JP2006203113A - Stage device, stage control method, exposure device and method, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stage device, a stage control method and the like in which a settlement time can be shortened by suppressing rotary vibration of a stage that occurs after the end of acceleration. <P>SOLUTION: A plate stage PST for holding a plate P includes a substrate table 14 for holding the plate P, and a mobile table 15 for holding the substrate table 14. A first plate interferometer 17 measures the position of the substrate table 14 in a direction X and its rotation amount around a Z-axis, and a second plate interferometer 18 measures a position of the mobile table 15 in the direction X and its rotation amount around the Z-axis. Based on measured results of the first plate interferometer 17 and the second plate interferometer 18, a main controller MC controls a linear motor 13 or a Z/θ driving mechanism 16 so as to suppress rotary vibration of the substrate table 14. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a stage apparatus and a stage control method configured to be movable while an object such as a mask (reticle) and a substrate (plate) is placed thereon, an exposure apparatus and an exposure method using the apparatus and method, and the exposure The present invention relates to a device manufacturing method for manufacturing a device using an apparatus and a method.

  In a photolithography process provided as one of manufacturing processes of semiconductor elements, flat panel display elements such as liquid crystal display elements, imaging elements such as CCD (Charge Coupled Device), thin film magnetic heads, and other various devices, a mask or a reticle ( In the following, an exposure apparatus is used that transfers a pattern formed on a mask (when collectively referred to as a mask) to a substrate such as a glass plate or a wafer coated with a photoresist via a projection optical system. Conventionally, various exposure apparatuses have been devised, but in recent years, step-and-repeat reduction projection exposure apparatuses (steppers) or step-and-scan exposure apparatuses are often used. Yes.

  The stepper collectively reduces and projects the pattern formed on the mask onto each shot area set on the substrate, and when the transfer of the pattern to one shot area is completed, the substrate is stepped to another shot area. An exposure apparatus that performs pattern transfer. In addition, the step-and-scan type exposure apparatus has a pattern formed on the mask while moving the mask and the substrate synchronously with respect to the projection optical system in a state where the mask is irradiated with slit-shaped exposure light. Is partially transferred to a shot area of a substrate, and when the pattern transfer to one shot area is completed, the substrate is moved stepwise to transfer the pattern to another shot area.

  In the above step-and-scan exposure apparatus, when exposure processing is performed on each of a plurality of partitioned areas (shot areas) set on the substrate surface, the positional relationship between the substrate and the mask is synchronized. However, it is necessary to move at a substantially constant speed at a speed commensurate with the amount of energy to be exposed. For this reason, the substrate stage on which the substrate is mounted and the mask stage on which the mask is placed are run up (accelerated), the stage is synchronized during this run, and then the shot area on the substrate to be exposed When the exposure area reaches the exposure area, a procedure is performed in which exposure is performed by irradiating the exposure area with exposure light.

For this reason, in a step-and-scan type exposure apparatus, the time required for each stage to settle (vibration (position error with respect to the target position)) after each stage is accelerated and the speed to be constant (settling). Reducing the time) is extremely important in improving the throughput (the number of substrates that can be exposed per unit time). For example, Patent Document 1 below discloses a technique for improving the follow-up performance between stages and improving the throughput and pattern transfer accuracy.
JP 2000-0773313 A

  Incidentally, the synchronous movement error between the mask stage and the substrate stage is roughly divided into a position error in the synchronous movement direction (scanning direction) and a rotation error in the direction intersecting the mask and the substrate. The control system to be controlled is designed so that each error falls within a preset settling time (below a predetermined value). In other words, after the settling time has elapsed after the acceleration of both stages, the position error and rotation error between the mask stage and the substrate stage are adjusted to exposure accuracy (resolution, transfer fidelity, overlay accuracy, line width error, etc.). It should be small enough not to affect it.

  However, in recent years, the exposure area has been increased in area, and the acceleration of the stage is set higher than before in order to improve the throughput. When the acceleration of the stage is increased, a vibration of about 10 Hz is generated and the rotation error of the stage becomes so large that it cannot be ignored, and the rotation vibration of the stage continues even after the settling time elapses. As a result, there is a problem that the settling time must be longer than a preset time, resulting in a deterioration in throughput.

  The present invention has been made in view of the above circumstances, and a stage apparatus and a stage control method that can shorten the settling time by suppressing the rotational vibration of the stage that occurs after completion of acceleration. It is an object of the present invention to provide an exposure apparatus and method capable of performing exposure processing at a throughput, and a device manufacturing method for manufacturing a device using the exposure apparatus or method.

The present invention employs the following configuration associated with each figure shown in the embodiment. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.
In order to solve the above problems, a stage apparatus according to the present invention is a stage apparatus including a first stage (PST) that holds an object (P) and is movable in a predetermined direction (X direction). A first detection device (17) having a first part (14) for holding the object and a second part (15) for supporting the first part, and detecting a rotation amount of the first part; A second detector (18, 18a, 18b) for detecting a relative rotation amount between the first part and the second part, and the first stage when driving the first stage in the predetermined direction. And a control device (MC) for controlling the rotational vibration of the first portion based on the detection result of the second detection device.
According to this invention, the first detection device detects the rotation amount of the first part of the first stage, and the second detection device detects the relative rotation amount of the first part and the second part of the first stage. Based on these detection results, the rotation vibration of the first portion is controlled by the control device.
The stage device of the present invention includes a first position detection device (17, 18) for detecting a position of the first stage in the predetermined direction, a second stage (MST) different from the first stage, A second position detector (12) for detecting the position of the second stage in a predetermined direction, and the controller is configured to rotate the first portion based on the detection results of the first and second detectors. And controlling the second stage so that the first stage and the second stage are in a predetermined positional relationship based on the detection results of the first position detecting device and the second position detecting device. It is characterized by that.
According to the present invention, the position of the first stage is detected by the first position detection device, and the position of the second stage different from the first stage is detected by the second position detection device, and the first and second detections are performed. While the rotational vibration of the first part is controlled by the control device based on the detection result of the device, the control device controls the first stage and the second stage based on the detection result of the first and second position detection devices. It is controlled to become.
In order to solve the above problems, a stage control method of the present invention includes a first portion (14) that holds an object (P) and a second portion (15) that supports the first portion, and the object Is a stage control method for controlling a stage (PST) that can move in a predetermined direction (X direction) while holding the stage, and a driving step for driving the stage in the predetermined direction and detecting a rotation amount of the first portion Based on detection results of the first detection step, the second detection step of detecting the relative rotation amount of the first part and the second part, and the detection results of the first and second detection steps. And a control step for controlling the rotational vibration of the portion.
The exposure apparatus of the present invention is capable of moving in a predetermined direction (X direction) while holding a substrate having an outer shape larger than 500 mm in the exposure device (EX) that exposes a predetermined pattern on the substrate (P). A first stage (PST) is provided, the first stage having a first part (14) for holding the substrate and a second part (15) for supporting the first part, wherein the first part A first detection device (17) for detecting the amount of rotation of the first part, a second detection device (18, 18a, 18b) for detecting the relative amount of rotation of the first part and the second part, and the first When the stage is driven in the predetermined direction, a control device (MC) that controls rotational vibration of the first portion based on detection results of the first and second detection devices is provided.
The exposure method of the present invention is an exposure method for exposing a pattern of a mask (M) held on a mask stage (MST) onto a substrate (P) held on a substrate stage (PST). The method includes the step of controlling the substrate stage as the stage using the stage control method described above.
The device manufacturing method of the present invention is a device manufacturing method including a lithography step, and includes an exposure step of performing exposure using the above-described exposure apparatus in the lithography step.
Here, in the present situation, the size of the substrate is increasing, and accordingly, the substrate stage is increased in size and the weight of the substrate stage is further increased. The exposure apparatus of the present invention is particularly effective for a substrate whose outer shape is larger than 500 mm. Here, that the outer shape is larger than 500 mm means that the length of one side or diagonal is larger than 500 mm. The exposure apparatus of the present invention is also effective when exposing a high-definition pattern, and is a joint when the number of projection optical systems is increased as an exposure apparatus for manufacturing a wider display element device. When the field of view of each projection optical system is increased and the projection area of each projection optical system is widened, fluctuations such as image distortion and magnification fluctuations due to the distance from the center of the projection optical system at the periphery. The present invention is effective when it becomes large and improvement in splicing accuracy is required.

