JP2006210839A - Cleaning device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent watermarks of cleaned articles, which have been cleaned halfway in a transfer process, from being produced. <P>SOLUTION: In a cleaning device that has cleaning means 4A, 4B in a cleaning chamber 2A and is configured to dry-cleaned articles 6A, 6B after they are brought in the cleaning chamber 2A and are cleaned by the cleaning means 4A, 4B; the atmosphere in the vicinity of the cleaned articles 6A, 6B, is kept at high humidity that is higher than the predetermined value, to prevent the watermark from occurring on the cleaned articles 6A, 6B, by providing humidifying means 13A to 13F that heat the atmosphere in the vicinity of the cleaning means 4A, 4B in the cleaning chamber 2A to humidify the vicinity of the cleaned 4A, 4B in the cleaning chamber 2A by the humidifying means 13A to 13F. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  In microelectronic structures such as semiconductor devices, miniaturization of circuit patterns, higher density, and higher integration are progressing year by year, and the minimum processing dimensions are further miniaturized. Along with this, the size of contaminants such as particles, metal / metal ions, and organic matter on the wafer surface is miniaturized and the cleanliness level is becoming stricter. Regarding cleaning of such an object to be cleaned, cleaning methods employed so far can be broadly divided into wet cleaning and dry cleaning. However, at present, it is difficult to maintain a satisfactory level of wafer cleanliness with dry cleaning alone, and even when dry cleaning is used, it is often used in combination with technologies such as wet cleaning. Cleaning is mainstream.

  In the case of wet cleaning, organic, aqueous or activator additives are generally employed as the cleaning medium. Recently, a cleaning method improved from the conventional RCA cleaning method and new technologies such as ozone water, electrolyzed water, and a chelating agent have been developed.

  Furthermore, with regard to environmental measures, closed technologies have been developed that are not measures on the outlet side as in the past, and that use of a cleaning medium with a low environmental load and chemicals and chemicals are not discharged out of the process.

  By the way, in the case of such a wet type cleaning apparatus, for example, if water droplets are dried on the surface of an object to be cleaned such as a semiconductor device, a trace called a watermark that is harmful on the electronic circuit remains.

  Therefore, in the drying process, which is the final process of cleaning, the following various cleaning and drying means have been employed so far in order to perform efficient drying while preventing this.

(1) First, in the first prior art, as a washing and drying method for preventing the generation of watermarks in a multi-tank washing apparatus,
The substrate after the cleaning treatment is carried in and immersed in an inner tank filled with pure water, the atmosphere in the outer tank (pressure vessel) containing the inner tank is replaced with nitrogen gas, and the inside of the tank is kept under reduced pressure. While flowing nitrogen gas through the outer tank, pure water is supplied to the inner tank to overflow rinse the substrate, and then the inner tank is drained from the inner tank to the water receiving tank by the pressure difference between the water tank connected to the inner tank. After draining the substrate, vacuum was drawn while supplying nitrogen gas into the outer tank, and the lamp heater was turned on and dried under reduced pressure while heating the substrate (see Patent Document 1),
(2) In the second prior art, as a washing and drying method for suppressing the generation of watermarks,
A means for cleaning the semiconductor material by spraying a processing chemical and pure water, a means for filling the chamber with another processing chemical and immersing the semiconductor material, and a semiconductor material being immersed in the chamber And a means for discharging the treatment chemical solution or pure water from the upper part of the chamber in order. The pure water is drained from below at such a speed that the interface layer can be maintained. Subsequently, after all the liquid is drained from the chamber, nitrogen gas is supplied from the upper part of the chamber to purge the chamber to discharge the isopropyl alcohol atmosphere. Thereby, gas (outside air, atmosphere, air) and liquid (pure water) and liquid (pure water) can be completely separated and dried, and a clean wafer surface free of watermark is obtained (see Patent Document 2). ),
(3) Further, as a third prior art, there is one in which exhaust from a cleaning liquid containing ammonia or hydrogen peroxide is purified by an air washer (see Patent Document 3).

