JP2006156880A - Attaching method of punched part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an attaching method of a punched part wherein, when a punched part from a tape member by a punch is pressed to the predetermined place of a sheet-like material to be attached and attached thereto even in the case of a wide punched-part, the punched part is temporally attached to the material with being held on the front end face of the punch, and then attached thereto without remaining bubbles in an adhering surface to the material. <P>SOLUTION: A punch 14 is used in which a vacuum contact hole 14a is opened in a front end face such that a punched part 12a is held on the front end face, and the punched part 12a held on the front end face of the punch 14 is partially subjected to temporal attaching by partially pressing the part to the predetermined place of a radiating plate 16 at one end side, and the punched part 12a is not attached at the other end side, and then the punched part 12a is sequentially pressed by a roller in a direction from the temporary attached one-end-side to the not attached other-end-side, thereby performing main attaching of attaching an attaching surface of the punched part 12a to the predetermined place of the material to be attached. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for attaching a punched part, and more specifically, a punched part punched from a flexible tape member is pressed against a predetermined portion of a plate-shaped adherend, and the punching part is pressed. The present invention relates to a method for attaching a punched part to be attached by an adhesive applied to at least one side of a punched part and an adherend.

In Patent Document 1 below, a thin punched part punched from a flexible tape member having one surface formed on the adhesive application surface is pressed against a predetermined portion of a plate-shaped adherend. The sticking method of sticking is described. This sticking method is shown in FIG.
In the adhering method shown in FIG. 3, first, as shown in FIG. 3 (a), a flexible tape member 102 is applied to one surface side of the die 100 in which the hole 100a is formed, and the adhesive is applied. Place it so that the surfaces abut.
A punch 104 is provided on one surface side of the die 100 so as to be movable up and down. In the punch 104, a vacuum suction hole 104a that opens to the front end surface of the punch 104 is formed. The vacuum suction hole 104a is connected to a vacuum pump (not shown) and can vacuum-punch a punched part punched on the tip surface of the punch 104.
Further, on the other surface side of the die 100, a plate-like adherend 106 for attaching a punched part punched from the tape member 102 is placed on the thermocompression bonding tool 108.

The punch 104 shown in FIG. 3A is lowered, and the tip portion is inserted into the hole 100a of the die 100, so that it is placed on one surface side of the die 100 as shown in FIG. The tape member 102 is punched out. The punched part 102a that has been punched is vacuum-adsorbed to the tip surface of the punch 104 through a vacuum suction hole 104a by driving a vacuum pump (not shown).
As shown in FIG. 3C, the punched part 102a vacuum-adsorbed on the front end surface of the punch 104 descends together with the punch 104 and strikes the adherend 106 placed on the thermocompression bonding tool 108. The adhesive-coated surface of the punched part 102 a comes into contact with and is hot-pressed, and the punched part 102 a is temporarily pressed onto a predetermined portion of the adherend 106.
Further, similarly, after temporarily pressing the punched parts 102a, 102a,... To the plate-like adherend 106, the adherend 106, in which the punched parts 102a, 102a,. As shown in FIG. 4, the film is sandwiched between the pressure bonding tools 110 and 112 and subjected to the main pressure bonding by heating and pressing. In this main pressure bonding, pressing is performed simultaneously over the entire surface of the punched parts 102a, 102a,.

3 and 4, there is no problem as long as the punched part 102a has a narrow width, but it is like a punched part including one flexible wiring board on which a semiconductor element is mounted in a subsequent process on one side. In the case of the wide punched part 102a, when the wide punched part 102a was temporarily press-bonded to the adherend 106, bubbles easily remained on the bonding surface. These bubbles remain without being removed even in the main pressure bonding shown in FIG. Such residual bubbles tend to cause a decrease in the adhesive force between the punched part 102a and the adherend 106.
As a sticking method in which the bubbles do not easily remain, as shown in FIG. 5, the following Patent Document 2 sequentially presses the film member 202 against the plate-like adherend 200 by a roller 204 from one end side. It has been proposed to do.
JP-A-5-301669 (FIG. 6) JP 2003-152143 A (FIG. 1)

