JP2006128561A - Substrate rolling mechanism and film formation device with it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate rolling mechanism which realizes a long life and cost reduction and a film formation device having the substrate rolling mechanism. <P>SOLUTION: A rotation/revolution mechanism A has a substrate holder 9 whereon a substrate W is mounted. It has a first treatment substrate holding member 1 holding the substrate W to rotate freely, a second treatment substrate holding member 2 which holds a plurality of first treatment substrate holding members 1 to rotate freely and a base plate 7 holding the second treatment substrate holding member 2. It has rotating members 16A/16B which hold a plurality of spheres 6 for rotating the first treatment substrate holding member 1 or the second treatment substrate holding member 2 in the inside between the first treatment substrate holding member 1 and the second treatment substrate holding member 2, and between the second treatment substrate holding member 2 and the base plate 7. Holding grooves 17a/17b for storing the rotating members 16A/16B are formed in the first treatment substrate holding member 1 and the second treatment substrate holding member 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate rotation mechanism and a film forming apparatus, and more specifically, various film forming processes such as a metal organic chemical vapor deposition (MOCVD) method (hereinafter referred to as “MOCVD method”). The present invention relates to a substrate rotating mechanism that can be suitably used for a film forming apparatus that applies to a plurality of substrates, and a film forming apparatus including the substrate rotating mechanism.

  In recent years, in the field of semiconductor devices, there has been an increasing demand for film formation processing technology for forming a desired surface. Among them, the MOCVD method is particularly attracting attention as a film forming technique for forming a thin film of a compound semiconductor useful for an optical device, a high-speed device or the like.

  In a film forming apparatus equipped with a substrate rotation mechanism used in this MOCVD method, it is important to introduce a reactive source gas into the substrate surface to cause a predetermined chemical reaction to form a desired thin film uniformly. is there.

  When forming a desired thin film by the MOCVD method, it is known that the surface reaction that occurs on the surface of the substrate by the reactive source gas has an extremely complicated mechanism. That is, a large number of parameters contribute to the surface reaction, such as the temperature of the substrate, the temperature of the source gas, the flow rate, the pressure, the type of active chemical species contained in the source gas, and the residual gas components in the reaction system. For this reason, it is extremely difficult to control these parameters and form a desired thin film by MOCVD.

  Under such circumstances, in a film forming apparatus (MDCVD apparatus) using the MOCVD method, there are various methods for forming a desired thin film more uniformly and more stably on the substrate surface under the conditions of the above parameters. Proposed.

  In general, a method of rotating a substrate on a plane is used as a method of forming a thin film by making the film thickness and the film composition uniform. For example, when forming a lattice-matched InGaAsP thin film on an InP substrate, the pressure in the reaction tube included in the MOCVD apparatus and the carrier gas flow rate are determined only from the interface steepness of the multiple quantum well (MQW) structure, The uniform film thickness and composition generated from upstream to downstream of the carrier gas flow are averaged using a method of rotating the substrate on a plane.

  In the method of rotating the substrate, as a measure for further enhancing the effect of uniforming the film thickness and the film composition by rotating the substrate, the substrate is rotated and the susceptor holding the substrate is rotated to rotate the substrate. Means equipped with a so-called “self-revolving mechanism” of the substrate that revolves around the rotation axis of the susceptor has been used (for example, Patent Documents 1 to 4).

  FIG. 11 is a cross-sectional view of a film forming apparatus D having such a substrate self-revolution mechanism. As shown in FIG. 11, the film forming apparatus D generally includes a substrate W, a substrate tray 200 that holds the substrate W, a susceptor 300 that holds the substrate tray 200, and a substrate rotation mechanism that rotates the substrate W (illustrated). And a rotation shaft SC that rotates the susceptor 300. Then, the susceptor 300 is rotated by the SC on the rotating shaft, so that the film forming process is performed on the substrate W held on the substrate tray 200.

  On the other hand, Patent Document 5 discloses a film forming apparatus provided with a substrate rotation mechanism that rotates (rotates and revolves) a substrate via a drive gear. FIG. 12 is a perspective view of the substrate rotation mechanism X in this film forming apparatus. FIG. 13 is a cross-sectional view schematically showing the configuration of the substrate rotation mechanism X. FIG. 14 is a cross-sectional view schematically showing the configuration of the bearing grooves 132 and 162 that support the bearing B1 provided in the substrate rotation mechanism X of FIG. The substrate rotation mechanism X is used in a film forming apparatus such as MOCVD. In this film forming apparatus, the disk-shaped susceptor (stage) 130 holding a plurality of substrates is rotated (revolved) via the drive gear 105 in order to simultaneously rotate and revolve the substrates. That is, a rotation shaft (see FIG. 11) provided in alignment with the rotation axis C10 of the susceptor 130 is eliminated, and a gear 121 is formed on the outer peripheral portion of the substrate tray 120 that holds the substrate. 120 is configured to mesh with a fixed gear 104 that is fixedly disposed on an upper portion of the outer periphery of the susceptor 130. As a result, when the susceptor 130 rotates (revolves), the substrate tray 120 and thus the substrate held by the substrate holding portion 125 can simultaneously rotate.

  In this film forming apparatus, as shown in FIG. 13, the first rotating mechanism 101 includes a susceptor 130 via a bearing B 1 supported by bearing grooves 132 and 162 provided in each of the susceptor 130 and the base plate 106. The second rotating mechanism 102 rotatably holds the substrate tray 120 via a bearing B2 supported by bearing grooves 123 and 133 provided in the substrate tray 120 and the susceptor 130, respectively. .

