JP2006228842A - Resin film for fixing for semiconductor device, and method of manufacturing semiconductor device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin film for fixing which can be prevented from positional deviation at the time of being placed on salient electrodes of a semiconductor device. <P>SOLUTION: The resin film 6 for fixing is placed on the plurality of salient electrodes 5 of the semiconductor device 1, then heated and melted to enter a space between the salient electrodes 5, and finally cooled to be solidified into a solid resin layer 7. The resin film 6 for fixing is made of thermosetting resin or thermoplastic resin, and has, on the surface on the side in contact with the salient electrodes 5, a plurality of concave portions 8 for alignment which can be engaged with the salient electrodes 5. The concave portions 8 are formed in places corresponding to the individual salient electrodes 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a fixing resin film for fixing a semiconductor device to a printed circuit board or the like when the semiconductor device is mounted on a printed circuit board or the like, and a method for manufacturing a semiconductor device using the resin film.

  In recent years, as semiconductor devices are becoming lighter, thinner, and smaller, connection electrodes of the semiconductor devices are also narrowed, and the electrodes themselves are shifting toward smaller volumes and smaller areas. The same applies to mounting of a printed circuit board using a semiconductor device, and the connection electrode connecting the semiconductor device and the printed circuit board is reduced in volume and area, and there is a danger of lowering the mounting reliability of the circuit board.

  As a means for improving the board mounting reliability, a method of injecting a thermosetting resin into a gap between a semiconductor device and a printed board and heat curing is generally performed in a printed board mounting manufacturer. Recently, a method of preparing a thermosetting resin on the semiconductor device side in advance has been considered.

Hereinafter, a mounting method for mounting a conventional semiconductor device on a printed circuit board using a thermosetting resin will be described.
As shown in FIG. 10, the semiconductor device 31 includes a plurality of projecting electrodes 32 for connection. First, as shown in FIG. 10A, in the solder printing process, an electrode pad (on the printed circuit board 33) (Not shown), a solder paste 34 is applied, and then, as shown in (b), in the semiconductor device product mounting step, each protruding electrode 32 is pressed onto the solder paste 34 to thereby attach the semiconductor device 31 to the printed circuit board. Next, as shown in (c), in the reflow process, the whole including the printed circuit board 33 and the semiconductor device 31 is heated to melt the solder paste 34.

  Normally, the mounting on the printed circuit board 33 is completed by this reflow process. However, in order to further improve the mounting reliability of the circuit board, as shown in FIG. In the underfill injection step, the underfill 35 is injected into the gap between the semiconductor device 31 and the printed circuit board 33 as a thermosetting resin that serves as a fixing agent. Thereafter, as shown in (e), the underfill 35 is thermally cured by heating again in the heat curing step. Through these steps, the semiconductor device 31 and the printed board 33 are more firmly fixed.

  In the case of such a mounting method, the underfill injection process shown in (d) and the heat curing process shown in (e) are performed in excess of the normal process, so that the equipment cost and time are reduced. There is a problem that various burdens in terms of manpower are large.

  Further, since the area of the connecting land tends to be narrowed with the recent narrowing of the pitch, the phenomenon that the solder paste 34 does not come out of the hole of the printing mask in the solder printing process shown in FIG. There is a problem that a mask residual phenomenon occurs.

  In addition, since the flux agent contained in the solder paste 34 is solidified and attached around the protruding electrodes 32 after the reflow process shown in (c), in the underfill injection process shown in (d) below, There is a problem that the entry of the fill 35 is hindered and the underfill 35 cannot be injected to the innermost part of the gap between the semiconductor device 31 and the printed circuit board 33.

  Further, since it is necessary to secure a space for injecting the underfill 35, there is a problem that the distance between components of the adjacent semiconductor devices 31 has to be increased, and a high-density design cannot be performed.

