JP2006113192A - Electrooptical device and projection type display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrooptical device and a projection type display device incorporating the same, capable of efficiently dissipating heat generated inside while preventing display from becoming dark. <P>SOLUTION: Light which is headed toward a pixel electrode 20 is not weakened as a light shielding section 21 is embedded in a region Σ where incident light which is headed toward the pixel electrode 20 is not shielded in an opposing substrate 5. Moreover, as the light shielding section 21 is embedded so that a cross section may exist in the region Σ, a cross sectional area to a direction which heat is conducting is made sufficiently large and the generated heat in a liquid crystal apparatus, for example, is efficiently conducted. Thereby, the heat generated inside the liquid crystal apparatus is efficiently dissipated while preventing display characteristics from degrading. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electro-optical device such as a liquid crystal device, an organic EL (Electro-Luminescence) device, a light emitting device represented by an inorganic EL device, and a projection display device.

  The liquid crystal device has a configuration in which, for example, a liquid crystal is sandwiched between an element substrate on which a plurality of pixel electrodes, switching elements for driving the pixel electrodes, and the like are arranged, and a counter substrate provided to face the element substrate. The element substrate and the counter substrate are made of a transparent material such as quartz or glass. A light-shielding layer such as a so-called black matrix is provided on the inner substrate (liquid crystal side) surface of the counter substrate so that, for example, light does not strike a region between adjacent pixel electrodes.

  Such a liquid crystal device is used as a display unit of a direct-view display device or as a light valve of a projection display device such as a projector. In particular, when used as a light valve of a projector, intense light is emitted as compared with the case of being used in a direct-view display device.

The light emitted to the liquid crystal device is not only transmitted through the liquid crystal device, but also absorbed inside the liquid crystal device, for example, a liquid crystal or a light shielding layer. The absorbed light is generated as heat inside the liquid crystal device. Since quartz and glass constituting the element substrate and the counter substrate are not so high in thermal conductivity, the generated heat tends to be trapped inside the liquid crystal device, and the temperature inside the liquid crystal device rises. When the temperature inside the liquid crystal device rises, it may cause display defects such as deterioration of liquid crystal characteristics. Since the light bulb of the projector is irradiated with strong light, the temperature rises greatly and the display defect becomes remarkable. On the other hand, Patent Document 1 discloses a technique for efficiently dissipating heat generated inside the liquid crystal device by forming a thin transparent heat dissipation layer on the entire inner surfaces of the element substrate and the counter substrate. Are listed.
JP 2003-156729 A

In Patent Document 1, since the heat dissipation layer is a thin film and the cross-sectional area in the direction in which heat is conducted is small, it is difficult for heat to be transmitted, and there is a possibility that the heat generated inside the liquid crystal device cannot be sufficiently dissipated.
In addition, although the heat dissipation layer is transparent, it is formed so as to cover the optical path, so it absorbs light from the light source, causing heat generation and reducing the amount of light transmitted through the liquid crystal device. It may also cause the display to darken.

  In view of the circumstances as described above, an object of the present invention is to provide an electro-optical device capable of efficiently dissipating heat generated inside while preventing the display from becoming dark, and a projection display equipped with the electro-optical device. To provide an apparatus.

To achieve the above object, an electro-optical device according to the present invention includes an element substrate on which a plurality of pixel electrodes and switching elements for driving the pixel electrodes are arranged, and a counter substrate provided to face the element substrate. An electro-optical device having a light-shielding portion that shields light traveling from an outer surface of the counter substrate toward the element substrate side at a predetermined angle toward light between adjacent pixel electrodes. Provided on the inner surface of the counter substrate, and the light shielding portion is embedded in the counter substrate so as to have a cross section in a region of the counter substrate that does not block the incident light toward the effective display region of the pixel electrode. It is characterized by.
Here, “the inner surface of the counter substrate” means a substrate surface of the counter substrate that faces the element substrate, and “the outer surface of the counter substrate” means a substrate surface opposite to the inner surface.

  In the present invention, since the light shielding portion is embedded in the region of the counter substrate that does not shield the incident light directed to the pixel electrode, the light directed to the pixel electrode is not weakened. In addition, since the light shielding portion is embedded so as to have a cross section in the region, the cross sectional area in the direction in which heat is conducted can be sufficiently increased, and the heat generated inside the electro-optical device can be efficiently conducted. be able to. Thereby, the heat generated inside can be efficiently radiated while preventing the display from becoming dark.

  An electro-optical device according to another aspect of the present invention includes an element substrate on which a plurality of pixel electrodes and switching elements that drive the pixel electrodes are arranged, and a counter substrate provided to face the element substrate. An electro-optical device having a light-shielding portion that shields light directed to a region between adjacent pixel electrodes from incident light incident at a predetermined angle from an outer surface of the counter substrate is provided on an inner surface of the counter substrate. The light-shielding portion has a tapered portion that tapers from the inner surface embedded in the counter substrate toward the outer surface.

