JP2006124545A - Method for producing aromatic polyamide resin - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for safely and simply producing an aromatic polyamide resin with a reduced content of ionic impurities in an industrial scale. <P>SOLUTION: The method for producing aromatic polyamide resin comprises a step carrying out a polycondensation of an aromatic diamine and an aromatic dicarboxylic acid by using an aromatic phosphorous ester in a solvent, a step hydrolyzing remaining condensing agent by dropping water into the reaction solution until formation of separated phase under heating, and a step leaving the reaction mixture a while and then removing low molecular weight organic compound and the ionic impurities contained in the water phase by removing the water phase which is an upper layer, and then separating out the polyamide resin in a poor solvent and filtering and then drying. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for producing a highly pure aromatic polyamide resin.

  Polyamide resins, particularly polyamide resins containing aromatic groups in the main chain, have excellent heat resistance and mechanical strength, and are expected to be applied to various industrial applications. These polyamide resins are generally obtained by a condensation reaction using a dicarboxylic acid and a diamine and / or a compound having one carboxylic acid and an amino group in the structure as raw materials, but a condensing agent or catalyst added to advance the reaction. In addition, since it contains ionic impurities derived from additives or by-products generated during the reaction, its use in applications requiring electrical insulation is limited. In particular, the method of condensing an amine and a carboxylic acid in the presence of an aromatic phosphite and a pyridine derivative is a widely used condensation reaction, but the polyamide resin synthesized by this method contains an aromatic phosphite. Phosphorus ionic impurities derived from acid esters are likely to remain. Patent Document 1 devised a method for producing a polyamide resin with less impurities by taking out the prepared polyamide resin as fine powder with good cleaning properties, but it satisfies the increasingly required level of electrical insulation. It has not yet reached. Further, in Patent Document 2, a polyamide resin is precipitated as a fine powder from a reaction solution, a low molecular weight component is washed with water vapor from a fine powder of a polyamide resin isolated from the reaction solution, and further dissolved in a solvent to dissolve an organic amine compound, etc. A method is described in which a basic compound is added, treated and precipitated again as a fine powder. In this case, water vapor cleaning of fine powder is cleaning in a non-uniform system, and problems such as bumping and a decrease in yield as a result have been pointed out. Another problem is that the raw material organic amine remains in the fine powder of the polyamide resin, which adversely affects the physical properties of the subsequent resin composition.

JP 2002-97282 A JP 2004-35677 A

  An object of the present invention is to provide a method for producing an aromatic polyamide resin with few impurities to a level that can be used as a material in a field requiring a high degree of electrical insulation in a simple and safe process.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors have developed a method for efficiently removing impurities contained in an aromatic polyamide resin and completed the present invention.

That is, the present invention provides (1) the following formula (A)

(In the formula, Ar ³ represents a divalent aromatic group.)
An aromatic diamine represented by the following formula (B)

(In the formula, Ar ² represents a divalent aromatic group having a phenolic hydroxyl group.)
And, if necessary, the following formula (C)

(In the formula, Ar ¹ represents a divalent aromatic group.)
Is condensed in a solvent in the presence of an aromatic phosphite, and water is added to the reaction solution under heating to hydrolyze the remaining aromatic phosphite. After that, continue to add water, leave the oil layer containing the resin and the water layer at the stage where layer separation began, and remove the ionic impurities and organic low molecular weight impurities by removing the upper water layer Formula (1) characterized by including the process to do

(In the formula, m and n are average values, and m + n = 2 to 200. n is a positive number of 0.1 or more. Ar ¹ , Ar ^3, and Ar ² are the formulas (A) and (B). And the same meaning as in formula (C).
(2) As a compound of formula (A), diaminodiphenyl ether as a compound of formula (B), hydroxyisophthalic acid as a compound of formula (C), and isophthalate as a compound of formula (C) The production method according to (1) or (2), wherein an acid is used and the pyridine derivative is used as the reaction catalyst (3) as a reaction catalyst.

