JP2006199880A - Surface modification method of resin moldings and resin moldings - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface modification method of resin moldings capable of adding various surface properties at a low cost and the resin moldings modified by the surface modification method. <P>SOLUTION: The surface modification method is comprised of a step for spraying a flame of a fuel gas containing an alkylsilane compound and/or an alkoxysilane compound to the surface of the resin moldings and a step for forming a modified layer by applying a resin composition containing an organosilane to the surface of the resin moldings. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for modifying a surface of a resin molded body and a resin molded body, and more specifically, a water-repellent and hydrophilic surface such as antifouling, a reactive surface such as a vinyl group, an acryloxy group, an amino group, and an isocyanate group. The present invention relates to a surface modification method for easily forming a surface on a resin molded body and a resin molded body including at least one film modified by the surface modification method.

  Known as surface modification methods for sheet-like and film-like resin moldings are dry treatment and wet treatment. As dry treatment, only the vicinity of the resin surface, such as corona treatment, plasma treatment, and flame treatment, is modified. There are methods for forming an inorganic film by vapor deposition, sputtering, and the like, which are disclosed in Patent Document 1 and Patent Document 2. However, the modification method such as corona treatment is limited only to the formation of a hydrophilic surface, the modification effect is low, and the modification effect is significantly deteriorated due to the external environment.

  In addition, in the frame process, a silicic acid flame process is disclosed in Patent Document 3 because the reforming effect is sustained. However, this method is also limited to the formation of only a hydrophilic surface, and has low versatility as a method for modifying the surface of a resin molded body. In the method of forming an inorganic film such as sputtering, since it is a process in a vacuum, it is difficult to process in a large area, and the process time is long. There was a problem in that the adhesion between the resin film and the resin substrate was low, and the modified film easily peeled off.

  In wet processing, a modification method by chemical treatment with acid, alkali, solvent, etc., a method of forming a coating film by inorganic oxide coating, polymer coating, etc., a method of introducing a polymer graft chain to the surface of an activated resin molding There are disclosed in Patent Document 4 and Patent Document 5. However, chemical treatment has problems such as only the formation of a hydrophilic surface and a low modification effect. With the method of forming a coating film, the adhesion between the coating film and the resin substrate is low, and the film is peeled off in the usage environment. However, there is a problem of elution when used in a liquid. In the polymer grafting method, there are problems such as a complicated process for activating the resin molded body for grafting and difficulty in processing in a large area.

JP-A-11-286561 JP 2004-107564 A JP 2003-238710 A JP 05-310979 A JP 07-138394 A

  The present invention solves the above-mentioned problems, and a surface-modified film having various functions such as hydrophilicity, water repellency, and having a reactive group is formed on the resin molded body at a low cost and in a large area. It is an object to provide a surface modification method that can be applied. It is another object of the present invention to provide a modified resin molded body in which the modified film and the resin molded body substrate have high adhesion.

  The present inventors radiate a flame of a fuel gas containing an alkylsilane compound and / or an alkoxysilane compound to the surface of the resin molded body, thereby causing nanosized silica particles to be firmly bonded to the surface of the resin molded body, and By applying a resin composition containing organosilane on the surface of the resin molding and forming a surface modified film containing organosilane on the surface of the resin molding, a hydrophilic surface, a water-repellent surface and / or a reactive surface The above-mentioned problems are solved by finding that a member having a low cost can be obtained and that the modified film and the resin-molded substrate have high adhesion and have durability against long-term use in a liquid. The present invention has been reached.

  That is, in the present invention, following the step of radiating a flame of a fuel gas containing an alkylsilane compound and / or an alkoxysilane compound to the surface of the resin molding, a resin composition containing organosilane is applied to the surface of the resin molding, A surface modification method comprising a step of forming a surface modification film on the surface of the resin molded body.

Further, the present invention provides the above surface modification wherein the surface free energy of the surface of the resin molded article after radiating the flame of the fuel gas containing the alkylsilane compound and / or alkoxysilane to the surface is 30 to 80 mJ / cm ^2. Is the method.