As shown in FIG. 5, the film member 202 is adhered to the plate-shaped adherend 200 from the other end side of the opened film member 202 by sequentially pressing the film member 202 from one end side with a roller 204. Temporary pressure bonding can be performed while discharging air between the body 200.
However, with the sticking method shown in FIG. 3, it is extremely difficult to temporarily press-bond the punched part 102 to the adherend 106 using the roller 204 shown in FIG. 5.
That is, the air between the adherend 106 is discharged to one end side where the punched part 102 vacuum-adsorbed on the front end surface of the punch 104 shown in FIG. It is because it is necessary to make the other end side to perform into the open state of non-sticking.
On the other hand, in the sticking method shown in FIG. 3, when the punched part 102 punched by the punch 104 is held on the front end surface of the punch 104 and temporarily bonded to the adherend 106, the punched part 102 is changed. No temporary operation is required, and the temporary crimping operation can be simplified.
Therefore, the problem of the present invention is that when a punched part punched from a tape member is pressed against a predetermined portion of a plate-shaped adherend and pressed, even if it is a wide punched part, Providing a method for attaching a punched part that can be temporarily pressure-bonded to an adherend while holding the punched part on the tip surface, and can be attached without leaving bubbles on the adhesive surface with the adherend. is there.

As a result of repeated studies to solve the above-mentioned problems, the present inventors have partially performed the punching part held on the front end surface of the punch by partial pressing that presses one end of the punched part to a predetermined position of the adherend. Pre-crimping is possible, and by pressing sequentially with a roller in the direction from one end side to the other end side of the pre-bonded punching part, air between the adherends is discharged from the other non-stick side and punched. The present inventors have found that the sticking surface of the extracted part can be stuck, and have reached the present invention.
That is, in the present invention, a punched part punched from a flexible tape member is pressed against a predetermined portion of a plate-shaped adherend to at least one of the punched part and the adherend. When affixed with an adhesive applied to the front end, a punch having a suction hole opened on the front end surface is used as the punch so that a punched punched part can be held on the front end surface. The punched part held on the surface is partially temporarily pressure-bonded by partial pressing that presses one end of the punched part against a predetermined part on one side of the adherend, and the other end of the punched part is not attached. Then, the punching component is pressed from the one end side of the punched component that has been temporarily press-bonded to the other end side of the non-sticking by a roller, and the sticking surface of the punching component is pressure-bonded to a predetermined portion of the adherend. It is in the sticking method of the punching part characterized by performing crimping | compression-bonding.

In the present invention, using the crimping tool provided on the other surface side of the adherend, the portion corresponding to the one end side of the punched part to be temporarily crimped formed on the projecting portion, the projecting of the crimping tool The one end side of the punched part is covered with the one end side of the punched part and the portion to be temporarily press-bonded of the adherend between the tip end surface of the punch and the punch tip surface. Temporary pressure bonding can be easily performed on a predetermined portion of the sticking body.
Further, the main pressure bonding can be easily performed by sandwiching the punched part and the adherend between a pair of heating rollers.
By using a heating tool with a built-in heater as the pressure bonding tool used for such temporary pressure bonding, one end side of the punched part by temporary pressure bonding can be sufficiently bonded to the adherend.
Furthermore, as an adhesive, an adhesive having a bonding temperature higher than room temperature is used, and the punching part and the adherend are bonded so that the bonding temperature of the adhesive is reached during the temporary pressure bonding and the main pressure bonding. By heating the pressing part, it is possible to apply only the necessary part of the punched part by heating it above the bonding temperature.
Note that, as a flexible tape member, a tape member on which a plurality of flexible wiring boards are formed is used, and a punched part including at least one flexible wiring board punched from the tape member is attached to one surface of the heat radiating plate. By sticking to the side, even a wide punched part including at least one flexible wiring board can be stuck without leaving bubbles on the heat sink.

According to the present invention, it is possible to perform partial temporary pressure bonding while holding a punched part obtained by punching a flexible tape member by a punch, on the front end surface of the punch. By such temporary press-bonding, one end side of the punched part can be attached to a predetermined portion of the adherend, and the other end side of the punched part can be unattached. For this reason, the air between the adherends is discharged from the other end side of the non-adhering member by sequentially pressing the stamped parts attached to the adherend member from one end side to the other end side by a roller. In addition, the entire sticking surface of the punched part can be stuck.
As a result, even a wide punched part in which a flexible tape member is punched by punching can be stuck without leaving bubbles on the adhesive surface with the adherend, and adhesion due to residual bubbles We can prevent power loss.

