WO2005091284A1

WO2005091284A1 - Device and method for manufacturing recording medium

Info

Publication number: WO2005091284A1
Application number: PCT/JP2005/004588
Authority: WO
Inventors: Hideo Yamashita; Yoshitake Yanagisawa; Shigenori Aokage; Hiroyuki Sugimoto
Original assignee: Sony Disc & Digital Solutions Inc.
Priority date: 2004-03-19
Filing date: 2005-03-09
Publication date: 2005-09-29
Also published as: JP2007226846A

Abstract

A device and a method for manufacturing a recording medium, wherein the opening part of a disk substrate (25) is inserted onto the large diameter part of a center pin (23) and the disk substrate (25) is supported by a loading table (22). Also, the opening part of a disk substrate (26) is inserted onto the tip small diameter part of the center pin (23), and the disk substrate (26) is supported by a step part at a boundary between the small diameter part and the large diameter part. After the disk substrate (25) and the disk substrate (26) are supported, a sealed space is formed by a chamber (27), the inside of the chamber (27) is depressurized, and the center pin (23) is vertically moved by a plate (34) to stick the disk substrate (25) on the disk substrate (26).

Description

Description Recording medium manufacturing apparatus and manufacturing method

The present invention relates to an apparatus and a method for manufacturing a recording medium, and is suitably applied, for example, to the manufacture of a recording medium manufactured by laminating disk-shaped substrates having openings having different hole diameters. Background art

So-called optical discs such as MD (Mini Disc) and DVD (Digital Versatile Disc) are usually manufactured through the following steps. First, in a disk substrate molding process, a disk substrate is molded from a synthetic resin material such as polycarbonate by an injection molding method. Next, in a film forming step, a reflective film serving as a recording layer is formed by a sputtering method on the main surface of the disk substrate formed in the disk substrate forming step. For example, CDs (Compact Discs) and MDs are manufactured by providing a protective layer on the main surface of a disk substrate so as to cover the formed recording layer. The two-layer DVD is manufactured by bonding a dummy substrate to the substrate thus formed, and the two-layer DVD is formed by bonding two disk substrates each having a recording layer formed thereon with an adhesive layer serving as an intermediate layer.

Japanese Patent Laid-Open Publication No. 2002-197735 discloses that an ultraviolet-curing adhesive is uniformly applied to one surface of two disk substrates, the two disk substrates are bonded to each other, and ultraviolet light is irradiated. There is described an optical disk manufacturing apparatus that forms a bonding disk by curing an adhesive with the adhesive.

In the optical disk manufacturing apparatus described in Japanese Patent Application Laid-Open No. 2002-197735, a space-saving bonded disk that can reduce the required area can be manufactured. A production line can be configured.

However, the conventional manufacturing apparatus and manufacturing method for manufacturing a recording medium by bonding disk substrates as described above have the following problems. Bubbles are formed in the adhesive layer between the bonded disk substrates. There was a problem that it would remain. Therefore, it is preferable to reduce the pressure in the space where the disk substrates are bonded, and to bond the disk substrates together. However, in the conventional recording medium manufacturing apparatus and manufacturing method, during bonding, the upper disk substrate is held by a vacuum suction head, and the entire vacuum suction head is lowered to determine the position of the lower disk substrate. Since the center pin is pressed down and bonded to the lower disk substrate, it is difficult to perform bonding by reducing the pressure between the disk substrates to a vacuum state or the like.

Even if the space to be bonded is decompressed and the disk substrates are bonded together, if the disk substrates are bonded immediately (for example, within 3 seconds) after the evacuation for decompression starts, the disk substrate The probability that bubbles exceeding the allowable size and / or the allowable number remained in the adhesive layer between them was high.

Further, in the conventional recording medium manufacturing apparatus and manufacturing method, it is necessary to perform precise positioning of the upper disk substrate because the upper disk substrate and the center pin are fitted at the time of bonding. In addition, it is difficult to reduce the cycle time of the bonding operation because the fitting needs to descend and descend at the lowest possible speed.

Also, if there is a disk substrate that cannot be bonded due to a handling error of the disk substrate supply device, if the operation is continued as it is, the uncured adhesive will adhere to the handling part of the disk substrate, The disc substrate to be handled later could be contaminated with adhesive and become defective. When the operation is stopped, the operation cannot be performed until a person manually removes the disk substrate. However, the operating rate will deteriorate. Special gloves and protective glasses must be worn to handle disk substrates coated with uncured adhesive, making handling difficult. The disc substrate with uncured adhesive will be discarded, but a container (bag) that does not leak the uncured adhesive must be prepared separately from other disc substrates.

Accordingly, an object of the present invention is to provide an apparatus and a method for manufacturing a recording medium which can prevent bubbles from being generated in an adhesive between substrates to be bonded, shorten a cycle time, and are easy to handle. is there. Disclosure of the invention

In order to achieve the above-described object, a recording medium manufacturing apparatus according to the present invention includes a first substrate having an opening in the center of the main surface, and a first substrate having an opening in the center of the main surface. An apparatus for manufacturing a recording medium, comprising: bonding a second substrate having a small opening to a first substrate and Z or an adhesive applied to one main surface of the second substrate with an adhesive therebetween;

A center pin formed with a step at the boundary between the small diameter portion and the large diameter portion at the tip end, the center pin being capable of being vertically displaced through the opening of the mounting table;

A decompression unit that decompresses the sealed space where the bonding is performed,

The first substrate supported by the mounting table with the large-diameter portion of the center pin inserted into the opening, and the second substrate supported by the stepped portion with the tip of the center pin inserted into the opening. With the center pin displaced vertically.