In order to solve such problems, there is a method of mounting the semiconductor device 31 to which the underfill 35 has been applied in advance on the printed board 33.
That is, first, as shown in FIG. 11A, in the underfill coating step, the underfill 35 is filled in the gaps between the protruding electrodes 32 of the semiconductor device 31, and then, as shown in FIG. In the semiconductor device product mounting process, the semiconductor device 31 is placed on the printed circuit board 33, and as shown in FIG. 5C, the whole including the printed circuit board 33 and the semiconductor device 31 is heated in the reflow process. Thereby, since the underfill 35 is thermally cured, the semiconductor device 31 is firmly fixed to the printed circuit board 33.

  However, in the method in which the underfill 35 is applied to the semiconductor device 31 in advance as described above, it is difficult to fill the gaps between the protruding electrodes 32 with the underfill 35, and the filling amount of the underfill 35 into the gaps varies. Occurs, and it is difficult to keep the filling amount of the underfill 35 at an appropriate amount.

  Patent Document 1 below discloses a semiconductor device in which a plurality of protruding electrodes (bumps) are formed on a semiconductor element, and a thermoplastic resin layer is formed between the protruding electrodes (bumps) and the protruding electrodes (bumps). It is described that when reflowing during mounting, the thermoplastic resin layer is melted and then cured, whereby the semiconductor device is firmly adhered to the circuit board. The point which may be thermocompression-bonded from the side is described.

However, when a semiconductor device is manufactured by thermocompression bonding the resin sheet from the protruding electrode side as described above, when the resin sheet is placed on the protruding electrode, the resin sheet is easily displaced from a desired position, and the resin sheet is a semiconductor. There arises a problem that it protrudes from the chip surface of the apparatus or cannot be attached to an appropriate place.
JP-A-11-297750

  The present invention provides a resin film for fixing a semiconductor device, which can be positioned accurately at a desired location of the protruding electrode, preventing displacement when placed on the protruding electrode of the semiconductor device, Another object of the present invention is to provide a method of manufacturing a semiconductor device capable of forming an appropriate amount of a solid resin layer in a gap between protruding electrodes.

  In order to achieve the above object, the first invention is placed on a plurality of protruding electrodes provided in a semiconductor device, melted by heating, enters a gap between the protruding electrodes, and is cooled. A resin film for fixing a semiconductor device that is solidified into a solid resin layer, wherein the fixing resin film is made of a thermosetting resin or a thermoplastic resin, and a protrusion is formed on a surface in contact with the protruding electrode. A recess for alignment that can be freely fitted to the electrode is provided, and the recess is disposed at a position facing the plurality of protruding electrodes.

  According to this, when the fixing resin film is placed on the protruding electrode of the semiconductor device, the positioning resin recess can be fitted to the protruding electrode to prevent the fixing resin film from being displaced and fixed. The resin film can be accurately disposed at a desired position of the protruding electrode.

Further, in the resin film for fixing a semiconductor device according to the second invention, a plurality of recesses are formed.
According to this, the displacement of the fixing resin film can be prevented by fitting the plurality of recesses to the plurality of protruding electrodes, respectively.

  The resin film for fixing a semiconductor device according to the third aspect of the present invention has a groove formed as a recess, and the groove can be fitted to a plurality of protruding electrodes.

According to this, it is possible to prevent the displacement of the fixing resin film by fitting the alignment grooves to the plurality of protruding electrodes.
Moreover, this 4th invention is a manufacturing method of the semiconductor device using the resin film for fixation in any one of the said 1st invention to the 3rd invention, Comprising: The recessed part for position alignment is fitted in a protruding electrode. The fixing resin film is placed on the protruding electrodes and heated to melt the fixing resin film, fill the gaps between the protruding electrodes, and cool to form a solid resin layer in the gaps between the protruding electrodes. To do.

  According to this, it is possible to prevent the displacement of the fixing resin film by fitting the alignment concave portion to the protruding electrode, and accurately dispose the fixing resin film at a desired position of the protruding electrode. Can do.

  Thereafter, by heating and cooling the fixing resin film, since the solid resin layer is formed in the gap between the protruding electrodes, variation in the amount of solid resin layer formed in the gap can be suppressed, An appropriate amount of the solid resin layer can be formed in the gap.

