JP2006140369A - Manufacturing method for electronic part and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for electronic equipment capable of reducing a cost and improving a yield, capable of flattening the surface of a sealing resin and facilitating thinning, and electronic equipment. <P>SOLUTION: Chips 12 are arranged on a substrate 13, and mold-forms 11A, 11B and 11C for resin-molding surrounding regions in which the chips 12 are disposed are molded by filling a metal mold with liquid resin and the pressing of the resin on the substrate 13. The mold-forms 11A, 11B and 11C for resin-molding are arranged at intervals D1. The regions surrounded by the forms 11A, 11B and 11C for resin-molding are filled with the sealing resin sealing the chips 12, and the substrate 13, the sealing resin, and the forms are cut. An electronic part with the section of the substrate 13, the chips 12 and the section of the sealing resin is formed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing, for example, a surface-mount type electronic component.

  Conventionally, as a method for manufacturing this type of electronic component, there is a method as shown in FIGS. 7A to 7E (see Patent Document 1: Japanese Patent Laid-Open No. 11-274373). The manufacturing method of this electronic component is a resin molding by first punching a laminated sheet material composed of a sheet material such as silicon rubber and a double-sided pressure-sensitive adhesive sheet laminated on the sheet material into a frame shape with a mold or the like. A working form 71 is formed. As shown in FIG. 7A, the resin-molding mold 71 is manually attached to a substrate 73 on which a plurality of chips 72 are mounted using a jig or the like. As a result, as shown in FIG. 7B, the periphery of the plurality of chips 72 is surrounded by a mold frame 71 for resin molding. Subsequently, as shown in FIG. 7C, liquid resin is supplied and filled inside the resin molding mold 71 on the substrate 73, and then cured in an oven to cure the resin. A sealing resin 74 is formed. After that, as shown in FIG. 7D, the resin molding form 71 is peeled off from the surface of the substrate 73. 7E, the substrate 73 and the sealing resin 74 are cut along a predetermined cut line with a dicing machine and divided to complete the electronic components 75, 75,.

  However, the conventional method for manufacturing an electronic component has the following problems (1) to (4).

  (1) The silicon rubber of the sheet material constituting the resin molding form 71 is relatively expensive, and most of it is punched and discarded, so that the material use efficiency is low and the cost is high.

  (2) Since the resin-molding mold 71 is attached to the substrate 73 by hand using a jig or the like, the number of steps is relatively large, and it is difficult to reduce the cost.

  (3) The bonding wire falls or breaks due to an operation mistake when the resin molding mold 71 is attached, or the liquid material of the sealing resin leaks due to insufficient adhesion of the resin molding mold 71 to the substrate 73. Such problems may occur, and it is difficult to improve the manufacturing yield.

  (4) The thickness of the silicon rubber and the double-sided pressure-sensitive adhesive sheet of the resin molding form 71 is non-uniform, and in the case of manual attachment to the substrate 73, the silicon rubber is bonded to the substrate 73 by the double-sided pressure-sensitive adhesive sheet. The state becomes uneven. Therefore, the height of the resin molding form 71 becomes non-uniform, and it is difficult to flatten the surface of the sealing resin 74.

(5) Since it is difficult to reduce the thickness of the silicon rubber, it is difficult to reduce the height of the mold 71 for resin molding, it is difficult to reduce the thickness of the sealing resin 74, and it is difficult to reduce the thickness of the electronic component.
Japanese Patent Laid-Open No. 11-274373

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component manufacturing method and an electronic apparatus that can reduce the cost and improve the yield, can flatten the surface of the sealing resin, and can be easily reduced in thickness.

  First, the inventor invented a method for manufacturing an electronic component in order to solve the above-described problems.

The manufacturing method of this electronic component is:
Arranging the elements on the substrate;
On the substrate, a mold surrounding a region where the element is arranged, a mold forming step of filling a mold with liquid resin and pressurizing the mold,
A sealing resin filling step of filling a region surrounded by the mold with a sealing resin for sealing the element;
A cutting step of cutting the substrate, the sealing resin, and the mold to form an electronic component having the substrate portion, the element, and the sealing resin portion is provided.

  That is, in the method of manufacturing the electronic component, as shown in FIG. 8A, after mounting a plurality of chips 82 as an example of an element on a substrate 83, the periphery of the position where the chips 82 are mounted is surrounded. Then, a resin molding mold 81 made of resin is formed. This resin molding mold 81 is formed by injection molding using an injection mold.

  Next, as shown in FIG. 8B, a liquid resin is supplied and filled inside the resin molding mold 81, and the liquid resin is cured by curing in an oven. Form.