An apparatus for manufacturing a recording medium, comprising:

The method of manufacturing a recording medium according to the present invention comprises: a first substrate having an opening at the center of the main surface; and a second substrate having an opening at the center of the main surface smaller than the opening of the first substrate. And the contact applied on one major surface of the first substrate and Z or the second substrate. A method for manufacturing a recording medium to be bonded with a bonding agent interposed therebetween,

Inserting the opening of the first substrate into the large-diameter portion of the center pin, and supporting the first substrate with a mounting table;

Inserting the opening of the second substrate into the small-diameter portion at the tip of the center pin, and supporting the second substrate by a step at the boundary between the small-diameter portion and the large-diameter portion;

A step of decompressing the sealed space where the bonding is performed,

A step of vertically displacing the center pin by the pressing portion and further pressing the second substrate by the pressing portion to bond the first substrate and the second substrate together;

A method for manufacturing a recording medium, comprising:

According to the present invention, the opening of the first substrate is inserted into the large-diameter portion of the center pin, the first substrate is supported by the mounting table, and the opening of the second substrate is connected to the end of the center pin. The second board is supported by the step at the boundary between the small-diameter section and the large-diameter section, and the center pin is displaced vertically to attach the first and second boards. The alignment makes it possible to easily and accurately position the first substrate and the second substrate during bonding. In addition, since the first substrate and the second substrate are not held by vacuum suction, the first substrate and the second substrate can be bonded to each other by reducing the pressure of the sealed space where bonding is performed. Air bubbles can be prevented from remaining in the adhesive interposed between the first substrate and the second substrate. Further, the first substrate and the second substrate can be brought close to each other before bonding, so that the cycle time can be reduced.

Therefore, according to the present invention, it is possible to provide a manufacturing apparatus and a manufacturing method of a recording medium which can prevent bubbles from being generated in an adhesive between disk substrates to be bonded, shorten a cycle time, and are easy to handle. Can be. Brief Description of Drawings FIG. 1 is a schematic diagram illustrating an example of a configuration of an optical disk manufacturing apparatus according to an embodiment of the present invention. FIG. 2 is a flowchart for explaining the flow of processing in the optical disk manufacturing apparatus. FIG. 3 is a schematic diagram illustrating an example of a cross-sectional structure near a vacuum bonding apparatus. FIG. 4 is a schematic diagram showing an example of a cross-sectional structure of a center pin. FIG. 5 is a schematic diagram showing an example of a cross-sectional structure of a disc substrate after bonding. FIG. 6 is a schematic diagram showing a state before a bonding process. FIG. 7 is a schematic diagram showing a state where the chamber is closed. FIG. 8 is a schematic diagram showing a state where the pressure in the chamber is reduced. FIG. 9 is a schematic diagram showing a state where the plate is projected. FIG. 10 is a schematic diagram showing a state where the plate is protruded. FIG. 11 is a schematic diagram showing a state where the ventilation valve is opened. FIG. 12 is a schematic diagram showing a state where the chamber is opened and the position of the plate is returned. FIG. 13 is a flowchart for explaining the flow of processing during the bonding operation. FIG. 14 is a schematic diagram showing an example of a configuration of an optical disk manufacturing apparatus to which the present invention can be applied. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an apparatus and a method for manufacturing a recording medium according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a schematic configuration of an example of an optical disk manufacturing apparatus according to an embodiment of the present invention. FIG. 2 is a flowchart for explaining the flow of processing in the optical disk manufacturing apparatus. Hereinafter, an apparatus and method for manufacturing a recording medium according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

The forming apparatus 1 has a cavity for forming two substrates. The cavity is composed of a mold that can be opened and closed, for example, a fixed mold and a movable mold. The molding apparatus 1 is composed of two flat annular substrates having the same outer diameter and different inner diameters (substrates 0 and 2) made of a synthetic resin material such as polycarbonate by an injection molding method. Form the substrate 1). A stamper for forming pits of different information is attached to one principal surface of each of the cavities for molding these two substrates, and these two planar annular substrates (hereinafter referred to as disk substrates). Are formed on one main surface by a fine dent transferred by a stamper so that a signal recording surface is provided.

In the substrate forming step, these two disk substrates are formed by the forming apparatus 1 (step S 1). The disk substrate formed by the forming device 1 is transferred to the cooling device 3 by the take-out device 2.

The take-out machine 2 has a take-out arm capable of holding a disk substrate. The unloader 2 controls this arm so as to synchronize with, for example, the opening and closing of the mold that constitutes the cavity of the molding device 1, and forms two disk substrates (a molded substrate 0 and a substrate 1). Hereinafter, simply referred to as two disk substrates) from the cavity and transported to the cooling device 3. It should be noted that efficiency can be improved by adopting a mechanism for simultaneously removing two disk substrates from the capity.

The cooling device 3 has a mechanism for receiving two disk substrates from the unloader 2. The efficiency can be improved by adopting a mechanism that receives two disk substrates at the same time. The cooling device 3 further includes a mechanism for cooling the disk substrate, a mechanism for storing a predetermined number of disk substrates (for example, 3 to 20), and a film forming apparatus for performing the next step (film forming step). There is a mechanism that adjusts the direction of the disk surface in a direction that matches the mechanism for adding the reflective film to the disk substrate, and a mechanism that adjusts the time and passes the disk substrate to the next process (film formation process) in the order in which it was loaded. are doing. For example, the time to pass the loaded disk substrate to the next process (film formation process) is the earliest time, the time for one cycle of substrate molding in the previous process (substrate molding process), and the latest time. The time is obtained by multiplying the cycle time of substrate molding by the number of storages that can be performed. In the cooling step, the disk substrate formed in the substrate forming step is cooled by the cooling device 3 (Step S2). The disk substrate cooled by the cooling device 3 is transferred to the film forming device by the first transfer arm 4. The substrate 0 is transported to the first film forming apparatus 5, and the substrate 1 is transported to the second film forming apparatus 6.

The first transfer arm 4 has a mechanism for taking out two disk substrates from the cooling device 3. The efficiency can be improved by adopting a mechanism for simultaneously taking out two disk substrates. Further, the first transfer arm 4 transfers the two disk substrates taken out to the film forming apparatus for performing the next process (film forming step), and returns to the position where the disk substrates are taken out from the cooling device 3. Has a mechanism. In addition, efficiency can be improved by using a mechanism that simultaneously transports two disk substrates, respectively.

Further, the first transfer arm 4 has a mechanism for supplying two disk substrates to the sampling device 10. In addition, efficiency can be improved by using a mechanism for simultaneously supplying two disk substrates. This mechanism is used when sampling a disk substrate before film formation.

