JP2002097282A - Method of producing polyamide resin fine powder - Google Patents

Method of producing polyamide resin fine powder

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Publication number
JP2002097282A
JP2002097282A JP2000291364A JP2000291364A JP2002097282A JP 2002097282 A JP2002097282 A JP 2002097282A JP 2000291364 A JP2000291364 A JP 2000291364A JP 2000291364 A JP2000291364 A JP 2000291364A JP 2002097282 A JP2002097282 A JP 2002097282A
Authority
JP
Japan
Prior art keywords
polyamide resin
fine powder
polyamide
solvent
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000291364A
Other languages
Japanese (ja)
Inventor
Makoto Uchida
誠 内田
Minoru Nomichi
稔 野路
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP2000291364A priority Critical patent/JP2002097282A/en
Publication of JP2002097282A publication Critical patent/JP2002097282A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a method of producing high quality polyamide fine powder having high solubility in a solvent, excellent workability with improved dissolving speed in the solvent and improved efficiency of washing and drying by making a polyamide resin into fine powder. SOLUTION: This method of producing polyamide resin fine powder comprises the steps of adding a poor solvent of polyamide resin to a solution of polyamide resin in a solvent to form a slurry of dispersed polyamide resin, adding the slurry to a poor solvent of polyamide resin to convert to a state of dispersed fine powder and obtaining polyamide resin in the form of fine powder.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はポリアミド樹脂微粉
末の製造方法に関し、詳しくは、ポリアミド樹脂分散ス
ラリーを貧溶媒中に添加しポリアミド樹脂微粉末を製造
する方法に関する。
The present invention relates to a method for producing polyamide resin fine powder, and more particularly to a method for producing polyamide resin fine powder by adding a polyamide resin dispersion slurry to a poor solvent.

【0002】[0002]

【従来の技術】溶液重合により得られたポリアミド溶液
や、ワニス調製等で得られたポリアミド溶液からポリア
ミド樹脂を取り出す時、一般にポリアミド溶液を攪拌
し、ポリアミド樹脂が析出するまで貧溶媒を添加する方
法が行われるが、ポリアミド樹脂が塊状となりやすく、
攪拌翼、容器や釜壁等の装置に付着固化しやすいため、
粉末として取り出すことは困難であり、収率が低下し、
生産性に劣る。また、予め用意した貧溶媒を攪拌し、貧
溶媒中にポリアミド溶液を添加する方法も知られている
が、添加するポリアミド溶液の粘度、滴下速度、貧溶媒
の攪拌速度等で析出するポリアミド樹脂の形態が決ま
り、微粉末を得ることは困難である。
2. Description of the Related Art When taking out a polyamide resin from a polyamide solution obtained by solution polymerization or a polyamide solution obtained by varnish preparation, etc., generally, the polyamide solution is stirred and a poor solvent is added until the polyamide resin is precipitated. Is performed, but the polyamide resin tends to be in a lump,
It is easy to adhere and solidify on devices such as stirring blades, containers and kettle walls.
It is difficult to take out as a powder, the yield decreases,
Poor productivity. Further, a method of stirring a poor solvent prepared in advance and adding a polyamide solution to the poor solvent is also known, but the viscosity of the polyamide solution to be added, the dropping speed, the stirring speed of the poor solvent, etc. The form is determined and it is difficult to obtain a fine powder.

【0003】[0003]

【発明が解決しようとする課題】ポリアミド樹脂を微粉
末とすることで、洗浄および乾燥の効率が向上する。更
に加工時の溶媒への溶解速度が向上し、作業性に優れる
ことが期待できる。本発明は溶媒溶解性に優れた高品質
なポリアミド樹脂微粉末を製造することを目的としたも
のである。
The fineness of the polyamide resin improves the efficiency of washing and drying. Further, it is expected that the dissolution rate in the solvent at the time of processing is improved and the workability is excellent. An object of the present invention is to produce a high-quality fine polyamide resin powder having excellent solvent solubility.

【0004】[0004]

【課題を解決するための手段】本発明者らは、上記課題
を解決するため、鋭意研究の結果、洗浄および乾燥効率
がよく、極めて高品質で、溶媒溶解性が良好なポリアミ
ド樹脂微粉末の製造方法を見出した。すなわち本発明
は、(1)ポリアミド樹脂が溶媒に溶解したポリアミド
溶液に、ポリアミド樹脂の貧溶媒を加えポリアミド樹脂
分散スラリーを調製した後、そのスラリーをポリアミド
樹脂の貧溶媒中に添加し、微粉末分散状態とすることで
ポリアミド樹脂を微粉末状で得ることを特徴とするポリ
アミド樹脂微粉末の製造方法、(2)ポリアミド溶液が
10〜50重量%ポリアミド樹脂を含有することを特徴
とする上記(1)記載の製造方法。(3)ポリアミド樹
脂の対数粘度がN,N−ジメチルアセトアミド溶媒で3
0℃の時、0.2〜1.2g/dlであることを特徴と
する上記(1)又は(2)記載の製造方法、(4)ポリ
アミド樹脂分散スラリーを−10〜25℃に冷却し、ポ
リアミド樹脂の貧溶媒中に添加することを特徴とす上記
(1)、(2)、又は(3)のいずれか1項に記載の製
造方法、(5)ポリアミドが主鎖に芳香族基を含有する
芳香族含有ポリアミドであることを特徴とする上記
(1)、(2)、(3)、又は(4)のいずれか1項に
記載の製造方法、(6)ポリアミド樹脂が構造中にエラ
ストマーを含有するゴム変性ポリアミドであることを特
徴とする上記(1)、(2)、(3)、(4)、又は
(5)のいずれか1項に記載の製造方法に関する。
Means for Solving the Problems In order to solve the above-mentioned problems, the present inventors have conducted intensive studies, and as a result, have found that a fine polyamide resin powder having good washing and drying efficiencies, extremely high quality and good solvent solubility is obtained. A manufacturing method was found. That is, the present invention relates to (1) a method of preparing a polyamide resin dispersion slurry by adding a poor solvent for a polyamide resin to a polyamide solution in which a polyamide resin is dissolved in a solvent, adding the slurry to the poor solvent for the polyamide resin, (2) A method for producing a polyamide resin fine powder characterized by obtaining a polyamide resin in a fine powder form by dispersing the polyamide resin, (2) a polyamide solution containing 10 to 50% by weight of a polyamide resin. 1) The production method according to the above. (3) The logarithmic viscosity of the polyamide resin is 3 in N, N-dimethylacetamide solvent.
The production method according to the above (1) or (2), wherein the slurry is 0.2 to 1.2 g / dl at 0 ° C., and (4) cooling the polyamide resin dispersion slurry to −10 to 25 ° C. The method according to any one of the above (1), (2) or (3), wherein the polyamide is added to a poor solvent of the polyamide resin. The method according to any one of the above (1), (2), (3) or (4), wherein the polyamide resin comprises The present invention relates to the production method according to any one of the above (1), (2), (3), (4) and (5), which is a rubber-modified polyamide containing an elastomer.

