JP2006165491A5 - - Google Patents

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Publication number
JP2006165491A5
JP2006165491A5 JP2005093923A JP2005093923A JP2006165491A5 JP 2006165491 A5 JP2006165491 A5 JP 2006165491A5 JP 2005093923 A JP2005093923 A JP 2005093923A JP 2005093923 A JP2005093923 A JP 2005093923A JP 2006165491 A5 JP2006165491 A5 JP 2006165491A5
Authority
JP
Japan
Prior art keywords
side wall
wall
recess
metal material
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005093923A
Other languages
English (en)
Japanese (ja)
Other versions
JP4802533B2 (ja
JP2006165491A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005093923A priority Critical patent/JP4802533B2/ja
Priority claimed from JP2005093923A external-priority patent/JP4802533B2/ja
Priority to US11/270,495 priority patent/US7462928B2/en
Publication of JP2006165491A publication Critical patent/JP2006165491A/ja
Publication of JP2006165491A5 publication Critical patent/JP2006165491A5/ja
Application granted granted Critical
Publication of JP4802533B2 publication Critical patent/JP4802533B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005093923A 2004-11-12 2005-03-29 半導体装置 Expired - Fee Related JP4802533B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005093923A JP4802533B2 (ja) 2004-11-12 2005-03-29 半導体装置
US11/270,495 US7462928B2 (en) 2004-11-12 2005-11-10 Semiconductor apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004328319 2004-11-12
JP2004328319 2004-11-12
JP2005093923A JP4802533B2 (ja) 2004-11-12 2005-03-29 半導体装置

Publications (3)

Publication Number Publication Date
JP2006165491A JP2006165491A (ja) 2006-06-22
JP2006165491A5 true JP2006165491A5 (enExample) 2008-04-24
JP4802533B2 JP4802533B2 (ja) 2011-10-26

Family

ID=36385381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005093923A Expired - Fee Related JP4802533B2 (ja) 2004-11-12 2005-03-29 半導体装置

Country Status (2)

Country Link
US (1) US7462928B2 (enExample)
JP (1) JP4802533B2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7915085B2 (en) * 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
JP2007317753A (ja) * 2006-05-24 2007-12-06 Matsushita Electric Ind Co Ltd 半導体装置および半導体装置の製造方法、光ピックアップ装置および光ディスクドライブ装置
US8425271B2 (en) * 2006-09-01 2013-04-23 Cree, Inc. Phosphor position in light emitting diodes
US7910938B2 (en) * 2006-09-01 2011-03-22 Cree, Inc. Encapsulant profile for light emitting diodes
JP4858032B2 (ja) * 2006-09-15 2012-01-18 日亜化学工業株式会社 発光装置
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
EP2191517B1 (en) * 2007-08-31 2017-11-29 LG Innotek Co., Ltd. Light emitting device package
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8878219B2 (en) * 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
JP5344179B2 (ja) * 2008-01-29 2013-11-20 株式会社村田製作所 チップ型ｐｔｃサーミスタ
DE102009037732A1 (de) * 2009-08-17 2011-02-24 Osram Gesellschaft mit beschränkter Haftung Konversions-LED mit hoher Effizienz
KR101641860B1 (ko) * 2010-05-12 2016-07-29 엘지이노텍 주식회사 발광소자 어레이, 조명장치 및 백라이트 장치
TW201144410A (en) * 2010-06-03 2011-12-16 qi-rui Cai Warm white light emitting diode and lutetium-based phosphor powder thereof
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
KR20130022052A (ko) * 2011-08-24 2013-03-06 엘지이노텍 주식회사 발광소자 패키지 및 조명 장치
TWI619208B (zh) * 2014-03-31 2018-03-21 菱生精密工業股份有限公司 具聚光結構之光學模組的封裝方法
JP6493348B2 (ja) * 2016-09-30 2019-04-03 日亜化学工業株式会社 発光装置
KR102399464B1 (ko) * 2017-06-27 2022-05-19 주식회사 루멘스 엘이디 패널
JP7021937B2 (ja) * 2017-12-26 2022-02-17 京セラ株式会社 電子部品搭載用パッケージ、電子装置および電子モジュール

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3974002A (en) * 1974-06-10 1976-08-10 Bell Telephone Laboratories, Incorporated MBE growth: gettering contaminants and fabricating heterostructure junction lasers
JP3168901B2 (ja) * 1996-02-22 2001-05-21 株式会社日立製作所 パワー半導体モジュール
JP3316838B2 (ja) * 1997-01-31 2002-08-19 日亜化学工業株式会社 発光装置
JP3228321B2 (ja) 1997-08-29 2001-11-12 日亜化学工業株式会社 チップタイプｌｅｄ
JP2000294831A (ja) * 1999-04-08 2000-10-20 Omron Corp 半導体発光装置、半導体発光装置アレイ、フォトセンサおよびフォトセンサアレイ
TW517228B (en) * 2000-10-13 2003-01-11 Teac Corp Loading device for recording medium
JP4407204B2 (ja) * 2002-08-30 2010-02-03 日亜化学工業株式会社 発光装置
JP2004207672A (ja) 2002-10-28 2004-07-22 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2004228549A (ja) * 2002-11-25 2004-08-12 Kyocera Corp 発光素子収納用パッケージおよび発光装置

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