JP-A-6-163508 (Specification 1-4, FIG. 1-3) Japanese Patent Laid-Open No. 10-144650 (Specification 1-8, FIG. 1-7) JP 2002-253927 A (Specification 1-7, FIG. 1-9)

  In general, cleaning devices such as those described above use chemicals that are harmful to the human body and surrounding devices such as hydrofluoric acid, hydrochloric acid, sulfuric acid, ammonia, and hydrogen peroxide. A large amount of internal atmosphere is discharged outdoors to prevent leakage to the outside. In order to prevent particles from adhering to the substrate during the replenishment of the exhaust gas and the transfer process, clean air in the cleaning chamber flows in via the upper downflow unit. Is a low-humidity air of about 40% RH, which lowers the humidity in the apparatus and may cause unintentional drying of the object to be cleaned during conveyance between tanks until drying.

  However, none of the above-mentioned conventional techniques give consideration to the prevention of the generation of watermarks during the course of cleaning leading to drying.

  Therefore, there is a problem that it is not possible to prevent the generation of a watermark during the cleaning to the same drying.

  In addition, since the exhaust cannot be directly released to the atmosphere, it is treated by providing a neutralization treatment apparatus outdoors or downstairs, and these power costs and equipment costs are large. In order to cope with such an increase in cost, the third prior art described above is configured as a circulation type exhaust treatment device, but this is only a contrivance on the treatment device side, and it is used for the entire usage including the cleaning device. Is not considered at all.

  The present invention has been made based on such circumstances, and the atmosphere around the cleaning means in the cleaning chamber is effectively humidified by the humidifying means to maintain the ambient atmosphere of the object to be cleaned at a high humidity equal to or higher than a predetermined value. Therefore, it is an object of the present invention to provide a cleaning device that can effectively prevent the generation of a watermark during the cleaning leading to drying, and can also reduce the exhaust power. .

  In order to achieve the above object, the present invention is configured with the following problem solving means.

(1) First Problem Solving Means The first problem solving means of the present invention has cleaning means 4A and 4B in the cleaning chamber 2A, and cleans the objects 6A and 6B carried into the cleaning chamber 2A. In the cleaning apparatus that is cleaned by the means 4A and 4B and then dried, humidifying means 13A to 13F that humidify the atmosphere around the cleaning means 4A and 4B in the cleaning chamber 2A are provided, and the inside of the cleaning chamber 2A is provided. The surroundings of the objects to be cleaned 4A and 4B are humidified by the humidifying means 13A to 13F, whereby the atmosphere around the objects to be cleaned 6A and 6B is maintained at a high humidity equal to or higher than a predetermined value.

  According to such a configuration, since the atmosphere density around the cleaning means 4A and 4B in the cleaning chamber 2A is humidified to a required high humidity level, the unintended water of the objects to be cleaned 6A and 6B in the middle of cleaning to dryness Generation of marks can be effectively prevented.

(2) Second Problem Solving Means The second problem solving means of the present invention is characterized in that, in the configuration of the first problem solving means, the humidifying means 13A to 13F are constituted by porous membrane elements. Yes.

  Thus, when the porous membrane element is used as the humidifying means 13A to 13F, there is no restriction on the ventilation direction and the installation direction is free, and the ceiling installation type, the side installation type, and the rear surface according to the cleaning device in a multistage configuration. An arbitrary installation form such as an installation type with a small occupied floor area can be selected, and in some cases, elements can be dispersedly arranged in an empty space in the cleaning apparatus.

  Therefore, the optimal usage including the exhaust treatment unit can be realized.

  Further, since the porous membrane elements 13A to 13F can humidify the air at the molecular level, they can be humidified without causing water droplets, and there is no possibility of clogging the particulate filter used in the blowing path. .

(3) Third Problem Solving Means According to a third problem solving means of the present invention, in the configuration of the second problem solving means, the porous membrane element is provided from the air supply section to the cleaning chamber 2A and the cleaning chamber 2A. It is characterized in that it is provided in the air recirculation passages 15a and 15b that connect to the exhaust part.

  As described above, when the porous membrane element is provided in the air circulation paths 15a and 15b that connect the air supply section to the cleaning chamber 2A and the exhaust section from the cleaning chamber 2A, a closed-type recirculation flow is taken into consideration. When the mold cleaning apparatus is configured, efficient humidification can be performed.