【0005】[0005]

【発明の実施の形態】本発明におけるポリアミド樹脂が
溶媒に溶解したポリアミド溶液は、ジカルボン酸とジア
ミン、および/または構造中にカルボン酸とアミンを1
つずつ有する化合物を原料とし、重縮合反応により生成
するポリアミド樹脂と、該ポリアミド樹脂が可溶な溶媒
とを必須成分とし、原料、縮合剤、副生物、触媒、添加
剤等を含有し得る溶液であり、ポリアミド樹脂構造に関
して特に制限はないが、芳香族または脂肪族ジカルボン
酸と芳香族または脂肪族ジアミンとの重縮合反応により
生成するポリアミド樹脂が好ましい。
BEST MODE FOR CARRYING OUT THE INVENTION A polyamide solution in which a polyamide resin according to the present invention is dissolved in a solvent contains a dicarboxylic acid and a diamine and / or a carboxylic acid and an amine in the structure.
A solution that can contain a raw material, a condensing agent, by-products, a catalyst, additives, and the like, using a compound having one by one as a raw material, a polyamide resin produced by a polycondensation reaction, and a solvent in which the polyamide resin is soluble as essential components. The polyamide resin structure is not particularly limited, but a polyamide resin formed by a polycondensation reaction between an aromatic or aliphatic dicarboxylic acid and an aromatic or aliphatic diamine is preferable.

【0006】用い得る芳香族ジカルボン酸の具体例とし
ては、フタル酸、イソフタル酸、テレフタル酸、ベンゼ
ン二酢酸、ベンゼンジプロピオン酸、ビフェニルジカル
ボン酸、オキシジ安息香酸、チオジ安息香酸、ジチオジ
安息香酸、ジチオビス(ニトロ安息香酸)、カルボニル
ジ安息香酸、スルホニルジ安息香酸、ナフタレンジカル
ボン酸、メチレンジ安息香酸、イソプロピリデンジ安息
香酸、ヘキサフルオロイソプロピリデンジ安息香酸、ピ
リジンジカルボン酸、ヒドロキシイソフタル酸、ヒドロ
キシテレフタル酸、ジヒドロキシイソフタル酸や、ジヒ
ドロキシテレフタル酸などが挙げられ、中でもイソフタ
ル酸とヒドロキシイソフタル酸が好ましい。
Specific examples of the aromatic dicarboxylic acids that can be used include phthalic acid, isophthalic acid, terephthalic acid, benzene diacetate, benzene dipropionic acid, biphenyl dicarboxylic acid, oxydibenzoic acid, thiodibenzoic acid, dithiodibenzoic acid, and dithiobis. (Nitrobenzoic acid), carbonyldibenzoic acid, sulfonyldibenzoic acid, naphthalenedicarboxylic acid, methylenedibenzoic acid, isopropylidenedibenzoic acid, hexafluoroisopropylidenedibenzoic acid, pyridinedicarboxylic acid, hydroxyisophthalic acid, hydroxyterephthalic acid, Examples thereof include dihydroxyisophthalic acid and dihydroxyterephthalic acid. Of these, isophthalic acid and hydroxyisophthalic acid are preferable.

【0007】用い得る脂肪族ジカルボン酸の具体例とし
ては、シュウ酸、マロン酸、メチルマロン酸、コハク
酸、グルタル酸、アジピン酸、マレイン酸、フマル酸、
りんご酸、酒石酸、(メタ)アクリロイルオキシコハク
酸、ジ(メタ)アクリロイルオキシコハク酸、(メタ)
アクリロイルオキシりんご酸、(メタ)アクリルアミド
コハク酸や、(メタ)アクリルアミドりんご酸などが挙
げられる。
Specific examples of the aliphatic dicarboxylic acid that can be used include oxalic acid, malonic acid, methylmalonic acid, succinic acid, glutaric acid, adipic acid, maleic acid, fumaric acid,
Malic acid, tartaric acid, (meth) acryloyloxysuccinic acid, di (meth) acryloyloxysuccinic acid, (meth)
Acryloyloxymalic acid, (meth) acrylamide succinic acid, (meth) acrylamide malic acid, and the like are included.

