TWI265614B - Manufacturing method for electronic components used in signal transmission - Google Patents

Abstract

A manufacturing method for electronic components used in signal transmission comprises the following steps: winding at least one wire of at least one transforming unit on at least one inner terminal of at least one lead of a packaging case; disposing the transforming unit beyond the inner terminal side of the packaging case to arrive at an opposite side thereof; turning over the inner terminal of the packaging case for permitting the winding portion of the inner terminal to face downwardly, and immersing the inner terminal of the packaging case into a solder material of a soldering container; and drawing the winding portion of the inner terminal out of the soldering container so that the winding portion of the inner terminal forms a connecting portion for electrically connecting the wire of the transforming unit.

Description

1265614 V. INSTRUCTIONS (1) [Technical field to be issued 1] Ϊ Ϊ 以 以 以 以 以 以 = 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输A number of leads, the welding action, to accelerate the manufacturing process of the signal transmission electronic components. f珣[Prior Art] A network device such as a data plane, a telephone, a hub, and an adapter for a local area network (LAN) or a signal transmission device is provided with at least one The connector [C〇nnect〇r] is used to form a complete regional network network via the t-network route. Conventional signal transmission connection: As described in the new patent of the "Communication Network Connector Slot Structure" of the Republic of China Announcement No. 4 0 8 8 9 2, it is usually built directly inside a joint housing, and several transformer components are used. The voltage level of the input pulse for the modulation network. However, when the same network device has several identical connectors (joints), the industry has evolved to design a plurality of transformer components used in each connector to form a transformer package component to further simplify the connection. The structure of the device itself is as shown in FIG. 1 . The transformer package component comprises a package housing #〇, a package cover 20 and a plurality of transformer elements 30. The package housing 1 is provided with a chamber 11 and a plurality of arches 12 are arranged on both sides thereof. Each of the pins 2 has an inner terminal 121 and an outer terminal 122. In the conventional process, one of the leads 31 of the transformer element 30 is soldered to the terminal 121 of the pin 12 by manual soldering and soldering. However, when the operator welds the transformer element 30 one by one, the solder easily accidentally sticks to the adjacent two.

1265614 Description of the invention (2) On the terminal 121, unnecessary electricity is formed, and insufficient soldering is caused, resulting in electrical connection, or it may also reduce production yield, and the production system is good. All of the above operational problems lead to mass production. Based on the above factors, it is time-consuming and labor-intensive for the second=9 fresh, and it is not suitable for the large-sized transmission electronic components. It is necessary to further improve the above-mentioned information. In view of this, the present invention improves the internal terminals of the plurality of pins respectively. One of the package housings is retracted. Pile 荽, i Μ丄 Μ丄 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少...the acceleration and simplification of the process, and [invention] The main object of the present invention is to utilize a lead-in component of a soldering component, to simplify the process, and to perform the signal step according to the present invention: at least one transformer is at least one pin At least the housing is moved away from the inner terminal toward the lower side, and each

Providing a synchronized welding operation to further enhance at least one internal terminal of the electronic component for transmission; one side of the sub-side; the inner terminal of the inverted inner winding is used for transmission of a plurality of pieces to make the yield component The lead wire is embossed to provide an effect of the acceleration of the terminal in the manufacturing lead of the electronic component of the sealed lead. The method comprises the steps of: arranging the package component relative to the package housing to synchronize the inner end of the package component into a solder bath; and moving the inner terminal of the package housing out of the solder bath, such that the inner terminal is formed a soldering portion for stably electrically connecting the leads of the transformer element.