  Then, using a dicing machine, as shown in FIG. 8C, the substrate 83, the resin molding form 81 and the sealing resin 84 are cut along predetermined cut lines L, L.

  As a result, a portion of the substrate 83, a chip 82 mounted on the portion of the substrate 83, and a portion of the sealing resin 84 formed on the surface of the portion of the substrate 83 so as to cover the chip 82 are included. A plurality of electronic components 85, 85,... Are completed.

  The portion 16 formed by cutting the resin molding form 81 located around the region where the electronic components 85, 85... Are obtained is an unnecessary portion.

  In addition, as shown in FIG. 9, the electronic component manufacturing method can also be performed on a substrate 93 that can increase the number of electronic components to be taken per sheet as compared with the substrate 83. The substrate 93 is arbitrarily dimensioned in the longitudinal direction and the lateral direction, and has a size suitable for process equipment and jigs.

  In FIG. 9, the area | region which arrange | positions the chip | tip 92 for every predetermined quantity is divided | segmented into plurality with the mold 91 for resin molding. This divided area has a size suitable for molding the liquid sealing resin.

  As the liquid sealing resin, an epoxy resin is usually used, but there are many types other than the epoxy resin. For example, the liquid sealing resin includes a one-component type and a two-component type, and the properties of the liquid sealing resin are various. The properties of the two-component liquid sealing resin differ depending on the blending ratio of the main material and the curing agent.

  It is necessary to pay attention to the viscosity of the liquid sealing resin supplied to the divided areas. Usually, the liquid sealing resin has a viscosity of about 4000 to 8000 mPa · s. As a result, the time for filling the divided region with the liquid sealing resin becomes longer, so that the working efficiency is deteriorated.

  In addition, it is necessary to pay attention to shrinkage after curing as the liquid sealing resin supplied to the divided regions. Although the thickness of the sealing resin is becoming thinner due to the recent downsizing of the electronic component package, the liquid sealing resin is cured and contracted to cause warping and bending of the electronic component. This warping and bending not only interferes with the post-process, but also causes a decrease in manufacturing yield. Therefore, by using a resin molding form having a shape suitable for the properties of the liquid sealing resin to be used, workability is improved (filling time is shortened), and warping and bending after curing are prevented.

  Although the manufacturing method of electronic parts as described above has achieved cost reduction, improvement in yield, flattening of the surface of the sealing resin, and thinning of the package, the following problems are associated with the manufacturing method of the electronic parts. There is.

  It is possible to suppress warping and bending of the substrate to some extent by making the material of the resin molding form similar to the base material of the substrate (for example, linear expansion coefficient). Therefore, after the molding, it is difficult to make the warpage of the substrate generated due to the difference in linear expansion coefficient between the substrate and the mold for resin molding zero. As a result, the following problems (I) and (II) occur.

  (I) The warpage of the substrate that occurs due to the difference in linear expansion coefficient between the substrate and the mold for resin molding becomes more prominent as the substrate size increases. Automatic conveyance is not possible.

  (II) In processes such as chip mounting and wire bonding, it is necessary to flatten the substrate by pressing with a clamper, etc. However, if the substrate is warped, a large load is required for pressing and the pressing is insufficient. The position accuracy of chip mount and wire bonding is deteriorated, which causes a decrease in yield.

In order to solve the problems (I) and (II) above,
The method for manufacturing an electronic component of the present invention includes:
Arranging the elements on the substrate;
A mold forming step of forming a plurality of molds on the substrate, each of which surrounds the region where the element is arranged, and spaced apart from each other by filling the mold with liquid resin and pressurizing the mold.
A sealing resin filling step of filling a region surrounded by the mold with a sealing resin for sealing the element;
A cutting step of cutting the substrate, the sealing resin, and the mold to form an electronic component having the substrate portion, the element, and the sealing resin portion is provided.

  According to the method for manufacturing an electronic component having the above-described structure, a mold frame surrounding a region where the element is to be placed is molded on the substrate by filling the mold with liquid resin and pressing it. Therefore, the mold can be formed at a low cost by using a relatively inexpensive thermoplastic resin or the like. Moreover, since the said mold can be shape | molded, for example by injection molding etc., rather than punching a sheet-like material like the said patent document 1 (henceforth "conventional") and forming a mold, it is material of the material. Useless use can be reduced. Therefore, the mold can be formed at a lower cost than the conventional one.

  In addition, since the mold is directly molded on the substrate by injection molding or the like, it is possible to reduce the time and labor of electronic components compared to the conventional method of attaching the separately formed mold to the substrate. Manufacturing cost can be reduced.