【0008】用い得る芳香族ジアミンの具体例として
は、ジアミノベンゼン、ジアミノトルエン、ジアミノジ
メチルベンゼン、ジアミノメシチレン、ジアミノクロロ
ベンゼン、ジアミノニトロベンゼン、ジアミノアゾベン
ゼン、ジアミノナフタレン、ジアミノビフェニル、ジア
ミノジメトキシビフェニル、ジアミノジフェニルエーテ
ル、ジアミノジメチルジフェニルエーテル、メチレンジ
アニリン、メチレンビス(メチルアニリン)、メチレン
ビス(ジメチルアニリン)、メチレンビス(メトキシア
ニリン)、メチレンビス(ジメトキシアニリン)、メチ
レンビス(エチルアニリン)、メチレンビス(ジエチル
アニリン)、メチレンビス(エトキシアニリン)、メチ
レンビス(ジエトキシアニリン)、メチレンビス(ジブ
ロモアニリン)、イソプロピリデンジアニリン、ヘキサ
フルオロイソプロピリデンジアニリン、、ジアミノベン
ゾフェノン、ジアミノジメチルベンゾフェノン、ジアミ
ノアントラキノン、ジアミノジフェニルチオエーテル、
ジアミノジメチルジフェニルチオエーテル、ジアミノジ
フェニルスルホン、ジアミノジフェニルスルホキシド
や、ジアミノフルオレンなどが挙げられ、中でもジアミ
ノジフェニルエーテルとメチレンビス(ジエチルアニリ
ン)が好ましい。
Specific examples of the aromatic diamine that can be used include diaminobenzene, diaminotoluene, diaminodimethylbenzene, diaminomesitylene, diaminochlorobenzene, diaminonitrobenzene, diaminoazobenzene, diaminonaphthalene, diaminobiphenyl, diaminodimethoxybiphenyl, diaminodiphenylether, diaminodiphenylether, Dimethyldiphenyl ether, methylenedianiline, methylenebis (methylaniline), methylenebis (dimethylaniline), methylenebis (methoxyaniline), methylenebis (dimethoxyaniline), methylenebis (ethylaniline), methylenebis (diethylaniline), methylenebis (ethoxyaniline), methylenebis (Diethoxyaniline), methylenebis (dibromoaniline), i Pro pyridinium Denji aniline, hexafluoro isopropylidene aniline ,, diaminobenzophenone, diamino dimethyl benzophenone, diaminoanthraquinone, diaminodiphenyl thioether,
Examples thereof include diaminodimethyldiphenylthioether, diaminodiphenylsulfone, diaminodiphenylsulfoxide, and diaminofluorene. Of these, diaminodiphenylether and methylenebis (diethylaniline) are preferable.

【0009】用い得る脂肪族ジアミンの具体例として
は、エチレンジアミン、プロパンジアミン、ヒドロキシ
プロパンジアミン、ブタンジアミン、ヘプタンジアミ
ン、ヘキサンジアミン、ジアミノジエチルアミン、ジア
ミノジプロピルアミン、シクロペンタンジアミン、シク
ロヘキサンジアミン、アザペンタンジアミンや、トリア
ザウンデカンジアミンなどが挙げられる。
Specific examples of the aliphatic diamine which can be used include ethylenediamine, propanediamine, hydroxypropanediamine, butanediamine, heptanediamine, hexanediamine, diaminodiethylamine, diaminodipropylamine, cyclopentanediamine, cyclohexanediamine, azapentanediamine And triazaundecanediamine.

【0010】上記重縮合反応により得られたポリアミド
樹脂を更にゴム変性、(メタ)アクリル変性や、エポキ
シ変性等を行っても良い。ゴム変性は、末端アミンのポ
リアミドと末端カルボン酸のエラストマーまたは、末端
カルボン酸のポリアミドと末端アミンのエラストマーと
を更に重縮合することで変性できる。エラストマーの具
体例としては、ポリブタジエン、ブタジエン−アクリロ
ニトリル共重合体、スチレン−ブタジエン共重合体、ポ
リウレタンや、シリコーンゴムなどが挙げられ、中でも
末端アミンのポリアミドを末端カルボン酸のブタジエン
−アクリロニトリル共重合体で変性したものが好まし
い。
The polyamide resin obtained by the above polycondensation reaction may be further subjected to rubber modification, (meth) acrylic modification, epoxy modification and the like. The rubber modification can be performed by further polycondensing the polyamide of the terminal amine and the elastomer of the terminal carboxylic acid, or the polyamide of the terminal carboxylic acid and the elastomer of the terminal amine. Specific examples of the elastomer include polybutadiene, butadiene-acrylonitrile copolymer, styrene-butadiene copolymer, polyurethane, and silicone rubber.In particular, a polyamide having a terminal amine is a butadiene-acrylonitrile copolymer having a terminal carboxylic acid. Modified ones are preferred.

【0011】ポリアミド溶液中に含有し得る原料は未反
応原料を示し、縮合剤は重縮合反応で用いた物を示す。
縮合剤の具体例としては、亜リン酸トリフェニル、亜リ
ン酸ジフェニル、亜リン酸トリ−o−トリル、亜リン酸
ジ−o−トリル、亜リン酸トリ−m−トリル、亜リン酸
ジ−m−トリル、亜リン酸トリ−p−トリル、亜リン酸
ジ−p−トリルや、亜リン酸トリ−p−クロロフェニル
などが挙げられる。また、副生物は使用した縮合剤の分
解物、分解物の酸化および他変性物や、オリゴ等のアミ
ド化合物等を示し、触媒、添加剤はピリジン等の三級ア
ミン類、塩化リチウム等の無機塩類や、安定化剤等、本
製造方法を行う前にポリアミド溶液に添加したものを示
す。
The raw materials that can be contained in the polyamide solution represent unreacted raw materials, and the condensing agents represent those used in the polycondensation reaction.
Specific examples of the condensing agent include triphenyl phosphite, diphenyl phosphite, tri-o-tolyl phosphite, di-o-tolyl phosphite, tri-m-tolyl phosphite, and di-phosphite phosphite. -M-tolyl, tri-p-tolyl phosphite, di-p-tolyl phosphite, tri-p-chlorophenyl phosphite and the like. In addition, by-products include decomposed products of the condensing agent used, oxidation and other modified products of the decomposed products, amide compounds such as oligos, etc., and catalysts and additives are tertiary amines such as pyridine and inorganic compounds such as lithium chloride. The following shows salts, stabilizers, and the like added to the polyamide solution before performing this production method.