According to the present invention, the rotational vibration of the first part is controlled based on the detection result of the rotation amount of the first part of the first stage and the relative rotation amount of the first part and the second part. Rotational vibration of the stage (first portion) can be satisfactorily suppressed, and as a result, there is an effect that the settling time required until the stage vibration is settled can be shortened.
In addition, according to the present invention, the rotational vibration of the first portion of the first stage is controlled and the first stage and the second stage are controlled to have a predetermined positional relationship. There is an effect that the synchronous movement error with the two stages can be reduced.
Furthermore, according to the present invention, the stage settling time can be shortened, so that there is an effect that the device can be efficiently manufactured with high throughput. Furthermore, since the synchronous movement error between the first stage and the second stage can be reduced, there is an effect that the exposure accuracy can be increased.

  Hereinafter, a stage apparatus, a stage control method, an exposure apparatus and method, and a device manufacturing method according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a front view showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. An exposure apparatus EX shown in FIG. 1 is an exposure apparatus for manufacturing a liquid crystal display element. The pattern formed on the mask M is sequentially transferred to the plate P while the plate P as an object or substrate and the mask M are moved synchronously. This is a reduction projection type exposure apparatus of a step-and-scan method for transferring the image on the top. Further, it is assumed that the exposure apparatus EX shown in FIG. 1 performs exposure on a plate P having an outer shape larger than 500 mm.

  In the following description, if necessary, an XYZ orthogonal coordinate system is set in the drawing, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The XYZ orthogonal coordinate system shown in FIG. 1 is set so that the Y axis and the Z axis are parallel to the paper surface, and the X axis is set to a direction perpendicular to the paper surface. In the XYZ coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z-axis is set vertically upward. Further, it is assumed that the synchronous movement direction (scanning direction) of the plate P and the mask M at the time of exposure is set in the X direction.

  The exposure apparatus EX shown in FIG. 1 includes an illumination optical system ILS, a mask stage MST, a projection optical system PL, a plate stage PST, a main body column CL, and a main controller MC. The illumination optical system ILS performs shaping of exposure light emitted from a light source unit (not shown) (for example, a laser light source such as an ultra-high pressure halogen lamp or an excimer laser) and uniformization of illuminance distribution, and shaping exposure light. The EL is irradiated onto the slit-shaped (or arc-shaped) illumination area on the mask M. More specifically, the illumination optical system ILS includes, for example, a secondary light source forming optical system such as a light source unit, a shutter, and a fly-eye lens (optical integrator), a beam as disclosed in Japanese Patent Laid-Open No. 9-320956, for example. It includes a splitter, a condenser lens system, a field stop (blind), an imaging lens system, etc. (all not shown), and the illumination area on the mask M held on the mask stage MST has a uniform illuminance. Illuminate.

Here, as the light source unit, a KrF excimer laser (wavelength 248 nm), an ArF excimer laser (wavelength 193 nm), an F ₂ laser light source (wavelength 157 nm), a Kr ₂ laser light source (wavelength 146 nm), an Ar ₂ laser light source ( An ultraviolet laser light source having a wavelength of 126 nm), a copper vapor laser light source, a harmonic generation light source of a YAG laser, a harmonic generation device of a solid-state laser (semiconductor laser, etc.), or a mercury lamp (i-line, etc.) can also be used. .

  The mask stage MST holds the mask M on which the pattern of the liquid crystal display element to be transferred to the plate P is formed by vacuum suction or electrostatic suction, and is movable in the X direction while holding the mask M, and in the Y direction. In addition, it is configured to be capable of minute driving in the rotation direction (θZ direction) around the Z axis. The mask stage MST is levitated and supported above the upper surface of the upper surface plate CL1 constituting the main body column CL by an air pad (not shown) via a clearance of about several microns, and is driven by the drive mechanism 11. In the present embodiment, a linear motor is used as the drive mechanism 11 that drives the mask stage MST. Therefore, this drive mechanism is referred to as the linear motor 11 in the following description.

  The linear motor 11 includes a stator 11a and a mover 11b. The stator 11a of the linear motor 11 is fixed to the upper part of the upper surface plate CL1, and extends along the Y-axis direction. The mover 11b of the linear motor 11 is fixed to the mask stage MST. The position of the mask stage MST in the X direction, the Y direction, and the rotation direction (θZ direction) around the Z axis is measured by a mask stage position measuring laser interferometer (hereinafter referred to as a mask interferometer) 12 fixed to the main body column CL. Measurement is always performed with a predetermined resolution, for example, a resolution of several nanometers, with reference to the projection optical system PL. Position information indicating the position of the mask stage MST in the X direction, the Y direction, and the rotation direction around the Z axis (θZ direction) measured by the mask interferometer 12 is supplied to the main controller MC.

  The projection optical system PL is configured to include a plurality of refractive optical elements (lens elements), and projects the exposure light EL transmitted through the illumination region set on the mask M onto the plate P. The projection optical system PL is disposed below (−Z direction) the upper surface plate CL1 of the main body column CL, and is held by a holding member CL3 constituting the main body column CL. Here, as the projection optical system PL, an apparatus that projects an equal-size erect image is used. Therefore, when the illumination area set on the mask M is illuminated by the exposure light EL from the illumination optical system ILS, an equal magnification image (partial upright image) of the pattern in the illumination area is displayed on the illumination area on the plate P. It is projected onto a conjugate exposure area.

  The projection optical system PL may include a plurality of sets of equal-magnification projection optical system units disclosed in, for example, JP-A-7-57986. Further, the projection optical system PL may be telecentric on both the object plane (mask M) side and the image plane (plate P) side, or one may be telecentric. Further, instead of projecting the same size image, a reduction system that reduces and projects the pattern image of the mask M may be used. Further, an inverted image of the pattern formed on the mask M may be projected onto the plate P. Further, as the projection optical system PL, a reflection system composed only of a reflection optical element, or a catadioptric system (catadioptric system) having a reflection optical element and a refractive optical element may be employed. For example, quartz or fluorite is used as the glass material of the plurality of lens elements provided in the projection optical system PL according to the wavelength of the exposure light EL.

  The plate stage PST holds the plate P by vacuum chucking or electrostatic chucking, and can move in the X direction and the Y direction while holding the plate P, and around the Z direction, the X axis, the Y axis, and the Y axis. It is configured to be capable of minute driving in the rotation direction. The plate stage PST is disposed below the projection optical system PL (in the −Z direction), and a clearance of about several microns is provided above the upper surface of the lower surface plate CL2 constituting the main body column CL by an air pad (not shown). Is supported by levitation. The plate stage PST is driven in the X direction and the Y direction by a linear motor 13 as a drive mechanism. The stator 13a of the linear motor 13 is fixed to the lower surface plate CL2 and extends along the Y-axis direction. The mover 13b of the linear motor 13 is fixed to the bottom of the plate stage PST. In FIG. 1, the plate stage PST is schematically illustrated in a simplified manner, but the details of the configuration will be described later.

