JP2006107854A - Ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket realizing a characteristics test with high reliability. <P>SOLUTION: When a bending part 102 contacts a solder ball 103 and a solder ball 105, a spring 106 is also bent along faces of the solder ball 103 and the solder ball 105. By the above, the bending part 102 pierces the solder ball 103 and the solder ball 105 almost vertically. Consequently, a contact dent remaining on the solder ball 103 and the solder ball 105 gets smaller. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an IC socket used for an electrical characteristic test.

  As an IC socket used in a conventional electrical characteristic test, for example, there is one described in Patent Document 1. FIG. 6 shows an IC socket described in this document.

  An IC socket 1 described in Patent Document 1 has a contact portion 2 that contacts a solder ball 3. The contact portion 2 has a plurality of upright metal blades 4 formed by cutting out a portion near the center of the circular metal plate 5 and bending the notched portion. It is comprised so that it may contact.

Japanese Patent Laid-Open No. 2001-273962

  However, in recent years, the types of solder, including differences in hardness, have been increasing due to lead-free solder balls. In addition, as the number of pins increases, the difference in coplanarity (flatness accuracy) of solder balls is increasing. In the prior art described in Patent Document 1, since the contact is made between the solder ball and the metal wing, the contact mark may become large. Also, when the coplanarity of the solder balls varies, the height of the metal wings is the same, so the solder balls that have contacted earlier may be in strong contact and may be in contact with the solder balls that contacted later. .

  The present invention has been made in view of the above circumstances, and provides an IC socket that realizes a highly reliable characteristic test.

  According to the present invention, an IC socket is mounted on a package via a solder ball provided on the package, and is provided on the main body of the IC socket and on the upper surface of the main body, and is connected to the solder ball. A contact portion, and the contact portion includes a conductive elastic body fixed to the main body and a plurality of conductive terminals provided in the elastic body. A socket is provided.

  According to the present invention, in the IC socket, the plurality of conductive terminals provided in the conductive elastic body and the solder balls provided in the package are in contact. Since the elastic body has elasticity, it is possible to reduce a contact mark generated at the time of contact between the solder ball and the terminal. In addition, the influence on the contact property between the terminal and the solder ball due to the difference in the coplanarity of the solder ball can be reduced.

  ADVANTAGE OF THE INVENTION According to this invention, the IC socket which implement | achieves a reliable characteristic test is provided by having the several terminal which has the electroconductivity with which the elastic body which has electroconductivity was equipped.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  FIG. 1 is a cross-sectional view for explaining a configuration of a BGA IC socket 100 according to the present embodiment.

  The BGA IC socket 100 has a configuration in which a cylindrical conductor 108 is embedded in a main body 101. The cylindrical conductor 108 has an external terminal (not shown) at the lower portion thereof, and is electrically connected to the wiring of a test board for continuity testing. In order to test the continuity of the BGA package 110 described later. Used. Further, the cylindrical conductor 108 is hollow, and a part of a solder ball described later can be accommodated in the upper part of the hollow portion. As a material constituting the main body 101, for example, plastics such as polycarbonate is used. As a material constituting the cylindrical conductor 108, for example, copper or aluminum is used.

  A spring 106, which is a belt-like and plate-like elastic body, is fixed to the BGA IC socket 100 so as to cover at least a part of the cylindrical conductor 108, that is, the ring-shaped recess. Further, as shown in FIG. 3 and FIG. 5A, which is a plan view showing an enlarged part of the spring 106, a cut 112 is made in a part of the spring 106, and the sectional view of the spring 106 in FIG. As shown in the drawing, a plurality of bent portions 102 (contact terminals) formed by raising a portion having the cut 112 are provided in pairs. That is, the bent portion 102 is made of the same material as the spring 106 and is formed integrally with the spring 106. In the present embodiment, the level of the upper surface of the spring 106 is the same as the level of the upper surface of the main body 101. Here, the spring 106 has conductivity, and the bending portion 102 has an acute angle (about 0 to 15 degrees) between the bending portion 102 and the normal of the surface formed by the plate-like spring 106. ) To be bent. As a material constituting the spring 106, for example, steel is used. Further, in order to make the stopper 104 described later function effectively, the spring 106 is provided with, for example, a U-shaped notch as shown in FIG.