（式中、Ｘは、２個存在する時は同一または異なり、Ｒ^１は同一または異なり、エーテル結合あるいはエステル結合を有してもよい炭素数1〜８の直鎖型または分岐型アルキル基を示し、Ｒ^２、Ｒ^３は、同一または異なり炭素数１〜１０の直鎖型アルキル基または分岐型アルキル基を示し、ａは０〜３の整数、ｂは０〜３の整数である。）
で表され、式中Ｘがビニル基、エポキシ基、アクリロキシ基、メタクリロキシ基、スチリル基、アミノ基、メルカプト基、パーフルオロアルキル基、ウレイド基、クロロアルキル基、イソシアネート基、アセトキシ基、フェニル基からなる群より選択される少なくとも１つのアルコキシシランであることを特徴とする上記の表面改質方法である。 In the present invention, the above organosilane is represented by the following general formula (1):

(Wherein X is the same or different when two are present, R ¹ is the same or different, and represents a linear or branched alkyl group having 1 to 8 carbon atoms which may have an ether bond or an ester bond. And R ² and R ³ are the same or different and each represents a linear or branched alkyl group having 1 to 10 carbon atoms, a is an integer of 0 to 3, and b is an integer of 0 to 3.
Wherein X is a vinyl group, an epoxy group, an acryloxy group, a methacryloxy group, a styryl group, an amino group, a mercapto group, a perfluoroalkyl group, a ureido group, a chloroalkyl group, an isocyanate group, an acetoxy group, or a phenyl group. The surface modification method described above, wherein the surface modification method is at least one alkoxysilane selected from the group consisting of:

  Further, the present invention is a resin molded body whose surface is modified by the above method, and further includes a resin composition layer comprising a compound having a reactive group capable of reacting with a reactive group present on the surface of the resin molded body Is a resin molded body provided on the resin molded body.

  In the present invention, a resin composition containing an organosilane is applied to a resin molded article that radiates a flame of a fuel gas containing an alkylsilane compound and / or an alkoxysilane compound to the surface, and the resin molded article substrate is firmly attached. A bonded surface-modified film can be formed on the resin molded body. This surface modification method can form a resin molded body having a hydrophilic surface, a water-repellent surface, and a reactive surface with a resin composition containing an organosilane at a low cost and a large area, and has various surface properties. It can be used as a method for modifying the surface of the resin molding to be applied.

Hereinafter, the present invention will be described in detail with reference to the drawings. The following description shows preferred embodiments of the present invention, and the scope of the present invention is not limited to the following embodiments. In each figure, the same numerals indicate the same or equivalent components.
In the method for modifying the surface of a resin molded body of the present invention, a flame of a fuel gas containing an alkylsilane compound and / or an alkoxysilane compound is radiated to the surface of the resin molded body substrate 1 so that nano-sized silica particles are formed on the resin molded body substrate 1. A step of forming a layer 2 that is firmly bonded to the surface, a step of applying a resin composition containing organosilane, and a step of forming a surface-modified film 3 made of a resin composition containing organosilane after drying. (See FIG. 1).

  The resin molded body substrate 1 used in the present invention is not particularly limited as long as it is made of a synthetic polymer and / or a natural polymer and has a self-supporting property. For example, an olefin resin such as polyethylene, polypropylene, and cycloolefin; Vinyl resins such as polyvinyl chloride, polystyrene, polyvinyl acetate, and polyvinyl alcohol; acrylic resins such as polymethyl methacrylate; ester resins such as polyethylene terephthalate, polylactic acid, and polyglycolic acid; polytetrafluoroethylene, polyvinylidene fluoride, and the like Fluorine resin; Silicon resin such as polydimethylsiloxane; Polycarbonate resin; Polyimide resin; Polyamide resin; Unsaturated bond-containing resin such as polybutadiene and polyisoprene. These resins may be homopolymers or copolymers with other monomers. Further, these resins may contain various additives such as a colorant, a diffusing agent, a thickener, and machine fine particles.

  The resin-molded substrate 1 that emits a flame of a fuel gas containing an alkylsilane compound and / or an alkoxysilane compound is preferably the above-mentioned resin substrate, but it is a primer that can be easily modified partially or entirely on the resin substrate. A laminated film including at least one layer, an ink layer for design, a hard coat layer for protection, and the like may be formed in advance.

  The shape of the resin molded body substrate 1 is not particularly limited. However, considering the simplicity of the reforming process, a sheet shape or a film shape is preferable, and even if the surface is flat, random or regular unevenness is applied. It may be molded, or it may have random or regular holes or holes.

  The thickness of the resin molded substrate 1 is not particularly limited, but is preferably 0.5 μm to 30 mm in consideration of cost.

