JP2006165156A - Thermally conductive sheet - Google Patents

Thermally conductive sheet Download PDF

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Publication number
JP2006165156A
JP2006165156A JP2004352421A JP2004352421A JP2006165156A JP 2006165156 A JP2006165156 A JP 2006165156A JP 2004352421 A JP2004352421 A JP 2004352421A JP 2004352421 A JP2004352421 A JP 2004352421A JP 2006165156 A JP2006165156 A JP 2006165156A
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Japan
Prior art keywords
sheet
heat
conductive sheet
thermally conductive
insulating
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Pending
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JP2004352421A
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Japanese (ja)
Inventor
Kazuhiko Kubo
和彦 久保
Norihiro Kawamura
典裕 河村
Etsuro Habata
悦朗 幅田
Masashi Senba
正志 船場
Yoshikazu Hori
義和 堀
Minoru Ouchi
実 大内
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2004352421A priority Critical patent/JP2006165156A/en
Publication of JP2006165156A publication Critical patent/JP2006165156A/en
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To improve electric insulating performance in a thermally conductive sheet with respect to the thermally conductive sheet to be used for heat dissipation countermeasures of a heat-generating electronic component such as an LSI. <P>SOLUTION: The thermally conductive sheet 1 has a configuration in which a plurality of small pieces 6 having different sizes and made of a graphite sheet are mixed into an insulating sheet 5 made of a resin. Thus, since the small pieces of graphite sheet are each independently disposed in the insulating sheet, the electric insulating performance can be ensured while utilizing high thermally conductive performance of the graphite sheet. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明はLSIなどの発熱電子部品の放熱対策に用いられる熱伝導シートに関する。   The present invention relates to a heat conductive sheet used as a heat dissipation measure for heat generating electronic components such as LSI.

一般にハードディスクに用いられるLSIやパワーアンプに用いられるICなどの発熱電子部品はその温度上昇に伴いそれらを用いた製品に対して悪影響を及ぼしてしまうため、その放熱対策として発熱電子部品とそのヒートシンクとなる部材との間に熱伝導シートが設けられている。   Generally, heat generating electronic components such as LSIs used in hard disks and ICs used in power amplifiers have an adverse effect on products using them as the temperature rises. The heat conductive sheet is provided between the members.

よって、この熱伝導シートには、発熱電子部品より局所的に発せられる熱を効率よく広範囲に分散させることが要求され、従来このような効果を有するものとして炭素を2次元的に結合させ熱伝導性を高めたグラファイトシートが用いられていた。   Therefore, this heat conduction sheet is required to disperse the heat generated locally from the heat-generating electronic component efficiently and over a wide range. Conventionally, carbon having two-dimensional bonding is considered to have such an effect and heat conduction. A graphite sheet with improved properties was used.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献1が知られている。
特開平10−330177号公報
As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent Laid-Open No. 10-3301177

しかしながら、グラファイトシートは炭素を2次元的に結合させた構造であるため、電気絶縁性が低く、発熱電子部品やその周辺において電気回路を形成する電子部品に対しては電気的に干渉し易いという問題があった。   However, since the graphite sheet has a structure in which carbon is two-dimensionally bonded, its electrical insulation is low, and it easily interferes electrically with heat-generating electronic components and electronic components that form an electric circuit in the vicinity thereof. There was a problem.

そこで、本発明はこのような問題を解決し、熱伝導シートにおける電気絶縁性を高めることを目的とする。   Then, this invention aims at solving such a problem and improving the electrical insulation in a heat conductive sheet.

そして、この目的を達成するために本発明は、特に熱伝導シートを樹脂からなる絶縁シート内にグラファイトシートからなる大きさの異なる複数の小片を混入した構成としたのである。   In order to achieve this object, in the present invention, in particular, the heat conductive sheet is configured such that a plurality of small pieces made of graphite sheets are mixed in an insulating sheet made of resin.

この構成によれば、グラファイトシートが持つ高い熱伝導性を活用しながら、絶縁シート内で個々のグラファイトシートの小片が独立配置されるので電気絶縁性をも確保できるのである。   According to this configuration, while utilizing the high thermal conductivity of the graphite sheet, the individual graphite sheet pieces are independently arranged in the insulating sheet, so that electrical insulation can be secured.