  The BGA package 110 has solder balls 103 and solder balls 105 having different diameters. As a material constituting the solder ball 103 and the solder ball 105, lead-free solder or the like is used.

  The spring 106 has stoppers 104 that are fixing tools for fixing the solder balls to both ends thereof. The stopper 104 has a function of preventing the solder ball 103 and the solder ball 105 from coming off from the ring-shaped region above the cylindrical conductor 108 when the BGA package 110 is mounted on the BGA IC socket 100. Have. As a material constituting the stopper 104, for example, a highly rigid metal is used.

  The pair of bent portions 102 and the spring 106 serve as contact portions that electrically connect the solder balls 103 and 105 and the cylindrical conductor 108 when the BGA package 110 and the BGA IC socket 100 are connected. It has the function of.

  The BGA package 110 and the BGA IC socket 100 can be manufactured by a known manufacturing method using the above-described materials.

  Hereinafter, the mechanism when the BGA IC socket 100 is mounted on the BGA package 110 will be described with reference to FIG.

  When performing the electrical characteristic test, when the BGA package 110 is lowered, first, the vicinity of the lower end of the solder ball 103 and the solder ball 105 contacts the vicinity of the center of the spring 106. Next, the spring 106 is gradually bent, and the bent portion 102 pierces the solder ball 103 and the solder ball 105. Here, when the bent portion 102 pierces the solder ball 103 and the solder ball 105, the bent portion 102 contacts the solder ball 103 and the solder ball 105, and is electrically connected. That is, when the solder ball 103 is inserted into the contact portion, the spring 106 is elastically deformed downward, and the solder ball 103 and the bent portion 102 are in contact with each other and are electrically connected. Further, when a force for lowering the BGA package 110 is applied, the presence of the stopper 104 provided on the spring 106 supports the solder ball 103 and the solder ball 105, and the lowering of the BGA package 110 is stopped.

  Hereinafter, the effect of this embodiment will be described.

  As shown in FIG. 2, when the BGA package 110 is lowered and attached to the BGA IC socket 100, when the bent portion 102 comes into contact with the solder ball 103 and the solder ball 105, the spring 106, which is an elastic body, is also attached to the solder ball 103. The solder ball 105 is bent along the curved surface. Therefore, the bent portion 102 pierces almost perpendicularly on the surface where the solder ball 103 and the solder ball 105 and the spring 106 contact. That is, the tip of the bent portion 102 pierces almost vertically toward the center of the spheres of the solder ball 103 and the solder ball 105. Therefore, the area where the bent portion 102 pierces the solder ball 103 and the solder ball 105 can be relatively reduced. As a result, contact marks remaining on the surfaces of the solder balls 103 and the solder balls 105 can be reduced.

  Further, the contact between the solder ball 103 and the solder ball 105 and the spring 106 is made by a bent portion 102 formed by using a part of the spring 106, as shown in FIG. Therefore, even if there is a difference in the coplanarity of the solder balls, the difference in the coplanarity can be absorbed by the bending portion 102 being bent. Therefore, the influence on the contact property between the solder ball and the spring 106 can be reduced. In addition, since the bending portion 102 is bent, the influence on the contact property can be reduced regardless of the magnitude of the bending of the spring 106 itself. Even when there is a difference in diameter between the solder ball 103 and the solder ball 105, the contact between the solder ball and the spring 106 is made by the bent portion 102, so that the influence on the contact property described above can be reduced.

  Further, stoppers 104 are provided at both ends of the spring 106. Therefore, as shown in FIG. 2, even if the solder ball 103 and the solder ball 105 are lowered by lowering the BGA package 110, the lowering of the solder ball 103 and the solder ball 105 can be stopped at the position of the stopper 104. it can. Therefore, the possibility that the solder ball 103 and the solder ball 105 are detached from the hollow portion of the cylindrical conductor 108 can be reduced.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

  For example, in the above embodiment, the spring 106 is provided in one direction and the pair of bent portions 102 are in contact with the solder balls. However, as shown in FIG. 4, the spring 106 is provided in two directions, You may make it contact with a solder ball by two pairs of bending parts. By doing so, the contact property between the solder ball and the spring 106 can be further improved. Further, the springs may be provided not only in one direction or two directions but also in three directions or more, and may be contacted with the solder balls by three or more bending portions.

