JP2006102268A - Multilayer wiring board for endoscope and endoscope - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board for endoscopes preventing short circuit between wiring patterns by migration and to provide an endoscope with the multilayer wiring board for the endoscopes. <P>SOLUTION: The multilayer wiring board 11 is provided with a substrate 110 comprising a plurality of laminated insulator layers 12-14, a terminal 142 provided on the outer face of the substrate 110 and connected with a terminal 151 provided in an electronic component 15, and the wiring patterns 121 and 141 provided inside the substrate 110 and electrically connected to the terminal 142; and the terminal 142 alone is exposed from the substrate 110. Thus, even if steam intrudes inside the endoscope, the wiring patterns 121 and 141 can be prevented from being directly exposed to the steam. Consequently, this constitution prevents the generation of the migration caused by remaining of moisture between the wires in the wiring patterns 121 and 141 so as to prevent the short circuit of the wiring patterns caused by the generation of the migration. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an endoscope multilayer wiring board and an endoscope.

In the medical field, endoscopes are used for examination and diagnosis of the digestive tract and the like.
Such an endoscope includes an insertion portion to be inserted into a body cavity, an operation portion for operating the insertion portion, a connection portion flexible tube connected to the operation portion, and a distal end portion of the connection portion flexible tube And a light source insertion portion connected to the.

  For example, an image pickup device (CCD) is provided at the distal end of the insertion portion, and an image signal of a subject image picked up by the image pickup device is supplied as a light source via an image signal cable continuously provided in the endoscope. It is transmitted to the plug. And it inputs into the monitor apparatus connected to the light source insertion part.

  By the way, in such an endoscope, a wiring board on which electronic components are mounted at each location is incorporated (for example, refer to Patent Document 1).

  For example, a wiring board having a drive circuit that drives the image sensor, a signal processing circuit that converts a subject image into an image signal, and the like is built in the distal end of the insertion portion. In addition, the light source insertion portion incorporates a wiring board having a signal processing circuit for performing predetermined signal processing on the image signal sent from the image sensor.

  Such a wiring board is usually configured by providing a terminal to which an electronic component is connected and a wiring pattern electrically connected to the terminal on an insulating substrate, and the electronic component is connected to the terminal. As a result, a predetermined circuit is formed.

  However, in such a wiring board, since the wiring pattern is exposed on the surface, the following problems occur particularly when mounted on an endoscope.

  That is, in an endoscope, when an insertion part is inserted into a body cavity, it is contaminated with living tissue or blood. For this reason, after completion of the inspection and processing, cleaning, disinfection and sterilization processing for removing contaminants is performed.

  Among these, sterilization is generally performed by leaving the endoscope for a certain period of time in an autoclave filled with high-temperature and high-pressure steam at 130 ° C. or higher.

  Here, water vapor may enter the endoscope during sterilization by an autoclave. At this time, if the wiring pattern is exposed to the outside, the wiring pattern is exposed to moisture, and moisture remains on the wiring pattern. In particular, if moisture remains between two points where the applied voltages of the wiring patterns are different, migration occurs through the moisture, causing a problem that the two points are short-circuited.

JP 2003-169773 A

  An object of the present invention is to provide a multilayer wiring board for an endoscope in which a short circuit between wiring patterns due to migration is prevented, and an endoscope including such a multilayer wiring board for an endoscope.

Such an object is achieved by the present inventions (1) to (6) below.
(1) An endoscope multilayer wiring board used for an endoscope,
An insulating substrate;
A terminal connected to a terminal included in the electronic component;
A wiring pattern electrically connected to the terminal;
A multilayer wiring board for an endoscope, wherein the wiring pattern is provided inside the board, leaving the terminals.

  Thereby, it is possible to prevent moisture from being stored between the wirings of the wiring pattern, and as a result, it is possible to prevent a short circuit between the wiring patterns due to the occurrence of migration.

(2) The substrate is composed of a plurality of laminated insulator layers,
The multilayer wiring board for an endoscope according to (1), wherein the wiring pattern is provided between the insulator layers.

  Thereby, it can prevent more reliably that a water | moisture content accumulates between the wiring of a wiring pattern.

  (3) The insulator layer provided with the terminal is formed with a through hole, and the terminal and the wiring pattern are electrically connected via a conductive portion provided in the through hole. (1) Or the multilayer wiring board for endoscopes as described in (2).

