JP2006130745A - Nozzle plate and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a nozzle plate capable of improving stability of accuracy of the shape of the nozzle plate by protecting a nozzle member from damage in the manufacturing processes. <P>SOLUTION: In this method of manufacturing the nozzle plate 1, a first photosensitive resin layer 12 is laminated on a sacrifice member 9, the first photosensitive resin layer 12 is exposed by using a first mask 13, and then a nozzle 2 is formed in the first photosensitive resin layer 12. A second photosensitive resin layer 15 is laminated on the first photosensitive resin layer 12, the second photosensitive resin layer 15 is exposed by using a second mask 16, and then a base section 4 is formed in the second photosensitive resin layer 15. The development processing and the separation of the sacrifice member 9 are carried out to form the nozzle plate 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a nozzle plate and a method for manufacturing the same, and more particularly, manufacturing a nozzle plate that can protect the nozzle member from damage of the nozzle member during manufacturing and improve the stability of the shape accuracy of the nozzle plate. The present invention relates to a method and a nozzle plate manufactured by the manufacturing method.

  In recent years, focusing on the versatility and low cost of inkjet printer technology, the formation of fine patterns such as color filters for liquid crystal display devices, and the formation of conductor patterns on printed wiring boards, which have been processed by conventional photolithography technology. Inkjet printer applications are attracting attention.

  Therefore, development of a micro dot forming apparatus capable of forming a micro pattern with high accuracy by directly drawing micro ink dots on a drawing target (for example, a color filter for a liquid crystal display, a printed wiring board, etc.) is active. It has become.

  In such a minute dot forming apparatus, a nozzle plate having high discharge characteristics such as discharge stability and high landing accuracy is required.

  The configuration and manufacturing method of the nozzle plate will be described as follows based on the prior art.

  Patent Document 1 discloses a technique for forming a nozzle plate for discharging fine droplets using a photosensitive resin material. FIG. 8 is a cross-sectional view showing a configuration of a nozzle plate (hereinafter referred to as a conventional configuration) disclosed in Patent Document 1. 9A to 9E are explanatory views showing a method for manufacturing the nozzle plate shown in FIG.

  The nozzle plate 104 having the conventional configuration shown in FIG. 8 includes an electrically insulating substrate 141 serving as a base, a plurality of discharge electrodes 142 formed on the surface 141a of the substrate 141, and a substrate via the plurality of discharge electrodes 142. 141, and a nozzle layer 143 laminated on the entire surface 141a. A plurality of nozzle holes 103 a are arranged in the nozzle layer 143 so as to penetrate the nozzle layer 143. Further, the nozzle layer 143 has a portion corresponding to the nozzle hole 103a processed into a truncated cone shape. The nozzle 103 has a structure protruding from the base surface 143b of the nozzle layer, and includes a through hole 145 having a nozzle hole 103a at one end.

  A method for manufacturing the nozzle plate 104 shown in FIG. 8 will be described below with reference to FIGS.

  As shown in FIG. 9A, a flat substrate 141 is prepared, a conductive film 142 ′ is formed on one surface of the substrate 141, and then a predetermined layer is used by a photolithography and etching technique using a resist layer 150. Then, the discharge electrode 142 is formed. Next, as shown in FIG. 9B, a photosensitive resin 143 'is formed on the surface 141a of the substrate on which the ejection electrode 142 is formed.

  Next, as shown in FIG. 9C, light that can sensitize the photosensitive resin is irradiated, the photosensitive resin is exposed to a predetermined shape, and then developed, thereby providing a through hole 145. The shape of the nozzle 103 is processed.

Next, as shown in FIG. 9D, a resist film 151 is formed on the back surface 141b of the substrate 141 by photolithography. Next, as shown in FIG. 9E, when the substrate 141 is etched using the resist film 151 formed in FIG. 9D as a mask, a plurality of through holes 141c are formed in the substrate 141, and then the resist film 151 is formed. Remove. Thereby, the nozzle plate 104 is manufactured.
JP 2004-136656 A (publication date: May 13, 2004)

  However, the conventional configuration disclosed in Patent Document 1 described above has the following problems.

  That is, in Patent Document 1, after forming the protrusion shape of the nozzle 103, as shown in FIG. 9D, a resist film 151 is formed on the back surface of the substrate 141, and further, as shown in FIG. As described above, the substrate 141 is etched to form a through hole 141c communicating with the nozzle hole 103a. When producing a nozzle by such a process, there are the following problems.

  First, as described above, the resist film 151 is formed on the surface of the substrate 141 opposite to the surface on which the nozzle 103 is formed. Since the Si substrate disclosed in Patent Document 1 does not transmit visible light, it is difficult to align the pattern of the nozzle holes 103a formed on the surface of the substrate 141 and the pattern of the through holes 141c formed on the back surface of the substrate 141. Become. Therefore, the problem that the processing precision in the case of through-hole processing becomes low arises.

  On the other hand, if a glass substrate is used as the substrate 141, visible light is transmitted, so that the pattern alignment of the front and back patterns of the substrate 141 can be accurately performed. However, when wet etching is used when etching the through hole 141c, the etching progresses isotropically, so that the processing shape accuracy of the through hole 141c is deteriorated. Instead, even when dry etching with high anisotropy is used, there is a high possibility that the discharge electrode 142 and the photosensitive resin 143 ′ are damaged by overetching when the through-hole 141c is processed. Disappearance and instability of nozzle hole shape increase.

  Furthermore, in the technique of Patent Document 1, the shape of the nozzle 103 is processed into a high aspect ratio shape having a tip outer diameter of 2 μm, a root diameter of 5 μm, and a height of 100 μm. Therefore, when a load is applied to the nozzle 103, the shape is very easy to break. Therefore, there is an extremely high possibility that the nozzle 103 is damaged in the process of processing the through hole 141c.

  Therefore, the present invention has been made in view of the above problems, and its purpose is to protect the nozzle member from damage to the nozzle member during manufacturing and to improve the stability of the shape accuracy of the nozzle plate. Another object of the present invention is to provide a method for manufacturing a nozzle plate.

  In order to solve the above-described problems, a nozzle plate manufacturing method according to the present invention includes a nozzle member provided with a nozzle through hole having a nozzle hole for discharging a liquid material at one end, and a flow serving as a flow path for the liquid material. A method of manufacturing a nozzle plate comprising a substrate member provided with a through-hole, wherein a first photosensitive resin layer is laminated on a sacrificial member, and the first lamination step is laminated. A first photosensitive step of exposing the first photosensitive resin layer to light that forms the first through hole by exposing the first photosensitive resin layer to the first photosensitive resin layer; and the first photosensitive step exposed to the first photosensitive step. A second lamination step of laminating a second photosensitive resin layer made of a light transmitting material on one photosensitive resin layer, and the second photosensitive resin layer laminated by the second lamination step, 2 photosensitive resin layers are exposed to the first through hole. A second photosensitive step of irradiating with light to form a second through hole, a developing step of developing the first and second photosensitive resin layers exposed by the first and second photosensitive steps, and the first And a separation step of separating the sacrificial member from the first and second photosensitive resin layers exposed by the first and second exposure steps. Specifically, it is preferable that one of the nozzle member and the substrate member is formed by the first photosensitive resin layer, and the other is formed by the second photosensitive resin layer. Further, the nozzle plate manufactured by the nozzle plate manufacturing method of the present invention is an electrostatic suction type nozzle plate that charges a liquid material and discharges the liquid material by the electrostatic suction force of the liquid material. Is preferred.

  According to the nozzle plate manufacturing method of the present invention, the first and second photosensitive resin layers constituting the nozzle plate are laminated on the sacrificial member, the first and second through holes are formed, and then the sacrifice is performed. A nozzle plate is manufactured by separating the member and the first and second photosensitive resin layers. That is, the nozzle plate is temporarily formed on the sacrificial member, the through hole is processed, and then the sacrificial member is removed to separate the nozzle plate.