An example of the stamping part sticking method according to the present invention is shown in FIG. In the adhering method shown in FIG. 1, first, as shown in FIG. 1 (a), a flexible tape member 12 is placed on one side of a die 10 in which a hole 10a is formed. The position of the tape member 12 is adjusted so that a portion including one flexible wiring board among the plurality of formed flexible wiring boards is positioned above the perforation hole 10a.
On one surface side (upper surface side) of the die 10, a punch 14 is provided so as to be movable up and down, and a vacuum suction hole 14 a that opens to the front end surface of the punch 14 is formed in the punch 14. The vacuum suction hole 14a is connected to a vacuum pump (not shown). For this reason, when the tip of the punch 14 is inserted into the hole 10a of the die 10 and a punched part including one flexible wiring board is punched from the tape member 12, the tip of the punch 14 is driven by driving the vacuum pump. The punched parts can be vacuum-adsorbed on the surface.
Further, on the other surface side (lower surface side) of the die 10, a heat dissipation plate 16 as a plate-like adherend to which a punched part punched from the tape member 102 is attached is positioned above the crimping tool 18. is doing. An adhesive made of a thermosetting resin and having an adhesion temperature higher than room temperature is applied to the surface (front surface) of the heat radiating plate 16 on the die 10 side.
Further, the crimping tool 18 is provided so as to be movable up and down with respect to the back surface side of the heat radiating plate 16, and the cross-sectional shape formed at the protruding portion 18 a that protrudes in the direction of the drilling hole 10 a of the die 10 is L-shaped. It is formed in a shape. The crimping tool 18 is a heating tool with a built-in heater, and the tip end surface of the protruding portion 18 a is formed to be narrower than the opening surface of the drilling hole 10 a of the die 10. In addition, the protruding portion 18 a is provided so that the tip end surface thereof is offset toward the opening peripheral side of the hole 10 a of the die 10.

The punch 14 shown in FIG. 1 (a) is lowered, and as shown in FIG. 1 (b), the tip of the punch 14 is inserted into the hole 10a of the die 10 so as to include one flexible wiring board. When the punched part 12a is punched from the tape member 12, the vacuum pump is driven to vacuum-suck the punched part 12a on the tip surface of the punch 14.
Further, the punch 14 is lowered while the punched part 12a is vacuum-adsorbed on the front end surface of the punch 14, and when the punched part 12a comes close to the heat radiating plate 16, the lowering of the punch 14 is stopped.
Next, the crimping tool 18 heated to a temperature equal to or higher than the bonding temperature of the adhesive made of a thermosetting resin applied to the die 10 side surface of the radiator plate 16 is raised in the direction of the radiator plate 16, and the protruding portion of the crimping tool 18 is raised. The front end surface of 18a is brought into contact with the back surface of the heat radiating plate 16, and the surface of the heat radiating plate 16 is pushed up to the punched component 12a for pressure bonding.

At this time, the front end surface of the protruding portion 18a of the crimping tool 18 is in contact with a portion on the back surface side of the heat radiating plate 16 corresponding to one end side of the punched component 12a for a predetermined time, and the front end surface of the protruding portion 18a is in contact with it. The part of the heat radiating plate 16 is partially heated, and the temperature of the heated part of the adhesive is raised to the bonding temperature or higher. For this reason, one end side of the punched part 12a is heat-pressed to the heat sink 16 and temporarily press-bonded, but the other end side is not heat-pressed and the other end side of the punched part 12a is not attached to the heat sink 16 Kept in a state. That is, the punching part 12 is in a state where only a part of the surface to be attached is attached and the other part is not attached, for example, a sticky note is attached.
In this way, after heat-bonding to one end of the punched part 12a by the crimping tool 18, the crimping tool 18 is lowered to break the vacuum state of the vacuum suction hole 14a and eliminate the vacuum suction of the punched part 12a. As a result, the temporary press-bonding step is completed by raising the punch 14.
Thereafter, as shown in FIG. 3C, the tape member 12 is moved so that the portion including one flexible wiring board to be punched next is positioned on the drilling hole 10a, and the next punching component 12a is The heat radiating plate 16 is moved so that the portion to be temporarily crimped is located below the drilling hole 10a.
The moved heat sink 16 is left with a punched part 12a in which only one end side is temporarily pressure-bonded to the heat sink 16 before moving.