以下、本発明の一実施形態について図を用いながら説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図1は本発明の熱伝導シート1の断面を示したもので、図2に示されるようにLSIやパワーアンプに用いられるICなどの発熱電子部品2と、そのヒートシンクとなる放熱部材3との間に設けられ、発熱電子部品2から局所的に生じた熱を素早く熱伝導シート1の面内領域に拡散させながら放熱部材3に熱伝達することで放熱効果を高めるものである。   FIG. 1 shows a cross section of a heat conductive sheet 1 according to the present invention. As shown in FIG. 2, a heat generating electronic component 2 such as an IC used in an LSI or a power amplifier and a heat radiating member 3 serving as a heat sink are shown. The heat dissipation effect is enhanced by transferring heat to the heat radiating member 3 while quickly diffusing the heat generated locally from the heat generating electronic component 2 to the in-plane region of the heat conductive sheet 1.

また、このような発熱電子部品2を要する電子機器の中でも携帯電話やノート型パソコンといったモバイル型の電子機器においては、ハードディスクの高性能化や液晶モニタの大型化、機器自体の小型低背化が進められる中、発熱電子部品2を含む各種電子部品4の高密度実装化や高速応答化が進み、熱伝導シート1においては高い放熱効果だけではなく、さらに、発熱電子部品2およびその周囲の電子部品4に対する電気的な干渉を防止する高い電気絶縁性が求められている。   Among such electronic devices that require the heat generating electronic component 2, in mobile electronic devices such as mobile phones and laptop computers, the performance of the hard disk, the size of the liquid crystal monitor, and the size and height of the device itself are reduced. While being advanced, high-density mounting and high-speed response of various electronic components 4 including the heat-generating electronic component 2 have progressed, and the heat conducting sheet 1 has not only a high heat dissipation effect, but also the heat-generating electronic component 2 and the surrounding electrons. High electrical insulation properties that prevent electrical interference with the component 4 are required.

そこで、本実施形態における熱伝導シート1は図1に示されるように、シリコンなどの絶縁性樹脂からなる絶縁シート5の内部にグラファイトシートの小片6が複数混入された構造とし、発熱電子部品2から放熱部材3に至る熱伝導性及び発熱電子部品2及びその周囲の電子部品4に対する電気絶縁性を両立している。なお、グラファイトシートはポリイミド等の有機樹脂シートを1200度以上の温度で炭化させ、その後、2600度以上の温度でグラファイト化し、図3に示されるよう炭素が2次元的に密に結合した炭素数の多層構造体であり、炭素の結合面内において高い熱伝導特性を示すものである。   Therefore, as shown in FIG. 1, the heat conductive sheet 1 in this embodiment has a structure in which a plurality of pieces of graphite sheet 6 are mixed inside an insulating sheet 5 made of an insulating resin such as silicon, and the heat generating electronic component 2. The heat conductivity from the heat dissipation member 3 to the heat dissipating member 3 and the electrical insulation of the heat generating electronic component 2 and the surrounding electronic component 4 are compatible. The graphite sheet is obtained by carbonizing an organic resin sheet such as polyimide at a temperature of 1200 ° C. or higher, and then graphitizing at a temperature of 2600 ° C. or higher. As shown in FIG. A multi-layered structure having high thermal conductivity in the carbon bonding plane.

すなわち、熱伝導シート1を図1に示すような構成とすることにより、グラファイトシートからなる小片6が絶縁シート5を形成する絶縁性樹脂で覆われた構造となり、それぞれの作用である高い熱伝導性と高い電気的絶縁性を兼ね備えた構造となり、さらに絶縁シート5内に混入されるグラファイトシートが小片化されたものであることから、それぞれの小片6においては電気導通性を有するものであるが個々の小片6が絶縁シート5を形成する絶縁性樹脂により分離され独立するのでより高い電気的絶縁性が確保された構造となっている。   That is, by configuring the heat conductive sheet 1 as shown in FIG. 1, a small piece 6 made of a graphite sheet is covered with an insulating resin that forms the insulating sheet 5, and high heat conduction that is a function of each is obtained. However, since the graphite sheet mixed into the insulating sheet 5 is fragmented, each small piece 6 has electrical conductivity. Since the individual small pieces 6 are separated by the insulating resin forming the insulating sheet 5 and are independent, the structure has a higher electrical insulating property.

