JP2006187799A5 - - Google Patents
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- Publication number
- JP2006187799A5 JP2006187799A5 JP2005003034A JP2005003034A JP2006187799A5 JP 2006187799 A5 JP2006187799 A5 JP 2006187799A5 JP 2005003034 A JP2005003034 A JP 2005003034A JP 2005003034 A JP2005003034 A JP 2005003034A JP 2006187799 A5 JP2006187799 A5 JP 2006187799A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005003034A JP4711394B2 (ja) | 2005-01-07 | 2005-01-07 | 電子ビーム照射表面改質加工装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005003034A JP4711394B2 (ja) | 2005-01-07 | 2005-01-07 | 電子ビーム照射表面改質加工装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006187799A JP2006187799A (ja) | 2006-07-20 |
| JP2006187799A5 true JP2006187799A5 (enExample) | 2008-02-14 |
| JP4711394B2 JP4711394B2 (ja) | 2011-06-29 |
Family
ID=36795447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005003034A Expired - Fee Related JP4711394B2 (ja) | 2005-01-07 | 2005-01-07 | 電子ビーム照射表面改質加工装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4711394B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5187876B2 (ja) * | 2006-10-26 | 2013-04-24 | 株式会社ソディック | 電子ビーム照射表面改質装置 |
| JP5112103B2 (ja) * | 2008-02-14 | 2013-01-09 | 株式会社東芝 | 蒸気タービン翼およびその表面改質方法 |
| JP5656774B2 (ja) * | 2011-08-30 | 2015-01-21 | 株式会社ソディック | 金属表面改質方法 |
| US10384299B2 (en) * | 2013-06-26 | 2019-08-20 | Apple Inc. | Electron beam conditioning |
| CN110560874A (zh) * | 2019-07-25 | 2019-12-13 | 沈阳富创精密设备有限公司 | 一种adc12铝合金真空电子束焊接方法 |
| CN110560867A (zh) * | 2019-07-25 | 2019-12-13 | 沈阳富创精密设备有限公司 | 一种铝合金水冷接头真空电子束焊接方法 |
| JP6744694B1 (ja) * | 2019-12-03 | 2020-08-19 | 株式会社ソディック | 表面改質装置および表面改質方法 |
| CN111180299B (zh) * | 2020-03-31 | 2024-11-26 | 陕西中控微脉智能科技有限公司 | 一种材料表面处理装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0613299A (ja) * | 1992-06-25 | 1994-01-21 | Hitachi Ltd | 電子ビーム描画方法およびその描画装置 |
| JPH08247909A (ja) * | 1995-03-15 | 1996-09-27 | Nikon Corp | Ｘ線顕微鏡用試料カプセルおよびその温度制御装置 |
| JP2002075261A (ja) * | 2000-09-05 | 2002-03-15 | Canon Inc | エミッション顕微鏡およびその分析方法 |
| US6863531B2 (en) * | 2001-06-28 | 2005-03-08 | Itac Ltd. | Surface modification process on metal dentures, products produced thereby, and the incorporated system thereof |
| JP2004001086A (ja) * | 2002-04-01 | 2004-01-08 | Nagata Seiki Co Ltd | 電子ビーム照射による金型の表面処理方法と処理された金型 |
-
2005
- 2005-01-07 JP JP2005003034A patent/JP4711394B2/ja not_active Expired - Fee Related
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