  Further, in this film forming apparatus, as shown in FIG. 14, the bearing groove 132 provided on the susceptor 130 side and the bearing groove 162 provided on the base plate 106 side included in the first rotating mechanism 101 are each in the horizontal direction. The bearing groove 132 provided on the susceptor 130 side has a vertical plane formed in the vertical direction and the horizontal plane formed in the upper support portion 103a positioned on the horizontal plane above the bearing B1. The bearing groove 162 provided on the base plate 106 side supports the bearing B1 on the lower horizontal plane below the bearing B1. The upper support portion 1 is supported by at least two points including the portion 106a and the inner support portion 106b located on the inner vertical plane. Each 3a is a lower support portion 106a, together with the uppermost and lowermost bearing B1, the outer support portions and the inner support portions are each are constituted located at both ends of the horizontal bearing B1.

In this way, in the film forming apparatus of Patent Document 5, it is possible to stably rotate the susceptor and thereby revolve the substrate.
JP 5-129208 (May 25, 1993) JP 4-313220 (published on November 5, 1992) Japanese Patent Laid-Open No. 9-266173 (released on October 7, 1997) 2-138422 (opened on November 19, 1990) JP 2002-179552 (released on June 21, 2002)

  However, in the film forming apparatus described in Patent Document 5, the bearings B1 and B2 are held by the bearing grooves 123, 133132, and 162 formed in the substrate tray 120, the susceptor 130, and the base plate 106, as shown in FIG. Yes. For this reason, there is a problem that the bearing grooves 123, 133, 132, 162 and the bearings B 1, B 2 are easily rubbed and worn by the rotation of the substrate tray 120 and the susceptor 130. As a result, it is necessary to replace not only the bearings B1 and B2, but also the substrate tray 120, the susceptor 130, and the base plate 106 in which the bearing grooves 123, 133132, and 162 are formed.

  Specifically, as shown in FIG. 13, the bearing B1 is held by contacting a bearing groove 132 provided on the susceptor 130 side and a bearing groove 162 provided on the base plate 106 side. Similarly, the bearing B2 is held by contacting a bearing groove 123 provided on the substrate and the example 120 side and a bearing groove 133 provided on the susceptor 130 side. For this reason, when the substrate is rotated, friction between the bearing grooves 132 and 162 (123 and 133) and the bearing B1 (B2) is unavoidable, and wear of the bearing grooves 132 and 162 (123 and 133), or The wear of the bearing B1 (B2) proceeds. If the rotation is continued for a long time in a worn state, the position of the substrate on the substrate tray 120 changes, so that a uniform and stable film forming process cannot be performed. Therefore, not only the bearings B1 and B2, but also the members (substrate tray 120, susceptor 130, and base plate 106) in which the bearing grooves 123, 133, 132, and 162 are formed are frequently required. That is, in the configuration of Patent Document 5, there is a problem that the life of each member related to the bearings B1, B2, etc. is short and frequent maintenance is required.

  Further, when wear powder is generated due to friction between the bearing B1 (B2) and the bearing grooves 132 and 162 (123 and 133), the wear powder acts as an abrasive. As a result, there is a problem in that the wear of the bearing grooves 132 and 162 (123 and 133) and the bearing B1 (B2) is promoted and the life thereof is further shortened. In addition, there is a problem that the abrasion powder is mixed into the substrate to be processed (film formation surface) and affects the film quality.

  Further, the member (substrate tray 120, susceptor 130, base plate 106) in which the bearing grooves 132 and 162 (123 and 133) are formed needs to use a heat-resistant material and a low-reactive material with a source gas. The bearing grooves 132 and 162 (123 and 133) are very expensive because it is necessary to perform high-precision processing in order to ensure rotational accuracy. For this reason, it is not preferable to frequently replace these members because the running cost increases.

  The present invention has been made in view of such problems, and an object of the present invention is to reduce the number of replacement parts at the time of maintenance and to reduce the cost, and to form a film including the substrate rotation mechanism. To provide an apparatus.

  In order to solve the above-described problem, a substrate rotation mechanism according to the present invention includes a first substrate holding member that includes a placement portion on which a substrate is placed and rotatably holds the substrate. In the substrate rotation mechanism including a second substrate holding member that rotatably holds a plurality of first substrate holding members and a support that holds the second substrate holding member, the first substrate holding member A plurality of annular members for rotating the first substrate holding member or the second substrate holding member between the second substrate holding member and the second substrate holding member and the support. A rotation member held inside is provided, and a holding groove for accommodating the rotation member is formed in the first substrate holding member and the second substrate holding member.

  According to said structure, a 1st board | substrate holding member is hold | maintained at a 2nd board | substrate holding member via a rotation member, and a 2nd board | substrate holding part is hold | maintained at a support body via a rotation member. ing. Then, the annular member inside the rotating member rotates the first substrate holding member and the second substrate holding member. For this reason, the rotating member can be a separate member from the first substrate processing member and the second substrate holding member. Since the annular member is held inside the rotating member, it is possible to replace the rotating member in which the holding groove is formed when rotational wear occurs due to friction between the annular member and the rotating member. . Therefore, even if rotational wear occurs between the annular member and the holding groove, only the rotating member needs to be replaced. That is, it is not necessary to replace the first substrate holding member and the second substrate holding member itself, the holding grooves provided in each of the first substrate holding member and the second substrate holding member, and the support. For this reason, the number of replacement parts at the time of maintenance can be reduced, and the cost can be reduced.

  In the present substrate rotation mechanism, it is preferable that a collecting portion for collecting wear powder generated by friction between the annular member and the rotating member is formed on the rotating member.

  According to said structure, since the collection | recovery part which collect | recovers friction powder is formed in the rotating member, it is possible to collect | recover friction powder. Thereby, it can prevent acting powder as an abrasive | polishing agent with the abrasion powder adhering to the annular member. Therefore, wear of the annular member 6 and the rotating member can be reduced, and the life of the rotating mechanism can be further increased. Moreover, the contamination of the substrate due to the friction powder can be prevented.

  In the substrate rotating mechanism, the annular member is preferably held by a plurality of ring-shaped members having different inner diameters.

