JP2006100852A - Exposure device and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the weight of a movable body without adversely affecting its properties, such as controllability, stiffness, and the like, which are required for it. <P>SOLUTION: In a stage device which has a movable body which is supported by a reference plane and is movable, a first hydrostatic bearing for supporting the movable body on the reference plane so as not to be contact with each other, a guide which has a guideway which guides the movable body in a predetermined direction, a second hydrostatic bearing for maintaining the guideway and the movable body so as not to be contact with each other, and a linear motor in which a moving element is provided in the movable body side. Lightening hole is formed in at least one part of the movable body to which the first hydrostatic bearing, the second hydrostatic bearing and the linear motor moving member are joined. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an exposure apparatus and a device production method used in a lithography process of a semiconductor device or a liquid crystal device.

Conventionally, as an exposure apparatus used for manufacturing a semiconductor device or the like, a pattern of an original (reticle or mask) is projected through a projection optical system to a plurality of exposure areas on the substrate while moving the substrate (wafer or glass substrate) stepwise. Step-and-repeat type exposure apparatus (sometimes referred to as a stepper) that performs sequential exposure, or step-and-scan type that repeats exposure transfer to multiple areas on the substrate by repeating step movement and scanning exposure A typical exposure apparatus (sometimes referred to as a scanner or a scanning exposure apparatus).
In particular, the step-and-scan type uses only a portion of the projection optical system that is relatively close to the optical axis, which is limited by the slit, so that it is possible to expose a fine pattern with higher accuracy and wider field of view. And is expected to become the mainstream in the future.
These exposure apparatuses have a stage device (wafer stage, reticle stage) that moves and positions the wafer and reticle at high speed. When the stage is driven, a reaction force of inertia force accompanying acceleration / deceleration occurs. If it is transmitted to the surface, it will cause shaking and vibration of the surface plate and the floor to fix it.
These vibrations excite the natural vibrations of the mechanism system of the exposure apparatus and become vibrations, which may hinder high-speed and high-accuracy positioning.
Recently, the stage acceleration accompanying the improvement of the processing speed (throughput) is steadily increasing. For example, in a step-and-scan type exposure apparatus, the maximum acceleration of the stage now reaches 4G for the reticle stage and 1G for the wafer stage. .
Furthermore, the stage mass has increased with the increase in size of the reticle and substrate. For this reason, the driving force defined by <mass of moving body> × <acceleration> is very large, and the reaction force is enormous.
Therefore, the vibration of the installation floor due to the increase in acceleration and weight has become a problem that cannot be overlooked.

In view of this, so-called fleshing, in which grooves and cavities are provided in the stage movable member and the stage surface plate constituting the stage to reduce their weight, has been performed.
However, when such a lightening is performed, sub-resonance occurs in the stage movable member and the stage surface plate, and vibration of the floor and the like easily propagates to the stage movable part through the stage fixed part, thereby improving the controllability of the stage. It was getting worse.
In addition, from the viewpoint of workability, it is common to cut out the meat so that a groove is formed on the surface of the solid material. Therefore, rigidity is insufficient, or conversely, an attempt is made to secure rigidity. As a result, it was not possible to reduce the weight by sufficiently removing the meat.
Furthermore, since air-conditioning air blows on the top plate located at the top of the stage, if the top plate is thinned, there is a problem that air-conditioning air turbulence is caused and exposure accuracy deteriorates.
The present invention has been made in view of the above-described problems in the conventional example, and an object of the present invention is to reduce the weight of the moving body without adversely affecting the controllability, rigidity, and other characteristics necessary for the moving body.

The exposure apparatus of the present invention comprises a chuck that holds and holds a substrate, a stage on which the chuck is mounted, and means for exposing the substrate held on the chuck,
The chuck has a rib structure on the back side of the surface that adsorbs the substrate,
The interval between the ribs is set to be not less than the maximum exposure field angle to the substrate and not more than the radius of the maximum size of the substrate to be held.
Furthermore, the exposure apparatus of the present invention is an exposure apparatus that performs exposure while moving the moving body in a predetermined direction,
A chuck for adsorbing and holding a substrate, a stage on which the chuck is mounted, and means for exposing the substrate held by the chuck,
The chuck has a rib structure on the back side of the surface that adsorbs the substrate,
A plurality of the ribs are formed along a direction orthogonal to the predetermined direction.
Furthermore, the device manufacturing method of the present invention is characterized in that a device is manufactured by a manufacturing process including a step of preparing the exposure apparatus and a step of exposing the substrate using the exposure apparatus.