  In addition, after manufacturing a semiconductor device in this way, the semiconductor device is mounted on a substrate such as a printed circuit board in a semiconductor device product mounting step, and then, in the reflow step, the whole including the substrate and the semiconductor device is heated. To do. Thereby, since the solid resin layer is thermally cured, the semiconductor device is firmly fixed to the substrate.

  As described above, according to the present invention, it is possible to prevent displacement of the fixing resin film, and it is possible to accurately dispose the fixing resin film at a desired position of the protruding electrode of the semiconductor device. In addition, an appropriate amount of the solid resin layer can be formed in the gap between the protruding electrodes. This improves the reliability when the semiconductor device is mounted on a substrate such as a printed circuit board by reflow heating, and facilitates the mounting process of the semiconductor device to the substrate.

Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1D and 2, the semiconductor device 1 includes a substrate 2 provided with a plurality of wirings, a semiconductor element 3 mounted on either the front or back surface of the substrate 2, Connection means 4 (a stud bump bonding method is shown in FIG. 1) electrically connecting a plurality of wirings and wiring pads of the semiconductor element 3 and the wiring on the other surface opposite to one surface of the substrate 2 And a plurality of protruding electrodes 5 (bumps) electrically connected to each other. Further, a solid resin layer 7 made of a fixing resin film 6 is formed in the gap between the protruding electrodes 5. Note that the thickness of the solid resin layer 7 is slightly thinner than the height of the protruding electrode 5, whereby the tip portion of the protruding electrode 5 is exposed from the solid resin layer 7.

  As shown in FIG. 1A, FIG. 3 and FIG. 4, the fixing resin film 6 is made of a thermosetting resin of a two-curing type that is melted by the first heating and cured by the second heating. The fixing resin film 6 has a plurality of alignment recesses 8 that can be fitted to the protruding electrodes 5 on the surface in contact with the protruding electrodes 5. Each concave portion 8 has a hemispherical concave shape, and is disposed at a location facing all the protruding electrodes 5.

Next, a method for manufacturing the semiconductor device 1 will be described with reference to FIG.
First, as shown in FIGS. 1A and 1B, the fixing resin film 6 is placed on each protruding electrode 5 by fitting each recessed portion 8 to each protruding electrode 5. Next, as shown in (c), the fixing resin film 6 is melted by heating to fill the gaps between the protruding electrodes 5. Thereafter, as shown in (d), the solidified resin layer 7 is formed in the gaps between the protruding electrodes 5 by cooling and solidifying the molten fixing resin film 6. Thereby, the semiconductor device 1 having the solid resin layer 7 is completed.

  As described above, when the fixing resin film 6 is placed on the protruding electrode 5, as shown in FIG. 5B, by fitting the concave portions 8 to the protruding electrodes 5, Misalignment can be prevented, and the fixing resin film 6 can be accurately arranged at a desired position of the protruding electrode 5.

  Thereafter, as shown in (c) and (d), the solid resin layer 7 is formed in the gap between the protruding electrodes 5 by heating and cooling the fixing resin film 6, so that the solid resin in the gap is formed. Variation in the formation amount of the resin layer 7 can be suppressed, and an appropriate amount of the solid resin layer 7 can be formed in the gap.

  After manufacturing the semiconductor device 1 as shown in FIGS. 1A to 1D, the semiconductor device 1 is mounted on the printed circuit board 11 as shown in FIG. That is, as shown in FIG. 5A, the semiconductor device 1 is placed on the printed board 11 in the semiconductor device product mounting process, and then in the reflow process, the printed board 11 is shown in FIG. 5B. And the entire semiconductor device 1 are heated. Thereby, since the solid resin layer 7 is thermally cured, the semiconductor device 1 is firmly fixed to the printed circuit board 11.

Thereby, the reliability when mounting the semiconductor device 1 on the printed circuit board 11 is improved, and the mounting process of the semiconductor device 1 on the printed circuit board 11 can be easily performed.
In addition, since the fixing resin film 6 can be cut and used according to the size of the substrate 2 of the semiconductor device 1, it can be easily applied to the semiconductor device 1 having the substrates 2 of various sizes.

