JP2006114093A - Lamination apparatus of disk substrate and lamination method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lamination apparatus of disk substrates and a lamination method by which width of an adhesive layer can be formed surely, uniformly, and stably with a comparatively simple mechanism, width of an outer peripheral part can be adjusted surely and simply. <P>SOLUTION: When a disk substrate 20 and a disk substrate 21 to which an adhesive 35 and an adhesive 38 are coated respectively to lamination planes by spin coat are laminated together, the outer peripheral part of the disk substrate 20 is pressed stepwise to the radial direction from the outer peripheral side so that an inner peripheral ring 52 presses after an outer peripheral ring 51. The disk substrate 20 is bent by pressure of the outer peripheral ring, bubbles mixed in the adhesive layer are pressed out toward the inner peripheral side. Also, width of the adhesive extended thickly toward the outer peripheral part from the inner peripheral part by spin coat is uniformalized by pressing the inner side of the outer peripheral part. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a disk substrate bonding apparatus and a bonding method, and in particular, a disk substrate bonding suitable for use in manufacturing a disk-shaped recording medium manufactured by bonding two disk substrates having different inner diameters. The present invention relates to an apparatus and a bonding method.

  Currently, optical discs such as CD (Compact Disc), MD (Mini Disc), and DVD (Digital Versatile Disc) are used. The optical disc is manufactured as follows, for example. First, a planar annular disk substrate is formed from a synthetic resin material such as polycarbonate by an injection molding method. Next, a reflective film to be a recording layer is formed on the main surface of the molded disk substrate by a sputtering method. For example, a CD or MD is manufactured by providing a protective layer on the main surface of a disk substrate so as to cover the formed recording layer, and a single-layer DVD is a dummy on the disk substrate on which the recording layer is formed. A two-layer DVD is manufactured by bonding together a disk substrate, and two disk substrates manufactured using two types of film materials are bonded together using an adhesive serving as an intermediate layer.

  In the laminating process in the manufacture of optical discs that bond disc substrates together, the thickness of the adhesive layer interposed between the disc substrates is made uniform, bubbles are prevented from entering the adhesive layer, centering to prevent eccentricity, etc. Advanced technology is required.

  For example, a method is known in which an adhesive such as a UV curable resin or a pressure-sensitive resin is spread on a bonding surface of a disk substrate using a spin coater to bond another disk substrate. However, in the spread of the adhesive by spin coating, it has been difficult to make the adhesive layer have a uniform thickness with high accuracy. For example, when a liquid adhesive is dropped on the inner periphery of a disk substrate having a center hole, and the dropped adhesive is spread by spin coating, the thickness of the adhesive increases from the inner periphery toward the outer periphery. End up.

  Therefore, for example, in Patent Document 1 below, the outer peripheral portion of two stacked disc substrates is heated, and the adhesive layer between the disc substrates is spread by spin coating, so that the adhesive layer on the inner and outer periphery is spread. It is described that the thickness is uniform.

JP 2000-228038 A

  Also, for example, in Patent Document 2 below, a protective film is formed by spreading an ultraviolet curable resin by spin coating on a reflective film on a pit surface of a disk substrate, and another disk substrate is sandwiched between the formed protective films. It describes that the thickness unevenness of the protective film can be made uniform by pressing the entire periphery of the disk substrate and then pressing the entire surface when bonding.

Japanese Patent No. 2777552

  However, the method of heating the outer peripheral portion described in Patent Document 1 described above is difficult to control the temperature of an intended narrow area on the disk substrate, and is particularly applicable to bonding of disk substrates having a small size. Have difficulty. Further, since the heat applied to the outer peripheral portion of the disk substrate has a great influence on the skew of the disk substrate, there is a problem that it is particularly difficult to apply to bonding of disk substrates having a small thickness.

  Further, the uniformity of thickness unevenness described in Patent Document 2 described above is for improving the swell of the protective film generated by surface tension at the outer peripheral edge of the disk substrate. It did not equalize the thickness of the adhesive that would be thickly extended from the outer periphery to the outer periphery.

  Accordingly, an object of the present invention is to bond disk substrates that can be formed stably and uniformly with a relatively simple mechanism, and the thickness of the outer peripheral portion can be adjusted accurately and easily. An object is to provide an apparatus and a bonding method.

  To achieve the above object, the first invention is a disc substrate laminating apparatus for laminating the first and second disc substrates in which an adhesive is spread on at least one laminating surface by spin coating. A step-shaped center pin into which a first disk substrate and a second disk substrate having an inner diameter smaller than the first disk substrate are movable, and the first disk substrate and the second disk substrate. Placing means for sequentially placing the first and second disk substrates into the center pin and placing them on the mounting table so that the bonding surfaces of the two face each other, and the outer periphery of the second disk substrate placed by the placing means A disk substrate laminating apparatus, comprising: a pressing unit configured to press the portion stepwise in a radial direction from the outer peripheral side toward the mounting table. A.

  According to a second aspect of the present invention, there is provided a disc substrate laminating method in which an adhesive is spread on at least one laminating surface by spin coating, and the first and second disc substrates having different inner diameters are bonded in the axial direction. The first disk substrate and the second disk substrate are attached to a step-shaped center pin into which the first disk substrate and the second disk substrate having a smaller inner diameter than the first disk substrate are inserted. The step of sequentially inserting the first and second disk substrates and arranging them on the mounting table so that the mating surfaces face each other, and the outer peripheral portion of the second disk substrate arranged on the mounting table are mounted. And a step of stepwise pressing in a radial direction from the outer peripheral side toward the table.

  According to the present invention, the outer periphery of the second disk substrate disposed on the mounting table is pressed in a radial direction from the outer periphery toward the mounting table, so that the outside of the outer periphery is in line contact. The inner side of the outer peripheral portion is pressed after being pressed by. Thereby, the bubbles mixed in the adhesive layer at the time of bonding are pushed out toward the inner peripheral side. Further, by pressing the inside of the outer peripheral portion, the thickness of the adhesive that is thickly extended from the inner peripheral portion to the outer peripheral portion by spin coating can be made uniform.

  Even if the shape of the disk substrate is small or thin, it is only necessary to press the outer peripheral portion, so that the thickness of the adhesive layer can be reliably and uniformly formed with a relatively simple mechanism. Further, the thickness of the outer peripheral portion can be adjusted accurately and easily by appropriately setting the pressing force.

  Hereinafter, a disk substrate bonding apparatus and a bonding method according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an example of the configuration of a bonded optical disk manufacturing apparatus to which an embodiment of the present invention is applied. FIG. 2 is a flowchart showing an example of a processing flow in the manufacturing apparatus.

  The molding apparatus 1 has a cavity for molding two planar annular disk substrates. The cavity is composed of a mold that can be opened and closed, for example, consisting of a fixed mold and a movable mold. The molding apparatus 1 molds two disc substrates made of a synthetic resin material such as polycarbonate and having the same outer diameter and different inner diameters by an injection molding method. Hereinafter, a disk substrate having a smaller inner diameter is referred to as a small diameter disk substrate, and a disk substrate having a larger inner diameter is referred to as a large diameter disk substrate. The small diameter disk substrate and the large diameter disk substrate are collectively referred to as two disk substrates.