[Brief Description of the Invention] [Embodiment] The above features and advantages of the present invention will become more apparent in the following description. ...b and with the accompanying drawings 'clear reference to Figures 2 and 3, the present invention compares the electronic component paste white ## Γ The signal transmission for the application example ii: body 10, a package cover 2〇 And at least, the piece 30 [electron early body] 'the use of - the soldering pool 40 and the dream of the welding operation' is finally embedded by a package of colloid 50 i ": = signal transmission electronics Finished components. Depending on the product requirements, the electronic component 30 can also be replaced with other electronic unit. For example, the furnace wave component, please refer to the figures 2, 3 and 4, and the manufacture of the electronic component for signal transmission according to the preferred embodiment of the present invention. The first step of the method is to wind the lead 31 of the transformer element sub-unit body onto the pin of the sealing case 1〇! 2 sub 1 2 1. More specifically, the package housing of the present invention is provided with a valley to 11, a plurality of pins 12 and a bottom opening 13. The chamber η is for accommodating the transformer element 30. The pin 12 is substantially embedded in the sidewall of the package housing ’ and one end of the pin 12 is exposed to form at least one of the inner terminal 1 2 1 and at least one outer terminal 1 22 . The bottom opening 13 provides an adjustment space for the transforming element 30 to move up and down. The transformer element 3 is twisted with a core of an enamel wire and has at least one of the leads 31. Referring to FIGS. 2 and 5, the second step of the method for manufacturing the signal transmission electronic component according to the preferred embodiment of the present invention is: the transformer element 30 (electronic unit body) is opposed to the package housing 10 Moving away from the inner terminal 121

C:\Logo-5\Five Coatinents\PK9805.ptd Page 9 1265614 V. DESCRIPTION OF THE INVENTION (4) The present invention preferably uses the applicable tool to move the transformation == to the package housing 10 The outer side of the bottom opening 13 is. At this time, the lead 31 of the ferrule 3 is maintained to be wound around the inner terminals 1 21 of the package case 10. The second step of the method for manufacturing the signal transmission according to the preferred embodiment of the present invention is to invert the package housing i such that the inner terminal 121 faces downward. The portions of the inner leads 121 around which the leads 3 j are wound are simultaneously immersed in the solder bath 4 。. More specifically, the solder bath 40 of the present invention has heated and melted solder 41, such as solder or the like. Further, it is necessary to control the inner terminal 121 to immerse only the portion around which the lead 31 is wound into the solder bath 40 to avoid excessive immersion, resulting in unnecessary electrical connection between adjacent inner terminals j2 j to form unnecessary electrical properties. connection. Thereby, the portions of the inner terminals 丨21 wound around the leads 31 can simultaneously complete the soldering step to accelerate and simplify

Referring again to FIGS. 2 and 7, the fourth step of the method for manufacturing the electronic component for signal transmission according to the preferred embodiment of the present invention is to remove the inner terminal 1 1 1 of the package housing from the solder bath. 4 〇, the inner terminal 1 2 1 forms a soldering portion 4 2 to firmly connect the #丨 line 3 1 of the transformer element 3 电子 [electronic unit body]. More specifically, after the inner terminal 112 of the present invention is removed from the solder bath 40, the solder adhered to each of the inner terminals 21 is solidified into the solder portion 42 by appropriate cooling treatment. Thereby, each of the inner terminals 121 can be correspondingly connected to the lead 3 1 of the transformer element 30 in a stable manner. Referring to FIGS. 2 and 7, the fifth and sixth steps of the method for manufacturing the electronic component for signal transmission according to the preferred embodiment of the present invention are: testing the inner ends.