  For this reason, it can manufacture in the state in which the rigidity of each component member under manufacture is high compared with the manufacturing method when there is no sacrifice member. Therefore, the processing accuracy in the fine processing is improved.

  Specifically, in the prior art nozzle plate manufacturing method, a sacrificial member is not used, and a nozzle having a shape protruding from the substrate is formed, and then a passage through hole of the substrate is formed on the back surface of the nozzle. Therefore, as described above, since the shape of the nozzle is a high aspect ratio shape such as a tip outer diameter of 2 μm, a root diameter of 5 μm, and a height of 100 μm, during the step of forming the flow path through hole of the substrate, The nozzle is easily damaged.

  Therefore, according to the method for manufacturing a nozzle plate of the present invention, as described above, each component member being manufactured can be manufactured with high rigidity, so a nozzle having a high aspect ratio shape as in the conventional configuration can be obtained. This is particularly effective when a nozzle plate is provided.

  Furthermore, the said 2nd photosensitive resin layer laminated | stacked on the said 1st photosensitive resin layer by the said 2nd lamination process is a light transmissive material. Therefore, when forming a 2nd through-hole in the said 2nd photosensitive resin layer, position alignment with the 1st through-hole formed in the said 1st photosensitive resin layer can be performed easily. That is, the processing accuracy of the first and second through holes can be improved as compared with the conventional case.

  Here, the light transmissive material is a material having a light transmissive property that facilitates alignment with the first through hole when the second through hole is formed in the second photosensitive resin layer. It may be a transparent material or a translucent material. Specific examples include polymethyl methacrylate (PMMA) resin and organic resin mainly composed of methyl methacrylate (MMA) and methacrylic acid (MAA).

  Further, in the conventional manufacturing method, when the flow path through hole is formed in the substrate, it is formed by etching, so that there is a high possibility that a problem may occur due to over-etching or the like as described above.

  Therefore, according to the method of manufacturing a nozzle plate of the present invention, the above-described problem does not occur because the flow path through hole of the substrate is formed by exposure. That is, the nozzle plate can be manufactured satisfactorily and a good nozzle plate can be provided.

  In the nozzle plate manufacturing method according to the present invention, in order to solve the above-described problem, the nozzle member has an outer diameter larger than the diameter of the first or second through hole provided in the substrate member. It has a cylindrical protrusion, and has an opening communicating with the first or second through hole provided in the substrate member and the nozzle hole on each of the circular surfaces of the cylindrical shape facing each other. It is preferable.

  According to the nozzle plate manufacturing method of the present invention described above, since the cylindrical protrusion is formed as the nozzle member, the electric field concentration in the vicinity of the discharge port can be increased in the nozzle plate of the electrostatic discharge type inkjet head. .

  As a result, the liquid material can be discharged at a low discharge voltage.

  Moreover, according to the manufacturing method mentioned above, since the protrusion is formed by photosensitivity, the protrusion can be easily and accurately created. Therefore, it is possible to provide a good nozzle plate.

  In the nozzle plate manufacturing method according to the present invention, in order to solve the above-described problems, the first and second photosensitive steps are performed by lithography using light having a wavelength of 0.3 to 1.0 nm. Is preferred.

  According to the above-described configuration, in the nozzle plate manufacturing method of the present invention, the first and second through holes are formed by lithography using light having a wavelength of 0.3 to 1.0 nm. That is, the first and second through holes are formed by lithography with very short wavelength light.

  Therefore, it is possible to realize nozzle plate processing with very high lithography resolution and high accuracy.

  Moreover, in the manufacturing method of the nozzle plate according to the present invention, it is preferable that the light used for the lithography is synchrotron radiation in order to solve the above-described problems.

  According to the configuration described above, the light used for the lithography is synchrotron radiation. That is, in the nozzle plate manufacturing method of the present invention, the first and second through holes are formed by lithography using light having a very high degree of parallelism.

  Therefore, a nozzle member having a high aspect ratio or a cylindrical member having a cylindrical protrusion can be easily processed.

  In the nozzle plate manufacturing method according to the present invention, in order to solve the above-described problem, the developing step separates the first and second photosensitive resin layers and the sacrificial member by the separating step. It is preferable to carry out later.

  According to the configuration described above, in the nozzle plate manufacturing method of the present invention, the development step is performed after the sacrificial member and the first and second photosensitive resin layers are separated.

  Thereby, a manufacturing process can be implemented in the state whose rigidity of each constituent member under manufacture is still higher. That is, according to the method for manufacturing a nozzle plate of the present invention, the separation step can be performed before the development step. In particular, when the nozzle member is formed by the first photosensitive resin layer. When the first and second photosensitive resin layers are developed before the separation step, the structure of the nozzle plate being manufactured that enters the separation step is connected to the sacrificial member only by the protrusions. It will be in the state. In such a state, when an impact or the like is applied to the sacrificial member from the outside during the separation process or during the separation process, the impact affects the protrusion and damages the protrusion. It is also possible. Therefore, by performing the developing step after the sacrificial member and the first and second photosensitive resin layers are separated, the above-described possibility can be avoided and a good nozzle plate is provided. It becomes possible to do.

In the method for manufacturing a nozzle plate according to the present invention, in order to solve the above-described problem, the first and second through holes are provided with openings having substantially the same diameter, and the first through hole is provided. It is preferable that the center of each opening in the communication portion between the first through hole and the second through hole is formed so as to be shifted. Specifically, the diameter of the opening portion of the first through hole is D1, the diameter of the opening portion of the second through hole is D2, the outer diameter of the nozzle is D0, and the center of each opening portion of the communication portion is When the deviation amount is ΔA,
D0> D1 / 2 + D2 / 2 + ΔA
Is preferably satisfied.

  According to the configuration described above, in the nozzle plate manufacturing method of the present invention, the center of each opening in the communication portion between the first through hole and the second through hole is formed to be shifted.

  Thereby, the flow path resistance of the liquid substance can be generated at the communication portion between the first through hole and the second through hole.

  By generating the flow resistance of the liquid substance, it is possible to suppress a large amount of ink supply when a small amount of low-viscosity ink is ejected from the protruding portion, and thereby the ink discharged from the leading end of the protruding portion. The amount of droplets can be controlled minutely.

  Further, the magnitude of the flow path resistance can be adjusted by adjusting the alignment of the first through hole and the second through hole without recreating the mask pattern. Therefore, a nozzle (projecting portion) having desired ejection characteristics can be manufactured very simply and without increasing the cost.

  Here, “formed so as to be displaced” means that the first through hole and the second through hole communicate with each other, that is, the first photosensitive resin layer and the second photosensitive resin layer. The center of each opening of the first through hole and the second through hole is shifted so that the first or second photosensitive resin layer slides along the boundary surface. That means.

  In addition, in order to solve the above-described problem, the nozzle plate manufacturing method according to the present invention is configured so that the nozzle member has a protruding amount substantially the same as the protruding amount of the protruding portion on the outside of the cylindrical protruding portion. It is preferable that the planar portion is formed through a groove having a predetermined depth.

According to the above-described configuration, in the nozzle plate of the present configuration, the flat surface portion having a projection amount substantially the same as the projection amount of the projection portion on the outside of the cylindrical projection portion is a groove having a predetermined depth. Is formed through. For this reason, the electric field is concentrated also in the boundary region with the groove in the planar portion, and the electric field generated in the boundary region confines the electric field in the vicinity region where the liquid material is discharged in the protruding portion. Divergence of the field electric field lines is prevented.
Thereby, the landing accuracy of the liquid substance flying along the lines of electric force is improved.