  The plate stage PST includes a substrate table 14 as a first part for holding the plate P, a moving table 15 as a second part to which the mover 13 b of the linear motor 13 is fixed, and a Z mounted on the moving table 15. A configuration including the θ drive mechanism 16. A substrate table 14 is placed on the Z · θ drive mechanism 16, and the plate P is held on the substrate table 14. The substrate table 14 is driven by the Z / θ drive mechanism 16 in the Z direction and the rotation directions (θX, θY, θZ directions) around the X axis, the Y axis, and the Y axis.

  The position of the substrate table 14 in the X direction and the amount of rotation in the rotation direction around the Z axis (θZ direction) are projected by a laser interferometer (hereinafter referred to as a first plate interferometer) 17 fixed to the main body column CL. Is always measured with a predetermined resolution, for example, a resolution of about several nanometers. Similarly, the position of the moving table 15 in the X direction and the rotation amount around the Z axis (θZ direction) are projected by a laser interferometer (hereinafter referred to as a second plate interferometer) 18 fixed to the main body column CL. The optical system PL is always measured with a predetermined resolution, for example, a resolution of about several nanometers.

  Information indicating the position of the mask stage MST in the X direction and the amount of rotation about the Z axis measured by the first plate interferometer 17 and the second plate interferometer 18 is supplied to the main controller MC. Although not shown in FIG. 1, a laser interferometer 19 (see FIG. 2) for measuring the position of the substrate table 14 in the Y direction is also provided. In this specification, for convenience, it is described that the first plate interferometer 17 and the second plate interferometer 18 measure the rotation amount of the substrate table 14 around the Z axis and the rotation amount of the movable table 15 around the Z axis. In practice, however, as will be described later, the main controller MC determines the amount of rotation of the substrate table 14 around the Z axis and the moving table based on information output from the first plate interferometer 17 and the second plate interferometer 18. The amount of rotation about 15 Z-axis is obtained.

  FIG. 2 is a diagram showing the configuration of the plate stage PST and its control system. FIG. 2 shows a state in which the plate stage PST is viewed from above, and the members shown in FIG. 1 are denoted by the same reference numerals. As shown in FIG. 2, the plate stage PST is configured to be movable on the lower surface plate CL2 while holding the plate P, and the main controller MC controls the drive of the plate stage PST. The main controller MC includes a host controller 21, a controller 22, current amplification units 23a to 23c, and position detection units 24a and 24b. Note that FIG. 2 shows only the configuration of the control system that controls the plate stage PST among the various configurations included in the main controller MC.

  The host controller 21 outputs a control signal for instructing the position of the plate P in the XY plane to the controller 22. The control controller 22 generates drive signals for driving the linear motors 27, 28, and 30 based on the control signals output from the host controller 21 and the detection signals output from the position detectors 24a and 24b. The operation of the plate stage PST on which the plate P is placed is controlled. Note that the linear motors 27, 28, and 30 in FIG. 2 correspond to the linear motor 13 shown in FIG.

  The current amplifying units 23 a to 23 c amplify the current of the drive signal output from the controller 22 with a predetermined amplification factor and supply the amplified current to the linear motors 27, 28, and 30, respectively. The position detection unit 24a performs predetermined processing (for example, processing such as coordinate conversion) on the measurement result output from the plate interferometer 19, and obtains the position of the plate stage PST (substrate table 14) in the Y direction. . Further, the position detection unit 24b performs predetermined processing on the measurement results output from the first plate interferometer 17 and the second plate interferometer 18 (18a, 18b), and the position of the plate stage PST in the X direction and Obtain the amount of rotation around the Z axis. Specifically, the position detector 24b obtains the position of the substrate table 14 in the X direction and the amount of rotation about the Z axis from the measurement result of the first plate interferometer 17, and the second plate interferometer 18 (18a, 18b). ) To obtain the position of the moving table 15 in the X direction and the amount of rotation about the Z axis. Further, the difference between the rotation amount of the substrate table 14 around the Z axis and the rotation amount of the moving table 15 around the Z axis is obtained. As shown in FIG. 2, the second plate interferometer 18 includes two second plate interferometers 18a and 18b.

  Next, the configuration of the plate stage PST will be described in detail with reference to FIGS. FIG. 3 is a perspective view showing a configuration example of the plate stage PST. As described above, the plate stage PST is disposed between the substrate table 14, the moving table 15 that moves the substrate table 14 in the XY plane (on the lower surface plate CL2), and the substrate table 14 and the moving table 15. And a Z · θ drive mechanism 16. A plurality of air bearings (air pads) (not shown) which are non-contact bearings are fixed to the bottom surface of the plate stage PST, and the plate stage PST is placed on the lower surface plate CL2 by these air bearings, for example, about several microns. It is supported by levitating via clearance.

  As shown in FIGS. 2 and 3, the moving table 15 includes a guide bar 26 that integrally supports the substrate table 14 and the Z / θ drive mechanism 16 so as to be relatively movable in the Y direction. The guide bar 26 has a long shape along the Y direction, and a movable element 27a and a movable element 28a each including an armature unit are provided at both ends in the length direction. Stators 27b and 28b having magnet units respectively corresponding to the movers 27a and 28a are provided on the lower surface plate CL2. In FIG. 3, only a part of the lower surface plate CL2 is illustrated.

  The mover 27a and the stator 27b constitute a linear motor 27, and the mover 28a and the stator 28b constitute a linear motor 28. The movable bar 27a is driven by electromagnetic interaction with the stator 27b, and the movable bar 28a is driven by electromagnetic interaction with the stator 28b, whereby the guide bar 26 moves in the X direction. By adjusting the drive amounts of the linear motor 27 and the linear motor 28, the plate stage PST rotates around the Z axis perpendicular to the X axis and the Y axis. That is, the plate stage PST (substrate table 14) is driven around the X direction and the Z axis almost integrally with the guide bar 26 by the linear motors 27 and 28. Here, as an example, the substrate table 14 is configured to be rotatable around the Z axis by adjusting the drive amounts of the linear motors 27 and 28 that drive the substrate table 14 and the like in the X direction. However, the present invention can also be applied to a configuration in which the substrate table 14 can be rotated around the Z axis by the linear motor 30 that drives the substrate table 14 and the like in the Y direction.

  A mover of a voice coil motor 29 (see FIG. 3) which is a kind of linear motor is attached to the Y direction side of the guide bar 26. The voice coil motor 29 adjusts the position of the guide bar 26 in the Y direction by generating thrust in the Y direction, and its stator is provided on a reaction frame (not shown). For this reason, the reaction force when driving the plate stage PST in the X direction has a function of being transmitted to the lower surface plate CL2 via the reaction frame.

  The substrate table 14 is supported and held in a non-contact manner so as to be relatively movable in the Y direction relative to the guide bar 26 via a magnetic guide composed of a magnet and an actuator that maintain a predetermined amount of gap in the Z direction with the guide bar 26. Has been. Further, the plate stage PST is driven in the Y direction by electromagnetic interaction by the linear motor 30 having a stator embedded in the guide bar 26. The mover of the linear motor 30 is not shown, but is attached to the lower part of the Z · θ drive mechanism 16. A plate P is held on the upper surface of the substrate table 14 via a plate holder (not shown). The above guide bar 26 corresponds to the moving table 15, and the linear motors 27, 28, and 29 correspond to the linear motor 13 provided on the moving table 15.