なお、熱伝導シート1において電気絶縁性を確保するということであれば、絶縁シート5にグラファイトシートからなる小片6を混入する構成の他に、絶縁シート5に対して天然グラファイトやセラミクスなど熱伝導性の高い粉体或いは粒体を混入させる構成が考えられるが、絶縁シート5に粉体や粒体を混入した場合、確かに粉体や粒体はそれ自体で熱伝導性を有したものとなるが、熱伝導シート1内において個々の粉体或いは粒体が絶縁シート5を形成する絶縁性樹脂によって独立した状態となることから、熱伝導シート1の面内方向における熱伝達が鈍くなってしまう。   In addition, in order to ensure electrical insulation in the heat conductive sheet 1, in addition to the configuration in which small pieces 6 made of a graphite sheet are mixed in the insulating sheet 5, heat conduction such as natural graphite and ceramics is performed on the insulating sheet 5. It is conceivable that a highly powdery or granular material is mixed, but when the insulating sheet 5 is mixed with a powdery or granular material, the powdery or granular material itself has thermal conductivity by itself. However, since the individual powders or granules in the heat conductive sheet 1 become independent by the insulating resin forming the insulating sheet 5, heat transfer in the in-plane direction of the heat conductive sheet 1 becomes dull. End up.

これに対して、絶縁シート5にグラファイトシートの小片6を混入した場合は、小片6自体が2次元的な広がりを持ちその範囲内での熱伝導効果を有するものとなることから、粉体や粒体を混入したものに比べて高い熱伝導性を得ることが出来るのである。   On the other hand, when the graphite sheet small piece 6 is mixed in the insulating sheet 5, the small piece 6 itself has a two-dimensional expanse and has a heat conduction effect within the range. High thermal conductivity can be obtained as compared with a mixture containing particles.

また、絶縁シート5内に混入するグラファイトシートからなる複数の小片6の大きさを異ならせることで、大きな小片6の間に小さな小片6を介在させることができ、熱伝導シート1内におけるグラファイトシートからなる複数の小片6の分布密度を上げることになり、熱伝導シート1の熱伝導性を高められるのである。   Further, the small pieces 6 can be interposed between the large pieces 6 by making the sizes of the plurality of pieces 6 made of the graphite sheet mixed in the insulating sheet 5 different, and the graphite sheet in the heat conductive sheet 1 can be interposed. Thus, the distribution density of the plurality of small pieces 6 is increased, and the thermal conductivity of the heat conductive sheet 1 can be increased.

本発明は、熱伝導シートに関し、高い熱伝導性および電気絶縁性を確保できるという効果を有し、特に発熱電子部品を要する電子機器に有用である。   The present invention relates to a heat conductive sheet, has an effect of ensuring high heat conductivity and electrical insulation, and is particularly useful for an electronic device that requires a heat generating electronic component.

本発明の一実施形態における熱伝導シートの断面図Sectional drawing of the heat conductive sheet in one Embodiment of this invention 同熱伝導シートを用いた電子機器を模式的に示した図The figure which showed the electronic equipment using the heat conduction sheet typically 同熱伝導シートに用いられるグラファイトシートの模式図Schematic diagram of the graphite sheet used for the heat conductive sheet

符号の説明Explanation of symbols

1 熱伝導シート
5 絶縁シート
6 小片
1 Thermal conductive sheet 5 Insulating sheet 6 Small piece

Claims (1)

樹脂からなる絶縁シート内にグラファイトシートからなる大きさの異なる複数の小片を混入したことを特徴とする熱伝導シート。 A heat conducting sheet comprising a plurality of small pieces of graphite sheets mixed in an insulating sheet made of resin.
JP2004352421A 2004-12-06 2004-12-06 Thermally conductive sheet Pending JP2006165156A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004352421A JP2006165156A (en) 2004-12-06 2004-12-06 Thermally conductive sheet

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JP2004352421A JP2006165156A (en) 2004-12-06 2004-12-06 Thermally conductive sheet

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014183257A (en) * 2013-03-21 2014-09-29 Stanley Electric Co Ltd Thermal interface material and its manufacturing method, and heat dissipation device
JP2014183261A (en) * 2013-03-21 2014-09-29 Stanley Electric Co Ltd Thermal interface material and its manufacturing method, and heat dissipation device
JP2014183284A (en) * 2013-03-21 2014-09-29 Stanley Electric Co Ltd Heat dissipation device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014183257A (en) * 2013-03-21 2014-09-29 Stanley Electric Co Ltd Thermal interface material and its manufacturing method, and heat dissipation device
JP2014183261A (en) * 2013-03-21 2014-09-29 Stanley Electric Co Ltd Thermal interface material and its manufacturing method, and heat dissipation device
JP2014183284A (en) * 2013-03-21 2014-09-29 Stanley Electric Co Ltd Heat dissipation device

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