(4) Fourth Problem Solving Means According to a fourth problem solving means of the present invention, in the configuration of the second or third problem solving means, the porous membrane element is harmful in the exhaust air from the cleaning chamber 2A. It is configured as a harmful substance removing means for removing substances, and is characterized in that harmful substances contained in exhaust gas such as cleaning liquid evaporation components are removed simultaneously with humidification.

  If comprised in this way, the density | concentration of the harmful | toxic gas component in a washing | cleaning room | chamber interior can be kept low by the harmful substance removal effect | action of a porous membrane element, even if the exhaust_gas | exhaustion amount to the outdoors is reduced significantly.

  Therefore, the amount of exhaust to the outside can be effectively reduced without reducing the cleaning ability.

(5) Fifth Problem Solving Means According to a fifth problem solving means of the present invention, in the configuration of the second, third, or fourth problem solving means, a water supply circuit for supplying water to the porous membrane element is circulated. A water regeneration means 20 having a gas recovery action is provided as a circuit configuration, and the cleaning liquid evaporation component is recovered and removed simultaneously with humidification.

  If comprised in this way, the water for humidification and harmful | toxic gas collection | recovery can be repeatedly used by the harmful | toxic gas collection | recovery effect | action of the water reproduction | regeneration means 20. FIG. As a result, the amount of expensive pure water used can be reduced and the amount of partial drainage can be greatly reduced.

  As a result of the above, according to the present invention, it is possible to effectively prevent unintentional drying in the middle of cleaning first, and to provide a highly reliable cleaning apparatus that does not cause the occurrence of a watermark as in the prior art. Will be able to.

  Further, the conventional neutralization device for the exhaust treatment is not required, and the exhaust power can be greatly reduced. Therefore, the equipment can be simplified and the cost can be greatly reduced.

  As a result, the apparatus can be downsized and the installation space can be narrowed.

(Best Embodiment 1)
First, FIGS. 1 to 3 show the entire cleaning device and the configuration of the main part according to the best embodiment 1 of the present invention.

  In the case of the configuration of the best embodiment 1, for example, semiconductor devices 6A, 6B... Such as silicon wafers are selected as an example of an object to be cleaned, and the cleaning apparatus 1 having a predetermined cleaning space 2 is Are installed corresponding to the substrate processing step of the production line of the semiconductor devices 6A, 6B. The cleaning apparatus 1 is provided in a clean room of a semiconductor manufacturing facility together with a harmful substance removing unit 12 described later.

  The cleaning space 2 includes chemical tanks 4A and 4B (which may be plural or single) as cleaning means for the semiconductor devices 6A, 6B... Which are objects to be cleaned, in the chemical tanks 4A and 4B. A wet cleaning method is adopted in which cleaning is performed by immersing semiconductor devices 6A, 6B,. As the chemical solutions 5 and 5, for example, hydrofluoric acid, hydrochloric acid, sulfuric acid, ammonia, hydrogen peroxide and the like are employed.

  Further, in the upper part of the cleaning space 2 of the cleaning device 1, the blowers 8A and 8B having high corrosion resistance for blowing an air flow from the upper side to the lower side, and the air blown downward from the blowers 8A and 8B. A downflow unit 7 comprising fine particle filters 9A and 9B for removing fine contaminants is provided via a partition wall 10. The fine particle filters 9A and 9B are made of a predetermined PTFE made of, for example, corrosion resistant effective as a fine particle filter.

  Further, a partition wall 11 having good ventilation is provided below the cleaning space 2, and the above-described chemical tanks 4A and 4B are connected to the downflow unit via the partition wall 11 as shown in the figure. 7 is installed so as to correspond directly below the blowers 8A and 8B. A space between the partition wall 11 on the lower side and the partition wall 10 on the downflow unit 7 side is formed in the cleaning chamber 2A.

  An exhaust chamber 2 </ b> B is formed between the partition wall 11 below the cleaning space 2 and the bottom surface of the cleaning device 1. In addition, the downflow cleaning chamber 2A is provided in an air circulation channel (described later) that communicates between the exhaust chamber 2B and a later-described air supply chamber 3 in the downflow unit 7 outside the apparatus main body. A harmful substance removal unit 12 for removing and collecting harmful substances in the air is provided.