  Moreover, in the said embodiment, although the part in which the spring 106 was bent and the bending part 102 was formed was demonstrated, the spring which has electroconductivity should just be equipped with the bending part which has electroconductivity. .

  Further, in the above-described embodiment, the form using the spring as the elastic body having conductivity has been described. However, for example, the above-described embodiment can also be used by using an elastic body having conductivity other than the spring, such as conductive rubber. The same effect as described in the above can be obtained.

  Moreover, in the said embodiment, although the form which used the plate-shaped spring was demonstrated as an elastic body, even if it is an elastic body other than a plate shape, the elasticity which can acquire the effect similar to having demonstrated in the said embodiment Any body is acceptable.

  In the above-described embodiment, the form using the cylindrical conductor has been described. However, any conductor may be used as long as the elastic body is in contact with the upper portion and can accommodate a part of the solder ball.

  In the above-described embodiment, a description has been given of a mode in which a part of the spring 106 is cut and a plurality of bent portions 102 are formed by raising the part having the cut. A plurality of bent portions (a plurality of terminals) may be formed by projecting, or a plurality of bent portions may be formed using other methods.

  Moreover, in the said embodiment, although the bending part 102 demonstrated the form formed integrally with the spring 106, it does not need to be integrated.

  In the above-described embodiment, the form in which the level of the upper surface of the spring 106 is the same as the level of the upper surface of the main body 101 has been described.

  Moreover, in the said embodiment, although the strip | belt-shaped and plate-shaped spring 106 was provided so that at least one part of the recessed part of the cylindrical conductor 108 provided in the main body 101 might be covered, other than strip | belt shape was demonstrated. A spring 106 may be provided.

It is sectional drawing which showed typically the IC socket which concerns on embodiment. It is sectional drawing which showed typically the IC socket which concerns on embodiment. It is the top view which showed typically the IC socket which concerns on embodiment. It is the top view which showed typically the IC socket which concerns on embodiment. It is the enlarged view which showed typically the IC socket which concerns on embodiment. It is the figure which showed typically the IC socket which concerns on a prior art.

Explanation of symbols

100 BGA IC socket 101 Body 102 Bending part 103 Solder ball 104 Stopper 105 Solder ball 106 Spring 108 Conductor 110 BGA package 112 Break

Claims (12)

An IC socket attached to the package via solder balls provided on the package,
A body of the IC socket;
A contact portion provided on the upper surface of the main body and connected to the solder ball;
With
The IC socket, wherein the contact portion includes a conductive elastic body fixed to the main body, and a plurality of conductive terminals provided in the elastic body. The IC socket according to claim 1,
The IC socket, wherein the plurality of terminals are formed integrally with the elastic body. The IC socket according to claim 2,
The IC socket, wherein the plurality of terminals are formed by making a cut in a part of the elastic body and raising the cut part. The IC socket according to claim 2,
The plurality of terminals are formed by projecting a part of the elastic body upward. The IC socket according to any one of claims 1 to 4,
When the solder ball is inserted into the contact portion, the elastic body is elastically deformed downward so that the solder ball and the plurality of terminals are in contact with each other. The IC socket according to any one of claims 1 to 5,
The IC socket according to claim 1, wherein the elastic body is a plate-like elastic body. The IC socket according to any one of claims 1 to 6,
In the contact part, the elastic body is a band-shaped elastic body provided so as to cover at least a part of a recess provided in the main body. The IC socket according to any one of claims 1 to 7,
The level of the upper surface of the elastic body is the same as or lower than the level of the upper surface of the main body. The IC socket according to any one of claims 1 to 8,
The IC socket, wherein the plurality of terminals are a pair of terminals. The IC socket according to any one of claims 1 to 8,
The IC socket, wherein the plurality of terminals are two pairs of terminals. The IC socket according to any one of claims 1 to 10,
The IC socket according to claim 1, wherein the contact portion has a fixture for fixing the solder ball. The IC socket according to any one of claims 1 to 11,
The IC socket, wherein the elastic body is a spring.

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