  Furthermore, the protruding amount of the flat portion is substantially the same as the protruding amount of the protruding portion. That is, the front end surface of the protruding portion from which the liquid material is discharged is configured to be on the same plane as the flat portion. Due to the presence of the flat portion, only the protruding portion protrudes from the nozzle plate. As a result, it is possible to prevent the protrusion from being damaged due to contact with the target substrate or the like that is the target for discharging the liquid substance.

  As described above, the nozzle plate manufacturing method according to the present invention includes a nozzle member provided with a nozzle through hole having a nozzle hole for discharging a liquid substance at one end, and a flow path through hole serving as a liquid material flow path. A method of manufacturing a nozzle plate comprising a provided substrate member, wherein a first lamination step of laminating a first photosensitive resin layer on a sacrificial member, and a first layer laminated by the first lamination step A first photosensitive step of irradiating the photosensitive resin layer with light for forming the first through hole by exposing the first photosensitive resin layer; and the first photosensitive property exposed by the first photosensitive step. A second laminating step of laminating a second photosensitive resin layer made of a light transmitting material on the resin layer; and the second photosensitive resin layer laminated by the second laminating step. A second through hole that exposes the resin layer to communicate with the first through hole. A second photosensitive step of irradiating the light to be formed; a developing step of developing the first and second photosensitive resin layers exposed by the first and second photosensitive steps; and the first and second photosensitive steps. And a separation step of separating the sacrificial member from the first and second photosensitive resin layers exposed by.

  According to the nozzle plate manufacturing method of the present invention, the first and second photosensitive resin layers constituting the nozzle plate are laminated on the sacrificial member, the first and second through holes are formed, and then the sacrifice is performed. A nozzle plate is manufactured by separating the member and the first and second photosensitive resin layers. That is, the nozzle plate is temporarily formed on the sacrificial member, the through hole is processed, and then the sacrificial member is removed to separate the nozzle plate.

  For this reason, it can manufacture in the state in which the rigidity of each component member under manufacture is high compared with the manufacturing method when there is no sacrifice member. Therefore, the processing accuracy in the fine processing is improved. In particular, it is effective when manufacturing a nozzle plate having a high aspect ratio shaped nozzle as in the conventional configuration.

  Furthermore, since the second photosensitive resin layer laminated on the first photosensitive resin layer in the second lamination step is a light transmitting material, the second photosensitive resin layer has a second layer. When forming the through hole, alignment with the first through hole formed in the first photosensitive resin layer can be easily performed, and the processing accuracy of the first and second through holes is compared with the conventional one. And can be improved.

  In addition, according to the method for manufacturing a nozzle plate of the present invention, the flow path through hole of the substrate is formed by exposure to light, so that problems such as over etching do not occur. That is, the nozzle plate can be manufactured satisfactorily and a good nozzle plate can be provided.

[Embodiment 1]
An embodiment of the present invention will be described below with reference to FIGS. 1 (a) and 1 (b) to FIG.

  In the following description, various technically preferable limitations for carrying out the present invention are given, but the scope of the present invention is not limited to the following embodiments and drawings.

  In the following description, an electrostatic suction type nozzle plate that charges a liquid material and discharges the liquid material by the electrostatic suction force of the liquid material will be described. However, the present invention is not limited to this, and a piezoelectric method in which the liquid material is discharged by deforming the flow path of the liquid material by vibration of the piezoelectric element, or a heating element is provided in the flow path of the liquid material, The present invention can also be applied to a thermal type nozzle plate that generates heat by generating heat from the heating element and discharges a liquid material in accordance with a pressure change in the flow path due to the bubbles.

  1A and 1B show a configuration of a nozzle plate 1 according to an embodiment of the present invention, and FIG. 1A is a perspective view schematically showing the configuration of the nozzle plate 1. FIG. 1B is a cross-sectional view showing a cut surface obtained by cutting the nozzle plate 1 shown in FIG. 1A along a cutting line AA ′.

  A nozzle plate 1 shown in FIGS. 1A and 1B is provided in, for example, an ink jet printer, and has a fine pattern by drawing fine ink dots (droplets) directly on a target substrate to be drawn. It can be formed with accuracy.

  Here, the target substrate refers to a target object that receives the impact of the discharged liquid substance. Further, the material is not particularly limited. Therefore, when the nozzle plate 1 of the present embodiment is applied to an ink jet printer, a recording medium such as paper or a sheet or a color filter for liquid crystal display corresponds to the target substrate. When a circuit is formed using a conductive paste, the base on which the circuit is to be formed corresponds to the target substrate.

  Specifically, when discharging the liquid substance using the nozzle plate 1, a voltage is applied to a discharge electrode (not shown) provided in the nozzle plate 1 or in the ink jet head to apply the nozzle 2 (nozzle). The electric field is concentrated on the nozzle tip 3 which is the tip of the member, the protrusion), the liquid substance is charged, and the liquid substance is discharged from the target substrate side opening 8 of the nozzle 2 by the electrostatic attraction force of the liquid substance. Can be discharged.

  In the case of the nozzle plate 1 of the present embodiment, it is possible to discharge the liquid material without the counter electrode facing the nozzle tip 3. For example, when the target base material is disposed so as to face the nozzle tip portion 3 in the state where the counter electrode is not present, and the target base material is a conductor, the nozzle tip portion is based on the receiving surface of the target base material. A mirror image charge having a reverse polarity is induced at a position of 3 plane symmetry. On the other hand, in the case where the target substrate is an insulator, a video charge having a reverse polarity is induced at a symmetrical position determined by the dielectric constant of the substrate with respect to the receiving surface of the target substrate. Then, a droplet of the liquid material flies by an electrostatic force between the charge induced in the nozzle tip 3 and the mirror image charge or the image charge. Therefore, the nozzle plate 1 includes a base portion 4 (substrate member) and a nozzle 2 as shown in FIGS. As described above, the nozzle plate according to the present invention has a configuration in which the discharge electrode for charging the liquid material is provided. However, in the following description, the discharge electrode is not particularly illustrated.

  As shown in FIGS. 1A and 1B, the base portion 4 discharges the liquid material to an inflow surface 4a through which the liquid material flows into the base portion 4 and a target base material (not shown) that is a discharge target. The discharge surface 4b is disposed opposite to the inflow surface 4a. Furthermore, the base portion 4 includes a base through hole 5 (first through hole, second through hole) having openings on both the inflow surface 4a and the discharge surface 4b.

  The thickness of the base portion 4 can be set as appropriate, but is preferably set in the range of 10 to 300 μm. When the thickness of the base part 4 is 10 μm or less, it becomes difficult to maintain the structural stability of the nozzle itself. Further, when the thickness of the base portion 4 is 300 μm or more, it is difficult to process the base through hole 5. As an example, the thickness may be 100 μm.

  The nozzle 2 is arranged on the discharge surface 4b side of the base portion 4 and has a cylindrical shape as shown in the figure. The nozzle 2 has a nozzle through-hole 6 (first aperture) having an opening, a base portion-side opening, and a target substrate-side opening 8 (nozzle hole) in each of a pair of circular surfaces constituting the cylindrical shape. A through hole and a second through hole). Of the base part side opening and the target base material side opening 8 of the nozzle through hole 6, the base part side opening is connected to the opening on the discharge surface 4 b side of the base through hole 5 in the communication part 7. The base through hole 5 and the nozzle through hole 6 communicate with each other.

  The size of the cylindrical shape of the nozzle 2 can be set as appropriate. The outer diameter of the nozzle 2 is preferably 2 to 35 μm. Moreover, it is preferable to set it as 10-200 micrometers as protrusion amount from the base part 4 of the nozzle 2, specifically, protrusion amount from the discharge surface 4b. By setting the amount of protrusion from the ejection surface 4b to 10 μm or more, the electric field can be effectively concentrated at the nozzle tip. Further, when the amount of protrusion from the discharge surface 4b is 300 or more, it becomes difficult to process the nozzle holes. As an example, the outer diameter of the nozzle 2 can be 10 μm, and the protruding amount of the nozzle 2 from the base portion 4 can be 100 μm.