Further, the first transfer arm 4 takes out the two disk substrates from the film forming apparatus, and transports the taken-out disk substrates to an adhesive applying apparatus for performing the next step (adhesive applying step). It has a mechanism to return to the position where the disk substrate is taken out of the film device. The substrate 0 taken out of the first film forming apparatus 5 is transported to the first adhesive applying apparatus 7, and the substrate 1 taken out of the second film forming apparatus 6 is supplied to the second adhesive applying apparatus 8. Transported to Note that efficiency can be improved by adopting a mechanism in which two disk substrates are simultaneously taken out from the film forming apparatus. In addition, efficiency can be improved by adopting a mechanism for simultaneously transporting two disk substrates to the adhesive application device.

The first transfer arm 4 has two discs, one from the cooling device 3 and the other from the film forming device. A mechanism that simultaneously takes out the disk substrate, a mechanism that simultaneously transports two disk substrates to the film forming device and the adhesive application device, and a two that returns to the removal position again after the disk substrate transport operation It has a mechanism to perform the return operation simultaneously. Here, in order to improve the efficiency, the first transfer arm 4 has a mechanism for simultaneously performing the take-out, transfer, and return operations of these two, but it goes without saying that the first transfer arm 4 does not necessarily need to be at the same time.

The first film forming apparatus 5 has a function of adding a reflective film of silicon, aluminum, silver, or the like to the signal (pit) transfer surface side of the substrate 0 by a sputtering method. In addition, the first film forming apparatus 5 has a function of receiving a transparent disk substrate before film formation from the first transfer arm 4, a function of transferring a film-formed disk substrate to the first transfer arm 4, and a sputtering method. It has the function of adjusting the pressure in the space where sputtering is performed to a pressure suitable for the sputtering conditions, and the function of moving the disk substrate to the space where sputtering is performed.

The second film forming apparatus 6 has a function of adding a reflective film of silicon, aluminum, silver, or the like to the signal (pit) transfer surface side of the substrate 1 by a sputtering method. In addition, the second film forming apparatus 6 has a function of receiving a transparent disk substrate before film formation from the first transfer arm 4, a function of passing a formed disk substrate to the first transfer arm 4, and a function of sputtering. It has the function of adjusting the pressure in the space where sputtering is performed to a pressure suitable for the sputtering conditions, and the function of moving the disk substrate to the space where sputtering is performed.

In the film forming process, a film forming process is performed on each of the two disk substrates cooled by the cooling device 3 using the film forming devices (Step S 3). The substrate 0 is subjected to a film forming process by a first film forming apparatus 5, and the substrate 1 is subjected to a film forming process by a second film forming apparatus 6. As described above, the substrate 0 after film formation is supplied to the first adhesive coating device 7 by the first transfer arm 4, and the substrate 1 is supplied to the second adhesive coating device 8 by the first transfer arm 4. Supplied respectively. The first adhesive application device 7 is located near the center of the substrate 0 on which the film has been formed (for example, if the center hole diameter is about Φ15 mm, it is around φ20πΗη to φ26ππιιη) Has a table provided with a mechanism for sucking and holding by vacuum. The first adhesive application device 7 applies an adhesive to a main surface to be a bonding surface of the substrate 0 by a spin coating method, and a table for holding the substrate 0 includes, for example, 3 0 r ρ π! A mechanism that rotates at a rotation speed in the range of 800 rpm, a mechanism that applies the adhesive with good position reproducibility near the center of the substrate 0, and a mechanism that returns the adhesive shaken off by rotation to the adhesive supply tank have. When the adhesive is applied only to the substrate 1 side, the table of the first adhesive application device 7 is used as a temporary table of the substrate 0.

The second adhesive application device 8 is provided in the vicinity of the center of the substrate 1 on which the film has been formed (for example, the diameter of the hole per center is </). (Approximately φ26 mm) by vacuum. The second adhesive application device 8 applies an adhesive onto the main surface to be bonded to the substrate 0 by a spin coating method, and a table holding the substrate 1 is, for example, 3 A mechanism that rotates at a rotation speed in the range of 0 rpm to 800 rpm, a mechanism that applies adhesive with good position reproducibility near the center of the substrate 1, and an adhesive that is shaken off by rotation is supplied to the adhesive It has a return mechanism. When the adhesive is applied only to the substrate 0 side, the table of the second adhesive applying device 8 is used as a temporary placing table of the substrate 1. In the example shown in Fig. 1, the substrate 1 side is used as a temporary storage table.

In the adhesive application step, the adhesive is applied to the two disk substrates on which the film formation has been performed by the film formation apparatus using the adhesive application apparatus (step S4). In the example shown in FIG. 1, the substrate 0 is coated with the first adhesive on the main surface to be the bonding surface. The adhesive is applied by the device 7, and the substrate 1 is placed on the temporary placing table. The substrate 0 to which the adhesive has been applied is supplied to the reversing device 11 1 by the second transfer arm 9, and the substrate 1 is supplied to the bonding table by the second transfer arm 9. It is supplied to the disk substrate receiving section of the device 12 respectively. The sampling disk substrate is supplied to the sampling device 10 by the second transport arm 9.

The second transfer arm 9 takes out the two disk substrates from the adhesive application device to perform the next process (disk substrate bonding process), and removes the removed disk substrates into a reversing device 11, It has a mechanism for supplying to the table of the disk substrate receiving section of the table device 12. Substrate 0 is supplied to reversing device 11. The substrate 1 is supplied to a disk substrate receiving portion of the table device 12 and is inserted into a center pin. The efficiency can be improved by adopting a mechanism for simultaneously taking out two disk substrates from the adhesive application device. Further, efficiency can be improved by using a mechanism for simultaneously supplying two disk substrates to the reversing device 11 and the table device 12 respectively.

Further, the second transfer arm 9 has a mechanism for supplying two disk substrates to the sampling device 10 located between the reversing device 11 and the disk temporary placing table. The efficiency can be improved by providing a mechanism for simultaneously supplying two disk substrates. This mechanism is used when sampling the disk substrate after film formation.

