JP2006160434A - Non-contact transport apparatus - Google Patents

Non-contact transport apparatus Download PDF

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JP2006160434A
JP2006160434A JP2004352933A JP2004352933A JP2006160434A JP 2006160434 A JP2006160434 A JP 2006160434A JP 2004352933 A JP2004352933 A JP 2004352933A JP 2004352933 A JP2004352933 A JP 2004352933A JP 2006160434 A JP2006160434 A JP 2006160434A
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nozzle
workpiece
chamber
air
contact
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Yoshio Kurihara
良男 栗原
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Nihon Dempa Kogyo Co Ltd
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Nihon Dempa Kogyo Co Ltd
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Priority to JP2004352933A priority Critical patent/JP2006160434A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact transport apparatus, suspending and holding a comparatively small work in the non-contact state. <P>SOLUTION: This non-contact transport apparatus includes: a nozzle 1 having a number of through holes 4 and a center hole 5; a case 2 provided to surround the whole nozzle 1 to form an air chamber 3 around the nozzle; and an auxiliary case 7 provided on the upside of the case 2. The auxiliary case 7 has a chamber 7. The through holes 4 of the nozzle 1 communicate with the air chamber 3 and the space above the work W, and the center hole 5 of the nozzle 1 communicates with the space above the work W and the chamber 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、たとえば、水晶製品などの製造工程において比較的小型のワークを非接触状態で懸垂保持して搬送する非接触搬送装置に関する。   The present invention relates to a non-contact conveying apparatus that suspends and conveys a relatively small work in a non-contact state in a manufacturing process of a crystal product or the like, for example.

水晶ウェハの製造、あるいは水晶振動子などの水晶製品の組立て・検査におけるワークの搬送もしくはハンドリングにおいてウェハやワークに異物が付着してその除去に手間取り、また、ワークに損傷を与えて使用不能に陥ることがある。これは、たとえば、ワークの搬送場面ではワークとそれを掴み取る吸着手段とが直接接触するために吸着手段に付着している異物などがワークに移り、あるいはワークの脱着の際に吸着手段が強くワークと接触してその表面を傷つけることで発生する。   During the transportation or handling of workpieces during the manufacture of quartz wafers or the assembly / inspection of quartz crystal products such as quartz resonators, foreign matter adheres to the wafers and workpieces, and it takes time to remove the workpieces. Sometimes. This is because, for example, when the workpiece is transported, the workpiece and the suction means for picking up the workpiece are in direct contact with each other, so that foreign matter adhering to the suction means moves to the workpiece, or the suction means becomes stronger when the workpiece is detached. Occurs when the surface is damaged by contact with the workpiece.

こうした不具合は、たとえば、作業員がワークの搬送中に十分に注意するように努めても、ワークと吸着手段とが直接接触するので、その発生を抑えることには限界があり、不具合をなくすことは難しい。この対策としてワークに異物を付着させない、また損傷を与えにくい吸着手段に変更することも試みられているが、これまでの対策は幾分の効果はあるものの十分なものが見出されていない。   For example, even if an operator tries to pay sufficient attention while transporting a workpiece, the workpiece and the suction means are in direct contact with each other. Is difficult. Attempts have been made to change the suction means to prevent foreign matter from adhering to the workpiece and to prevent damage, but no countermeasure has been found so far, although some effects have been found.

ところで、半導体の製造工程においては極薄いウェハの搬送またはハンドリングで異物による汚れからウェハを護り、変形や損傷を与える可能性をなくすために非接触搬送装置が用いられる。これは、たとえば、50μmという、極薄いウェハを全く変形させず、また表面を傷つけることなく、搬送するために空中に浮遊した状態で懸垂保持することを可能にしたもので、図4に示すようなフロートチャックと呼ばれる手段でなし遂げられる(非特許文献1参照)。   By the way, in the semiconductor manufacturing process, a non-contact transfer device is used in order to protect the wafer from contamination by foreign matters by transferring or handling an extremely thin wafer and to eliminate the possibility of deformation or damage. This makes it possible to suspend and hold a very thin wafer of 50 μm, for example, in a suspended state in the air for transportation without causing any deformation or damage to the surface, as shown in FIG. This is accomplished by means called a simple float chuck (see Non-Patent Document 1).

