JP2006225648A5 - - Google Patents

Claims (17)

It includes vapor-grown carbon fibers and synthetic resins having a specific surface area of 10 to 50 m ² / g, an average aspect ratio of 65 to 500, and an average fiber diameter of 50 to 130 nm, and a volume resistivity of 10 ¹ to 10 ¹² Ωcm. The conductive resin composition characterized by the above-mentioned.   2. The conductive resin composition according to claim 1, wherein the ratio of the melt flow index of the conductive resin composition to the melt flow index of the synthetic resin with no filler added is 0.1 or more. The number of branches of vapor grown carbon fiber is 0.3 / μm or less, d _{002 of} X-ray diffraction method is 0.345 nm or less, and the peak height (Id) of the band of 1341 to 1349 cm ^{−1 in} the Raman scattering spectrum. The conductive resin composition according to claim 1, wherein a ratio (Id / Ig) of peak heights (Ig) of bands of 1570 to 1578 cm ⁻¹ is 0.1 to 1.3. The amount of vapor grown carbon fibers, conductive resin composition according to any one of claims 1 to 3, which is 1-13 parts by weight of the synthetic resin 100 parts by mass. It is a manufacturing method of the conductive resin composition in any one of Claims 1-4 , Comprising: Gas phase method carbon fiber is mixed with the liquid resin raw material used as a synthetic resin by the melted synthetic resin or hardening. Manufacturing method. The manufacturing method of the conductive resin composition of Claim 5 mixed with the energy of 1000 MJ / m < ³ > or less. The manufacturing method of the conductive resin composition of Claim 5 which suppresses the fracture | rupture of the vapor-grown carbon fiber at the time of mixing to 20% or less. A molded article obtained by molding the conductive resin composition according to any one of claims 1 to 4 . The conductive resin composition according to any one of claims 1 to 4 , wherein the volume resistivity is in the range of 10 ¹ to 10 ⁶ Ωcm. The conductive resin composition according to claim 9 , wherein the amount of vapor grown carbon fiber is 5 to 13 parts by mass with respect to 100 parts by mass of the synthetic resin. The thermal conductivity is 0.8 W / mK or more, the tensile breaking elongation at 23 ° C. is 50% or more of the resin with no filler added, the notched Izod impact value is 1 kJ / m ² or more, and 80 ° C. for 30 minutes. The conductive resin composition according to claim 9 or 10 , wherein the total amount of gas generated when heated is 5 ppm or less. The conductive resin composition according to any one of claims 1 to 4 , wherein the volume resistivity is in the range of 10 ⁶ to 10 ¹² Ωcm. The conductive resin composition according to claim 12 , wherein the amount of vapor grown carbon fiber is 1 to 5 parts by mass with respect to 100 parts by mass of the synthetic resin. The average particle carbon particles of size 1 m to 10 m, the conductive resin composition according to claim 12 or 13 containing 5 to 25 parts by weight of the synthetic resin 100 parts by mass. The maximum / minimum variation in resistance value in the molded product surface is 10 or less, the tensile elongation at break at 23 ° C. is 50% or more of the additive-free resin, and the notched Izod impact value is 1 kJ / m ² or more. The conductive resin composition according to any one of claims 12 to 14 , wherein the total amount of gas generated when heated at 80 ° C for 30 minutes is 5 ppm or less. A carrier tape using the conductive resin composition according to any one of claims 12 to 14 , wherein the maximum value / minimum value of variation in resistance value in the surface of the molded body is <10 or less. The carrier tape according to claim 16 , wherein the synthetic resin is selected from the group consisting of thermoplastic resins having a glass transition temperature of 100 ° C or higher and / or a melting point of 200 ° C or higher.