JP2006170712A - Inspection device of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection device of a semiconductor device capable of reducing the work mistake due to an inspector. <P>SOLUTION: The inspection device of the semiconductor device is equipped with a microscope 5, which is equipped with a mounting part 9 having the semiconductor device being an inspection target mounted thereon, and a stabilizing member 11 arranged adjacent to the microscope 5 and constituted so as to stabilize the position of the hand 15 of the inspector who inspects the semiconductor device mounted on the mounting part 9. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a semiconductor device inspection apparatus.

  When manually removing an element with an appearance problem during a microscopic appearance inspection of a semiconductor element, place the element on an adhesive sheet and remove the element with tweezers within its field of view while inspecting the element with a microscope. Is common. At this time, the examiner lifts his hand in the air so that the hand holding the tweezers does not touch the element, but the examiner's eyes are on the eyepiece of the microscope, so how much of the examiner's hand is to the element I can't check if I'm away.

  For this reason, an error may occur in the control of the hand due to fatigue or the like during the inspection, and the hand may inadvertently touch the element on the sheet. When a hand touches the element, oil or sweat adhering to the hand may adhere to the element and adversely affect the element.

  The present invention has been made in view of such circumstances, and provides a semiconductor element inspection apparatus capable of reducing work errors by an inspector.

  A semiconductor element inspection apparatus according to the present invention includes a microscope including a placement unit for placing a semiconductor element to be inspected, and a semiconductor element placed adjacent to the microscope and placed on the placement unit. And a stabilizing member configured to stabilize the position of the hand of the inspector.

  According to the present invention, since the stabilizing member configured to stabilize the position of the hand of the inspector performing the inspection of the semiconductor element is disposed adjacent to the microscope, the inspector Work can be done with the hand on top, and work can be performed stably. In addition, since the position of the inspector's hand is stabilized, the frequency of causing an operation error such that the inspector inadvertently touches the element can be reduced. Furthermore, since the tension of the inspector is eased, the fatigue of the inspector can be reduced, and as a result, the inspection efficiency and accuracy can be improved.

1. Semiconductor element inspection apparatus The semiconductor element inspection apparatus of the present invention includes a microscope having a placement portion for placing a semiconductor element to be inspected, and a semiconductor placed adjacent to the microscope and placed on the placement portion. And a stabilizing member configured to stabilize the position of an inspector's hand for inspecting the element.

1-1. Microscopes As the microscope, various microscopes generally used for inspection of semiconductor elements can be used. The microscope includes a placement unit for placing a semiconductor element to be inspected. This placement section is preferably configured so that a plurality of semiconductor elements can be arranged and placed. In this case, there is an advantage that many devices can be inspected at a time. The “semiconductor element” is a light emitting diode, a semiconductor laser, or the like.

1-2. Stabilizing member The stabilizing member is placed adjacent to the microscope. The stabilization member may be separated from the microscope or connected to the microscope. The stabilizing member includes various members having a function of stabilizing the position of the examiner's hand.
One embodiment of the stabilizing member is a pedestal. The surface of the table is preferably configured so that friction with the hand of the inspector is reduced. In this case, the inspector can place the hand on the table and inspect the semiconductor element while sliding the hand on the surface of the table. The platform may be plate-shaped or block-shaped. The table may be provided with a leg on the lower surface, and the upper surface of the table may be at a height similar to that of the microscope mounting portion.

  Another embodiment of the stabilizing member comprises a pedestal and a pedestal for placing a hand configured to be movable relative to the pedestal. In this case, since the platform for placing the hand is movable relative to the pedestal, the hand can be moved freely with the hand placed on the platform. The base and pedestal may be plate-shaped or block-shaped. The platform is preferably movable back and forth and from side to side with respect to the base. This is because the hand placed on the table can be moved freely as long as it can move back and forth and right and left. Further, the base is preferably connected to the base by a spring. In this case, since the inspector can move his / her hand in an arbitrary direction, the work freedom is very high, and the inspection efficiency is improved.

  Moreover, it is preferable that the apparatus of the present invention further includes an elastic member that applies an upward tensile force to the hand of the inspector. In this case, the hand of the inspector can be moved very easily because the inspector's hand is lightly lifted while being placed on a stabilizing member (such as a table).