  According to the production method of the present invention, an aromatic polyamide resin with less impurities can be produced efficiently and safely.

  In the method for producing an aromatic polyamide resin of the present invention, the aromatic diamine (formula (A)) is excessive with respect to the total number of moles of the aromatic dicarboxylic acid (formula (B) and formula (C)). Charge and condense.

  Examples of the aromatic diamine represented by the formula (A) include diaminobenzenes such as diaminobenzene, diaminotoluene, diaminophenol, diaminomethylbenzene, diaminomesitylene, diaminochlorobenzene, diaminonitrobenzene and diaminoazobenzene; diamino such as diaminonaphthalene Naphthalenes; diaminobiphenyls such as diaminobiphenyl or diaminodimethoxybiphenyl; diaminodiphenyl ales such as diaminodiphenyl ether or diaminodimethyldiphenyl ether, methylene dianiline, methylene bis (methoxyaniline), methylene bis (dimethoxyaniline), methylene bis (ethylaniline), Methylenebis (diethoxyaniline), methylenebis (ethoxyaniline), methylenebis ( Ethoxyaniline), methylenebis (dibromoaniline), aniline such as isopropylidene dianiline or hexafluoroisopropylidenedianiline, diaminobenzophenones such as diaminodimethylbenzophenone such as diaminobenzophenone; diaminoanthraquinone, diaminodiphenylthioether, diaminodiphenyl sulfoxide, Examples include diaminofluorene, among which diaminodiphenyl ethers or methylenebis (diethylaniline) are preferable. The usage-amount of aromatic diamine is 1.001-1.5 mol normally with respect to 1 mol of aromatic dicarboxylic acids mentioned below.

  Examples of the aromatic dicarboxylic acid having a phenolic hydroxyl group of the formula (B) include hydroxyisophthalic acids such as hydroxyisophthalic acid and dihydroxyisophthalic acid; hydroxyterephthalic acids such as hydroxyterephthalic acid and dihydroxyterephthalic acid, and the like. Examples of aromatic dicarboxylic acids having no phenolic hydroxyl group of formula (C) include phthalic acids such as phthalic acid, isophthalic acid, terephthalic acid, benzenediacetic acid, benzenedipropionic acid, biphenyldicarboxylic acid, oxydibenzoic acid, thiodi Benzoic acids such as benzoic acid, dithiodibenzoic acid, dithiobis (nitrobenzoic acid), carbonyldibenzoic acid, sulfonyldibenzoic acid, naphthalenedicarboxylic acid, methylenedibenzoic acid, isopropylidenedibenzoic acid, hexafluoroisopropylidenebenzoic acid, naphthalene Examples thereof include dicarboxylic acid and pyridinedicarboxylic acid. In the present invention, among these aromatic dicarboxylic acids, the aromatic dicarboxylic acid of the formula (B) is essential, but the combined use of the aromatic dicarboxylic acid of the formula (C) makes it easier to give the cured product flexibility. ,preferable. When used in combination, the structures of the aromatic dicarboxylic acids of the formula (B) and the formula (C) are preferably a combination having an isophthalic acid skeleton. In the dicarboxylic acid of the formula (B) and the aromatic dicarboxylic acid of the formula (C), the proportion of the hydroxyl group contained in the dicarboxylic acid component is usually 0.5 mol% or more, preferably 1 mol% or more, particularly preferably 5 Both are used within a range of at least mol%. In addition, when the aromatic polyamide resin obtained by the present invention is dissolved in a solvent and used as a varnish, it is preferable that the solvent is removed by evaporation because the content of the dicarboxylic acid having a hydroxyl group is small. In terms of adhesive strength, a range in which the hydroxyl group content is 30 to 60 mol% is preferable. In the following description, the term “aromatic dicarboxylic acid” refers to both of the aromatic dicarboxylic acids of the formula (B) and the formula (C).