Further, the second transfer arm 9 has a mechanism for returning to a position where the disk substrate is taken out from the adhesive application device. The second transfer arm 9 is controlled to synchronize with the first transfer arm 4. That is, the operation of taking out the disk substrate is performed simultaneously with the operation of taking out the first transfer arm 4, and the operation of supplying the disk substrate is performed simultaneously with the operation of supplying the first transfer arm 4. Also, The operation of returning to the take-out position of the disk substrate is performed simultaneously with the operation of returning the first transfer arm 4. Here, the second transfer arm 9 is controlled so as to be synchronized with the first transfer arm 4 in order to improve efficiency. However, it is needless to say that the second transfer arm 9 does not always need to be synchronized.

The sampling device 10 is a device for acquiring a disk substrate for sampling, and has a function of receiving the substrate 0 and the substrate 1 before the film formation from the first transfer arm 4 and a substrate after the film formation. It has a function of receiving the straight 0 and the substrate 1 from the second transfer arm 9, and a function of enabling the disk substrate received by these functions to be safely taken out by hand.

The reversing device 11 1 is a mechanism for receiving the substrate 0 from the second transfer arm 9, a mechanism for turning the adhesive applied surface of the substrate 0 facing upward, and a substrate 0 for the disk of the table device 12. And a mechanism for supplying to the receiving portion and fitting to the center pin of the mounting table. The substrate 0 and the substrate 1 are fitted to the center pin by the reversing device 11 and the second transport arm 9 in a direction in which the adhesive is interposed.

The table device 12 has a disk-shaped rotary table. A mounting table on which the substrate 1 is mounted is provided on the rotary table. A center pin is provided at the center of the mounting table. In the example shown in FIG. 1, four sets of the mounting table and the center pin are provided on the rotary table. The table device 12 rotates the rotary table and moves the mounting table on which the disk substrate is mounted to the disk receiving portion, the vacuum bonding device 13, the adhesive curing device 14, and the disk removing portion, respectively. Has functions. The set of the mounting table and the center pin is preferably set to 4 sets in consideration of the efficiency of the structure of the table device 12, but may be set to 3 sets or less or 5 sets or more. . The vacuum bonding device 13 bonds the substrate 0 and the substrate 1 inserted into the center pin. The second transfer arm 9 and the second transfer arm 9 due to a handling error of the transfer device such as the removal arm of the removal machine 2, the first transfer arm 4, the second transfer arm 9, and the reversing device 11 described above. Due to the reversing device 11, only one of the substrate 0 and the substrate 1 may be inserted into the center pin. In such a case, the vacuum bonding apparatus 13 does not bond the substrates 0 and 1 together. The details around the vacuum bonding apparatus 13 will be described later.

In the disk substrate bonding step, the disk substrate to which the adhesive has been applied by the adhesive coating device is bonded by the vacuum bonding device 13 (step S5). The disk substrate bonded by the vacuum bonding device 13 is transported to the adhesive curing device 14 by a rotating table.

The adhesive curing device 14 has a mechanism for curing the adhesive between the disk substrates and a mechanism for blowing nitrogen gas to the outer periphery of the disk substrate. When the adhesive is an ultraviolet-curing adhesive, the mechanism for curing the adhesive is, for example, irradiating ultraviolet light (UV light) to the surface on the substrate 0 side to cure the adhesive between the disk substrates. Mechanism, mechanism to keep UV light out of the required area, polyhedral or cylindrical reflection mechanism to uniformly irradiate UV light to the required surface, UV irradiation with substrate 0 raised or lowered It is constituted by a mechanism.

Due to the handling error of the above-described transfer device, the adhesive curing device 14 can be used even if only one of the substrate 0 and the substrate 1 is transferred from the vacuum bonding device 13. When the applied disk substrate is supplied, the adhesive of the disk substrate is cured. In the adhesive curing step, the adhesive interposed between the two disk substrates bonded by the vacuum bonding apparatus 13 is cured by the adhesive curing apparatus 14 (Step S6). Adhesive curing device Disk substrate with adhesive cured by 4 Is moved to the disk substrate take-out portion of the table device 12 by the rotary table, and taken out of the table device 12 by the take-out arm 15. The take-out arm 15 has a mechanism for taking out the disc board from the disc board take-out portion of the table device 12, a mechanism for supplying the disc board to the reversing arm 16, and a mechanism for receiving the disc board from the reversing arm 16. A mechanism for moving the disc substrate to the discarding unit 17 and a mechanism for passing the disc substrate to the ejection device 18 are provided.

The reversing arm 16 has a mechanism for receiving the disk substrate from the removal arm 15, a mechanism for reversing the held disk substrate, and a mechanism for passing the disk substrate to the removal arm 15. .

The discarding unit 17 has a mechanism for stacking, for example, about 0 to 100 disk substrates, and a mechanism for manually pulling out and removing the stacked disk substrates.

The discharge device 18 has a mechanism for transferring the disk substrate to an unloading device 19 for performing the processing of the next step (post-processing step).

The disk substrate taken out of the table device 12 by the take-out arm 15 is passed to the reversing arm 16 and is turned over by the reversing arm 16. Disk substrates that were not properly processed, such as disk substrates where the adhesive was hardened without being bonded due to the handling error of the transport device described above, are discarded by the reversing arm 16. Moved to 17 and stacked as disc disc substrate. The normally processed disk substrate is transferred from the reversing arm 16 to the take-out arm 15.

The ejection arm 15 supplies the disc substrate received from the reversing arm 16 to the ejection device 18, and the ejection device 18 supplies the disc substrate received from the ejection arm 15 to the ejection device 19. I do. The unloading device 19 performs post-processing such as disk inspection (step S7), and unloads the manufactured optical disk (step S7). Step S8).

Here, the bonding of the disk substrates by the above-described vacuum bonding apparatus 13 will be described in detail. FIG. 3 shows an example of a cross-sectional structure near the vacuum bonding apparatus.