【0012】ポリアミド樹脂が可溶な溶媒は、用いるポ
リアミド樹脂と溶媒和を起こす溶媒であれば特に制限は
ないが、具体例としては、N,N−ジメチルホルムアミ
ド、N,N−ジメチルアセトアミド、N−メチル−2−
ピロリドン、ジメチルスルホキシドなどや、これらの混
合溶媒、これらを含有する溶媒が挙げられる。また、ポ
リアミド溶液中のポリアミド樹脂の濃度は、10〜50
重量%が好ましく、生産効率と操作性の良い溶液粘度と
を考慮すると、15〜30重量%が特に好ましい。尚、
用いるポリアミド樹脂の対数粘度は、N,N−ジメチル
アセトアミド溶媒で30℃の時、0.2〜1.2g/d
lが好ましく、0.4〜0.8g/dlが特に好まし
い。
The solvent in which the polyamide resin is soluble is not particularly limited as long as it is a solvent that causes solvation with the polyamide resin to be used. Specific examples thereof include N, N-dimethylformamide, N, N-dimethylacetamide, N -Methyl-2-
Examples thereof include pyrrolidone and dimethyl sulfoxide, a mixed solvent thereof, and a solvent containing these. The concentration of the polyamide resin in the polyamide solution is 10 to 50.
% By weight, and particularly preferably 15 to 30% by weight in consideration of the production efficiency and the solution viscosity with good operability. still,
The logarithmic viscosity of the polyamide resin used is 0.2 to 1.2 g / d at 30 ° C. in an N, N-dimethylacetamide solvent.
1 is preferable, and 0.4 to 0.8 g / dl is particularly preferable.

【0013】本発明におけるポリアミド樹脂分散スラリ
ーとは、均一透明なポリアミド溶液にポリアミド樹脂の
貧溶媒を徐々に加えて行った時、ポリマー同士が凝集し
可視光を散乱し始め、攪拌下で均一に濁り始めた状態か
ら、貧溶媒を更に加えても濁り具合が変化しなくなる状
態までをいう。これ以上貧溶媒を添加するとスラリーの
粘度は減少するが、それに伴い析出したポリアミド樹脂
が塊状になるため好ましくない。ポリアミド樹脂分散ス
ラリーの調製に用いる貧溶媒は、用いるポリアミド樹脂
と溶媒和を起こし難い溶媒であれば特に制限はないが、
具体例としては、水、メタノール、エタノールなどや、
これらの混合溶媒、これらを含有する溶媒が挙げられ
る。また、これら貧溶媒の量で、ポリアミド樹脂微粉末
の粒径は、1μm〜1mmの範囲である程度制御でき、
添加する貧溶媒の好ましい量は、最終的に得られるポリ
アミド樹脂粉末の状態で決定される。例えば、N,N−
ジメチルアセトアミド溶媒で30℃の時、0.4〜0.
6g/dlの対数粘度を示すポリアミド樹脂が、N−メ
チルピロリドンに18重量%溶解したポリアミド溶液1
00gに対し、メタノール31gと水24gの混合溶媒
を添加し、ポリアミド樹脂分散スラリーを調製し、その
後このスラリーを貧溶媒中に添加した場合に得られるポ
リアミド樹脂微粉末の平均粒径は20〜50μmであ
る。また、ポリアミド樹脂分散スラリーを調製する時、
攪拌翼、容器や釜壁等の装置に付着固化を防ぐため、−
10〜25℃、好ましくは0〜10℃に冷却すると良
い。
[0013] The polyamide resin dispersion slurry in the present invention means that when a poor solvent for the polyamide resin is gradually added to a uniform and transparent polyamide solution, the polymers coagulate and begin to scatter visible light. It refers to the state from the beginning of turbidity to the state where turbidity does not change even if a poor solvent is further added. If the poor solvent is added more than this, the viscosity of the slurry decreases, but the precipitated polyamide resin is undesirably formed as a mass. The poor solvent used for preparing the polyamide resin dispersion slurry is not particularly limited as long as it is a solvent that hardly causes solvation with the polyamide resin used,
Specific examples include water, methanol, ethanol, etc.
These include mixed solvents and solvents containing them. Also, with the amount of these poor solvents, the particle size of the polyamide resin fine powder can be controlled to some extent in the range of 1 μm to 1 mm,
The preferable amount of the poor solvent to be added is determined in the state of the finally obtained polyamide resin powder. For example, N, N-
0.4-0.1 at 30 ° C. with dimethylacetamide solvent.
Polyamide solution 1 in which a polyamide resin having a logarithmic viscosity of 6 g / dl was dissolved in N-methylpyrrolidone at 18% by weight.
To 00 g, a mixed solvent of 31 g of methanol and 24 g of water was added to prepare a polyamide resin dispersion slurry, and then the average particle diameter of the fine polyamide resin powder obtained when this slurry was added in a poor solvent was 20 to 50 μm. It is. Also, when preparing a polyamide resin dispersion slurry,
In order to prevent solidification on devices such as stirring blades, containers and kettle walls,
It is good to cool to 10 to 25 ° C, preferably to 0 to 10 ° C.

