JP2006147608A - Thin substrate carrier and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin substrate carrier where dispersion of an amount of cream solder is prevented and a thin substrate is easily peeled. <P>SOLUTION: An adhesion resin layer (5) is formed on the upper face of a base plate (3) in the thin substrate carrier (1). The upper face of the adhesion resin layer is divided into a thick region (7) and thin regions (9). Since the adhesion force of the thin region is weaker than that of the thick region, the thin substrate is easily peeled. Irregularities with which the thin substrate is distorted are not formed on the upper face of the adhesion resin layer. Thus, the dispersion of the amount of cream solder due to distortion can effectively be prevented. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a thin substrate carrier for transporting a thin substrate such as a flexible printed circuit board (FPC) or other thin wiring substrate, and more particularly, a thin substrate having a resin layer to which the thin substrate can be attached and fixed. The present invention relates to a substrate carrier and a manufacturing method thereof.

  As described above, a thin substrate carrier (hereinafter simply referred to as “carrier”) used when mounting an electronic component such as an IC or a capacitor on the surface of a thin substrate (hereinafter simply referred to as “substrate”) is as described above. In many cases, a thin substrate-adhering resin layer (adhesive resin layer) is provided. FIG. 17 shows an example of a carrier. The carrier 101 includes a base plate 103 and an adhesive resin layer 105 formed thinly on the upper surface of the base plate 103. Generally, aluminum or glass epoxy is used for the base plate 103, and fluororesin or silicone resin is used for the adhesive resin layer. The carrier 101 is used as follows. That is, first, the thin substrate 111 is placed at a predetermined position on the adhesive resin layer 105 of the carrier 101. The placed thin substrate 111 is attached to the adhesive resin layer 105 (carrier 101) by the adhesive force of the adhesive resin layer 105. The thin substrate 111 is literally thin and generally small. It is also fragile. For this reason, it is very difficult to handle the thin substrate 111 as it is. Therefore, the thin substrate 111 is fixed to the carrier 101 in order to facilitate handling while reinforcing. The thin substrate 111 fixed to the carrier 101 is subjected to solder printing, component mounting, reflow, and other processes as it is.

For the solder printing in the above process, a metal mask 115 having through holes 116,. As shown in FIGS. 21 to 23, the metal mask 115 is overlaid on the thin substrate 111 attached to the adhesive resin layer 105, and further the metal mask 115 is overlaid thereon. Next, cream solder 117 is placed on the metal mask 115, and the placed cream solder 117 is squeezed with a squeegee 119 to pass through the through-holes 116,... When the printing is completed, the metal mask 115 is released. However, the adhesive force of the adhesive resin layer 105 becomes an obstacle when the release is performed. That is, there arises a problem that the metal mask 115 sticks to the adhesive resin layer 105 due to the adhesive force of the adhesive resin layer 105 and is difficult to separate.
JP 2001-144430 A (see paragraphs 0013 to 0014)

The problem that it is difficult to peel off from the adhesive resin layer 105 is the same for the thin substrate, and the following technique is disclosed in order to facilitate peeling. In other words, it is a technique for roughening the place by laser scanning to a predetermined place on the surface of the adhesive resin layer. By roughening, the contact area between the adhesive resin layer and the thin substrate is reduced as a whole. It is intended to reduce the adhesive strength. Parts other than the predetermined part where laser scanning is performed are covered with a metal mask so as not to be laser-scanned (FIG. 20, Patent Document 2). A carrier 101 ′ shown in FIG. 20 is also an example of a conventional carrier. The carrier 101 ′ includes a base plate 103 ′, and a plurality of through-holes 105′h,... Are passed through a desired region in the adhesive resin layer 105 ′ on the upper surface of the base plate 103 ′. Each of the through-holes 105′h has a main purpose of reducing the contact area between the adhesive resin layer and the thin substrate, similarly to the roughening by laser scanning described above.
JP 2004-158477 A (see paragraphs 0015 and 0037)

  However, according to the laser scanning method, a metal mask is required as described above. However, if the metal mask is a simple shape, it does not matter so much, but it takes time to make a complicated shape. It will take. Further, when the adhesive resin layer surface is roughened or through-holes are formed, the following problems may occur during solder printing, particularly in the latter case. The problem is a variation in the amount of solder caused by substrate distortion during solder printing. That is, the solder printing is performed by squeezing the cream solder placed on the thin substrate with the squeegee as described above. However, as shown in FIGS. Part of the thin substrate 111 placed on the surface of 105 is pushed into the through-hole 104 of the adhesive resin layer 105 roughened by squeegeeing of the squeegee 119. As a result, the thin substrate 111 undulates, etc. A gap 106 may be generated between the upper surface and the lower surface of the metal mask 115. When the gap 106 is generated, the cream solder 117 is pushed into the gap, and the pushing of the cream solder 117 causes the amount of solder to be printed to be larger than a predetermined amount. The amount of solder to be pushed in depends on the shape and size of the through holes of the mask, the distance between the through holes, and the like. As a result, the amount of cream solder to be printed varies.