すなわち、フロートチャックは搬送されるウェハWaと対峙する作動面Fを有する。空気は中心孔51から流入し、偏向器52で直角に偏向されて装置の外周域に向かって流動する。ウェハWaとの距離が大きいとき、クッション室53は真空室として機能し、内部が負圧状態に保たれ、ウェハWaを吸引する。この吸引でウェハWaとの距離が小さくなると、エアクッション効果でクッション室53内の圧力が急上昇してウェハWaを遠ざける。この平衡が維持された距離でウェハWaを浮遊した非接触状態で懸垂保持することが可能になる。この装置は作動面Fを流れた空気を回収する機構54を備える。   That is, the float chuck has an operating surface F that faces the wafer Wa to be transferred. The air flows from the central hole 51, is deflected at a right angle by the deflector 52, and flows toward the outer peripheral area of the apparatus. When the distance from the wafer Wa is large, the cushion chamber 53 functions as a vacuum chamber, and the inside is maintained in a negative pressure state, and the wafer Wa is sucked. When the distance from the wafer Wa is reduced by this suction, the pressure in the cushion chamber 53 rapidly rises due to the air cushion effect and moves the wafer Wa away. It becomes possible to suspend and hold the wafer Wa in a floating and non-contact state at a distance where this equilibrium is maintained. This apparatus includes a mechanism 54 that collects the air that has flowed through the working surface F.

ちなみに、非接触搬送装置として構成するときは、図5に示すように、このフロートチャックについて、たとえば、4個を同一平面に装着して使用する。
「生産技術技術実用化便覧」初版、株式会社工業調査会、2000年12月25日、p.758−765
Incidentally, when configuring as a non-contact conveying apparatus, as shown in FIG. 5, for example, four of the float chucks are mounted on the same plane and used.
"Handbook of practical application of production technology" first edition, Industrial Research Co., Ltd., December 25, 2000, p. 758-765

近年、水晶振動子など水晶製品の小型化への要求は非常に強くなっており、製造工程で使用される搬送手段もそれに見合って比較的小型のワークを扱うのに有利な形態を備えていなければならない。   In recent years, the demand for miniaturization of crystal products such as crystal units has become very strong, and the transport means used in the manufacturing process must also have an advantageous form for handling relatively small workpieces. I must.

上記の半導体製造工程で多用されるフロートチャックは極薄いウェハに直接空気を吹き出すようにしたとき、垂直方向に働く圧力でウェハが局部的にたわむことで、気流をウェハに直接空気を吹き出すことができず、偏向器で気流の向きをウェハ面にほぼ平行になるように偏向させている。このため、高速気流はウェハには向かわないで、隣接する吸収手段にかけて流れる。   Float chucks often used in the semiconductor manufacturing process described above can blow air directly to the wafer by blowing the air directly onto the extremely thin wafer, by locally bending the wafer with the pressure acting in the vertical direction. However, the deflector deflects the airflow so that it is almost parallel to the wafer surface. For this reason, the high-speed airflow does not go to the wafer but flows to the adjacent absorbing means.

しかしながら、気流制御のために偏向器を複数の吸収手段と共に組み込んだ場合、これらの手段のために装置が複雑化することが避けられず、大きな搬送装置になってしまう。ワークの小型化が進む中で比較的小型の搬送装置で搬送またはハンドリングを担うには大きい装置は不利で、小型化した搬送装置が求められている。   However, when a deflector is incorporated together with a plurality of absorbing means for airflow control, it is inevitable that the apparatus becomes complicated due to these means, resulting in a large conveying apparatus. A large apparatus is disadvantageous in order to carry or handle a relatively small conveying apparatus as the workpiece is miniaturized, and a small conveying apparatus is required.

そこで、本発明の目的は比較的小型のワークを非接触で懸垂保持することを可能にした非接触搬送装置を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide a non-contact conveying apparatus that can suspend and hold a relatively small work in a non-contact manner.