  For example, as shown in FIG. 2, the harmful substance removal unit 12 is configured by disposing a harmful substance removal unit, a circulation fan unit 14, and a water circulation unit 12b in a casing 12a having a vertically long closed space. Yes. An exhaust introduction path 15a from the exhaust chamber 2B is connected (communication) to the lower end of the casing 12a, and an exhaust lead-out path 15b to the supply chamber 3 is connected to the upper end. .

  That is, in the configuration of the best embodiment 1, the harmful substance removing unit is configured using a porous film having a property of allowing gas permeation and preventing water permeation. Specifically, frame-shaped porous film elements 13A to 13F formed by laminating (or arranging) flat cylindrical elements (or tube-shaped elements) each formed of a porous film at predetermined intervals are predetermined. The space in each flat cylindrical element is used as a water flow path (not shown), and the opposing space between the flat cylindrical elements and the opposing space between the porous membrane elements 13A to 13F are air flow paths (respectively). And a water circulation part 12b is arranged on the side of each of the porous membrane elements 13A to 13F. The air flow path communicates with the internal space of the housing 12a (that is, the contaminated air flow path), and the water flow path communicates with the water circulation portion 12b.

  Then, when contaminated air containing harmful substances (gas components) introduced from the exhaust introduction passage 15a of the casing 12a is sequentially flowed to the air flow path, water is flowed to the water flow path from the water circulation portion 12b side. While the contaminated air flows through the air flow path, harmful substances contained in the contaminated air permeate the porous membrane from the air flow path side to the water flow path side and into the water flowing through the water flow path. It is dissolved, thereby cleaning the contaminated air. Therefore, the air that passes through the harmful substance removing portion composed of the porous membrane elements 13A to 13F and is led out from the exhaust lead-out path 15b of the housing 12a becomes relatively clean air having a very low harmful substance concentration.

  Note that a pure water supply path 16a and a drainage path 16b are connected to the water circulation section 12b, and clean pure water flowing into the water circulation section 12b from the pure water supply path 16a circulates through the water circulation section 12b. During this time, harmful substances are dissolved and discharged as contaminated water from the drainage channel 16b to the outside.

  As described above, if the harmful substance removing unit of the harmful substance removing unit 12 is configured to utilize the permeation action of the porous membrane, the contaminated air and water supplied to the harmful substance removing unit are both in a closed channel. Therefore, the arrangement form of the harmful substance removal unit 12 is not restricted by the direction of gravity. Therefore, for example, as shown in FIG. 2, the harmful substance removing unit 12 is arranged vertically (that is, an arrangement structure in which the porous membrane elements 13A to 13F are stacked in the vertical direction), or as shown in FIG. The installation form of the harmful substance removal unit 12 may be set in any direction as necessary, such as horizontal arrangement (that is, an arrangement structure in which the porous membrane elements 13A to 13F are laminated in the horizontal direction). it can.

  In addition, it is possible to select an arbitrary installation form having a small occupied floor area such as a ceiling installation type, a side installation type, and a rear installation type according to the cleaning apparatus 1 in a multi-stage configuration, and in some cases, an empty space in the cleaning apparatus 1 It is also possible to disperse and arrange the porous membrane elements 13A to 13F.

Therefore, the optimal usage including the exhaust treatment unit can be realized.

  In addition, as a material of the said porous film in this case, polytetrafluoroethylene (PTFE) is preferable, for example. In addition, hydrophobic porous membranes such as polyethylene and polypropylene can also be used.

  When the semiconductor device 6A, 6B,... Is cleaned in the cleaning device for semiconductor devices as described above, the blowers 8A, 8B having the downflow structure are operated, and the air supply chamber 3 side is operated. Air is blown out as a downflow air flow toward the chemical solution tanks 4A and 4B in the cleaning chamber 2A. In this case, the blown air is mixed into the intake air by passing through the fine particle filters 9A and 9B. Contaminated fine particles are collected and removed by the fine particle filters 9A and 9B, and clean air in which fine particles are not mixed is blown out to the side of the chemical liquid tanks 4A and 4B as a downflow airflow.