  Thereby, it can prevent more reliably that a water | moisture content accumulates between the wiring of a wiring pattern.

  (4) The multilayer wiring board for an endoscope according to any one of (1) to (3), wherein the terminal protrudes from an outermost surface of the board, and a protruding height thereof is larger than a thickness of the wiring pattern. .

  Thereby, the air permeability between the electronic component connected to the terminal and the substrate is maintained, and it is possible to prevent moisture from being stored between the terminals of the electronic component. As a result, due to the occurrence of migration A short circuit between terminals of the electronic component can be prevented.

  (5) In the above (4), when the protruding height of the terminal is A [μm] and the thickness of the wiring pattern is B [μm], A / B satisfies the relationship of 1.5 or more. Multi-layer wiring board for endoscopes.

  Thereby, air permeability is more reliably ensured between the electronic component connected to the terminal and the insulator layer.

(6) An endoscope comprising the endoscope multilayer wiring board according to any one of (1) to (5).
Thereby, a highly reliable endoscope is obtained.

  According to the present invention, since only the terminals are exposed from the substrate and the wiring pattern is not exposed from the substrate, moisture remains between the wiring patterns even when the multilayer wiring substrate for endoscope is exposed to water vapor. Is prevented.

  Therefore, the migration between the wiring patterns caused by moisture is suppressed, and a short circuit between the wiring patterns due to the migration is prevented.

  Hereinafter, a multilayer wiring board for an endoscope and an endoscope according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<Endoscope>
First, an endoscope in which the endoscope multilayer wiring board of the present invention is built will be described by taking an electronic endoscope as an example.

  FIG. 1 is an overall view showing an electronic endoscope (electronic scope). Hereinafter, in FIG. 1, the upper side is described as “base end” and the lower side is described as “tip”.

  An electronic endoscope 1 shown in FIG. 1 is connected to a long insertion tube flexible tube 2 having flexibility (softness) and a proximal end portion of the insertion tube flexible tube 2 and is grasped by an operator. Then, an operation unit 6 for operating the entire electronic endoscope 1, a connection portion flexible tube 7 connected to the operation unit 6, and a light source insertion portion 8 connected to the distal end portion of the connection portion flexible tube 7 have.

  The insertion portion flexible tube 2 is used by being inserted into a body cavity. As shown in FIG. 1, the insertion portion flexible tube 2 has a flexible tube portion 20 from the hand (base end) side, and a bending portion 21 that is provided at the distal end portion of the flexible tube portion 20 and can be bent. is doing.

  As shown in FIG. 1, the outer surface of the insertion portion flexible tube 2 is provided with a scale 22 for displaying the insertion depth into the body cavity. As a result, when the insertion portion flexible tube 2 is inserted into the body cavity, the tip of the insertion portion flexible tube 2 can be reliably guided to a desired position by operating while observing the scale 22. it can.

  An imaging device (CCD) (not shown) that captures a subject image at the observation site is provided inside the distal end portion of the bending portion 21, and this imaging device is provided in the insertion portion flexible tube 2, the operation portion 6, and the connection. It is connected to an image signal connector 82 provided in the light source insertion portion 8 by an image signal cable (not shown) continuously disposed in the flexible tube 7.

  Further, a light source connector 81 is provided along with an image signal connector 82 at the distal end of the light source insertion portion 8, and the light source connector 81 and the image signal connector 82 are connected to a connection portion of a light source processor device (not shown). The light source insertion unit 8 is connected to the light source processor device. A monitor device (not shown) is connected to the light source processor device via a cable.

  The light emitted from the light source processor device is continuously arranged in the light source connector 81 and the light source insertion portion 8, the connection portion flexible tube 7, the operation portion 6 and the insertion portion flexible tube 2. Through the light guide (not shown), the observation site is irradiated and illuminated from the distal end of the bending portion 21 (insertion portion flexible tube 2). Such a light guide is configured by bundling a plurality of optical fibers made of, for example, quartz, multicomponent glass, plastic, or the like.

  The reflected light (subject image) from the observation site illuminated by the illumination light is imaged by the image sensor. The image sensor outputs an image signal corresponding to the captured subject image. This image signal is transmitted to the light source insertion unit 8 via the image signal cable.