  In addition, before the semiconductor device 1 is mounted on the printed circuit board 11, the solid resin layer 7 is prevented from adhering to a transfer tray, a storage pocket portion of an embossed carrier tape, or the like, or the solid resin layer 7. In order to prevent dust from adhering to the surface, it is desirable to keep it dry. Further, the surface of the semiconductor device 1 on which the protruding electrode 5 is formed is covered and protected with a cover film or the like, and the cover film is removed in the subsequent mounting stage on the printed circuit board 11 to print the semiconductor device 1. It may be mounted on the substrate 11.

  Further, in the first embodiment, as shown in FIG. 5, in order to save labor, the protruding electrode 5 is directly joined to the printed circuit board 11 without using the solder paste, but the solder paste is used. May be.

  In the first embodiment, as shown in FIG. 1 (d), the thickness of the solid resin layer 7 is formed slightly thinner than the height of the bump electrode 5, and the tip portion of the bump electrode 5 is formed. Although it is exposed from the solid resin layer 7, the thickness of the solid resin layer 7 may be the same as the height of the protruding electrode 5, or the thickness of the solid resin layer 7 is made thicker than the height of the protruding electrode 5. Thus, the protruding electrode 5 may be embedded in the solid resin layer 7. However, the projection electrode 5 can be easily inspected when the tip portion of the projection electrode 5 is exposed from the solid resin layer 7.

  In the first embodiment, as shown in FIG. 2, the full matrix type semiconductor device 1 in which a plurality of protruding electrodes 5 are arranged uniformly distributed over almost the other surface of the substrate 2 has been described. As a second embodiment, as shown in FIG. 6, an area 14 where the protruding electrode 5 is not formed is provided at the center of the other surface of the substrate 2, and a plurality of protruding electrodes 5 are formed around the area 14. The tooth removal type semiconductor device 1 may be used. In this case, a plurality of the recesses 8 of the fixing resin film 6 are provided at locations facing the protruding electrodes 5, and are not provided at locations facing the area 14.

  In the first embodiment, the same number of the concave portions 8 as the protruding electrodes 5 are formed, but the number of the concave portions 8 may be two or more and the number of the protruding electrodes 5 or less. For example, as a third embodiment, as shown in FIGS. 7 and 8, two concave portions 8 are formed at diagonal corners of the fixing resin film 6, and the other surface of the substrate 2 is formed. You may make it make relative to the two protruding electrodes 5 located in the corner 15 (refer FIG. 2) on a diagonal.

  According to this, when the fixing resin film 6 is placed on the protruding electrode 5, as shown in FIG. 8, both the concave portions 8 are fitted to the protruding electrodes 5, thereby shifting the position of the fixing resin film 6. Can be prevented. At this time, the portion of the fixing resin film 6 where the concave portion 8 is not formed is placed on the protruding electrodes 5 other than the two protruding electrodes 5 positioned at the corner 15.

  In the third embodiment, as shown in FIG. 7, two recesses 8 are formed at diagonal corners of the fixing resin film 6, but recesses are formed at the four corners of the fixing resin film 6. Four 8 may be formed.

  In the first to third embodiments, the fixing resin film 6 is formed with the hemispherical recess 8 in the fixing resin film 6, but in the following fourth to sixth embodiments, FIG. As shown in FIG. 5, the grooves 16, 16a to 16d for alignment are formed as the recesses.

  That is, in the fourth embodiment, as shown in FIG. 9A, the groove 16 is formed on the outer peripheral edge of the fixing resin film 6 over the entire circumference. The groove 16 is formed in a B shape in plan view, and can be fitted to the plurality of protruding electrodes 5 on the outer peripheral edge of the substrate 2 facing the groove 16.

According to this, the positional displacement of the fixing resin film 6 can be prevented by fitting the groove 16 to the plurality of protruding electrodes 5.
In the fifth embodiment, as shown in FIG. 9B, a plurality of grooves 16 a to 16 d are formed on the outer peripheral edge of the fixing resin film 6. These grooves 16 a to 16 d are separated and independent at the four corners of the fixing resin film 6. Each of the grooves 16a to 16d can be fitted to the plurality of protruding electrodes 5 on the outer peripheral edge of the substrate 2 facing the grooves 16a to 16d.