  A stamper for forming pits of different information is attached to one main surface of each cavity for molding these two disk substrates. On one main surface of these two disk substrates, Pits are formed by fine dents transferred by the stamper so that the signal recording surface is provided.

  In the substrate forming step, the two disk substrates are formed by the forming apparatus 1 (step S1). The disk substrate molded by the molding apparatus 1 is conveyed to the cooling apparatus 3 by the take-out machine 2.

  The take-out machine 2 has a take-out arm that can hold the disk substrate. The take-out machine 2 controls this arm so as to synchronize with the opening and closing of the mold that constitutes the cavity of the molding apparatus 1, for example, and takes out the two formed disk substrates from the cavity and conveys them to the cooling apparatus 3. It should be noted that the efficiency can be improved by adopting a mechanism for simultaneously taking out two disk substrates from the cavity.

  The cooling device 3 has a mechanism for receiving two disk substrates from the take-out machine 2. It should be noted that the efficiency can be improved by adopting a mechanism for simultaneously receiving two disk substrates. The cooling device 3 further includes a mechanism for cooling the disk substrate, a mechanism for storing a predetermined number of disk substrates (for example, 3 to 20 sheets), and a film forming apparatus for performing the next process (film forming process). It has a mechanism that aligns the orientation of the disk surface in a direction that matches the mechanism that adds the film to the disk substrate, and a mechanism that adjusts the time to the next process (film formation process) in the order in which the disk substrates are loaded. . For example, the time for passing the input disk substrate to the next process (film forming process) is the earliest, and is the time for one cycle of substrate molding in the previous process (substrate forming process), and the latest is the substrate. A time obtained by multiplying the molding cycle time by the number of storages possible.

  In the cooling process, the disk substrate molded in the substrate molding process is cooled by the cooling device 3 (step S2). The disk substrate cooled by the cooling device 3 is transferred to the film forming apparatus by the first transfer arm 4. The small diameter disk substrate is transported to the first film forming apparatus 5, and the large diameter disk substrate is transported to the second film forming apparatus 6.

  The first transfer arm 4 has a mechanism for taking out two disk substrates from the cooling device 3. In addition, efficiency can be achieved by using a mechanism for simultaneously taking out two disk substrates. Further, the first transfer arm 4 transfers the two disc substrates taken out to the film forming apparatus for performing the next process (film forming process), and returns to the disk substrate extraction position from the cooling device 3. It has a mechanism. It should be noted that the efficiency can be improved by using a mechanism for simultaneously transporting the two disk substrates.

  The first transfer arm 4 has a mechanism for supplying two disk substrates to the sampling device 10. In addition, efficiency can be achieved by using a mechanism that supplies two disk substrates simultaneously. This mechanism is used when sampling the disk substrate before film formation.

  Further, the first transfer arm 4 takes out two disk substrates from the film forming apparatus, conveys the taken disk substrates to an adhesive application device that performs the next process (adhesive application process), and forms a film. It has a mechanism for returning to the position for taking out the disk substrate from the apparatus. The small-diameter disk substrate taken out from the first film forming apparatus 5 is conveyed to the first adhesive application device 7, and the large-diameter disk substrate taken out from the second film forming apparatus 6 is used as the second adhesive application device. 8 is conveyed. Note that efficiency can be improved by using two disk substrates that are simultaneously removed from the film forming apparatus. In addition, efficiency can be improved by using a mechanism that simultaneously transports the two disk substrates to the adhesive application device.

  The first transfer arm 4 has a mechanism for simultaneously taking out two disk substrates from the cooling device 3 and from the film forming device, two disk substrates to the film forming device, and the adhesive coating device. And a mechanism that simultaneously performs two return operations to return to the take-out position after the disc substrate transport operation. Here, in order to increase efficiency, the first transfer arm 4 is a mechanism that simultaneously performs the two take-out, transfer, and return operations, but it is needless to say that the first transfer arm 4 does not necessarily have to be simultaneously.

  The film forming apparatus 5 has a function of adding a reflective film of silicon, aluminum, silver or the like to the signal (pit) transfer surface side of the small-diameter disk substrate by a sputtering method. Further, the film forming apparatus 5 has a function of receiving a transparent disk substrate before film formation from the first transfer arm 4, a function of passing a disk substrate on which film formation has been performed to the first transfer arm 4, and a space for performing sputtering. Has a function of adjusting the pressure to a pressure suitable for the sputtering conditions and a function of moving the disk substrate to the space for sputtering.

  The film forming apparatus 6 has a function of adding a reflective film of silicon, aluminum, silver or the like to the signal (pit) transfer surface side of the large-diameter disk substrate by a sputtering method. Further, the film forming apparatus 6 has a function of receiving a transparent disk substrate before film formation from the first transfer arm 4, a function of passing a disk substrate on which film formation has been performed to the first transfer arm 4, and a space for performing sputtering. Has a function of adjusting the pressure to a pressure suitable for the sputtering conditions and a function of moving the disk substrate to the space for sputtering.

  In the film forming process, a film forming process is performed on each of the two disk substrates cooled by the cooling device 3 using these film forming devices (step S3). The small diameter disk substrate is subjected to film formation by the film formation apparatus 5, and the large diameter disk substrate is subjected to film formation by the film formation apparatus 6. As described above, the small-diameter disk substrate after film formation is supplied to the adhesive application device 7 and the large-diameter disk substrate is supplied to the adhesive application device 8 by the first transfer arm 4.

  The adhesive applicator 7 has a table having a mechanism for vacuum-holding the vicinity of the center of a small-diameter disk substrate on which the film has been formed (for example, if the center hole diameter is about φ15 mm, φ20 mm to φ26 mm). ing. The adhesive application device 7 is for applying an adhesive on a main surface to be a bonding surface of a small-diameter disk substrate by spin coating, and a table for holding the small-diameter disk substrate is set in a range of, for example, 30 rpm to 8000 rpm. And a mechanism for applying an adhesive with good position reproducibility near the center of the small-diameter disk substrate, and a mechanism for returning the adhesive shaken off by rotation to the adhesive supply tank. When applying the adhesive only to the large-diameter disk substrate side, the table of the adhesive application device 7 is used as a temporary placement table for the small-diameter disk substrate.

  The adhesive applicator 8 has a table having a mechanism for vacuum-holding the vicinity of the center of the large-diameter disk substrate on which the film has been formed (for example, if the center hole diameter is about φ15 mm, around φ20 mm to φ26 mm). is doing. The adhesive applicator 8 is for applying an adhesive on a main surface to be a bonding surface of a large-diameter disk substrate by a spin coating method, and a table for holding the large-diameter disk substrate is, for example, 30 rpm to 8000 rpm. A mechanism for rotating at a rotational speed in the range of 1), a mechanism for applying an adhesive near the center of the large-diameter disk substrate with good position reproducibility, and a mechanism for returning the adhesive shaken off by rotation to the adhesive supply tank. When applying the adhesive only to the small-diameter disk substrate side, the table of the adhesive application device 8 is used as a temporary placement table for the large-diameter disk substrate.