  Then, predetermined processing (for example, signal processing, image processing, etc.) is performed in the light source insertion unit 8 and the light source processor device, and then input to the monitor device. In the monitor device, an image (electronic image) captured by the image sensor, that is, an endoscope monitor image of a moving image is displayed.

  Further, the operation unit 6 is provided with a first operation knob 61, a second operation knob 62, a first lock lever 63, and a second lock lever 64 on the upper surface in FIG. .

  When the operation knobs 61 and 62 are rotated, a wire (not shown) disposed in the insertion portion flexible tube 2 is pulled, so that the bending portion 21 is bent in four directions, and the direction of the bending portion 21 is changed. Can be changed.

  Further, when the lock levers 63 and 64 are rotated counterclockwise, the bending state (the bending state in the vertical direction and the horizontal direction) of the bending portion 21 can be fixed (held), respectively. When the rotation operation is performed, the bending portion 21 fixed in the bent state can be released.

  Further, a plurality (three in this embodiment) of control buttons 65, suction buttons 66, and air / liquid feeding buttons 67 are provided on the side surface (circumferential surface) in FIG.

  While the electronic endoscope 1 is connected to the light source processor device (external device), by pressing each control button 65, various operations of peripheral devices such as the light source processor device and the monitor device (for example, moving images of electronic images) And a still image, an electronic image filing system and an imaging device can be operated and / or stopped, and an electronic image recording device can be operated and / or stopped.

  The suction button 66 and the air / liquid supply button 67 are respectively formed continuously in the light source insertion portion 8, the connection portion flexible tube 7, the operation portion 6 and the insertion portion flexible tube 2, respectively. Has a function of opening and closing a suction channel and an air / liquid feeding channel (both not shown) opened at the distal end of the insertion portion flexible tube 2 and opened at the other end by the light source insertion portion 8.

  That is, before the suction button 66 and the air / liquid feeding button 67 are pressed, the suction channel and the air / liquid feeding channel are closed (the fluid cannot pass through), When the suction button 66 and the air / liquid feeding button 67 are pressed, the suction channel and the air / liquid feeding channel are communicated (the fluid can pass).

  When the electronic endoscope 1 is used, suction means is connected to the other end of the suction channel, and air supply / liquid supply means is connected to the other end of the air / liquid supply channel.

  Thereby, in a state where the suction channel is in communication, body fluid or blood in the body cavity can be sucked from the distal end of the insertion portion flexible tube 2, and in the state where the air / liquid supply channel is in communication, the insertion portion Liquid or gas can be supplied from the distal end of the flexible tube 2 into the body cavity.

<Multilayer wiring board for endoscope>
Next, a multilayer wiring board for endoscopes (hereinafter simply referred to as “multilayer wiring board”) of the present invention will be described.

  FIG. 2 is a cross-sectional view showing an embodiment of an endoscope multilayer wiring board. In the following description, the upper side is “upper” and the lower side is “lower” in FIG.

  The multilayer wiring board 11 is built in each part of the electronic endoscope 1 as described above in a state where the electronic component 15 is mounted and a predetermined circuit is formed.

  For example, the multilayer wiring board 11 on which a drive circuit for driving the image sensor, a signal processing circuit for converting a subject image into an image signal, and the like are built in the distal end portion of the bending portion 21. In addition, the light source insertion portion incorporates a multilayer wiring board 11 in which a signal processing circuit for performing predetermined signal processing on the image signal sent from the image sensor is formed.

  2 includes a substrate 110 in which a first insulator layer 12, a second insulator layer 13, and a third insulator layer 14 are laminated in this order, and an upper surface (outermost surface) of the substrate 110. ) 111 and a plurality of terminals 142 projecting from the first wiring pattern 111 and a first wiring pattern 121 and a second wiring pattern 141 provided inside the substrate 110 (between the insulating layers).

  Each insulator layer functions as a shielding material that supports the first wiring pattern 121, the second wiring pattern 141, and the terminal 142, and prevents water vapor from entering the inside of the multilayer wiring board 11, respectively. Is.

  As a constituent material of these insulator layers, for example, either an organic or inorganic material may be used, or a composite material thereof may be used.

  Here, examples of the inorganic material include a ceramic material and a glass material, and examples of the organic material include a resin material such as a polyimide resin.