  According to the above configuration, since the annular member is held by the plurality of ring-shaped members having different inner diameters, a predetermined interval (space) is formed between the ring-shaped member and the ring-shaped member. For this reason, a space is further formed between each of the pair of rings having different diameters. This space also functions as a collection unit. This makes it possible to dispose the recovery unit on the rotating member without increasing its thickness.

  In addition, by holding the annular member with a plurality of ring-shaped members having different inner diameters, it becomes possible to independently replace the outer peripheral ring on the outer peripheral side with a larger amount of abrasion (amount of wear) by centrifugal force. The number of replacement parts at the time of maintenance can be reduced, and the running cost can be reduced.

  In the substrate rotation mechanism, it is preferable that the holding groove has a through portion that penetrates the first substrate holding member and the second substrate holding member.

  According to said structure, the penetration part has penetrated the 1st board | substrate holding member and the 2nd board | substrate holding member. For this reason, when exchanging (removing) the rotating member, for example, by inserting a screw having a length longer than the depth of the penetrating portion and tightening the screws evenly in order, It can be removed without applying excessive stress. Therefore, it is possible to remove the rotating member A from the holding groove without applying extra stress to the rotating member.

  In order to solve the above problems, a film forming apparatus according to the present invention (the present film forming apparatus) includes any one of the substrate rotating mechanisms.

  According to the above configuration, since the present substrate rotation mechanism is provided, the first substrate holding member, the second substrate holding member 2 itself, the first processing substrate holding member 1 and the second processing substrate holding member 2 are provided. There is no need to replace the ring groove 17a and the base plate 7 installed in each. For this reason, cost reduction can be achieved.

  In the present film forming apparatus, it is preferable that the placement unit holds the film forming process surface of the substrate vertically downward. Thereby, since dust or the like does not adhere to the film forming surface of the substrate, a uniform film forming process is possible.

  As described above, the substrate rotating mechanism includes the first substrate holding member between the first substrate holding member and the second substrate holding member, and between the second substrate holding member and the support. Alternatively, a rotation member that holds a plurality of annular members for rotating the second substrate holding member therein, and a holding groove that accommodates the rotation member is provided in the first substrate holding member and the second substrate holding member. Is formed. Therefore, even if rotational wear occurs between the annular member and the holding groove, only the rotating member needs to be replaced. That is, it is not necessary to replace the first substrate holding member and the second substrate holding member itself, the holding grooves provided in each of the first substrate holding member and the second substrate holding member, and the support. For this reason, there is an effect that the cost can be reduced.

  Hereinafter, an embodiment of the present invention will be described. Note that the present invention is not limited to this. Hereinafter, as this embodiment, a film forming apparatus including the substrate rotation mechanism (the present substrate rotation mechanism) according to the present invention will be described as an example.

[Embodiment 1]
First, the film forming apparatus (this film forming apparatus) of this embodiment will be described. FIG. 7 is a cross-sectional view (schematic cross-sectional view) showing the basic configuration of the film forming apparatus. As shown in FIG. 7, the film forming apparatus 10 performs a predetermined film forming process on the surface (film forming surface) of the substrate W held by the first processing substrate holding member 1 inside the reaction chamber R. Is. In the reaction chamber R, the film forming apparatus 10 includes a substrate W, a rotation / revolution mechanism (substrate rotation mechanism) A that rotates or revolves the substrate W, and a temperature adjustment device TA that adjusts the temperature of other necessary portions. And a temperature control mechanism TC. The self-revolving mechanism A rotates the first processing substrate holding member 1 with the fixed gear 3 to rotate the substrate W placed on the first processing substrate holding member 1, and this first processing substrate. The second processing substrate holding member 2 holding the holding member 1 is rotated by the drive gear 4 to revolve the substrate W.

  In the present embodiment, “the rotation of the substrate W” indicates that the substrate W is rotated on the first processing substrate holding member 1, and “the revolution of the substrate W” is the first processing. The rotation of the second processing substrate holding member 2 holding the substrate holding member 1 about the rotation axis C1 is shown as a rotation axis. 7, the mechanism for transporting the substrate W, the mechanism for introducing a raw material used for a predetermined film forming process applied to the substrate W, and the pressure inside the reaction chamber R are controlled to a predetermined pressure. The mechanism and the like are omitted.

  The substrate rotating mechanism and the film forming apparatus 10 including the substrate rotating mechanism are particularly effective for a film forming process using a vapor phase growth method such as MOCVD, but are not limited thereto. In addition, for example, as a film forming process using plasma, it can also be applied to a film process such as plasma CVD or sputtering, or a process process such as dry etching in which an etching process is performed on the surface of a substrate in a gas phase. It is.

  Next, the substrate rotation mechanism will be described. FIG. 1 is an exploded perspective view schematically showing a main part of a rotation mechanism used in a film forming apparatus 10 provided with a self-revolution mechanism A, and FIG. 2 is an enlarged view thereof. As shown in FIG. 1, the self-revolving mechanism A of the substrate W mainly includes an annular (ring-shaped) first processing substrate holding member 1 having a plurality of (three in FIG. 1) openings for holding the substrate W. A second processing substrate holding member 2 having a disk shape that holds the first processing substrate holding member 1 rotatably via a sphere (annular member) 6, and a second processing substrate holding member 2 is a sphere. And a base plate (support) 7 that is rotatably held via 6.

  The plurality of first processing substrate holding members 1 are arranged at equal distances around the rotation axis C1 of the second processing substrate holding member 2 as described later. In other words, the center of each first processing substrate holding member 1 is arranged on a concentric circle with the rotation axis C1 as the center.

  Further, teeth 1 a that mesh with teeth 3 a of a fixed gear 3 described later are formed on the outer peripheral portion of each first processing substrate holding member 1. The first processing substrate holding member 1 is provided between the fixed gear 3 and the second processing substrate holding member 2.