  In the present invention, the light shielding portion has a tapered portion embedded in the counter substrate, that is, the side surface of the light shielding portion is inclined so as to be tapered inside the counter substrate with respect to the substrate surface of the counter substrate. Therefore, if the inclination of the tapered portion is designed in accordance with the direction and angle of light traveling inside the counter substrate, it is possible to prevent light incident on the pixel region from being blocked. Further, since the light shielding portion has a shape in which the tip becomes narrower toward the inside of the counter substrate, the cross section has a sufficient cross sectional area to conduct heat, and the tapered portion. Thus, heat generated in the electro-optical device can be efficiently conducted. Thereby, the heat generated inside can be efficiently radiated while preventing the display from becoming dark.

  Moreover, it is preferable that the inclination angle of the tapered portion of the light shielding portion is larger than the refraction angle of the incident light. “Inclination angle” means an inclination angle with respect to a plane perpendicular to the substrate surface of the counter substrate. If the inclination angle of the taper portion is smaller than the refraction angle of incident light, the taper portion is configured to block at least a part of the light toward the pixel electrode, so that the light toward the pixel electrode becomes weak. . Increasing the angle of inclination of the tapered portion than the angle of refraction of the incident light can prevent the incident light directed to the pixel electrode from being blocked by the tapered portion. Thereby, it can prevent that a display becomes dark.

  Moreover, it is preferable that the cross section of the said light-shielding part is a substantially triangle. The light shielding portion can be formed, for example, by cutting the surface of the counter substrate and embedding a material in the cut groove. When the cross section of the light shielding portion is triangular, the shape of the groove to be cut may be triangular. Since it is easy to form the triangular groove by cutting, there is an advantage that the manufacturing process is simplified and the productivity is improved.

  Moreover, it is preferable that the cross section of the said light-shielding part is a shape by an etching. Thereby, for example, the groove when the substrate is etched can be used as it is as the shape of the light-shielding portion, so that there is an advantage that the manufacturing process is simplified and the productivity is improved. By etching, the cross-sectional shape of the light shielding portion becomes, for example, a semicircle.

  Moreover, it is preferable that the said light shielding part is provided in the said opposing board | substrate at a grid | lattice form. For example, when a TFT (Thin Film Transistor) is used as an element, the pixel electrodes are usually arranged vertically and horizontally on the surface of the element substrate, so that the area between adjacent pixel electrodes is in a grid pattern. By forming the light shielding layer in a lattice shape so as to correspond to the lattice area, it is possible to shield the light to the wiring and element, and at the same time, through the light shielding layer formed in the lattice shape, the electro-optical device The heat generated inside the substrate can be diffused throughout the substrate.

  Moreover, it is preferable that the said light-shielding part is provided in the said opposing board | substrate at stripe form. For example, when a TFD (Thin Film Diode) is used as an element, wiring is usually formed on the stripe on the surface of the element substrate. By forming the light-shielding portion in a stripe shape so as to correspond to the region where the element and the wiring are formed, light can be shielded to the wiring and the element, and at the same time, the heat generated in the electro-optical device is moved along the stripe. Can be diffused.

  Further, it is preferable that the light shielding portion extends from one end to the other end of the counter substrate. In this way, the heat generated inside the electro-optical device can be widely diffused from one end of the counter substrate to the other end.

  Moreover, it is preferable that a heat radiating member is provided at least at one end or the other end of the counter substrate so as to be in contact with the light shielding portion. Accordingly, the heat generated inside the electro-optical device and diffused to one end or the other end of the substrate can be conducted to the frame portion. For example, heat can be more efficiently conducted by forming the frame portion from a material such as a metal having high thermal conductivity. The heat generated inside the electro-optical device is conducted to the entire electro-optical device through the light shielding portion and the frame portion, so that the heat radiation efficiency can be significantly improved.

  Moreover, it is preferable that the heat radiating member is a frame for holding the electro-optical device. Since the case also serves as a heat radiating member, it is not necessary to provide a heat radiating member separately. Thereby, the heat generated inside can be efficiently radiated.

  Moreover, it is preferable that the said light shielding part consists of metals. The metal is preferably used as the material for forming the light-shielding portion because the metal is a material having high thermal conductivity, can be formed in accordance with the shape of the groove of the counter substrate, and has a high light reflectance. This is because, for example, there is a strong tendency to reflect the irradiated light without absorbing it compared to a resin or the like, and the function as a light shielding portion can be sufficiently exhibited.

  Moreover, it is preferable that the said light-shielding part consists of aluminum. Aluminum has a very high light reflectance among metals. Most of the light irradiated to aluminum is reflected without being absorbed. By using aluminum as a material for the light shielding portion, it is possible to sufficiently shield the light, and since the light shielding portion itself hardly absorbs light, heat generation in the light shielding portion can be suppressed.