  The problem to be solved by the present invention is to provide a thin substrate carrier in which the above-mentioned problems of the prior art are improved, and to provide a method for manufacturing such a thin substrate carrier.

  The inventor who has intensively studied to solve the above-described problem is that the thickness of the adhesive resin layer may be changed in order to adjust the adhesive force on the upper surface of the adhesive resin layer without causing distortion in the thin substrate. I found out. The causal relationship is currently being elucidated, but even when the adhesive resin layer is the same, the thickness of the thin area (part) is the same as that of the thicker area (part) when compared to the flat upper surface. It was confirmed by an experiment that the adhesive strength in was small. The thicker is stronger than the thinner. The present invention has been made from such a viewpoint, and the detailed contents thereof will be described again. It should be noted that the definitions of terms and the like used to describe the invention described in any claim shall be applied to the invention described in other claims as long as it is possible regardless of the category of the invention.

(Characteristics of the invention of claim 1)
A thin substrate carrier according to the invention described in claim 1 (hereinafter, appropriately referred to as “carrier of claim 1”) includes a base plate having an upper surface and an adhesive resin layer having a flat upper surface formed on the upper surface of the base plate. The upper surface of the adhesive resin layer is divided into a thick region for releasably attaching a part or all of the lower surface of the thin substrate and a thin region other than the thick region. Further, a raised protrusion that is integral with or separate from the base plate is formed on the upper surface of the base plate corresponding to the thin area. Both the thick region and the thin region do not have to be one place with respect to the thin substrate to be attached, and may be dispersed in a plurality of places. Further, the other region can be arranged in one region. There may be a difference in the height dimension of the raised protrusion partially in the thin region. Note that the number of thin substrates to be attached may be singular or plural depending on the shape of the thin substrate, the size of the base plate, and the like.

  According to the carrier of the first aspect, since the adhesive resin layer is flat on the upper surface, the thickness dimension changes depending on the presence or absence of the raised protrusion. That is, the thickness dimension based on the upper surface of the adhesive resin layer in the thin area is smaller than the thickness dimension based on the upper surface of the adhesive resin layer in the thick area. As described above, the thicker the thickness, the greater the adhesive strength than the thinner. In this way, on the upper surface of the adhesive resin layer having a difference in adhesive force, the thick region of the adhesive resin layer sticks the lower surface of the thin substrate and holds it. Therefore, the thin substrate can be protected during handling and processing of the thin substrate, and the handling thereof can be facilitated. Furthermore, the thin substrate can be easily peeled from the adhesive resin layer by appropriately selecting the size and arrangement of the thick region and the thin region according to the shape of the thin substrate and the like, or by combining both appropriately. In addition to facilitating peeling of such a thin substrate, or in place of this, an arrangement or the like that facilitates peeling of a mask used for cream solder printing may be performed. Since the upper surface of the adhesive resin layer is flat, it is possible to efficiently adjust the adhesive force of the upper surface (adhesion surface) of the adhesive resin layer without forming irregularities that cause distortion in the thin substrate. Therefore, it is possible to easily peel off the attached thin substrate, and it is possible to effectively suppress the push-in of excess cream solder that would have occurred if unevenness occurred. To prevent as much as possible.

(Characteristics of the invention described in claim 2)
In the thin substrate carrier according to the invention described in claim 2 (hereinafter referred to as “the carrier of claim 2” as appropriate), the raised protrusion in the basic configuration of the carrier of claim 1 is the same as the constituent resin of the adhesive resin layer. It is comprised by the raising resin layer formed separately from the said adhesion resin layer using resin. That is, although the adhesive resin layer and the raised protrusion are formed of the same resin, since both are formed separately, both are not integrated and a boundary (interface) exists between them.

  According to the carrier of the second aspect, in addition to the function and effect of the carrier of the first aspect, since the same resin as the resin of the adhesive resin layer is used for forming the raised protrusion, the labor of changing the raw material can be saved. That is, not only when the raised protrusion and the adhesive resin layer are formed in the same forming equipment, but also when the raised protrusion and the adhesive resin layer are formed in different equipment, only one kind of raw material resin is prepared, and there is no need to change the raw material.

(Characteristics of Claim 3)
In the thin substrate carrier according to the invention described in claim 3 (hereinafter, referred to as “the carrier of claim 3” as appropriate), the raising protrusion is provided before the conveyance, after having the basic structure of the carrier of claim 1. It is composed of a thin substrate laminated with one or more thin substrates, or a thin substrate before transporting one or two or more laminated substrates. That is, one thin substrate before transfer or a processed substrate, or a plurality of thin substrates before transfer or a processed substrate are used as raised protrusions. The main processing is, for example, a part such as a through-hole or notch that will correspond to the thin region if there is no processing, and that corresponds to the thick region by the processing.

