JP2006147379A - Ion generator, its manufacturing method and holding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ion generator, in which soldering can be easily performed and its performance does not fluctuate, as well as its manufacturing method and holding device. <P>SOLUTION: A connecting component on which a number of wire rods 32 are held with a holding part 31 is used to connect a terminal part 21 of an electrode plate to a circuit substrate SB. Since the holding part 31 is fitted into a fixing part 13 to fix it formed in a casing 11, positioning of the wire rods 32 by hand is not necessary when they are soldered. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention includes an electrode plate facing a window hole formed in a casing body, an ion generator for discharging ions from the electrode plate into the air, a manufacturing method thereof, and a holding treatment used when the ion generator is manufactured. Concerning ingredients.

  In this type of conventional ion generating apparatus, a window hole is provided in either the casing body or a lid that covers the opening of the casing body, and an electrode plate is attached so as to close the window hole. The surface of the electrode plate is an ion generating surface, and a terminal portion for supplying high voltage power or the like to the electrode plate is provided on the back surface.

  Further, a circuit board for generating high voltage power to be supplied to the electrode plate is housed in the casing body. It is necessary to electrically connect the circuit board and the terminal part of the electrode, and conventionally, the circuit board and the terminal part are connected by a lead wire (see, for example, Patent Document 1 and Patent Document 2).

  In order to increase the reliability of the ion generator, when the circuit board is stored in the casing body with the electrode plate and the circuit board connected by lead wires, a thermosetting resin such as urethane resin is placed inside the casing body. Potting is performed by filling in.

When performing this potting, the resin is hardened by placing the casing body together with the resin in the casing body and heating the resin together with the casing body.
Japanese Patent Laying-Open No. 2003-45611 (FIG. 8) JP 2004-111135 A (FIGS. 1 and 3)

  Since the electrode plate cannot be perforated due to functional problems, the terminal portion formed on the back surface is formed by depositing a metal foil on the back surface of the electrode plate. Therefore, when soldering the lead wire to the terminal portion, the lead wire must be positioned and soldered by hand, so that the workability is extremely poor and the soldering quality is difficult to be fixed. .

  Moreover, it is desirable that the lead wire be as short as possible, and it is not possible to provide a margin for the length of the lead wire. Therefore, it is difficult to perform the soldering operation, the time required for the soldering process becomes long, and the number of products produced per hour cannot be easily increased.

  Furthermore, the lead wire whose both ends are connected to the terminal portion of the electrode plate and the circuit board is housed between the circuit board and the electrode plate, but the housing is performed manually and the lead wire is bent freely. Therefore, it is difficult to always keep the lead wire in a housed state. If the storage state of the lead wires varies, the line-to-line capacitance between the lead wires is not constant, so that the high-voltage power output from the circuit board to the electrode plate varies and the performance may not be constant.

  In view of the above-described problems, an object of the present invention is to provide an ion generator that can be easily soldered and does not vary in performance.

  In order to solve the above problems, an ion generator according to the present invention is an electrode plate attached to a window hole formed in a wall surface of a casing body so as to close the window hole and an ion generation surface facing the outside. And an ion generator including a connection member that electrically connects a circuit board for high voltage generation housed in the casing body and a plurality of terminal portions formed on the inner surface of the electrode plate, The connection member is formed by a plurality of conductive wire rods corresponding to each of the plurality of terminal portions and a holding portion for holding the wire rods corresponding to the respective terminal portions, and soldering the tip ends of the respective wire rods to the terminal portions. And the other end of the wire rod is soldered to the circuit board with the other end penetrating the circuit board.

  Unlike the lead wire, the shape of the wire of the connecting member does not change with a small external force, so that positioning is easy even during soldering, and soldering can be performed easily. Furthermore, since each wire is held by the holding portion, for example, if the holding portion is positioned, all the wires can be positioned.