  In addition, a substrate holding portion (mounting portion) 9 for holding the substrate W is formed on the inner peripheral portion of the first processing substrate holding member 1. The substrate holding portion 9 is recessed from the surface on the fixed gear 3 side of the first processing substrate holding member 1 to the second processing substrate holding member 2 side, and has a plane parallel to the surface of the first processing substrate holding member 1. It is formed to have.

  An opening is formed in the center of the first processing substrate holding member 1 and the substrate holding portion 9, and this opening becomes a substrate insertion hole 8 when the substrate W is placed on the substrate holding portion 9.

  The second processing substrate holding member 2 is provided between the first processing substrate holding member 1 and the support. Further, the second processing substrate holding member 2 has a disk shape, and a plurality of first processing substrate holding members 1 are held. Further, teeth 2 a that mesh with the teeth 4 a of the drive gear 4 are formed on the outer periphery of the second processing substrate holding member 2. A holding groove 17a for holding the first processing substrate holding member 1 is formed on the surface of the second processing substrate holding member 2 (a surface facing the first processing substrate holding member 1). . One ring 16a of the rotating member 16A is accommodated in the holding groove 17a. The holding groove 17a will be described later.

  The base plate 7 is for holding the second processing substrate holding member 2. The base plate 7 is an annular (ring-shaped) member having an open center. The outer diameter of the base plate 7 is larger than the outer diameter of the second processing substrate holding member 2. A holding groove 17 b for holding the second processing substrate holding member 2 is formed on the surface of the base plate 7 (the surface facing the second processing substrate holding member 2). One ring 16b of the rotating member 16B is accommodated in the holding groove 17b. The holding groove 17b will be described later.

  Thus, the self-revolving mechanism A of the film forming apparatus 10 is formed in the order of the fixed gear 3, the first processing substrate holding member 1, the second processing substrate holding member 2, and the base plate 7. Further, the first processing substrate holding member 1 (substrate holding unit 9), the second processing substrate holding member 2, and the base plate 7 are formed with openings penetrating from the base plate 7 to the substrate holding unit 9.

  The fixed gear 3 has an annular shape (ring shape) with an opening at the center, and teeth 3 a that mesh with the teeth 1 a of the first processing substrate holding member 1 are formed on the inner peripheral portion (opening). This opening (in other words, teeth on the inner periphery) has a contact point on each of the plurality of first processing substrate holding members 1. Then, the rotation of the fixed gear 3 rotates the center of each first processing substrate holding member 1 around the rotation axis while maintaining the arrangement state of the plurality of first processing substrate holding members 1. That is, as described above, the substrate W placed on the substrate holding part 9 of each first processing substrate holding member 1 rotates with the rotation axis of each first processing substrate holding member 1 as the rotation axis.

  The drive gear 4 has a disk shape, and has teeth 4 a that mesh with the teeth 2 a on the outer periphery of the second processing substrate holding member 2 on the outer periphery thereof. Thereby, when the drive gear 4 is driven, the second processing substrate holding member 2 rotates. Along with this, the first processing substrate holding member 1 held by the second processing substrate holding member 2 also rotates. The first processing substrate holding member 1 rotates about the rotation axis C1 of the second processing substrate holding member 2 as a rotation axis. That is, as described above, each first processing substrate holding member 1 revolves around the rotation axis C1.

  In addition, as a drive mechanism for driving the fixed gear 3 and the drive gear 4, a drive mechanism that is normally used can be used. For example, as a drive mechanism that can realize a stable operation relatively easily, a magnetic mechanism can be used. A sealed servo motor, stepping motor, or the like can be used.

  As described above, the self-revolving mechanism A includes the first processing substrate holding member 1, the fixed gear 3 having the teeth 3a that mesh with the teeth 1a on the outer periphery thereof, the second processing substrate holding member 2, and the second The driving gear 4 having teeth 4a meshing with the teeth 2a provided on the outer periphery of the processing substrate holding member 2 and the base plate 7 holding the second processing substrate holding member 2 are configured. Then, the substrate W placed on the substrate holding part 9 through the substrate insertion hole 8 of the first processing substrate holding member with the surface (surface) on which the film forming process is to be performed facing downward (base plate 7 side). However, the film forming process is performed while rotating and revolving.

  Next, a characteristic configuration of the self-revolving mechanism A will be described with reference to FIGS. FIG. 3 is a sectional view of the rotating member 16A and its surroundings. The self-revolving mechanism A includes a rotating member 16 </ b> A for rotating the first processing substrate holding member 1 between the first processing substrate holding member 1 and the second processing substrate holding member 2. Between the substrate holding member 2 and the base plate 7, a rotating member 16B for rotating the second processing substrate holding member 2 is provided. In particular, the rotating members 16A and 16B are characterized by holding a ball (annular member) 6 therein.

  In this embodiment, the rotating member 16A (16B) is formed by combining a pair of rings 16a and 16a (16b and 16b), and a plurality of spheres 6 are formed along the inside of the rings 16a and 16a (16b and 16b). Is held. That is, the plurality of spheres 6 are held inside the rotating member 16A (16B) so as to form a ring shape as a whole. In each drawing, a pair of rings 16a and 16a (16b and 16b) having different outer diameters are combined. However, the outer diameter may be the same and is not particularly limited.