  At this time, the harmful substance removing unit 12 is also operated, and the clean air blown out from the circulation fan 14 after most of the harmful substances are removed by the porous membrane elements 13A to 13F as described above is used as the reflux air. It is introduced into the air supply chamber 3 of the downflow unit 7 through the exhaust outlet passage 16b (corresponding to the exhaust to the outside substantially). On the other hand, a predetermined amount of fresh air outside the cleaning chamber 2A passes through the prefilter 7b and is supplied to the air supply chamber 3 side from the air supply port 7a provided in the top plate portion of the downflow unit 7. Some are introduced. The recirculated air and the air supplied from the outside are mixed after being introduced into the air supply chamber 3, supplied as air for downflow to the blowers 8 </ b> A and 8 </ b> B, and blown into the lower cleaning chamber 2 </ b> A. The

  On the other hand, in the cleaning chamber 2A, the semiconductor devices 6A, 6B,... Are immersed in the chemical liquids 5, 5 in the chemical liquid tanks 4A, 4B, and the required cleaning process is performed. , 5 are mixed in the downflow airflow, and polluted air containing the toxic substance at a high concentration is generated. This contaminated air with a high gas concentration (see broken arrow) flows from the cleaning chamber 2A side to the exhaust chamber 2B side through the many through holes of the lower partition plate 11.

  A part of the contaminated air is discharged from the branch discharge path 17 below the exhaust chamber 2B to the external discharge path 18 as it is. Of course, the polluted air discharged to the outside is released as clean air by removing harmful substances by appropriate neutralization processing means (not shown).

  On the other hand, most of the contaminated air introduced into the exhaust chamber 2B is introduced from the exhaust chamber 2B to the harmful substance removal unit 12 side as described above. The contaminated air introduced to the harmful substance removal unit 12 side passes through the porous film elements 13A to 13F of the harmful substance removal unit, so that the harmful substances contained therein are porous film of the harmful substance removal unit. After being dissolved and removed on the water side flowing between the elements 13A to 13F and purified to clean air having a very low concentration of harmful substances, the supply air of the downflow unit 7 is supplied by the circulation fan 14 via the exhaust outlet passage 15b. It returns to the chamber 3 side as reflux air. Then, the reflux air is mixed with the 7b air supplied through the pre-filter from the air supply port 7a, and again blown out as a downflow air current around the chemical tanks 4A and 4B in the cleaning chamber 2A. .

  In this case, the relationship between the air supply amount from the air supply port 7a and the exhaust amount from the branch discharge passage 17 to the external discharge passage 18 is set so that the discharge amount to the outside slightly exceeds the air supply amount. With this setting, the internal pressure in the cleaning chamber 2A is always maintained on the negative pressure side, and contaminated air containing harmful substances is prevented from leaking into the cleaning chamber 2A.

  By the way, the porous membrane elements 13A to 13F constituting the harmful substance removing portion of the harmful substance removing unit 12 are contaminated gas contained in the exhaust gas on the water side flowing in contact with the membrane surface as described above. At the same time, the harmful substances are dissolved and removed, and at the same time, the water molecules are moved to the air side to act to humidify the passing air at the molecular level and are supplied into the cleaning chamber 2A through the air supply chamber 3. Circulating air with a gas concentration is in a high humidity state (high water molecule state) that is a predetermined value or higher.

  That is, as described above, when hydrofluoric acid, hydrochloric acid, sulfuric acid, ammonia, hydrogen peroxide, etc. are used as cleaning chemicals, the internal concentration is prevented from increasing due to evaporating components, and leakage from the gaps in each part of the device to the outside. In order to prevent this, a large amount of internal atmosphere must be circulated using the downflow unit 7.

  However, since this downflow air is, for example, a low-humidity air having a temperature of 23 ° C. and a humidity of about 40% RH, the humidity in the cleaning chamber 2A is inevitably lowered, and the tank as shown in FIG. There is a risk that unintentional drying may occur in the semiconductor devices 6A, 6B,.

  As a result, there is a risk that a watermark may occur during transport between the tanks leading to the same drying (of course, after cleaning in the cleaning chamber without transporting to the drying process, the object to be cleaned is not moved. The same applies to the case of drying with flowing dry air inside).