  Since the linear motor 30 is arranged closer to the plate P placed on the plate stage PST than the linear motors 27 and 28, the linear motor 30 has a coil as a heat source as a stator and a plate. It is desirable to use a moving magnet type linear motor moving away from P. On the other hand, since the linear motors 27 and 28 drive the linear motor 30, the guide bar 26, the Z / θ drive mechanism 16, and the substrate table 14 together, they require a much larger thrust than the linear motor 30. Therefore, a lot of electric power is required and the heat generation amount is larger than that of the linear motor 30. Therefore, it is desirable that the linear motors 27 and 28 are moving coil type linear motors.

As shown in FIG. 2, the first plate interferometer 17 is a biaxial interferometer that irradiates the substrate table 14 with two length measuring beams separated by a predetermined distance L1 in the Y direction orthogonal to the X direction. Yes, the measured value of each length measuring axis is supplied to the main controller MC (position detecting unit 24b). Assuming that the measurement values of the length measuring axes of the first plate interferometer 17 are X11 and X12, respectively, the position X1 of the substrate table 14 in the X direction can be obtained from the following equation (1). The rotation amount θ1 is obtained from the following equation (2).
X1 = (X11 + X12) / 2 (1)
θ1 = (X11−X12) / L1 (2)

As shown in FIG. 2, the second plate interferometers 18a and 18b constituting the second plate interferometer 18 are arranged at different positions in the Y direction, and are two length measuring units separated by a predetermined distance L2 in the Y direction. The beams are irradiated to the guide bars 26, respectively. The measurement values of the second plate interferometers 18a and 18b are supplied to the main controller MC (position detection unit 24b). Assuming that the measured values of the second plate interferometers 18a and 18b are X21 and X22, respectively, the position X2 of the guide bar 26 in the X direction is obtained from the following equation (3), and the rotation amount θ2 around the Z axis of the guide bar 26 Is obtained from the following equation (4).
X2 = (X21 + X22) / 2 (3)
θ2 = (X21−X22) / L2 (4)

  Returning to FIG. 1, in the exposure apparatus EX of the present embodiment, a focus position detection system (not shown) that measures the position of the plate P in the Z direction, for example, a grazing incidence type focus position detection system holds the projection optical system PL. It is fixed to the holding member CL3. The Z position information of the plate P from this focal position detection system is supplied to the main controller MC, and the main controller MC, for example, through the Z / θ drive mechanism 16 based on this Z position information during scanning exposure. Thus, an autofocus operation for matching the position and posture of the plate P in the Z direction with the image plane of the projection optical system PL is executed.

  Further, the main controller MC of the present embodiment is based on the rotation amount θ1 around the Z axis of the first plate interferometer 17 and the rotation amount θ2 around the Z axis of the second plate detection system 18. A rotation amount of the substrate table 14 generated at the time of scanning exposure is controlled by obtaining a rotation amount and controlling the thrust applied to the linear motors 27 and 28 and the drive amount of the Z · θ drive mechanism 16. The rotational vibration of the substrate table 14 via the Z / θ drive mechanism 16 is also controlled based on the rotational error of both obtained from the alignment result of the mask M and the plate P.

  As described with reference to FIGS. 1 to 3, the moving table 15, the Z • θ driving mechanism 16 mounted on the moving table 15, and the substrate table 14 mounted on the Z • θ driving mechanism 16 are provided. It is the composition which includes. For this reason, in order to control the rotational vibration of the substrate table 14, it is necessary to model the control target plate stage PST having the above-described configuration and to design the control system. As described above, to control the rotational vibration of the substrate table 14, there are a method for controlling the thrust applied to the linear motors 27 and 28 and a method for controlling the drive amount of the Z · θ drive mechanism 16. A control system design method (control parameter determination method) when performing the above control will be described.

FIG. 4 is a diagram showing a physical model of the plate stage PST related to position control in the scanning direction. In the physical model of the plate stage PST shown in FIG. 4, the variables shown in the figure are as follows.
X1: Position of the substrate table X2: Position of the moving table 15 M1: Mass of the substrate table 14 M2: Mass of the moving table 15 C1: Viscosity of the substrate table 14 C2: Viscosity of the substrate table 15 C3: Z · θ drive mechanism 16 V: the rigidity of the Z · θ drive mechanism 16 F2: thrust of the linear motors 27 and 28 The variable X1 indicating the position of the substrate table 14 is obtained from the above-described equation (1), and the position of the moving table 15 Is obtained from the above-described equation (2).

  When an equation of motion is established for the physical model shown in FIG. 4 and then the equation of motion is Laplace transformed and arranged, the equation of motion using the transfer function of the plate stage PST can be converted. By using this transfer function, a simulation model equivalent to the physical model shown in FIG. 4 can be obtained. FIG. 5 is a diagram showing a simulation model of the plate stage PST. The simulation model shown in FIG. 5 shows the position X2 of the moving table 15 and the position X1 of the substrate table 14 when the thrust F2 is applied to the moving table 15. That is, in this simulation model, the input is the thrust F2 applied to the moving table 15, and the output is the position of the substrate table 14 and the moving table 15.

  Referring to FIG. 5, the thrust F 2 applied to the moving table 15 and the positions of the substrate table 14 and the moving table 15 are the mass and viscosity of the substrate table 14 and the moving table 15 shown in FIG. 1, and the viscosity of the Z · θ drive mechanism 16. And are related by stiffness. In FIG. 5, the variable X1 ′ is the speed of the substrate table 14, and the variable X2 ′ is the speed of the moving table 15. Design of a control system (control parameter determination) for controlling the rotational vibration of the substrate table 14 by controlling the thrust applied to the linear motors 27 and 28 is performed using a simulation model shown in FIG.

  FIG. 6 is a block diagram showing the configuration of a control system that controls the rotational vibration of the substrate table 14 that occurs during scanning exposure. In the block diagram shown in FIG. 6, the relative rotational speed between the substrate table 14 and the moving table 15 is controlled by controlling the thrust applied to the linear motors 27 and 28, and the rotational vibration of the substrate table 14 is suppressed. It is a block diagram which shows the structure of a control system. As shown in FIG. 6, the main controller MC includes a servo calculation unit 40, a thrust distribution unit 41, an interferometer calculation unit 42, an amplifier 43, a calculation unit 44, a servo calculation unit 45, and an amplifier unit 46. . These control parameters are determined using a simulation model shown in FIG.

  The configuration including the servo calculation unit 40 and the thrust distribution unit 41 corresponds to the control controller 22 and the current amplification units 23a to 23c in FIG. Moreover, the structure which consists of the said interferometer calculating part 42 and amplifier 43 is a structure corresponded to the position detection part 24b in FIG. The servo calculation unit 40, the thrust distribution unit 41, the interferometer calculation unit 42, and the amplifier 43 constitute a control system for controlling the plate stage PST. The calculation unit 44, the servo calculation unit 45, and the amplifier Unit 46 constitutes a control system for controlling mask stage MST.

  The servo calculation unit 40 includes a rotation position command output unit 51, a rotation speed command output unit 52, a calculation unit 53, a position controller 54, a calculation unit 55, a first speed controller 56, a second speed controller 57, a calculation unit 58, and a phase advance. The compensation unit 59, the calculation unit 60, and the speed calculation units 61 and 62 are included. The rotation position command output unit 51 outputs a command signal indicating the target rotation position of the plate stage PST (movement table 15), and the rotation speed command output unit 52 indicates a command signal indicating the target rotation speed of the plate stage PST (movement table 15). Is output.