  In the present invention, the flame fuel gas radiated to the surface of the resin molded substrate 1 is mainly composed of a hydrocarbon gas such as propane gas, a flammable gas such as compressed air, and an alkylsilane compound and / or an alkoxysilane compound. It is.

  The use ratio of the flammable gas in the fuel gas is 80 mol% or more and 99.9 mol% or less, and preferably 85 mol% or more and 90 mol% or less. This is because if the use ratio is less than 80 mol%, the miscibility with other contained gases decreases and the combustion efficiency decreases, and if it exceeds 99.9 mol%, the effect of the flame treatment is significantly decreased.

  Specific examples of the alkylsilane compound and / or alkoxysilane compound contained in the fuel gas include tetramethylsilane, tetraethylsilane, 1,2-dichlorotetramethylsilane, 1,2,3-tetramethylsilane, 1,2- Alkylsilane compounds such as dichlorotetraethylsilane, 1,2-diphenyltetramethylsilane, 1,2-diphenyltetraethylsilane, and dimethyldiethyltetrasilane; alkoxysilane compounds such as methyltrimethoxysilane, dimethyldimethoxysilane, and dimethyldiethoxysilane Can be mentioned. These compounds can be used alone or in combination of two or more.

The component usage ratio of the alkylsilane compound and / or alkoxysilane compound in the fuel gas is 1 × 10 ⁻¹⁰ mol% to ¹⁰ mol%, preferably 1 × 10 ⁻⁹ mol% to 5 mol%. This is because if the use ratio is less than 1 × 10 ⁻¹⁰ mol%, the effect of the flame treatment is remarkably reduced, and if it exceeds 10 mol%, the miscibility with air is reduced.

  A carrier gas such as air can be used in the fuel gas in order to improve the miscibility of the fuel gas.

  Various organosilanes may be used as the resin composition used in the present invention to be applied to a flame-treated resin-molded substrate to form the surface-modified film 3, but the stability of the resin composition In terms of reactivity, it is preferable to contain alkoxysilane.

で表され、一般式（１）中、Ｘはビニル基、エポキシ基、アクリロキシ基、メタクリロキシ基、スチリル基、アミノ基、メルカプト基、パーフルオロアルキル基、ウレイド基、クロロアルキル基、イソシアネート基、アセトキシ基、フェニル基を示す。一般式（１）中にＸが複数個存在するときは、同一であっても異なってもよい。 Alkoxylane is represented by the following general formula (1)

In the general formula (1), X is vinyl group, epoxy group, acryloxy group, methacryloxy group, styryl group, amino group, mercapto group, perfluoroalkyl group, ureido group, chloroalkyl group, isocyanate group, acetoxy Group and phenyl group. When a plurality of X are present in the general formula (1), they may be the same or different.

Examples of the alkyl group having 1 to 8 carbon atoms which may have an ether bond or an ester bond of R ¹ include a methylene group, an ethylene group, an n-propylene group, and an i-propylene group.

Examples of the monovalent alkyl group having 1 to 10 carbon atoms of R ² and R ³ include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, a sec-butyl group, and a t-butyl group. Groups and the like. When a plurality of general formulas (1) are present, they may be the same or different. R ² can include substituted derivatives of these groups. Examples of the substituent in the substituted derivative of R ² include a halogen atom, a hydroxyl group, and an amino group. When a plurality of general formulas (1) are present, they may be the same or different.