  The counter substrate is preferably provided with a microlens array. Thereby, the light incident on the counter substrate is condensed toward the pixel electrode by the lens portion of the microlens. For example, light that is originally directed toward the tapered portion of the light-shielding portion can be condensed toward the pixel electrode by the lens portion, so that the light can be used efficiently.

  A projection display apparatus according to another aspect of the present invention includes a light source, a light modulation unit that modulates light from the light source, and a projection unit that projects light modulated by the light modulation unit. In the display device, the light modulation unit is the electro-optical device described above.

  In the present invention, since an electro-optical device that can avoid display defects by efficiently dissipating the heat generated inside while preventing the display from becoming dark by not blocking the light from the light source, A projection display device with high contrast can be obtained.

Embodiments of the present invention will be described below with reference to the drawings. In each drawing used for the following description, the scale of each member is appropriately changed to make each member a recognizable size.
In the present specification, the liquid crystal layer side of each component of the liquid crystal device is referred to as an inner side, and the opposite side is referred to as an outer side. “When non-selection voltage is applied” and “when selection voltage is applied” are respectively “when the applied voltage to the liquid crystal layer is near the threshold voltage at which the liquid crystal orientation changes” and “applied to the liquid crystal layer”. "When the voltage is sufficiently higher than the threshold voltage of the liquid crystal".
In the present embodiment, an active matrix type transmissive liquid crystal device using a thin film transistor (hereinafter referred to as TFT) element as a switching element will be described as an example.

[First Embodiment]
(Equivalent circuit)
FIG. 1 is an equivalent circuit diagram of the liquid crystal device. Pixel electrodes 20 are formed on a plurality of dots arranged in a matrix to form an image display region of the transmissive liquid crystal device. Further, on the side of the pixel electrode 20, a TFT element 15 that is a switching element for performing energization control to the pixel electrode 20 is formed. The data line 10 is electrically connected to the source of the TFT element 15. Each data line 10 is supplied with image signals S1, S2,..., Sn. The image signals S1, S2,..., Sn may be supplied to each data line 10 in this order, or may be supplied for each group of data lines 10 adjacent to each other.

  Further, the scanning line 9 is electrically connected to the gate of the TFT element 15. The scanning signals G1, G2,..., Gm are supplied to the scanning line 9 in a pulse manner at a predetermined timing. The scanning signals G1, G2,..., Gm are applied to each scanning line 9 in this order in this order. Further, the pixel electrode 20 is electrically connected to the drain of the TFT element 15. When the TFT element 15 serving as a switching element is turned on for a certain period by the scanning signals G1, G2,..., Gm supplied from the scanning line 9, the image signals S1, S2,. , Sn are written to the liquid crystal of each pixel at a predetermined timing.

  Image signals S1, S2,..., Sn written in the liquid crystal are held for a certain period by a liquid crystal capacitor formed between the pixel electrode 20 and a common electrode described later. In order to prevent the retained image signals S1, S2,..., Sn from leaking, a storage capacitor 51 is formed between the pixel electrode 20 and the capacitor line 60, and is arranged in parallel with the liquid crystal capacitor. . Thus, when a voltage signal is applied to the liquid crystal, the alignment state of the liquid crystal molecules changes depending on the applied voltage level. As a result, the light incident on the liquid crystal is modulated so that gradation display can be performed.

(Planar structure)
FIG. 2 is an explanatory diagram of a planar structure of the liquid crystal device. In the liquid crystal device of the present embodiment, rectangular pixel electrodes 20 (the outlines of which are indicated by broken lines 20a) are arranged in a matrix on a TFT array substrate (element substrate) 4. A data line 10, a scanning line 9, and a capacitor line 60 are provided along the vertical and horizontal boundaries of the pixel electrode 20. In addition, light shielding portions 21 are provided in a lattice shape in a region indicated by diagonal lines (on the counter substrate 5). In the present embodiment, the area where each pixel electrode 20 is formed is a dot area, and display can be performed for each dot area arranged in a matrix.

  The TFT element 15 is formed around the semiconductor layer 1a made of a polysilicon film or the like. A data line 10 is electrically connected to a source region (described later) of the semiconductor layer 1 a through a contact hole 53. Further, the pixel electrode 20 is electrically connected to the drain region (described later) of the semiconductor layer 1 a through the contact hole 54. On the other hand, a channel region 1a 'is formed in a portion facing the scanning line 9 in the semiconductor layer 1a. The scanning line 9 functions as a gate electrode at a portion facing the channel region 1a '.

(Cross-section structure)
3 is an explanatory diagram of a cross-sectional structure of the liquid crystal device, and is a side cross-sectional view taken along the line AA ′ of FIG. As shown in FIG. 3, the liquid crystal device 1 of the present embodiment is mainly composed of a TFT array substrate 4, a counter substrate 5 disposed to face the TFT array substrate 4, and a liquid crystal layer 8 sandwiched therebetween. Yes. The TFT array substrate 4 is made of a translucent material such as glass or quartz, and the TFT element 15, the pixel electrode 20, the alignment film 22 a, and the like are provided on the inner side. One counter substrate 5 is made of a light-transmitting material such as glass or quartz, and a common electrode 57 and an alignment film 22b are provided on the inner side.