  The calculation unit 53 outputs a deviation signal corresponding to the difference between the command signal output from the rotational position command output unit 51 and the signal indicating the rotation amount θ2 of the moving table 15 output from the interferometer calculation unit 42. Here, since the deviation signal is the amount of deviation of the actual rotational position of the moving table 15 from the target rotational position, it can be said that the deviation signal is a rotation follow-up error of the moving table 15. In FIG. 6, a configuration in which a signal indicating the rotation amount θ <b> 2 of the moving table 15 is input to the calculation unit 53 is illustrated as an example. It may be configured to input a signal indicating the rotation amount θ1. In the case of such a configuration, it can be said that the deviation signal output from the calculation unit 53 is a rotation tracking error of the substrate table 14.

  The position controller 54 generates a control signal for controlling the rotational position of the moving table 15 based on the deviation signal output from the calculation unit 53. Here, the position controller 54 is described as controlling the rotational position of the moving table 15 by P (proportional) control, but any one of P (proportional) control, I (integral) control, and D (differential) control. One or a combination of two or more may be performed. The calculation unit 55 adds the control signal output from the position controller 54 and the command signal output from the rotation speed command output unit 52, and calculates a signal obtained by subtracting the calculation signal of the speed calculation unit 61 therefrom. .

  The first speed controller 56 and the second speed controller 57 generate a control signal for controlling the rotation speed of the moving table 15 based on the signal output from the calculation unit 55. Here, the first speed controller 56 generates a control signal for controlling the rotational speed of the moving table 15 by P (proportional) control, and the second speed controller 57 controls the rotational speed of the moving table 15 by I (integral) control. A control signal is generated. The computing unit 58 adds the control signal generated by the first speed controller 56 and the control signal generated by the second speed controller 57. The phase lead compensation unit 59 compensates for the phase lead of the signal output from the calculation unit 58. The calculation unit 60 obtains the difference between the signal output from the phase advance compensation unit 59 and the signal output from the speed calculation unit 62. A signal obtained by the calculation unit 60 is a thrust signal applied to the linear motor 13 (27, 28).

  The speed calculation unit 61 calculates the rotation speed of the movement table 15 from the rotation amount θ2 of the movement table 15 output from the interferometer calculation unit 42. The rotation speed of the movement table 15 calculated here is output to the calculation unit 55 described above. With this configuration, a control loop for controlling the rotation speed of the moving table 15 is formed. Further, the speed calculator 61 calculates the relative rotation between the substrate table 14 and the moving table 15 based on the difference Δθ between the rotation amount θ1 of the substrate table 14 and the rotation amount θ2 of the moving table 15 output from the interferometer calculating unit 42. Calculate the speed. The calculation result is output to the calculation unit 60 described above. With this configuration, a control loop for controlling the relative rotational speed between the substrate table 14 and the moving table 15 is formed.

  The thrust distribution unit 41 distributes the thrust signal input from the servo calculation unit 40 to the linear motors 27 and 28 according to the position of the substrate table 14 in the Y direction. That is, the substrate table 14 is movable in the Y direction on the moving table 15, and the position of the center of gravity of the plate stage PST changes according to the position of the substrate table 14 in the Y direction, and the plate stage PST is moved in the X direction. Moment occurs. In order to prevent the generation of this moment, the thrust generated by the linear motors 27 and 28 is controlled according to the position of the substrate table 14 in the Y direction. Although not shown, the measurement result of the plate interferometer 19 is input to the thrust distributor 41, and the thrust distributor 41 converts the thrust FX indicated by the thrust signal based on this measurement result into the thrust FX11. , FX12.

  The interferometer calculating unit 42 includes subtracting units 70 and 72, dividing units 71 and 73, and a subtracting unit 74. The interferometer calculating unit 42 calculates the rotation amount θ1 around the Z axis of the substrate table 14, the rotation amount θ2 around the Z axis of the moving table 15 from the measurement results of the first plate interferometer 17 and the second plate interferometer 18, and A difference Δθ between the rotation amount θ1 of the substrate table 14 and the rotation amount θ2 of the moving table 15 is obtained. Specifically, the subtracting unit 70 subtracts the measurement value X12 of the other measurement axis from the measurement value X11 of one measurement axis of the two measurement beams emitted from the first plate interferometer 17. Then, the division unit 71 divides the subtraction result by the distance L1 of the length measurement beam, thereby realizing the above-described equation (2) and calculating the rotation amount θ1 around the Z axis of the substrate table 14.

  Further, the subtracting unit 72 subtracts the measured value X22 of the second plate interferometer 18 (18b) from the measured value X21 of the second plate interferometer 18 (18a), and the dividing unit 73 obtains the subtraction result as the second plate interferometer. By dividing by the distance L2 of the length measurement beam emitted from 18a and 18b, the above-described equation (4) is realized, and the rotation amount θ2 around the Z axis of the moving table 15 is calculated. Further, the subtraction unit 74 subtracts the rotation amount θ2 around the Z axis of the moving table 15 from the rotation amount θ1 around the Z axis of the substrate table 14, so that the difference Δ between the rotation amounts of the substrate table 14 and the moving table 15 is obtained. Calculated. The amplifier 43 expands (amplifies) the difference Δ between the rotation amounts of the substrate table 14 and the moving table 15 calculated by the interferometer calculating unit 42 at a predetermined magnification.

  The computing unit 44 constituting the control system for controlling the mask stage MST is configured to calculate the difference between the rotation amount around the Z axis of the mask stage MST measured by the mask interferometer 12 and the rotation amount θ1 around the Z axis of the substrate table 14. A corresponding deviation signal is output. The deviation signal calculated here can be said to be a follow-up error related to the rotation of the mask stage MST about the Z axis with respect to the substrate table 14. In addition, the servo calculation unit 45 generates a control signal for controlling the rotational position of the mask stage MST based on the deviation signal output from the calculation unit 44. The amplifier unit 46 amplifies the control signal generated by the servo calculation unit 45 with a predetermined amplification factor and outputs the amplified signal to the linear motor 11 that drives the mask stage MST.

  6 controls the relative rotational speed of the substrate table 14 and the moving table 15 by controlling the thrust applied to the linear motors 27 and 28, thereby suppressing the rotational vibration of the substrate table 14. FIG. 5 is a block diagram showing a configuration of a control system for causing the substrate table 14 to follow the mask stage MST. A control system for controlling the positions of the plate stage PST and the mask stage MST in the X direction and the Y direction by controlling the thrust applied to the linear motors 27, 28, and 30, and the Z · θ drive mechanism 16 to control the substrate table 14. A control system for controlling the amount of rotation is provided separately. A thrust signal output from a control system that controls the position of the plate stage PST in the Y direction is input to the thrust distribution unit 41 as a force that causes the linear motor 30 to generate a thrust FY, and controls to control the Z · θ drive mechanism 16. The thrust signal output from the system is input to the thrust distribution unit 41 as generating a thrust Fθ.

  Next, an operation when the substrate is exposed by the exposure apparatus having the above-described configuration will be described. When the exposure operation is started, the main controller MC outputs a control signal to a substrate transport device (not shown) to transport and hold the plate P on the substrate table 14 and to send a control signal to the mask transport device (not shown). Is output and the mask M is conveyed and held. When the transfer of the substrate P and the mask M is completed and each is held on the substrate table 14 and the mask stage MST, the main controller MC drives the plate stage PST to move the substrate P below the alignment sensor (not shown). It arrange | positions (-Z direction) and the position measurement of several typical alignment marks (about 3-9 pieces) on the board | substrate P is performed using an alignment sensor. After completing the measurement of these representative alignment marks, the main controller MC performs an EGA (Enhanced Global Alignment) operation using these measurement results and the design values of each shot area recorded in advance. The arrangement coordinates of all shot areas on the plate P are obtained.