The table device 12 includes a rotary table 21, a mounting table 22, a center pin 23, and a seal member 24. The rotary table 21 is a rotary table included in the above-described table device 12, and the mounting table 22 is a table on which the substrate 1 provided on the rotary table 21 is mounted. is there. Although the rotary table 21 is not limited to the disk shape as shown in FIG. 1, it is preferable to make the table surface circular because it rotates around the center of the table surface. The mounting table 22 is not limited to the disk shape as shown in FIGS. 1 and 3, but the disk surface may be circular because the disk substrate is mounted on the table surface. preferable. The mounting table 22 may be formed integrally with the rotary table 21.

At the center of the table surface of the mounting table 22, a center pin 23 protrudes. The center pin 23 is fitted to the mounting table 22 so as to be displaceable in a direction perpendicular to the mounting surface of the disk substrate.

The center pin 23 is attached to a portion of the mounting table 22 that protrudes from the mounting surface of the disk substrate, to the first disk substrate 25, that is, to the tip of the large-diameter portion into which the opening of the substrate 1 is inserted. The second disk substrate 26, that is, a small-diameter portion into which the opening of the substrate 0 is inserted. The disk substrate 25 inserted into the large-diameter portion is supported by the mounting table 22. The disk substrate 26 inserted into the small-diameter portion is formed between the small-diameter portion and the large-diameter portion. It is supported by the step. The large-diameter portion and the small-diameter portion are provided on the center pin 23 so that the opening of the disk substrate 25 and the opening of the disk substrate 26 are concentric. A seal such as a 0-ring is provided between the center pin 23 and the mounting table 22. A material 24 is provided, and the gap between the sensor pin 23 and the mounting table 22 and the rotary table 21 is closed.

FIG. 4 shows an example of a cross-sectional structure of the center pin 23. Center pin 2 3

The large-diameter portion 23a has a small-diameter portion 23b on the distal end side that is smaller in diameter than the large-diameter portion 23a. In FIG. 4, the large-diameter portion 23a and the small-diameter portion 23b are separated from each other, but they may be integrated.

The side wall 23 c of the large diameter portion 23 a positions the disk board 25 to be inserted into the center pin 23 in the radial direction. The disk board 25 inserted into the center pin 23 is received and supported by the mounting table 22. The side wall 23 d of the small-diameter portion 23 b positions the disk substrate 26 inserted in the center pin 23 in the radial direction. The disk substrate 26 inserted into the center pin 23 is received and supported by a step formed at the boundary between the small diameter portion 23b and the large diameter portion 23a.

The step portion is formed such that the distance between the bonding surfaces of the disk substrate 25 and the disk substrate 26 fitted into the center pin 23 is short. For example, this distance is set to 0.5 mm to 2.0 mm. As mentioned above, center pin 2

3 is movable in the vertical direction with respect to the mounting surface of the disk substrate of the mounting table, and the movable range is such that the step portion is located on the mounting surface of the mounting table 22 on the disk substrate. On the other hand, for example, it is 0 mm to 10 mm. The center pin 23 can be controlled with a stop accuracy of, for example, 0.1 mm or less, and the distance between the stepped portion of the center pin 23 and the mounting surface of the disk substrate of the mounting table 22 is arbitrary. Can be controlled.

The disc substrate 26 may be supported by forming the small-diameter portion 23b so as to gradually become thinner toward the front end without providing a step portion on the center pin 23.

The tip of the small diameter portion 23b is chamfered so as to gradually become thinner. This facilitates the fitting of the disk substrate to the center pin 23.

Here, the description returns to FIG. The vacuum bonding apparatus 13 includes a chamber 27, an air passage 29, an intake valve 30, a ventilation valve 31, a plate shaft 32, a motor 33, a plate 34, and a sealing member. 28 and a sealing member 35. The vacuum bonding device 13 controls the pressure in the sealed space where the disk substrates 25 and 26 are bonded to each other, and moves the center pin 23 to a mechanism for creating a vacuum. And a mechanism for bonding the disk substrate 26 to the disk substrate 26.

The chamber 27 is a member that separates a space where the disk substrates are bonded from each other from the outside, and is capable of coming into contact with and separating from the table device 12. In addition, the table device 12 side may be configured to be able to contact and separate from the chamber 27 side. A seal member 28 such as an O-ring is provided between the chamber 27 and the table device 12. When the chamber 27 is closed to the table device 12 side, the chamber 27 and the table device are mounted. It is designed to close the gap with the 12 side.

An air passage 29 is provided in the chamber 27, and the inside of the chamber 27 and an intake port of an intake device (not shown) communicate with each other through the air passage 29. An intake valve 30 provided in the air passage 29 is a valve for adjusting a ventilation state between the inside of the chamber 27 and an intake port of an intake device (not shown). The air passage 29 further communicates with outside air via a ventilation valve 31. The ventilation valve 31 is a valve for adjusting the ventilation state between the inside of the chamber 27 and the outside air.

The plate shaft 32 is inserted into the chamber 27 at a portion facing the center pin 23. One end of the plate shaft 32 outside the chamber 27 is connected to the motor 33. The plate shaft 32 moves in the axial direction of the center pin 23 by the rotation of the motor 33. At the other end of the plate shaft 32 in the chamber 27, a plate 34 is provided. The plate 34 is inserted into the center pin 23. It has a pressing surface for pressing the main surfaces of the disk substrate 25 and the disk substrate 26 toward the table device 12 with a uniform pressure. Here, the plate shaft 32 and the plate 34 are separated from each other, but the plate shaft 32 and the plate 34 may be integrated.

In the example shown in FIG. 3, the tip of the center pin 23 is pressed by the pressing of the motor 33, the plate shaft 32 and the plate 34, and the center pin 23 moves. The pressing of the tip of the center pin 23 is not limited to the one using the motor 33, the plate shaft 32 and the plate 34. For example, the tip of the center pin 23 is formed by a pin-shaped member. The power used for pressing is not limited to the motor, but may be a structure using other power, such as using a cylinder or performing a manual operation.