According to the exposure apparatus of the present invention, comprising: a chuck for adsorbing and holding a substrate; a stage on which the chuck is mounted; and means for exposing the substrate held on the chuck;
The chuck has a rib structure on the back side of the surface that adsorbs the substrate,
The interval between the ribs is set to be not less than the maximum exposure angle of view to the substrate and not more than the radius of the maximum size of the substrate to be held.
According to this configuration, the weight of the chuck can be reduced. Further, by arranging the rib on the back surface, it is possible to prevent the deformation in the plane direction during the plane correction.
Furthermore, according to the exposure apparatus of the present invention, the exposure apparatus performs exposure while moving the moving body in a predetermined direction,
A chuck for adsorbing and holding a substrate, a stage on which the chuck is mounted, and means for exposing the substrate held by the chuck,
The chuck has a rib structure on the back side of the surface that adsorbs the substrate,
A plurality of the ribs are formed along a direction orthogonal to the predetermined direction.
According to this configuration, since the rib is passed only in one direction, the chuck can be further reduced in weight.
Since the rib direction is perpendicular to the stage scanning direction, the wafer can be flattened in the direction perpendicular to the stage scanning direction, but cannot be corrected in a direction parallel to the stage scanning direction.
However, in the scanning exposure apparatus, waviness in the scanning direction can be corrected by exposure surface position control based on so-called pre-read focus measurement, so there are few problems.
Moreover, according to the device manufacturing method of the present invention, it is possible to provide a device production method with excellent productivity using the exposure apparatus of the present invention.

As described above, according to the present invention, it is possible to reduce the weight and weight while securing the rigidity of the moving body.
Therefore, it is possible to suppress the occurrence of sub-resonance of the movable part that occurs during drive control of the moving body, improve the response controllability of the moving body, shorten the settling time to the target position, and improve the positioning accuracy.
As a result, the exposure apparatus having such a stage can improve throughput and exposure accuracy.

Embodiments of the present invention will be described below with reference to the drawings.

First Embodiment FIG. 1 shows the configuration of a stage apparatus constituting a scanning exposure apparatus according to a first embodiment of the present invention.
In the figure, 1 is a stage surface plate, 2 is a stator of a Y linear motor that drives in the Y direction, 3 is a Y guide that performs linear motion guide in the Y direction, 4 is a movement in the Y direction, and will be described later. This is a Y stage equipped with an X guide. Reference numeral 5 denotes a stator of an X linear motor that drives in the X direction, 6 denotes an X guide that performs linear motion guide in the X direction, and 7 denotes an X slider that moves in the X direction. Since the X linear motor stator 5 is coupled to the Y stage 4 that is movable in the Y direction, the X slider 7 is freely movable in both the X direction and the Y direction. Reference numeral 8 denotes an X-bottom air pad that constitutes a hydrostatic bearing, and the Y stage 4 and the X stage 7 are floated from the stage surface plate 1 by several μm to several tens of μm. Reference numeral 9 denotes a fine movement top plate which can move in the Z direction and rotate in the rotation directions around the XYZ axes. Reference numeral 10 denotes a chuck for attracting a wafer (not shown).

FIG. 2 shows a cross-sectional structure of the stage surface plate 1 in FIG. 1, and FIG. 3 shows a cross-sectional structure of the X slider 7. In the figure, reference numerals 21, 31, 32, and 33 denote thinned portions, which are filled with a damping material such as damping rubber, gel-like rubber, resin, or liquid.
In the conventional stage movable member, since the member is not filled with a damping material, the controllability is deteriorated when the movable member causes sub-resonance during stage drive control. Moreover, since the stage fixing portion was not filled with the damping material, the vibration transmitted to the stage fixing portion could not be attenuated and propagated to the stage movable portion, thereby deteriorating controllability.
In this embodiment, therefore, a ceramic having high rigidity and high specific strength is used for the material of the stage movable part (X slider 7, X guide 6, X linear motor stator 5, fine movement top plate 9 and the like), and the thickness is reduced. In order to reduce the weight of the movable part of the stage, it is possible to move the stage by filling the thinned parts 31, 32, 33 with a damping material (damping rubber, gel rubber, resin, liquid, etc.). The peak of partial sub-resonance is limited.
In addition, the stage fixing part (stage surface plate 1, Y guide 2 and the like) is similarly cut out, and damping material (damping rubber, gel rubber, resin, liquid, etc.) is applied to the cutout part 21. By filling, the vibration propagating from the outside of the unit to the stage fixing part is restricted, and the propagation of the vibration generated by the movement of the stage movable part to the outside of the stage is restricted.