  Specific examples of such alkoxysilanes include vinyltrimethoxysilane, vinyltriethoxysilane, vinylmethyldimethoxysilane, vinylmethyldiethoxysilane; styryl-functional alkoxysilanes such as vinyl-functional alkoxysilane and p-styryltrimethoxysilane. Β-acryloxyethyltrimethoxysilane, β-methacryloxyethyltrimethoxysilane, β-acryloxyethyltriethoxysilane, β-methacryloxyethyltriethoxysilane, γ-acryloxypropyltrimethoxysilane, γ-methacryloxy Propyltrimethoxysilane, γ-acryloxypropyltriethoxysilane, γ-methacryloxypropyltriethoxysilane, β-acryloxyethylmethyldimethoxysilane, β-methacryloxyethylmethyl Dimethoxysilane, β-acryloxyethylmethyldiethoxysilane, β-methacryloxyethylmethyldiethoxysilane, γ-acryloxypropylmethyldimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, γ-acryloxypropylmethyldiethoxysilane , Γ-methacryloxypropylmethyldiethoxysilane, β-acryloxyethylethyldimethoxysilane, β-methacryloxyethylethyldimethoxysilane, β-acryloxyethylethyldiethoxysilane, β-methacryloxyethylethyldiethoxysilane, γ -Acryloxypropylethyldimethoxysilane, γ-methacryloxypropylethyldimethoxysilane, γ-acryloxypropylethyldiethoxysilane, γ-methacryloxypropylethyl Acryloxy and methacryloxy functional alkoxysilanes such as ethoxysilane; 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2- (3,4 epoxy) (Cyclohexyl) ethyltrimethoxysilane and other epoxy functional alkoxysilanes; 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2 (aminoethyl) 3-aminopropyltrimethoxysilane, N-2 (amino Amino-functional alkoxysilanes such as ethyl) 3-aminopropyltriethoxysilane, N-2 (aminoethyl) 3-aminopropylmethyldimethoxysilane, 3-ureidopropyltrimethoxysilane, 3-ureidopropyltrieth Ureido functional alkoxysilanes such as xyloxysilane; mercaptofunctional alkoxysilanes such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-isocyanatopropyltrimethoxysilane, 3- Isocyanate-functional alkoxysilanes such as isocyanatepropyltriethoxysilane; Acetoxy-functional alkoxysilanes such as acetoxymethyltrimethoxysilane and acetoxymethyltriethoxysilane; Phenyl-functional alkoxysilanes such as phenyltrimethoxysilane and phenyltriethoxysilane; Fluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, heptadecatrifluorodecyltrimethoxysila , Fluoroalkylalkoxysilanes such as heptadecatrifluorodecyltriethoxysilane; chloroalkylalkoxysilanes such as 3-chloropropyltrimethoxysilane; tetramethoxysilane, tetraethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, dimethyldimethoxy Examples include silane, dimethyldiethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, decylmethoxysilane, and decylethoxysilane. .

  Examples of organosilanes other than alkoxysilanes include chlorosilanes such as methylchlorosilane, methyldichlorosilane, dimethylchlorosilane, trimethylchlorosilane, phenyltrichlorosilane, diphenyldichlorosilane, trifluoropropyltrichlorosilane, and heptadecafluorodecylchlorosilane. These organosilanes may be used alone or in combination of two or more.

  When the surface-modified film 3 that gives a water-repellent surface is formed on the resin molded body substrate, for example, a resin composition containing heptadecatrifluoromethoxysilane is preferable. Moreover, when forming the surface which has hydrophilic property and an amino group in a resin molding, the resin composition containing 3-aminopropyl trimethoxysilane can be utilized preferably, for example. Or when forming the surface which has photoreactivity in a resin molding, the resin composition containing (gamma) -acryloxypropyl trimethoxysilane can be utilized preferably, for example. Thus, an organosilane suitable for the purpose of surface modification can be selected as appropriate.

  The resin composition applied to the flame-treated resin molded substrate may contain an acid such as hydrochloric acid, sulfuric acid or acetic acid; or an alkali such as sodium hydroxide or potassium hydroxide in order to hydrolyze the alkoxysilane. Furthermore, after hydrolysis, a partial condensate obtained by condensation reaction can be included.

  The concentration of the alkoxysilane in the resin composition is conveniently adjusted according to the film thickness of the surface modification film 3 to be formed and the coating method. In this case, a diluent is used. Further, a diluent that improves the dispersion stability of the composition is used.

  Such a diluent is not particularly limited as long as it is a diluent used in general resin coatings and can mix the composition uniformly. For example, acetone, methyl ethyl ketone, cyclohexanone, etc. Ketones; Esters such as methyl acetate, ethyl acetate, butyl acetate, ethyl lactate and methoxyethyl acetate; Ethers such as diethyl ether, ethylene glycol dimethyl ether, ethyl cellosolve, butyl cellosolve, phenyl cellosolve and dioxane; Fragrances such as toluene and xylene Aliphatic hydrocarbons such as pentane and hexane; halogenated hydrocarbons such as methylene chloride, chlorobenzene and chloroform; alcohols such as methanol, ethanol, normal propanol and isopropanol; water and the like. These diluents can be used alone or in combination of two or more.