  However, in this embodiment, as described above, the harmful substance removing means on the harmful substance removing unit 12 side returns to the cleaning chamber 2A (that is, around the chemical tanks 4A and 4B in the cleaning chamber 2A). The porous membrane elements 13A to 13F effectively humidify the atmosphere) at the molecular level. Then, the above circulating air is effectively humidified, and the ambient atmosphere around the semiconductor devices 6A, 6B... Transport path (inter-tank transport path) during the cleaning is, for example, a predetermined value or more as shown in FIG. It is designed to maintain a high humidity state.

  Therefore, since the atmospheric humidity around the chemical tanks 4A and 4B in the cleaning chamber 2A is humidified to a high humidity level necessary to prevent the generation of the watermark, the transporting process between the tanks during the cleaning to the drying is performed. Generation of watermarks can be effectively prevented.

  Moreover, since the porous membrane elements 13A to 13F can humidify the air at the molecular level, they can be humidified without causing water droplets, and there is no possibility of clogging the particulate filters 9A and 9B.

  As described above, in the configuration of the semiconductor device cleaning apparatus according to the first embodiment, the cleaning unit has the cleaning unit, and the object to be cleaned carried in the cleaning chamber is cleaned by the cleaning unit and then dried. In the cleaning apparatus configured as described above, a humidifying unit that humidifies the atmosphere around the cleaning unit in the cleaning chamber to a predetermined humidity is provided, and the periphery of the object to be cleaned in the cleaning chamber is effectively humidified by the humidifying unit. The atmosphere around the object to be cleaned is maintained at a high humidity of a predetermined value or higher.

  According to such a configuration, since the atmosphere density around the cleaning means in the cleaning chamber is humidified to the required high humidity level, it is also possible to effectively prevent the generation of watermarks during the inter-tank transport process during the cleaning process. Will be able to.

  In addition, the configuration of the best embodiment 1 is characterized in that the humidifying means is composed of a porous membrane element.

  In this way, when a porous membrane element is used as a humidifying means, there is no restriction on the direction of ventilation, the installation direction is free, and the ceiling installation type, side installation type, rear installation type, etc. according to the cleaning device in a multi-stage configuration etc. It is possible to select an arbitrary installation form having a small occupied floor area. In some cases, it is also possible to disperse the elements in an empty space in the cleaning apparatus.

  Therefore, the optimal usage including the exhaust treatment unit can be realized.

  Moreover, since the porous membrane element can humidify the air at the molecular level, it can be humidified without generating water droplets, and there is no possibility of clogging the particulate filter used in the blowing path.

  Further, the configuration of the best embodiment 1 is characterized in that the porous membrane element is provided in an air recirculation path connecting an air supply section to the cleaning chamber and an exhaust section from the cleaning chamber.

  As described above, when the porous membrane element is provided in the air reflux path connecting the air supply unit to the cleaning chamber and the exhaust unit from the cleaning chamber, a closed-type recirculation type cleaning device is configured in consideration of environmental load. In some cases, efficient humidification can be performed.

  Furthermore, in the configuration of the best embodiment 1, the porous membrane element is configured as a harmful substance removing means for removing harmful substances in the exhaust air from the cleaning chamber. It is characterized by the removal of harmful substances contained in the exhaust.

  If comprised in this way, the density | concentration of the harmful | toxic gas component in a washing | cleaning room | chamber interior can be kept low by the harmful substance removal effect | action of a porous membrane element, even if the exhaust_gas | exhaustion amount to the outdoors is reduced significantly.

  Therefore, the amount of exhaust to the outside can be effectively reduced without reducing the cleaning ability.

  As a result of the above, according to the same configuration, it is possible to effectively prevent unintentional drying in the middle of cleaning leading to drying, and to provide a highly reliable cleaning device that does not cause the occurrence of a watermark. become.

  Further, the conventional neutralization device for the exhaust treatment is not required, and the exhaust power can be greatly reduced. Therefore, the equipment can be simplified and the cost can be greatly reduced.

  As a result, the apparatus can be downsized and the installation space can be narrowed.

(Best Mode 2)
Next, FIG. 4 shows the overall configuration of the cleaning apparatus according to the second embodiment of the present invention.