  Coordinates obtained by correcting the coordinate value of the shot area on the plate P obtained by the above EGA calculation by the baseline amount (distance between the projection center of the projection image via the projection optical system PL and the center of the measurement visual field of the alignment sensor) If the value is obtained and the plate stage PST is driven using the corrected coordinate value, each shot area on the plate P can be aligned with the exposure area of the projection optical system PL. For this reason, main controller MC first obtains a coordinate value obtained by correcting the coordinate value of the shot area obtained by the EGA calculation with the baseline amount, and drives plate stage PST based on this coordinate time to perform exposure first. The shot area to be scanned is arranged at the scanning start position. In addition to the plate stage PST, the mask stage MST is also arranged at the scanning start position.

When the above arrangement is completed, the main controller MC first obtains the rotation amount around the Z axis of the substrate table 14 obtained from the measurement result of the first plate interferometer 17 and the measurement result of the second plate interferometer 18. A difference Δθ _off from the rotation amount of the moving table 15 around the Z axis is obtained and stored. This difference Δθ _off is an offset of the rotation amount error between the substrate table 14 and the moving table 15 at the start of acceleration. When the difference Δθ _off is obtained, main controller MC starts acceleration of mask stage MST and plate stage PST. When acceleration of these stages is started, a command signal indicating the target rotational position of the plate stage PST (moving table 15) is output from the rotational position command output unit 51 provided in the main controller MC, and the rotation is performed. A command signal indicating the target rotational speed of the plate stage PST (movement table 15) is output from the speed command output unit 52.

  The command signal output from the rotational position command output unit 51 is input to the calculation unit 53, and the deviation according to the difference from the signal indicating the rotation amount θ2 of the moving table 15 output from the interferometer calculation unit 42 in the calculation unit 53. A signal is required. The deviation signal is input to the position controller 54, and the position controller 54 generates a control signal for controlling the rotational position of the moving table 15. The control signal generated by the position controller 54 is input to the calculation unit 55, added to the command signal output from the rotation speed command output unit 52, and the calculation signal calculated by the speed calculation unit 61 is subtracted from the addition result. The

  The calculation results of the calculation unit 55 are output to the first speed controller 56 and the second speed controller 57, respectively, and a control signal for controlling the rotation speed of the moving table 15 is generated. The control signals generated by the respective controllers are added in the calculation unit 58, and the phase advance of the added signal is compensated by the phase advance compensation unit 59. The control signal output from the phase advance compensation unit 59 is input to the thrust distribution unit 41 by subtracting the signal output from the speed calculation unit 62 in the calculation unit 60. The thrust distribution unit 41 distributes the thrust FX indicated by the input signal to the thrusts FX11 and FX12 by distribution according to the measurement result of the plate interferometer 19 (position in the Y direction of the substrate table 14). Output to the linear motors 27 and 28, respectively. As a result, the linear motors 27 and 28 are driven.

When the linear motors 27 and 28 are driven, the substrate table 14 and the moving table 15 move in the scanning direction (Y direction), and their positions are measured by the first plate interferometer 17 and the second plate interferometer 18, respectively. The These measurement results are input to the interferometer calculating unit 42, and the rotation amount θ1 around the Z axis of the substrate table 14, the rotation amount θ2 around the Z axis of the moving table 15, and the rotation amount θ1 of the substrate table 14 and the moving table 15 are detected. The difference Δθ from the rotation amount θ2 is obtained. The rotation amount θ2 of the moving table 15 obtained by the interferometer computation unit 42 is output to the computation unit 53 and the speed computation unit 61, and the rotation amount difference Δθ obtained by the interferometer computation unit 42 is transmitted via the amplifier 43. It is output to the calculation unit 62. The rotation amount difference Δθ output to the speed calculation unit 62 is obtained by subtracting the difference Δθ _off that is an offset of the rotation amount error between the substrate table 14 and the moving table 15 described above.

The above control is performed in a predetermined servo cycle from the start of acceleration of the plate stage PST until the exposure of one shot area is completed. Here, assuming that the number of servo cycles is k, the rotation amount difference Δθ between the substrate table 14 and the moving table 15 for each servo cycle is obtained from the following equation (5). The calculated rotational speed difference ΔθV is expressed by the following equation (6).
Δθ _k = θ1 _k −θ2 _k + Δθ _off (5)
ΔθV _k = Δθ _k −Δθ _k−1 (6)
By calculating the rotation speed difference ΔθV calculated by the speed calculation unit 62 and the control signal output from the phase advance compensation unit 59 by the calculation unit 60 and outputting it to the thrust distribution unit 41, the rotation vibration of the substrate table 14 is reduced. It can be suppressed (damped).

  Further, a signal indicating the rotation amount θ1 around the Z axis of the substrate table 14 output from the dividing unit 71 of the interferometer calculating unit 42 is output to the calculating unit 44, and the mask measured by the mask interferometer 12 in the calculating unit 44. A deviation signal indicating a difference from a signal indicating the rotation amount of the stage MST around the Z axis is calculated. Based on this deviation signal, the servo calculation unit 45 generates a control signal for controlling the rotational position of the mask stage MST, and this control signal is output to the linear motor 11 via the amplifier unit 46 to drive the mask stage MST. . Thereby, the synchronous movement error (rotation error) between the mask stage MST and the plate stage PST can be reduced. In addition to the control of the rotation amount of the substrate table 14, the main controller MC determines the mask stage MST and the mask stage MST based on the measurement result of the mask interferometer 12 and the measurement results of the first plate interferometer 17 and the second plate interferometer 18. Position control in the X direction with the plate stage PST is also performed.

  When each of mask stage MST and plate stage PST reaches a constant speed and is synchronized, main controller MC irradiates mask M with exposure light EL and starts exposure to expose the shot area. During scanning, a part of the pattern image of the mask M is projected onto the exposure area, and the plate is synchronized with the projection optical system PL moving in the + Y direction (or -Y direction) at the speed V. P moves at a speed V in the + Y direction (or -Y direction).

  The above-described control is performed from the start of acceleration of the plate stage PST and the mask stage MST until the exposure process for one shot region is completed. By performing the above control, the rotational vibration of the substrate table 14 can be suppressed, so that the settling time from when the acceleration is finished until the rotational vibration of the substrate table 14 is settled and the speed becomes constant can be shortened. . As a result, the throughput can be improved. In addition, since the synchronous movement error between the mask stage MST and the plate stage PST can be reduced, exposure accuracy (resolution, transfer fidelity, overlay accuracy, etc.) can be increased.

  When the exposure process for one shot area is completed, the main controller MC steps the plate stage PST to move the next shot area to the scanning start position and moves the mask stage MST to the scanning start position. Start moving both stages. Also in this case, the above-described control is performed, and after both stages reach a constant speed and are synchronized, the mask M is irradiated with the exposure light EL to start exposure, and the shot area is exposed. Similarly, exposure processing for other shot areas is performed.