By pressing the tip of the center pin 23, the pin 23 is moved in the direction in which the disc board 26 and the disc board 25 inserted into the pin 23 are pulled out, and the disc is moved. The bonding surface of the substrate 25 and the bonding surface of the disk substrate 26 are in close contact with each other, and the disk substrate 25 and the disk substrate 26 are bonded together. As described above, since the center pin 23 is configured so that the opening of the disk substrate 25 and the opening of the disk substrate 26 are concentric with each other, this bonding structure allows The substrate 25 and the disk substrate 26 can be accurately aligned and bonded.

In addition, in the example shown in FIG. 3, the plate 34 presses the disk substrate 25 by moving the pin 23 to the table device 12 side. As a result, the adhesiveness between the disk substrates can be increased, and the thickness of the disk substrate after bonding can be adjusted. When only the disk substrate 26 is inserted into the center pin 23, the table device 12 does not move the center pin 23, and the uncured adhesive is placed on the mounting table of the table device 12. Do not stick to 2 2 etc. In this case, glue from vacuum bonding device 13 The adhesive is hardened by being conveyed to the agent hardening device 14 with the disk substrate 26 inserted into the center pin 23.

A seal member 35 such as an O-ring is provided between the plate shaft 32 and the chamber 27, and a gap between the chamber 27 and the plate shaft 32 is closed. When the chamber 27 is closed to the table device 12 side by the seal member 24, the seal member 28, the seal member 35, the intake valve 30, and the ventilation valve 31, the space in the chamber 27 is sealed. be able to. With the chamber 27 closed, the intake valve 30 is opened, and the space in the chamber 27 is depressurized and evacuated by vacuuming with an intake device (not shown). Further, by closing the intake valve 30 and opening the ventilation valve 31 from such a reduced pressure state, the pressure in the space in the chamber 27 can be returned to the normal state. That is, the vacuum bonding apparatus 13 can control the pressure in the sealed space in the chamber 27 where the disk substrate 25 and the disk substrate 26 are bonded.

Here, the detailed shapes of the disk substrates 25 and 26 will be described. FIG. 5 shows an example of a cross-sectional structure of the disc substrate after bonding. The first disk substrate 25 and the second disk substrate 26 each have a planar annular structure. The disk substrate 25 and the disk substrate 26 have the same outer diameter, but the inner diameter of the opening is smaller in the disk substrate 26 than in the disk substrate 25.

The opening of the disc substrate 25 has an inner wall 25 a perpendicular to the main surface, and the inner wall 25 a is attached to the large-diameter portion 2 Mated with side wall 23c of 3a. The opening of the disk substrate 26 has an inner wall 26a perpendicular to the main surface, and the inner wall 26a is attached to the small diameter portion 2 of the center pin 23 at the time of bonding. Mates with side wall 23d of 3b.

Next, a series of operations when the disk substrates are bonded by the vacuum bonding apparatus 13 will be described. Figures 6 to 12 show the vacuum bonding equipment 1 3 13 shows a series of states during the bonding operation, and FIG. 13 shows an example of the flow of processing during the bonding operation.

FIG. 6 is a cross-sectional configuration of the vacuum bonding apparatus 13 before the bonding processing. In a state before the bonding process, the chamber 27 is in an open state. Further, the plate 34 is in a state of being retracted with respect to the center pin 23 side. The disk substrate 25 and the disk substrate 26 fitted to the center pin 23 are supplied by the rotary table 21, and the preparation for bonding is completed.

When the preparation for bonding is completed, the chamber 27 is closed (step S11). FIG. 7 shows a state where the chamber 27 is closed. When the chamber 27 is closed and the inside of the chamber 27 is closed, the intake valve 30 is opened, and the chamber is vacuumed by a suction device (not shown). Thus, the pressure in the chamber 27 is reduced, and this state is maintained (step S12). FIG. 8 shows a state where the pressure in the chamber 27 is reduced. Specifically, the pressure in the chamber 27 is set to 10 Pa to 300 Pa, and the state is maintained for 1 second to 2 seconds.

After maintaining the reduced pressure in the chamber 27, the plate 34 is protruded toward the table device 12 as shown in FIG. As a result, the center pin 23 is retreated to the turntable 21 side, and the main surface of the disk substrate 26 is pressed by the plate surface of the plate 34, and the foreground of the disk substrate 26 and the disk substrate 25 are forked. Join with the mating surface (step S13). FIG. 10 shows a state where the plate 34 is protruded.

After projecting the plate 34 and bonding the disk substrate 26 and the disk substrate 25 together, the intake valve 30 is closed and the ventilation valve 31 is opened. As a result, the inside of the chamber 27 is ventilated, and the pressure in the chamber 27 becomes normal (step S14). FIG. 11 shows a state in which the ventilation valve 31 is opened.

After ventilating the inside of the chamber 27, the chamber 27 is opened, and the plate 34 is returned to the original position before bonding (step S15). Figure 12 shows chamber 2 7 shows a state in which the plate 34 is returned with the plate 7 opened. The bonded disk substrate 25 and disk substrate 26 are supplied to the next step by rotating the turntable 21.

As described above, according to the optical disk manufacturing apparatus and the manufacturing method according to the embodiment, both the disk substrate 25 and the disk substrate 26 are formed with the center pin.

Since it is inserted and fitted into 23 and bonded together, it is not necessary to hold the disk substrate with a vacuum suction device, and the closed space in the chamber 27 where bonding is performed is depressurized by the suction device and vacuumed. Can be bonded together. This can prevent bubbles from remaining in the adhesive between the disk substrates. In addition, since the stop accuracy of the movable center pin 23 is high, the distance between the disk substrate 25 and the disk substrate 26 before bonding can be kept close. This prevents bubbles from remaining in the adhesive between the disk substrates even if the disk substrates are bonded immediately (for example, within 2 seconds) immediately after the start of decompression in the chamber 27.

Also, the fitting portion 23 c and the fitting portion 2 c are arranged so that the opening of the disk substrate 25 and the opening of the disk substrate 26 positioned by the center pin 23 are concentric.

Since 3d is provided, the positioning of the disk substrates to be bonded can be performed easily, accurately, and quickly.