【0014】調製したポリアミド樹脂分散スラリーを添
加する貧溶媒も、特に制限はないが、具体例としては、
水、メタノール、エタノールなどや、これらの混合溶
媒、これらを含有する溶媒が挙げられ、ポリアミド樹脂
分散スラリーの調製に用いた貧溶媒と同じでも、異なっ
ていても良い。これら析出させる貧溶媒の量は、添加す
るスラリーに対して2分の1体積量以上が好ましく、析
出した微粉末同士の融着や濾過時の廃液量を考慮する
と、スラリーに対し同量〜3倍量が特に好ましい。ま
た、これら析出させる貧溶媒はあらかじめ容器、釜等に
用意しておき、激しく攪拌しながら、この貧溶媒中にス
ラリーをすばやく添加すると良い。添加の方法は、ポン
プ、重力、圧力差等の利用が考えられ、特に析出させる
容器、釜等を減圧し、圧力差を利用した方法が好まし
い。
The poor solvent to which the prepared slurry of the polyamide resin dispersion is added is not particularly limited.
Examples thereof include water, methanol, ethanol, and the like, a mixed solvent thereof, and a solvent containing these, and may be the same as or different from the poor solvent used for preparing the polyamide resin dispersion slurry. The amount of the poor solvent to be precipitated is preferably equal to or more than a half volume with respect to the slurry to be added. Double amounts are particularly preferred. The poor solvent to be precipitated is prepared in advance in a container, a pot, or the like, and the slurry may be quickly added to the poor solvent with vigorous stirring. As a method of addition, use of a pump, gravity, a pressure difference or the like can be considered. In particular, a method of reducing the pressure of a vessel or a kettle for precipitation and utilizing a pressure difference is preferable.

【0015】得られたポリアミド樹脂微粉末分散液は、
直ちに濾過しても良いが、1時間程度そのまま攪拌する
ことにより、濾過時の微粉末同士の融着を多少抑え得
る。また、場合によっては、濾過前に、16メッシュ程
度の網にポリアミド樹脂微粉末分散液を通しても良い。
The obtained polyamide resin fine powder dispersion is
Although the filtration may be carried out immediately, the stirring of the fine powder during filtration can be suppressed to some extent by stirring the mixture for about 1 hour. In some cases, before the filtration, the polyamide resin fine powder dispersion may be passed through a mesh of about 16 mesh.

【0016】上記濾過で得られたポリアミド樹脂微粉末
は表面積が大きいため、通常の方法で行う洗浄と乾燥で
も、極めて効率が良く、短時間で高純度のポリアミド樹
脂微粉末が得られる。洗浄方法は通常、貧溶媒中での攪
拌、再溶解再沈殿の繰り返しや、ポリアミド樹脂微粉末
分散液を調製後に蒸気を吹込むことで行われるが、水中
で攪拌洗浄した後濾過し、再度ポリアミド樹脂微粉末水
中分散液を調製後に蒸気を吹込む組み合わせが好まし
い。乾燥は、常圧下でも減圧下でも良いが、温度は10
0℃以下で良い。
Since the polyamide resin fine powder obtained by the above filtration has a large surface area, even if washing and drying are carried out by a usual method, a highly purified polyamide resin fine powder can be obtained in a very short time in a very efficient manner. The washing method is usually performed by repeating stirring in a poor solvent, re-dissolution and re-precipitation, or by blowing steam after preparing a polyamide resin fine powder dispersion. A combination in which steam is blown after preparing an aqueous dispersion of resin fine powder is preferable. Drying may be performed under normal pressure or reduced pressure, but the temperature is 10
The temperature may be 0 ° C or less.

【0017】本発明におけるポリアミド樹脂微粉末は、
ポリアミド樹脂が元来有する耐熱性に加え、溶解し得る
溶剤への溶解速度が速く、エポキシ類やアクリル類モノ
マー、オリゴマーや、他ポリマーへの溶解性や相溶性に
優れるため、作業性が良い。その他耐熱性等を損なわな
い範囲で必要に応じて不活性な有機又は無機顔料、染
料、カブリ防止剤、退色防止剤、ハレーション防止剤、
蛍光増白剤、界面活性剤、可塑剤、難燃剤、酸化防止
剤、充填剤、静電防止剤、消泡剤、流動調整剤、促進
剤、遅延剤、光安定剤、防かび剤、抗菌剤、磁性体等を
混合することができる。
The polyamide resin fine powder according to the present invention comprises:
In addition to the inherent heat resistance of the polyamide resin, the dissolution rate in a solvent that can be dissolved is high, and the solubility and compatibility with epoxies and acrylic monomers, oligomers, and other polymers are excellent, so that workability is good. Inactive organic or inorganic pigments, dyes, antifoggants, anti-fading agents, antihalation agents as necessary within a range that does not impair heat resistance, etc.
Optical brighteners, surfactants, plasticizers, flame retardants, antioxidants, fillers, antistatic agents, defoamers, flow regulators, accelerators, retarders, light stabilizers, fungicides, antibacterial Agents, magnetic substances and the like can be mixed.

