JP2006120771A - Device and method for chip pickup - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip pickup device and a chip pickup method for picking up a chip without giving damage to the chip at a higher speed. <P>SOLUTION: In the chip pickup method for picking up the chip 6 attached to a sheet 5 by attracting and holding the same with an extracting nozzle 20 including an aperture 20a for vacuum attraction, the chip 6 is attracted and held by the extracting nozzle 20 by extracting the chip 6 so that the position of the aperture 20a is offset from the gravity position of the chip based on the position detecting result of the chip 6, and then vacuum-attracting the chip from the aperture 20a by relatively positioning the chip to the nozzle 20. Accordingly, the chip 6 can be separated without a force from the sheet 5 from the side of the end surface, and the chip 6 can also be picked up without giving damage at a higher speed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a chip pick-up apparatus and a pick-up method for picking up a chip cut out from a wafer and attached to a sheet.

In the manufacturing process of a semiconductor device, a semiconductor chip is cut out from a wafer composed of a large number of individual chips. The individual chips are cut out with the wafer attached to an adhesive sheet, and the cut individual chips are peeled off from the sheet and picked up (see, for example, Patent Document 1). In this pickup operation, the chip is picked up and held by the pick-up head while being peeled from the sheet by pushing up the chip from the lower face side of the sheet by the ejector while the sheet is sucked from the lower face side.
Japanese Patent No. 2679266

  With recent miniaturization of electronic components, chips tend to be thinner, and ultra-thin chips of 100 μm or less have come into practical use. However, such a thinned chip is difficult to handle because it is low in rigidity, easily bent, and extremely easily damaged. For this reason, it is difficult to achieve high-speed and high-efficiency pickup operations, and damage such as chip breakage or chipping may occur in the pickup operation for taking out individual chips from the wafer.

  Therefore, an object of the present invention is to provide a chip pickup apparatus and a pickup method that can pick up a chip at high speed without causing damage.

  The chip pick-up device of the present invention is a chip pick-up device for picking up and picking up a chip affixed to a sheet with a pick-up nozzle having an opening for vacuum suction, and supporting the sheet from below A position detection unit that detects the position of the chip by imaging the chip from above, and the position of the opening is offset from the position of the center of gravity of the chip based on the detection result of the position detection unit. Positioning means for positioning the tip relative to the take-out nozzle, suction means for sucking and holding the tip to the take-out nozzle by vacuum suction from the opening, and nozzle lifting / lowering means for raising and lowering the take-out nozzle And with.

  The chip pick-up method of the present invention is a chip pick-up method for picking up a chip affixed to a sheet by sucking and holding it with a take-out nozzle having an opening for vacuum suction, and supporting the sheet from below. A step of detecting the position of the chip by imaging the chip from above, and the position of the opening is offset from the position of the center of gravity of the chip based on the detection result of the position detection process. A positioning step for positioning the tip relative to the take-out nozzle, a nozzle lowering step for lowering the take-out nozzle with respect to the sheet, and a vacuum suction from the opening to make the tip into the take-out nozzle A suction step for sucking and holding, and a nozzle raising step for raising the take-out nozzle.

According to the present invention, the chip is taken out from the end surface side by vacuum suction from the opening while the position of the vacuum suction opening is offset from the center of gravity of the chip, and the chip is taken out and held by the nozzle. It can be peeled from the sheet, and the chip can be picked up at high speed without causing damage.

(Embodiment 1)
FIG. 1 is a block diagram showing a configuration of a chip pickup device according to a first embodiment of the present invention, FIG. 2 is a partial sectional view of a sheet peeling mechanism of the chip pickup device according to the first embodiment of the present invention, FIG. FIG. 4 is a process explanatory diagram of the chip pickup method according to the first embodiment of the present invention.

  First, the configuration of the chip pickup device will be described with reference to FIG. This chip pick-up device has a function of picking up a semiconductor chip that has been divided into individual pieces by dicing and stuck to a sheet by picking up and holding it with a take-out nozzle having an opening for vacuum suction. In FIG. 1, the chip supply unit 1 is configured by connecting a holding table 4 on a bracket 3 erected on an XY table 2. The holding table 4 holds a sheet 5 on which a plurality of semiconductor chips 6 (hereinafter simply abbreviated as “chips 6”) are attached. Here, the chip 6 is a thin chip that has been thinned, and has a characteristic that it has low rigidity and is easily bent.