Also, in the adhesive curing device 14, even when only one of the substrate 0 and the substrate 1 is conveyed to the vacuum bonding device 13 and the bonding is not performed, the adhesive is applied. If there is a disc substrate that has been hardened, the uncured adhesive adheres to the handling part of the disc substrate to cure the adhesive on the disc substrate, and the disc substrate that is later handled becomes dirty with the adhesive and becomes defective. Can be prevented. Disk substrates that have not been properly processed, such as disk substrates that have not been bonded, are moved to the disposal unit 17 by the reversing arm 16 and are stacked as disk substrates for disposal. Therefore, a disk substrate that has not been processed normally can be processed easily and without lowering the operation rate.

Further, since the configuration is such that the number of times of handling the disk substrate is reduced, it is possible to reduce the occurrence of defects due to handling mistakes. The present invention is also applicable to an optical disk manufacturing apparatus having the configuration shown in FIG.

Molding device 51, take-out device 52, cooling device 53, first film forming device 56, second film forming device 57, first adhesive applying device 61, second device in FIG. 14 The adhesive application device 62, the table device 64, the vacuum bonding device 65, the adhesive curing device 66, the discharging device 70, and the unloading device 71 are each a molding device 1 in the above-described embodiment. , Remover 2, cooling device 3, first film forming device 5, second film forming device 6, first adhesive coating device 7, second adhesive coating device 8, table device 12, vacuum bonding The functional configuration is the same as that of the aligning device 13, the adhesive curing device 14, the discharging device 18, and the discharging device 19.

The transport table 54 is a table on which two disk substrates are placed and transported, and has a mechanism for taking out two disk substrates from the cooling device 53. It should be noted that efficiency can be improved by adopting a mechanism for simultaneously taking out two disk substrates. The transport table 54 has a mechanism for supplying two disk substrates to the sputter arm 55, a function for receiving two disk substrates from the sputter arm 55, and two disks for the sampling arm 58. A mechanism for supplying the substrate, a mechanism for supplying two disk substrates to the spinner arm 60, and a mechanism for rotating the disk horizontally in a state where the two disk substrates are placed on the table, for example, 90 degrees. have. It should be noted that efficiency can be improved by using a mechanism that simultaneously supplies two disk substrates to the sputtering arm 55. Efficiency can be improved by adopting a mechanism that receives two disk substrates from the sputter arms 55 at the same time. Supply two disk substrates simultaneously to sampling arm 58 By adopting such a mechanism, efficiency can be improved. Efficiency can be improved by providing a mechanism for simultaneously supplying two disk substrates to the spinner arm 60.

The sputter arm 55 has a mechanism for receiving two transparent disk substrates before film formation from the transfer table 54 and transferring them to the film forming apparatus. The substrate 0 is transferred to a first film forming apparatus 56, and the substrate 1 is transferred to a second film forming apparatus 57. In addition, efficiency can be improved by using a mechanism for simultaneously transporting two disk substrates. The sputter arm 55 has a mechanism for receiving two disk substrates from the film forming apparatus and supplying the disk substrates to the transfer table 54. Substrate 0 is received from the first film forming apparatus 56, and substrate 1 is received from the second film forming apparatus 57. The efficiency can be improved by adopting a mechanism in which two disk substrates are simultaneously received from the film forming apparatus and are simultaneously supplied to the transfer table 54.

The sampling arm 58 is an arm attached to the rotating shaft, and has a mechanism for receiving two disk substrates from the transfer table 54, a mechanism for holding the two received disk substrates, and a rotating shaft. A mechanism for rotating horizontally 180 degrees, for example, and a mechanism for supplying two disk substrates to the sampling device 59 are provided. The efficiency can be improved by using a mechanism for receiving two disk substrates simultaneously from the transfer table. By using a mechanism for simultaneously supplying two disk substrates to the sampling device 59, efficiency can be improved.

The sampling device 59 has a mechanism for receiving two disk substrates from the sampling arm 58, and, for example, a disk having a rod-shaped member having a diameter smaller than the opening diameter passed through the central opening of the disk substrate. And a mechanism for stacking substrates. When sampling the disk substrate before film formation, the film formation processing is not performed in the film forming apparatus, and the sample is sampled from the transfer table 54 via the sampling arm 58. The two disk substrates are supplied to the pulling device 59. When sampling the disk substrate after film formation, a film formation process is performed in a film formation device, and two disk substrates are transferred from the transfer table 54 to the sampling device 59 via the sampling arm 58. Supply.

The spinner arm 60 is an arm attached to a rotating shaft, and has a mechanism for transporting two disk substrates to an adhesive application device. Substrate 0 is transported to first adhesive coating device 61, and substrate 1 is transported to second adhesive coating device 62. It should be noted that efficiency can be improved by using a mechanism for simultaneously transporting two disk substrates. The spinner arm 60 has a mechanism for receiving two disk substrates from the adhesive application device. Substrate 0 is received from the first adhesive applicator 61, and substrate 1 is received from the second adhesive applicator 62. In addition, efficiency can be improved by adopting a mechanism that receives two disk substrates at the same time. The spinner arm 60 further includes a mechanism for supplying the disk substrate to the reversing device 63, a mechanism for supplying the disk substrate to the table on which the disk of the bonding table device 64 is mounted, and a rotating shaft. A reversing device 63 having a mechanism for rotating the center in the horizontal direction, for example, 90 degrees, a mechanism for receiving the substrate 0 from the spinner arm 60, an adhesive application surface of the substrate 0 facing upward. And a mechanism for supplying the substrate 0 to the disk receiving portion of the table device 64 and inserting it into the center pin of the mounting table. By the reversing device 63 and the spinner arm 60, the substrate 0 and the substrate 1 are fitted to the center pin in a direction in which an adhesive is interposed.

The take-out arm 67 has a mechanism for taking out the disc substrate from the disc board take-out part of the table device 64, a mechanism for supplying the disc board to the reversing arm 68, and a mechanism for moving the disc board to the discard part 69. have. The reversing arm 68 has a mechanism for receiving the disk substrate from the unloading arm 67, a mechanism for reversing the held disk substrate, and a mechanism for supplying the disk substrate to the ejection device 70. .