  A first interlayer insulating film 59 is formed on the surface of the TFT array substrate 4. A semiconductor layer 1a made of polycrystalline silicon or the like is formed on the surface of the first interlayer insulating film 59, and the TFT element 15 is formed around the semiconductor layer 1a. A channel region 1a 'is formed in a portion of the semiconductor layer 1a facing the scanning line 9, and a source region and a drain region are formed on both sides thereof. Since the TFT element 15 employs an LDD (Lightly Doped Drain) structure, a high concentration region having a relatively high impurity concentration and a relatively low concentration region (LDD) are respectively provided in the source region and the drain region. Region). That is, a low concentration source region 1b and a high concentration source region 1d are formed in the source region, and a low concentration drain region 1c and a high concentration drain region 1e are formed in the drain region.

    A gate insulating film 2 is formed on the surface of the semiconductor layer 1a. Then, a scanning line 9 is formed on the surface of the gate insulating film 2, and a part thereof constitutes a gate electrode. A second interlayer insulating film 61 is formed on the surfaces of the gate insulating film 2 and the scanning line 9. The data line 10 is formed on the surface of the second interlayer insulating film 61 and is electrically connected to the high-concentration source region 1 d through the contact hole 53 formed in the second interlayer insulating film 61. Further, a third interlayer insulating film 62 is formed on the surfaces of the second interlayer insulating film 61 and the data line 10. A pixel electrode 20 made of a transparent conductive material such as indium tin oxide (hereinafter referred to as ITO) is formed on the surface of the third interlayer insulating film 62. The pixel electrode 20 is electrically connected to the high concentration drain region 1 e through a contact hole 54 formed in the second interlayer insulating film 61 and the third interlayer insulating film 62. Further, an alignment film 22 a made of an organic material such as polyimide is formed inside the pixel electrode 20. The surface of the alignment film 22a is rubbed or the like so that the alignment direction of the liquid crystal molecules when a non-selection voltage is applied can be regulated. Note that although the scanning line includes a gate electrode, the scanning line may be formed in a layer different from that of the gate electrode and connected through a contact hole.

  In the present embodiment, the first storage capacitor electrode 1f is formed by extending the semiconductor layer 1a. Further, the gate insulating film 2 is extended to form a dielectric film, and the capacitor line 60 is arranged on the surface thereof to form a second storage capacitor electrode. Thus, the above-described storage capacitor 51 is configured.

  A common electrode 57 made of a transparent conductive material such as ITO is formed on the surface of the counter substrate 5 over substantially the entire surface. Furthermore, an alignment film 22b made of an organic material such as polyimide is formed on the surface of the common electrode 57 through a water repellent layer (not shown), which will be described later, as necessary. The surface of the alignment film 22b is rubbed or the like so that the alignment direction of the liquid crystal molecules when a non-selection voltage is applied can be regulated.

  In order to form the alignment films 22a and 22b, polyimide is first applied by spin coating, dried at about 80 ° C. for about 10 minutes to volatilize the solvent, and then baked at about 180 ° C. for about 1 hour. Form. Further, if the polyimide film is rubbed at a rubbing density of about 450, the alignment films 22a and 22b are formed. For example, the alignment films 22a and 22b have a thickness of about 25 nm. Note that the thickness of the alignment films 22a and 22b is preferably 5 to 50 nm, and more preferably 15 to 30 nm.

  A liquid crystal layer 8 made of nematic liquid crystal is sealed inside a sealant that bonds the TFT array substrate 4 and the counter substrate 5 at the peripheral edge. This nematic liquid crystal molecule exhibits a positive dielectric anisotropy, and is oriented horizontally with respect to the electrode when a non-selective voltage is applied, and perpendicularly with respect to the electrode when a selective voltage is applied. . Note that the alignment regulation direction by the alignment film 22a of the TFT array substrate 4 and the alignment regulation direction by the alignment film 22b of the counter substrate 5 are arranged in a state twisted by about 90 °. Thereby, the liquid crystal device 1 of the present embodiment is configured to operate in the twisted nematic mode. In addition to the twisted nematic mode, the liquid crystal mode may be a liquid crystal mode having negative dielectric anisotropy, that is, a vertical alignment mode.

FIG. 4 is an explanatory diagram of the liquid crystal device according to the present embodiment. FIG. 4 is a schematic diagram of the cross-sectional structure shown in FIG. 3, and is omitted as appropriate for easy understanding.
A light shielding portion 21 is formed on the surface of the TFT array substrate 4 corresponding to the formation region of the TFT element 15. The light-shielding portion 21 is composed of aluminum alone or a laminate of another metal film on aluminum.