  Moreover, it is preferable that the apparatus of this invention is further equipped with the intake type cylinder which can attract | suck a semiconductor element. The inspector can remove the defective semiconductor elements using tweezers or the like, but it is necessary to move the elements one by one outside the field of view of the microscope, which takes time, but the inhalation type provided in the apparatus of the present invention. When a cylinder is used, defective semiconductor elements can be removed continuously, so that work efficiency is good.

2. Semiconductor element inspection method The semiconductor element inspection method of the present invention is a semiconductor element inspection method using the inspection apparatus described above, wherein a semiconductor element to be inspected is placed on a placement portion, and a stabilizing member is used. A step of removing a defective semiconductor element in a state where the hand of the inspector is stabilized.

  The above description of the semiconductor element of the present invention also applies to its manufacturing method unless it is contrary to its spirit. Further, according to the method of the present invention, it is possible to inspect semiconductor elements stably and remove defective semiconductor elements.

  As a semiconductor element to be inspected, a light emitting diode wafer (hereinafter referred to as a wafer) 1 having a diameter of about 50 mm is divided into elements on an adhesive sheet 3, and then the sheet is stretched to create a distance between the elements, and to provide a chip area. The one expanded from the initial 50 mm diameter to the 80 mm diameter region is used (see FIG. 1). The microscope 5 to be used is an optical type, and a microscope that adjusts the focus by moving the objective lens 7 up and down (that is, without moving the platform up and down) is used. The pressure-sensitive adhesive sheet 3 on which the element is placed is placed on a mounting table 9 and is arranged so that the element enters the field of view of the microscope 5 (see FIG. 2).

Hereinafter, a case of a right-handed inspector will be described as an example.
The right side of the plate 11 having a size of 200 mm in width and 100 mm in depth is placed on a guide 13 that moves linearly in the front-rear and left-right directions, and the left side of the plate 11 is arranged in a space near the upper surface of the stage 9 of the microscope 5 (see FIG. 3).

  Hold the intake cylinder 17 with the right hand 15 and place that hand on the left side of the plate 11. The intake cylinder 17 has the configuration shown in FIG. 4, and the element sucked by the suction port 19 collides with the filter 21 and is stored in the element reservoir 23. The element suction force is given by a vacuum pump connected to one end 25.

  The tip of the suction port 19 of the cylinder 17 is brought into the field of view of the microscope 5. In this state, the suction port 19 is applied to the element that needs to be removed, and the element is sucked into the cylinder. When it is necessary to apply the suction port to other elements in the field of view, the plate 11 is moved linearly by moving the right hand back and forth, and left and right, and the suction port 19 is brought on the desired element, and the element is moved. Suction.

It is a top view which shows the state which mounted the semiconductor element on the adhesive sheet. It is a side view which shows the state which put the adhesive sheet which mounted the semiconductor element on the mounting base of a microscope. It is a perspective view which shows the state which is test | inspecting a semiconductor element. It is sectional drawing which shows the structure of an intake type cylinder.

Explanation of symbols

1: Wafer 3: Adhesive Sheet 5: Microscope 7: Objective Lens 9: Platform 11: Plate Guide 15: Right Hand 17: Intake Type Cylinder 19: Suction Port 21: Filter 23: Element Pool 25: One End

Claims (9)

A microscope including a placement unit for placing a semiconductor element to be inspected;
And a stabilizing member arranged adjacent to the microscope and configured to stabilize the position of an inspector's hand for inspecting the semiconductor element placed on the mounting portion. Inspection equipment. The apparatus according to claim 1, wherein the placement unit is configured to be able to place a plurality of semiconductor elements in an array. The apparatus of claim 1, wherein the stabilizing member comprises a pedestal and a pedestal for placing a hand configured to be movable relative to the pedestal. The apparatus according to claim 3, wherein the base is movable back and forth and right and left with respect to the pedestal. The apparatus according to claim 1, wherein the base is connected to the base by a spring. The apparatus according to claim 1, further comprising an elastic member that applies an upward tensile force to an examiner's hand. The apparatus according to claim 1, further comprising an intake cylinder capable of sucking the semiconductor element. A method for inspecting a semiconductor element using the inspection apparatus according to claim 1,
Place the semiconductor element to be inspected on the placement part,
A method for inspecting a semiconductor element comprising a step of removing a defective semiconductor element in a state where an inspector's hand is stabilized by a stabilizing member. The method of claim 8, wherein the semiconductor element comprises a light emitting diode.

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