JP2006108710A - マイクロ電子基板の機械的および化学機械的平面化用の方法および装置 - Google Patents
マイクロ電子基板の機械的および化学機械的平面化用の方法および装置 Download PDFInfo
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- JP2006108710A JP2006108710A JP2005342957A JP2005342957A JP2006108710A JP 2006108710 A JP2006108710 A JP 2006108710A JP 2005342957 A JP2005342957 A JP 2005342957A JP 2005342957 A JP2005342957 A JP 2005342957A JP 2006108710 A JP2006108710 A JP 2006108710A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Abstract
【解決手段】平面化媒体140は、その表面に均一に分布された上部平坦小瘤147もしくは丸いピークと凹部148からなる微小フィーチャー146を有し、ポリエステル等のポリマーまたはポリウレタンなどの他の適切な材料から構成される、平面化溶液を実質的に通さない非圧縮性シートまたは単層ウエブからなる平面化フィルム142である。
【選択図】図3
Description
本発明は、マイクロ電子基板の機械的および化学機械的平面化に関する。さらに特定すると、本発明の実施態様は、基板を平面化する性能を高めおよび/またはその費用を安くするための平面化研磨パッド、ならびにその研磨パッドの使用方法および作製方法に関する。
機械的および化学機械的平面化プロセスは、半導体ウエハ、電界放出表示装置および多くの他のマイクロ電子基板の表面から材料を取り除いて、これらの基板にて、所望の高さで、平坦な面を形成する。図1は、平面化装置10を概略的に図示しており、これは、圧盤20、キャリヤアセンブリ30、研磨パッド40、および研磨パッド40の上の平面化溶液44を備えている。平面化装置10はまた、圧縮性アンダーパッド25を有し得、これは、研磨パッド40を支持するために、圧盤20の上面22に装着されている。多くの平面化装置では、ドライブアセンブリ26は、圧盤20を回転(矢印A)および/または往復運動(矢印B)させて、平面化中にて、研磨パッド40を移動させる。
本発明は、マイクロ電子基板を機械的および/または化学機械的に平面化するための方法および装置である。1実施態様では、本発明の原理に従って、薄膜およびこの膜上の複数の微小フィーチャー(micro−features)を有する平面化媒体上にて、マイクロ電子基板が平面化または研磨される。このフィルムは、平面化溶液を実質的に通さない非圧縮性シートまたはウエブであり得、これらの微小フィーチャーは、この基板の下にて、このフィルムの表面にわたって、この平面化溶液の流体流れを制限するために、このフィルム上にて、選択パターンで構成され得る。この微小フィーチャーは、例えば、支持点を規定する実質的に非圧縮性の複数の第一隆起フィーチャー、これらの支持点の下の少なくとも1個の空洞、およびこれらの支持点間およびその下の複数の第二隆起フィーチャーを備えた選択パターンで、構成され得る。これらの支持点、空洞、および第二隆起フィーチャーは、平面化中にて、この基板の下で、この溶液の実質的に連続的で均一な分布を捕捉するように、作動し得る。さらに、この微小フィーチャーの選択パターンは、多数の基板に対して、一貫した平面化面が設けられ得るように、このフィルム上にて、選択パターンを複製する微小フィーチャーのマスターパターンから再生され得る。
本発明は、マイクロ電子装置の製造で使用される基板の機械的および/または化学機械的平面化のための装置および方法である。本発明のある実施態様の多くの具体的な詳細は、このような実施態様を完全に理解できるように、以下の説明および図2〜6で示されている。しかしながら、当業者は、本発明がさらなる実施態様を有し得ること、および以下の説明で記述された細部のいくつかがなくても実施され得ることを理解する。
Claims (1)
- マイクロ電子基板を平面化するための平面化媒体であって、
溶液を通さない平面化フィルム;および
複数の微小構造的フィーチャーであって、該複数の微小構造的フィーチャーは、選択され複製されたパターンで該フィルム上に構成されており、該選択されたパターンは、支持点を規定する複数の第一隆起フィーチャー、該支持点の下の少なくとも1個の空洞、および該支持点間およびその下の複数の第二隆起フィーチャーを有する、複数の微小構造的フィーチャー
を備える、平面化媒体。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/001,333 US6139402A (en) | 1997-12-30 | 1997-12-30 | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000526334A Division JP3774367B2 (ja) | 1997-12-30 | 1998-12-29 | マイクロ電子基板の機械的および化学機械的平面化用の方法および装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006108710A true JP2006108710A (ja) | 2006-04-20 |
Family
ID=21695502
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000526334A Expired - Fee Related JP3774367B2 (ja) | 1997-12-30 | 1998-12-29 | マイクロ電子基板の機械的および化学機械的平面化用の方法および装置 |
JP2005342957A Pending JP2006108710A (ja) | 1997-12-30 | 2005-11-28 | マイクロ電子基板の機械的および化学機械的平面化用の方法および装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000526334A Expired - Fee Related JP3774367B2 (ja) | 1997-12-30 | 1998-12-29 | マイクロ電子基板の機械的および化学機械的平面化用の方法および装置 |