  More specifically, the rotating member 16 </ b> A is provided between the first processing substrate holding member 1 and the second processing substrate holding member 2 and is received in the holding groove 17 a of the second processing substrate holding member 2. . The pair of rings 16 a and 16 a have contact surfaces on the surfaces (outer surfaces) facing the first processing substrate holding member 1 and the second processing substrate holding member 2, and the inner sphere 6 has the first sphere 6. The processing substrate holding member 1 and the second processing substrate holding member 2 are not in contact with each other. Further, the rings 16a and 16a have a substantially similar shape, and a substantially closed space is formed inside by making a pair by combining them. The sphere 6 is held in this closed space. The inner diameter of the ring 16 a is substantially equal to the outer diameter of the recessed substrate holding part 9 of the first processing substrate holding member 1. Although not shown, a holding groove for receiving the ring 16a is formed on the surface (back side) of the first processing substrate holding member 1 facing the ring 16a. That is, the rings 16 a and 16 a of the rotating member 16 </ b> A are accommodated in the holding grooves formed in the first processing substrate holding member 1 and the second processing substrate holding member 2.

  As a result, as shown in FIG. 3, the rotating member is provided between the first processing substrate holding member 1 and the second processing substrate holding member 2 and includes the rings 16a and 16a holding the sphere 6 therein. The first processing substrate holding member 1 is held on the second processing substrate holding member 2 through 16A.

  The structure of the rotating member 16B is substantially the same as that of the rotating member 16A except for the size. That is, the rotating member 16B is provided between the second processing substrate holding member 2 and the base plate 7, and is accommodated in the holding groove 17b of the base plate 7. The pair of rings 16 b and 16 b have contact surfaces on the surface (outer surface) facing the second processing substrate holding member 2 and the base plate 7, and the inner sphere 6 is formed by the second processing substrate holding member 2. And it does not contact the base plate 7. Moreover, the rings 16b and 16b have substantially similar shapes, and a substantially closed space is formed in the interior by pairing them in combination. The sphere 6 is held in this closed space. The shape (size) of the ring 16 b is substantially equal to the holding groove 17 b of the base plate 7. Although not shown, a holding groove 17b for accommodating the ring 16b is also formed on the surface (back side) of the second processing substrate holding member 2 facing the ring 16b. That is, the rings 16b and 16b of the rotating member 16B are accommodated in the holding grooves 17b formed in the second processing substrate holding member 2 and the base plate 7.

  Thereby, although not shown in figure, it is provided between the 1st process substrate holding member 1 and the 2nd process substrate holding member 2 via rotation member 16A which consists of rings 16a and 16a which held ball 6 inside. Thus, the first processing substrate holding member 1 is held on the second processing substrate holding member 2.

  As described above, in the self-revolving mechanism A, there is an internal space between the first processing substrate holding member 1 and the second processing substrate holding member 2 and between the second processing substrate holding member 2 and the base plate 7. Rotating members 16A and 16B having spheres 6 are provided. Thus, the first processing substrate holding member 1 and the second processing substrate holding member 2 can be rotatably held. Therefore, the rotation members 16 </ b> A and 16 </ b> B can be said to be rotation assisting members that assist the rotation of the first processing substrate holding member 1 or the second processing substrate holding member 2 by the fixed gear 3 and the drive gear 7.

  Furthermore, as shown in FIG. 3, a sphere holding groove 14 for holding the sphere 6 is formed inside the rotary member 16A (16B) (each of the rings 16a and 16a (16b and 16b)). The rings 16a and 16a (16b and 16b) are installed so as to face each other so as to sandwich the sphere 6 inside the sphere holding groove 14. More specifically, in the case of the rotating member 16A, the rings 16a and 16a are respectively fitted in holding grooves 17a installed in the first processing substrate holding member 1 and the second processing substrate holding member 2, respectively. Further, in the case of the rotating member 16B, the rotating member 16B is fitted in the holding grooves 17b installed in the second processing substrate holding member 2 and the base plate 7, respectively. Thus, since the rotating member 16A (16B) is accommodated in the holding groove 17a (17b), the first processing substrate holding member 1 is apparently held by the second processing substrate holding member 2, and the first Two processing substrate holding members 2 appear to be held by the base plate 7.

  The sphere 6 is slightly spaced between the first processing substrate holding member 1 and the second processing substrate holding member 2 and between the second processing substrate holding member 2 and the base plate 7. Thereby, rotation of the 1st processing substrate holding member 1 and the 2nd processing substrate holding member 2 advances smoothly.

  Further, the sphere holding groove 14 has a shape having a space 23 immediately below the center of the sphere 6. For this reason, the abrasion powder generated by the friction between the ball 6 and the rotating member 16 a by the rotation of the first processing substrate holding member 1 or the second processing substrate holding member 2 can be collected in the space 23. That is, this space 23 serves as a collection unit for collecting wear powder.

  In the configuration of FIG. 3, the cross-section of the sphere holding groove 14 is substantially close to a quadrangle having the sphere 6 as an inscribed circle. In the cross-sectional view of FIG. 3, the sphere 6 is held at four points in the sphere holding groove 14. The sphere holding groove 14 is provided in each of the rings 16 a and 16 a and is arranged to face each other to hold the sphere 6. Assuming that the rotation axis C1 side is the inner side and the fixed gear 3 side is the upper side, the sphere holding groove 14 is connected to the upper inner support 18 on the inner side and the upper side of the ring 16a on the first processing substrate holding member 1 side. Two points of the outer and upper upper and lower support portions 19 and the ring 16a on the second processing substrate holding member 2 side are the inner and lower lower inner support portions 20 and the outer and lower lower outer support portions 21. It is configured to support. Further, the upper inner support portion 18 and the lower outer support portion 21, and the upper upper outer support portion 19 and the lower inner support portion 20 are in positions symmetrical with respect to the center of the sphere 6.

  Each of the rings 16a and 16b has heat resistance, and is made of a material having low reactivity with a raw material gas used for film formation, and a material having a low friction coefficient and low wear. Used. For example, carbon, alumina, boron nitride, molybdenum, quartz and the like are exemplified.

  Further, when the rotation member 16A (16B) and the holding groove 17a (17b) are fitted by gap fitting, the key groove and the protrusion are arranged so that the rotation member 16A (16B) does not move by the rotational force. For example, the circumferential movement is constrained. The installation method of the rotating member 16A (16B) for restricting the movement in the circumferential direction is not limited to such a method, and the rotating member 16A (16B) is fixed and held by another member. I just need it.