【0018】また、本発明のポリアミド樹脂微粉末は、
高純度高品質であるため、電気材料等に特に有用であ
り、具体的用途としては、フォトレジスト、液状レジス
ト、電子写真、ダイレクト刷版材料、ホログラム材料、
接着剤、粘着剤、粘接着剤、封止剤、塗料、コーティン
グ剤や、ガラス繊維含浸剤等が挙げられる。
Further, the polyamide resin fine powder of the present invention comprises:
Because of its high purity and high quality, it is particularly useful for electrical materials and the like. Specific applications include photoresist, liquid resist, electrophotography, direct plate materials, hologram materials,
Examples include adhesives, pressure-sensitive adhesives, adhesives, sealants, paints, coating agents, and glass fiber impregnants.

【0019】[0019]

【実施例】以下に実施例によって本発明を更に詳細に説
明するが、本発明はこれらの実施例に限定されるもので
はない。
The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.

【0020】実施例1 温度計、環流冷却器、滴下ロート、窒素導入装置、攪拌
装置のついた500mlの反応器に、イソフタル酸1
0.200g(0.0614モル)、5−ヒドロキシイ
ソフタル酸1.867g(0.0103モル)、3,
4’−ジアミノジフェニルエーテル16.205g
(0.0809モル)と、塩化リチウム1.53gを仕
込み、乾燥窒素を流しながら、N−メチル−2−ピロリ
ドン153.3gと、ピリジン18.00gを加え、攪
拌しながら反応器内が95℃になるまで徐々に加熱し、
固形分を溶解させた。その後、反応器内を攪拌し95℃
に保ち、亜リン酸トリフェニル39.07gを2時間で
滴下し、さらに1時間反応させた。次に、反応器内を9
5℃に保ち、末端カルボン酸ブタジエンアクリロニトリ
ル共重合体(CTBN)25.505g(0.0071
モル)をN−メチル−2−ピロリドン131.7gに溶
解させた溶液全量を1時間で滴下し、さらに2時間反応
させた。その後反応器内を50℃以下に冷却し、ポリア
ミド溶液を調製した。
Example 1 Isophthalic acid was placed in a 500 ml reactor equipped with a thermometer, a reflux condenser, a dropping funnel, a nitrogen introducing device, and a stirring device.
0.200 g (0.0614 mol), 1.867 g (0.0103 mol) of 5-hydroxyisophthalic acid, 3,
16.205 g of 4'-diaminodiphenyl ether
(0.0809 mol) and 1.53 g of lithium chloride, 153.3 g of N-methyl-2-pyrrolidone and 18.00 g of pyridine were added while flowing dry nitrogen, and the reactor was heated to 95 ° C. while stirring. Gradually heat until
The solid was dissolved. Thereafter, the inside of the reactor was stirred at 95 ° C.
, And 39.07 g of triphenyl phosphite was added dropwise over 2 hours, and the mixture was further reacted for 1 hour. Next, 9
Keeping at 5 ° C., 25.505 g (0.0071) of butadiene acrylonitrile carboxylate copolymer (CTBN)
Mol) was dissolved in 131.7 g of N-methyl-2-pyrrolidone in 1 hour, and the mixture was further reacted for 2 hours. Thereafter, the inside of the reactor was cooled to 50 ° C. or lower to prepare a polyamide solution.

【0021】上記ポリアミド溶液を全量1000ml容
器に移し、室温で攪拌しながら、メタノール126gを
加えた後、10℃以下に冷却し、イオン交換水50gを
30分かけて滴下した。その後更に10℃以下で1時間
攪拌し、ポリアミド樹脂分散スラリーを調製した。
The above polyamide solution was transferred to a 1000 ml container, and 126 g of methanol was added with stirring at room temperature. After cooling to 10 ° C. or lower, 50 g of ion-exchanged water was added dropwise over 30 minutes. Thereafter, the mixture was further stirred at 10 ° C. or lower for 1 hour to prepare a polyamide resin dispersion slurry.

【0022】2000ml容器にイオン交換水700g
を仕込み、室温で攪拌しながら、前記ポリアミド樹脂分
散スラリーを1分程度で加え、ポリアミド樹脂微粉末分
散液を得た。その後さらに室温で1時間攪拌し、ポリア
ミド樹脂微粉末分散液を濾過した後、1000ml容器
にイオン交換水500gを仕込み、攪拌しながら、前記
濾過して得られたポリアミド樹脂微粉末を徐々に加え、
再分散させ、室温で30分攪拌洗浄した後、濾過した。
700 g of ion-exchanged water in a 2000 ml container
And the above-mentioned polyamide resin dispersion slurry was added in about 1 minute while stirring at room temperature to obtain a polyamide resin fine powder dispersion. Thereafter, the mixture was further stirred at room temperature for 1 hour, and after filtering the polyamide resin fine powder dispersion, 500 g of ion-exchanged water was charged into a 1000 ml container, and while stirring, the polyamide resin fine powder obtained by the filtration was gradually added.
It was redispersed, washed with stirring at room temperature for 30 minutes, and then filtered.

【0023】温度計、分留装置、水蒸気導入口、攪拌装
置のついた1000mlの反応器に、前記濾過して得ら
れた水洗後のポリアミド樹脂微粉末と、イオン交換水5
00gを加え、攪拌しながら反応器内が95℃になるま
で徐々に加熱た。その後加熱を停止し、反応器内を攪拌
しながら、水蒸気を150g/時間程度で約24時間吹
込み、洗浄を行った。分留装置より留出する液量は、
3,600gであった。その後、反応器内を50℃以下
に冷却した後、濾過した。
Into a 1000 ml reactor equipped with a thermometer, a fractionator, a steam inlet and a stirrer, the water-washed polyamide resin fine powder obtained by filtration and ion-exchanged water
The reactor was gradually heated to 95 ° C. while stirring. Thereafter, the heating was stopped, and steam was blown at a rate of about 150 g / hour for about 24 hours while stirring the inside of the reactor to perform washing. The amount of liquid distilled from the fractionator is
It was 3,600 g. Thereafter, the inside of the reactor was cooled to 50 ° C. or lower, and then filtered.

【0024】濾過して得られた水蒸気洗浄後のポリアミ
ド樹脂微粉末を、75℃で72時間熱風乾燥し、目的と
するポリアミド樹脂微粉末を得た(収率96%)。この
ポリアミド樹脂微粉末平均粒径は38μmであった。ま
た、このポリアミド樹脂微粉末0.100gをN,N−
ジメチルアセトアミド20.0mlに溶解させ、30℃
で測定した対数粘度は、0.47dl/gであった。
The steam-washed polyamide resin fine powder obtained by filtration was dried with hot air at 75 ° C. for 72 hours to obtain the desired polyamide resin fine powder (yield: 96%). The average particle size of the polyamide resin fine powder was 38 μm. Further, 0.100 g of this polyamide resin fine powder was added to N, N-
Dissolved in 20.0 ml of dimethylacetamide, 30 ° C
Was 0.47 dl / g.

【0025】実施例2 温度計、環流冷却器、滴下ロート、窒素導入装置、攪拌
装置のついた500mlの反応器に、イソフタル酸1
6.61g(0.0614モル)、3,4’−ジアミノ
ジフェニルエーテル20.62g(0.0809モル)
と、塩化リチウム1.96gを仕込み、乾燥窒素を流し
ながら、N−メチル−2−ピロリドン196.0gと、
ピリジン23.04gを加え、攪拌しながら反応器内が
95℃になるまで徐々に加熱し、固形分を溶解させた。
その後、反応器内を攪拌し95℃に保ち、亜リン酸トリ
フェニル50.00gを2時間で滴下し、さらに1時間
反応させた。次に、反応器内を95℃に保ち、アクリル
酸7.00g(0.0071モル)を1時間で滴下し、
さらに2時間反応させた。その後反応器内を50℃以下
に冷却し、ポリアミド溶液を調製した。
Example 2 Isophthalic acid 1 was placed in a 500 ml reactor equipped with a thermometer, a reflux condenser, a dropping funnel, a nitrogen introducing device, and a stirring device.
6.61 g (0.0614 mol), 20.62 g (0.0809 mol) of 3,4'-diaminodiphenyl ether
And 1.96 g of lithium chloride, and 196.0 g of N-methyl-2-pyrrolidone while flowing dry nitrogen.
23.04 g of pyridine was added, and the reactor was gradually heated to 95 ° C. with stirring to dissolve solids.
Thereafter, the inside of the reactor was stirred and maintained at 95 ° C., and 50.00 g of triphenyl phosphite was added dropwise over 2 hours, and the reaction was further performed for 1 hour. Next, while keeping the inside of the reactor at 95 ° C., 7.00 g (0.0071 mol) of acrylic acid was added dropwise over 1 hour.
The reaction was further performed for 2 hours. Thereafter, the inside of the reactor was cooled to 50 ° C. or lower to prepare a polyamide solution.

【0026】上記ポリアミド溶液を全量1000ml容
器に移し、室温で攪拌しながら、メタノール126gを
加えた後、10℃以下に冷却し、イオン交換水50gを
30分かけて滴下した。その後更に10℃以下で1時間
攪拌し、ポリアミド樹脂分散スラリーを調製した。
The above polyamide solution was transferred to a 1000 ml container, and 126 g of methanol was added with stirring at room temperature. After cooling to 10 ° C. or lower, 50 g of ion-exchanged water was added dropwise over 30 minutes. Thereafter, the mixture was further stirred at 10 ° C. or lower for 1 hour to prepare a polyamide resin dispersion slurry.

【0027】2000ml容器にイオン交換水700g
を仕込み、室温で攪拌しながら、前記ポリアミド樹脂分
散スラリーを1分程度で加え、ポリアミド樹脂微粉末分
散液を得た。その後さらに室温で1時間攪拌し、ポリア
ミド樹脂微粉末分散液を濾過した後、1000ml容器
にイオン交換水500gを仕込み、攪拌しながら、前記
濾過して得られたポリアミド樹脂微粉末を徐々に加え、
再分散させ、室温で30分攪拌洗浄した後、濾過した。
700 g of ion-exchanged water in a 2000 ml container
And the above-mentioned polyamide resin dispersion slurry was added in about 1 minute while stirring at room temperature to obtain a polyamide resin fine powder dispersion. Thereafter, the mixture was further stirred at room temperature for 1 hour, and after filtering the polyamide resin fine powder dispersion, 500 g of ion-exchanged water was charged into a 1000 ml container, and while stirring, the polyamide resin fine powder obtained by the filtration was gradually added.
It was redispersed, washed with stirring at room temperature for 30 minutes, and then filtered.

【0028】温度計、分留装置、水蒸気導入口、攪拌装
置のついた1000mlの反応器に、前記濾過して得ら
れた水洗後のポリアミド樹脂微粉末と、イオン交換水5
00gを加え、攪拌しながら反応器内が95℃になるま
で徐々に加熱た。その後加熱を停止し、反応器内を攪拌
しながら、水蒸気を150g/時間程度で約24時間吹
込み、洗浄を行った。分留装置より留出する液量は、
3,600gであった。その後、反応器内を50℃以下
に冷却した後、濾過した。
Into a 1000 ml reactor equipped with a thermometer, a fractionator, a steam inlet, and a stirrer, the water-washed polyamide resin fine powder obtained by filtration and ion-exchanged water
The reactor was gradually heated to 95 ° C. while stirring. Thereafter, the heating was stopped, and steam was blown at a rate of about 150 g / hour for about 24 hours while stirring the inside of the reactor to perform washing. The amount of liquid distilled from the fractionator is
It was 3,600 g. Thereafter, the inside of the reactor was cooled to 50 ° C. or lower, and then filtered.