  According to the carrier of claim 3, in addition to the effect of the carrier of claim 1, the thin substrate itself or a material obtained by processing the thin substrate can be used, and it corresponds to the shape of the thin substrate to be transported. Since a thin region can be formed, it is possible to reduce the time required for forming the raised protrusions corresponding to the thin substrate to be transported separately from the thin substrate before transport. That is, the manufacturing process of the entire carrier can be simplified. If processing is performed, much labor is required, but still less labor is required compared to the case where the raised protrusion is formed from the beginning.

(Feature of the invention of claim 4)
In the thin substrate carrier according to the invention of claim 4 (hereinafter referred to as “the carrier of claim 4” as appropriate), the thin substrate is pasted after the basic configuration of the carrier of any one of claims 1 to 3 is provided. A region occupied when the image is attached (occupied region of the thin substrate) includes a part of the thin region and the thick region surrounded by a part of the thin region. That is, the occupied area of the thin substrate has the same shape as the thin substrate, but the thin area exists in the occupied area, and the thick area exists in the thin area. The number and shape of the thick region and the thin region can be appropriately selected depending on the balance with the adhesive force adjustment and the like.

  According to the carrier of the fourth aspect, in addition to the function and effect of the carrier of any one of the first to third aspects, the adhesive force of the adhesive resin surface (thick region) acting on the entire back surface of the thin substrate is weakened by the presence of the thin region. It is done. In other words, the sum of the thick area adhesive strength and the thin area adhesive strength that has been weakened even if it does not work acts on the entire back surface of the thin substrate. If converted into the adhesive force per area, the converted value becomes smaller than that in the absence of the thin region. That is, the contact area between the upper surface of the adhesive resin layer and the rear surface of the thin substrate is substantially reduced from the viewpoint of the adhesive force action. This facilitates peeling of the thin substrate from the adhesive resin layer.

(Feature of the invention of claim 5)
In the thin substrate carrier according to the invention described in claim 5 (hereinafter referred to as “the carrier of claim 5” as appropriate), the basic structure of the carrier according to any one of claims 1 to 3 is provided, and then the thick region is formed. The contour is formed in the same shape (same contour) as the contour of the region occupied by the attached thin substrate, and the thin region is formed in at least one place inside the thick region.

  According to the carrier of claim 5, in addition to the function and effect of the carrier according to any one of claims 1 to 3, the adhesive resin surface (thick region) acting on the entire back surface of the thin substrate is formed in the thin region. It is weakened by the existence of the area. In other words, the sum of the thick area adhesive force and the thin area adhesive force that does not act or is weakened even if it acts, acts on the entire back surface of the thin substrate. If converted into the adhesive force per area, the converted value becomes smaller than that in the absence of the thin region. That is, the contact area between the upper surface of the adhesive resin layer and the rear surface of the thin substrate is substantially reduced from the viewpoint of the adhesive force action. Since the adhesive force is reduced, the thin substrate is easily peeled off from the adhesive resin layer.

(Characteristics of the invention described in claim 6)
A thin substrate carrier according to the invention described in claim 6 (hereinafter, appropriately referred to as “carrier of claim 6”) includes a base plate having an upper surface and an adhesive region set on the upper surface of the base plate, and the adhesive region A plurality of small resin portions having an upper surface that is substantially flush with the upper surface of the base plate are formed therein.

  According to the carrier of claim 6, since the small resin part that can adhere to the thin substrate and the upper surface of the non-adhesive base plate coexist in the adhesive region, the substantial adhesive force viewed from the entire adhesive region. Will be weakened by the presence of the non-sticky part. Due to the weakening, the thin substrate can be easily peeled off from the base plate 92.

(Feature of the invention of claim 7)
A manufacturing method of a thin substrate carrier according to the invention described in claim 7 (hereinafter referred to as “manufacturing method of claim 7” as appropriate) includes a step of creating a base plate having a raised protrusion corresponding to a thin region on the upper surface, And forming a flat adhesive resin layer on the upper surface of the base plate.

  According to the manufacturing method of the seventh aspect, the base plate having the raised protrusion on the upper surface is obtained by the first step. In the next step, a base plate covered with an adhesive resin layer is obtained. The pressure-sensitive adhesive resin layer encloses the entire raised protrusion and the upper surface thereof becomes flat. The height of the raised protrusion and the shape in the plane direction are, for example, the magnitude of the adhesive force that should be exerted on the thin substrate after comprehensively considering the size and shape of the thin substrate to be attached and the properties of the lower surface. The size, shape, etc. are set according to the above. The presence of the raised protrusion weakens the adhesive strength of the thin area on the upper surface of the adhesive resin layer. A thick region having a relatively large adhesive force and a thin region having a relatively small adhesive force coexist on the upper surface of the adhesive resin layer of the carrier. Since the selection of the shape of the thin region is the selection of the planar shape of the raised protrusion as it is, the base plate on which the adhesive resin layer is formed is used as a common member, and in other words, the raised protrusion having a different shape is used in combination. By changing only the planar shape of the raised protrusion, it is possible to manufacture a thin substrate carrier that can accommodate various shapes of thin substrates.