  As shown in FIG. 4A, the light-shielding portion 21 is not formed in a film shape, but has a cross section formed in, for example, a triangle. Specifically, the width L (L = about 4 μm) is formed on the inner surface of the counter substrate 5 and the depth h (h = about 10 μm) is formed inside the counter substrate 5, and gradually inside the counter substrate 5. It is embedded in the counter substrate 5 so as to be tapered. Thus, since the light shielding part 21 has a cross section, the heat generated inside the liquid crystal device 1 is easily transmitted in the extending direction of the light shielding part 21. If the cross section has a width L of about 4 μm and a depth (height) of about 10 μm as in the light shielding portion 21, it can be said that the cross-sectional area in the direction in which heat is conducted is sufficiently large.

The tapered portion (hereinafter referred to as “taper portion”) 21 a is inclined so as to form an angle θ ₃ with respect to a direction (normal direction) perpendicular to the substrate. The light from the light source is incident on the counter substrate 5 at an incident angle θ ₁ from a certain direction with respect to the counter substrate 5, refracts at the refraction angle θ ₂ , and travels straight in the counter substrate 5. . When the refractive index of a material (for example, glass) forming the counter substrate 5 is n ₂ , sin (θ ₁ ) = n ₂ sin (θ ₂ ).

で表すことができる。ここでθ_２は上述した入射光の屈折角の値、Ｌは上述した遮光部２１の幅の値を示すものである。θ_２については、例えば１６°程度にすることが好ましい。 As shown in FIG. 4B, the incident light α ₁ and the incident light β ₁ incident on the counter substrate 5 reach the pixel electrode 20 without being blocked by the light shielding portion 21. And light alpha ₂ incident from the left side in the drawing than the incident light alpha _1, an optical beta ₂ incident from the right side in the drawing than the incident light beta ₁ will be shielded by the light shielding unit 21. Such light does not reach the pixel electrode 20 when the light blocking portion 21 is not present, but reaches the region 25 between the adjacent pixel electrodes 20. The light shielding portion 21 can shield light reaching other than the pixel electrode 20 and also prevent incident light α shown in FIG. 4B so as not to shield light reaching the pixel electrode 20. Is formed so as to fall within a region Σ surrounded by a line representing incident light β, a line representing incident light β, and a line representing the surface of the counter substrate 5. The depth H from the surface of the counter substrate 5 to the vertex P of the region Σ is

It can be expressed as Here, θ ₂ represents the value of the refraction angle of the incident light described above, and L represents the value of the width of the light shielding unit 21 described above. For example, θ ₂ is preferably about 16 °.

As shown in FIG. 4C, when the light shielding part 21 is formed so as to protrude from the region Σ shown in FIG. 4B, for example, the value of the height h is changed without changing the value of the width L of the light shielding part 21. When the value is larger than the value of [Expression 1], even the incident light α ₃ that can originally reach the pixel electrode 20 is shielded by the light shielding portion 21. For comparison, the light shielding portion 21 shown in FIG. 4B is indicated by a one-dot chain line in FIG. 4C for comparison. The light alpha ₃ can reach the pixel electrode 20 through just part of the foot of the light-shielding portion shown by a chain line, reaches the pixel electrode 20 is blocked by the tapered portion 21a of the light shielding portion 21 shown by the solid line Can not do it.

FIG. 5 is a diagram illustrating a configuration of an end portion of the liquid crystal device 1.
The light shielding portion 21 is in contact with the surface 3 a of the frame 3 at the end of the liquid crystal device 1. The frame 3 is made of a metal having a high thermal conductivity such as aluminum, and holds the liquid crystal device 1. For example, heat generated inside the liquid crystal device 1 is transmitted to the end portion of the liquid crystal device 1 through the light shielding portion 21, and is transmitted from the light shielding portion 21 to the frame 3 at the end portion and radiated through the frame 3. ing.

Next, the manufacturing process of the liquid crystal device 1 of the present invention will be described.
FIG. 6 is a flowchart showing a manufacturing process of the liquid crystal device 1. In the present embodiment, a method in which a plurality of liquid crystal devices are collectively formed using a mother substrate having a large area and separated into individual liquid crystal devices 1 by cutting will be described as an example.

  The counter-side mother substrate 5M is formed by the steps from ST1 to ST6, and the TFT array-side mother substrate 4M in which switching elements are provided in the case of an active matrix type liquid crystal device is formed by the steps from ST11 to ST13. Is done. The TFT array-side mother substrate 4M is a large-sized substrate including a plurality of rectangular display areas to be the TFT array substrate 4. The counter-side mother substrate 5M includes a plurality of rectangular display areas to be the counter substrate 5. A large substrate.