本発明による非接触搬送装置は多数の透孔および中心孔を備えたノズルと、ノズル全体を取り囲みノズルの周りにエアチャンバを形成するように設けられたケースと、ケースの上面に設けられ、チャンバを有する補助ケースとを備え、ノズルの透孔はエアチャンバとワーク上面との間の空間とを連通すると共に、ノズルの中心孔はワーク上面の空間とチャンバとを連通するものである。   A non-contact conveyance device according to the present invention includes a nozzle having a large number of through holes and a center hole, a case that surrounds the entire nozzle and forms an air chamber around the nozzle, and an upper surface of the case. The nozzle through hole communicates with the space between the air chamber and the workpiece upper surface, and the nozzle central hole communicates with the chamber on the workpiece upper surface and the chamber.

上記構成からなる非接触搬送装置においては、図2に示すように、図示しないエアチャンバに流入した空気はノズル1の各透孔4を通って高速気流となってワークWに吹き出し、この高速気流でワークWが浮遊し、ワークWとの距離dが小さくなる。同時に、一部空気は負圧状態にある中心孔5を通ってチャンバ(図示せず)に流れるためにワークWが浮遊状態を保ち続ける。また、一部空気は作動面FとワークWとの間の空間を通り、装置の外周域にかけて流動する。   In the non-contact conveying apparatus having the above-described configuration, as shown in FIG. 2, air flowing into an air chamber (not shown) is blown out to the work W through each through hole 4 of the nozzle 1 as a high-speed air current. As a result, the workpiece W floats and the distance d from the workpiece W decreases. At the same time, part of the air flows through the central hole 5 in a negative pressure state to the chamber (not shown), so that the workpiece W keeps floating. Part of the air flows through the space between the working surface F and the workpiece W and flows toward the outer peripheral area of the apparatus.

中心孔5に向かう流れでワークWが吸引され、作動面FとワークWとの間の距離dが小さくなると、作動面F内側の圧力はに急激に上昇し、ワークWを作動面Fから遠ざける。この平衡が維持された距離でワークWを空中に浮遊した非接触状態で懸垂保持することができる。   When the workpiece W is sucked by the flow toward the center hole 5 and the distance d between the working surface F and the workpiece W becomes small, the pressure inside the working surface F rapidly increases to move the workpiece W away from the working surface F. . The workpiece W can be suspended and held in a non-contact state floating in the air at a distance where this equilibrium is maintained.

このように非接触搬送装置によれば、比較的小型のワークを非接触状態で懸垂保持することが可能で、吸着手段のような直接ワークを保持する手段を用いないでワークを懸垂保持することができる。これにより、搬送またはハンドリングにおいて異物がワークに付着するのを抑制し、また、着脱操作中、ワークに損傷を与えるミスを回避することができる。   As described above, according to the non-contact conveyance device, it is possible to suspend and hold a relatively small work in a non-contact state, and to suspend and hold the work without using a means for directly holding the work such as a suction means. Can do. Thereby, it is possible to prevent foreign matters from adhering to the workpiece during conveyance or handling, and to avoid mistakes that damage the workpiece during the attachment / detachment operation.

本発明による非接触搬送装置の一実施の形態について図面を参照して説明する。図1において、本発明の非接触搬送装置はワークWを懸垂保持するノズル1を有する。ノズル1はノズル全体を取り囲む円筒状のケース2内に収容されており、ケース2と嵌合するノズル上端と下端とは高い気密を保っている。ケース2内部は使用時に空気で満たされるエアチャンバ3として形成される。   An embodiment of a non-contact conveying apparatus according to the present invention will be described with reference to the drawings. In FIG. 1, the non-contact conveying apparatus of the present invention has a nozzle 1 that holds a workpiece W suspended. The nozzle 1 is housed in a cylindrical case 2 that surrounds the entire nozzle, and the upper and lower ends of the nozzle that are fitted to the case 2 are kept highly airtight. The inside of the case 2 is formed as an air chamber 3 that is filled with air during use.