(Characteristics of the invention described in claim 8)
A method of manufacturing a thin substrate carrier according to the invention of claim 8 (hereinafter referred to as “manufacturing method of claim 8” as appropriate) includes a step of forming raised protrusions on the upper surface of the base plate, And a step of forming an adhesive resin layer having a flat upper surface.

  According to the manufacturing method of the eighth aspect, the base plate having the raised protrusion on the upper surface is obtained by the first step. In the next step, a base plate covered with an adhesive resin layer is obtained. The pressure-sensitive adhesive resin layer encloses the entire raised protrusion and flattens its upper surface. The height of the raised protrusion and the shape in the plane direction are, for example, the magnitude of the adhesive force that should be exerted on the thin substrate after comprehensively considering the size and shape of the thin substrate to be attached and the properties of the lower surface. The size, shape, etc. are set according to the above. The presence of the raised protrusion weakens the adhesive strength of the thin area on the upper surface of the adhesive resin layer. A thick region having a relatively large adhesive force and a thin region having a relatively small adhesive force coexist on the upper surface of the adhesive resin layer of the carrier. Since the selection of the shape of the thin region is the selection of the planar shape of the raised protrusion as it is, the base plate on which the adhesive resin layer is formed is used as a common member, and in other words, the raised protrusion having a different shape is used in combination. By changing only the planar shape of the raised protrusion, it is possible to manufacture a thin substrate carrier that can accommodate various shapes of thin substrates.

(Feature of the invention of claim 9)
In the method for manufacturing a thin substrate carrier according to the invention described in claim 9 (hereinafter referred to as “the manufacturing method according to claim 9” as appropriate), the raised protrusion is provided with the basic configuration of the manufacturing method according to claim 7. Is formed using the same resin as that of the adhesive resin layer before the adhesive resin layer is formed. That is, the adhesive resin layer is formed after the previously formed resin layer is solidified to form raised protrusions. Although the adhesive resin layer and the raised protrusion are formed of the same resin, since both are formed separately, both are not integrated and a boundary (interface) exists between them.

  According to the manufacturing method of claim 9, in addition to the effects of the manufacturing method of claim 7, the same resin as the resin of the pressure-sensitive adhesive resin layer can be used for forming the raised protrusion, so that the labor of changing the raw material is saved. be able to. That is, not only when the raised protrusion and the adhesive resin layer are formed in the same forming equipment, but also when the raised protrusion and the adhesive resin layer are formed in different equipment, only one kind of raw material resin is prepared, and there is no need to change the raw material.

(Features of the invention of claim 10)
In the method for manufacturing a thin substrate carrier according to the invention described in claim 10 (hereinafter, referred to as “the manufacturing method of claim 10” as appropriate), the raised protrusion is provided with the basic configuration of the manufacturing method of claim 8. In place of forming a thin substrate before transporting one or two or more, or by processing one or more thin substrates before transporting, It is comprised so that it may install on the said upper surface. The main processing is, for example, a part such as a through-hole or notch that will correspond to the thin region if there is no processing, and that corresponds to the thick region by the processing.

  According to the manufacturing method of the tenth aspect, in addition to the function and effect of the manufacturing method of the seventh aspect, the thin substrate itself or a material obtained by processing the thin substrate can be used. Therefore, it is possible to reduce the time required for forming the raised region corresponding to the thin substrate to be transferred separately from the thin substrate before transfer. That is, the manufacturing process of the entire carrier can be simplified. If processing is performed, much labor is required, but still less labor is required compared to the case where the raised protrusion is formed from the beginning.

(Characteristic of the invention of claim 11)
In the method for manufacturing a thin substrate carrier according to the invention of claim 11 (hereinafter, referred to as “manufacturing method of claim 11” as appropriate), the basic structure of the manufacturing method of claim 10 is provided, and then the processing is performed. , Through holes and / or notches are formed.

  According to the manufacturing method of claim 11, in addition to the operational effect of the manufacturing method of claim 10, the region corresponding to either or both of the through hole and the notch is a thick region, and the thick region is to be conveyed. The adhesive force with respect to the back surface of the thin substrate can be increased. In other words, a thin region that is the same shape as the thin substrate is formed only with an unprocessed thin substrate. If there is not enough adhesive strength to hold the thin substrate, the thin region is reduced by the above processing (the thick region is increased). ). That is, the adhesive force can be adjusted by selecting whether to use the through hole and the notch in combination, or to use only one of them, or to use the size and number of the through holes.