  In the adhesive application process, the adhesive is applied to the two disk substrates on which the film is formed by the film forming apparatus, using the adhesive applying apparatus (step S4). In the example shown in FIG. 1, the small-diameter disk substrate is coated with an adhesive on the main surface serving as a bonding surface by an adhesive application device 7, and the large-diameter disk substrate is bonded onto the main surface serving as a bonding surface. An adhesive is applied by the application device 8. The small-diameter disk substrate coated with the adhesive is supplied to the reversing device 11 by the second transport arm 9, and the large-diameter disk substrate coated with the adhesive is bonded by the second transport arm 9. Is supplied to the disk substrate receiving part of the table device 12 for use. The sampling disk substrate is supplied to the sampling device 10 by the second transfer arm 9.

  The second transfer arm 9 takes out the two disk substrates from the adhesive application device in order to perform the process of the next step (disk substrate bonding step), and removes the removed disk substrates from the reversing device 11 and the table device. It has a mechanism for supplying to the table of the 12 disk substrate receiving portions. The small-diameter disk substrate is supplied to the reversing device 11. The large-diameter disk substrate is supplied to the disk substrate receiving portion of the table device 12 and is inserted into the center pin. In addition, efficiency can be achieved by using a mechanism in which the two disk substrates are simultaneously removed from the adhesive application device. Further, efficiency can be improved by providing a mechanism for supplying two disk substrates to the reversing device 11 and the table device 12 simultaneously.

  The second transfer arm 9 has a mechanism for supplying two disk substrates to the sampling device 10 between the adhesive applying device and the reversing device 11. In addition, efficiency can be achieved by using a mechanism that supplies two disk substrates simultaneously. This mechanism is used when sampling the disk substrate after film formation.

  Further, the second transfer arm 9 has a mechanism for returning to the disk substrate take-out position from the adhesive application device. The second transfer arm 9 is controlled to synchronize with the first transfer arm 4. That is, the disk substrate take-out operation is performed simultaneously with the take-out operation of the first transfer arm 4, and the disk substrate supply operation is performed simultaneously with the supply operation of the first transfer arm 4. The operation of returning to the disk substrate take-out position is performed simultaneously with the return operation of the first transfer arm 4. Here, in order to increase the efficiency, the second transfer arm 9 is controlled to synchronize with the first transfer arm 4, but needless to say, it is not always necessary to synchronize.

  The sampling device 10 is a device for obtaining a disk substrate for sampling, and has a function of receiving a small-diameter disk substrate and a large-diameter disk substrate before film formation from the first transfer arm 4, and a small-diameter after film formation. It has a function of receiving the disk substrate and the large-diameter disk substrate from the second transfer arm 9 and a function of enabling the received disk substrate to be safely taken out by these functions.

  The reversing device 11 has a mechanism for receiving the small-diameter disk substrate from the second transfer arm 9, a mechanism for directing the adhesive application surface of the small-diameter disk substrate facing upward, and the small-diameter disk substrate to the disk receiving portion of the table device 12. And a mechanism to be inserted into the center pin of the mounting table. By the reversing device 11 and the second transfer arm 9, the small-diameter disk substrate and the large-diameter disk substrate are fitted into the center pin with the adhesive interposed.

  The table device 12 has a disk-shaped rotary table. A mounting table on which a large-diameter disk substrate is placed is provided on the rotary table. A center pin is provided at the center of the mounting table. In the example shown in FIG. 1, four sets of the mounting table and the center pin are provided on the rotary table. The table device 12 has a function of rotating the rotary table and moving the placement table on which the disc substrate is placed to each of the disc receiving unit, the vacuum bonding device 13, the adhesive curing device 14, and the disc ejecting unit. is doing. From the structure of the table device 12, the set of the mounting table and the center pin is preferably 4 sets in consideration of efficiency, but may be 3 sets or less or 5 sets or more.

  The vacuum bonding device 13 bonds the small-diameter disk substrate fitted into the center pin and the large-diameter disk substrate. The second transport arm 9 and the reversing device 11 are caused by a handling error of the transporting device such as the take-out arm, the first transport arm 4, the second transport arm 9, and the reversing device 11 described above. Therefore, only one of the small-diameter disk substrate and the large-diameter disk substrate may be fitted into the center pin. In such a case, the vacuum bonding apparatus 13 does not bond the small diameter disk substrate and the large diameter disk substrate.

  In the disk substrate bonding step, the disk substrate coated with the adhesive by the adhesive coating device is bonded by the vacuum bonding device 13 (step S5). The disk substrate bonded by the vacuum bonding device 13 is conveyed to the adhesive curing device 14 by the rotary table.

  The adhesive curing device 14 has a mechanism for curing the adhesive between the disk substrates and a mechanism for blowing nitrogen gas to the outer periphery of the disk substrate. When the adhesive is an ultraviolet curable adhesive, the mechanism for curing the adhesive is, for example, a mechanism for irradiating the surface of the small-diameter disk substrate with UV light to cure the adhesive between the disk substrates, UV light Is formed by a mechanism that does not leave the area where irradiation is necessary, a polyhedral or cylindrical reflection mechanism for uniformly irradiating the irradiation necessary surface with UV light, and a mechanism that performs UV irradiation while raising or lowering the small-diameter disk substrate.

  Even when only one of the small-diameter disk substrate and the large-diameter disk substrate is transported from the vacuum bonding apparatus 13 due to a handling error of the transport device described above, the adhesive curing device 14 applies the adhesive. When the prepared disk substrate is supplied, the adhesive of the disk substrate is cured.

  In the adhesive curing step, the adhesive present in the two disk substrates bonded by the vacuum bonding apparatus 13 is cured by the adhesive curing apparatus 14 (step S6). The disk substrate whose adhesive has been cured by the adhesive curing device 14 is moved to the disk substrate take-out portion of the table device 12 by the rotary table, and taken out from the table device 12 by the take-out arm 15.

  The take-out arm 15 includes a mechanism for taking out the disk substrate from the disk substrate take-out portion of the table device 12, a mechanism for supplying the disk substrate to the reversing arm 16, a mechanism for receiving the disk substrate from the reversing arm 16, and a discarding unit 17. And a mechanism for moving the disk substrate to the ejection device 18.

  The reversing arm 16 has a mechanism for receiving the disk substrate from the take-out arm 15, a mechanism for turning the held disk substrate, and a mechanism for passing the disk substrate to the take-out arm 15.

  The discarding unit 17 has a mechanism for stacking, for example, about 0 to 100 disk substrates and a mechanism for manually pulling out and taking out the stacked disk substrates.

  The discharge device 18 has a mechanism for delivering a disk substrate to a carry-out device 19 that performs the next process (post-processing process).

  The disk substrate taken out from the table device 12 by the take-out arm 15 is transferred to the reversing arm 16 and reversed by the reversing arm 16. A disk substrate that has not been processed normally, such as a disk substrate in which the adhesive has been cured without being bonded due to a handling error of the transfer device described above, is moved to the disposal unit 17 by the reversing arm 16, Stacked as a waste disk substrate. The disk substrate that has been processed normally is transferred from the reversing arm 16 to the taking-out arm 15.

  The take-out arm 15 supplies the disk substrate received from the reversing arm 16 to the discharge device 18, and the discharge device 18 supplies the disk substrate received from the take-out arm 15 to the carry-out device 19. The unloading device 19 performs post-processing such as disk inspection (step S7), and unloads the manufactured optical disk (step S8).