  Moreover, as an insulator layer comprised with a composite material, the thing formed by impregnating an epoxy resin, a polyimide resin, etc. in fillers (reinforcing material), such as a glass cloth, a glass filler, an aramid resin, and paper, is mentioned, for example. It is done.

  Among these, each insulator layer (particularly, the first insulator layer 12 and the third insulator layer 14) is preferably obtained by impregnating a polyimide resin into a filler. This is excellent in heat resistance and moisture resistance, and can effectively prevent water vapor from entering the multilayer wiring board 11 during autoclave sterilization or the like.

  Each insulator layer may have a single layer structure or a multilayer structure in which two or more layers are stacked.

  In the first insulator layer 12, a first wiring pattern 121 is formed on the surface (upper surface) on the second insulator layer 13 side.

  On the other hand, a second wiring pattern 141 is formed on the surface (lower surface) of the third insulator layer 14 on the second insulator layer 13 side, and the surface on the opposite side to the second insulator layer 13 ( A plurality of terminals 142 are formed on the upper surface 111).

  The terminal 142 constitutes an electrical connection unit connected to the terminal 151 provided in the electronic component 15 such as a resistor, a capacitor, a diode, a transistor, or an IC.

  The first wiring pattern 121 and the second wiring pattern 141 are each electrically connected to the terminal 142.

  As a constituent material of the first wiring pattern 121, the second wiring pattern 141, and the terminal 142, for example, Au, Sn, Cu or an alloy containing them, a conductive oxide such as ITO, FTO, and the like can be given. These 1 type or 2 types or more can be used in combination (for example, as a laminated body).

  A plurality of through holes 131 are formed through the second insulator layer 13, and a plurality of through holes 143 are formed through the third insulator layer 14.

  Conductive portions 132 and 144 are provided in the through hole 131 and the through hole 143, respectively, and the first wiring pattern 121 and the second wiring pattern 141 are provided by the conductive portion 132, and the terminal 142 is provided by the conductive portion 144. And the second wiring pattern 141 are electrically connected to each other.

  The conductive part 132 and the conductive part 144 are each composed of, for example, a conductive paste or a metal plating layer containing conductive particles and a binder.

  Examples of the conductive particles used in the conductive paste include silver particles and copper particles. Examples of the binder include polycarbonate resin, polysulfone resin, polyester resin, phenoxy resin, phenol resin, and polyimide resin.

  In such a multilayer wiring board 11, each terminal 142 protrudes (exposes) from the upper surface (outermost surface) 111 of the third insulator layer 14 (substrate 110), leaving these terminals 142, and the first wiring The pattern 121 and the second wiring pattern 141 are provided inside the substrate 110.

  Therefore, even when water vapor enters the electronic endoscope 1 due to autoclave sterilization or the like, each insulator layer serves as a shielding material, and the first wiring pattern 121 and the second wiring pattern 141 are directly exposed to water vapor. Can be prevented.

  Thereby, in the first wiring pattern 121 and the second wiring pattern 141, the occurrence of migration due to moisture remaining between the wirings is prevented, and the short circuit of the wiring pattern due to the occurrence of migration is prevented.

  The protruding height of the terminal 142 from the upper surface 111 of the substrate 110 is preferably larger than the thickness of the wiring patterns 121 and 141. By making the height of the terminal 142 relatively high, a relatively large gap is formed between the electronic component 15 connected to the terminal 142 and the third insulator layer 14 (multilayer wiring board 11), thereby allowing ventilation. Sex is secured.

  As a result, even when water vapor enters the electronic endoscope 1 during autoclave sterilization or the like, moisture hardly remains between the electronic component 15 and the third insulator layer 14, and the terminal 151 of the electronic component 15. It is possible to effectively prevent moisture from remaining between them and to prevent a short circuit due to the occurrence of migration at the portion.

  Specifically, when the protruding height of the terminal 142 is A [μm] and the thickness of the wiring pattern 141 (121) is B [μm], the relationship that A / B is 1.5 or more is satisfied. Is preferable, and it is more preferable to satisfy the relationship of 2 or more. Thereby, the said effect is exhibited more notably.

  In the present embodiment, the thickness of the wiring pattern 121 is substantially equal to the thickness of the wiring pattern 141. However, when these are different or when three or more different wiring patterns are formed, the terminal 142 The protruding height is preferably set to be larger than the thickness of the maximum wiring pattern.

  In particular, in the multilayer wiring board 11 of the present embodiment, the second wiring pattern 141 and the terminal 142 are not formed in the same plane, that is, the second wiring pattern 141 and the terminal 142 are individually formed. The terminal 142 having such a height can be easily formed.

Such a multilayer wiring board 11 can be manufactured as follows, for example.
<1> First, the first insulator layer 12 is prepared, and the first wiring pattern 121 is formed on the upper surface of the first insulator layer 12.

  This can be formed, for example, by providing a conductive film on the upper surface of the first insulator layer 12 and then removing unnecessary portions by etching.

  <2> Also, a third insulator layer 14 is prepared and formed through the through hole 143 by, for example, laser processing.

  Next, the conductive portion 144 is formed in the through hole 143 by, for example, a method of supplying a conductive paste or a plating method.

  Next, similarly to the formation of the first wiring pattern 121, the second wiring pattern 141 is formed on the lower surface of the third insulator layer 14, and the terminal 142 is formed on the upper surface.

  <3> Next, the conductive portion 132 is formed at a predetermined location of the first wiring pattern 121 by, for example, plating.

  <4> Next, a curable resin precursor such as a thermosetting resin or a photocurable resin is supplied to the upper surface of the first insulator layer 12.

  <5> Next, the first insulator layer 12 and the third insulator layer 14 are arranged and approached so that the first wiring pattern 121 and the second wiring pattern 141 face each other.

In this state, the curable resin precursor is cured. Thereby, the second insulator layer 13 is formed, and the first insulator layer 12 and the second insulator layer 14 are joined.
The multilayer wiring board 11 is obtained through the steps as described above.

  As mentioned above, although the multilayer wiring board for endoscopes and the endoscope of the present invention have been described with respect to the illustrated embodiments, the present invention is not limited thereto.

  For example, the multilayer wiring board of the present invention is not limited to a laminate of three insulating layers, and may have a two-layer configuration or a multilayer configuration of four or more layers.

  Further, the part in which the multilayer wiring board is built is not limited to the inside of the distal end portion of the bending portion or the light source insertion portion.

  Further, the endoscope in which the multilayer wiring board of the present invention is built is not limited to an electronic endoscope, may be an optical endoscope (fiberscope), and is not limited to a medical endoscope, It may be an endoscope used for industrial use.

It is a general view which shows an electronic endoscope (electronic scope). It is sectional drawing which shows embodiment of the multilayer wiring board for endoscopes of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic endoscope 2 Insertion part flexible tube 20 Flexible tube part 21 Bending part 22 Scale 6 Operation part 61 1st operation knob 62 2nd operation knob 63 1st lock lever 64 2nd lock lever 65 Control button 66 Suction button 67 Air / Liquid Feed Button 7 Connection Portion Flexible Tube 8 Light Source Insertion Portion 81 Light Source Connector 82 Image Signal Connector 11 Multilayer Wiring Board 110 Substrate 111 Top Surface 12 First Insulator Layer 121 First Wiring Pattern 13 First 2 insulator layer 131 through hole 132 conductive portion 14 third insulator layer 141 second wiring pattern 142 terminal 143 through hole 144 conductive portion 15 electronic component 151 terminal

Claims (6)

A multilayer wiring board for an endoscope used for an endoscope,
An insulating substrate;
A terminal connected to a terminal included in the electronic component;
A wiring pattern electrically connected to the terminal;
A multilayer wiring board for an endoscope, wherein the wiring pattern is provided inside the board, leaving the terminals. The substrate is composed of a plurality of laminated insulator layers,
The multilayer wiring board for an endoscope according to claim 1, wherein the wiring pattern is provided between the insulator layers.   A through hole is formed in the insulator layer provided with the terminal, and the terminal and the wiring pattern are electrically connected through a conductive portion provided in the through hole. 3. A multilayer wiring board for an endoscope according to 2.   The multilayer wiring board for an endoscope according to any one of claims 1 to 3, wherein the terminal protrudes from an outermost surface of the board, and a protruding height thereof is larger than a thickness of the wiring pattern.   The endoscope according to claim 4, wherein A / B satisfies a relationship of 1.5 or more when a protruding height of the terminal is A [μm] and a thickness of the wiring pattern is B [μm]. Multi-layer wiring board.   An endoscope comprising the multilayer wiring board for an endoscope according to any one of claims 1 to 5.

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