  According to the thin substrate carrier of the present invention, the upper surface of the adhesive resin layer remains flat, and the lower surface of the adhesive resin layer is supported by the upper surface of the base plate or the raised protrusions. It is possible to efficiently adjust the adhesive strength of the upper surface (sticking surface) of the adhesive resin layer without forming a film. Moreover, according to the manufacturing method of the thin substrate carrier which concerns on this invention, the above-mentioned thin substrate carrier can be manufactured easily.

  The best mode for carrying out the present invention (hereinafter referred to as “the present embodiment”) will be described with reference to the drawings. 1 and 2 are perspective views of a carrier and a thin substrate. FIG. 3 is a longitudinal sectional view for explaining the outline of the carrier manufacturing process. 4 and 5 are perspective views for illustrating a carrier manufacturing process. FIG. 6 is a perspective view for illustrating a method of using the carrier. 7 to 10 are longitudinal sectional views for illustrating a method of using the carrier. FIG. 11 is a perspective view illustrating how to use the carrier. FIG. 12 is a cross-sectional view showing the experimental apparatus. FIG. 13 is a perspective view showing a first modification of the present embodiment. FIG. 14 is a longitudinal sectional view showing a second modification of the present embodiment. 15 to 16 are perspective views showing a third modification of the present embodiment. FIG. 17 is a perspective view showing a fourth modification of the present embodiment. FIG. 18 is a longitudinal sectional view showing a fourth modification of the present embodiment. The thick region 7 shown in FIGS. 1, 2, 5, 6, 11, and 16 and the thick region 67 shown in FIG. 13 are hatched. This is easy to distinguish from the thin regions 9 and 69. This is for convenience.

(Schematic structure of carrier)
This will be described with reference to FIGS. The carrier 1 is schematically configured from a base plate 3 and an adhesive resin layer 5 formed on one surface (upper surface) of the rectangular base plate 3. The chamfered portion 3a and the through-hole 3b provided at the corner of the base plate 3 are used for recognizing the direction (front and rear) of the base plate 3 by differentiating from other corners not provided with these. It is. The base plate 3 is made of, for example, an aluminum plate having a thickness of about 1 mm, and the adhesive resin layer 5 is made of, for example, a fluororesin having a thickness of about 100 μm. Each size (width) is formed in a sufficient size according to the shape and size of the thin substrate 31 to be transported. For example, when the size of the thin substrate 31 is about 85 mm × 45 mm including the maximum protrusion, the base plate 3 can be about 140 mm × 80 mm, and the adhesive resin layer 5 can be about 120 mm × 60 mm. . The carrier 1 is made for the purpose of transporting a single thin substrate 31, but can also be made to carry a plurality of thin substrates attached to a single large carrier (described later). . Furthermore, in addition to aluminum, a metal such as stainless steel or magnesium, a resin such as glass epoxy, or the like can be used as appropriate for the base plate 3. Can be used as long as they are not affected at all or are not adversely affected. In addition, a resin other than the fluororesin, for example, a silicone resin can be suitably used for the adhesive resin layer 5.

  The upper surface region of the adhesive resin layer 5 is divided into a thick region 7 shown by shading in FIGS. 1 and 2 and a thin region 9 also shown by white, and the adhesive force of the thin region 9 is raised as described later. By the protrusions 4..., The adhesive strength of the thick region 7 is weakened. The thin regions 9,... Are formed by a plurality of small circular regions scattered in the thick region 7. The reason for the scattering is to make it easy to peel off the thin substrate 31 attached to the adhesive resin layer 5. That is, the sum of the adhesive force of the thick region 7 and the adhesive force of the thin region 9 that has been weakened even if it does not act acts on the entire back surface of the thin substrate 31. Is converted into an adhesive force per unit area on the back surface of the thin substrate 31, the converted value is smaller than that in the case where the thin region 9 is absent. That is, the contact area between the upper surface of the adhesive resin layer 5 and the back surface of the thin substrate 31 is substantially reduced from the viewpoint of the adhesive force action. This makes it easier to peel the thin substrate from the adhesive resin layer. In order to make it easy to peel, there are a method of weakening the adhesive strength of the thick region 7 as a whole and a method of reducing the area of the thick region 7. In this embodiment, the latter method is adopted. Specifically, a substantial area reduction of the thick region 7 is realized by forming a small circular thin region 9 in the thick region 7. It should be noted that the shaded area of the thick area 7 is merely a display for easy identification of the thin area 9,... (The same applies to other drawings), and the actual surface of the adhesive resin layer 5 is It is not necessarily clearly divided as shown.