  In FIG. 3, the ball 6 is supported by two points of the upper upper and lower support portions 18 and 19 on the upper side, the lower lower support portion 20 and the lower lower and outer support portion 21. However, the present invention is not limited to this.

  As described above, according to the present embodiment, the self-revolving mechanism A of the substrate W meshes the teeth 4a of the drive gear 4 and the teeth 2a formed on the outer periphery of the second processing substrate holding member 2, A rotation mechanism (revolution mechanism) that rotates the first processing substrate holding member 1 about the rotation axis C1 as a rotation axis by the rotation of the second processing substrate holding member 2 via the ball 6 in the rotation member 16B, and a fixed state. The teeth 3a of the gear 3 and the teeth 1a formed on the outer periphery of the first processing substrate holding member 1 are meshed with each other, and the second processing substrate holding member 2 rotates to pass through the balls 6 in the rotating member 16A. The first processing substrate holding member 1 rotates and revolves the substrate W by a rotation mechanism (spinning mechanism) that rotates the one processing substrate holding member 1.

  In particular, the ring member 17 </ b> A (16 </ b> B) in which the ball holding groove 14 is formed is provided with a ring groove 17 a provided on the opposing surfaces of the first processing substrate holding member 1 and the second processing substrate holding member 2. It can be installed as a separate component in (ring groove 17b installed on each of the opposing surfaces of second processing substrate holding member 2 and base plate 7). For this reason, when rotational wear of the sphere 6 and the sphere holding groove 14 occurs, the rotating member 16A (16B) in which the sphere holding groove 14 is formed can be replaced. Therefore, even if rotational wear of the sphere 6 and the sphere holding groove 14 occurs, the first processing substrate holding member 1 and the second processing substrate holding member 2 themselves, the first processing substrate holding member 1 and the second processing substrate holding member 1 are not affected. The ring groove 17a and the base plate 7 installed in each of the processing substrate holding members 2 need not be replaced. For this reason, the number of replacement parts at the time of maintenance can be reduced, and the cost can be reduced.

  Also in the configuration of the present embodiment, it is inevitable that the material of the sphere 6 and the sphere holding groove 14 is scraped due to the friction between the sphere 6 and the sphere holding groove 14 to generate wear powder. It is also possible to collect the wear powder due to the occurrence of the rotational wear in the space 23 of the ball holding groove 14. Thereby, the contamination of the substrate W during the film forming process can be prevented.

  Further, by providing a plurality of spheres 6, a member that restrains rotation can be installed in the vicinity of the substrate W (substrate to be processed), so that highly accurate rotation is possible. On the other hand, conventional bearings cannot be applied in the vicinity of the substrate to be processed because they become high temperature due to rotation and corrosion due to material gas for film formation.

  In FIG. 3, only the rotating member 16 </ b> A has been described, but the rotating member 16 </ b> B is also substantially the same, and the description thereof is omitted.

  Hereinafter, another configuration example of the self-revolving mechanism A of the present embodiment will be described as the second to fourth embodiments. Since the basic configuration is the same as the configuration of the first embodiment, the following embodiment will mainly describe different points. For convenience of explanation, members having the same functions as those shown in the first embodiment are given the same reference numerals and explanation thereof is omitted.

[Embodiment 2]
FIG. 4 is a sectional view showing another configuration example of the rotating member 16A of the present embodiment, and FIG. 8 is a perspective view of the ring 16a in the rotating member 16A. As described above, even with the film forming apparatus 10 of the present invention, the material of the sphere 6 and the sphere holding groove 14 may be scraped off due to the friction between the sphere 6 and the sphere holding groove 14 to generate wear powder. In the configuration of the first embodiment, the generated wear powder accumulates in the space 23 in which the ball holding groove 14 is vacant. However, the wear powder does not stay in the space 23, but adheres to the sphere 6 by rotation and causes the sphere 6 or the sphere holding groove 14 to be scraped off as an abrasive. Therefore, the wear powder promotes the wear of the sphere 6 and the sphere holding groove 14 and may reduce the life thereof.

  Therefore, in the present embodiment, as shown in FIGS. 4 and 8, in the sphere holding groove 14 of the ring 16 a on the second processing substrate holding member 2 side, a vertically lower portion of the sphere 6 (an area directly below the sphere 6). ), A wear powder collecting groove 15 is formed. It can be said that the collection groove 15 is one in which the space 23 of the first embodiment is positively removed to widen the region (the depth of the space is increased). The collecting groove 15 has an abrasion powder collecting groove 15 formed at a portion (the sphere holding groove 14 other than the contact surface) except the contact surface between the sphere 6 and the sphere holding groove 14. The cross section of the recovery groove 15 is formed in a rectangular shape, that is, in a ring shape having an inner diameter different from that of the ring 16a as a whole.

  According to the present embodiment, the abrasion powder generated by the friction of the sphere 6 and the sphere holding groove 14 falls freely into the collection groove 15 by the heavy load and is collected, so that the abrasion powder remains attached to the sphere 6 and polished. It can prevent acting as an agent. Therefore, wear of the sphere 6 and the sphere holding groove 14 can be reduced, and the life of the rotating mechanism can be further increased. In addition, this collection | recovery groove | channel 15 should just be comprised in the shape which can collect | recover abrasion powder, without limiting to a rectangular cross section.

  When wear powder is generated by friction of the rotating member, it is considered that the following problems occur due to the wear powder. (A) Rotational accuracy deteriorates due to accumulation of wear powder (longitudinal swing, de-wheeling due to ball climbing, etc.); (b) Since wear powder is between ball 16 and rings 16a and 16a, it looks like abrasive processing. (However, if the abrasion powder has lubricity (for example, carbon, molybdenum, molybdenum disulfide, boron nitride, etc.), it is not polished, but the problem (a) remains). ). That is, if the wear powder is between the ball 6 and the rings 16a and 16a, such a problem may occur. In the present embodiment, such a problem can be avoided because the collecting groove 15 is positively formed.