Country Status (8)
Country | Link |
---|---|
US (9) | US6139402A (ja) |
EP (1) | EP1042105B1 (ja) |
JP (2) | JP3774367B2 (ja) |
KR (1) | KR100563758B1 (ja) |
AT (1) | ATE254012T1 (ja) |
AU (1) | AU2208799A (ja) |
DE (1) | DE69819779T2 (ja) |
WO (1) | WO1999033615A1 (ja) |
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-
1998
- 1998-12-29 EP EP98966113A patent/EP1042105B1/en not_active Expired - Lifetime
- 1998-12-29 JP JP2000526334A patent/JP3774367B2/ja not_active Expired - Fee Related
- 1998-12-29 AU AU22087/99A patent/AU2208799A/en not_active Abandoned
- 1998-12-29 AT AT98966113T patent/ATE254012T1/de not_active IP Right Cessation
- 1998-12-29 KR KR1020007007361A patent/KR100563758B1/ko not_active IP Right Cessation
- 1998-12-29 DE DE69819779T patent/DE69819779T2/de not_active Expired - Lifetime
- 1998-12-29 WO PCT/US1998/027773 patent/WO1999033615A1/en active IP Right Grant
-
1999
- 1999-11-22 US US09/444,754 patent/US6354930B1/en not_active Expired - Lifetime
-
2001
- 2001-02-27 US US09/795,282 patent/US6364757B2/en not_active Expired - Lifetime
- 2001-02-27 US US09/795,336 patent/US6537190B2/en not_active Expired - Fee Related
- 2001-08-07 US US09/924,066 patent/US6419572B2/en not_active Expired - Lifetime
- 2001-08-29 US US09/944,257 patent/US6390910B1/en not_active Expired - Lifetime
-
2002
- 2002-03-12 US US10/096,540 patent/US6514130B2/en not_active Expired - Lifetime
- 2002-06-10 US US10/167,102 patent/US6652370B2/en not_active Expired - Lifetime
-
2003
- 2003-10-10 US US10/683,972 patent/US6913519B2/en not_active Expired - Fee Related
-
2005
- 2005-11-28 JP JP2005342957A patent/JP2006108710A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP1042105B1 (en) | 2003-11-12 |
EP1042105A1 (en) | 2000-10-11 |
US20020173171A1 (en) | 2002-11-21 |
US20010049254A1 (en) | 2001-12-06 |
US20010009841A1 (en) | 2001-07-26 |
US20020094765A1 (en) | 2002-07-18 |
KR20010033809A (ko) | 2001-04-25 |
US6419572B2 (en) | 2002-07-16 |
US6913519B2 (en) | 2005-07-05 |
US6354930B1 (en) | 2002-03-12 |
US20040097175A1 (en) | 2004-05-20 |
US6390910B1 (en) | 2002-05-21 |
ATE254012T1 (de) | 2003-11-15 |
JP2001526970A (ja) | 2001-12-25 |
US6139402A (en) | 2000-10-31 |
WO1999033615A1 (en) | 1999-07-08 |
US6652370B2 (en) | 2003-11-25 |
AU2208799A (en) | 1999-07-19 |
US20010006875A1 (en) | 2001-07-05 |
DE69819779T2 (de) | 2004-09-23 |
US6537190B2 (en) | 2003-03-25 |
US20020031984A1 (en) | 2002-03-14 |
DE69819779D1 (de) | 2003-12-18 |
US6364757B2 (en) | 2002-04-02 |
US6514130B2 (en) | 2003-02-04 |
KR100563758B1 (ko) | 2006-03-24 |
JP3774367B2 (ja) | 2006-05-10 |
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