  A sheet peeling mechanism 7 is disposed below the holding table 4. The sheet peeling mechanism 7 has a function of peeling the chip 6 from the sheet 5 in the pickup operation of the chip 6 by the pickup head 8 described below. That is, the chip 6 is peeled off from the upper surface of the sheet 5 by causing the sheet 5 to protrude from the lower surface of the sheet 5. The push-up pin is not essential.

  Above the chip supply unit 1, a pickup head 8 mounted on a moving table 9 is disposed so as to be movable in a horizontal direction. A take-out nozzle 20 is attached to the lower part of the pickup head 8, and the take-out nozzle 20 can be moved up and down by nozzle lifting means built in the pickup head 8. An opening 20a for vacuum suction (see FIG. 3C) is provided on the lower surface of the take-out nozzle 20, and vacuum suction is performed from the opening 20a by driving the suction unit 23 (suction means). The chip 6 can be taken out and held on the nozzle 20 by suction.

  The chip 6 from which the sheet 5 has been peeled is picked up by the take-out nozzle 20 by vacuum suction. Then, the picked-up chip 6 is moved above the substrate holding table 10 together with the take-out nozzle 20 by the movement of the pick-up head 8 by the moving table 9, and by moving the take-out nozzle 20 up and down, the chip 6 is moved to the substrate holding table. 10 is mounted on the substrate 11 held on the substrate 10.

  Above the holding table 4, an imaging unit 12 including a camera 13 is disposed. The imaging unit 12 images the chip 6 on the sheet 5 from above and outputs the imaging result to the image recognition unit 14. The image recognition unit 14 detects the position of the chip 6 by recognizing the imaging result. The imaging unit 12 and the image recognition unit 14 serve as position detection means for imaging the chip 6 held on the sheet 5 and detecting the position. The calculation unit 15 is a CPU, and controls each unit described below by performing various operation processes and calculations by executing a program stored in the storage unit 16.

The storage unit 16 stores various data such as a program necessary for the operation of each unit, the size of the chip 6 to be recognized, arrangement data on the sheet 5, and an offset amount at the time of relative positioning between the chip 6 and the take-out nozzle 20 described later. Remember. The mechanism control unit 17 controls the pickup head 8 and the moving table 9 that moves the pickup head 8, the sheet peeling mechanism 7, and the XY table 2.

  The XY table 2, the holding table 4, the moving table 9, the calculation unit 15, and the mechanism control unit 17 take out the chip to be picked up based on the position detection result of the chip 6 by the position detection means and with respect to the opening 20 a of the nozzle 20. It is a positioning means for relatively positioning. In the present embodiment, as will be described later, the chip 6 is taken out and positioned relative to the nozzle 20 so that the position of the opening 20 a is offset from the position of the center of gravity of the chip 6. The display unit 18 displays a captured image of the chip 6 and a screen at the time of operation / input. The operation / input unit 19 is an input device such as a keyboard, and performs operation input and data input.

  Next, the configuration of the sheet peeling mechanism 7 will be described with reference to FIG. As shown in FIG. 2, the sheet peeling mechanism 7 includes a sheet peeling tool 25, and the upper surface of the sheet peeling tool 25 is a contact support surface 25 a (support portion) that comes into contact with the lower surface of the sheet 5 in the sheet peeling operation. ing. A plurality of suction holes 25b are opened in the contact support surface 25a, and vacuum suction is performed from the suction holes 25b by driving a vacuum suction source 28 communicated with the internal space of the sheet peeling tool 25. By driving the vacuum suction source 28 in a state where the contact support surface 25a is in contact with the lower surface of the sheet 5, the sheet 5 is attracted and held on the contact support surface 25a.