【0029】濾過して得られた水蒸気洗浄後のポリアミ
ド樹脂微粉末を、75℃で72時間熱風乾燥し、目的と
するポリアミド樹脂微粉末を得た(収率96%)。この
ポリアミド樹脂微粉末平均粒径は38μmであった。ま
た、このポリアミド樹脂微粉末0.100gをN,N−
ジメチルアセトアミド20.0mlに溶解させ、30℃
で測定した対数粘度は、0.47dl/gであった。
The polyamide resin fine powder after the water vapor washing obtained by filtration was dried with hot air at 75 ° C. for 72 hours to obtain the desired polyamide resin fine powder (96% yield). The average particle size of the polyamide resin fine powder was 38 μm. Further, 0.100 g of this polyamide resin fine powder was added to N, N-
Dissolved in 20.0 ml of dimethylacetamide, 30 ° C
Was 0.47 dl / g.

【0030】[0030]

【発明の効果】本発明によれば従来困難であったポリア
ミド樹脂の微粉末を容易に調製することができ、ポリア
ミド樹脂を工業的に製造する祭の作業性が大幅に改善す
ることができる。
According to the present invention, fine powder of polyamide resin, which has been difficult in the past, can be easily prepared, and the workability of festivals for industrially producing polyamide resin can be greatly improved.

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】ポリアミド樹脂が溶媒に溶解したポリアミ
ド溶液に、ポリアミド樹脂の貧溶媒を加えポリアミド樹
脂分散スラリーを調製した後、そのスラリーをポリアミ
ド樹脂の貧溶媒中に添加し、微粉末分散状態とすること
でポリアミド樹脂を微粉末状で得ることを特徴とするポ
リアミド樹脂微粉末の製造方法。
A polyamide resin-dispersed slurry is prepared by adding a polyamide resin poor solvent to a polyamide solution in which a polyamide resin is dissolved in a solvent, and then the slurry is added to the polyamide resin poor solvent to obtain a fine powder dispersion state. A method for producing a fine polyamide resin powder, comprising: obtaining a polyamide resin in the form of fine powder.
【請求項2】ポリアミド溶液が10〜50重量%ポリア
ミド樹脂を含有することを特徴とする請求項1記載の製
造方法。
2. The method according to claim 1, wherein the polyamide solution contains 10 to 50% by weight of a polyamide resin.
【請求項3】ポリアミド樹脂の対数粘度がN,N−ジメ
チルアセトアミド溶媒で30℃の時、0.2〜1.2g
/dlであることを特徴とする請求項1又は2記載の製
造方法。
3. A polyamide resin having an logarithmic viscosity of 0.2 to 1.2 g at 30 ° C. in an N, N-dimethylacetamide solvent.
3. The method according to claim 1, wherein the ratio is / dl.
【請求項4】ポリアミド樹脂分散スラリーを−10〜2
5℃に冷却し、ポリアミド樹脂の貧溶媒中に添加するこ
とを特徴とする請求項1、2、又は3のいずれか1項に
記載の製造方法。
4. A polyamide resin dispersed slurry of -10 to 2
The method according to any one of claims 1, 2, or 3, wherein the method is cooled to 5 ° C and added to a poor solvent for the polyamide resin.
【請求項5】ポリアミド樹脂が主鎖に芳香族基を含有す
る芳香族含有ポリアミド樹脂であることを特徴とする請
求項1、2、3、又は4のいずれか1項に記載の製造方
法。
5. The method according to claim 1, wherein the polyamide resin is an aromatic-containing polyamide resin having an aromatic group in the main chain.
【請求項6】ポリアミド樹脂が構造中にエラストマーを
含有するゴム変性ポリアミド樹脂であることを特徴とす
る請求項1、2、3、4、又は5のいずれか1項に記載
の製造方法。
6. The method according to claim 1, wherein the polyamide resin is a rubber-modified polyamide resin containing an elastomer in the structure.
JP2000291364A 2000-09-26 2000-09-26 Method of producing polyamide resin fine powder Pending JP2002097282A (en)

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Publication Number Publication Date
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Family

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Country Link
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004123811A (en) * 2002-09-30 2004-04-22 Jsr Corp Polymer recovery method
JP2006045529A (en) * 2004-07-01 2006-02-16 Nippon Kayaku Co Ltd Process for production of polyamide resin powder
JP2008127495A (en) * 2006-11-22 2008-06-05 Teijin Ltd Process for producing wholly aromatic polyamide particle
JP2009102660A (en) * 2009-02-10 2009-05-14 Nippon Kayaku Co Ltd Method for purifying polyamide resin
JP2014109022A (en) * 2012-12-04 2014-06-12 Maruzen Petrochem Co Ltd Purification method of resin for photolithography

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004123811A (en) * 2002-09-30 2004-04-22 Jsr Corp Polymer recovery method
JP2006045529A (en) * 2004-07-01 2006-02-16 Nippon Kayaku Co Ltd Process for production of polyamide resin powder
JP2008127495A (en) * 2006-11-22 2008-06-05 Teijin Ltd Process for producing wholly aromatic polyamide particle
JP2009102660A (en) * 2009-02-10 2009-05-14 Nippon Kayaku Co Ltd Method for purifying polyamide resin
JP2014109022A (en) * 2012-12-04 2014-06-12 Maruzen Petrochem Co Ltd Purification method of resin for photolithography
TWI583712B (en) * 2012-12-04 2017-05-21 丸善石油化學股份有限公司 Method for purifying resin for photolithography

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