[Embodiment 3]
FIG. 5 is a cross-sectional view showing still another configuration example of the rotating member 16A of the present embodiment, and is an exploded view of the rotating member 16A in FIG.

  In the configuration example of the second embodiment, in order to widen the region of the collection groove 15 for collecting the wear powder and collect the wear powder efficiently, the ball holding groove constituting ring 16A is made thick. The collection groove 15 needs to be processed.

  However, increasing the thickness of the rotating member 16A (16B) causes an increase in the weight of the rotating member 16A (16B), and thus the weight of the second processing substrate holding member 2 increases. That is, the load applied to the rotating member 16B installed on the base plate 7 increases. Since an increase in the load reduces the life of the rotating mechanism, it is preferable to reduce the weight as much as possible. Further, since the centrifugal force acting on the rotating member 16A (16B) is larger on the outer peripheral side than on the inner peripheral side, the load on the rotating member 16A (16B) is also larger on the outer peripheral side where the centrifugal force is larger. Takes a lot. For this reason, the shaving due to wear increases on the outer peripheral side.

  Therefore, in the present embodiment, as shown in FIGS. 5 and 8, the rotating member 16A (the respective rings 16a and 16a) is divided into two parts as inner peripheral rings 24a and 24b and outer peripheral rings 25a and 25b. The inner rings 24a and 24b are fitted to the inner circumference of the ring groove 17a, and the outer rings 25a and 25b are fitted to the outer circumference of the ring groove 17a. A space is provided between the inner ring 24a, 24b and the outer ring 25a, 25b, and the space functions as the recovery groove 15. In other words, the structure in which the space 23 of the second embodiment and the recovery groove 15 of the third embodiment are processed until they reach the first processing substrate holding member 1 or the second processing substrate holding member 2 in the direction of the holding groove 17a. It can be said.

  As described above, according to the present embodiment, each of the rotating members 16A (16B) constituted by a pair of members, that is, the rings 16a and 16a (16b and 16b) is divided into two in the circumferential direction. It is a configuration. That is, each of the rings 16a and 16a is a pair of rings having different diameters. Each ring has a contact point (contact surface) with the sphere 6. That is, the sphere 6 is held by four rings. Further, a space is formed between each pair of rings having different diameters. This space functions as the collection groove 15. As a result, the collection groove 15 can be disposed on the rotating member 16 without increasing its thickness. For this reason, the weight of the rotating member 16A can be reduced. In addition, since the outer ring 25a and 25b on the outer peripheral side with a larger amount of wear (amount of wear) can be replaced independently by centrifugal force, the number of replacement parts during maintenance can be reduced, and running Cost can be reduced.

[Embodiment 4]
FIG. 6 is a sectional view showing still another configuration example of the rotating member 16A of the present embodiment, and FIG. 10 is an exploded view of the rotating member 16A. In the embodiments described above, the rotating member 16A is accommodated in the holding groove 17a. Therefore, when replacing the rotating member 16A, for example, when removing the rotating member 16A for cleaning, it is difficult to remove the rotating member 16A. There is a risk of damage to the rotating member 16A during removal.

  Therefore, in this embodiment, when the rotating member 16A is installed (accommodated) in the holding groove 17a on the surface of the holding groove 17a facing the rings 16a and 16a, the holding groove is formed from the surface of the first processing substrate holding member 1. A plurality of push-up holes (penetration portions) 26 penetrating to the end face of 17a are provided. Specifically, as shown in FIGS. 6 and 10, in the first processing substrate holding member 1, the push-up hole 26 has a ring shape penetrating to the ring 16a. On the other hand, in the second process substrate holding member 2, the push-up holes 26 are dotted with a plurality of push-up holes 26 on the circumference of the second process substrate holding member 2. The push-up hole 26 of the second processing substrate holding member 2 is a female screw hole, and a male screw having a length longer than the depth of the push-up hole 26 is provided. When removing the rotating member 16A, the male screw having a length equal to or greater than the depth of the push-up hole 26 is inserted into the push-up hole 26, and the plurality of male screws are tightened evenly in order, thereby adding extra to the rotary member 16A. It is possible to remove without applying any stress. Further, the push-up hole 26 of the first processing substrate holding member 1 can be similarly removed from the rotating member 16A (ring 16a).

  As described above, according to the present embodiment, it is possible to remove the rotating member 16A from the holding groove 17 without applying excessive stress to the ball holding groove constituting ring 16.

  The substrate rotation mechanism according to the present invention can also be expressed as follows.

  [1] A substrate to be processed held rotatably in a reaction chamber is held, the reaction chamber is heated while supplying a reaction gas to the substrate to be processed, and a film is formed on the substrate by a CVD processing method. In the substrate processing apparatus, the rotation mechanism of the processing substrate holding member rotatably held has a plurality of spheres installed in the vicinity of the substrate to be processed, and the rotation receiving portions (rotating members 16A and 16B) A ring holding groove constituting ring (rings 16a and 16b) in which a ring-like ball holding groove for holding a sphere is formed, and a ring groove (holding groove) for holding the ball holding groove constituting ring. A substrate rotation mechanism.

  According to this configuration, the sphere holding groove forming ring in which the sphere holding groove is formed is provided with the ring groove, the second groove installed in the rotation mechanism (each of the first processing substrate holding member and the second processing substrate holding member). Since it can be installed as a separate part in the ring groove installed on each of the processing substrate holding member and the base plate, the ball holding groove configuration in which the ball holding groove is formed when rotational wear of the ball and the ball holding groove occurs Since the ring can be exchanged, the ring groove, the second treatment substrate holding member, and the base plate installed in each of the first treatment substrate holding member and the second treatment substrate holding member need not be exchanged. It is possible to provide a substrate rotating mechanism capable of reducing costs.