The discarding unit 69 has a mechanism for stacking, for example, about 0 to 100 disk substrates, and a mechanism for manually pulling out and removing the stacked disk substrates.

The main flow of processing in the optical disk manufacturing apparatus shown in FIG. 14 is the same as that of the optical disk manufacturing apparatus of the above-described embodiment.

That is, the two disk substrates formed by the forming device 51 are conveyed to the cooling device 53 by the take-out device 52 and cooled. The disk substrate cooled by the cooling device 53 is transferred to a film forming device by a transfer table 54 and a sputter arm 55 to perform a film forming process. The substrate 0 is subjected to a film forming process by a first film forming device 56, and the substrate 1 is subjected to a film forming process by a second film forming device 57.

The two disk substrates formed by the film forming apparatus are supplied to the spinner arm 60 by the transfer table 54, transferred to the adhesive coating device, and coated with the adhesive. The sampling disk substrate is transferred to the sampling device 59 by the transfer table 54 and the sampling arm 58. In the example shown in FIG. 14, the substrate 0 is coated with an adhesive by the first adhesive coating device 61, and the substrate 1 is placed on the temporary table. The substrate 0 to which the adhesive is applied is supplied to the reversing device 63 by the spinner arm 60, and the substrate 1 is the disk of the bonding table device 64 by the spinner arm 60. The substrate 0 supplied to the reversing device 63 supplied to the substrate receiving portion and the substrate 1 supplied to the table device 64 are respectively provided with an adhesive by a vacuum bonding device 65. The adhesive is cured by an adhesive curing device 66.

The disk substrate on which the adhesive has been cured by the adhesive curing device 66 is taken out of the table device 64 by the take-out arm 67, passed to the reversing arm 68, and inverted.

Disk substrates that have not been properly processed, such as disk substrates that have been cured due to mishandling due to handling error of the transport device, etc., are moved to the disposal section 69 by the reversing arm 68. And stacked as disc substrates for disposal. The normally processed disk substrate is transferred from the reversing arm 68 to the ejection device 70.

As described above, according to the optical disc manufacturing apparatus and the manufacturing method shown in FIG. 14, the same effects as those of the optical disc manufacturing apparatus and the manufacturing method according to the embodiment can be obtained. Although the number of times of handling is larger than that of the optical disk manufacturing apparatus according to one embodiment, taking into account the flow of each processing, a transfer device for each processing such as a sputter arm 55, a sampling arm 58, a spinner arm 60, etc. Cycle time can be reduced.

The present invention is not limited to the above-described embodiment of the present invention, and various modifications and applications can be made without departing from the gist of the present invention. For example, the numerical values given in the above-described embodiment are merely examples, and different numerical values may be used as needed.

In the above-described embodiment, the manufacture of a read-only optical disk having pits has been described. However, applicable recording media are not limited to this. For example, a writable optical disk having a land group instead of a pit can be used. It can be applied to the manufacture of optical recording media. The present invention can be applied not only to an optical disk but also to various other recording media such as a magnetic disk and a magneto-optical disk as long as they are manufactured by bonding substrates having different openings. The outer peripheral shape of the substrate and the shape of the opening are not limited to a circle, but may be a square, a triangle, or the like. Other shapes such as shapes are also applicable. Further, the present invention is applicable even if the outer peripheral shapes of the substrates to be bonded are not the same.

Further, in the above-described embodiment, the motor 33 is provided on the vacuum bonding apparatus side, and the plate 34 is moved by the rotation of the motor 33, thereby pressing the tip of the sensor pin 23. Although the center pin 23 is moved, the motor 33 may be provided on the rotary table 21 side, and the center pin 23 may be driven by the motor 33 provided on the rotary table 21 side. The drive of the center pin 23 is not limited to the motor, but may be a structure using other power such as a cylinder or a manual.

Claims

The scope of the claims

1. A first substrate having an opening at the center of the main surface, and a second substrate having an opening smaller than the opening of the first substrate at the center of the main surface, An apparatus for manufacturing a recording medium, wherein the recording medium is bonded by interposing an adhesive applied on one main surface of the substrate and / or the second substrate,

The first substrate supported by the mounting table, wherein the large-diameter portion of the center pin is inserted into the opening, and the tip end of the center pin is inserted into the opening; The second substrate supported by the step is bonded to the second substrate by displacing the center pin vertically.

An apparatus for manufacturing a recording medium, comprising:

2. An apparatus for manufacturing a recording medium according to claim 1, wherein

Further, a pressing portion is provided, the tip of the center pin is pressed by the pressing portion to displace the center pin in a vertical direction, and the first substrate is pressed by the pressing portion to press the second substrate. An apparatus for manufacturing a recording medium, wherein the first substrate and the second substrate are bonded to each other.

3. The apparatus for manufacturing a recording medium according to claim 1, wherein

When only one of the first substrate and the second substrate is inserted into the center pin, the adhesive is cured without bonding the first substrate and the second substrate. An apparatus for manufacturing a recording medium, comprising:

4. An apparatus for manufacturing a recording medium according to claim 3, wherein

An apparatus for manufacturing a recording medium, characterized in that when only the second substrate is inserted into the center pin, the center pin does not move in the vertical direction.

5. A first substrate having an opening at the center of the main surface, and a second substrate having an opening smaller than the opening of the first substrate at the center of the main surface, A method for producing a recording medium, wherein the recording medium is bonded to the substrate and / or an adhesive applied on one principal surface of the second substrate with an adhesive interposed therebetween.

Inserting the opening of the first substrate into the large-diameter portion of the pin, and supporting the first substrate with a mounting table;

A step of inserting the opening of the second substrate into the small-diameter portion at the tip of the sensor pin and supporting the second substrate by a step at the boundary between the small-diameter portion and the large-diameter portion; When,

A step of decompressing the sealed space where the bonding is performed,

A step of vertically displacing the center pin by a pressing portion and further pressing the second substrate by the pressing portion to bond the first substrate and the second substrate together;

A method for manufacturing a recording medium, comprising: