the counter substrate is formed in a step-and-repeat manner, and determining whether or not the liquid crystal dropped on the inner region of the first peripheral frame by the optical sensor and the optimization of the liquid crystal dropping amount are determined. The method of manufacturing an electro-optical display device according to claim 11. Immediately after dropping a predetermined amount of liquid crystal on the inner area of the first peripheral frame, the substrate on which the counter substrate is formed is moved in a step-and-repeat manner in synchronization with the liquid crystal dispenser and the optical sensor, Alternatively, the substrate on which the counter substrate is formed is moved by a step-and-repeat method without moving the optical sensor and the liquid crystal dispenser, and is dropped onto the inner region of the first peripheral frame by the optical sensor synchronized with a predetermined amount of liquid crystal dropping. The method for manufacturing an electro-optical display device according to claim 11, further comprising a step of determining whether or not the liquid crystal is dropped and optimizing the liquid crystal dropping amount. A bottom scribe line is formed in a region of the opposing substrate corresponding to a boundary region between a region where the external extraction electrode portion is formed and a region where the external extraction electrode portion is not formed on the drive substrate, and the scribe line of the substrate on which the drive substrate is formed The drive substrate is subjected to an impact on the region where the recess is formed after full-cut dicing of the counter substrate until a cut recess having a predetermined depth is formed in the substrate on which the drive substrate is formed from the side of the counter substrate along The electro-optic display device according to claim 11, further comprising: a step of dividing the base on which the counter substrate is formed by removing the region of the counter base corresponding to the external extraction electrode portion of each counter substrate. Manufacturing method. 16. The electric device according to claim 15, further comprising a step of dividing the base on which the drive substrate is formed for each drive substrate by dicing the recess formation region of the cut from the front surface or the back surface side of the drive substrate. Manufacturing method of optical display device. Each of the opposing surfaces in the substrate on which the sealing region of each driving substrate in the substrate on which the driving substrate is formed, the inorganic alignment film or the organic alignment film formed on the common region and the external extraction electrode portion, and the counter substrate are formed The method for manufacturing an electro-optic display device according to claim 11, comprising a step of laser etching an inorganic alignment film or an organic alignment film formed on the sealing region and the common region of the substrate.

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