  [2] The above-mentioned [1], wherein the rotation receiving portion is further provided with a collection groove at a location excluding a ball holding groove for holding the ball and a contact surface between the ball and the ball holding groove. Substrate rotation mechanism.

  [3] The substrate rotation mechanism according to the above [1] or [2], wherein the rotation receiving portion has a sphere holding groove constituting ring divided into two.

  [4] The rotation receiving portion holding portion for holding the rotation receiving portion has a push-up hole penetrating to the end surface of the ball holding structure ring in the ring groove holding the ball holding groove forming ring [1], The substrate rotating mechanism according to [2] or [3].

  According to the invention of [2], the abrasion powder generated by the friction of the sphere and the sphere holding groove freely falls into the collection groove by gravity and is collected, so that the abrasion powder remains attached to the sphere and acts as an abrasive. This can be prevented. Therefore, wear of the sphere and the sphere holding groove can be reduced, and a substrate rotation mechanism that can extend the life of the rotation mechanism can be provided.

  As described above, according to the present invention, the substrate to be processed that is rotatably held in the reaction chamber is held, and the reaction chamber is heated while supplying the reaction gas to the substrate to be processed. In the substrate processing apparatus for forming a film on the substrate to be processed, it is possible to provide a substrate rotating mechanism capable of extending the life and cost of the substrate rotating mechanism.

  According to the invention of [3], by dividing the sphere holding groove constituting ring into two, it becomes possible to dispose the collecting groove without increasing the thickness of the sphere holding groove constituting ring, and the weight can be reduced. Become. In addition, it is possible to replace the outer peripheral side ball holding groove constituting ring on the outer peripheral side with a larger amount of shaving alone, so that the number of replacement parts at the time of maintenance can be reduced, and the running cost can be reduced. A substrate rotation mechanism can be provided.

  According to the invention of [4], it is possible to provide a substrate rotating mechanism that enables the ball holding groove constituting ring to be removed from the ring groove without adding extra force to the ball holding groove constituting ring.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The substrate rotation mechanism and the film forming apparatus including the same according to the present invention are particularly effective for film forming processing using a vapor phase growth method such as MOCVD, but are not limited thereto. In addition, for example, as a film forming process using plasma, it can also be applied to a film process such as plasma CVD or sputtering, or a process process such as dry etching in which an etching process is performed on the surface of a substrate in a gas phase. It is.

It is a disassembled perspective view which shows typically the principal part of the board | substrate rotation mechanism concerning one Embodiment of this invention. It is the disassembled perspective enlarged view which expanded the principal part of the board | substrate rotation mechanism of FIG. It is sectional drawing of the rotation member in the board | substrate rotation mechanism concerning one Embodiment of this invention. It is sectional drawing of the rotation member in the board | substrate rotation mechanism concerning another one Embodiment of this invention. It is sectional drawing of the rotation member in the board | substrate rotation mechanism concerning another one Embodiment of this invention. It is sectional drawing of the rotation member in the board | substrate rotation mechanism concerning another one Embodiment of this invention. It is sectional drawing which shows the basic composition of the film-forming apparatus provided with the substrate rotation mechanism concerning one Embodiment of this invention. It is a perspective view of the ring in the rotation member of FIG. FIG. 6 is an exploded perspective view of the rotating member of FIG. 5. FIG. 7 is an exploded perspective view of the rotating member of FIG. 6. It is sectional drawing which shows typically the structure of the film-forming apparatus provided with the conventional board | substrate rotation mechanism. It is a disassembled perspective view which shows typically the structure of the film-forming apparatus provided with the conventional board | substrate rotation mechanism. It is sectional drawing which shows typically the structure of the board | substrate rotation mechanism of FIG. It is sectional drawing which shows typically the structure of the bearing groove which supports the bearing provided in the board | substrate rotation mechanism of FIG.

Explanation of symbols

A Self-revolution mechanism (substrate rotation mechanism)
W substrate 1 first processing substrate holding member (first substrate holding member)
2 Second processing substrate holding member (second substrate holding member)
6 sphere (annular member)
7 Base plate (support)
9 Substrate holder (mounting part)
10 Film forming apparatus 14 Sphere holding groove 15 Collection groove (collection unit)
16A, 16B Rotating members 17a, 17b Retaining grooves 24a, 24b Inner ring (ring-shaped member)
25a / 25b outer ring (ring-shaped member)
26 Push-up hole (through part)

Claims (6)

A first substrate holding member having a mounting portion for mounting the substrate and rotatably holding the substrate;
A second substrate holding member for rotatably holding a plurality of first substrate holding members;
In a substrate rotation mechanism comprising a support that holds the second substrate holding member,
To rotate the first substrate holding member or the second substrate holding member between the first substrate holding member and the second substrate holding member and between the second substrate holding member and the support. A rotating member holding the plurality of annular members inside,
A substrate rotation mechanism, wherein the first substrate holding member and the second substrate holding member are formed with holding grooves for receiving the rotating member.   The substrate rotating mechanism according to claim 1, wherein the rotating member is formed with a recovery portion that recovers wear powder generated by friction between the annular member and the rotating member.   3. The substrate rotating mechanism according to claim 1, wherein the annular member is held by a plurality of ring-shaped members having different inner diameters.   The substrate rotation mechanism according to claim 1, wherein the holding groove has a penetrating portion that penetrates the first substrate holding member and the second substrate holding member.   The film-forming apparatus provided with the substrate rotation mechanism of any one of Claims 1-4. The film forming apparatus according to claim 5, wherein the placement unit holds the film forming surface of the substrate downward in the vertical direction.

Images