  The size of the nozzle through hole 6 of the nozzle 2 can also be set as appropriate. For example, it is preferably 1 μm or more, which is the limit of resolution in high aspect ratio processing, and is preferably 30 μm or less in consideration of the production of fine droplets. As an example, the inner diameter of the nozzle through hole 6 can be set in the range of 3 to 5 μm.

  The base through-hole 5 and the nozzle through-hole 6 are formed on the surface of the nozzle 2 facing the target base material after flowing through the base through-hole 5 and then through the nozzle through-hole 6. What is necessary is just to be comprised so that it may discharge from the target base material side opening part 8, and the opening part by the side of the discharge surface 4b of the said base part 4 and the said base part side opening part of the said nozzle 2 are mentioned so that it may mention later. The shapes do not necessarily have to match. Although details will be described later, for example, the openings may not have the same diameter, or the centers of the openings may be shifted from each other.

  In FIG. 1A, the two nozzles 2 are configured. However, the present invention is not limited to this, and the arrangement of the nozzles 2 is also limited to the illustrated one. Specifically, the plurality of nozzles 2 may be configured in a plurality of rows.

  As described above, the nozzle plate 1 according to the present embodiment forms the cylindrical nozzle 2 having the target substrate side opening 8 on the nozzle plate. Thereby, when a voltage is applied to the discharge electrode, the electric field concentration in the vicinity of the target substrate side opening 8 is improved, and the liquid substance can be discharged with a low applied voltage.

  Next, a method for manufacturing the nozzle plate 1 according to the present embodiment having the above-described configuration will be described.

  FIGS. 2A to 2F are explanatory views for explaining a method of manufacturing the nozzle plate 1 of the present embodiment. 2A to 2F correspond to the state cut along the cutting line AA ′ in the nozzle plate 1 after completion of manufacture shown in FIG. 1A, as in FIG. 1B. It is sectional drawing.

  FIG. 2A shows the sacrificial member 9. The sacrificial member 9 includes a substrate 10 made of glass or Si, and a sacrificial layer 11 formed on the substrate 10 and containing Ni as a main component, which can be etched with an acid.

  In the present embodiment, a laminated structure of the substrate 10 and the sacrificial layer 11 is used as the sacrificial member 9. However, the present invention is not limited to this, and the sacrificial member 9 may be, for example, the sacrificial layer as long as the nozzle plate 1 can be removed from the sacrificial member 9 in a later manufacturing process. 11 may be constituted only by the material used for 11.

  Further, the material of the sacrificial layer 11 is mainly composed of Ni, but the material of the nozzle plate 1 formed on the sacrificial member 9 is etched with high selectivity in a later manufacturing process. The material is not particularly limited as long as it can be used. Therefore, for example, a metal material such as Fe, Cu, or Al can be used as the sacrificial layer 11.

  Next, FIG. 2B shows a state in which the first photosensitive resin layer 12 is laminated on the sacrificial member 9 (first lamination step).

  The first photosensitive resin layer 12 can be laminated by applying it on the sacrificial member 9 by a conventionally known method such as a spin coating method.

  As shown in FIG. 1B, the nozzle plate 1 of the present embodiment has a configuration in which a cylindrical nozzle 2 protrudes from the base portion 4. Therefore, as described above, for example, when the amount of protrusion from the base portion 4 of the nozzle 2 is desired to be 100 μm, the first photosensitive resin layer 12 is laminated on the sacrificial member 9 so as to have a thickness of 100 μm. do it. That is, in the present embodiment, the thickness of the first photosensitive resin layer 12 corresponds to the amount of protrusion from the base portion 4 of the nozzle 2.

  In the present embodiment, the nozzle 2 is formed using the first photosensitive resin layer 12. Further, as shown in FIG. 1A, the nozzle 2 has a nozzle through hole 6 formed therein. Accordingly, FIG. 2C shows a process of forming the nozzle 2 and the nozzle through hole 6 using the first photosensitive resin layer 12 (first photosensitive process).

  As shown in FIG. 2C, the first mask 13 is disposed on the side opposite to the sacrificial member 9 side in the first photosensitive resin layer 12, and the first photosensitive resin layer 12 is formed by the first mask 13. The first photosensitive resin layer 12 is irradiated with synchrotron radiation 14 having a center wavelength of 0.5 nm (5 mm) so that a part of the first photosensitive resin layer 12 is masked.

  By this irradiation, as shown in FIG. 2C, the region E <b> 2 is exposed, and the cylindrical nozzle 2 having the nozzle through hole 6 is formed in the first photosensitive resin layer 12.

  Next, FIG. 2D shows a state in which the second photosensitive resin layer 15 is laminated on the first photosensitive resin layer 12 that is exposed to the synchrotron radiation 14 (second laminated layer). Process). In the present embodiment, the base portion 4 shown in FIG. 1A is formed using the second photosensitive resin layer 15.

  The second photosensitive resin layer 15 can be laminated by applying it onto the first photosensitive resin layer 12 by a conventionally known method, similarly to the lamination of the first photosensitive resin layer 12. As described above, for example, when the thickness of the base portion 4 is desired to be 100 μm, the second photosensitive resin layer 15 is laminated on the first photosensitive resin layer 12 so as to have a thickness of 100 μm. That's fine.

  As described above, the base portion 4 is formed with the base through hole 5. FIG. 2E shows a process of forming the base portion 4 and the base through-hole 5 using the second photosensitive resin layer 15 (second photosensitive process). As shown in FIG. 2E, the second mask 16 is second photosensitive by the second mask 16 on the opposite side of the second photosensitive resin layer 15 from the first photosensitive resin layer 12 side. It arrange | positions so that a part of resin layer 15 may be masked. Then, using the second mask 16, the second photosensitive resin layer 15 is irradiated with synchrotron radiation light 14 having a center wavelength of 0.5 nm.

  By this irradiation, as shown in FIG. 2E, the region E1 is exposed and the base portion 4 having the base through hole 5 is formed.

  Next, FIG. 2F shows the nozzle plate 1 that has been manufactured. In FIG. 2 (e), the nozzle plate 1 in which the base portion 4 having the base through hole 5 is formed immerses the exposed region E1 and region E2 in a developer containing tetrahydrooxyzane, aminoethanol and ethanol. Then, the region E1 and the region E2 are removed. Next, development is stopped with a stop solution containing ethanol, and then washed with water to develop the shape of the nozzle plate 1 (development process). Further, the sacrificial member 9 is etched with an etching solution containing nitric acid. Thereby, the nozzle plate 1 (the 1st photosensitive resin layer 12 and the 2nd photosensitive resin layer 15) and a sacrificial member can be isolate | separated (separation process).

  As described above, the nozzle plate 1 can be manufactured by the steps illustrated in FIGS.

  As described above, in the present embodiment, the first photosensitive resin layer 12 and the second photosensitive resin layer 15 are immersed in the developer, whereby the exposed region E1 and region E2 are removed. It is the composition which becomes. Therefore, the first photosensitive resin layer 12 and the second photosensitive resin layer 15 are made of a so-called positive material that increases the solubility in the developer.

  Further, in the present embodiment, a light transmitting material is used as the first photosensitive resin layer 12 and the second photosensitive resin layer 15. The reason will be described below.

  The nozzle plate 1 according to the present embodiment has a configuration in which the openings of the base through hole 5 and the nozzle through hole 6 coincide with each other in the communication portion 7 (FIG. 1A). Therefore, in the step shown in FIG. 2E, the second mask 16 has the nozzle through-hole 6 in which the region E1 in the second photosensitive resin layer 15 is formed in the first photosensitive resin layer 12. Needs to be arranged to correspond to

  Therefore, as described above, by using the first photosensitive resin layer 12 and the second photosensitive resin layer 15 as the light transmitting material, the base through-hole 5 is formed in the second photosensitive resin layer 15 in particular. In doing so, alignment with the nozzle through hole 6 formed in the first photosensitive resin layer 12 can be easily performed.