  The condensation reaction of the aromatic dicarboxylic acid and the aromatic diamine is performed in the presence of an aromatic phosphite as a condensing agent. At this time, it is preferable to use a pyridine derivative as a catalyst.

  The aromatic phosphite used here includes triphenyl phosphite, diphenyl phosphite, tri-o-tolyl phosphite, di-o-tolyl phosphite, tri-m-tolyl phosphite. , Di-m-tolyl phosphite, tri-p-tolyl phosphite, di-p-tolyl phosphite, tri-p-chlorophenyl phosphite and the like. The usage-amount of aromatic phosphite is 0.6-1.5 mol normally with respect to a total of 1 mol of aromatic diamine and aromatic dicarboxylic acid, Preferably it is 0.7-1.2 mol.

  Examples of pyridine derivatives include pyridine, 2-picoline, 3-picoline, 4-picoline, 2,4-lutidine, 2,6-lutidine, and 3,5-lutidine. The usage-amount of a pyridine derivative is 1.0-5.0 mol normally with respect to a total of 1 mol of aromatic diamine and aromatic dicarboxylic acid, Preferably it is 2.0-4.0 mol.

  In addition, in order to obtain an aromatic polyamide resin having a higher molecular weight, an inorganic salt such as lithium chloride can be added to carry out the reaction. The usage-amount of inorganic salt is 0.01-0.5 mol normally with respect to 1 mol in total of aromatic diamine and aromatic dicarboxylic acid, Preferably it is 0.05-0.3 mol.

  The reaction is carried out by charging an aromatic dicarboxylic acid, an aromatic diamine, a condensing agent and, if necessary, a pyridine derivative and an inorganic salt in a solvent. The solvent is not particularly limited as long as it is a solvent that solvates with the aromatic polyamide resin. Specific examples include N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone, and dimethyl. Examples thereof include sulfoxide and mixed solvents thereof, and N-methyl-2-pyrrolidone is particularly preferable. The amount of the solvent used is preferably such that the concentration of the aromatic polyamide resin to be produced is 2 to 50% by weight, but considering the production efficiency and the solution viscosity with good operability, the amount to be 5 to 30% by weight. Particularly preferred. The reaction temperature in the condensation reaction is usually 60 to 150 ° C., preferably 70 to 120 ° C., and the reaction time is usually 1 to 15 hours, preferably 2 to 10 hours.

  The aromatic polyamide thus obtained is usually represented by the following formula (1).

(In the formula, m and n are average values, and m + n = 2 to 200. n is a positive number of 0.1 or more. Ar ¹ and Ar ³ are divalent aromatic groups, and Ar ^2. Represents a divalent aromatic group having a phenolic hydroxyl group.)
In the said Formula (1), the value of m and n is determined by the preparation ratio of aromatic diamine and aromatic dicarboxylic acid, and is normal average value n + m = 2-200, Preferably it is 5-150.
The intrinsic viscosity value (measured with a 0.5 g / dl N, N-dimethylacetamide solution at 30 ° C.) of the aromatic polyamide resin having a preferable average degree of polymerization is in the range of 0.1 to 4.0 dl / g. . In general, whether or not the polymer has a preferable average degree of polymerization is determined by referring to the intrinsic viscosity. When the intrinsic viscosity is less than 0.1 dl / g, the film formability and the appearance of properties as an aromatic polyamide resin are insufficient, which may not be preferable. On the other hand, if the intrinsic viscosity is larger than 4.0 dl / g, there is a possibility that the degree of polymerization is so high that the solvent solubility is deteriorated and the molding processability is deteriorated.

  In the production method of the present invention, after completion of the condensation reaction, water is added to the reaction system to hydrolyze the aromatic phosphite. The addition of water is usually performed by heating to 60 to 110 ° C., preferably 70 to 100 ° C. with stirring. The addition of water is continued until stirring until the oil layer and the aqueous layer begin to separate, but usually 10 to 200% by weight, preferably 20 to 150% by weight, is sufficient based on the total weight of the reaction solution. In order to sufficiently perform hydrolysis, it is preferable that water is added dropwise usually over 30 minutes to 15 hours, preferably 1 to 10 hours, rather than adding all of the necessary amount at once. In this water dropping step, the aromatic phosphite is hydrolyzed to phosphate ions and phenols.