First, the formation process (ST1 to ST6) of the opposite-side mother substrate 5M will be described.
The light shielding part 21 is formed on the opposing mother substrate 5M (ST1). As shown in FIG. 7, a resist R is applied to the surface of the opposing mother substrate 5M. Next, as shown in FIG. 8, the surface of the opposite mother substrate 5 </ b> M coated with the resist R is cut together with the resist R by dicing. At this time, the width L and the depth h of the cutting portion 35 are set within the above-described region Σ. Next, as shown in FIG. 9, aluminum (a portion indicated by hatching in FIG. 9) is deposited on the cut portion 35. Then, as shown in FIG. 10, when the resist R portion and the upper aluminum are removed, a light shielding portion 21 is formed.

  Next, a planarization layer and a common electrode 57 are sequentially formed on the surface where the light shielding portion 21 is formed (ST2), an alignment film 22b is formed so as to cover the common electrode 57 (ST3), and the alignment film 22b is formed. Then, the rubbing process is executed (ST4). The alignment film 22b can be formed by applying or printing polyimide, for example.

  At the periphery of each display area, a sealing material 6 made of epoxy resin or the like is formed in a rectangular frame shape so as to surround the display area (ST5). The sealing material 6 is accurately formed at a designed position using a dispenser or the like. The sealing material 6 is formed in a closed ring shape with a single stroke starting from the corner of the display area. In a region on the TFT array side mother substrate 4M where the sealing material 6 is formed, a reflective film 40 (see FIG. 10) made of a material such as a metal having a high light reflectance is formed in advance.

  And a liquid crystal is apply | coated to the display area enclosed with the sealing material (ST6). For example, a liquid having a predetermined area can be obtained by disposing a counter mother substrate in a liquid crystal dropping device, discharging liquid crystals in droplets from a liquid droplet discharge head, and arranging a large number of them continuously on the substrate surface. A film is formed.

Next, a process of forming the TFT array side mother substrate 4M (ST11 to ST13) will be briefly described.
As in the case of the opposing mother substrate 5M, the scanning lines 9, the data lines 10 and the like are formed in each display region of a large base material made of a light-transmitting material such as quartz, and the pixel electrodes 20 and the TFT elements 15 are formed. (ST11). The scanning lines 9 and the data lines 10 can be collectively formed for each display region by, for example, sputtering a metal such as aluminum on the entire surface of the substrate and etching it. Next, an alignment film made of polyimide or the like is formed in each display region (ST12), and a rubbing process is performed on the alignment film (ST13).

  Next, the opposing mother substrate 5M and the TFT array mother substrate 4M formed in each of the above steps are bonded together (ST21). Both substrates are brought close to each other so that the TFT array-side mother substrate 4M is adhered to the sealing material 6 on the opposite-side mother substrate 5M. After bonding the opposing mother substrate 5M and the TFT array mother substrate 4M, as shown in FIG. 11, the sealing material 6 is irradiated with ultraviolet rays (UV) and cured.

  When ultraviolet rays are irradiated from the outside of the opposing mother substrate 5M, the ultraviolet rays are transmitted through the opposing mother substrate 5M and applied to the sealing material 6. The ultraviolet rays that pass through the sealing material 6 are reflected by the reflective film 40 formed in advance on the sealing material 6 forming portion of the TFT array-side mother substrate 4M, and are applied to the sealing material 6. Of the ultraviolet light reflected by the reflective film 40, the ultraviolet light that has again passed through the sealing material 6 is reflected again by the surface 21 b of the light shielding part 21 and is irradiated onto the sealing material 6. In this way, the sealing material 6 is cured by efficiently irradiating ultraviolet rays.

  Thereafter, scribe lines are formed on the TFT array substrate 4 and the counter substrate 5, the liquid crystal panel is cut along the scribe lines (ST22), each liquid crystal panel is cleaned (ST23), and, for example, ACF is applied to each liquid crystal panel. The flexible substrate is mounted through the liquid crystal device 1 to complete the liquid crystal device 1.

  According to this embodiment, since the light shielding part 21 is embedded in the region Σ that does not shield the incident light directed to the pixel electrode 20 in the counter substrate 5, the light directed to the pixel electrode 20 is not weakened. In addition, since the light-shielding portion 21 is embedded in the region Σ so as to have a cross section, the cross-sectional area with respect to the direction in which heat is conducted can be sufficiently increased. For example, the heat generated in the liquid crystal device 1 can be reduced. It can conduct efficiently. Thereby, it is possible to efficiently dissipate heat generated inside the liquid crystal device 1 while preventing deterioration of display characteristics.

  In this embodiment, the counter-side mother substrate 5M is broken before being bonded to the TFT array-side mother substrate 4M, and the separated counter substrate 5 is bonded to the TFT array-side mother substrate 4M. Good.

(Second Embodiment)
Next, a second embodiment of the present invention will be described.
FIG. 12 is a cross-sectional view showing a configuration of the liquid crystal device 101 according to the present embodiment. About the same component as 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted. In this embodiment, since the structure of the light-shielding part is different from that of the first embodiment, this point will be mainly described.

  As shown in FIG. 12, the light shielding part 221 is formed so as to have a lattice shape in the X direction and the Y direction of the counter substrate 5, and is formed so that the cross section thereof becomes a semicircle. It is accommodated in a region Σ that is embedded and formed to have a width L (L = about 4 μm) on the inner surface of the counter substrate 5 and a depth h (h = about 10 μm) inside the counter substrate 5. This is the same as in the first embodiment.

  Next, a method for manufacturing the liquid crystal device 101 configured as described above will be described. Since it is the same as that of 1st Embodiment except the process of forming the light shielding part 221, the manufacturing process of the light shielding part 221 is demonstrated here.

  In order to form the light shielding part 221 on the opposing mother substrate 5M, first, as shown in FIG. 13, a resist R is applied to the surface of the opposing mother substrate 5M except for the region S where the light shielding part 221 is formed. Next, as shown in FIG. 14, for example, wet etching is performed on the region S to form a semicircular groove 235. Etching is performed using hydrofluoric acid (HF) or the like that can dissolve, for example, quartz and does not dissolve the resist R. At this time, the width L and the depth h of the groove 235 are set within the above-described region Σ. Next, as shown in FIG. 15, aluminum 236 is deposited in the groove 235. Then, as shown in FIG. 16, when the resist R is removed, the light shielding portion 221 is completed in a state of being embedded in the opposing mother substrate 5M.

  As described above, according to the present embodiment, the groove 235 obtained when the counter-side mother substrate 5M is etched can be used as it is as the shape of the light-shielding portion 221, so that the manufacturing process is simplified and the productivity is improved. There are advantages. By etching, the cross-sectional shape of the light shielding part 221 becomes, for example, a semicircle.

(Projection type display device)
Next, an embodiment of a projection display device using the liquid crystal device of each embodiment as a light modulation device will be described.

FIG. 17 is a diagram schematically showing an internal configuration of a projector 102 as an example of a projection display device.
The projector 102 is a three-plate intermittent display type color liquid crystal projector having a transmission type liquid crystal light valve for each of different colors of R (red), G (green), and B (blue), for example. Lenses 108 and 109, dichroic mirrors 110 and 111, reflection mirrors 112, 113, and 114, liquid crystal light valves 115, 116, and 117, a cross dichroic prism 118, and a projection lens 119 are provided. The projector 102 may be a single plate type.

  The light source 107 includes, for example, a lamp 107a such as a high-pressure mercury lamp that emits white light, and a reflector 107b that reflects light from the lamp 107a. The fly-eye lenses 108 and 109 make the illuminance distribution of light from the light source 107 uniform. The fly-eye lens 108 on the light source 107 side forms a plurality of secondary light source images. The fly eye lens 109 on the screen 103 side superimposes the secondary light source image formed by the fly eye lens 108.

  Of the white light emitted from the light source 107, the dichroic mirror 110 transmits the red light LR and reflects the green light LG and the blue light LB. The dichroic mirror 111 reflects the green light LG and transmits the blue light LB.

  The liquid crystal light valves 115, 116, and 117 modulate the emitted red light, green light, and blue light, respectively, based on a predetermined image signal. The cross dichroic prism 118 is formed by bonding four right-angle prisms. On the inner surface, a dielectric multilayer film 118a that reflects red light and a dielectric multilayer film 118b that reflects blue light are formed in a cross shape. Three color lights are synthesized by the dielectric multilayer films 118a and 118b, and light (image light) representing a color image is formed. The projection lens 119 projects image light toward the screen 103. As the liquid crystal light valves 115, 116, 117, the above-described liquid crystal devices 1, 101 are used here. When used as the liquid crystal light valves 115, 116, 117, the size of the liquid crystal devices 1, 101 is about 4.6 square centimeters (about 0.7 square inches).

  Light from the light source 107 is converted into parallel light (linearly polarized light), modulated by the liquid crystal device 1, and each modulated color light is projected onto the screen 103 by the projection lens 119.

  If heat is generated in the liquid crystal devices 1 and 101 while the projector 102 is being driven and, for example, cracks are formed in each of the internal layers, a large display appears on the screen S, resulting in poor display. The liquid crystal devices 1 and 101 can efficiently dissipate the heat generated in the liquid crystal device 1 while preventing the display from becoming dark, so that the temperature rise in the liquid crystal device 1 can be suppressed. Display defects due to heat can be suppressed. Therefore, the projector 102 with high contrast can be obtained.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
For example, as shown in FIG. 18, the counter substrate 5 may be provided with a microlens. Specifically, the microlens 5e can be sandwiched between the sealing substrate 5c and the counter substrate 5d.

  In this case, the light incident on the counter substrate 5 is condensed toward the pixel electrode 20 by the lens portion 5f of the microlens 5e. For example, light that is originally directed toward the tapered portion 21a of the light shielding portion 21 can be condensed toward the pixel electrode 20 by the lens portion 5f, so that the light can be efficiently used.