  FIG. 7 is a diagram showing position (rotational position) loop transmission characteristics of the control system shown in FIG. 6, and FIG. 8 is a diagram showing speed (rotational speed) loop transmission characteristics of the control system shown in FIG. 7 and 8, the solid line indicates the closed loop characteristic of the control system, and the alternate long and short dash line indicates the sensitivity function. 7 and 8, (a) shows gain characteristics, and (b) shows phase characteristics. 7 and 8, in this embodiment, the servo response band related to the rotation control of the plate stage PST is about a dozen Hz, and the vibration of about 10 Hz that causes a rotation error of the stage can be suppressed. I understand. That is, in the present embodiment, the response band is expanded and the control system can suppress the vibration of the substrate table 14 up to a higher frequency component than the conventional one. As a result, the settling time of the substrate table 14 is reduced. It can be shortened.

In the above description, the rotation amount difference Δθ between the substrate plate 14 and the moving table 15 is obtained, the rotation speed difference ΔθV is calculated from the difference Δθ, and the rotation speed difference ΔθV and the phase advance compensation unit 59 are calculated. The control signal output from is calculated by the calculation unit 60 and output to the thrust distribution unit 41, thereby suppressing the rotational vibration of the substrate table 14. Instead of the speed calculation unit 62 described above, a rotation acceleration calculation unit for obtaining a rotation acceleration difference between the substrate plate 14 and the moving table 15 may be provided to perform acceleration control. The rotational acceleration difference ΔθA calculated for each servo cycle by the rotational acceleration calculation unit is expressed by the following equation (7).
ΔθV _k = ΔθV _k −ΔθV _k−1 (7)

  The rotation acceleration difference ΔθA calculated by the rotation acceleration calculation unit and the control signal output from the phase advance compensation unit 59 are calculated by the calculation unit 60 and output to the thrust distribution unit 41, whereby the rotational vibration of the substrate table 14 is reduced. Can be canceled. By performing this acceleration control, the settling time can be shortened and the exposure accuracy can be improved. In the control system having such a configuration, the servo response band related to the rotation control of the plate stage PST is about tens of Hz, and vibrations of about 10 Hz that cause a rotation error of the stage can be suppressed. Furthermore, a control system in which a control system that performs speed control and a control system that performs acceleration control shown in FIG. 6 can be used.

  In the above-described embodiment, the case where the substrate table 14 is configured to be rotatable around the Z axis by adjusting the drive amounts of the linear motors 27 and 28 that drive the substrate table 14 and the like in the X direction. As an example, the same control system is used for the substrate table 14 in the case where the substrate table 14 can be rotated around the Z axis by the linear motor 30 that drives the substrate table 14 and the like in the Y direction. Rotational vibration can be suppressed.

  Furthermore, the rotational vibration of the substrate table 14 can be suppressed by controlling the Z · θ drive mechanism 16. The control system that controls the Z / θ drive mechanism 16 is also configured by one or both of a control system that performs speed control and a control system that performs acceleration control system. The control system that performs speed control is the control system shown in FIG. The control system for performing the acceleration control is provided with a rotation acceleration calculation unit for obtaining a rotation acceleration difference between the substrate plate 14 and the moving table 15 in place of the speed calculation unit 62 in FIG. It is.

  As mentioned above, although embodiment of this invention was described, this invention is not restrict | limited to the said embodiment, It can change freely within the scope of the present invention. For example, in the above embodiment, the case where the rotation control of the plate stage PST is performed has been described as an example. However, the present invention can also be applied to the case where the rotation control of the mask stage is performed. It is also possible to apply to both stages of the plate stage PST. In the above embodiment, the first plate interferometer 17 measures the position and rotation amount of the substrate table 14 in the X direction, and the second plate interferometer 18 measures the position and rotation amount of the moving table 15 in the X direction. However, an interferometer that measures the position in the X direction and an interferometer that measures the amount of rotation may be provided separately.

  Further, the functions of the control system shown in FIG. 6 can be configured by hardware or can be realized by software. When implemented by software, the hardware configuration is an external storage device such as a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), communication interface, optical disk, magnetic disk, magneto-optical disk, etc. The program for performing the control described above is read into the main control device MC via the communication line, or the program stored in the recording medium is read into the main control device MC using the external storage device.

  Next, a method for manufacturing a liquid crystal display element using the exposure apparatus according to an embodiment of the present invention will be described. FIG. 9 is a flowchart showing a part of a manufacturing process for manufacturing a liquid crystal display element as a micro device. In the pattern formation step S1 in FIG. 9, a so-called photolithography step is performed in which the mask pattern is transferred and exposed onto the plate P using the exposure apparatus of the present embodiment. A predetermined pattern including a large number of electrodes and the like is formed on the plate P by this photolithography process. Thereafter, the exposed plate P is subjected to various processes such as a developing process, an etching process, and a peeling process, whereby a predetermined pattern is formed on the plate P, and the process proceeds to the next color filter forming process S2.

  In the color filter forming step S2, a set of three dots corresponding to R (Red), G (Green), and B (Blue) is arranged in a matrix, or a filter having three stripes of R, G, and B A color filter is formed by arranging a plurality of sets in the horizontal scanning line direction. And cell assembly process S3 is performed after color filter formation process S2. In this cell assembling step S3, a liquid crystal panel (liquid crystal cell) is assembled using the plate P having the predetermined pattern obtained in the pattern forming step S1, the color filter obtained in the color filter forming step S2, and the like.

  In the cell assembly step S3, for example, liquid crystal is injected between the plate P having the predetermined pattern obtained in the pattern forming step S1 and the color filter obtained in the color filter forming step S2, and a liquid crystal panel (liquid crystal Cell). Thereafter, in the module assembly step S4, components such as an electric circuit and a backlight for performing display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete the liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, a liquid crystal display element having an extremely fine circuit pattern can be obtained with high throughput.

  An exposure apparatus according to an embodiment of the present invention is not limited to an exposure apparatus that manufactures liquid crystal display elements, but also includes an exposure apparatus that manufactures semiconductor elements, an exposure apparatus that manufactures CCDs, an exposure apparatus that manufactures thin film magnetic heads, and the like. The present invention can be applied to an exposure apparatus that manufactures a device. Next, a method for manufacturing a semiconductor element using the exposure apparatus will be described in which the exposure apparatus according to the embodiment of the present invention is applied to an exposure apparatus for manufacturing a semiconductor element.

  FIG. 10 is a flowchart showing a part of a manufacturing process for manufacturing a semiconductor element as a micro device. As shown in FIG. 10, first, in step S10 (design step), a function / performance design of a semiconductor element is performed, and a pattern design for realizing the function is performed. Subsequently, in step S11 (mask manufacturing step), a mask (reticle) on which the designed pattern is formed is manufactured. On the other hand, in step S12 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.

  Next, in step S13 (wafer processing step), using the mask and wafer prepared in steps S10 to S12, an actual circuit or the like is formed on the wafer by lithography or the like, as will be described later. Next, in step S14 (device assembly step), device assembly is performed using the wafer processed in step S13. This step S14 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S15 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S14 are performed. After these steps, the microdevice is completed and shipped.

  FIG. 11 is a diagram showing an example of a detailed flow of step S13 of FIG. In FIG. 11, in step S21 (oxidation step), the surface of the wafer is oxidized. In step S22 (CVD step), an insulating film is formed on the wafer surface. In step S23 (electrode formation step), an electrode is formed on the wafer by vapor deposition. In step S24 (ion implantation step), ions are implanted into the wafer. Each of the above steps S21 to S24 constitutes a pretreatment process at each stage of the wafer processing, and is selected and executed according to a necessary process at each stage.