  When the layer separation starts, the stirring is stopped and the mixture is allowed to stand, and when the upper layer (water layer) and the lower layer (oil layer containing resin) are separated, the upper aqueous layer is removed. In this case, since the oil layer usually has a high viscosity and is in a slurry state, the water layer can be easily removed by decantation or the like. It is also possible to send liquid outside the system with a pump or the like. The aqueous layer contains impurities such as phosphoric acid, phosphorous acid, catalysts, phenols, pyridine derivatives, and a part of the solvent.

  The oil layer left after the removal of the aqueous layer has some of the solvent removed, and the viscosity increases and is difficult to handle. Therefore, the organic solvent is added again for dilution. In this case, the organic solvent which can be used is N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone, dimethyl sulfoxide and the like. The amount of the solvent to be used is not particularly limited as long as the viscosity is sufficiently lowered, but is usually 5 to 100% by weight, preferably 10 to 80% by weight, based on the weight of the oil layer.

  Next, the diluted oil layer is added to a poor solvent to precipitate an aromatic polyamide resin. The poor solvent is not particularly limited as long as it is a liquid that does not easily solvate with the aromatic polyamide resin, but specific examples include water, methanol, ethanol, and a mixed solvent thereof. The amount used is preferably as small as possible within the range in which the precipitated aromatic polyamide resin can be filtered out without any problem in operation, and is 0. 0 part by weight with respect to 1 part by weight of the solvent (including the dilution solvent) used in the reaction. 5 to 50 parts by weight is preferable, and 1 to 10 parts by weight is particularly preferable.

  In mixing the diluted oil layer and the poor solvent, the poor solvent may be gradually added to the reaction solution with stirring, or the diluted solution of the oil layer may be added to the poor solvent with stirring. In the method of spraying the diluted liquid of the oil layer into the poor solvent using the liquid feed pump, the compressor and the two-fluid nozzle, or the liquid feed pump and the one-fluid nozzle, the aromatic polyamide resin having an appropriate particle diameter easily precipitates. preferable. The temperature at which the oil layer diluent and the poor solvent are mixed is usually 0 to 100 ° C, preferably 20 to 80 ° C.

  The aromatic polyamide resin precipitated by mixing with a poor solvent is isolated by filtration, and ionic impurities are removed by washing the cake with water. An aromatic polyamide resin can be obtained by drying the cake, but ionic impurities can be further reduced by washing with a water-soluble organic solvent.

  Examples of the water-soluble organic solvent that can be used include alcohols such as methanol, ethanol, n-propanol, and isopropanol, and acetone. These may be used alone or in combination, with methanol being particularly preferred.

  Washing with a water-soluble organic solvent is effective even if the polyamide resin cake isolated by filtration is washed on a filter, but it is wet, that is, an aromatic polyamide containing a good solvent and a poor solvent. The resin cake or the aromatic polyamide resin from which the good solvent and the poor solvent have been removed by drying and the water-soluble organic solvent are newly charged in a container, suspended by stirring, and then filtered again to further remove the cake. Excellent purification effect. In this case, the water-soluble organic solvent is used in an amount of 1 to 100 parts by weight, preferably 2 to 50 parts by weight, based on 1 part by weight of the net polyamide resin, and the stirring temperature is from room temperature to the boiling point of the suspension. Stirring at the boiling point is particularly preferable. The stirring time is 0.1 to 24 hours, preferably 1 to 5 hours. Furthermore, this operation is usually performed under normal pressure, but can also be performed by pressurization.

  After the above suspension treatment, the polyamide resin is filtered off, usually further washed with a cake using the above water-soluble organic solvent, and then optionally further washed with water and then dried. Thus, a polyamide resin with less ionic impurities can be obtained.