(Carrier manufacturing method)
Based on FIG. 3, the outline of a carrier manufacturing method is demonstrated. The manufacturing method of the carrier 1 includes the following two steps. In the first step, the base plate 3 having the raised protrusions 4,. In the present embodiment, the raised protrusions 4 are formed by pressing an aluminum plate. In the second step, the adhesive resin layer 5 is formed on the upper surface of the base plate 3. The upper surface of the adhesive resin layer 5 is formed flat. This completes the carrier manufacturing process. Since the carrier 1 manufactured by the above process has the upper surface of the adhesive resin layer 5 formed flat, the raised protrusions 4,... Protrude from the upper surface of the adhesive resin layer 5 as shown in FIG. It is coated without. The thickness of the adhesive resin layer 5 varies depending on the presence or absence of the raised protrusions 4. That is, as shown in FIG. 3C, the thickness dimension T1 based on the upper surface of the adhesive resin layer 5 in the thin region 9 raised by the raised protrusions 4,. Becomes smaller than the thickness dimension T2. The thicker the thickness, the greater the adhesive strength than the thinner, as the experimental results described below show.

  A specific method of manufacturing the carrier will be described with reference to FIGS. A rectangular frame-shaped mask 21 is overlaid on the upper surface of the base plate 3 on which the raised protrusions 4,. A rectangular portion is formed inside the mask 21, and the thickness dimension of the mask 21 is larger than the height dimension of the raised protrusion 4 as viewed from the upper surface of the base plate 3. Needless to say, it is necessary for coating. After fixing on the base plate 3, an adhesive resin is printed on the extracted portion of the mask 21 and cured. The usage method of the carrier 1 manufactured in this way will be described in the following section.

  Reference is made to FIGS. As shown in FIG. 1, a thin substrate 31 is attached to the upper surface of the adhesive resin layer 5 of the carrier 1. Actually, the thin substrate 31 placed at a predetermined position is lightly pressed by hand, and the adhesive force of the adhesive resin layer 5 acts to temporarily fix the thin substrate 31 (see FIG. 2). Next, a metal mask 115 is placed on the thin substrate 31. The metal mask 115 is formed with a plurality of through holes 116 (see FIGS. 7 and 8) through which cream solder to be printed on the thin substrate 31 passes. The metal mask 115 is temporarily fixed by a clamp (not shown). Next, cream solder 117 is placed on the metal mask 115 and squeezed with a squeegee 119 (see FIGS. 7 and 8). Since the upper surface of the adhesive resin layer 5 is squeezed in the forming process, it is substantially flat, and the thin substrate 31 placed on the flat upper surface is squeezed for cream solder printing. Even if it receives, it is not distorted extremely. Therefore, there is almost no gap between the lower surface of the thin substrate 31 and the upper surface of the adhesive resin layer 5. Since there is no gap, there is no cream solder pushed into it due to the gap. As a result, variation in the amount of cream solder is effectively prevented. When the printing of the cream solder 117 is completed, the metal mask 115 is peeled from the adhesive resin layer 5. Since the adhesive strength is weakened due to the presence of the thin regions 9,..., The metal mask 115 can be peeled off very easily.

  Subsequently, reference is made to FIGS. When cream solder printing is completed, an electronic component group 33 including active components and passive components is mounted (see FIG. 9), and the carrier 1 is reflowed. Cream solder melted by reflow solders the electronic component group 33 to the thin substrate 31 (see FIG. 10). Finally, the thin substrate 31 that has been reflowed is peeled from the adhesive resin layer 5 (mainly the thick region 7) of the carrier 1 (see FIG. 11). Since the adhesive strength of the thick region 7 is substantially weakened by the small circular thin regions 9 formed therein, the thin substrate 31 can be peeled off very easily.

(Experimental result)
FIG. 12 shows an experimental apparatus used by the inventor to measure the adhesive strength (adhesive strength) of the adhesive resin layer 5. The experimental apparatus 51 includes an aluminum plate 43 (with raised protrusions 44 formed) having a fluororesin layer 55 formed on the upper surface, stainless steel cubes 57 and 57 each having a side of 1 cm, a measuring device (not shown), It is comprised by. By forming the raised protrusions 44, the thickness of the adhesive resin layer 55 having a flat upper surface was set to 100 μm in the thick region 55a and 50 μm in the thin region 55b. In the experiment, the same cube 57 was alternately placed on the thick region 55a and the thin region 55b, and the force required to peel and lift the attached cube 57 was measured. The number of measurements is 5 times each. The experimental results are as shown in Table 1.

