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Application filed by Ycl Mechanical Co LtdfiledCriticalYcl Mechanical Co Ltd
Priority to TW94116786ApriorityCriticalpatent/TWI265614B/en
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Publication of TWI265614BpublicationCriticalpatent/TWI265614B/en
Publication of TW200642061ApublicationCriticalpatent/TW200642061A/en
A manufacturing method for electronic components used in signal transmission comprises the following steps: winding at least one wire of at least one transforming unit on at least one inner terminal of at least one lead of a packaging case; disposing the transforming unit beyond the inner terminal side of the packaging case to arrive at an opposite side thereof; turning over the inner terminal of the packaging case for permitting the winding portion of the inner terminal to face downwardly, and immersing the inner terminal of the packaging case into a solder material of a soldering container; and drawing the winding portion of the inner terminal out of the soldering container so that the winding portion of the inner terminal forms a connecting portion for electrically connecting the wire of the transforming unit.
TW94116786A2005-05-232005-05-23Manufacturing method for electronic components used in signal transmission
TWI265614B
(en)
Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package