JP2006165147A - Printed circuit board - Google Patents

Printed circuit board Download PDF

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Publication number
JP2006165147A
JP2006165147A JP2004352382A JP2004352382A JP2006165147A JP 2006165147 A JP2006165147 A JP 2006165147A JP 2004352382 A JP2004352382 A JP 2004352382A JP 2004352382 A JP2004352382 A JP 2004352382A JP 2006165147 A JP2006165147 A JP 2006165147A
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Japan
Prior art keywords
mounting
circuit board
printed circuit
silk
terminals
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Pending
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JP2004352382A
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Japanese (ja)
Inventor
Fumiaki Ikeda
史亮 池田
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Yaskawa Electric Corp
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Yaskawa Electric Corp
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Publication date
Application filed by Yaskawa Electric Corp filed Critical Yaskawa Electric Corp
Priority to JP2004352382A priority Critical patent/JP2006165147A/en
Publication of JP2006165147A publication Critical patent/JP2006165147A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed circuit board capable of positioning plate mounting parts on the level for every terminal while preventing the solder bridge between the terminals of plate mounting parts. <P>SOLUTION: A printed circuit board 1 comprises a mounting land 5 provided on the surface, plate mounting parts 3 with which terminals 4 are placed and soldered on the mounting land 5, and a silk 2 printed on the surface. The silk 2 is printed between the mounting lands 5 wherein the terminals 4 of the plate mounting parts 3 are placed. The silk 2 between the mounting lands 5 serves as the solder outflow prevention wall when soldering the terminals 4 to the mounting lands 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、面実装部品を実装するプリント基板に関する。   The present invention relates to a printed circuit board on which a surface mounting component is mounted.

図３は、従来のプリント基板の側断面図である。
図において、１はプリント基板、２は前記プリント基板上に配置したシルクで、面実装部品３の位置決め枠を形成している。４は前記面実装部品３の端子、５は前記面実装部品３を実装するためのプリント基板１上に設けられた実装用ランドである。
面実装部品３をプリント基板１上に実装する場合は、まず、前記面実装部品３を、面実装部品３の外形を模したシルク２で形成した位置決め枠に沿って位置決めをするとともに、前記端子４を前記実装用ランド５上に載置し、その後、面実装部品３の端子４と実装用ランド５を半田付けすることにより行う。
このように、従来のプリント基板は、シルク２を位置決め枠として面実装部品３を位置決め枠に挿入し半田付けするようにしている（例えば、特許文献１）。
特開平５−１６７２９６号公報 FIG. 3 is a side sectional view of a conventional printed circuit board.
In the figure, reference numeral 1 denotes a printed circuit board, and reference numeral 2 denotes silk arranged on the printed circuit board, which forms a positioning frame for the surface mount component 3. Reference numeral 4 denotes a terminal of the surface mount component 3, and 5 denotes a mounting land provided on the printed circuit board 1 for mounting the surface mount component 3.
When mounting the surface mount component 3 on the printed circuit board 1, first, the surface mount component 3 is positioned along a positioning frame formed of silk 2 simulating the outer shape of the surface mount component 3, and the terminal 4 is placed on the mounting land 5, and then the terminals 4 of the surface mount component 3 and the mounting land 5 are soldered.
Thus, the conventional printed circuit board inserts the surface mounting component 3 into the positioning frame using the silk 2 as a positioning frame and solders it (for example, Patent Document 1).
JP-A-5-167296

しかしながら、従来のプリント基板には、次のような問題があった。
（１）面実装部品の外形枠がシルクで模した位置決め枠となっているため、面実装部品の端子が端子ごとに独立できず、端子のピッチが狭い面実装部品では、図４に示すように、半田の量が多いと半田が実装用ランドから流出し、隣接する端子の間が半田ブリッジを起こす。
（２）端子数の多い面実装部品の実装の場合、位置決め枠が大きくなり、位置決め精度が低下する。
本発明は、このような問題点に鑑みてなされたものであり、面実装部品の端子間の半田ブリッジを防止するとともに、端子ごとのレベルで面実装部品の位置決めをすることができるプリント基板を提供することを目的とする。 However, the conventional printed circuit board has the following problems.
(1) Since the outer frame of the surface mount component is a positioning frame imitating silk, the terminals of the surface mount component cannot be independent for each terminal, and the surface mount component with a narrow terminal pitch is as shown in FIG. In addition, when the amount of solder is large, the solder flows out of the mounting land, and a solder bridge is generated between adjacent terminals.
(2) In the case of mounting a surface mount component with a large number of terminals, the positioning frame becomes large, and the positioning accuracy decreases.
The present invention has been made in view of such problems, and a printed circuit board capable of preventing the solder bridge between terminals of the surface mount component and positioning the surface mount component at a level for each terminal. The purpose is to provide.

上記問題を解決するため、本発明は、面上に設けられた実装用ランドと、端子が前記実装用ランド上に載置されて半田付けされる面実装部品と、面上に印刷されたシルクとを有するプリント基板において、前記面実装部品の端子が載置される実装用ランド間に、シルクを印刷するようにしたものである。   In order to solve the above problems, the present invention provides a mounting land provided on a surface, a surface-mounted component on which a terminal is placed and soldered on the mounting land, and a silk printed on the surface. In the printed board having the above, silk is printed between the mounting lands on which the terminals of the surface mount component are placed.

本発明によれば、面実装部品の端子間の半田流出を防止することができ、半田ブリッジを防止することができる。   According to the present invention, it is possible to prevent the solder from flowing out between the terminals of the surface mount component, and it is possible to prevent the solder bridge.

以下、本発明の実施例を図に基づいて説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図１は、本発明の実施例におけるプリント基板の側断面図、図２は、本発明のプリント基板の半田付け状態を示す要部の断面図である。
図において、１はプリント基板、２はプリント基板上に配置したシルクで、面実装部品３の位置決め枠を形成する。４は面実装部品３の端子、５は面実装部品３を実装するためのプリント基板１上に設けられた実装用ランドである。
本発明が従来技術と異なる部分は、面実装部品３の端子４が載置される実装用ランド５間にシルクが印刷されている点である。
前記実装用ランド５間のシルク２は、前記端子４を実装用ランド５に半田付けする際の半田流出防止壁の役目をしている。
以下、本発明の面実装部品のプリント基板への実装について説明する。
面実装部品３のプリント基板１への実装は、従来技術と同様に、実装用ランド５上に載置した面実装部品３の端子４と前記実装用ランド５とを半田付けすることにより行う。この場合、半田付けにあたって半田の量が多くても、シルク２が半田流出防止壁となって実装用ランド５から余分な半田の流出を防ぐ。これにより、隣接する端子間の半田ブリッジの形成が防止される。シルク２による半田流出防止壁は、面実装部品３の端子４が載置される実装用ランド５間全てに設けられているため、面実装部品３を端子４毎に位置決めすることができる。
本発明は、このように、シルク印刷で端子ごとのレベルで面実装部品３の位置決めを実施する構成としているので、プリント基板設計段階でシルクデータを作成し、プリント基板設計者の意思通りの位置決めを実施することができる。 FIG. 1 is a side sectional view of a printed circuit board according to an embodiment of the present invention, and FIG. 2 is a sectional view of a main part showing a soldered state of the printed circuit board of the present invention.
In the figure, 1 is a printed circuit board, and 2 is silk arranged on the printed circuit board, and forms a positioning frame for the surface mount component 3. Reference numeral 4 denotes a terminal of the surface mounting component 3, and 5 denotes a mounting land provided on the printed circuit board 1 for mounting the surface mounting component 3.
The present invention is different from the prior art in that silk is printed between the mounting lands 5 on which the terminals 4 of the surface mounting component 3 are placed.
The silk 2 between the mounting lands 5 serves as a solder outflow prevention wall when the terminals 4 are soldered to the mounting lands 5.
Hereinafter, mounting of the surface mount component of the present invention on a printed circuit board will be described.
The surface mounting component 3 is mounted on the printed circuit board 1 by soldering the terminals 4 of the surface mounting component 3 placed on the mounting land 5 and the mounting land 5 in the same manner as in the prior art. In this case, even if the amount of solder is large when soldering, the silk 2 serves as a solder outflow prevention wall to prevent the excess solder from flowing out from the mounting land 5. This prevents the formation of solder bridges between adjacent terminals. Since the solder outflow prevention wall by the silk 2 is provided between all the mounting lands 5 on which the terminals 4 of the surface mounting component 3 are placed, the surface mounting component 3 can be positioned for each terminal 4.
In the present invention, since the surface mounting component 3 is positioned at the level of each terminal by silk printing as described above, silk data is created at the printed circuit board design stage, and the positioning as intended by the printed circuit board designer. Can be implemented.

本発明の実施例を示すプリント基板の側断面図Side sectional view of printed circuit board showing an embodiment of the present invention 本発明の実施例におけるプリント基板の半田付け状態を示す要部の断面図Sectional drawing of the principal part which shows the soldering state of the printed circuit board in the Example of this invention 従来技術におけるプリント基板の側断面図Side sectional view of printed circuit board in the prior art 従来技術におけるプリント基板の半田付け状態を示す要部の断面図Sectional drawing of the principal part which shows the soldering state of the printed circuit board in a prior art

符号の説明Explanation of symbols

１ プリント基板
２ シルク
３ 面実装部品
４ 端子
５ 実装用ランド
６ 半田 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Silk 3 Surface mounting component 4 Terminal 5 Mounting land 6 Solder

Claims (1)

面上に設けられた実装用ランドと、端子が前記実装用ランド上に載置されて半田付けされる面実装部品と、面上に印刷されたシルクとを有するプリント基板において、
前記面実装部品の端子が載置される実装用ランド間に、シルクが印刷されていることを特徴とするプリント基板。 In a printed board having a mounting land provided on a surface, a surface-mounted component on which a terminal is placed and soldered on the mounting land, and a silk printed on the surface,
Silk is printed between mounting lands on which the terminals of the surface mounting component are placed.
JP2004352382A 2004-12-06 2004-12-06 Printed circuit board Pending JP2006165147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004352382A JP2006165147A (en) 2004-12-06 2004-12-06 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004352382A JP2006165147A (en) 2004-12-06 2004-12-06 Printed circuit board

Publications (1)

Publication Number Publication Date
JP2006165147A true JP2006165147A (en) 2006-06-22

Family

ID=36666829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004352382A Pending JP2006165147A (en) 2004-12-06 2004-12-06 Printed circuit board

Country Status (1)

Country Link
JP (1) JP2006165147A (en)

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