  Inside the sheet peeling tool 25, a push-up pin 26 held vertically by a pin holder 26a is vertically arranged, and the pin holder 26a can be raised and lowered by an elevating drive mechanism 27. By driving the lifting drive mechanism 27, the upper end portion of the push-up pin 26 protrudes above the contact support surface 25a from the suction hole 25b located at the center. In the state where the abutting support surface 25a is in contact with the lower surface of the sheet 5 on which the chip 6 is adhered and held, the push-up pin 26 is protruded, so that the push-up pin 26 that has broken through the sheet 5 as described above becomes the chip 6. , So that the chip 6 can be peeled off from the upper surface of the sheet 5.

  The chip pickup device is configured as described above. Next, a pickup method using this pickup device will be described with reference to FIGS. In FIG. 3A, a chip 6 to be picked up in the pick-up operation is located above the sheet peeling mechanism 7. In this state, the chip 6 to be picked up is not in the normal pick-up position but in the approximate position. Next, as shown in FIG. 3B, the sheet peeling tool 25 is raised to bring the contact support surface 25a (see FIG. 2) into contact with the lower surface of the sheet 5, and the sheet 5 is supported from below (supporting step). ). At this time, the sheet 5 is sucked and held by the suction holes 25b. Next, the position of the chip 6 is detected by imaging the chip 6 to be picked up from above by the camera 13 (position detection step).

  Next, the chip 6 is taken out and positioned relative to the nozzle 20 based on the detection result of this position (positioning step). At this time, as shown in FIG. 3C, positioning is performed by the above-described positioning means so that the center position C of the opening 20a is offset from the gravity center position G of the chip 6 by a predetermined offset amount d. The offset amount d is determined in advance by trial so as to realize an optimum pickup operation, and is stored in the storage unit 16.

Thereafter, as shown in FIG. 4A, the take-out nozzle 20 is lowered with respect to the sheet 5 (nozzle lowering step), and then vacuum suction is performed from the opening 20a, whereby the chip 6 is taken out and held by the nozzle 20. (Suction process). Then, the push-up pin 26 breaks through the sheet 5 to protrude upward, the chip 6 is pushed up from the lower surface side, and the take-out nozzle 20 is raised in synchronization with the push-up operation of the push-up pin 26. At this time, as described above, the chip 6 is displaced by the aforementioned offset amount with respect to the opening 20a.
The suction force due to is concentrated on a position close to the side end face rather than the center of the chip 6.

  That is, at the sticking interface where the chip 6 and the sheet 5 are in contact with each other in the sticking state, the suction force by the opening 20a acts on the side end surface of the chip 6 where mouth opening is most likely to occur. And by this suction force and the pushing-up from the lower side by the pushing-up pin 26, the chip 6 is peeled off from the sheet 5 while opening from one side of the sticking interface. Thereafter, the pickup nozzle 20 is further raised (nozzle raising step), and the chip 6 is completely separated from the sheet 5 to complete the pickup operation.

  In the chip pick-up method described above, in the chip pick-up method in which the chip 6 is peeled off from the sheet 5 by vacuum suction by the take-out nozzle 20 provided with the opening 20a, the position offset from the center of gravity position of the chip 6 Is adsorbed by the opening 20a. Thereby, compared with the conventional method of applying a vacuum suction force in the vicinity of the center of the chip, it is possible to easily generate a mouth opening at the bonding interface between the chip 6 and the sheet 5.

  Therefore, the chip 6 can be peeled off from the sheet 5 without difficulty from the end face side where the mouth is opened in this way, and the chip can be picked up at high speed without causing damage. Thereby, the tact time of the pick-up work can be shortened without deteriorating the quality due to damage during pick-up.

(Embodiment 2)
5 and 7 are explanatory views of the structure of the take-out nozzle used in the chip pickup device according to the second embodiment of the present invention. FIG. 6 is an explanatory diagram of the pickup operation by the chip pickup device according to the second embodiment of the present invention. FIGS. 8 and 9 are process explanatory views of the chip pick-up method according to the second embodiment of the present invention, and FIGS. 10 and 11 are structure explanatory views of the take-out nozzle used in the chip pick-up device according to the second embodiment of the present invention. It is.

  In the first embodiment, in order to facilitate the peeling of the chip 6 from the sheet 5, the relative positions of the take-out nozzle 20 and the chip 6 are offset from each other. However, in the second embodiment, In the take-out nozzle itself, an opening for vacuum suction is provided at a position offset in advance.

