JP2006156915A5 - - Google Patents
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- JP2006156915A5 JP2006156915A5 JP2004362776A JP2004362776A JP2006156915A5 JP 2006156915 A5 JP2006156915 A5 JP 2006156915A5 JP 2004362776 A JP2004362776 A JP 2004362776A JP 2004362776 A JP2004362776 A JP 2004362776A JP 2006156915 A5 JP2006156915 A5 JP 2006156915A5
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- JP
- Japan
- Prior art keywords
- laser beam
- power
- ltp laser
- ltp
- convection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
LTPレーザービーム818がウェハの表面312に入射すると、電源180からヒーターモジュール150に供給される電力850をそれに比例して減少させる。一定のバックグラウンド温度TCの電気的な制御を維持するためには、絶縁体層100を介した冷却板20への定常状態の熱損失は、放射及び対流による損失が差し引かれたLTPレーザービームからの最大供給エネルギーよりも大きくなければならない。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/001,954 US7731798B2 (en) | 2004-12-01 | 2004-12-01 | Heated chuck for laser thermal processing |
US11/001,954 | 2004-12-01 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006156915A JP2006156915A (ja) | 2006-06-15 |
JP2006156915A5 true JP2006156915A5 (ja) | 2012-07-12 |
JP5031984B2 JP5031984B2 (ja) | 2012-09-26 |
Family
ID=36566421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004362776A Expired - Fee Related JP5031984B2 (ja) | 2004-12-01 | 2004-12-15 | レーザー熱処理のための加熱チャック |
Country Status (4)
Country | Link |
---|---|
US (1) | US7731798B2 (ja) |
JP (1) | JP5031984B2 (ja) |
KR (1) | KR20060061198A (ja) |
TW (1) | TWI257158B (ja) |
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KR102640172B1 (ko) | 2019-07-03 | 2024-02-23 | 삼성전자주식회사 | 기판 처리 장치 및 이의 구동 방법 |
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US11493551B2 (en) | 2020-06-22 | 2022-11-08 | Advantest Test Solutions, Inc. | Integrated test cell using active thermal interposer (ATI) with parallel socket actuation |
US11549981B2 (en) | 2020-10-01 | 2023-01-10 | Advantest Test Solutions, Inc. | Thermal solution for massively parallel testing |
US11808812B2 (en) | 2020-11-02 | 2023-11-07 | Advantest Test Solutions, Inc. | Passive carrier-based device delivery for slot-based high-volume semiconductor test system |
US11821913B2 (en) | 2020-11-02 | 2023-11-21 | Advantest Test Solutions, Inc. | Shielded socket and carrier for high-volume test of semiconductor devices |
US20220155364A1 (en) | 2020-11-19 | 2022-05-19 | Advantest Test Solutions, Inc. | Wafer scale active thermal interposer for device testing |
US11609266B2 (en) | 2020-12-04 | 2023-03-21 | Advantest Test Solutions, Inc. | Active thermal interposer device |
US11573262B2 (en) | 2020-12-31 | 2023-02-07 | Advantest Test Solutions, Inc. | Multi-input multi-zone thermal control for device testing |
US11587640B2 (en) | 2021-03-08 | 2023-02-21 | Advantest Test Solutions, Inc. | Carrier based high volume system level testing of devices with pop structures |
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-
2004
- 2004-12-01 US US11/001,954 patent/US7731798B2/en not_active Expired - Fee Related
- 2004-12-15 KR KR1020040106671A patent/KR20060061198A/ko not_active Application Discontinuation
- 2004-12-15 TW TW093138893A patent/TWI257158B/zh not_active IP Right Cessation
- 2004-12-15 JP JP2004362776A patent/JP5031984B2/ja not_active Expired - Fee Related
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