  In the present embodiment, the provision of the light-shielding portion 21 can efficiently dissipate the heat generated inside the liquid crystal device 1 while preventing the deterioration of display characteristics, and the light can be emitted by providing the microlens 5e. It can be used efficiently and display characteristics can be further improved. Thus, by providing the light shielding portion 21 in combination with the microlens 5e, the significance of the present invention is further increased.

  Further, as shown in FIG. 19, the light shielding portions 21 may be formed in a stripe shape. Even the stripe-shaped light-shielding portion 21 can sufficiently shield light, and heat generated inside the liquid crystal devices 1 and 101 can be diffused along the stripe.

1 is an equivalent circuit diagram of a liquid crystal device according to a first embodiment of the present invention. It is explanatory drawing of the planar structure of the liquid crystal device which concerns on this embodiment. It is explanatory drawing of the cross-section of the liquid crystal device which concerns on this embodiment. It is sectional drawing which shows a part of liquid crystal device which concerns on this embodiment. It is sectional drawing which shows a part of liquid crystal device which concerns on this embodiment. It is a flowchart which shows the process of manufacturing the liquid crystal device which concerns on this embodiment. It is FIG. (1) which shows a mode that the liquid crystal device which concerns on this embodiment is manufactured. It is FIG. (2) which shows a mode that the liquid crystal device which concerns on this embodiment is manufactured. It is FIG. (3) which shows a mode that the liquid crystal device which concerns on this embodiment is manufactured. It is FIG. (4) which shows a mode that the liquid crystal device which concerns on this embodiment is manufactured. It is FIG. (5) which shows a mode that the liquid crystal device which concerns on this embodiment is manufactured. It is sectional drawing which shows the structure of the liquid crystal device which concerns on 2nd Embodiment of this invention. It is FIG. (1) which shows a mode that the liquid crystal device which concerns on this embodiment is manufactured. It is FIG. (2) which shows a mode that the liquid crystal device which concerns on this embodiment is manufactured. It is FIG. (3) which shows a mode that the liquid crystal device which concerns on this embodiment is manufactured. It is FIG. (4) which shows a mode that the liquid crystal device which concerns on this embodiment is manufactured. It is a figure which shows the structure of the projection type display apparatus which concerns on this embodiment. It is a figure (the 1) which shows the modification of this invention. It is a figure (the 2) which shows the modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,101 ... Liquid crystal device 4 ... TFT array substrate 5 ... Opposite substrate 15 ... TFT element 20 ... Pixel electrode 21 ... Light-shielding part 21a ... Tapered part

Claims (14)

An electro-optical device comprising: an element substrate on which a plurality of pixel electrodes and switching elements for driving the pixel electrodes are arranged; and a counter substrate provided to face the element substrate.
A light shielding portion is provided on the inner surface of the counter substrate for blocking light that enters the region between the adjacent pixel electrodes from incident light incident at a predetermined angle from the outer surface of the counter substrate toward the element substrate side. ,
The electro-optical device, wherein the light-shielding portion is embedded in the counter substrate so as to have a cross section in a region of the counter substrate that does not block the incident light directed to the effective display region of the pixel electrode. . An electro-optical device comprising: an element substrate on which a plurality of pixel electrodes and switching elements for driving the pixel electrodes are arranged; and a counter substrate provided to face the element substrate.
A light-shielding portion that shields light that is directed to a region between adjacent pixel electrodes from incident light incident at a predetermined angle from the outer surface of the counter substrate is provided on the inner surface of the counter substrate.
The electro-optical device, wherein the light shielding portion includes a tapered portion that tapers from an inner surface embedded in the counter substrate toward an outer surface.   The electro-optical device according to claim 2, wherein an inclination angle of the tapered portion of the light shielding portion is larger than a refraction angle of the incident light.   The electro-optical device according to claim 1, wherein a cross section of the light shielding portion is substantially a triangle.   The electro-optical device according to claim 1, wherein a cross section of the light shielding portion has a shape formed by etching.   The electro-optical device according to claim 1, wherein the light-shielding portion is provided on the counter substrate in a lattice shape.   The electro-optical device according to claim 1, wherein the light shielding portion is provided in a stripe shape on the counter substrate.   The electro-optical device according to claim 1, wherein the light shielding portion extends from one end to the other end of the counter substrate.   The electro-optical device according to claim 8, wherein a heat radiating member is provided at least at one end or the other end of the counter substrate so as to be in contact with the light shielding portion.   The electro-optical device according to claim 9, wherein the heat dissipation member is a frame that holds the electro-optical device.   The electro-optical device according to claim 1, wherein the light shielding portion is made of metal.   The electro-optical device according to claim 11, wherein the light shielding portion is made of aluminum.   The electro-optical device according to claim 1, wherein the counter substrate is provided with a microlens array. A light source;
Light modulating means for modulating light from the light source;
A projection type display device comprising: projection means for projecting light modulated by the light modulation means;
The projection display device, wherein the light modulation unit is the electro-optical device according to any one of claims 1 to 13.

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