  Specifically, if a light transmitting material is used, the second mask 16 having an area corresponding to the base through hole 5 opened is disposed on the second photosensitive resin layer 15, and the second photosensitive resin layer 15 is exposed. When the base through-hole 5 is formed in the photosensitive resin layer 15, the alignment between the opening region of the second mask 16 and the nozzle through-hole 6 formed in the first photosensitive resin layer 12 is performed, for example, by the first The photosensitive resin layer 12 and the second photosensitive resin layer 15 can be performed using light that is not exposed to light.

  Thereby, the processing precision of the base through-hole 5 and the nozzle through-hole 6 can be made higher than the conventional manufacturing method mentioned above.

  Here, the light transmissive material is a material having a light transmissive property that facilitates alignment with the nozzle through hole 6 when the base through hole 5 is formed in the second photosensitive resin layer. It may be a transparent material or a translucent material.

  Specific examples include polymethyl methacrylate (PMMA) resin and organic resin mainly composed of methyl methacrylate (MMA) and methacrylic acid (MAA). For example, the first photosensitive resin layer 12 and the second photosensitive resin layer 15 can be formed by applying polymethyl methacrylate (PMMA) resin to a thickness of 100 μm.

  In the present embodiment, the first photosensitive resin layer 12 and the second photosensitive resin layer 15 are exposed using synchrotron radiation light 14 having a center wavelength of 0.5 nm. However, the present invention is not limited to this, and any light that can sensitize the first photosensitive resin layer 12 and the second photosensitive resin layer 15 may be used.

  Of the light that can sensitize the first photosensitive resin layer 12 and the second photosensitive resin layer 15, light having a center wavelength of 0.3 to 1.0 nm (3 to 10 mm) is preferable. . Thus, the base through hole 5 and the nozzle through hole 6 can be formed by lithography using light having a very short wavelength with a center wavelength of 0.3 to 1.0 nm. Therefore, the processing of the nozzle plate 1 with a very high lithography resolution and high accuracy can be realized.

  Therefore, the first photosensitive resin layer 12 and the second photosensitive resin layer 15 are light-transmitting materials and materials exhibiting high sensitivity to light having a central wavelength of 0.3 to 1.0 nm. It is preferable.

  Further, among the lights having a center wavelength of 0.3 to 1.0 nm, the synchrotron radiation 14 is preferable. As a result, the base through hole 5 and the nozzle through hole 6 can be formed by lithography using synchrotron radiation having a very high degree of parallelism. Therefore, the cylindrical nozzle 2 can be easily processed as in the present embodiment.

  Further, the nozzle plate manufacturing method according to the present invention can be applied even to a nozzle member having a high aspect ratio similar to the conventional one. Also in this case, by using the synchrotron radiation light 14, a high aspect ratio nozzle member can be easily processed.

  As described above, by using the nozzle plate manufacturing method of the present embodiment, the nozzle plate 1 is formed on the sacrificial member 9 during the manufacturing process of the nozzle plate 1, and the base of the nozzle plate 1 is penetrated. After the holes 5 and the nozzle through holes 6 are formed, the sacrificial member 9 is separated from the nozzle plate 1.

  For this reason, it is possible to manufacture the nozzle plate 1 (the first photosensitive resin layer 12 and the second photosensitive resin layer 15) being manufactured with a higher rigidity than the manufacturing method in the case where the sacrificial member 9 is not provided. it can. Therefore, when the shape of the nozzle plate is fine as in the present embodiment, the processing accuracy can be increased.

  Further, when forming the base through hole 5 in the base portion 4, the nozzle 2 already formed in the first photosensitive resin layer 12 is fixed by the sacrificial member 9 together with the region E2, and has high rigidity. Therefore, the base through hole 5 can be formed without damaging the nozzle 2. Therefore, after forming a nozzle having a shape protruding from the substrate without using a sacrificial member, the nozzle is better than the nozzle plate manufacturing method in the prior art in which the passage through hole of the substrate is formed on the back surface of the nozzle. A plate 1 can be provided.

  Further, according to the nozzle plate manufacturing method of the present embodiment, the base through hole 5 is formed by using the synchrotron radiation light 14 having a center wavelength of 0.5 nm to be exposed. Therefore, the possibility of the above-described problem due to over-etching or the like is extremely low as compared with the conventional manufacturing method in which the base through hole is formed by etching. That is, the nozzle plate can be manufactured satisfactorily and a good nozzle plate can be provided.

  Moreover, since the nozzle 2 has a cylindrical shape, the electric field concentration in the vicinity of the target base material side opening 8 can be increased. As a result, the liquid material can be discharged at a low discharge voltage.

  In other words, the nozzle plate manufacturing method according to the present invention can be expressed as having the following features. That is, a method of manufacturing a nozzle plate having at least one nozzle hole for discharging a liquid substance, the step of preparing a sacrificial member, the step of forming a first photosensitive resin layer on the sacrificial member, Processing the shape corresponding to the first through-hole formed in the first photosensitive resin layer, forming the second photosensitive resin layer on the first photosensitive resin layer, and the first And a step of processing a shape corresponding to the second through hole formed in the second photosensitive resin layer, and a step of removing the sacrificial member after the processing of the second through hole.

  In this case, furthermore, at least one of the first photosensitive resin layer or the second photosensitive resin layer is processed into a cylindrical shape having an outer diameter larger than that of the first through hole or the second through hole. It can also be a feature.

Further, the center position of the first through hole and the center position of the second through hole may be shifted from each other.
[Embodiment 2]
Another embodiment according to the present invention will be described below with reference to FIGS. 3 (a) to 3 (d). In the present embodiment, in order to describe differences from the first embodiment, for the sake of convenience of explanation, members having the same functions as those described in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. Is omitted.

  FIGS. 3A to 3D are explanatory views for explaining a method of manufacturing the nozzle plate in the present embodiment. The nozzle plate 1 in the present embodiment is structurally the same as that of the first embodiment. Accordingly, FIGS. 3A to 3D illustrate the state cut along the cutting line AA ′ in the nozzle plate 1 after the completion of manufacture shown in FIG. 1A, as in FIG. 1B. It is sectional drawing.

  In the nozzle plate 1 of the first embodiment, the first photosensitive resin layer 12 and the first photosensitive resin layer 12 of the so-called positive type resin material whose solubility in the developing solution is increased between the base portion 4 and the nozzle 2 constituting the nozzle plate 1 and the first plate. Two photosensitive resin layers 15 are used. In contrast, in the present embodiment, the exposed region uses a so-called negative resin material that improves the dissolution resistance to the developer.

  A manufacturing method of the nozzle plate 1 in the case where a negative resin material is used for the first photosensitive resin layer 12 and the second photosensitive resin layer 15, based on FIGS. explain.

  The difference between the first embodiment and the manufacturing method of the present embodiment is that, in the present embodiment, the base portion 4 is formed using the first photosensitive resin layer 12, and the second photosensitive resin layer is formed. 15 is used to form the nozzle 2. Below, the manufacturing method of this Embodiment is demonstrated concretely. In the following, differences from the first embodiment will be particularly described, and description of the same contents as those of the first embodiment will be omitted.

  FIG. 3A shows a state in which the first photosensitive resin layer 12 is laminated on the sacrificial member 9 (first lamination step). As described above, in the present embodiment, the base portion 4 shown in FIG. 1A is formed using the first photosensitive resin layer 12. First, the first photosensitive resin layer 12 is applied on the sacrificial member 9 by a conventionally known method. For example, when the thickness of the base portion 4 is desired to be 100 μm, the first photosensitive resin layer 12 may be laminated so as to have a thickness of 100 μm.