C:\Logo-5\Fi ve Continents\PK9805. ptd Page 10 1265614 V. Inventive Note (5): The electrical conductivity of the lead 31 of 121 and the element 30 (electronic unit body) is used. The transformer element 30 in the embedding and packaging fixing 10 [electronic single opening ΐ garment into the limb electronic component finished product. More specifically, in order to obtain the signal transmission ^ - 1 Φ ^ 』 more flat σ, the invention can be detected by a detecting machine [f,,: the outer terminal 12 of the foot 12 to detect the welding And if there is excessive soldering, etc., the package cover is 2°, 2; etV) t; 713^^^^50 ? 曰 [epoxy]. Hunting this, you can get a transformer package 丨 other electronic components of the signal transmission connector. For example, as described above, compared with the conventional signal of the first drawing, the manufacturing method simply uses manual welding to reduce the yield by a point, and the invention of FIG. 2 causes the pins by inverting the package I. The inner terminal 121 of the U is immersed downward in a solder bath 4 〇 = ', so that the inner terminal 121 of the foot 12 is synchronized to complete the welding operation. Thereby, the clear acceleration can be relatively accelerated and the process can be simplified, and the manufacturing process can be further improved. The invention has been disclosed in detail using the foregoing preferred embodiments, and it is not obvious that any person skilled in the art can not leave it; invention: = 1⁄2 when various changes and modifications can be made, so the invention is stunned by S The scope of the patent application is subject to change. Page 11 .\Log〇-5\Five Continents\PK9805.ptd 1265614 Simple description of the drawing [Simple description of the drawing] Figure 1: Manufacturing of electronic components for transmission of conventional signals BRIEF DESCRIPTION OF THE DRAWINGS Fig. 2 is a flow chart showing a method of manufacturing an electronic component for signal transmission according to a preferred embodiment of the present invention. Fig. 3 is an exploded perspective view of an electronic component for signal transmission according to a preferred embodiment of the present invention. Figure BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is a cross-sectional view showing a second step of a method for manufacturing a signal transmission electronic component according to a preferred embodiment of the present invention. Figure 6 is a cross-sectional view showing the third step of the manufacturing method of the electronic component for signal transmission according to the preferred embodiment of the present invention. Figure 4 is a fourth embodiment of the method for manufacturing the electronic component for signal transmission according to a preferred embodiment of the present invention. Five-step schematic view 〇 [Main component symbol description] 10 Package housing 11 Housing 12 Pin 1 121 Inner terminal 122 External terminal 13 Bottom opening 20 Package cover 30 Transformer element 31 Lead 40 Solder bath 41 Solder 42 Soldering part 50 package colloid 90 soldering grab 91 solder

C:\Logo-5\Five Continents\PK9805. ptd第12页

Claims (1)

1265614, the patent manufacturing method for manufacturing electronic components for signal transmission, comprising the steps of winding at least one lead of at least one electronic unit body in at least one of at least one pin of a strong '/ a terminal; the electronic unit body is moved away from the side of the package with respect to the package; Μ and the package is inverted to make the inner terminal face downward, and each part of the lead wound is immersed in a solder fusion And the terminal removes the inner terminal of the package housing from the solder bath, and forms a soldering portion to stably electrically connect the inner end line of the electric j.卞 卞 卞 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 电子 电子 电子 电子 电子 电子^ Rate·Test each: "Please:" The second method of transmitting the power of the second component of the signal, in which the test includes another step: 1 ^ Embedding the package to fix the inside of the package The signal transmission electronic component is finished. 卞早凡体4, according to the signal transmission method of the first application patent scope, wherein the electronic unit system is selected from the manufacture of a transformer 7° piece. Text & 70 pieces, filter element 5 A method for transmitting a signal according to the scope of the patent application, wherein the casing comprises a chamber, a manufacturing unit of the element, for placing the electron, according to item 5 of the patent application scope. Manufacture of electronic components for signal transmission 1265614 6. Patent application The method further includes a package cover to close the chamber of the package housing. 7. The method of manufacturing an electronic component for signal transmission according to claim 1, wherein the package housing further comprises a bottom opening, the bottom opening providing an adjustment space for the transformer element to move up and down. The manufacturing method of the electronic component for signal transmission according to the first aspect of the patent application, wherein the pin of the package housing is substantially embedded in the sidewall of the package housing, and the two ends of the pin are respectively exposed to form at least one The inner terminal and the at least one outer terminal. • 9. The manufacturing method of the electronic component for lack signal transmission according to the first application of the patent scope, wherein the solder of the solder bath is selected from solder. C:\Logo-5\Five Continents\PK9805. ptd第14页