  Here, the bonding of the small-diameter disk substrate and the large-diameter disk substrate described above will be described in detail. The small-diameter disk substrate and the large-diameter disk substrate to be bonded have, for example, a planar annular shape shown in FIG. Note that the disk substrate 20 shown in FIG. 3A is an example of a small-diameter disk substrate, and the disk substrate 21 shown in FIG. 3B is an example of a large-diameter disk substrate.

  The outer shapes d1 and d2 of the disk substrate 20 and the disk substrate 21 are both 60 mm, and the thicknesses t1 and t2 of the disk substrate 20 and the disk substrate 21 are both 0.4 mm. The inner diameter d2 of the disk substrate 20 is 11 mm, and the inner diameter d4 of the disk substrate 21 is 13 mm. Thus, by making the inner diameters different between the disk substrate 20 and the disk substrate 21 to be bonded together, for example, a chucking metal fitting can be easily attached. The weights of the disk substrate 20 and the disk substrate 21 are both about 1.2 g.

  As described above, the transfer arm 9 fits the large-diameter disk substrate, that is, the disk substrate 21, into the center pin provided on the mounting table of the table device 12, and the small-diameter disk substrate, that is, the disk substrate 20, the reversing device 11. To supply. The reversing device 11 reverses the disk substrate 20 supplied from the transfer arm 9 and then fits the center pin into which the disk substrate 21 is inserted.

  The transport arm 9 holds and transports the disk substrate 20 and the disk substrate 21 by, for example, a mechanism shown in FIG. That is, one end side of the transfer arm 24 is fixed to the arm drive unit 23 that can rotate and move up and down the transfer device body 22. On the other end side of the transfer arm 24, an air chuck 26 and a pusher ring 27 for holding the disk substrate 25 and releasing the held disk substrate 25 are provided. Here, the disk substrate 25 is a small diameter disk substrate or a large diameter disk substrate.

  FIG. 5 is a perspective view of the vicinity of the air chuck 26 and the pusher ring 27. The air chuck 26 is, for example, a rotary drive type air chuck. As shown in FIG. 6, the air chuck 26 has three drive portions 28 and can open and close three chuck claws 29 provided in each drive portion 28. It is made into the composition. The air chuck 26 has a configuration in which, for example, the chuck claw 29 is expanded by applying air pressure, and the chuck claw 29 is narrowed by removing air. The drive unit 28 is not limited to the rotary drive type air chuck, and may be driven by another drive mechanism such as a mechanical chuck.

  Each of the chuck claws 29 has a linear bar shape, and is provided so as to be arranged in parallel and evenly. The disk substrate 25 is held at a portion where these are arranged in parallel and evenly.

  When the chuck claws 29 are narrowed, the three chuck claws 29 are inserted into the center hole of the disk substrate 25, and when the chuck claws 29 are widened, the three chuck claws 29 are inserted into the center hole of the disk substrate 25. It is set as the structure which is not inserted in.

  Therefore, the three chuck claws 29 are inserted into the center hole of the disk substrate 25 in a state where the chuck claws 29 are narrowed by the air chuck 26, and then the three chuck claws 29 are widened, whereby the disk substrate 25. The inner wall of the center hole can be evenly pressurized outward to hold the disk substrate 25. Further, since the chuck claw 29 has a linear bar shape, the holding disk substrate 25 can be separated by loosening the pressure applied to the inner wall of the center hole of the disk substrate 25. Since the disk substrate 25 is separated along the chuck claw 29, the chuck claw 29 functions as a guide when the disk substrate 25 is separated. The disk substrate 25 held by the chuck claw 29 may be moved and released so as to narrow the chuck claw 29. However, in order to function accurately as a guide, the chuck claw 29 is not moved only by loosening the pressure. It is preferable.

  The chuck claw 29 is not limited to the configuration shown in FIG. 5 and FIG. 6, and may be any other as long as it can hold the disk substrate 25 and functions as a guide when the held disk substrate 25 is released. It may be configured as follows. For example, the number of drive units 28 and chuck claws 29 is three in order to improve the reproduction of the position accuracy, but is not limited to this. Further, for example, the shape of the chuck claw 29 is not limited to a straight bar shape, and may be a curved shape in the middle or a plate shape curved along the center hole of the disk substrate 25. Good.

  The pusher ring 27 can be moved up and down by the pusher air cylinder 30 in the direction of the arrow shown in FIG. 5, that is, along the chuck claw 29 of the portion holding the disk substrate 25. For example, when the switch is turned on, the pushering air cylinder 30 is lowered to a predetermined position where the pusher ring 27 pushes the disk substrate 25, and when the switch is turned off, the pusher ring 27 moves the disk substrate 25. It is set as the structure which raises to the predetermined | prescribed position hold | maintained. The pusher ring 27 is for pushing out the disk substrate 25 when the held disk substrate 25 is released, and has a ring shape that uniformly presses the vicinity of the center hole of the disk substrate 25.

  The shape of the pusher ring 27 is not limited to the shape shown in FIG. 5, and the pusher ring 27 may have a shape other than the annular shape as long as the held disk substrate 25 can be pushed out with an equal pressure. There may be. The pusher ring 27 is not limited to the pushering air cylinder 30 and may be configured to move up and down by another power source such as a motor.

  7 and 8 show an example of the shape of the center pin into which the disk substrate 20 and the disk substrate 21 are inserted. The center pin 31 has a notch 32 into which the above-mentioned three chuck claws 29 are respectively inserted at the tip. Further, the tip is reduced in a stepped shape. Therefore, the center pin 31 has a two-stage pin configuration. The disk substrate 20 fitted into the center pin 31 and the disk substrate 21 are configured such that their main surfaces are parallel to each other. The disk substrate 21 fitted in the center pin 31 is supported by the placement surface.

  A disk substrate 21 is inserted into a lower pin (hereinafter referred to as a lower pin) of the diameter A, and a disk substrate 20 is inserted into an upper pin (hereinafter referred to as an upper pin) of the diameter B.

  The diameter A of the lower pin is configured to be a value slightly smaller than the inner diameter of the disk substrate 21, for example, about 5 μm. Similarly, the diameter B of the upper pin is configured to be a value slightly smaller than the inner diameter of the disk substrate 20, for example, about 5 μm. Thus, the centering can be easily performed so that the eccentricity is within the allowable range by simply fitting the disk substrate 20 and the disk substrate 21 into the center pin 31.

  A taper 33 is provided at the tip of the upper pin so that the disk substrate 20 can be easily inserted. As shown in FIG. 9, a taper 34 is provided at the end of the lower pin so that the disk substrate 21 fitted into the lower pin, that is, the disk substrate 21 can be easily fitted. The horizontal length L1 of the taper 34 is set to be within an allowable shift amount of positioning in a general transfer arm using an air cylinder, a motor, or the like, for example, about 0.2 mm.

  When the disk substrate 20 and the disk substrate 21 are bonded together, first, the disk substrate 21 is inserted into the center pin 31 as shown in FIGS. That is, as shown in FIG. 10, first, a narrowed chuck claw 29 is inserted into the center hole of the disk substrate 21 from the application surface side of the adhesive 35, and the inserted chuck claw 29 is spread and pressed outward. Then, the inner wall of the center hole of the disk substrate 21 is pressed outward to hold the disk substrate 21. At this time, the pusher ring 27 is raised. The adhesive 35 is spread over the main surface on the bonding surface side by a normal spin coating, that is, dropped by a nozzle near the center of the main surface of the disk substrate 21 as shown in FIG. Is widened by rotating at high speed, and becomes thicker from the inner peripheral side toward the outer peripheral side.