  A base through hole 5 is formed in the base portion 4. FIG. 3B shows a step of forming the base portion 4 and the base through hole 5 using the first photosensitive resin layer 12 (first photosensitive step).

  As shown in FIG. 3B, the first mask 13 is formed on the first photosensitive resin layer 12 by the first mask 13 on the side opposite to the sacrificial member 9 side in the first photosensitive resin layer 12. It arrange | positions so that a part, specifically the base through-hole 5 part may be masked. Then, using the first mask 13, the first photosensitive resin layer 12 is irradiated with synchrotron radiation light 14 having a center wavelength of 0.5 nm.

  By this irradiation, as shown in FIG. 3B, the region E3 is exposed and the base portion 4 having the base through hole 5 is formed.

  Next, FIG. 3C shows a state in which a second photosensitive resin layer 15 is stacked on the first photosensitive resin layer 12 that is exposed to the synchrotron radiation 14 (second stacked layer). Process). In the present embodiment, the nozzle 2 is formed using the second photosensitive resin layer 15.

  The second photosensitive resin layer 15 can be laminated by applying it onto the first photosensitive resin layer 12 by a conventionally known method, similarly to the lamination of the first photosensitive resin layer 12. For example, when the amount of protrusion from the base portion 4 of the nozzle 2 is desired to be 100 μm, the second photosensitive resin layer 15 is laminated on the first photosensitive resin layer 12 so as to have a thickness of 100 μm. That's fine. That is, in the present embodiment, the thickness of the second photosensitive resin layer 15 corresponds to the amount of protrusion from the base portion 4 of the nozzle 2.

  FIG. 3D shows a process of forming the nozzle 2 and the nozzle through hole 6 using the second photosensitive resin layer 15 (second photosensitive process).

  As shown in FIG. 3 (d), the second mask 16 is disposed on the opposite side of the second photosensitive resin layer 15 from the first photosensitive resin layer 12 side, so that the second photosensitive resin is formed. Mask part of layer 15. Then, using the second mask 16, the first photosensitive resin layer 12 is irradiated with synchrotron radiation light 14 having a center wavelength of 0.5 nm.

  By this irradiation, the region E4 is exposed and the cylindrical nozzle 2 having the nozzle through hole 6 is formed in the second photosensitive resin layer 15.

  Next, the nozzle plate 1 in which the base portion 4 is formed in the first photosensitive resin layer 12 and the nozzle 2 is formed in the second photosensitive resin layer 15 is developed as in the first embodiment (development). Process). Thereby, the nozzle plate 1 illustrated in FIG. 3E is completed.

  For the first photosensitive resin layer 12 and the second photosensitive resin layer 15 in the present embodiment, a so-called negative resin material that is a light-transmitting material and has improved dissolution resistance to a developer is used. Specifically, an epoxy-based material can be used, and more specifically, MicroChem Corp. SU-8 resist, etc. manufactured by the company can be used.

  By using the manufacturing method as described above, the nozzle plate 1 in the present embodiment forms the base portion 4 in order to form the base portion 4 and the base through hole 5 in the step before forming the nozzle 2. The conventional problem that the nozzle 2 is damaged at the time is eliminated.

  As in the first embodiment, according to the nozzle plate manufacturing method of the present embodiment, the base through-hole 5 is formed by exposing the synchrotron radiation light 14 having the center wavelength of 0.5 nm to light. . Therefore, the possibility of the above-described problem due to over-etching or the like is extremely low as compared with the conventional manufacturing method in which the base through hole is formed by etching. That is, the nozzle plate can be manufactured satisfactorily and a good nozzle plate can be provided.

  In addition, as described above, in the nozzle plate 1 in the first embodiment and the present embodiment, the openings of the base through hole 5 and the nozzle through hole 6 are the same in the communication portion 7 (FIG. 1A). It has become the composition. However, the nozzle plate according to the present invention is not limited to one having a configuration in which the openings coincide with each other.

  Specifically, the nozzle plate may be configured as shown in FIGS. 4A to 4C show other shapes of the base through hole 5 and the nozzle through hole 6 of the nozzle plate 1, and FIG. 1A shows the same shape as FIG. It is sectional drawing equivalent to the state cut | disconnected by the cutting line AA 'in the nozzle plate 1 after the completion of manufacture shown.

  The shape of the base through-hole 5 and the nozzle through-hole 6 shown in FIG. 4A is a cross-sectional view showing a configuration when the diameter of the nozzle through-hole 6 is smaller than the diameter of the base through-hole 5.

  In the case of the configuration shown in FIG. 4A, since the flow resistance of the base through hole 5 is smaller than that of the nozzle through hole 6, a large amount of liquid material is discharged from the finely formed nozzle through hole 6. When adopting the discharge form, the supply of the liquid material is not insufficient with respect to the discharge amount, and the drawing can be performed stably.

  The shape of the base through-hole 5 can be arbitrarily set according to the physical properties of the liquid material to be discharged and desired drawing characteristics as long as the outer diameter of the nozzle 2 is not exceeded.

  Further, the shape of the base through-hole 5 and the nozzle through-hole 6 shown in FIG. 4B is opposite to the configuration of FIG. It is sectional drawing which showed the structure in the case of being small.

  In the case of the configuration shown in FIG. 4B, the flow resistance of the base through-hole 5 is larger than that of the nozzle through-hole 6, so that a small amount of low-viscosity liquid material is discharged from the finely formed nozzle through-hole 6 When discharging, a large amount of liquid material can be suppressed.

  This also makes it possible to finely control the amount of liquid material droplets ejected from the tip of the nozzle through hole 6.

  The shape of the base through hole 5 and the nozzle through hole 6 shown in FIG. 4C is a configuration in which the arrangement of the nozzle through hole 6 and the base through hole 5 is shifted.

  Here, the “shifted configuration” means that the first photosensitive resin layer 12 or the second photosensitive resin layer 12 or the second photosensitive resin layer 15 at the boundary surface between the first photosensitive resin layer 12 and the second photosensitive resin layer 15. It means a configuration in which the centers of the openings of the base through-hole 5 and the nozzle through-hole 6 are shifted by causing the photosensitive resin layer 15 to slide along the boundary surface.

  In the case of the structure shown in FIG. 4C, the cross-sectional shape of the flow path becomes small at the communication part 7 between the base through hole 5 and the nozzle through hole 6, so that the flow path resistance can be increased at this communication part 7.

  Therefore, similarly to the configuration shown in FIG. 4B, mass transportation of the liquid substance can be restricted. Therefore, the discharge amount can be controlled minutely under the discharge condition in which a small amount of low-viscosity liquid material is discharged.

  The amount of deviation between the base through hole 5 and the nozzle through hole 6 can be set from the outer diameter of the nozzle 2 and the diameter of the nozzle through hole 6.

  That is, it is necessary to arrange so that the region of the base through hole 5 does not extend outside the outer peripheral portion of the nozzle 2. The reason is because of the following problems. FIG. 5 is a cross-sectional view corresponding to a state cut along the cutting line A-A ′ in the nozzle plate 1 after completion of manufacture shown in FIG. In the configuration of the nozzle plate 1 shown in FIG. 4, the edge region of the base through hole 5 is arranged outside the outer peripheral portion of the nozzle 2. If it becomes such a structure, the leak outlet 17 will be formed in the interface of the nozzle 2 and the base part 4, and when the liquid substance leaks out from this leak outlet 17, it is from the target base material side opening part 8. This is because there is a problem that the stability of the discharge amount of the liquid substance is remarkably lowered.