  Further, since the mold is formed by injection molding or the like, inconveniences such as element damage can be reduced as compared with the conventional method in which the mold is attached to the substrate manually. In addition, since the mold can be brought into close contact with the substrate, it is possible to prevent inconveniences such as leakage of the liquid sealing resin filling the inside of the mold. As a result, the manufacturing yield of electronic components can be improved as compared with the conventional one.

  In addition, by creating a mold for molding the mold with relatively high accuracy, the height of the mold from the substrate surface can be made uniform in all parts of the mold. Therefore, the sealing resin formed by filling the inside of the mold can be easily made to have a uniform height. That is, the surface of the sealing resin can be easily flattened.

  Further, since the liquid resin can be made thinner than, for example, silicon rubber, the height of the mold can be reduced as compared with the conventional one. Therefore, it is easier to make the electronic component thinner than the conventional one.

  Further, by arranging a plurality of the above-mentioned molds at a predetermined interval, even if the substrate size is increased, it is possible to prevent an increase in the warpage of the substrate caused by the difference in linear expansion coefficient between the substrate and the mold. Therefore, since the said board | substrate can be prevented from being caught by the runner part of a manufacturing apparatus, a board | substrate can be automatically conveyed.

  Even if the substrate size is increased, it is possible to prevent the warpage of the substrate caused by the difference in linear expansion coefficient between the substrate and the formwork from being increased, so that a small load is applied to the substrate in a process such as chip mounting or wire bonding. Can be pressed down sufficiently. Therefore, the positional accuracy of chip mounting and wire bonding can be improved, that is, the assembly accuracy can be improved, and the yield of manufacturing electronic components can be further improved.

  In addition, as a method of filling the liquid resin into a mold and pressurizing and molding, any method such as injection molding, compression molding, transfer molding, extrusion, casting, or thermoforming may be used.

  In addition, either the step of arranging the element on the substrate or the step of forming the mold on the substrate may be performed first.

  The interval is preferably determined according to the surface area of the substrate, the material of the substrate, and the material of the liquid resin.

  In the electronic component manufacturing method of one embodiment, the substrate is an insulating substrate.

  In the electronic component manufacturing method of one embodiment, the plurality of molds are all substantially the same size.

  In the electronic component manufacturing method of one embodiment, the width of the outer peripheral edge of the mold is smaller than the interval.

  In an electronic component manufacturing method according to an embodiment, a notch is formed in the outer peripheral edge of the mold, and a space inside the adjacent mold is communicated via the notch.

  In the electronic component manufacturing method according to one embodiment, the notch is located near the center of one side of the outer peripheral edge of the mold.

  An electronic device according to the present invention includes an electronic component manufactured using the method for manufacturing an electronic component according to the present invention.

  According to the electronic device having the above configuration, the electronic component can be thinned by manufacturing the electronic component using the method for manufacturing an electronic component according to the invention.

  The method of manufacturing an electronic component according to the present invention includes a step of placing an element on a substrate, and a plurality of molds surrounding the region on which the element is placed and spaced apart from each other by a predetermined distance. A mold forming step of filling a mold with a resin and pressurizing and molding, a sealing resin filling step of filling a region surrounded by the mold with a sealing resin for sealing the element, and the substrate And cutting the sealing resin and the mold to form an electronic component having the substrate portion, the element, and the sealing resin portion. It can be formed with high accuracy with less material and less labor than before, and with almost no adverse effects on the above-mentioned elements. Therefore, it is possible to reduce the cost of electronic components, improve yield, and improve quality.

  Also, a step of arranging the element on the substrate, and a plurality of molds surrounding the region where the element is arranged on the substrate and spaced apart from each other by filling the mold with liquid resin. A mold forming step in which the substrate is pressed and molded, a sealing resin filling step in which a region surrounded by the mold is filled with a sealing resin for sealing the element, and the substrate, the sealing resin, and the mold And cutting the substrate to form an electronic component having the portion of the substrate, the element, and the portion of the sealing resin. Therefore, it is possible to prevent the substrate from being warped due to the difference in the linear expansion coefficient, so that the substrate can be prevented from being caught by the runner portion of the manufacturing apparatus, for example. Therefore, since the substrate can be automatically conveyed, work efficiency can be improved.

  Even if the substrate size is increased, it is possible to prevent the warpage of the substrate caused by the difference in linear expansion coefficient between the substrate and the formwork from being increased, so that a small load is applied to the substrate in a process such as chip mounting or wire bonding. Can be pressed down sufficiently. Therefore, the positional accuracy of chip mounting and wire bonding can be improved, that is, the assembly accuracy can be improved, and the yield of manufacturing electronic components can be further improved.

  Since the electronic device of the present invention is manufactured using the method for manufacturing an electronic component of the above invention, the electronic device can be thinned.