  When the disk substrate 21 is held, as shown in FIG. 11, the held disk substrate 21 is provided on the mounting table 36 of the disk substrate receiving portion of the table device 12 by the arm driving unit 23 of the transfer device main body 22 described above. The center pin 31 is transported to the upper part and positioned so that the center pin 31 and the center hole of the disk substrate 21 are concentric. At this time, the inner diameter of the disk substrate 21 is set within the taper 34 of the center pin 31.

  The center pin 31 is fitted on the mounting surface of the mounting table 36 provided on the rotary table 37 of the table device 12 so as to be movable in the vertical direction with respect to the mounting surface. The center pin 31 is configured to be movable up and down in the axial direction by an input / output mechanism such as an air cylinder (not shown). The center pin 31 is normally raised to a predetermined position, and is configured to be lowered to a predetermined position by pressing the tip portion. For example, the center pin 31 is raised to a predetermined position by the pressure of air generated by driving the air cylinder, and is lowered to a predetermined position by stopping the driving. The center pin 31 is not limited to an air cylinder, and may be configured to move up and down by other power sources such as a motor and a spring.

  The rotary table 37 is a disk-shaped table that rotates around a central rotation axis (not shown). Although the rotary table 37 is not limited to a disk shape, it is preferable to make the table surface circular because it rotates around the center of the table surface. The mounting table 36 is a disk-shaped table on which the disk substrate 21 provided on the rotary table 37 is mounted. The mounting table 36 is not limited to a disk shape, but since the disk substrate 21 is mounted on the table surface, the table surface is preferably circular. The mounting table 36 may be integrated with the rotary table 37.

  After the disk substrate 21 is positioned, as shown in FIG. 12, the arm driving unit 23 of the transport device body 22 lowers the transport arm 24 until just before the disk substrate 21 enters the center pin 31 to cut the center pin 31. The chuck claw 29 is inserted into the notch 32.

  When the chuck claw 29 is fitted into the notch 32, the pressure applied to the inner wall of the center hole of the disk substrate 21 is released by the air chuck 26 in order to hold the disk substrate 21. At this time, the holding force of the disk substrate 21 by the air chuck 26 is lost, but the chuck claw 29 hardly moves at the position as it is, and since the weight of the disk substrate 21 is light, the disk substrate 21 remains as it is. Hold in posture. At this time, even if the disk substrate 21 falls, no particular problem occurs.

  When the pressure of the chuck claw 29 by the air chuck 26 is relaxed, the pusher ring 27 is lowered by the pushering air cylinder 30 and the disk substrate 21 is pushed out. The disk substrate 21 descends straight to the taper 34 of the center pin 31 with the chuck claw 29 as a guide.

  Here, when the center pin 31 and the inner diameter of the disk substrate 21 are slightly deviated from, for example, 0.2 mm, the disk substrate 21 is guided by the taper 34 of the center pin 31 to be aligned in the horizontal direction. To do. At this time, the air of the air chuck 26 is released, and the force for restricting the horizontal movement of the disk substrate 21 is weak. Therefore, the chuck claw 29 loses the movement of the disk substrate 21 and As much as necessary for alignment. Therefore, the disk substrate 21 is not subjected to much stress from the chuck claws 29, so that it is aligned with the center pin 31 and inserted to the back without being damaged by cracks or dents.

  As a result, as shown in FIG. 13, the disk substrate 21 is fitted into the center pin 31 and placed on the placement table 36.

  When the disk substrate 21 is inserted into the center pin 31, the pusher ring 27 is raised and returned to the original position by the pushering air cylinder 30, and the transfer arm 9 is raised. As described above, as shown in FIG. 14, the disk substrate 21 is fitted into the center pin 31, and the placement of the disk substrate 21 on the placement table 36 is completed.

  The disk substrate 21 is inserted into the center pin 31 because the chuck claw 29 is used as a guide to the center pin 31, so that there is almost no gap between the disk substrate 21 inserted into the center pin 31 in order to reduce eccentricity. In addition, even when the taper 34 is not sufficiently provided at the end of the center pin 31 into which the disk substrate 21 is inserted, the disk substrate 21 can be easily and reliably centered. .

  The disk substrate 20 is held by the transfer arm 9 in the same manner as the disk substrate 21 and is transferred to the reversing device 11. The reversing device 11 fits the disk substrate 20 transported from the transport arm 9 into the center pin 31 in which the disk substrate 21 has already been inserted, as shown in FIGS.

  That is, as shown in FIG. 16, first, the main surface of the disk substrate 20 on which the adhesive 38 is not applied is sucked by the vacuum pad 40 provided at the end of the transfer arm 39 of the reversing device 11. Hold. The adhesive 38 is spread over the main surface on the bonding surface side by a normal spin coat, that is, dropped by a nozzle near the center of the main surface of the disk substrate 20 as shown in FIG. Is widened by rotating at high speed, and becomes thicker from the inner peripheral side toward the outer peripheral side.

  The vacuum pad 40 is a suction port connected to a vacuum source (not shown), and holds the inner periphery of the disk substrate 20 by suction of the vacuum source. The reversing device 11 is not limited to the one that holds the disk substrate 20 by vacuum suction in this way, and may be configured to hold the disk substrate 20 by another holding mechanism such as a mechanical chuck.

  When the disk substrate 20 is held, as shown in FIG. 17, the held disk substrate 20 is reversed so that the adhesive 38 faces downward by the reversing mechanism of the reversing device 11 (not shown), and the reversed disk substrate 20 is It is conveyed to the upper part of the center pin 31 and positioned so that the center pin 31 and the center hole of the disk substrate 20 are concentric. At this time, the inner diameter of the disk substrate 20 is set within the taper 33 of the center pin 31. Since the taper 33 can be larger than the taper 34, even the reversing device 11 using a general transfer arm 39 can be easily positioned.

  When the disk substrate 20 is positioned, as shown in FIG. 18, the suction of the air that has been performed to hold the disk substrate 20 is switched to ejection, the disk substrate 20 is stopped holding, and the disk substrate 20 is removed from the reversing device 11. The disk substrate 20 is inserted into the center pin 31. Note that the disk substrate 20 may be separated only by stopping air suction.

  When the disk substrate 20 is inserted into the center pin 31, the reversing device 11 is moved to the original position. Thus, as shown in FIG. 19, the disk substrate 20 is inserted into the center pin 31 in which the disk substrate 21 is inserted, and the centering of the disk substrate 20 is completed. That is, the disk substrate 20 and the disk substrate 21 are concentrically on the mounting table 36 so that the adhesive 35 and the adhesive 38 spread on the bonding surfaces of the disk substrate 20 and the disk substrate 21 face each other. It is arranged to become.

  Thus, by providing a reduced diameter portion on the distal end side of the center pin 31 and inserting the disk substrate 20 having a small inner diameter into the reduced diameter portion to perform centering, the disk substrate 20 and the disk substrate 21 having different inner diameters are provided. Even in the case where the disk substrates are bonded together, the center positions of the disk substrate 20 and the disk substrate 21 can be reliably and stably aligned with a relatively simple mechanism.

  When the disk substrate 20 and the disk substrate 21 are inserted into the center pin 31, the disk substrate 20 and the disk substrate 21 are transported to the vacuum bonding apparatus 13 by the table device 12. FIG. 21 shows an example of the configuration of the vacuum bonding apparatus 13.

  The vacuum bonding apparatus 13 includes a chamber 41, an air passage 42, an intake valve 43, a vent valve 44, a pusher shaft 45, a motor 46, a pusher 47, and a seal member 48. The vacuum bonding apparatus 13 controls the pressure in the sealed space where the disk substrate 20 and the disk substrate 21 are bonded to each other, moves the center pin 31, and moves the disk substrate 20 and the disk substrate 21. And a mechanism for pasting together.

  The chamber 41 is a member that partitions the space for bonding from the outside, and can be brought into contact with and separated from the table device 12 side. Note that the table device 12 side may be movable toward and away from the chamber 41 side. A seal member 48 such as an O-ring is provided between the chamber 41 and the table device 12, and closes the gap between the chamber 41 and the table device 12 side when the chamber 41 is closed to the table device 12 side. It is structured.

  The chamber 41 is provided with an air passage 42, and the inside of the chamber 41 and an intake port of an intake device (not shown) communicate with each other through the air passage 42. The intake valve 43 provided in the air passage 42 is a valve for adjusting the ventilation state between the chamber 41 and an intake port of an intake device (not shown). The air passage 42 further communicates with outside air through a vent valve 44. The ventilation valve 44 is a valve for adjusting the ventilation state between the inside of the chamber 41 and the outside air.

  A pusher shaft 45 is fitted into the chamber 41 at a portion facing the center pin 31. One end of the pusher shaft 45 outside the chamber 41 is connected to the motor 46. The pusher shaft 45 moves in the axial direction of the center pin 31 by the rotation of the motor 46. A pusher 47 is provided at the other end of the pusher shaft 45 in the chamber 41. The pusher 47 has a center pin 31 and a pressing surface that presses the disk substrate 20 fitted in the center pin 31 and the disk substrate 21 toward the table device 12 with a uniform pressure. Here, the pusher shaft 45 and the pusher 47 are separated from each other, but the pusher shaft 45 and the pusher 47 may have an integral structure.

  The vacuum bonding apparatus 13 has a structure in which the center pin 31 moves by pressing the tip of the center pin 31 by a motor 46, a pusher shaft 45, and a pusher 47. The pressing of the tip of the center pin 31 is not limited to those using the motor 46, the pusher shaft 45, and the pusher 47. For example, the power used for pressing is not limited to the motor, and an air cylinder is used. A structure using other power may be used.

  By pressing the tip of the center pin 31, the center pin 31 is moved in the direction of pulling out the disk substrate 20 and the disk substrate 21 fitted in the center pin 31, and the bonded surface of the disk substrate 20 and the disk substrate 21 are moved. The bonded surface is in close contact, and the disk substrate 20 and the disk substrate 21 are bonded together. Since the center pin 31 is configured so that the center hole of the inserted disk substrate 20 and the center hole of the disk substrate 21 are concentric, the bonded structure allows the disk substrate 20 and the disk substrate 21 to be connected to each other. It can be accurately aligned and pasted.

  When the chamber 41 is closed to the table device 12 side by the seal member 48, the intake valve 43, and the ventilation valve 44, the space in the chamber 41 can be sealed. With the chamber 41 closed, the intake valve 43 is opened, and air is sucked in by an intake device (not shown), whereby the space in the chamber 41 can be decompressed and brought into a vacuum state. In addition, by closing the intake valve 43 and opening the vent valve 44 from such a reduced pressure state, the pressure in the space in the chamber 41 can be returned to the original normal state. That is, the vacuum bonding apparatus 13 can control the pressure in the sealed space in the chamber 41 where the disk substrate 20 and the disk substrate 21 are bonded.

  Here, with reference to the flowchart shown in FIG. 22, an example of the flow of the bonding process by the vacuum bonding apparatus 13 will be described.

  In a state before the bonding process, the chamber 41 is in an open state. The pusher 47 is in a retracted state with respect to the center pin 31 side. The disk substrate 20 and the disk substrate 21 fitted in the center pin 31 are supplied by the rotary table 37, and preparation for bonding is completed.

  When preparation for bonding is completed, the chamber 41 is closed (step S11). When the chamber 41 is closed and the inside of the chamber 41 is sealed, the intake valve 43 is opened, and the air in the chamber 41 is sucked by an intake device (not shown). Thereby, the inside of the chamber 41 is decompressed and this state is maintained (step S12). Specifically, the pressure in the chamber 41 is set to 10 Pa to 300 Pa, and the state is held for 1 second to 2 seconds.

  When the pressure in the chamber 41 is maintained, the pusher 47 protrudes toward the table device 12 side. As a result, the center pin 31 is immersed in the rotary table 37 and the bonded surface of the disk substrate 20 and the bonded surface of the disk substrate 21 are joined (step S13). The protrusion of the pusher 47 will be described in detail later.

  When the pusher 47 protrudes and the disk substrate 20 and the disk substrate 21 are bonded together, the intake valve 43 is closed and the vent valve 44 is opened. Thereby, the inside of the chamber 41 is ventilated, and the pressure in the chamber 41 becomes normal (step S14).

  After venting the chamber 41, the chamber 41 is opened, and the pusher 47 is retracted to the original position before bonding (step S15). The bonded disk substrate 20 and disk substrate 21 are supplied by the rotary table 37 to the adhesive curing device 14 for performing the next process, that is, the adhesive curing process.

  When only the disk substrate 20 is inserted into the center pin 31 due to a conveyance failure or the like, the table device 12 does not move the center pin 31, and the uncured adhesive 38 is placed on the mounting table 36 of the table device 12. Avoid sticking to etc. In this case, the vacuum bonding apparatus 13 is transported to the adhesive curing apparatus 14 with the disk substrate 20 inserted into the center pin 31, and the adhesive 38 is cured.

  Here, the pusher 47 of the vacuum bonding apparatus 13 described above will be described in detail. FIG. 23 shows an example of the configuration of the pusher 47. Here, the housing portion is omitted for ease of explanation. The pusher 47 is configured to press the outer peripheral portion of the disk substrate 20 disposed on the mounting table 36 stepwise in the radial direction from the outer peripheral side toward the mounting table 36. A double ring structure.

  The outer peripheral ring 51 has an annular pressing surface that presses the outer side of the outer peripheral portion of the main surface, and the inner peripheral ring 52 has an annular pressing surface that presses the inner side of the outer peripheral portion of the main surface. ing. The outer ring 51 and the inner ring 52 that press the main surface of the disk substrate 20 preferably have an annular pressing surface, but are particularly limited as long as the outer periphery of the main surface can be pressed uniformly. For example, it is good also as a structure which has arrange | positioned the press part equally on the same periphery. Further, the inner and outer diameters of the annular pressing surfaces of the outer ring 51 and the inner ring 52 take into account the shape of the disk substrate 20 and the disk substrate 21, the thickness of the adhesive 35 and the adhesive 38, the viscosity, and the like, respectively. To an appropriate value.

  The ring on the pressing surface of the outer ring 51 and the ring on the pressing surface of the inner ring 52 are concentric, and a pressing pin 53 for pressing the center pin 31 is provided at the center of the ring. It has been. The shape of the portion of the pressing pin 53 that presses the center pin 31 is not particularly limited as long as the center pin 31 can be pressed with a uniform force.

  The outer peripheral ring 51, the inner peripheral ring 52, and the pressing pin 53 are supported by a fixing portion 57 to which the pusher shaft 45 is attached by a spring portion 54, a spring portion 55, and a spring portion 56, respectively. The spring portion 54, the spring portion 55, and the spring portion 56 are respectively a guide mechanism that moves the outer peripheral ring 51, the inner peripheral ring 52, and the pressing pin 53 in a direction perpendicular to the main surface of the disk substrate 20, a coil spring, a leaf spring, and the like. And an elastic mechanism for giving an elastic force in a direction perpendicular to the main surface of the disk substrate 20. Note that the elastic mechanism of the spring part 54, the spring part 55, and the spring part 56 is not limited to a spring, and may be constituted by another elastic body, air, or the like as long as a predetermined elastic force can be obtained. It may be configured to use pressure such as oil.

  The spring portion 56 is provided, for example, at a central portion of the push pin 53, and the spring portion 54 and the spring portion 55 are, for example, on the side facing the fixing portion 57 of the outer ring 51 and the inner ring 52, respectively. Three portions are equally provided so that the elastic force to the pressing surface is uniform. That is, it is a three-point support. In addition, the arrangement position and the number of the spring portions 54, the spring portions 55, and the spring portions 56 are not particularly limited.

The elastic force of the outer peripheral ring 51 by the elastic mechanism is configured to be weaker than the elastic force of the inner peripheral ring 52. The elastic force of the outer peripheral ring 51 is, for example, 50 gf / cm ² , and the elastic force of the inner peripheral ring 52 is, for example, 200 gf / cm ² . The elastic force of the pressing pin 53 by the elastic mechanism is relatively strong enough to push down the center pin 31.

  Further, when the fixing portion 57 attached to the pusher shaft 45 is lowered by the motor 46, the pressing pin 53 and the outer ring 51 come into contact with the center pin 31 and the main surface of the disk substrate 20, respectively. The inner ring 52 projects from the main surface side of the disk substrate 20 so that the inner ring 52 contacts the main surface of the disk substrate 20.

  Here, the pressing of the center pin 31 by the pusher 47 will be described in detail with reference to FIGS. Here, the housing portion is omitted for ease of explanation.

  First, as shown in FIG. 24, the rotary table 37 is positioned so that the pressing pin 53 of the pusher 47 and the center pin 31 are located concentrically. This positioning is performed, for example, when the disk substrate 20 and the disk substrate 21 inserted into the center pin 31 by the rotary table 37 are transported to the vacuum bonding apparatus 13.

  When the rotary table 37 is positioned, the pusher 47 is lowered by the length L2 until the center pin 31 hits the stopper 58 by the motor 46 and the pusher shaft 45, and is raised again to the original position. The length L2 of the movement distance of the center pin 31 is the disk substrate 20 inserted in the center pin 31 when the center pin 31 is at the position of the solid line in the drawing, that is, when it is pushed up to the top. A gap is provided between the bonding surface of the disk substrate 21 and the bonding surface of the disk substrate 21. When the center pin 31 is at the position of the broken line in the drawing, that is, when the center pin 31 is pushed down to the bottom, the center pin is The bonding surface of the disk substrate 20 fitted in 31 and the bonding surface of the disk substrate 21 are in close contact with each other, and the center hole of the disk substrate 21 is set in a range that does not come off from the lower pin of the center pin 31. Yes.

  By lowering the pusher 47, first, as shown in FIG. 25, the outer peripheral ring 51 comes into contact with the main surface of the disk substrate 20, the contacted portion is pressed and bent, and the disk substrate 20 seems to be lying down. Shape. That is, the main surface of the disk substrate 20 has a curved shape. Further, the bonding surface of the disk substrate 20 and the bonding surface of the disk substrate 21 are first brought into line contact on the outer periphery. The pressing by the outer peripheral ring 51 is performed at a relatively low pressure sufficient to perform line contact.

  Further, when the pusher 47 is lowered and the center pin 31 is pushed down, as shown in FIG. 26, the inner peripheral ring 52 comes into contact with the main surface of the disk substrate 20, and the contacted portion is pressed. Since the bonding surface of the disk substrate 20 has a curved surface shape, the adhesive 38 of the disk substrate 20 is pressed with the adhesive 35 of the disk substrate 21 from the outer peripheral end toward the inner periphery by pressing the inner peripheral ring 52. Contact. Note that the pressure by the inner ring 52 is higher than the pressure by the outer ring 51, which is suitable for uniformizing the thickness of the portion where the outer peripheral side thickness of the adhesive 35 and the adhesive 38 is thick. Done. Thus, the adhesive layer 59 formed by synthesizing the adhesive 35 and the adhesive 38 is flattened.

  The disk substrate 20 and the disk substrate 21 are bonded together by lowering the center pin 31 to the stopper 58. When the pusher 47 is lowered and the center pin 31 is moved to the stopper 58, the pusher 47 is raised to a predetermined position. As described above, as shown in FIG. 27, it is possible to obtain a good bonded disc 60 in which mixing of bubbles is suppressed and thickness unevenness of the adhesive layer 59 is improved.

  The thickness t3 of the adhesive layer 59 of the bonded disc 60 is, for example, about 40 μm to 50 μm. Further, the outer diameter d5 of the mounting table 36 is smaller than the outer diameter d1 of the bonding disk 60 so that the adhesive of the adhesive layer 59 does not stick to the mounting table 36 when it protrudes to the outer peripheral portion. For example, when the outer diameter of the bonded disc 60 is 60 mm, it is preferably 58 mm.

  The bonded disc 60 is conveyed by the table device 12 to the adhesive curing device 14 that performs the next adhesive curing step, and the adhesive layer 59 interposed between the disc substrate 20 and the disc substrate 21 is cured. For example, when the adhesive layer 59 is an ultraviolet curable resin, ultraviolet rays are irradiated. Thus, the bonding of the disk substrate 20 and the disk substrate 21 is completed.

  FIG. 28 is an enlarged view of an example of a cross-sectional configuration of the bonded disc 60. The bonded disk 60 has a two-layer structure of a reflective film (L0 layer) 61 on the disk substrate 20 side and a reflective film (L1 layer) 62 on the disk substrate 21 side. When the reproduction light is incident from the L0 layer side, the reflective film 61 is made of, for example, silicon, and the reflective film 62 is made of, for example, aluminum. When the reproduction light is incident from the L0 layer side and the L1 layer side, the reflective film 61 and the reflective film 62 are made of, for example, aminium.

  As described above, in the vacuum bonding apparatus 13, since the outer periphery of the disk substrate 20 is in line contact with the outer ring 51, the inner side of the outer periphery is pressed by the inner ring 52. At this time, bubbles mixed with the adhesive layer 59 are pushed out toward the inner peripheral side. Further, by pressing the inner side of the outer peripheral portion of the disk substrate 20 with an appropriate pressure by the inner peripheral ring 52, the thickness of the adhesive spread thickly from the inner peripheral portion toward the outer peripheral portion by spin coating is made uniform. be able to.

  Further, even when the outer diameter of the optical disk is as small as 60 mm, for example, or when the thickness is as thin as 0.4 mm, for example, it is only necessary to press the outer peripheral portion of the disk substrate 20 with the pusher 47. Thus, the thickness of the adhesive layer can be reliably and uniformly formed. Further, by appropriately setting the pressing force by the outer peripheral ring 51 and the inner peripheral ring 52, the thickness of the outer peripheral portion can be adjusted accurately and easily.

  Here, the results when a bonded optical disk is manufactured by actually applying the disk substrate bonding apparatus and bonding method according to an embodiment of the present invention will be described. First, a bonded optical disk to which one embodiment was applied was manufactured under the following conditions.

  The shapes of the disk substrate 20 and the disk substrate 21 were those shown in FIGS. 3A and 3B, respectively. In the spin coating, an ink (adhesive) having a viscosity of 600 cps was applied to each bonding surface of the disk substrate 20 and the disk substrate 21 at a rotation speed of 6000 rpm and a rotation time of 0.3 seconds.

Further, the peripheral ring 51, an annular region of φ51mm~φ58mm of the disk substrate 20 was pressurized with 50 gf / cm ^2, by the inner peripheral ring 52, an annular region of φ38mm~φ50mm of the disk substrate 20 at 200 gf / cm ² Pressurized. Moreover, the pressurization time at that time was 0.3 second.

  Next, in order to compare what was bonded according to one embodiment with what was pressed and bonded to the entire main surface of the disk, the annular region of φ20 mm to φ58 of the disk substrate 20 was made uniform at once. Another laminated optical disc was manufactured by pressing so that the thickness was uniformed by pressure.

  As a result of measuring the thickness of the adhesive layer 59 in the range of φ28 mm to φ58 mm in each optical disc, the thickness of the adhesive layer 59 is 35 μm to 55 μm in the optical disc in which the entire main surface of the disc is pressed and bonded. In contrast to the large variation, the optical disc bonded by applying one embodiment had a good thickness with a thickness of 37 μm to 47 μm and the adhesive layer 59 had a small variation. Moreover, the thing bonded together by one Embodiment suppressed mixing of a bubble.

  Therefore, in this disc substrate laminating apparatus and laminating method, the thickness of the adhesive layer 59 can be made uniform and the mixing of bubbles into the adhesive layer 59 can be suppressed, thereby producing a good optical disc. I found out that I could do it.

  The present invention is not limited to the above-described embodiment of the present invention, and various modifications and applications are possible without departing from the spirit of the present invention. For example, the numerical values given in the above-described embodiment are merely examples, and different numerical values may be used as necessary. In the above-described embodiment, the read-only optical disk has been described. However, the present invention is not limited to this, and the present invention can also be applied to a writable optical disk. Furthermore, the present invention can be applied not only to optical discs but also to other disc-shaped media.

It is a basic diagram which shows an example of a structure of the optical disk manufacturing apparatus to which one Embodiment is applied. It is a flowchart for demonstrating the flow of a process of an optical disk manufacturing apparatus. It is a figure which shows an example of the shape of a small diameter disc board | substrate and a large diameter disc board | substrate. It is a figure for demonstrating the arm for conveyance. It is a perspective view which shows an air chuck | zipper and a pusher ring. It is a perspective view which shows the lower side of an air chuck | zipper. It is a perspective view which shows a center pin. It is a figure which shows the upper surface and side surface of a center pin. It is a figure for demonstrating the taper of a center pin. It is a basic diagram which shows the state holding the large diameter disc board | substrate. It is a basic diagram which shows the state which positioned the large diameter disc board | substrate. It is an approximate line figure showing the state where a chuck nail was inserted in a center pin. It is a basic diagram which shows the state which lowered the pusher ring. It is a basic diagram which shows the state by which the large diameter disc board | substrate was inserted by the center pin. It is a figure for demonstrating the adhesive agent spread by a large diameter disc board | substrate by spin coating. It is a basic diagram which shows the state holding the small diameter disc board | substrate. It is a basic diagram which shows the state which positioned the small diameter disc board | substrate. It is a basic diagram which shows the state which released | separated the small diameter disc board | substrate. It is a basic diagram which shows the state by which the small diameter disc board | substrate and the large diameter disc board | substrate were inserted by the center pin. It is a figure for demonstrating the adhesive agent extended by a spin coat to a small diameter disc board | substrate. It is a basic diagram which shows an example of a structure of a vacuum bonding apparatus. It is a flowchart for demonstrating the flow of the process at the time of bonding operation | movement. It is a basic diagram which shows an example of a structure of a pusher. It is a basic diagram which shows the state before a pusher descend | falls. It is a basic diagram which shows the state in the middle of descent | fall of a pusher. It is a basic diagram which shows a state when a pusher is lowered | hung. It is a basic diagram which shows a state when a pusher is raised. It is a figure which shows an example of the cross-sectional structure of a bonding disc.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Reversing device 12 ... Table device 13 ... Vacuum bonding device 14 ... Adhesive curing device 20 ... Disc substrate (small diameter)
21 ... Disc substrate (large diameter)
31 ... Center pin 35, 38 ... Adhesive 36 ... Mounting table 37 ... Rotary table 39 ... Transfer arm 40 ... Suction pad 41 ... Chamber 45 ... Pusher shaft 46 ... Motor 47 ... Pusher 51 ... Outer ring 52 ... Inner ring 53 ... Presser pin 54, 55, 56 ... Spring part 57 ... Fixing part 58 ... Stopper 59 ... Adhesive layer 60 ... Laminated disc

Claims (3)

In the disk substrate bonding apparatus for bonding the first and second disk substrates in which the adhesive is spread on at least one bonding surface by spin coating,
A step-shaped center pin into which a first disk substrate and a second disk substrate having an inner diameter smaller than that of the first disk substrate are fitted;
Arrangement means for sequentially placing the first and second disk substrates into the center pin and arranging them on the mounting table so that the bonding surfaces of the first disk substrate and the second disk substrate face each other. When,
A disc substrate pasting method comprising: pressing means for stepwise pressing the outer peripheral portion of the second disc substrate arranged by the arranging means in a radial direction from the outer peripheral side toward the mounting table. Alignment device. In claim 1,
The stepwise pressing of the pressing means consists of two stages, an outer peripheral side and an inner peripheral side. After pressing the outer peripheral side, the inner peripheral side is pressed with a force stronger than the pressure pressing the outer peripheral side. An apparatus for laminating a disk substrate, comprising: In the laminating method of the disk substrate, the first and second disk substrates having different inner diameters, in which the adhesive is spread by spin coating on at least one laminating surface,
A step-shaped center pin into which the first disk substrate and the second disk substrate having an inner diameter smaller than that of the first disk substrate are fitted, and the first disk substrate and the first disk substrate are movable in the axial direction. Inserting the first and second disk substrates in sequence and placing them on the mounting table so that the bonding surfaces of the two disk substrates face each other;
A step of pressing the outer peripheral portion of the second disk substrate disposed on the mounting table in a stepwise manner in the radial direction from the outer peripheral side toward the mounting table. How to match.

Images