According to this, the positional displacement of the fixing resin film 6 can be prevented by fitting the grooves 16a to 16d to the plurality of protruding electrodes 5, respectively.
Moreover, in 6th Embodiment, as shown in FIG.9 (c), several groove | channels 16a-16d are formed in the four corner parts of the outer periphery part of the resin film 6 for fixation. Each of the grooves 16a to 16d is formed in an L shape in plan view, and can be freely fitted to the plurality of protruding electrodes 5 at the four corners of the outer peripheral edge of the substrate 2 facing the respective grooves 16a to 16d.

According to this, the positional displacement of the fixing resin film 6 can be prevented by fitting the grooves 16a to 16d to the plurality of protruding electrodes 5, respectively.
In the fifth and sixth embodiments, four grooves 16a to 16d are formed, but a plurality of grooves other than four may be formed.

  Moreover, in each said embodiment, although the thermosetting resin was used for the material of the resin film 6 for fixation, you may use a thermoplastic resin. In particular, if a function of removing the semiconductor device 1 from the printed circuit board 11 is provided in a process of repairing and replacing the semiconductor device 1 (so-called repair process), it is desirable to use a thermoplastic resin. Furthermore, it is more preferable that a flux agent having an effect of removing the oxide film is included.

  The semiconductor device fixing resin film of the present invention and the method of manufacturing a semiconductor device using the fixing resin film can be applied to all semiconductor devices having protruding electrodes, and the reliability when the semiconductor device is mounted on a printed circuit board. It is useful as a means for improving the performance.

It is a figure which shows the manufacturing method of the semiconductor device using the resin film for fixation in the 1st Embodiment of this invention. It is XX arrow line view in (a) of FIG. It is a partial expanded sectional view of the resin film for fixation same as the above. It is a YY arrow line view in (a) of FIG. It is a figure which shows the method to mount a semiconductor device on a printed circuit board similarly. It is a top view of the semiconductor device in the 2nd Embodiment of this invention. It is a top view of the resin film for fixation in the 3rd embodiment of the present invention. It is the figure which mounted the resin film for fixation on the projection electrode of the semiconductor device. It is a top view of the resin film for fixation in the 4th-the 6th embodiment of the present invention. It is a figure which shows the method of mounting the conventional semiconductor device on a printed circuit board, and injects an underfill after a reflow process. It is a figure which shows the method of mounting the conventional semiconductor device on a printed circuit board, and applies an underfill beforehand.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor device 5 Projection electrode 6 Resin film for fixation 7 Solid resin layer 8 Concave part 16, 16a-16d Groove (concave part)

Claims (4)

For fixing a semiconductor device that is placed on a plurality of protruding electrodes provided in a semiconductor device, melts by heating, enters a gap between the protruding electrodes, and solidifies into a solid resin layer by cooling. A resin film,
The fixing resin film is made of a thermosetting resin or a thermoplastic resin, and has a concave portion for alignment that can be fitted to the protruding electrode on a surface on the side in contact with the protruding electrode.
The resin film for fixing a semiconductor device, wherein the concave portion is disposed at a position facing the plurality of protruding electrodes. 2. The resin film for fixing a semiconductor device according to claim 1, wherein a plurality of recesses are formed. 3. A resin film for fixing a semiconductor device according to claim 1, wherein a groove is formed as the recess, and the groove can be freely fitted to a plurality of protruding electrodes. A method for manufacturing a semiconductor device using the fixing resin film according to any one of claims 1 to 3,
The fixing resin film is placed on the protruding electrode by fitting the recessed portion for alignment with the protruding electrode, and heated, so that the fixing resin film is melted, filled in the gap between the protruding electrodes, and cooled. A method of manufacturing a semiconductor device using a fixing resin film, wherein a solid resin layer is formed in a gap between protruding electrodes.

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