JP2006114624A - Electronic component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting device surely detecting troubles such as the fall away of a nozzle for attracting the component, contamination of the tip end of the same or the like. <P>SOLUTION: A condition of the nozzle when it is mounted on a mounting head normally is recorded and retained in a predetermined recording unit (nozzle data master) in the recording device previously as a modeled geometrical data. When the nozzle is exchanged (S01) or when the mounting process of the component is effected (S07), an image data showing the condition of nozzle on the mounting head immediately thereafter is obtained (S03)(S08) to compare the image data with the modeled geometrical data of the nozzle to judge whether the image data are normal or abnormal (S04)(S10). The abnormality is judged immediately and the alarm information of the abnormality of nozzle is effected (S06) when there is abnormality in the nozzle even though it is slight. Therefore, an operator can know immediately that out of service of the device due to the error of component mounting process (S05) is generated by the fault of nozzle condition, thereby coping with the state optimally. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component mounting apparatus that reliably detects problems such as dropout of a nozzle that adsorbs an electronic component and contamination of its tip.

  2. Description of the Related Art Conventionally, there is a component mounting device that operates according to an NC program as a processing device that processes an operation of mounting an electronic component (hereinafter simply referred to as a component) on a printed circuit board (hereinafter simply referred to as a substrate). Some of them are extremely large, and there is a component mounting device that can mount various types of components on a board with a complicated circuit configuration. However, in recent years, multiple units such as Unit 1, Unit 2, Unit 3, etc. In many cases, a single production line is configured by combining and connecting small component mounting apparatuses.

  FIG. 6 (a) is an external perspective view of a conventional small component mounting apparatus, and FIG. 6 (b) is a perspective view schematically showing the internal configuration with the upper and lower protective covers removed. The component mounting apparatus (hereinafter also referred to as a main unit) 1 shown in FIGS. 1A and 1B includes a liquid crystal display and a touch panel on the ceiling cover, and can input various instructions by external operations. A display input device 2, a monitor device 3 composed of a CRT display, and an alarm lamp 4 for informing the operating state are provided.

  A pair of parallel and parallel substrate guide rails 6 (6-1, 6-2) fixed and movable at the center are placed on the lower base 5 (see FIG. 5B). It extends horizontally from diagonally lower right to diagonally upper left). A loop-shaped conveyance belt (conveyor belt) is disposed so as to be able to travel in contact with the lower part of the substrate guide rails 6. The transport belt is driven by a belt drive motor with the side of the belt of several millimeters in width looking into the substrate transport path from under the substrate guide rail 6 and travels in the substrate transport direction to support both sides of the back side of the substrate from below Then, the board before component mounting is carried into the apparatus main body from the upstream side of the line, and the board on which the component has been mounted is carried out to the downstream side of the line.

  The base 5 is provided with a substrate positioning device, a substrate fixing mechanism for fixing the substrate between the two guide rails 6, a control circuit for controlling each part, etc., although not particularly shown. Further, on the base 5, a pair of left and right fixed rails 7 (7-1) extending across the pair of board guide rails 6 and extending in a direction perpendicular to the board transfer direction (front-rear direction). 7-2). A movable rail 8 is slidably engaged with these fixed rails 7 along the fixed rail 7, and a work head 9 for performing work for mounting components on the board is slidable along the movable rails 8. Suspended by.

  Although not clearly shown in the figure, the moving rail 8 is provided with a lateral drive servo motor that freely moves the work head 9 along its longitudinal direction (lateral direction). A front-rear direction drive servo motor that moves the moving rail 8 back and forth along the fixed rail 7 is disposed above. When these lateral drive servo motor and front / rear drive servo motor rotate freely in both forward and reverse directions according to instructions from the control circuit, the work head 9 moves freely in the lateral direction and the front / rear direction.

  Component supply stages 10 (10-1, 10-2) are arranged on the front part and the rear part on the base 5, respectively. Although not shown in particular, a large number of tape cartridge type component supply devices that are detachably provided with reels around which tapes containing components are wound are mounted on these component supply stages 10 corresponding to a plurality of types of components. Alternatively, a tray-type component supply device equipped with a plurality of pallets corresponding to a plurality of types of components engages.

  The work head 9 includes one or a plurality of mounting heads having a mechanism that can freely move up and down in the vertical direction and that can rotate in the 360-degree direction, and a component suction that is detachably attached to the tip of the mounting head. A nozzle (hereinafter, simply referred to as a nozzle) 11 picks up or grips a desired component from a component supply device mounted or engaged on the component supply stage 10 and mounts it on the substrate.

  The working head 9 is connected to the central control unit of the apparatus main body by a plurality of signal cords (not shown) protected and accommodated in belt-like chain bodies 12-1 and 12-2 that are bendable and hollow inside. . The work head 9 is supplied with electric power and a control signal from the central control unit via these signal codes, and transmits image data indicating information on a component mounting position on the board to the central control unit.

  The working head 9 moves freely by engaging with the moving rail 8 and the fixed rail 7 described above, and is mounted on the nozzle exchanger 13 so as to mount the nozzle 11 corresponding to the component to be sucked at the tip of the mounting head. Then, the desired nozzle 11 is mounted, the desired component is sucked from an appropriate component feeding device on the component feeding stage 10, and the sucked component is automatically carried into the main body device 1 and positioned and fixed at a predetermined position. Mounted on the board.

  At this time, the work head 9 is a component recognition camera with a lighting tool that is arranged between the board guide rail 6 and the component supply stage 10 and aligned with the nozzle exchanger 13 prior to the mounting of the components. 14, the component recognition camera 14 causes the holding state of the held component to be imaged, and the captured image data is transmitted to the central control unit. Further, the work head 9 images the component mounting position of the substrate by a substrate recognition camera (not shown in the figure) disposed in the apparatus itself, and transfers the image data to the central control unit.

  FIG. 7 is a perspective view schematically showing the above-described tape cartridge type component supply device (hereinafter simply referred to as a component supply device). The figure shows a state in which the component mounting apparatus 1 is mounted and disposed on the component supply stage 10. As shown in the figure, mounting fixing holes 15 and 16 arranged in a line at a predetermined pitch are formed before and after the component supply stage 10 of the component mounting apparatus 1.

  The component supply device 17 is positioned by inserting two mounting pins which are not shown in the drawing into the mounting fixing holes 15 and 16 and are fixed to the component supply stage 10 by a fixing lever 18.

  The reel-type cartridge 19 held at the rear part of the component supply device 17 has a component tape that accommodates a large number of chip-shaped electronic components (not shown, hereinafter simply referred to as components) between two upper and lower tape members. The component tape is pulled out from the reel type cartridge 19 and pulled out to the supply port 21 through the guide portion inside the apparatus, and the upper and lower tapes are peeled off to expose the component from the storage portion. The parts thus picked up are picked up and taken out by the nozzle 11 at the tip of the mounting head of the work head 9 of the component mounting apparatus 1.

  The upper tape (top tape or cover tape) 22 that has been peeled up and down is taken up by a take-up reel 23, and the lower part accommodating tape 24 naturally falls along the inner edge of the part supply stage 10. Then, it stays in the gap below the component mounting apparatus 1.

  FIG. 8 is a perspective view showing an internal configuration with the cover of the working head 9 removed. As shown in the figure, the working head 9 is connected to the central control unit of the apparatus main body by the signal cord held inside the chain body 12 as described above.

  The working head 9 includes two mounting heads 25 and 25 and a substrate recognition camera 26 at the tip. Each of the two mounting heads 25 can move up and down in the Z-axis direction (up and down direction) and can rotate in the θ-axis direction (360 ° direction).

  Each of the two mounting heads 25 includes a light emitting portion 27 at the tip thereof, and a nozzle 11 is detachably attached to the lower portion thereof. The nozzle 11 includes a light diffusion plate 11-1 for diffusing the irradiation light of the light emitting unit 27 to form an imaging background of the component, and a nozzle main body 11- for attracting the component from the component supply device 17 and transferring it to the substrate. 2 is comprised.

  In such a configuration, the work head 9 is moved freely forward and backward and left and right by the fixed rail 7 and the moving rail 8 described above, and sucks components from the component supply device 17 by the nozzle body 11-2. The component recognition camera 14 arranged on the side 5 detects a holding position deviation of the sucked component, corrects the mounting position data based on the detected holding position deviation, and on the other hand, the board recognition camera 26. Confirm the position of the board and mount the above components on the board.

  By the way, in the component mounting apparatus as described above, the confirmation of the nozzle before the start of the component mounting process is performed by visual observation of the operator. Then, the nozzle 11 has been replaced from the nozzle exchanger 13 at the discretion of the operator.

  Since the operator has been left to replace the nozzle 11 in this way, when the model of the board unit to be produced is switched, the nozzle exchanger 13 forgets to arrange the nozzle corresponding to the component mounted on the board unit. In addition, when a nozzle that does not correspond to the component mounting program is arranged in the nozzle exchanger 13, the mounting head 25 tries to suck the component by mounting an inappropriate nozzle, so that the component can be sucked. Therefore, problems such as causing an adsorption error occur.

  In addition, when checking the contamination of the nozzle tip, the operator confirms it visually or through a screen for checking the state of the suction nozzle provided in the main body of the device. May be placed. As a result, in the image recognition of the component, dirt at the tip of the nozzle may be recognized as a component, which causes a problem that the component is not mounted on the board despite the mounting process.

  In addition, since the operator cleans the tip of the nozzle manually or with a cleaner, the tip of the suction nozzle, which is the main part of the suction nozzle, is damaged by excessive cleaning, shortening the life of the suction nozzle. There is a risk of it. The suction nozzle that has reached the end of its life needs to be replaced with a new one, but the operator may place the suction nozzle on the nozzle exchanger without noticing that the life has expired. In this case, the mounting head mounts a nozzle that is not suitable for sucking, and a malfunction such as a sucking error occurs because the component cannot be sucked up well.

As described above, since the inspection of the nozzles before the start of production of the substrate unit is performed by the operator's visual observation, the nozzles inappropriate for production may be overlooked. Accordingly, there have been proposed a nozzle type recognition control method, a nozzle dirt recognition control method, and a component mounting apparatus using these control methods, which are capable of correctly arranging appropriate nozzles in the nozzle exchanger. (For example, refer to Patent Document 1.)
JP 2002-280798 A

  By the way, in the technique of the above-mentioned patent document 1, when recognizing the type of nozzle, the type of nozzle is specified by the shape and number of marks drawn on the upper part of the nozzle, or by the shape of the component suction surface portion of the nozzle. The type of nozzle is specified.

  However, in recent years, with the miniaturization of electronic equipment, the board unit incorporated in the electronic equipment and the components mounted on the board unit have been miniaturized. Currently, the smallest part is 0.4 × 0.2 mm, etc. Small parts that cannot be confirmed by human eyes have been put into practical use. And with the miniaturization of such components, the nozzles that attract the components are also becoming smaller. Naturally, the tip of the nozzle is extremely thin and small.

In such a miniaturized nozzle, dirt at the tip of the nozzle requires a work such as enlarging and observing the recognition image, resulting in a reduction in work efficiency.
In addition, at present, it is almost impossible to arrange professional skilled workers at the production site because of the diversification of operators so that all work is handled by one or two people. There are many inexperienced operators, and if a mounting error occurs during the component mounting process as described above, the operator must identify the cause of the mounting error unless the component mounting device notifies and outputs accurate error information. It is difficult to find a nozzle error, and it is difficult to deal with nozzle errors easily.

  For example, if the nozzle is not properly placed in the nozzle changer, if the suction nozzle that should have been mounted on the mounting head has dropped, or if the suction nozzle is normal, the part has dropped in the middle In any case, if it is a skilled person, it is possible to take appropriate measures when a warning notification is given as a component recognition error.

  However, at present, errors such as when the nozzles arranged in the nozzle exchanger are not appropriate, when the nozzles are missing, or when the nozzle tips are dirty cannot be properly alerted for each type of error. It is difficult for the operator to deal with immediately.

  In particular, in a small nozzle that absorbs small parts that cannot be confirmed by human eyes, such as 0.6 x 0.3 mm or less, the tip is soiled (mainly applied to the mounting position of the substrate by empty mounting processing after the parts are dropped) Even if foreign matter adheres to the surface and causes a suction failure, the operator cannot determine what caused the mounting failure.

  In view of the above-described conventional situation, an object of the present invention is to provide a component mounting apparatus that reliably detects problems such as dropout of a nozzle that adsorbs components and contamination at the tip thereof.

Below, the structure of the component mounting apparatus (electronic component mounting apparatus) concerning this invention is described.
First, in the electronic component mounting apparatus according to the first aspect of the invention, a nozzle for adsorbing an electronic component is detachably attached to the tip of the mounting head, the electronic component is adsorbed by the nozzle, and the electronic component is mounted on a printed circuit board. In the electronic component mounting apparatus, nozzle data master storage means for storing in the nozzle data master as geometric data modeled on the state of the nozzle when the nozzle is normally mounted on the mounting head, and the nozzle on the mounting head And after-nozzle-mounted image acquisition means for acquiring the state of the tip of the mounting head as post-nozzle-mounted image data after performing the process of mounting on the nozzle, and the post-nozzle-mounted image data acquired by the post-nozzle-mounted image acquisition means And above the nozzles in the nozzle data master stored in the nozzle data master storage means. Nozzle state determining means for comparing the modeled geometric data, and failure occurrence notifying means for stopping the operation and notifying the operator when there is an abnormality in the comparison result by the nozzle state determining means. Configured.

The post-nozzle mounting image acquisition means is constituted by, for example, a component recognition camera for recognizing an image for position correction before mounting the electronic component.
Next, in the component mounting apparatus of the second invention, a nozzle for sucking an electronic component is detachably attached to the tip of the mounting head, the electronic component is sucked by the nozzle, and the electronic component is mounted on a printed board. In the electronic component mounting apparatus, nozzle data master storage means for storing in the nozzle data master as geometric data modeled on the state of the nozzle when the nozzle is normally mounted on the mounting head, and the electronic component on the print An after-mounting image acquisition unit that acquires the state of the nozzle as post-mounting image data after performing a process of mounting on a board, the post-mounting image data acquired by the post-mounting image acquisition unit, and the nozzle The modeled number of the nozzles in the nozzle data master stored in the data master storage means. A nozzle state determining means for comparing the data, and provided with a defect occurrence informing means for informing a warning to the operator to stop the operation when there is abnormality in the comparison result by the nozzle state determining means.

  Then, the post-component mounting image acquisition means is composed of, for example, a component recognition camera for recognizing the image of the electronic component for position correction before mounting.

  According to the present invention, the state of the nozzle when it is normally mounted on the mounting head is held in the nozzle data master as modeled geometric data, and the modeled geometric data of the nozzle data master and the current operation are stored. Since the data indicating the status of the nozzle being executed is always compared, a warning can be immediately issued if there is even a small amount of nozzles. If a warning is issued as a result, the nozzle can be used unconditionally. Thus, it is possible to reduce the burden of judgment by an unfamiliar operator and to prevent the work efficiency of the board unit production line from being lowered.

  Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram schematically showing the internal configuration of the main part of the component mounting apparatus of the present invention. The general appearance of the component mounting apparatus of this example is the same as that of the component mounting apparatus 1 shown in FIG.
In FIG. 1, two substrate guide rails 31, a loaded substrate 32, a supply stage 33, a tape reel type component supply device 34 disposed on the supply stage 33, and a tray type component supply device 35, A work head 36 that moves parts on the board 32 back and forth, right and left (XY directions) and performs component mounting work, and six rotarys that are held by the work head 36 and can be moved up and down (Z direction) and rotated 360 degrees. A component recognition head 38 and a component recognition camera 38 for recognizing an image of a component adsorbed on the tip of the mounting head 37 are shown. Further, the illustration of the nozzle exchanger is omitted.

  The mounting head 37 attracts the component 43 from the tray 42 on the pallet 41 drawn from the pallet storage shelf inside the apparatus to the component stage 39 of the tray-type component supply device 35, or the tape of the tape reel-type component supply device 34. The component 47 of the component tape 46 drawn from the reel 44 to the component supply port 45 is picked up by being picked up as indicated by an arrow a in the figure, and is moved by the component recognition camera 38 on the way to the substrate 32 as indicated by an arrow b. The part 43 or 47 is image-recognized, the position is corrected, and the part 43 or 47 is mounted on the substrate 32 as indicated by an arrow c.

  FIG. 2 is an enlarged perspective view showing the configuration of the mounting head of the component mounting apparatus. In the figure, the same components as those shown in FIG. 1 are denoted by the same reference numerals as those in FIG. Also, FIG. 2 shows working with the mounting head 37 (three mounting heads 37 of the six rotary types are visible on the near side of the figure), the nozzle 48 attached to the tip thereof, and the mounting head 37. A base recognition camera 49 supported by the head 36 is shown.

  FIG. 3 is a system block diagram of the component mounting apparatus configured as described above. As shown in the figure, the component mounting apparatus 50 of this example includes a CPU 51 and a control unit including an i / o (input / output) control unit 53 and an image processing unit 54 connected to the CPU 51 via a bus 52. Yes. Further, a memory 55 is connected to the CPU 51. The memory 55 includes a program area and a data area (not shown).

  Further, the i / o control unit 53 is attracted to the board illumination device 56 for illuminating the component mounting position of the board 32 (see FIGS. 1 and 2) and the nozzle 48 (see FIG. 2) of the mounting head 37. An LED illuminator 57 provided integrally with a component recognition camera 38 for illuminating the component 43 or 47 being connected is connected via an illumination control unit 58.

  Further, an X-axis motor 61, a Y-axis motor 62, a Z-axis motor 63, and a θ-axis motor 64 are connected to the i / o control unit 53 via respective amplifiers (AMP). The X axis motor 61 drives the work head 36 in the X direction, the Y axis motor 62 drives the work head 36 in the Y direction, the Z axis motor 63 drives the mounting head 37 up and down, and the θ axis motor. Reference numeral 64 rotates the mounting head 37, that is, the nozzle 48, 360 degrees.

  Although not shown in particular, each of the amplifiers is provided with an encoder, and the motors (X-axis motor 61, Y-axis motor 62, Z-axis motor 63, and θ-axis motor 64) are provided by these encoders. The encoder value corresponding to the rotation of is input to the CPU 51 via the i / o control unit 53. Thereby, the CPU 51 can recognize the front / rear, left / right, upper / lower current positions, and rotation angles of each mounting head 37.

  Further, a vacuum unit 65 is connected to the i / o control unit 53. The vacuum unit 65 is pneumatically connected to the nozzle 48 of the mounting head 37 via a vacuum tube 66. An air pressure sensor 67 is disposed in the vacuum tube 66. The vacuum unit 65 adsorbs the component 43 or 47 to the nozzle 48 by vacuum, or releases the suction by vacuum release, air blow, and vacuum break (vacuum break).

  At this time, air pressure data in the vacuum tube 66 is output from the air pressure sensor 67 to the CPU 51 via the i / o control unit 53 as an electrical signal. Thereby, the CPU 51 knows the state of the air pressure in the vacuum tube 66 and can recognize whether or not the component 43 or 47 is ready to be sucked by the nozzle 48 and the sucked component 43 or 47. It can be recognized whether or not is adsorbed normally.

  Further, the i / o control unit 53 is connected to a positioning device, a belt drive motor, a substrate sensor, an abnormality display lamp and the like via respective drivers. The positioning device is disposed below the board guide rail 31 inside the base of the component mounting apparatus 50, and positions the board 32 guided into the apparatus. The belt drive motor circulates and drives the conveyor belt that is integrally disposed on the guide rail 31. The substrate sensor detects the loading and unloading of the substrate 32. The abnormality display lamp is lit or flashed when an abnormality such as an operation abnormality of the component mounting apparatus 50 or an entry of a foreign object in the work area, and notifies the on-site worker of the occurrence of the abnormality.

  In addition, a communication i / o interface 68, a display operation input device 69, and a recording device 70 are connected to the CPU 51. The communication i / o interface 68 is connected to these processing devices in a wired or wireless manner when, for example, teaching processing or the like is performed by another processing device such as a personal computer, so that communication with the CPU 51 is possible. To do.

  The recording device 70 can be mounted with various recording media such as a hard disk, MO, FD, CD-ROM / RW, flash memory device, etc., and component mounting processing of the component mounting device 50 and component mounting performed beforehand. Programs such as teaching processing, data in the parts library, and a nozzle data master described later are recorded and held.

  The recording device 70 records and holds various data such as NC data from the CAD. These programs are loaded into the program area of the memory 55 by the CPU 51 and used for control processing of each unit. Data is also read into the data area of the memory 55 and subjected to predetermined processing. The processed and updated data is stored and stored in a predetermined data area of a predetermined recording medium. The data area of the memory 55 includes a number of subdivided register areas, and various count values are temporarily stored in the register area.

  In the display operation input device 69, when the component mounting operation is performed, the image processing unit 54 captures an image of the substrate 32 captured by the substrate recognition camera 49 on the work head 36 side, and the image processing unit 54 recognizes the component recognition on the main body device side. The image of the component 43 or 47 captured by the camera 38 is displayed on the display device. When the teaching process is executed, the teaching screen is displayed.

  When mounting the component 43 (or 47) on the substrate 32, the CPU 51 uses the component 43 or 47 sucked by the nozzle 48 at the tip of the mounting head 37 from the tray-type component supply device 35 or the tape reel-type component supply device 34 as the component. The image recognition is performed by the recognition camera 38, the mounting position of the substrate 32 on which the image-recognized component 43 or 47 is to be mounted is image-recognized by the substrate recognition camera 49, and the image is recognized at the mounting position on the substrate. The recognized component 43 or 47 is mounted while correcting the position.

  In this embodiment, an extremely small component such as 0.6 × 0.3 mm or less, which has been particularly increased in recent years, is mounted on the substrate 32. When such a small component is mounted on the substrate, the tip of the nozzle 48 is mounted. As described above, it is impossible to correctly mount components if dirt or foreign matter adheres to the surface.

  Therefore, in this example, first, an abnormality of the nozzle 48 is detected by using a component recognition camera 38 that performs image recognition for position correction before component mounting. In the abnormality detection of the nozzle 48, the nozzle recorded in the predetermined recording unit of the recording apparatus 70 as the geometric data modeling the state of the nozzle when the nozzle 48 is normally mounted on the mounting head 37. Hold in the data master.

  Then, after performing the process of mounting the nozzle 48 on the mounting head 37, that is, the process of replacing the nozzle, the post-nozzle mounting image data indicating the state of the tip of the nozzle 48 is acquired by the component recognition camera 38, and the acquired It is determined whether the image data after nozzle mounting is normal or abnormal by comparing it with the modeled geometric data of the nozzle 48 held in the nozzle data master.

  Further, even after the component mounting process on the board, the component mounting image data indicating the state of the tip of the nozzle 48 is acquired by the component recognition camera 38, and the acquired component mounting image data and the nozzle data master are acquired. It is determined whether the nozzle 48 is normal or abnormal by comparing with the modeled geometric data of the nozzle 48 held in the table.

FIG. 4 is a flowchart for explaining the above processing operation by the CPU 51.
FIG. 5 (a) is a modeled geometric data of a certain nozzle held in the above-described nozzle data master used in the above processing, and FIG. It is a figure which shows the example of the image data after components mounting in which the dirt adhered to the nozzle after mounting. When the nozzle has fallen off the mounting head, the component recognition camera 38 is focused on the tip of the nozzle, so the mounting head that is out of focus is viewed from below in the camera field of view. Only blurred images are shown.

  In FIG. 4, the CPU 51 determines whether or not the nozzle has been replaced (S01). If the nozzle has been replaced (S01 is Yes), the mounting head 37 is then moved onto the component recognition camera 38, and the state of the nozzle is imaged by the component recognition camera 38, The image data indicating the state of the nozzle obtained by imaging is stored in the temporary storage area of the recording apparatus 70 as image data after nozzle mounting (S02).

  Subsequently, the CPU 51 reads the modeled geometric data corresponding to the nozzles held in the nozzle data master (S03), and compares the modeled geometric data with the image data after nozzle mounting. It is then determined whether there is an abnormality (S04).

  In this process, for example, as shown in FIGS. 5 (a) and 5 (b), the modeled geometric data in FIG. 5 (a) and the nozzles with dirt or foreign matter attached to the tip shown in FIG. The image data after nozzle installation is compared. The example shown in FIG. 4B is an example in which the operator places the nozzle in the nozzle exchanger without noticing the dirt on the nozzle tip.

  In such a case, it is determined that both image data do not match, that is, abnormal (S04 is Yes). In this case, the CPU 51 immediately stops the operation of the main body device (S05), and then warns that the nozzle is abnormal (S06).

  In this warning notification, for example, in addition to a flashing display of a warning light, a message indicating that the nozzle is abnormal is displayed on the display device, and an image of the nozzle tip indicating the abnormality is further displayed.

  If there is no abnormality in the determination in the above-described processing S04 (No in S04), the component mounting process is executed as usual (S07), and then the mounting head 37 is used for component recognition before adsorbing the next component. It is moved onto the camera 38, the state of the nozzle is imaged by the component recognition camera 38, and image data indicating the state of the nozzle obtained by the imaging is temporarily stored in the recording device 70 as image data after component mounting. Store in the storage area (S08).

  Subsequently, the CPU 51 also reads the modeled geometric data corresponding to the nozzles held in the nozzle data master in this case (S09), and the modeled geometric data and the post-component mounting image are displayed. It is compared with the data to determine whether or not there is an abnormality (S010).

  In this process, for example, as shown in FIGS. 5 (a) and 5 (b), the modeled geometric data in FIG. 5 (a) and the nozzles with dirt or foreign matter attached to the tip shown in FIG. The image data after component mounting is compared.

  In this case, in the example shown in FIG. 5 (b), the air pressure in the vacuum tube 66 does not change greatly even if the parts fall off because the sucked parts fall off and the nozzle suction port is too small. Therefore, the air pressure sensor 67 cannot detect that the component has fallen out, and the component mounting process (empty mounting process) is performed as it is, so that the solder applied to the mounting position of the board is removed from the nozzle. An example attached to the tip is shown.

  Therefore, in this case as well, it is determined that there is an abnormality (S10 is Yse), and the above-described processing S05 and processing S06 are executed. Further, if the post-component mounting image data acquired in the above process S08 is as shown in FIG. 5A, it is not abnormal (No in S10). In this case, the process returns to the process S01, and the process S01 Repeat ~ S10.

If it is determined in the process S01 that the nozzle is not replaced (No in S01), the processes after the process S07 are immediately executed.
As described above, in this example, the state of the nozzle when the nozzle is normally mounted on the mounting head is recorded and held in advance as a modeled geometric data in a predetermined recording unit (nozzle data master) of the recording apparatus. When the nozzle is replaced and when a component mounting (mounting) process is performed, image data indicating the state of the nozzle immediately after that is acquired, and the image data and the modeled geometric data of the nozzle are acquired. And if it is normal or abnormal, if there is even a slight abnormality in the nozzle, the abnormality will be immediately determined and a warning notification will be given of the abnormal abnormality of the nozzle. It is possible to immediately know that it has occurred due to a defective nozzle state, and to deal with it appropriately.

  In the above embodiment, the modeled geometric data is held in the nozzle data master. However, the present invention is not limited to this, and the component master linked to the mounted component ID of the component mounting processing program (NC program). You may make it hold | maintain the modeled geometric data in (data in which all the data regarding all the mounted components are described).

  Also, when the nozzle is replaced or when a component mounting (mounting) process is performed, image data indicating the state of the nozzle immediately after that is acquired, and the image data and the modeled geometric data of the nozzle are acquired. If it is possible to arbitrarily set whether or not the nozzle state check process is compared to the part master corresponding to the nozzle data master at the time of teaching during setup, 0.6 x 0.3 mm or less The nozzle state check process can be limited only during the microchip mounting process, thereby improving the tact of the component mounting process.

It is a figure which shows typically the internal structure of the principal part of the components mounting apparatus of this invention. It is an expansion perspective view which shows the structure of the mounting head of a component mounting apparatus. It is a system block diagram of a component mounting apparatus. It is a flowchart explaining the processing operation of the nozzle defect detection by CPU of a component mounting apparatus. (a) is a figure which shows the example of the modeled geometric data previously hold | maintained at the nozzle data master, (b) is a figure which shows the example of the image data which the dirt adhered to the nozzle. (a) is an external perspective view of a conventional small component mounting apparatus, and (b) is a perspective view schematically showing an internal configuration by removing upper and lower protective covers. It is a perspective view which shows typically the component supply apparatus of the tape cartridge system attached on the conventional component supply stage. It is a perspective view which removes the cover of the conventional working head and shows an internal structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Display input apparatus 3 Monitor apparatus 4 Alarm lamp 5 Base 6 (6-1, 6-2) Board | substrate guide rail 7 (7-1, 7-2) Fixed rail 8 Moving rail 9 Work head 10 ( 10-1, 10-2) Component supply stage 11 Nozzle (component suction nozzle)
11-1 Light Diffusing Plate 11-2 Nozzle Body 12-1, 12-2 Chain Body 13 Nozzle Exchanger 14 Component Recognition Camera 15, 16 Mounting Fixing Hole 17 Component Supply Device 18 Fixing Lever 19 Reel Cartridge 21 Supply Port 22 Top tape (cover tape)
23 Reel for take-up 24 Component housing tape 25 Mounting head 26 Camera for substrate recognition 27 Light emitting part 31 Substrate guide rail 32 Substrate 33 Supply stage 34 Tape reel type component supply device 35 Tray type component supply device 36 Work head 37 Mounting head 38 Components Recognition camera 39 Component stage 41 Pallet 42 Tray 43 Component 44 Tape reel 45 Component supply port 46 Component tape 47 Component 48 Suction nozzle 49 Base recognition camera 50 Component mounting device 51 CPU
52 Bus 53 i / o (input / output) control unit 54 Image processing unit 55 Memory 56 Substrate illumination device 57 LED illuminator 58 Illumination control unit 61 X-axis motor 62 Y-axis motor 63 Z motor 64 θ-axis motor 65 Vacuum unit 66 Vacuum Tube 67 Pneumatic pressure sensor 68 Communication i / o interface 69 Display operation input device 70 Recording device

Claims (5)

In an electronic component mounting apparatus in which a nozzle that adsorbs an electronic component is detachably attached to the tip of the mounting head, the electronic component is adsorbed by the nozzle, and the electronic component is mounted on a printed board.
Nozzle data master storage means for storing in the nozzle data master as geometric data modeled when the nozzle is normally mounted on the mounting head;
A post-nozzle mounting image acquisition means for acquiring the state of the tip of the mounting head as post-nozzle mounting image data after performing the process of mounting the nozzle on the mounting head;
The post-nozzle image data acquired by the post-nozzle image acquisition means is compared with the modeled geometric data of the nozzles in the nozzle data master stored in the nozzle data master storage means. Nozzle state determining means;
A failure occurrence notifying means for stopping operation and notifying an operator of a warning when there is an abnormality in the comparison result by the nozzle state determining means;
An electronic component tower apparatus characterized by comprising:   2. The electronic component mounting apparatus according to claim 1, wherein the post-nozzle image acquisition unit is a component recognition camera for recognizing an image for position correction before mounting the electronic component. In an electronic component mounting apparatus in which a nozzle that adsorbs an electronic component is detachably attached to the tip of the mounting head, the electronic component is adsorbed by the nozzle, and the electronic component is mounted on a printed board.
Nozzle data master storage means for holding in the nozzle data master as geometric data modeled when the nozzle is normally mounted on the mounting head;
After-mounting image acquisition means for acquiring the state of the nozzle as post-mounting image data after performing the process of mounting the electronic component on the printed circuit board;
The post-component mounting image data acquired by the post-component mounting image acquisition unit is compared with the modeled geometric data of the nozzle in the nozzle data master stored in the nozzle data master storage unit. Nozzle state determining means;
A malfunction occurrence notifying means for stopping the operation and notifying the operator when there is an abnormality in the comparison result by the nozzle state determining means;
An electronic component tower apparatus characterized by comprising:   4. The electronic component mounting apparatus according to claim 3, wherein the post-component mounting image acquisition means is a component recognition camera for recognizing an image for correcting the position of the electronic component before mounting.   A first check step by acquiring the post-nozzle image data by the post-nozzle image acquisition means and comparing the post-nozzle image data by the nozzle state determination means and the modeled geometric data; And a second check based on the acquisition of the post-component image data by the post-component image acquisition unit and the comparison of the post-component image data and the modeled geometric data by the nozzle state determination unit. 2. The electronic component mounting apparatus according to claim 1, further comprising a check availability setting unit that sets whether or not the nozzle state check process including the processes can be performed in a component master corresponding to the nozzle data master.

Images