ノズル1には外周に近い箇所に極めて微小な口径の透孔4を多数穿っている。各透孔4はエアチャンバ3とワークW上面の空間とを連通している。このノズル1の軸心に沿って比較的大きい口径の中心孔5を穿っている。本実施の形態のケース2はワークと対向する作動面Fに沿って形成される圧力室6を有する。   The nozzle 1 has a large number of through-holes 4 with extremely small diameters at locations close to the outer periphery. Each through hole 4 communicates the air chamber 3 and the space on the upper surface of the workpiece W. A central hole 5 having a relatively large diameter is formed along the axis of the nozzle 1. The case 2 of the present embodiment has a pressure chamber 6 formed along the working surface F facing the workpiece.

ケース2は上面に円筒状の補助ケース7を備える。この補助ケース7内部は使用時に負圧状態を維持するように高い気密を保つチャンバ8として形成される。補助ケース7とケース2との接触面にはチャンバ8の気密を保持するためのパッキン9が介装される。また、補助ケース7は複数のビス(図示せず)によってケース2に固着される。上記のノズル1の中心孔5はワークW上面の空間とチャンバ8とを連通している。   The case 2 includes a cylindrical auxiliary case 7 on the upper surface. The inside of the auxiliary case 7 is formed as a chamber 8 that maintains high airtightness so as to maintain a negative pressure state during use. On the contact surface between the auxiliary case 7 and the case 2, a packing 9 for maintaining the airtightness of the chamber 8 is interposed. The auxiliary case 7 is fixed to the case 2 with a plurality of screws (not shown). The center hole 5 of the nozzle 1 communicates the space above the workpiece W with the chamber 8.

ケース2の側面にはテーパねじ10を刻設している。また、補助ケース7の側面にはテーパねじ11を刻設している。   A taper screw 10 is engraved on the side surface of the case 2. A taper screw 11 is engraved on the side surface of the auxiliary case 7.

この非接触搬送装置は、使用時、エアチャンバ3に空気を送給するために空気圧縮機を備えた空気供給装置12が接続される。また、チャンバ8の器内圧力を下げるためにチャンバ8内の空気を抽出する真空ポンプを備えた空気抽出装置13が接続される。空気供給装置12と空気抽出装置13とはそれぞれのコネクタをテーパねじ10とテーパねじ11とにそれぞれ連結して非接触搬送装置と連絡する。   The non-contact conveying device is connected to an air supply device 12 including an air compressor for supplying air to the air chamber 3 when in use. In addition, an air extraction device 13 having a vacuum pump for extracting the air in the chamber 8 is connected to lower the internal pressure of the chamber 8. The air supply device 12 and the air extraction device 13 are connected to the non-contact conveying device by connecting respective connectors to the taper screw 10 and the taper screw 11, respectively.

図2に示すように、ノズル1は周方向に等間隔に穿たれる多数の透孔4を有する。各透孔4は気流を真っ直ぐワークWに向けるために作動面Fと垂直に穿っている。透孔4は図において誇張して示されるが、0.05mmという、微小口径である。また、ノズル1は軸心に沿って穿たれた中心孔5を有する。この中心孔5は作動面Fと垂直に穿っている。この中心孔5の口径は0.27mmである。     As shown in FIG. 2, the nozzle 1 has a large number of through holes 4 that are bored at equal intervals in the circumferential direction. Each through hole 4 is formed perpendicular to the working surface F in order to direct the airflow straight to the workpiece W. The through-hole 4 is exaggerated in the figure, but has a small diameter of 0.05 mm. The nozzle 1 has a center hole 5 bored along the axis. The central hole 5 is formed perpendicular to the working surface F. The diameter of the center hole 5 is 0.27 mm.

上記構成からなる非接触搬送装置においてはエアチャンバ3に流入した空気はノズル1の透孔4を通って高速気流となってワークWに吹き出す。この高速気流でワークWは浮遊し、ワークWとの距離が大きくなる。同時に、一部空気は負圧状態にある中心孔5を通ってチャンバ8に流れるためにワークWは浮遊したままになる。また、一部空気は作動面FとワークWとの間の空間を通り、装置外に流れる。   In the non-contact transfer apparatus having the above-described configuration, the air that has flowed into the air chamber 3 passes through the through holes 4 of the nozzle 1 and is blown out to the workpiece W as a high-speed air current. The workpiece W floats by this high-speed air flow, and the distance from the workpiece W increases. At the same time, part of the air flows into the chamber 8 through the central hole 5 in a negative pressure state, so that the workpiece W remains floating. Further, part of the air passes through the space between the working surface F and the workpiece W and flows outside the apparatus.

中心孔5に向かう流れでワークWが吸引され、作動面FとワークWとの間の距離が小さくなると、圧力室6内部の圧力は急激に上昇し、ワークWを作動面Fから遠ざける。この平衡が維持された距離でワークWを空中に浮遊した非接触状態で懸垂保持することができる。   When the workpiece W is sucked by the flow toward the center hole 5 and the distance between the working surface F and the workpiece W becomes small, the pressure inside the pressure chamber 6 rapidly increases and moves the workpiece W away from the working surface F. The workpiece W can be suspended and held in a non-contact state floating in the air at a distance where this equilibrium is maintained.

本発明による非接触搬送装置は通常1個の装置で小型のワークを懸垂保持するが、ワーク形状が大きいときには2個ないしそれ以上の装置でワークを保持するようにしてもよい。また、この非接触搬送装置では搬送中に水平方向にワークの移動を阻止する手段を持たないので、正確な位置決めなどが必要な場合、ワークの移動を抑えるガイド部材などの機構を使用する。このガイド部材は各方向に1個ずつ配置すことが望ましい。   The non-contact conveying apparatus according to the present invention normally holds a small work in a suspended manner by one apparatus. However, when the work shape is large, the work may be held by two or more apparatuses. Further, since this non-contact conveying apparatus does not have means for preventing the movement of the workpiece in the horizontal direction during the conveyance, a mechanism such as a guide member for suppressing the movement of the workpiece is used when accurate positioning or the like is required. It is desirable to arrange one guide member in each direction.

このように本実施の形態においては比較的小型のワークについて吸着手段のような直接ワークを保持する手段を用いないで懸垂保持することができる。これにより、搬送またはハンドリングにおいて異物がワークに付着するのを抑制し、また、着脱操作中、ワークに損傷を与えるミスを回避することができる。   As described above, in the present embodiment, a relatively small work can be suspended and held without using a means for directly holding the work such as a suction means. Thereby, it is possible to prevent foreign matters from adhering to the workpiece during conveyance or handling, and to avoid mistakes that damage the workpiece during the attachment / detachment operation.

さらに、ノズル1とケース2との簡素な組み合わせで搬送装置を構成することが可能で、気流の制御ための手段を組み込まないので、搬送装置を極めて小型に構成することができる。   Furthermore, since the conveying device can be configured by a simple combination of the nozzle 1 and the case 2 and no means for controlling the airflow is incorporated, the conveying device can be configured extremely small.

本発明による非接触搬送装置の一実施の形態を示す構成図である。It is a block diagram which shows one Embodiment of the non-contact conveying apparatus by this invention. 本発明に係る搬送装置の動作を説明する図式的表示である。It is a schematic display explaining operation | movement of the conveying apparatus which concerns on this invention. 図1に示されるノズルを示すもので、(a)はノズルの正面図、(b)は図3(a)のA―A線に沿う断面図である。FIG. 2 shows the nozzle shown in FIG. 1, (a) is a front view of the nozzle, and (b) is a sectional view taken along the line AA in FIG. 3 (a). 従来の非接触搬送装置の一例を示す構成図である。It is a block diagram which shows an example of the conventional non-contact conveying apparatus. 従来の複数の非接触搬送装置を備える搬送装置の一例を示す配置図である。It is a layout view showing an example of a transport device including a plurality of conventional non-contact transport devices.

符号の説明Explanation of symbols

1… ノズル
2… ケース
3… エアチャンバ
4… 透孔
5… 中心孔
7… 補助ケース
8… チャンバ
DESCRIPTION OF SYMBOLS 1 ... Nozzle 2 ... Case 3 ... Air chamber 4 ... Through-hole 5 ... Center hole 7 ... Auxiliary case 8 ... Chamber

Claims (1)

多数の透孔および中心孔を備えたノズルと、前記ノズル全体を取り囲み前記ノズルの周りにエアチャンバを形成するように設けられたケースと、前記ケースの上面に設けられ、チャンバを有する補助ケースとを備え、前記ノズルの透孔は前記エアチャンバとワーク上面との間の空間とを連通すると共に、前記ノズルの中心孔はワーク上面の空間と前記チャンバとを連通している非接触搬送装置。

A nozzle having a large number of through-holes and a central hole, a case provided so as to surround the entire nozzle and form an air chamber around the nozzle, and an auxiliary case provided on an upper surface of the case and having a chamber A non-contact transfer device in which the through hole of the nozzle communicates with the space between the air chamber and the workpiece upper surface, and the central hole of the nozzle communicates with the space of the workpiece upper surface and the chamber.

JP2004352933A 2004-12-06 2004-12-06 Non-contact transport apparatus Pending JP2006160434A (en)

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JP2009032981A (en) * 2007-07-27 2009-02-12 Ihi Corp Non-contact carrier
JP2009028863A (en) * 2007-07-27 2009-02-12 Ihi Corp Non-contact carrier
JP2009028862A (en) * 2007-07-27 2009-02-12 Ihi Corp Non-contact carrier
JP2010258292A (en) * 2009-04-27 2010-11-11 Murata Machinery Ltd Article retention apparatus
JP2011108879A (en) * 2009-11-18 2011-06-02 Koganei Corp Workpiece transfer apparatus
WO2012176629A1 (en) * 2011-06-20 2012-12-27 東京エレクトロン株式会社 Detachment system, detachment method, and computer storage medium
KR101289973B1 (en) 2012-01-26 2013-07-26 금오공과대학교 산학협력단 Transfer uprising device using pueumatic system

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JPS631647A (en) * 1986-06-23 1988-01-06 Taiyo Tekko Kk Noncontact adsorbing device
JPH02305740A (en) * 1989-05-17 1990-12-19 Sony Corp Substrate transport device
JPH0343180A (en) * 1989-07-05 1991-02-25 Hiroshi Akashi Contactless holder
JPH05335404A (en) * 1991-07-17 1993-12-17 Hiroshi Akashi Non-contact retaining equipment
JPH07290355A (en) * 1994-04-25 1995-11-07 Nippon Steel Corp Polishing device

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JPS6216924A (en) * 1985-05-04 1987-01-26 Seibu Giken:Kk Method for suspensorily floating platelike body by means of fluid in noncontact state
JPS631647A (en) * 1986-06-23 1988-01-06 Taiyo Tekko Kk Noncontact adsorbing device
JPH02305740A (en) * 1989-05-17 1990-12-19 Sony Corp Substrate transport device
JPH0343180A (en) * 1989-07-05 1991-02-25 Hiroshi Akashi Contactless holder
JPH05335404A (en) * 1991-07-17 1993-12-17 Hiroshi Akashi Non-contact retaining equipment
JPH07290355A (en) * 1994-04-25 1995-11-07 Nippon Steel Corp Polishing device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009032981A (en) * 2007-07-27 2009-02-12 Ihi Corp Non-contact carrier
JP2009028863A (en) * 2007-07-27 2009-02-12 Ihi Corp Non-contact carrier
JP2009028862A (en) * 2007-07-27 2009-02-12 Ihi Corp Non-contact carrier
JP2010258292A (en) * 2009-04-27 2010-11-11 Murata Machinery Ltd Article retention apparatus
JP2011108879A (en) * 2009-11-18 2011-06-02 Koganei Corp Workpiece transfer apparatus
WO2012176629A1 (en) * 2011-06-20 2012-12-27 東京エレクトロン株式会社 Detachment system, detachment method, and computer storage medium
JP2013004845A (en) * 2011-06-20 2013-01-07 Tokyo Electron Ltd Separation system, separation method, program and computer storage medium
KR101289973B1 (en) 2012-01-26 2013-07-26 금오공과대학교 산학협력단 Transfer uprising device using pueumatic system

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