Each of the plurality of punched parts 12a is subjected to main pressure bonding after temporarily crimping each one end side to the heat radiating plate 16 in a state in which each other end side is not attached to the heat radiating plate 16.
As shown in FIG. 2, in this main pressure bonding, a pair of heating rollers 20 a and 20 b that are maintained at a temperature equal to or higher than the bonding temperature of the adhesive applied to one surface of the heat radiating plate 16 are used. By sandwiching the heat radiating plate 16 and the punched component 12a between 20a and 20b, a main pressure bonding is performed in which the sticking surface of each punched component 12a is heat bonded to the heat radiating plate 16.
In this case, the punched parts 12a, 12a,... Can be sequentially pressed by the pair of heating rollers 20a, 20b in the direction from the temporarily bonded one end to the non-bonded other end. The heat sink 16 is transferred in the direction indicated by the arrow.
In this way, by sequentially heat-pressing from the one end side of the temporarily pressed punched part 12a to the other side of the non-sticked side, the air between the heat sink 16 can be sufficiently discharged, and the punched part 12a can be removed. The main pressure bonding can be performed without leaving bubbles on the bonding surface at a predetermined position of the heat radiating plate 16.
The punching parts 12a, 12a,... Which are finally press-bonded to the heat sink 16 are for semiconductor devices comprising a flexible wiring board and a heat sink obtained by cutting the parts 12a, 12a,. A semiconductor device can be manufactured by mounting a semiconductor element on a substrate.

In the above description, the adhesive is applied to the bonding surface side of the heat radiating plate 16, but may be applied to the bonding surface side of the tape member 12, or may be applied to both bonding surfaces of the heat radiating plate 16 and the tape member 12. May be.
Further, as an adhesive, an adhesive made of a thermoplastic resin may be used instead of the adhesive made of a thermosetting resin. In the case of an adhesive made of a thermoplastic resin, an adhesive whose softening point or melting point is higher than room temperature is used.
2 uses a pair of heating rollers 20a and 20b, the back surface of the heat radiating plate 16 (opposite surface to the surface on which the punched parts 12a, 12a,. The surface of the heat radiating plate 16 may be pressed by a non-heating roller while being heated by a heating plate.
1 and 2, the wide punched part 12a including one flexible wiring board has been described. However, the punched part 12a including a plurality of flexible wiring boards may be used. The present invention can also be applied to punched parts.

It is process drawing explaining an example of temporary crimping employ | adopted with the sticking method of the stamping parts which concerns on this invention. It is explanatory drawing explaining an example of this crimping | compression-bonding employ | adopted with the sticking method of the punching components which concern on this invention. It is process drawing explaining the temporary crimping | compression-bonding in the pasting method of the conventional punching components. It is explanatory drawing explaining the main crimping | compression-bonding in the pasting method of the conventional punching components. It is explanatory drawing explaining the improvement method of the pasting method of the conventional punching components.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Die 10a Drilling hole 12 Tape member 12a Punching part 14 Punch 14a Vacuum suction hole 16 Heat sink 18 Crimping tool 18a Protrusion part

Claims (6)

An adhesive applied to at least one of the punched part and the adherend by pressing a punched part punched from a flexible tape member against a predetermined portion of the plate-like adherend. When sticking with
As the punch, a punch in which a suction hole is opened on the front end surface so that the punched part to be punched can be held on the front end surface,
The punched part held on the tip surface of the punch is partially temporarily pressure-bonded by partial pressing that presses one end of the punched part against a predetermined part on one side of the adherend, and the other end of the punched part. After unattached
Applying a final press-bonding process in which the stamped component is pressed against one end side of the punched component in the direction of the other end of the non-sticked side by a roller, and the sticking surface of the punched component is pressure-bonded to a predetermined portion of the adherend. A method for attaching a stamped part characterized by the above.   Using a crimping tool in which a portion corresponding to one end side of a punched part to be temporarily crimped provided on the other surface side of the adherend is formed on the projecting portion, the tip surface of the projecting portion of the crimping tool and The punching part sticking method according to claim 1, wherein temporary punching is performed by sandwiching one end side of the punching part and a portion to be temporarily press-bonded of the adherend between the front end surface of the punch.   The method for attaching a punched part according to claim 1 or 2, wherein the main pressing is performed by sandwiching the punched part and the adherend between a pair of heating rollers.   The method for attaching a punched part according to any one of claims 1 to 3, wherein a heating tool with a built-in heater is used as the pressure bonding tool used for temporary pressure bonding.   As an adhesive, an adhesive whose bonding temperature is higher than room temperature is used, and the punching part and the adherend are pressed so that the adhesive temperature becomes equal to or higher than the bonding temperature of the adhesive during the temporary pressure bonding and the main pressure bonding. The method for attaching a punched part according to any one of claims 1 to 4, wherein the part is heated. A tape member having a plurality of flexible wiring boards is used as a flexible tape member, and a punched part including at least one flexible wiring board punched from the tape member is disposed on one side of the heat radiating plate. The sticking method of the stamping parts as described in any one of Claims 1-5 to stick.

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