  The connection member may be positioned by hand, but if the casing is provided with a fixing portion for fixing the connection member to the casing body so that the tip of each wire abuts the terminal portion, the connection member is positioned by hand. Since there is no need, soldering work becomes easier.

  By the way, although existing connectors may be used in place of the connecting member, when soldering to the terminal portion of the electrode plate, heat is drawn to the electrode plate, so it is necessary to heat for a long time. Then, in the conventional connector, the resin part is softened by the heat at the time of soldering, and reliability may not be ensured. Therefore, it is desirable to form the holding portion of the connection member with a heat resistant material.

  In order to solve the above problems, an ion generator according to the present invention is attached to a window hole formed in a wall surface of a casing body so as to close the window hole and an ion generation surface faces the outside. In the ion generator that includes an electrode plate and electrically connects a circuit board for generating high voltage stored in the casing body and a plurality of terminal portions formed on an inner surface of the electrode plate, the plurality of terminals A plurality of conductive wires corresponding to each of the parts are held on the casing body in correspondence with each terminal part, and the tip of each wire is soldered to the terminal part, and the other end of the wire is passed through the circuit board. It is characterized in that it is soldered to the circuit board in a state where

  Alternatively, a high-pressure generator is provided in the window hole formed in the wall surface of the casing body, and includes an electrode plate that is attached so that the window hole is closed and the ion generation surface faces the outside. In an ion generator manufacturing method for electrically connecting a circuit board for use with a plurality of terminal portions formed on an inner surface of an electrode plate, a plurality of conductive wires corresponding to each of the plurality of terminal portions Is held by the holding jig in a state corresponding to each terminal part, the tip of each wire is soldered to the terminal part, and then the holding jig is removed from the casing body, and the other end of the wire is passed through the circuit board. It is characterized in that it is soldered to the circuit board in a state where

  In this case, it is desirable to position the wire relative to the terminal by positioning the holding jig relative to the casing body when soldering the tip of each wire to the terminal.

  Further, in this case, an electrode plate is provided in a window hole formed on the wall surface of the casing body so as to close the window hole and the ion generation surface faces the outside, and is housed in the casing body. A holding jig used for manufacturing an ion generator for electrically connecting a circuit board for generating high voltage and a plurality of terminal portions formed on the inner surface of the electrode plate, each of the plurality of terminal portions A plurality of corresponding conductive wires are held in a state corresponding to the respective terminal portions, and a positioning portion for positioning with respect to the casing body is provided in order to position the wires with respect to the terminal portions. A holding jig may be used.

  As is clear from the above description, in the present invention, since the terminal portion of the electrode plate and the circuit board are connected using a connecting member, the positioning of the wire is more than that in the case of connecting with a flexible lead wire. Easy soldering can be done quickly and accurately. Moreover, since the wire is integrally held by the holding portion, it is not necessary to position each wire separately.

  Furthermore, since the spacing between the wire rods is kept constant, the interline capacitance between the wire rods does not vary.

  With reference to FIG. 1, 1 shows an example of the ion generator by this invention. This ion generator is composed of a resin-molded casing main body 11 and a cover 12 bonded to the casing main body 11 in an engaged state. Reference numeral 13 denotes a cord for supplying electric power to the ion generator 13 from the outside. The electrode plate 2 is attached to the casing body 11. In this electrode plate 2, foil-like electrodes are alternately laminated with thin ceramic layers, and when high-voltage AC power is supplied, they discharge to generate ions and release them into the air.

  Referring to FIG. 2, this figure shows a state that is inverted upside down from the state shown in FIG. Four terminal portions 21 are formed on the back surface, that is, the inner side surface of the electrode plate 2, and the circuit board SB and these terminal portions 21 are connected by a conductive wire 32. That is, one end of each wire 32 is soldered to the terminal portion 21 and the other end is soldered to the circuit board SB.

  The wire 32 penetrates through the plate-like holding part 31 and is held by the holding part 31 at a predetermined interval. In the present embodiment, the holding portion 31 is formed of an epoxy resin containing glass fiber, and is excellent in heat resistance and strength. The material of the holding part 31 is not particularly limited as long as it can withstand the heat during potting.