  At each stage of the wafer process, when the above-described pre-processing step is completed, the post-processing step is executed as follows. In this post-processing step, first, in step S25 (resist formation step), a photosensitive agent is applied to the wafer. Subsequently, in step S26 (exposure process), the mask pattern is transferred to the wafer by the lithography system (exposure apparatus) and the exposure method described above. Next, in step S27 (development process), the exposed wafer is developed, and in step S28 (etching step), the exposed members other than the portion where the resist remains are removed by etching. In step S29 (resist removal step), the resist that has become unnecessary after the etching is removed. By repeatedly performing these pre-processing steps and post-processing steps, multiple patterns are formed on the wafer.

  If the microdevice manufacturing method of the present embodiment described above is used, a stage for holding a reticle (mask) using the above-described exposure apparatus and exposure method in the pattern formation step (step S1) or the exposure step (step S26). The stage holding the plate (wafer) is scanned. For this reason, since the overlay accuracy between the reticle (mask) and the plate (wafer) can be increased, a fine device can be produced with a high yield.

  In addition, not only microdevices such as liquid crystal display elements or semiconductor elements, but also mother reticles for manufacturing reticles or masks used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc. The present invention can also be applied to an exposure apparatus that transfers a pattern to a glass substrate or silicon wafer. Here, in an exposure apparatus using DUV (deep ultraviolet), VUV (vacuum ultraviolet) light, or the like, a transmission type reticle is generally used. As a reticle substrate, quartz glass, fluorine-doped quartz glass, fluorite, Magnesium fluoride or quartz is used. In proximity type X-ray exposure apparatuses, electron beam exposure apparatuses, and the like, a transmissive mask (stencil mask, membrane mask) is used, and a silicon wafer or the like is used as a mask substrate. Such an exposure apparatus is disclosed in WO99 / 34255, WO99 / 50712, WO99 / 66370, JP-A-11-194479, JP-A2000-12453, JP-A-2000-29202, and the like. .

It is a front view which shows schematic structure of the exposure apparatus by one Embodiment of this invention. It is a figure which shows the structure of plate stage PST and its control system. It is a perspective view which shows the structural example of plate stage PST. It is a figure which shows the physical model of the plate stage PST regarding the position control of a scanning direction. It is a figure which shows the simulation model of plate stage PST. It is a block diagram which shows the structure of the control system which controls the rotational vibration of the substrate table 14 which arises at the time of scanning exposure. It is a figure which shows the position (rotation position) loop transmission characteristic of the control system shown in FIG. It is a figure which shows the speed (rotation speed) loop transmission characteristic of the control system shown in FIG. It is a flowchart which shows a part of manufacturing process which manufactures the liquid crystal display element as a microdevice. It is a flowchart which shows a part of manufacturing process which manufactures the semiconductor element as a microdevice. It is a figure which shows an example of the detailed flow of step S13 of FIG.

Explanation of symbols

14 Substrate table (first part)
15 Moving table (second part)
17 First plate interferometer (first detection device, first position detection device)
18, 18a, 18b Second plate interferometer (second detection device, second position detection device)
22 Control controller (control unit)
24b Position detection unit (calculation unit)
EX exposure apparatus ILS Illumination optical system (exposure means)
M Mask MC Main controller (control device)
MST mask stage (second stage)
P plate (object, substrate)
PL projection optical system (exposure means)
PST plate stage (first stage, stage, substrate stage)

Claims (15)

In a stage apparatus including a first stage that holds an object and is movable in a predetermined direction,
The first stage includes a first part that holds the object, and a second part that supports the first part,
A first detection device for detecting a rotation amount of the first portion;
A second detection device for detecting a relative rotation amount between the first part and the second part;
And a control device that controls rotational vibration of the first portion based on detection results of the first and second detection devices when the first stage is driven in the predetermined direction. apparatus.   Based on the detection results of the first and second detection devices, the control device controls the relative rotational speed and rotational acceleration between the first portion and the second portion so as to suppress the rotational vibration of the first portion. The stage apparatus according to claim 1, further comprising a control unit configured to control at least one of the two.   The stage device according to claim 1, wherein the second detection device detects a rotation amount of the second portion. The control device includes a calculation unit that calculates a difference in rotation amount between the first portion and the second portion based on detection results of the first detection device and the second detection device,
The stage device according to claim 3, wherein the control unit controls at least one of the rotation speed and the rotation acceleration using a calculation result of the calculation unit. A first position detecting device for detecting a position of the first stage in the predetermined direction;
A second stage different from the first stage;
A second position detector for detecting the position of the second stage in the predetermined direction,
The control device controls rotational vibration of the first portion based on detection results of the first and second detection devices, and based on detection results of the first position detection device and the second position detection device. The stage apparatus according to any one of claims 1 to 4, wherein the second stage is controlled so that the first stage and the second stage are in a predetermined positional relationship. A stage control method for controlling a stage having a first part for holding an object and a second part for supporting the first part and holding the object and movable in a predetermined direction,
A driving step of driving the stage in the predetermined direction;
A first detection step of detecting a rotation amount of the first portion;
A second detection step of detecting a relative rotation amount between the first part and the second part;
And a control step of controlling rotational vibration of the first portion based on detection results of the first and second detection steps.   The control step controls at least one of a relative rotational speed and a rotational acceleration between the first portion and the second portion so as to suppress rotational vibration of the first portion based on a detection result of the detection step. The stage control method according to claim 6, wherein:   8. The stage control method according to claim 6, wherein the detection step and the control step are sequentially performed until the speed of the stage in the predetermined direction becomes constant. In an exposure apparatus that exposes a predetermined pattern on a substrate,
A first stage that holds a substrate whose outer shape is larger than 500 mm and is movable in a predetermined direction;
The first stage has a first part for holding the substrate and a second part for supporting the first part,
A first detection device for detecting a rotation amount of the first portion;
A second detection device for detecting a relative rotation amount between the first part and the second part;
And a control device that controls rotational vibration of the first portion based on detection results of the first and second detection devices when the first stage is driven in the predetermined direction. apparatus.   Based on the detection results of the first and second detection devices, the control device controls the relative rotational speed and rotational acceleration between the first portion and the second portion so as to suppress the rotational vibration of the first portion. The exposure apparatus according to claim 9, further comprising a control unit that controls at least one of the exposure apparatus.   The exposure apparatus according to claim 9, wherein the second detection device detects a rotation amount of the second portion. The control device includes a calculation unit that calculates a difference in rotation amount between the first portion and the second portion based on detection results of the first detection device and the second detection device,
The exposure apparatus according to claim 11, wherein the control unit controls at least one of the rotation speed and the rotation acceleration using a calculation result of the calculation unit. Exposure means for exposing a pattern of a mask on which the predetermined pattern is formed on the substrate;
A second stage that holds the mask and is different from the first stage;
A first position detecting device for detecting a position of the first stage in the predetermined direction;
A second position detector for detecting the position of the second stage in the predetermined direction,
The control device controls rotational vibration of the first portion based on detection results of the first and second detection devices, and based on detection results of the first position detection device and the second position detection device. The exposure apparatus according to any one of claims 9 to 12, wherein the second stage is controlled so that the first stage and the second stage are in a predetermined positional relationship. An exposure method for exposing a pattern of a mask held on a mask stage onto a substrate held on a substrate stage,
An exposure method comprising the step of controlling the substrate stage as the stage using the stage control method according to any one of claims 6 to 8. A device manufacturing method including a lithography process,
A device manufacturing method comprising an exposure step of performing exposure using the exposure apparatus according to any one of claims 9 to 13 in the lithography step.

Images