Therefore, when the structure shown in FIG. 4C is realized, the following expression must be satisfied.
D0> D1 / 2 + D2 / 2 + ΔA
The diameter of the base through-hole 5 is represented as D1, the diameter of the nozzle through-hole 6 is represented as D2, the outer diameter of the nozzle 2 is represented as D0, and the deviation amount of the center of each opening in the communicating portion is represented by ΔA. And

  When the structure shown in FIG. 4C is realized, by satisfying the above formula, the above-described problem does not occur and mass transportation of the liquid substance can be restricted. Therefore, the discharge amount can be controlled minutely and discharge of the liquid material can be performed stably under the discharge conditions in which a small amount of low-viscosity liquid material is discharged.

  The nozzle plate 1 may be a nozzle plate having the configuration shown in FIGS. 4A to 4C as described above. When the structure shown in FIG. 4A is manufactured, the diameter of the opening region of the nozzle through hole 6 formation portion provided in the first mask 13 is set to the base through hole 5 formation portion provided in the second mask 16. It can manufacture by making it smaller than the diameter of this opening area | region. In addition, when manufacturing the structure shown to Fig.4 (a), it is preferable to use a negative type resin material. 4A, the shape of the base through hole 5 is a straight shape in FIG. 4A, but in reality, the inner diameter of the base through hole 5 may be reduced by the exposure of the nozzle through hole 6. is there. When the structure shown in FIG. 4B is manufactured, the diameter of the opening region of the base through hole 5 formation portion provided in the second mask 16 is set to the nozzle through hole 6 formation portion provided in the first mask 13. It can manufacture by making it smaller than the diameter of this opening area | region. In addition, when manufacturing the structure shown in FIG.4 (b), a positive type or negative type resin material can be used.

  Furthermore, when the structure shown in FIG. 4C is manufactured, unlike the manufacturing method described above, when the base through hole 5 is formed in the second photosensitive resin layer 15 using the second mask 16. The second mask 16 can be manufactured by shifting the alignment with the nozzle through hole 6 already formed in the first photosensitive resin layer 12.

That is, when manufacturing the configuration shown in FIG. 4C, the flow path resistance in the nozzle 2 can be changed without creating a new mask pattern. Therefore, the flow path resistance setting and adjustment according to the application can be realized easily and without an increase in cost. In addition, when manufacturing the structure shown in FIG.4 (c), it is preferable to use a negative type resin material. 4C, the base through hole 5 has a straight shape in FIG. 4C. However, in actuality, the inner diameter of the base through hole 5 may decrease due to exposure of the nozzle through hole 6. is there.
[Embodiment 3]
Another embodiment according to the present invention will be described below with reference to FIGS. 6 (a) and 6 (b) and FIGS. 7 (a) to 7 (f). In the present embodiment, in order to describe differences from the first embodiment, for the sake of convenience of explanation, members having the same functions as those described in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. Is omitted.

  6A and 6B show the configuration of a nozzle plate 1 according to another embodiment of the present invention, and FIG. 6A is a perspective view schematically showing the configuration of the nozzle plate 1. FIG. 6B shows a cut surface obtained by cutting the nozzle plate 1 shown in FIG. 6A along a cutting line CC ′. For convenience of explanation, in the nozzle plate 1 shown in FIGS. 6A and 6B, the boundary surface between the nozzle 2 and the base portion 4 is illustrated, but in reality, there is no boundary surface.

  The nozzle plate 1 in the present embodiment includes a nozzle portion 20 (nozzle member) having a structure different from that of the nozzle 2 in the first embodiment.

  Specifically, as shown in FIGS. 6A and 6B, the nozzle plate 1 of the present embodiment includes the nozzle 2 in addition to the same cylindrical nozzle 2 as the nozzle 2 of the first embodiment. 2, that is, the flat surface portion 18 having a protrusion amount substantially the same as the protrusion amount from the base portion 4 of the nozzle 2 so as to surround the outer diameter of the nozzle 2 has the same depth as the protrusion amount. The formed nozzle portion 20 is provided through the groove 19.

  The manufacturing method of the nozzle plate 1 in this Embodiment is demonstrated based on Fig.7 (a)-(f). FIGS. 7A to 7F are cross-sectional views illustrating a state cut along a cutting line CC ′ in the nozzle plate 1 after completion of manufacture shown in FIG. 6A, as in FIG. 6B. It is.

  In addition, since the manufacturing method of the nozzle plate 1 in this Embodiment is substantially the same as the manufacturing method of the said Embodiment 1, in the following description, it is easy about the process similar to the manufacturing method of the said Embodiment 1. Explained.

  FIG. 7A shows the sacrificial member 9. The sacrificial member 9 includes a substrate 10 and a sacrificial layer 11 formed on the substrate 10 as in the case of the first embodiment. The sacrificial member 9 may be composed of only the material used for the sacrificial layer 11, and the nozzle plate 1 is easily separated from the sacrificial member 9 in the sacrificial layer 11 in a later manufacturing process. A material that can be etched with high selectivity is used.

  Next, FIG.7 (b) has shown the state which laminated | stacked the 1st photosensitive resin layer 12 on the said sacrificial member 9 (1st lamination process). The first photosensitive resin layer 12 is laminated on the sacrificial member 9 when the amount of protrusion of the nozzle portion 20 (nozzle 2 and flat portion 18) from the base portion 4 is, for example, 100 μm. The photosensitive resin layer 12 may be laminated so as to have a thickness of 100 μm. That is, in the present embodiment, the thickness of the first photosensitive resin layer 12 corresponds to the amount of protrusion from the base portion 4 of the nozzle portion 20.

  FIG. 7C shows a process of forming the nozzle 2, the nozzle through hole 6, the groove 19, and the flat portion 18 using the first photosensitive resin layer 12 (first Photosensitive process). As shown in FIG. 7C, the first mask 13 is disposed on the side opposite to the sacrificial member 9 side in the first photosensitive resin layer 12, and the first photosensitive resin layer 12 is formed by the first mask 13. The first photosensitive resin layer 12 is irradiated with synchrotron radiation light 14 having a center wavelength of 0.5 nm so that a part of the first photosensitive resin layer 12 is masked.

  By this irradiation, as shown in FIG. 7C, the region E5 is exposed, and the cylindrical nozzle 2 having the nozzle through-hole 6, the groove 19, and the plane portion 18 are the first photosensitive resin layer. 12 is formed.

  Next, FIG. 2D shows a state in which the second photosensitive resin layer 15 is laminated on the first photosensitive resin layer 12 that is exposed to the synchrotron radiation 14 (second laminated layer). Process). In the present embodiment, the base portion 4 is formed using the second photosensitive resin layer 15.

  FIG. 7E shows a step of forming the base portion 4 and the base through hole 5 using the second photosensitive resin layer 15 (second photosensitive step). As shown in FIG. 7E, the second mask 16 is second photosensitive by the second mask 16 on the opposite side of the second photosensitive resin layer 15 from the first photosensitive resin layer 12 side. It arrange | positions so that a part of resin layer 15 may be masked, and the 2nd photosensitive resin layer 15 is irradiated with the synchrotron radiation light 14 of center wavelength 0.5nm. By this irradiation, as shown in FIG. 7E, the region E1 is exposed and the base portion 4 having the base through hole 5 is formed.

  Since the process from the state shown in FIG. 7E to the nozzle plate 1 of the present embodiment in which the manufacture shown in FIG. 7F is completed is the same as that in the first embodiment, Then, explanation is omitted.

  As described above, the nozzle plate 1 can be manufactured by the steps shown in FIGS.

  In the present embodiment, as in the first embodiment, when the first photosensitive resin layer 12 and the second photosensitive resin layer 15 are developed, the photosensitive resin is exposed by being immersed in a developer. The region E1 and the region E5 are removed. Therefore, the first photosensitive resin layer 12 and the second photosensitive resin layer 15 are made of a so-called positive material that increases the solubility in the developer. However, the manufacturing method of the nozzle plate 1 in the present embodiment is not limited to this, and a so-called negative resin material that improves the dissolution resistance to the developer as in the second embodiment is used. It is also possible to manufacture by. When using a negative resin material, the base portion 4 is formed on the first photosensitive resin layer 12 and the nozzle portion 20 is formed on the second photosensitive resin layer 15 as in the second embodiment. .