  In the configuration of this embodiment, pure water is supplied to the water circulation part 12b between the porous membrane elements 13A to 13F in the configuration of FIG. Circulating circuit configurations 16a to 16b to 16a that do not discharge water, and a water supply side portion (water reflux side portion) is provided with a pure water replenishment path 16c, and a drainage side portion is provided with a partial drainage path 16d, thereby allowing water circulation. It is characterized by that.

  In this case, water regeneration means for recovering and removing harmful gas components dissolved in the circulating water is provided between the partial drainage passage 16d communicating portion and the pure water supply passage 16c communicating portion in the middle of the water circulation circuits 16a to 16b to 16a. 20 is provided.

  According to such a configuration, it becomes possible to collect and remove the cleaning liquid evaporation component in the circulating water simultaneously with the humidification, and it is possible to use the used pure water without waste while regenerating it.

  That is, when the water regeneration means 20 as described above is provided, the amount of expensive pure water used can be reduced and the amount of partial drainage can be greatly reduced.

  Since the removal rate of the water that has absorbed the harmful components increases as the concentration of harmful component ions increases, a portion of the water is always replaced with fresh water so that the concentration does not exceed a certain level. If the water regeneration means 20 is provided to suppress an increase in ion concentration, the amount of pure water exchange itself can be reduced.

(Other embodiments)
In each of the above-described embodiments, the case where a semiconductor device is used as an object to be cleaned has been described. However, the object to be cleaned according to the present invention is not limited to this and can be applied to other various micromachines. .

It is a figure which shows the whole structure of the washing | cleaning apparatus which concerns on best Embodiment 1 of this invention. It is a perspective view of the skeleton state which shows the structure of the harmful substance removal unit arranged vertically of the apparatus. It is a perspective view of the skeleton state which shows the structure of the harmful substance removal unit horizontally arrange | positioned of the same apparatus. It is a figure which shows the whole structure of the washing | cleaning apparatus which concerns on best Embodiment 2 of this invention.

Explanation of symbols

  1 is a cleaning device, 2 is a cleaning space in the cleaning device 1, 2A is a cleaning chamber, 2B is an exhaust chamber, 3 is an air supply chamber, 4A and 4B are chemical liquid tanks, 5 is chemical liquids, 6A, 6B. Device, 7 is a downflow unit, 8A and 8B are blowers, 9A and 9B are particulate filters, 10 and 11 are partition walls, 12 is a harmful substance removal unit, 13A to 13F are porous membrane elements, 14 is a circulation fan, and 15a is An exhaust introduction path, 15b is an exhaust outlet path, 16a is a pure water circulation supply path, 16b is a pure water circulation discharge path, 16c is a pure water supply path, and 16 is a partial drainage path.

Claims (5)

  The cleaning chamber (2A) has cleaning means (4A) and (4B), and the objects to be cleaned (6A) and (6B) carried into the cleaning chamber (2A) are cleaned (4A) and (4B). In the cleaning apparatus configured to be dried after cleaning in step (1), humidifying means (13A) to (13F) for humidifying the atmosphere around the cleaning means (4A) and (4B) in the cleaning chamber (2A) are provided, The surroundings of the objects to be cleaned (6A) and (6B) are humidified by the humidifying means (13A) to (13F) around the objects to be cleaned (4A) and (4B) in the cleaning chamber (2A). Is maintained at a high humidity equal to or higher than a predetermined value.   2. The cleaning apparatus according to claim 1, wherein the humidifying means (13A) to (13F) are constituted by a porous membrane element.   The porous membrane element is provided in an air recirculation path (15a), (15b) connecting an air supply section to the cleaning chamber (2A) and an exhaust section from the cleaning chamber (2A). Item 3. A cleaning device according to Item 2.   The porous membrane element is configured as a harmful substance removing means for removing harmful substances in the air discharged from the cleaning chamber (2A), and simultaneously removes harmful substances contained in the exhaust gas such as cleaning liquid evaporation components. The cleaning apparatus according to claim 2 or 3, wherein the cleaning apparatus is configured as described above. The water supply circuit for supplying water to the porous membrane element is provided as a circulation circuit configuration, and a water regeneration means (20) having a gas recovery action is provided to recover and remove the cleaning liquid evaporation component simultaneously with humidification. Item 5. A cleaning device according to item 2, 3 or 4.

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