  In the resin composition of the present invention, a polymerization inhibitor, an antifoaming agent, a leveling agent, a dispersant, a plasticizer, an antistatic agent, a surfactant, a thickener, a pigment, a dye, and a nonreactive agent are included as necessary. A polymer or the like can be added as long as the effect of modifying the target surface is not impaired.

  The resin composition can be produced by uniformly mixing other components blended as necessary according to a conventional method.

  The resin composition used in the present invention is a flame-treated resin molded substrate, impregnation method such as dip coating; spin coating method; coating method using rolls used in letterpress printing, lithographic printing, intaglio printing, etc .; Spray coating method, such as spraying on the surface; Curtain flow coating method, etc. If necessary, low-boiling substances such as diluents are heated and evaporated using a heating furnace, far infrared furnace, ultra far infrared furnace, etc. By removing, the surface modification film 3 is formed (FIG. 1).

  Although the film thickness of the surface modification film 3 can be determined conveniently according to the purpose, it is preferably 0.5 nm to 10 μm in consideration of cost.

  The resin molded body of the present invention in which the surface modified film 4 (lower layer) containing an organosilane having a reactive group is formed is a resin composition layer comprising a compound having a reactive group capable of reacting with the reactive group 5 (upper layer) can be further laminated (see FIG. 2). Here, the reactive groups of the lower layer and the upper layer can be determined conveniently according to the purpose. For example, on the surface of a resin molded body modified with acryloxy functional silane, a resin composition comprising an acrylate and a photopolymerization initiator is coated, dried, and then irradiated at the interface between the lower layer and the upper layer by UV irradiation. A film can be formed.

  In addition, by applying and drying a resin composition containing a compound having a hydroxyl group on the surface of a resin molded body modified with an isocyanate functional silane, it is possible to form a laminated film that reacts at the interface between the lower layer and the upper layer. In addition, a resin composition containing a carboxyl group-containing compound and a catalyst such as carbodiimide was applied to the surface of a resin molded body modified with an amino-functional silane, and reacted at the interface between the lower layer and the upper layer. A laminated film can be formed.

  Examples of the present invention will be specifically described below, but the scope of the present invention is not limited to the description of these Examples. Moreover, unless otherwise indicated, the compounding quantity of each component, etc. in an Example means the mass part.

(Surface free energy)
The surface free energy γ _s (the sum of the dispersion force component γ _s ^d and the polar force component γ _s ^p ) of the resin molded plate after the flame emission was obtained as follows. First, the contact angles (θ ₁ and θ ₂ ) on the resin molded plate are measured with a contact angle meter using water and methylene iodide. Next, the value of the contact angle and the value of the surface free energy of water or methylene iodide are substituted into the following equation (2), and the simultaneous equations consisting of the two obtained equations are solved to obtain γ _s ^d and γ _s ^p Ask for. The sum of γ _s ^d and γ _s ^p is the surface free energy γ _s of the resin molded plate.
{(1 + cos θ) · γ _l } / 2 = (γ _s ^d · γ _l ^d ) ^1/2 + (γ _s ^p · γ _l ^p ) ^1/2 (2)
(In the formula, γ _l is the surface free energy of the liquid, and γ _l ^d and γ _l ^p are components of dispersion force and polar force, respectively, and γ _l = γ _l ^d + γ _l ^p .)
The dispersion force component and polar force component of the surface free energy of water are 21.8 and 51.0 mJ / m ² , respectively. The dispersion force component and polar force component of the surface free energy of methylene iodide are 48.5 and ² respectively. Calculated as 3 mJ / m ² .

<Example 1>
A flame using propane gas and tetramethylsilane gas as fuel gas was emitted from a distance of 15 mm in burner height onto a polymethyl methacrylate (hereinafter, PMMA) plate having a thickness of 2 mm. The PMMA plate was supplied under the burner by a conveyor, and the conveyor speed was 20 mm / min. The surface free energy of the PMMA plate irradiated with flame was 71.3 mJ / m ² . Next, from the flame-radiated PMMA plate, 0.5 parts of heptadecatrifluorodecyltrimethoxysilane, 2.9 parts of 0.1 mol / l hydrochloric acid aqueous solution, 1.5 parts of methanol, and 95.1 parts of isopropyl alcohol The resulting resin composition was applied by dip coating and dried at 75 ° C. for 1 hour to obtain a PMMA plate having a water-repellent surface.