  In FIG. 5, the take-out nozzle 21 is attached to the lower portion of the pickup head 8 in the same manner as the take-out nozzle 20 in the first embodiment, and is used for the substantially square chip 6. On the lower surface of the take-out nozzle 21, an opening 21a is opened at a position offset in a diagonal direction from the center of the nozzle (the center position of the lower surface of the take-out nozzle 21 corresponding to the center of gravity position G of the chip 6). As in the first embodiment, the suction part 23 is communicated. Here, the offset amount d from the center of the nozzle to the center position C of the opening 21a is set similarly to the offset amount shown in FIG. 3 in the first embodiment.

  FIG. 6 shows the pick-up operation of the chip 6 by the take-out nozzle 21. In this case, a contact support surface 25a having a configuration different from that of the sheet peeling tool 25 in the first embodiment is used. That is, as shown in FIG. 6B, the position of the push-up pin 26 on the contact support surface 25a is set not in the center of the take-out nozzle 21 but in the vicinity of the suction position by the opening 21a. That is, the position of the push-up pin 26 is also offset in the same direction corresponding to the opening 21a being offset from the nozzle center.

FIG. 7 shows an example in which the configuration in which the vacuum suction opening is offset from the nozzle center position as in the above example is applied to the rectangular chip 6A. That is, the lower surface of the take-out nozzle 22 has a rectangular shape corresponding to the shape of the target chip 6A, and the opening 22a is provided at a position offset from the center of the nozzle. Even in the case of targeting such a rectangular chip 6A, the same effect as the example described above is obtained. This example can also be applied to a substantially square chip.

  Next, a pickup method using this pickup apparatus will be described with reference to FIGS. In FIG. 8A, a chip 6 to be picked up in the pick-up operation is located above the sheet peeling mechanism 7. In this state, the chip 6 to be picked up is not in the normal pick-up position but in the approximate position. Next, as shown in FIG. 8B, the sheet peeling tool 25A is raised so that the contact support surface 25a (see FIG. 2) contacts the lower surface of the sheet 5, and the sheet 5 is supported from below (supporting step). ). Next, the position of the chip 6 is detected by imaging the chip 6 to be picked up from above by the camera 13 (position detection step).

  Next, the chip 6 is taken out and positioned relative to the nozzle 21 based on the position detection result (positioning step). At this time, positioning is performed by the positioning means described above. In the second embodiment, by positioning the center of the take-out nozzle 21 so as to coincide with the position of the center of gravity of the chip 6, as shown in FIG. The center of gravity G is offset by a predetermined offset amount d.

  Thereafter, as shown in FIG. 9A, the take-out nozzle 21 is lowered with respect to the sheet 5 (nozzle lowering step), and then the chip 6 is taken out and held by the nozzle 21 by vacuum suction from the opening 21a. (Suction process). Then, the push-up pin 26 breaks through the sheet 5 to protrude upward, the chip 6 is pushed up from the lower surface side, and the take-out nozzle 20 is raised in synchronization with the push-up operation of the push-up pin 26. At this time, as described above, the tip 6 is displaced by the aforementioned offset amount with respect to the opening 21a. Therefore, as in the first embodiment, the suction force by the opening 21a is at the center of the tip 6. Instead, it acts in a concentrated manner near the side end face.

  That is, at the bonding interface where the chip 6 and the sheet 5 are in contact with each other in the bonded state, the suction force by the opening 21a acts on the side end surface of the chip 6 where mouth opening is most likely to occur. And by this suction force and the pushing-up from the lower side by the pushing-up pin 26, the chip 6 is peeled off from the sheet 5 while opening from one side of the sticking interface. Thereafter, the pick-up nozzle 21 is further raised (nozzle raising step), and the chip 6 is completely separated from the sheet 5 to complete the pickup operation.

  Also in the above-described chip pickup method, the position offset from the center of gravity of the chip 6 is attracted by the opening 21a. As a result, the same effect as in the first embodiment can be obtained, and the suction nozzle 21 can be sucked and held in contact with the entire surface of the chip 6, and the holding state can be stabilized.

  In addition, in the take-out nozzle 21A shown in FIG. 10, in the take-out nozzle 21 shown in FIG. 5, an opening 21b is added to a position corresponding to the vicinity of the center of the chip 6 in addition to the opening 21a. An example is shown. Further, in the take-out nozzle 22A shown in FIG. 11, in the take-out nozzle 22 shown in FIG. 7, an opening 22b is added to a position corresponding to the vicinity of the center of the chip 6A in addition to the opening 22a on the contact surface contacting the chip 6A. An example is shown. In both examples, the openings 21a and 22a are vacuum-sucked by the first suction part 23A, and the openings 21b and 22b are vacuum-sucked by the second suction part 23B.

Thus, in addition to the openings 21a and 22a provided to be offset from the center position of the chip in order to promote the opening of the chip, the openings 21b and 22b for vacuum suction are provided. As described in 1, the chip can be easily peeled and the chip can be held in a stable state. That is, when the chip is separated from the sheet by bringing the take-out nozzle into contact with the chip, only the first suction part 23A is driven and vacuum suction is performed from the openings 21a and 22a. After the chip is peeled off, the second suction part 23b is driven together with the first suction part 23A, and the chip is sucked and held by the openings 21a and 22a and the openings 21b and 22b. That is, the chip is sucked and held at two places, and the holding state by the take-out head is stabilized.

  The chip pick-up device and the pick-up method of the present invention have the effect that the chip can be peeled off from the endlessly from the sheet surface, and the chip can be picked up at high speed without causing damage, and a thin chip is picked up. This is useful for a pickup device as a target of the above.

1 is a block diagram showing a configuration of a chip pickup device according to a first embodiment of the present invention. 1 is a partial cross-sectional view of a sheet peeling mechanism of a chip pickup device according to a first embodiment of the present invention. Process explanatory drawing of the chip pick-up method of Embodiment 1 of this invention Process explanatory drawing of the chip pick-up method of Embodiment 1 of this invention Structure explanatory drawing of the taking-out nozzle used for the chip pick-up apparatus of Embodiment 2 of this invention Explanatory drawing of the pick-up operation | movement by the chip pick-up apparatus of Embodiment 2 of this invention. Structure explanatory drawing of the taking-out nozzle used for the chip pick-up apparatus of Embodiment 2 of this invention Process explanatory drawing of the chip pick-up method of Embodiment 2 of this invention Process explanatory drawing of the chip pick-up method of Embodiment 2 of this invention Structure explanatory drawing of the taking-out nozzle used for the chip pick-up apparatus of Embodiment 2 of this invention Structure explanatory drawing of the taking-out nozzle used for the chip pick-up apparatus of Embodiment 2 of this invention

Explanation of symbols

5 Sheet 6 Chip 7 Sheet peeling mechanism 8 Pickup head 20, 21, 22, 21A, 22A Extraction nozzle 20a, 21a, 22a Opening 23 Suction part

Claims (2)

A chip pick-up device for picking up a chip affixed to a sheet by suction holding with a take-out nozzle having an opening for vacuum suction,
A support unit that supports the sheet from below; a position detection unit that detects the position of the chip by imaging the chip from above; and a position of the opening based on a detection result of the position detection unit. Positioning means for positioning the tip relative to the take-out nozzle so as to be offset from the position of the center of gravity, suction means for sucking and holding the tip to the take-out nozzle by vacuum suction from the opening, A chip pick-up device comprising nozzle lifting / lowering means for lifting / lowering a take-out nozzle. A chip pick-up method for picking up a chip affixed to a sheet by sucking and holding it with a take-out nozzle having an opening for vacuum suction,
A support step for supporting the sheet from below; a position detection step for detecting the position of the chip by imaging the chip from above; and the position of the opening based on the detection result of the position detection step. A positioning step for positioning the chip relative to the take-out nozzle so as to be offset from the center of gravity position, a nozzle lowering step for lowering the take-out nozzle with respect to the sheet, and vacuum suction from the opening A chip pick-up method comprising: a suction step for sucking and holding the chip on the take-out nozzle; and a nozzle raising step for raising the take-out nozzle.

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