  Since the polyamide resin obtained by the production method of the present invention has a functional group such as a phenolic hydroxyl group and an amino group, it can be used as a curable resin composition by combining with an epoxy resin, a curing agent, a curing catalyst, a cyanate resin and the like. I can do it. Specific examples of applications include rigid substrate materials, flexible substrate materials, build-up substrate materials, semiconductor encapsulants, solder resists, paints, and adhesives.

  EXAMPLES Next, the present invention will be described more specifically with reference to examples. In the following, parts are parts by weight unless otherwise specified.

Example 1
While performing a nitrogen purge on a flask equipped with a thermometer, condenser, fractionator, and stirrer, 64.2 parts 5-hydroxyisophthalic acid, 39.0 parts isophthalic acid, 120 parts 3,4'-diaminodiphenyl ether, After adding 6.4 parts of lithium chloride, 680.4 parts of N-methylpyrrolidone and 136.1 parts of pyridine, stirring and dissolving, 295 parts of triphenyl phosphite was added and subjected to a condensation reaction at 95 ° C. for 4 hours. A resin reaction liquid (A) was obtained. While stirring this reaction liquid (A), 670 parts of water was added dropwise at 90 ° C. over 3 hours, further stirred at 90 ° C. for 1 hour, cooled to 60 ° C. and allowed to stand for 30 minutes. Since the upper layer was separated into an aqueous layer and the lower layer was separated into an oil layer (resin layer), the upper layer was removed by decantation. The amount of waste water was 620 parts. The oil layer (resin layer) was diluted by adding 620 parts of N, N-dimethylformamide. This polyamide solution was sprayed into 3000 parts of stirred water using a two-fluid nozzle, and precipitated as fine powder having a particle size of 5 to 50 μm, and the precipitate was separated by filtration. The obtained wet cake was dispersed in 1600 parts of methanol and refluxed for 2 hours with stirring. Next, methanol was filtered off, washed with 1600 parts of water, and dried to obtain the following formula (2).

190 parts of an aromatic polyamide resin represented by the formula: The total amount of phosphorus contained in this aromatic polyamide resin was determined by molybdenum blue-ascorbic acid spectrophotometry after wet oxidative decomposition with sulfuric acid and nitric acid and found to be 650 ppm. The intrinsic viscosity of the obtained aromatic polyamide resin was 0.51 dl / g (dimethylacetamide solution, 30 ° C.). In the formula, the value of m was about 16, and the value of n was about 24. Moreover, the active hydrogen equivalent with respect to the epoxy group of the phenolic hydroxyl group containing aromatic polyamide resin calculated from the preparation ratio was 565 g / eq.

Claims (3)

The following formula (A)

(In the formula, Ar ³ represents a divalent aromatic group.)
An aromatic diamine represented by the following formula (B)

(In the formula, Ar ² represents a divalent aromatic group having a phenolic hydroxyl group.)
And, if necessary, the following formula (C)

(In the formula, Ar ¹ represents a divalent aromatic group.)
Is condensed in a solvent in the presence of an aromatic phosphite, and water is added to the reaction solution under heating to hydrolyze the remaining aromatic phosphite. After that, the addition of water is further continued, and the oil layer containing the resin and the aqueous layer are allowed to stand at the stage where the layer separation is started, and the step of removing the upper aqueous layer is included.

(In the formula, m and n are average values, and m + n = 2 to 200. n is a positive number of 0.1 or more. Ar ¹ , Ar ^3, and Ar ² are the formulas (A) and (B). And the same meaning as in formula (C).
The manufacturing method of aromatic polyamide resin represented by these. The production method according to claim 1, wherein diaminodiphenyl ether is used as the compound of formula (A), hydroxyisophthalic acid is used as the compound of formula (B), and isophthalic acid is used as the compound of formula (C). The production method according to claim 1 or 2, wherein a pyridine derivative is used as a reaction catalyst.