  Hereinafter, a method for manufacturing an electronic component of the present invention will be described in detail with reference to embodiments shown in the drawings.

(First embodiment)
FIG. 1 shows one step of a method of manufacturing an electronic component according to the first embodiment of the present invention.

  In the method of manufacturing the electronic component, first, a plurality of chips 12 as examples of elements are mounted on a substrate 13 with a rectangular surface, and then a resin 3 is formed so as to surround a region where the chips 12 are arranged. Two molds 11A, 11B, and 11C for resin molding are formed with a buffer space 18 having a distance D1 therebetween.

  As the substrate 13, for example, a substrate made of glass epoxy or the like is used.

  The resin molding molds 11A, 11B, and 11C are formed by injection molding using an injection mold. The resin molding molds 11A, 11B, and 11C are all formed in substantially the same shape. More specifically, the shape of each of the resin molding molds 11A, 11B, and 11C when viewed from above is eight. Further, the resin molding molds 11A, 11B, and 11C respectively have divided portions 17A, 17B, and 17C that divide the inner space of the resin molding molds 11A, 11B, and 11C into substantially equal parts. As a material for the resin molding molds 11A, 11B, and 11C, for example, PPS (polyphenylene sulfide), polycarbonate resin, liquid crystal polymer resin, or the like is used.

  Next, a process similar to the process shown in FIG. 7B is performed. That is, a liquid resin is supplied and filled inside the resin molding molds 11A, 11B, and 11C, and cured in an oven to cure the liquid resin, thereby sealing resin (not shown). Form.

  Next, the same process as that shown in FIG. 7C is performed. That is, using the dicing machine, the substrate 13, the resin molding molds 11A, 11B, and 11C and the sealing resin are cut along predetermined cut lines L, L.

  As a result, a plurality of parts including the part of the substrate 13, the chip 12 mounted on the part of the substrate 13, and the part of the sealing resin formed on the surface of the part of the substrate 13 so as to cover the chip 12. The electronic component (not shown) is completed.

  According to the method for manufacturing an electronic component having the above-described configuration, the resin molding molds 11A, 11B, and 11C are obtained by using a relatively inexpensive thermoplastic resin or the like as the material of the resin molding molds 11A, 11B, and 11C. It can be formed at low cost. Further, since the resin molding molds 11A, 11B, and 11C are formed by injection molding using an injection mold, wasteful use of materials can be reduced as compared with the conventional resin molding mold 71. Therefore, the resin molding molds 11A, 11B, and 11C can be formed at a lower cost than the conventional one.

  In addition, since the resin molding molds 11A, 11B, and 11C are directly molded on the substrate 13 by injection molding, the resin molding molds that are separately formed are manually attached to the substrate as in the prior art. However, the labor can be reduced and the manufacturing cost of electronic parts can be reduced.

  Further, since the three resin molding molds 11A, 11B, and 11C are formed at the same time, the work process is not increased and the work efficiency is not lowered.

  Further, since the resin molding molds 11A, 11B, and 11C are molded by injection molding, the chip 12 is not damaged more than the conventional resin molding mold is attached to the substrate manually. Less. Further, since the resin molding molds 11A, 11B, and 11C can be brought into close contact with the substrate 13, the liquid sealing resin filled inside the resin molding molds 11A, 11B, and 11C is used as the resin molding mold. Inconveniences such as leakage from between the frames 11A, 11B, 11C and the substrate 13 can be prevented. As a result, the manufacturing yield of electronic components can be improved as compared with the conventional one.

  Further, by creating the injection mold with relatively high accuracy, the height of the resin molding molds 11A, 11B, and 11C from the substrate surface can be set to all of the resin molding molds 11A, 11B, and 11C. Can be uniform in the part. Therefore, the sealing resin formed by filling the resin molding molds 11A, 11B, and 11C can be easily made to have a uniform height. That is, the surface of the sealing resin can be easily flattened.

  Further, since the liquid resin can be made thinner than, for example, silicon rubber, the height (thickness) of the resin molding molds 11A, 11B, and 11C can be reduced as compared with the conventional one. Therefore, it is easier to make the electronic component thinner than the conventional one.

  Although the size of the substrate 13 is larger than the size of the substrate 83 in FIG. 7A, the three resin molding molds 11A, 11B, and 11C are arranged on the surface of the substrate 13 with a distance D1 therebetween, thereby forming the substrate 13. And the warp of the substrate 13 caused by the difference in linear expansion coefficient between the resin molds 11A, 11B, and 11C does not increase. Accordingly, since the substrate 13 can be prevented from being caught by, for example, the runner portion of the manufacturing apparatus, the substrate 13 can be automatically conveyed.

  Further, although the size of the substrate 13 is larger than the size of the substrate 83 in FIG. 7A, the warpage of the substrate 13 caused by the difference in the linear expansion coefficient between the substrate 13 and the resin molding molds 11A, 11B, and 11C becomes large. Therefore, the substrate 13 can be sufficiently pressed with a small load in a process such as chip mounting or wire bonding. Therefore, the positional accuracy of chip mounting and wire bonding can be improved, that is, the assembly accuracy can be improved, and the yield of manufacturing electronic components can be further improved.

  Further, for example, in order to improve the wire bonding property, when a heater block is applied to the back surface of the substrate 13 to heat the substrate 13 from the back surface, even if the substrate 13 is warped due to heat addition by the heater block, Since the buffer space 18 is provided between the mold 11A and the resin mold 11B and between the resin mold 11B and the resin mold 11C, the buffer 13 is formed more than the conventional one. Warpage can be returned with a small force. Therefore, it is easier to press the substrate 13 after heat application than in the conventional case.

  The resin molding molds 11A, 11B, and 11C have substantially the same shape, and the divided portions 17A, 17B, and 17C substantially bisect the space inside the resin molding molds 11A, 11B, and 11C. Therefore, the six spaces filled with the liquid resin have substantially the same shape. That is, the filling amounts of the liquid resin filling the six spaces are substantially the same. Therefore, it becomes easy to set the filling amount of the liquid resin, so that workability can be improved.

  In the first embodiment, a plurality of resin molding molds having substantially the same shape are formed on the substrate. However, a plurality of resin molding molds having different shapes may be formed on the substrate.

  In the first embodiment, the dividing portion divides the inner space of the resin molding mold into substantially equal parts. However, the dividing portion divides the inner space of the resin molding mold in, for example, one to three. It may be.

  In the first embodiment, the intervals between the resin molds are substantially the same, but may be different.

(Second Embodiment)
FIG. 2 shows one step of a method for manufacturing an electronic component according to the second embodiment of the present invention. 2, the same components as those of the first embodiment shown in FIG. 1 are denoted by the same reference numerals as those of the components in FIG.

  The electronic component manufacturing method is different from the first embodiment in that six resin molding molds 21A, 21B,..., 21F made of resin are used.

  The resin molding molds 21A, 21B,..., 21F are arranged with buffer spaces 18 and 28 at intervals D1 and D2 so as to surround a region where the chip 12 is arranged. More specifically, between the resin molding mold 21A and the resin molding mold 21B, between the resin molding mold 21B and the resin molding mold 21C, and between the resin molding mold 21D and the resin molding mold. A buffer space 18 having a distance D1 is provided between the frame 21E and between the resin molding die 21E and the resin molding die 21F. Further, between the resin mold 21A and the resin mold 21D, between the resin mold 21B and the resin mold 21E, between the resin mold 21C and the resin mold 21F. Between the two, a buffer space 28 with a distance D2 is provided. The resin molding molds 21A, 21B,..., 21F are formed by injection molding using an injection mold, as in the first embodiment. The resin molding molds 21A, 21B,..., 21F are all formed in substantially the same shape. More specifically, the shape of each of the resin molding molds 21A, 21B,..., 21F viewed from above is a round shape. Further, as the material of the resin molding molds 21A, 21B,..., 21F, for example, PPS (polyphenylene sulfide), polycarbonate resin, liquid crystal polymer resin, or the like is used.

  The method for manufacturing the electronic component has the same effects as those of the first embodiment, and the buffer spaces 18 and 28 are provided. Therefore, the effect of reducing the warpage in the substrate 13 can be enhanced more than that of the first embodiment. it can.

  For example, even if the substrate 13 is warped due to heat addition by a heater block, for example, the buffer space 28 having the interval D2 is provided in addition to the buffer space 18 having the interval D1, and therefore, the substrate 13 is more than the first embodiment. Warpage can be returned with a small force. Therefore, it is easier to press the substrate 13 after heat application than in the first embodiment.

  In the second embodiment, a plurality of resin molding molds having substantially the same shape are formed on the substrate. However, a plurality of resin molding molds having different shapes may be formed on the substrate.

  In the second embodiment, the four buffer spaces extending in the short direction of the substrate are all substantially the same, but may be different. For example, the buffer space 18 between the resin mold 21A and the resin mold 21B is different from the buffer space 18 between the resin mold 21D and the resin mold 21E. It may be.

  In the second embodiment, the three buffer spaces extending in the longitudinal direction of the substrate are all substantially the same, but may be different. For example, the buffer space 28 between the resin mold 21A and the resin mold 21D is different from the buffer space 28 between the resin mold 21B and the resin mold 21E. It may be.

(Third embodiment)
FIG. 3 shows one step of the electronic component manufacturing method according to the third embodiment of the present invention. In FIG. 3, the same components as those of the first embodiment shown in FIG. 1 are denoted by the same reference numerals as those of the components in FIG.

  The manufacturing method of the electronic component is different from the first embodiment in that three resin molding molds 31A, 31B, and 31C made of resin are used.

  The width of the portion extending in the short direction of the substrate 13 with respect to the resin molds 31A, 31B, 31C is narrower than that of the first embodiment. That is, the width of the portion extending in the short direction of the substrate 13 with respect to the resin molds 31A, 31B, 31C is the portion extending in the short direction of the substrate 13 with respect to the resin molds 11A, 11B, 11C of FIG. It is narrower than the width.

  The resin molding molds 31A, 31B, and 31C are arranged with a buffer space 38 having a distance D3 so as to surround an area where the chip 12 is arranged. More specifically, a buffer space 38 having a distance D3 is provided between the resin mold 31A and the resin mold 31B and between the resin mold 31B and the resin mold 31C. ing. Further, the resin molding molds 31A, 31B, 31C are formed by injection molding using an injection mold, as in the first embodiment. The resin molding molds 31A, 31B, 31C are all formed in substantially the same shape. More specifically, the shape of the resin molding molds 31A, 31B, 31C viewed from above is eight. The resin molding molds 31A, 31B, and 31C have divided portions 37A, 37B, and 37C that divide the inner space of the resin molding molds 31A, 31B, and 31C into substantially equal parts. Further, as the material of the resin molding molds 31A, 31B, 31C, for example, PPS (polyphenylene sulfide), polycarbonate resin, liquid crystal polymer resin, or the like is used.

  The method for manufacturing the electronic component has the same effects as those of the first embodiment, and the portion extending in the short direction of the substrate 13 with respect to the resin molding molds 31A, 31B, 31C as compared with the first embodiment. By narrowing the width, the distance D3 between the resin molding molds 31A, 31B, 31C can be widened, so that the effect of reducing warpage in the substrate 13 can be enhanced.

  Even if the substrate 13 is warped due to, for example, heat applied by the heater block, the warping of the substrate 13 can be returned with a small force because the buffer space 38 is wider than in the first embodiment. Therefore, it is easier to press the substrate 13 after heat application than in the first embodiment.

  Since the resin molding molds 31A, 31B, 31C are formed by injection molding using the injection mold, the width of each part of the resin molding molds 31A, 31B, 31C can be set to 1 mm or less. .

  In the third embodiment, a plurality of resin molding molds having substantially the same shape are formed on the substrate. However, a plurality of resin molding molds having different shapes may be formed on the substrate.

  In the said 3rd Embodiment, although the division | segmentation part divided the space inside the mold for resin molding into the substantially equal part, it seems that a division | segmentation part divides | segments the space inside the mold for resin molding by 1 to 3, for example. It may be.

  In the third embodiment, the interval between the molds for resin molding is substantially the same, but may be different.

(Fourth embodiment)
FIG. 4 shows one step of the electronic component manufacturing method according to the fourth embodiment of the present invention. In FIG. 4, the same components as those of the first embodiment shown in FIG. 1 are denoted by the same reference numerals as those of the components in FIG.

  The electronic component manufacturing method is different from the first embodiment in that six resin molding molds 41A, 41B, ..., 41F made of resin are used.

  The widths of the portions extending in the short direction of the substrate 13 with respect to the resin molding molds 41A, 41B,..., 41F are narrower than those in the first embodiment. That is, the width of the portion extending in the short direction of the substrate 13 with respect to the resin molds 41A, 41B,..., 41F is in the short direction of the substrate 13 with respect to the resin molds 11A, 11B, and 11C of FIG. It is narrower than the width of the extending part. Moreover, the width | variety of the part extended in the longitudinal direction of the board | substrate 13 regarding the said resin molding mold 41A, 41B, ..., 41F is narrower than the said 1st Embodiment. That is, the width of the portion extending in the longitudinal direction of the substrate 13 with respect to the resin molds 41A, 41B,..., 41F is the portion extending in the longitudinal direction of the substrate 13 with respect to the resin molds 11A, 11B, 11C of FIG. It is narrower than the width.

  In addition, the resin molding molds 41A, 41B,..., 41F are arranged with buffer spaces 38 and 48 at intervals D3 and D4 so as to surround an area where the chip 12 is arranged. More specifically, between the resin molding mold 41A and the resin molding mold 41B, between the resin molding mold 41B and the resin molding mold 41C, and between the resin molding mold 41D and the resin molding mold. A buffer space 38 having a distance D3 is provided between the frame 41E and between the resin molding die 41E and the resin molding die 41F. Further, between the resin mold 41A and the resin mold 41D, between the resin mold 41B and the resin mold 41E, between the resin mold 41C and the resin mold 41F. Between the two, a buffer space 48 with a distance D4 is provided. Further, the resin molding molds 41A, 41B,..., 41F are formed by injection molding using an injection mold, as in the first embodiment. The resin molding molds 41A, 41B,..., 41F are all formed in substantially the same shape. More specifically, the shape of each of the resin molds 41A, 41B,..., 41F viewed from above is a round shape. Further, as the material for the resin molding molds 41A, 41B,..., 41F, for example, PPS (polyphenylene sulfide), polycarbonate resin, liquid crystal polymer resin, or the like is used.

  The electronic component manufacturing method has the same effects as those of the first embodiment, and the shorter and longer directions of the substrate 13 with respect to the resin molding molds 41A, 41B,..., 41F than in the first embodiment. By narrowing the width of the portion extending in the direction, the distances D3 and D4 between the resin molds 41A, 41B,..., 41F can be widened, so that the effect of reducing warpage in the substrate 13 can be enhanced. it can.

  Even if the substrate 13 is warped due to, for example, heat applied by the heater block, the buffer space 38 extending in the short direction of the substrate 13 is wider than in the first embodiment, and the substrate 13 is larger than in the second embodiment. Therefore, the warpage of the substrate 13 can be returned with a smaller force than in the first and second embodiments. Therefore, it is easier to press the substrate 13 after heat application than in the first and second embodiments.

  Since the resin molding molds 41A, 41B, ..., 41F are formed by injection molding using the injection mold, the width of each part of the resin molding molds 41A, 41B, ..., 41F is set to 1 mm or less. can do.

  In the fourth embodiment, a plurality of resin molding molds having substantially the same shape are formed on the substrate. However, a plurality of resin molding molds having different shapes may be formed on the substrate.

  In the fourth embodiment, the four buffer spaces extending in the short direction of the substrate are all substantially the same, but may be different. For example, the buffer space 38 between the resin mold 41A and the resin mold 41B is different from the buffer space 38 between the resin mold 41D and the resin mold 41E. It may be.

  In the fourth embodiment, the three buffer spaces extending in the longitudinal direction of the substrate are all substantially the same, but may be different. For example, the buffer space 48 between the resin mold 41A and the resin mold 41D is different from the buffer space 48 between the resin mold 41B and the resin mold 41E. It may be.

(Fifth embodiment)
When a plurality of resin molding molds cannot be formed so as to be arranged in the short direction of the substrate as in the fourth embodiment, resin molding molds 51A, 51B, 51C as shown in FIG. 5 are formed. Thus, the same effect as in the fourth embodiment can be obtained.

  Notches are formed in portions extending in the short direction of the substrate 13 with respect to the resin molding molds 51A, 51B, 51C. The notches adjacent to each other in the short direction of the substrate 13 are connected to each other by a connecting portion 58. As a result, the spaces inside the resin molding molds 51A, 51B, 51C communicate with each other.

  As a result, when a liquid resin is filled in the space inside the resin molding mold 51A, the liquid resin flows into the space inside the resin molding mold 51B through the space between the connecting portions 58. The space inside the resin mold 51B can be filled with a liquid resin.

  Similarly, when a liquid resin is filled in the space inside the resin molding mold 51B, the liquid resin passes through the space between the connecting portions 58 and enters the space inside the resin molding molds 51A and 51C. Since it flows in, liquid resin can be filled also into the space inside the resin molding molds 51A and 51C.

  Similarly, when a liquid resin is filled in the space inside the resin molding mold 51C, the liquid resin flows into the space inside the resin molding mold 51B through the space between the connecting portions 58. The space inside the resin mold 51B can be filled with a liquid resin.

  Note that 57A, 57B, and 57C in FIG. 5 are division units similar to the division units 17A, 17B, and 17C.

(Sixth embodiment)
When a plurality of resin molding molds cannot be formed so as to be arranged in the short direction of the substrate as in the fourth embodiment, resin molding molds 51A, 51B, 51C as shown in FIG. 6 are formed. Thus, the same effect as in the fourth embodiment can be obtained.

  A notch is formed at the center of the portion extending in the short direction of the substrate 13 with respect to the resin molding molds 61A, 61B, 61C. The cutout is formed near the center of the substrate 13 in the short direction. That is, the notch is formed in the vicinity of the perpendicular bisector of the side in the short direction of the substrate 13. The notches adjacent to each other in the longitudinal direction of the substrate 13 are connected by a connection portion 68. As a result, the spaces inside the resin molding molds 61A, 61B, 61C communicate with each other.

  As a result, when a liquid resin is filled in the space inside the resin molding mold 61A, the liquid resin flows into the space inside the resin molding mold 61B through the space between the connecting portions 58. The liquid resin can also be filled into the space inside the resin molding mold 61B.

  Similarly, when a liquid resin is filled in the space inside the resin molding form 61B, the liquid resin passes through the space between the connecting portions 58 and enters the space inside the resin molding forms 61A and 61C. Since it flows in, liquid resin can be filled also into the space inside the resin molding molds 61A and 61C.

  Similarly, when a liquid resin is filled into the space inside the resin molding mold 61C, the liquid resin flows into the space inside the resin molding mold 61B through the space between the connecting portions 58. The liquid resin can also be filled into the space inside the resin molding mold 61B.

  In addition, since the cutout is formed in the vicinity of the perpendicular bisector of the side in the short direction of the substrate 13, the number of connection portions 68 can be reduced as compared with the fifth embodiment, so that the warpage of the substrate 13 is reduced. Can be reduced.

  6A, 67B, and 67C in FIG. 6 are division units similar to the division units 17A, 17B, and 17C.

  Needless to say, the present invention is not limited to the first to sixth embodiments.

  Moreover, what combined the said 1st-6th suitably may be made into one Embodiment of this invention.

FIG. 1 is a schematic view showing one step of a method of manufacturing an electronic component according to the first embodiment of the present invention. FIG. 2 is a schematic view showing one step of a method of manufacturing an electronic component according to the second embodiment of the present invention. FIG. 3 is a schematic view showing one step of a method of manufacturing an electronic component according to the third embodiment of the present invention. FIG. 4 is a schematic view showing one step of a method of manufacturing an electronic component according to the fourth embodiment of the present invention. FIG. 5 is a schematic view showing one step of a method of manufacturing an electronic component according to the fifth embodiment of the present invention. FIG. 6 is a schematic view showing one step of the electronic component manufacturing method according to the sixth embodiment of the present invention. FIG. 7A is a schematic view showing one step of a conventional method of manufacturing an electronic component. FIG. 7B is a schematic view showing one step of a conventional method for manufacturing an electronic component. FIG. 7C is a schematic view showing one step of a conventional method for manufacturing an electronic component. FIG. 7D is a schematic view showing one step of a conventional method for manufacturing an electronic component. FIG. 7E is a schematic view showing one step of a conventional method for manufacturing an electronic component. FIG. 8A is a schematic view showing one step of a reference example of the method for manufacturing an electronic component of the present invention. FIG. 8B is a schematic diagram showing one step of a reference example of the method for manufacturing an electronic component of the present invention. FIG. 8C is a schematic view showing one step of a reference example of the method for manufacturing an electronic component of the present invention. FIG. 9 is a schematic view showing one step of a reference example of the method for manufacturing an electronic component of the present invention.

Explanation of symbols

11A, 11B, 11C Resin molding mold 12 Chip 13 Substrate 21A, 21B, ..., 21F Resin molding mold 31A, 31B, 31C Resin molding mold 41A, 41B, ..., 41F Resin molding mold 51A, 51B, 51C Resin Molding 61A, 61B, 61C Resin Molding

Claims (6)

Arranging the elements on the substrate;
A mold forming step of forming a plurality of molds on the substrate, each of which surrounds the region where the element is arranged, and spaced apart from each other by filling the mold with liquid resin and pressurizing the mold.
A sealing resin filling step of filling a region surrounded by the mold with a sealing resin for sealing the element;
An electronic device comprising: a cutting step of cutting the substrate, the sealing resin, and the mold to form an electronic component having the substrate portion, the element, and the sealing resin portion. A manufacturing method for parts. In the manufacturing method of the electronic component of Claim 1,
The method of manufacturing an electronic component, wherein the plurality of molds are all substantially the same size. In the manufacturing method of the electronic component of Claim 1,
The method of manufacturing an electronic component, wherein the width of the outer peripheral edge of the mold is smaller than the interval. In the manufacturing method of the electronic component of Claim 1,
Notches are formed in the outer peripheral edge of the mold,
A method of manufacturing an electronic component, wherein spaces inside the adjacent molds communicate with each other through the notches. In the manufacturing method of the electronic component of Claim 4,
The method for manufacturing an electronic component according to claim 1, wherein the notch is positioned near the center of one side of the outer peripheral edge of the mold. An electronic device comprising the electronic component manufactured using the method for manufacturing an electronic component according to claim 1.

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