<Comparative Example 1>
From a PMMA plate having a thickness of 2 mm, 0.5 parts of heptadecatrifluorodecyltrimethoxysilane, 2.9 parts of a 0.1 mol / l hydrochloric acid aqueous solution, 1.5 parts of methanol, and 95.1 parts of isopropyl alcohol as in Example 1. The resulting resin composition was applied by dip coating and dried at 75 ° C. for 1 hour to obtain a PMMA plate having a water-repellent surface.

<Comparative example 2>
The distance between the electrode and the PMMA plate was 5 mm on the 2 mm thick PMMA plate, and the corona treatment was performed at an output of 330 W and a speed of 2 m / min. Next, a resin composition comprising 0.5 parts of heptadecatrifluorodecyltrimethoxysilane, 2.9 parts of a 0.1 mol / l hydrochloric acid aqueous solution, 1.5 parts of methanol, and 95.1 parts of isopropyl alcohol as in Example 1. The product was applied by dip coating and dried at 75 ° C. for 1 hour to obtain a PMMA plate having a water-repellent surface.

  The following evaluation was performed about the Example and the comparative example.

(Contact angle) The contact angle of the modified PMMA plate surface with water was measured with a contact angle meter.

(Durability) When the modified PMMA plate is immersed in isopropyl alcohol, cleaned for 5 minutes in ultrasonic waves, and the modified film is considered to have peeled off due to the contact angle with water on the surface of the PMMA plate after cleaning Was marked with ◯ when the modified film was considered not peeled off.

The results are shown in Table 1.

  From Table 1, in Example 1 where a resin composition made of fluoroalkylalkoxysilane was applied after radiating a flame of fuel gas containing alkylsilane, a highly hydrophobic surface could be formed on the PMMA plate. Furthermore, the contact angle after washing with isopropyl alcohol also maintains high hydrophobicity, indicating good durability.

  On the other hand, in Comparative Example 1 in which a resin composition composed of fluoroalkylalkoxysilane was applied to an untreated PMMA plate, it was more hydrophobic than before treatment (PMMA plate contact angle: 75 °). The modified resin layer is completely peeled off by washing with isopropyl alcohol. In Comparative Example 2 in which the resin composition composed of fluoroalkylalkoxysilane was applied to the PMMA plate after the corona treatment, it was more hydrophobic than the PMMA plate, but the modified resin layer was completely peeled off by isopropyl alcohol cleaning. .

Resin molded body coated with organosilane resin composition after flame emission A resin molded body comprising a resin composition layer containing an organosilane having a reactive group and a resin composition layer comprising a compound having a reactive group capable of reacting with the reactive group

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin molding board | substrate 2 The layer in which the nanosize silica particle is couple | bonded firmly 3 Surface modification film | membrane layer 4 Surface modification film | membrane 5 containing the organosilane which has a reactive group The reaction which can react with the said reactive group Resin composition layer comprising a compound having a functional group

Claims (5)

Following the step of radiating a flame of a fuel gas containing an alkylsilane compound and / or an alkoxysilane compound to the surface of the resin molded body, a resin composition containing organosilane is applied to the surface of the resin molded body, and a surface modified film is formed. A surface modification method comprising a step of forming on the surface of the resin molded body. 2. The surface according to claim 1, wherein the surface free energy of the resin molding after radiating a flame of a fuel gas containing an alkylsilane compound and / or an alkoxysilane compound to the surface is 30 to 80 mJ / cm ^2. Modification method. Organosilane is represented by the following general formula (1)

(Wherein X is the same or different when two are present, R ¹ is the same or different, and represents a linear or branched alkyl group having 1 to 8 carbon atoms which may have an ether bond or an ester bond. And R ² and R ³ are the same or different and each represents a linear or branched alkyl group having 1 to 10 carbon atoms, a is an integer of 0 to 3, and b is an integer of 0 to 3.
Wherein X is a vinyl group, an epoxy group, an acryloxy group, a methacryloxy group, a styryl group, an amino group, a mercapto group, a perfluoroalkyl group, a ureido group, a chloroalkyl group, an isocyanate group, an acetoxy group, or a phenyl group. The surface modification method according to claim 1, wherein the surface modification method is at least one alkoxysilane selected from the group consisting of: The resin molding by which the surface was modified by the method of any one of Claims 1-3. A resin molded body comprising a resin layer comprising a resin composition comprising a compound having a reactive group capable of reacting with a reactive group present on the surface of the resin molded body on the resin molded body according to claim 4.

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