  In addition, as shown in FIG. 2, in the state which connected the terminal part 21 and the circuit board SB of the electrode plate 2 with the wire 32, it filled with the urethane resin until the liquid level became the position of P in the casing 11, and then Potting is done by heating.

  Incidentally, as shown in FIG. 3, the connecting member 3 is configured by the wire 32 and the holding portion 31. In addition, a pair of inverted L-shaped fixing portions 13 are formed inside the casing 11. The electrode plate 2 is fixed from the outside so as to close the window hole 11 a formed at the bottom of the casing 11. Then, the terminal part 21 is exposed to the inside of the casing 11 from the window hole 11a. In this state, the connection member 3 is fixed to the fixing portion 13. In the drawing, the holding portion 31 is engaged with the fixing portion 13 by sliding in the horizontal direction so that the holding portion 31 of the connecting member 3 is engaged with the fixing portion 13.

  Thus, when the holding | maintenance part 31 was engaged with the fixing | fixed part 13, it set so that the front-end | tip of the wire 32 may contact | abut each terminal part 21. FIG. By setting in this way, when the connecting member 3 is fixed to the casing 11 by the fixing portion 13, it is not necessary to fix the connecting member 3 by hand thereafter, and the work of soldering the tip of the wire 32 to the terminal portion 21 is performed. It can be done easily. In addition, although the wire 32 becomes high temperature at the time of this soldering operation | work, since the holding | maintenance part 31 is excellent in heat resistance as mentioned above, malfunctions, such as a deformation | transformation of the holding | maintenance part 31, do not arise.

  Then, after soldering the tip of each wire 32 to the terminal portion 21, the circuit board SB is mounted in the casing body 11 as shown in FIG. In the circuit board SB, a hole through which the other end of the wire 32 passes is formed in advance. When the circuit board SB is set in the casing body 11 as shown in FIG. 4, the other end of the wire 32 penetrates the circuit board SB. And protrude upwards. A land is formed around a hole through which the wire 32 penetrates, and the wire 32 protruding from the circuit board SB is soldered to the circuit board SB. It is not necessary to position the wire 32 by hand during this soldering operation. When the soldering operation is completed, the urethane resin is filled in the casing 11 until the liquid level reaches the position P as described above, and after heating and curing, the cover 12 is adhered to the casing body 11 to be ionized. The generator 1 is completed.

  By the way, in the above embodiment. Although the connection member 3 is used, the structure which does not use the connection member 3 is also considered. With reference to FIG. 5 and FIG. 6, a holding portion 14 that holds the wire 32 may be provided in the casing body 11, and the wire 32 may be directly held by the casing body 11. In this configuration, in FIG. 5 and FIG. 6, a vertical through hole is formed in the holding portion 14 in advance in the wire 32, the wire is inserted from below, and the wire 32 is held by the holding portion 14. Thereafter, the electrode plate 2 is bonded to the casing body 11. When the bonding step is completed, one end of the wire 32 is soldered to the terminal portion, and the other end of the wire 32 is soldered to the circuit board SB in the same manner as described above.

  Alternatively, as shown in FIG. 7, the wire 32 may be soldered to the terminal portion while the holding jig 4 is positioned on the casing body 11 while the wire 32 is held by the holding jig 4. .

  The holding jig 4 has a positioning grip 42 at the lower end of the base 41. The positioning grip 42 is formed with four vertical grooves for positioning the wire 32. And the wire 32 is hold | gripped in the state fitted to the vertical groove. On the other hand, a holding grip 43 that is swingably connected to the base 41 presses the wire 32 so that the wire 32 does not fall out of the longitudinal groove.

  The press gripping portion 43 is always urged by a torsion spring (not shown) in a direction in which it presses against the positioning gripping portion 42. The holding jig 4 can be removed from the wire 32 by moving away from the positioning grip 42 against the urging force.