As understood from Table 1, in the case of the thick region 55a, the maximum is 61.095 kN / m ² (≈0.623 kgf / cm ² ), and the minimum is 35.206 kN / m ² (≈0.359 kgf / cm ^2). ), And the average was 50.916 kN / m ² (≈0.519 kgf / cm ² ). On the other hand, in the case of the thin region 55b, the maximum is 39.423 kN / m ² (≈0.402 kgf / cm ² ), the minimum is 22.948 kN / m ² (≈0.234 kgf / cm ² ), and the average is 30. It was 263 kN / m ² (≈0.308 kgf / cm ² ). When the two maximum values were compared with each other, the adhesive strength was reduced by 35.5%, when the minimum values were compared with each other, it was reduced by 34.8%, and when the average values were compared with each other, it was reduced by 40.6%. Furthermore, according to the tactile observation, some viscosity is felt from the surface of the adhesive resin layer 55a, but very little viscosity is felt from the surface of the adhesive resin layer 55b. From these facts, it was found that the adhesive force can be greatly reduced by forming the raised protrusion 44, that is, by reducing the thickness dimension of the adhesive resin layer 55. Moreover, when the surface was visually observed, the adhesive resin layer 55 was not confirmed to be uneven.

(First modification of this embodiment)
This will be described with reference to FIG. The carrier 61 shown in the first modification differs from the carrier 1 described above in the size of the base plate and the number of adhesive resin layers formed on the base plate. There are no other differences between the two. That is, the carrier 61 includes a large base plate 63 and a plurality of adhesive resin layers 65 formed on the upper surface of the base plate 63. The base plate 63 is made of the same material as the base plate 3 and the adhesive resin layers 65 are made of the same material as the adhesive resin layer 5 so as to achieve the same operational effects. The adhesive resin layer 65 has a thick area 67 and a thin area 69 on its upper surface, and raised protrusions 64 are formed on the base plate 63 corresponding to each of the thin areas 69. Note that the adhesive resin layers 65,... Can be formed as a single continuous layer without being dispersedly arranged.

(Second modification of this embodiment)
This will be described with reference to FIG. The difference between the carrier of the second modification and the carrier of the present embodiment is in the method of forming the raised protrusion. That is, the base plate 73 of the carrier 71 has a flat upper surface, and raised protrusions (resin layers) 74,... Are formed on the upper end of the base plate 73 with resin (see FIG. 14A). When the raised protrusions 74 are solidified (see FIG. 14B, shown in black for the sake of understanding), an adhesive resin layer 75 is formed thereon. The method for forming the raised protrusions 74,... And the adhesive resin layer 75 may be the same as the method for forming the adhesive resin layer 5 described above. The resin constituting each raised protrusion 74 can be different from the resin forming the adhesive resin layer 75, but in the second modification, both are made of the same resin, that is, a fluororesin here. The same resin is used to form the raised protrusions 74,... And the adhesive resin layer 75 in the same forming equipment, as well as in the case of forming in different equipment. This is because there is no need to change raw materials. Although they are made of the same resin, the raised protrusions 74,... And the adhesive resin layer 75 are formed separately, so that they are not integrated and there is a boundary (interface) between them.

(Third Modification of this Embodiment)
Reference is made to FIGS. The carrier of the third modification is different from the carrier of the present embodiment in the method of forming the raised protrusion. In order to form the raised protrusion, the thin substrate 31 ′ before conveyance is used. That is, in the carrier 81, the thin substrate 31 ′ before transporting installed on the upper surface of the base plate 83 is used as the raised protrusion 84. In other words, since the raised protrusion 84 is the thin substrate itself before transport, a thin area 89 corresponding to the shape of the thin substrate to be transported can be formed on the upper surface of the adhesive resin layer 85, so that the raised protrusion corresponding to the thin substrate is formed. This saves you the trouble of trying. If it is not possible to obtain a thickness (height) sufficient to form a raised protrusion with only one thin substrate before conveyance, a plurality of layers may be used. Further, for example, a processing for forming a through hole or a notch is performed on one or a plurality of thin substrates before conveyance, and a portion that corresponds to the thin region 89 if not processed corresponds to the thick region 87 by the processing. You may make it make it.

(Fourth modification of the present embodiment)
This will be described with reference to FIGS. The carrier of the fourth modified example and the carrier of this embodiment are different in the shape of the adhesive resin layer 95. That is, the carrier 91 of the fourth modified example includes a base plate 92, and has an adhesive region 93 indicated by a two-dot chain line in FIG. The adhesive region 93 is a region that can be arbitrarily set by the user in accordance with the shape of the thin substrate to be transported. A plurality of recesses 94 are scattered in the adhesive region 93 of the base plate 92, and each recess 94 is filled with an adhesive resin. Each adhesive resin filled in each concave portion 94 is referred to as a small resin portion 94 in this specification. Each small resin portion 94 is not limited in shape in plan view, and for example, a small round shape or a thin line shape can be selected as appropriate. The upper surface 94a of each small resin portion 94 is formed to be substantially flush with the upper surface 92a of the base plate 92 (see FIG. 18). To summarize the above, an adhesive region 93 is set on the upper surface of the base plate 92, and a plurality of small resin portions 94 having upper surfaces that are substantially the same as the upper surface of the base plate are formed in the adhesive region 93. There will be. According to the carrier 91, since the upper surface of the small resin portion 94 that can be adhered to the thin substrate and the non-adhesive base plate 92 is mixed in the adhesion region 93, the substantial adhesion that looks at the entire adhesion region 93 is obtained. The power is weakened by the amount of the non-sticky part. Due to the weakening, the thin substrate can be easily peeled off from the base plate 92.