  As described above, the nozzle plate 1 of the present embodiment is substantially the same as the protruding amount from the base portion 4 of the nozzle 2 so as to surround the outer diameter of the nozzle 2 outside the cylindrical nozzle 2. A flat surface portion 18 having a protruding amount includes a nozzle portion 20 formed through a groove 19 having the same depth as the protruding amount.

  As a result, the electric field is concentrated also in the boundary region between the groove 19 and the flat portion 18, and the electric field in the vicinity of the target base material side opening 8 of the nozzle portion 20 is confined by the electric field generated from the outer peripheral portion. . Therefore, the divergence of the electric force lines near the target base material side opening 8 is prevented, thereby improving the landing accuracy of the fluid flying along the electric lines of force.

  Furthermore, since the flat surface portion 18 exists on the outer side of the groove 19, damage to the nozzle portion 20 due to contact with the target base material can be prevented.

  In addition, the nozzle plate 1 in the present embodiment has a configuration in which the openings of the base through hole 5 and the nozzle through hole 6 are matched. However, as in the case of the first embodiment, also in the present embodiment, the diameter of the base through hole 5 and the diameter of the nozzle through hole 6 can be set to different sizes. Similarly to the case of the first embodiment, the arrangement of the nozzle through hole 6 and the base through hole 5 can be shifted as long as the above formula is satisfied.

  In other words, the nozzle plate manufacturing method according to the present invention can be expressed as having the following features. That is, at least one of the first photosensitive resin layer 12 or the second photosensitive resin layer 15 surrounds the cylindrical shape having an outer diameter larger than the first through hole or the second through hole and the cylindrical shape, respectively. It can also be characterized by being processed to have an outer groove.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and obtained by appropriately combining technical means disclosed in different embodiments. Such embodiments are also included in the technical scope of the present invention.

  The nozzle plate manufacturing method according to the present invention provides a nozzle plate manufacturing method capable of protecting the nozzle member from damage of the nozzle member during manufacturing and improving the stability of the shape accuracy of the nozzle plate. Can do.

  Therefore, for example, it can be widely applied to a method of manufacturing a nozzle plate provided in an ink jet printer for forming a fine pattern such as a color filter for a liquid crystal display device or forming a conductor pattern of a printed wiring board.

(A) is the perspective view which showed the structure of the nozzle plate which is one Embodiment of this invention, (b) is the state which cut | disconnected the nozzle plate illustrated to (a) with the cutting line AA '. It is sectional drawing shown. (A)-(f) is explanatory drawing explaining the manufacturing method of the nozzle plate in one Embodiment of this invention, and cut | disconnected the nozzle plate by the cutting line AA 'illustrated to Fig.1 (a). It is sectional drawing of the nozzle plate corresponded to a state. (A)-(e) is explanatory drawing explaining the manufacturing method of the nozzle plate in the 2nd Embodiment of this invention, and shows a nozzle plate by the cutting line AA 'illustrated to Fig.1 (a). It is sectional drawing of the nozzle plate corresponded in the cut | disconnected state. (A)-(c) is sectional drawing which showed the other structure of the base through-hole provided in the nozzle plate in one Embodiment of this invention, and a nozzle through-hole, respectively. FIG. 5 is a cross-sectional view illustrating a case where a leak outlet is formed in the base through hole in the structure of the base through hole and the nozzle through hole illustrated in FIG. (A) is the perspective view which showed the structure of the nozzle plate which is the 3rd Embodiment of this invention, (b) cut | disconnected the nozzle plate illustrated to (a) with the cutting line CC '. It is sectional drawing which showed the state. (A)-(f) is explanatory drawing explaining the manufacturing method of the nozzle plate in the 3rd Embodiment of this invention, and shows a nozzle plate by the cutting line CC 'illustrated to Fig.6 (a). It is sectional drawing of the nozzle plate corresponded in the cut | disconnected state. It is sectional drawing which shows the structure of the conventional nozzle plate. It is explanatory drawing explaining the manufacturing method of the conventional nozzle plate shown in FIG.

Explanation of symbols

1 Nozzle plate 2 Nozzle (nozzle member, protrusion)
3 Nozzle tip 4 Base (substrate member)
4a Inflow surface 4b Discharge surface 5 Base through hole (first through hole, second through hole)
6 Nozzle through hole (first through hole, second through hole)
7 communication portion 8 target base material side opening 9 sacrificial member 10 substrate 11 sacrificial layer 12 first photosensitive resin layer 13 first mask 14 synchrotron radiation 15 second photosensitive resin layer 16 second mask 17 leakage port 18 Flat part 19 Groove 20 Nozzle part (nozzle member)

Claims (11)

A method of manufacturing a nozzle plate, comprising: a nozzle member provided with a nozzle through hole having a nozzle hole for discharging a liquid substance at one end; and a substrate member provided with a flow path through hole serving as a flow path for the liquid material. And
A first laminating step of laminating the first photosensitive resin layer on the sacrificial member;
A first photosensitive step of irradiating the first photosensitive resin layer laminated by the first lamination step with light for forming the first through hole by exposing the first photosensitive resin layer;
A second laminating step of laminating a second photosensitive resin layer made of a light transmitting material on the first photosensitive resin layer exposed in the first photosensitive step;
The second photosensitive resin layer laminated by the second lamination step is irradiated with light that forms the second through hole communicating with the first through hole by exposing the second photosensitive resin layer to light. A second exposure step;
A developing step for developing the first and second photosensitive resin layers exposed in the first and second photosensitive steps;
A method for producing a nozzle plate, comprising: a separation step of separating the first and second photosensitive resin layers exposed by the first and second photosensitive steps and the sacrificial member.   2. One of the nozzle member and the substrate member is formed by the first photosensitive resin layer, and the other is formed by the second photosensitive resin layer. Manufacturing method of nozzle plate.   The nozzle member has a cylindrical projecting portion having an outer diameter larger than the diameter of the first or second through hole provided in the substrate member, and the first or second provided in the substrate member. 2. The method of manufacturing a nozzle plate according to claim 1, further comprising: an opening communicating with the two through-holes and the nozzle hole on each of the circular surfaces of the cylindrical shape arranged opposite to each other.   2. The method of manufacturing a nozzle plate according to claim 1, wherein the first and second exposure steps are performed by lithography using light having a wavelength of 0.3 to 1.0 nm.   The method for manufacturing a nozzle plate according to claim 4, wherein the light used for the lithography is synchrotron radiation.   2. The method of manufacturing a nozzle plate according to claim 1, wherein in the separating step, the first and second photosensitive resin layers developed in the developing step and the sacrificial member are separated.   The first and second through holes are provided with openings having substantially the same diameter, and are formed so that the centers of the respective openings in the communicating portion between the first and second through holes are shifted. The nozzle plate manufacturing method according to claim 1, wherein the nozzle plate is manufactured. The diameter of the opening portion of the first through hole is D1, the diameter of the opening portion of the second through hole is D2, the outer diameter of the nozzle is D0, and the deviation amount of the center of each opening portion of the communicating portion is ΔA. When
D0> D1 / 2 + D2 / 2 + ΔA
The nozzle plate manufacturing method according to claim 7, wherein:   In the nozzle member, a planar portion having a projection amount substantially the same as the projection amount of the projection portion is formed outside the cylindrical projection portion via a groove having a predetermined depth. The manufacturing method of the nozzle plate of Claim 3.   The nozzle plate manufactured by the manufacturing method of the nozzle plate of any one of Claims 1-9.   The nozzle plate according to claim 10, wherein the nozzle plate is an electrostatic suction type nozzle plate that charges a liquid material and discharges the liquid material by an electrostatic suction force of the liquid material.

Images