  By the way, both end portions 43 a of the pressing and gripping portion 43 abut against a pair of positioning portions 15 formed on the casing body 11, so that the holding jig 4 can be positioned with respect to the casing body 11. Then, one end of the wire rod 32 is soldered to the terminal portion in the positioned state. Thereafter, the holding jig 4 is taken out from the casing body 11, and the other end of the wire 32 is soldered to the circuit board SB in the same manner as described above.

  In addition, this invention is not limited to an above-described form, You may add a various change in the range which does not deviate from the summary of this invention.

The figure which shows the structure of one embodiment of this invention Cross section of ion generator The figure which shows the attachment state of the connection member Sectional view showing the attachment state of the connecting member The figure which shows 2nd Embodiment VI-VI cross section The figure which shows 3rd Embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ion generator 2 Electrode plate 3 Connection member 4 Holding jig 13 Fixing part 11 Casing main body 21 Terminal part 31 Holding part 32 Wire material

Claims (7)

  The window hole formed in the wall surface of the casing body is provided with an electrode plate attached so that the window hole is closed and the ion generation surface faces the outside, and is used for generating a high voltage stored in the casing body. In an ion generator including a circuit board and a connection member that electrically connects a plurality of terminal portions formed on an inner surface of the electrode plate, a plurality of conductive materials corresponding to each of the plurality of terminal portions. The connecting member is formed by a wire rod and a holding portion that holds the wire rod in correspondence with each terminal portion, the tip of each wire rod is soldered to the terminal portion, and the other end of the wire rod is passed through the circuit board. An ion generator characterized by being soldered to a circuit board in a state.   The ion generator according to claim 1, wherein a fixing portion for fixing the connecting member to the casing body is formed on the casing so that the tip of each wire rod comes into contact with the terminal portion.   The ion generator according to claim 1, wherein the holding portion of the connection member is formed of a heat resistant material.   The window hole formed in the wall surface of the casing body is provided with an electrode plate attached so that the window hole is closed and the ion generation surface faces the outside, and is used for generating a high voltage stored in the casing body. In an ion generator for electrically connecting a circuit board and a plurality of terminal portions formed on an inner surface of an electrode plate, a plurality of conductive wires corresponding to each of the plurality of terminal portions are connected to each terminal portion. The ion is characterized in that the tip of each wire rod is soldered to the terminal portion while being held by the casing body in correspondence with the solder, and the other end of the wire rod is soldered to the circuit board with the circuit board penetrating the other end. Generator.   The window hole formed in the wall surface of the casing body is provided with an electrode plate attached so that the window hole is closed and the ion generation surface faces the outside, and is used for generating a high voltage stored in the casing body. In the manufacturing method of an ion generator for electrically connecting a circuit board and a plurality of terminal portions formed on the inner surface of the electrode plate, a plurality of conductive wires corresponding to each of the plurality of terminal portions, The holding jig is held in a state corresponding to each terminal part, the tip of each wire is soldered to the terminal part, and then the holding jig is removed from the casing body, and the other end of the wire is passed through the circuit board. A method of manufacturing an ion generator, wherein the circuit board is soldered with   6. The ion according to claim 5, wherein when the tip of each wire is soldered to the terminal portion, the wire is positioned with respect to the terminal portion by positioning the holding jig with respect to the casing body. A method of manufacturing a generator. The window hole formed in the wall surface of the casing body is provided with an electrode plate attached so that the window hole is closed and the ion generation surface faces the outside, and is used for generating a high voltage stored in the casing body. A holding jig for use in manufacturing an ion generator for electrically connecting a circuit board and a plurality of terminal portions formed on an inner surface of an electrode plate, and a plurality of conductive members corresponding to each of the plurality of terminal portions. A holding jig comprising a positioning portion for positioning the wire rod with respect to the terminal body in order to hold the wire in a state corresponding to each terminal portion and to position the wire rod with respect to the terminal portion .

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