It is a perspective view of a carrier and a thin substrate. It is a perspective view of a carrier and a thin substrate. It is a longitudinal cross-sectional view for demonstrating the outline of the manufacturing process of a carrier. It is a perspective view for showing a manufacturing process of a carrier. It is a perspective view for showing a manufacturing process of a carrier. It is a perspective view for showing the usage method of a carrier. It is a longitudinal cross-sectional view for showing the usage method of a carrier. It is a longitudinal cross-sectional view for showing the usage method of a carrier. It is a longitudinal cross-sectional view for showing the usage method of a carrier. It is a longitudinal cross-sectional view for showing the usage method of a carrier. It is a perspective view for showing the usage method of a carrier. It is sectional drawing which shows an experimental apparatus. It is a perspective view which shows the 1st modification of this embodiment. It is a longitudinal cross-sectional view which shows the 2nd modification of this embodiment. It is a perspective view which shows the 3rd modification of this embodiment. It is a perspective view which shows the 3rd modification of this embodiment. It is a perspective view which shows the 4th modification of this embodiment. It is a longitudinal cross-sectional view which shows the 4th modification of this embodiment. It is a top view of the conventional carrier. It is a top view of the conventional carrier. It is a longitudinal cross-sectional view of the carrier for demonstrating a prior art. It is a longitudinal cross-sectional view of the carrier for demonstrating a prior art. It is a longitudinal cross-sectional view of the carrier for demonstrating a prior art.

Explanation of symbols

1, 61, 71, 81, 91 Carrier 3, 63, 73, 83, 92 Base plate 4, 64, 74, 84 Raised protrusion 5, 65, 75 Adhesive resin layer 7, 67, 87 Thick region 9, 69, 89 Thin area 3a Chamfered portion 3b Through hole 21 Mask 22 Through hole 31 Thin substrate 31 'Thin substrate 31c Cutout portion 31h Through hole 33 Electronic component group 51 Experimental device 53 Aluminum plate 55 Fluoro resin layer 57 Cube 93 Adhesive region 94 Small resin portion 101 , 101 ′ Carrier 103, 103 ′ Base plate 104 Through hole 105, 105 ′ Adhesive resin layer 105 ′ Through hole 106 Gap 111 Thin substrate 115 Metal mask 116 Through hole 117 Cream solder 119 Squeegee

Claims (11)

A base plate having an upper surface;
An upper surface flat adhesive resin layer formed on the upper surface of the base plate,
The adhesive resin layer upper surface is divided into a thick region for allowing a part or all of the lower surface of the thin substrate to be peeled and a thin region other than the thick region,
A thin substrate carrier characterized in that an upper surface of the base plate corresponding to the thin region is formed with a raised protrusion that is integral with or separate from the base plate. 2. The thin substrate carrier according to claim 1, wherein the raised protrusion is constituted by a raised resin layer formed separately from the adhesive resin layer using the same resin as the constituent resin of the adhesive resin layer. From the one in which the raised protrusion is formed by stacking one or more thin substrates before transport, or by processing one or two or more thin substrates before transport. The thin substrate carrier according to claim 1, wherein The area occupied when the thin substrate is attached includes a part of the thin area and the thick area surrounded by a part of the thin area. 3. The thin substrate carrier according to any one of 3 above. The outline of the thick area is formed in the same shape as the outline of the area occupied by the attached thin substrate,
The thin substrate carrier according to any one of claims 1 to 3, wherein a thin region is formed in at least one place inside the thick region. A base plate having an upper surface;
An adhesive region set on the upper surface of the base plate,
A thin substrate carrier, wherein a plurality of small resin portions having an upper surface that is substantially flush with the upper surface of the base plate are formed in the adhesive region. Creating a base plate having raised protrusions corresponding to the thin area on the upper surface;
Forming a flat top adhesive resin layer on the top surface of the base plate. A method of manufacturing a thin substrate carrier. Forming a raised protrusion on the upper surface of the base plate;
Forming a flat top adhesive resin layer on the top surface of the base plate. A method of manufacturing a thin substrate carrier. The method of manufacturing a thin substrate carrier according to claim 8, wherein the raised protrusion is formed before the adhesive resin layer is formed using the same resin as the resin of the adhesive resin layer. Instead of forming the raised protrusions, processing was performed on one or two or more thin substrates before transport, or one or two or more thin substrates before transport. The method of manufacturing a thin substrate carrier according to claim 8, wherein a thing is placed on the upper surface. The method of manufacturing a thin substrate carrier according to claim 10, wherein the processing is formation of a through hole and / or a notch.

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