Thus, the stage response controllability is improved by filling the movable part of the stage and the lightening part of the fixed part with damping material and attenuating the sub-resonance generated in the movable part during stage control and the vibration propagating from outside the unit. As a result, the settling time to the target position is shortened and the positioning accuracy is improved. As a result, when the stage apparatus of this embodiment is used in an exposure apparatus, the throughput of the exposure apparatus and the exposure accuracy can be improved. Become.
In this embodiment, the center of gravity and the power point are made to coincide after the damping material is filled. That is, the center of gravity of the X stage including the X slider 7, the fine movement top plate 9 and the chuck 10 is made to coincide with the driving force point of the X linear motor, and the X stage, the X linear motor stator 5, the X guide 6 and the Y stage 4 are moved. The combined center of gravity is made to coincide with the driving force point of the Y linear motor. Thereby, the controllability of the stage can be further improved, and the throughput and exposure accuracy of the exposure apparatus can be further improved.
The reason why the center of gravity coincides with the power point is to prevent pitching and rolling during stage movement by preventing a rotational moment from being applied to the stage movable part. However, even a hydrostatic bearing frequently used in this type of stage apparatus has a resistance component such as the friction of the bearing and the viscosity of the attraction magnet for improving the hydrostatic fluid and bearing rigidity. In consideration of such a resistance component, it is preferable to bring the center of gravity of the movable part to a position higher than the driving force point by the linear motor.

Second Embodiment FIG. 4 shows the configuration of an X stage according to a stage apparatus constituting an exposure apparatus according to a second embodiment of the present invention.
In the figure, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals. 41 is an X bottom plate constituting the X slider 7, 42 is an X horizontal air pad constituting a hydrostatic bearing for supporting the X slider 7 in the Y direction with respect to the X guide 6, and 43 is a mover of the X linear motor. . The mover is a magnet when the linear motor is a magnet movable type, and is a coil when the linear motor is a coil movable type. In addition, the stator is a coil in a magnet movable linear motor, and is a magnet in a coil movable type linear motor.
Rigidity could not be ensured by removing the movable part in the conventional stage device. That is, conventionally, it was impossible to reduce the weight by removing the movable part while securing the rigidity.
In this embodiment, the inner side surface of the X slider 7 of the stage movable portion is formed into a thinned shape, and the base of the X linear motor movable element 43 and the base of the X side air pad 42 are joined to the thinned surface. 32 and 33 are box-shaped and closed. Thereby, weight reduction can be achieved, without reducing the rigidity of a stage movable part.
Further, the side surface of the X bottom air pad 8 of the X bottom plate 41 of the stage movable part is made into a thinned shape, and the base of the X bottom air pad 8 is joined to the thinned surface, thereby closing the thinned portion 31 in a box shape. It has a structure. Thereby, weight reduction can be achieved, without reducing the rigidity of a stage movable part.
Further, the inner surface of the X guide 6 on the X linear motor stator 5 side of the X guide 6 of the stage movable portion is made into a thinned shape, and the base of the X linear motor stator 5 is joined to the thinned surface, thereby removing the thinning. The part (not shown) is a box-type closed structure. Thereby, weight reduction can be achieved, without reducing the rigidity of a stage movable part.

FIG. 5 shows a state in which the fine movement top plate 9 is mounted on the X slider 7 of FIG.
In the figure, reference numeral 51 denotes a radial guide which serves as a guide when the fine movement top plate 9 is finely moved around the Z and XYZ axes.
In this embodiment, as shown in FIGS. 4 and 5, the inner surface of the X slider 7 of the stage movable portion is made thin, and the fine grounding plate landing surface and the radial guide coupling surface side are made flat so that the thin portion A wide flat surface 52 necessary for positioning the radial guide 8 and the fine movement top plate 9 can be efficiently secured on the back side of the plate.
According to the present embodiment, while ensuring high rigidity of the stage movable part, it is possible to reduce the weight of the movable part, suppress the occurrence of sub-resonance of the movable part during stage control, and improve the stage response controllability. In addition, the settling time to the target position can be shortened and the positioning accuracy can be improved. As a result, the throughput of the exposure apparatus and the exposure accuracy can be improved.

Third Embodiment FIG. 6 shows a stage apparatus constituting an exposure apparatus according to a third embodiment of the present invention.
This embodiment shows an example in which the present invention is applied to a fine top plate 9. In the figure, 61 is a thinned portion, 62 is a wafer that is sucked and held by the chuck 10, 63 is a Y bar mirror for measuring the position of the stage in the Y direction, and 64 is conditioned air.
In the conventional finely adjustable top plate of the stage movable member, the weight of the movable portion has not been reduced by securing the rigidity and eliminating the disturbance of the air-conditioning air and then removing the movable portion.
According to the present embodiment, the wafer 62, the chuck 10, the bar mirror 63, and the like are supported while reducing the weight by providing the lightening portion 61 on the back surface of the fine movement top plate 9 that does not serve as a flow path for the air-conditioning air 64. By making the front surface of the fine movement top plate 9 the flat surface 65, the flow path of the air-conditioning air 64 on the surface of the fine movement top plate 9 can be made flat, and the turbulence (turbulence) of the air-conditioning air flow near the stage is generated. Can be prevented. In addition, by reducing the weight of the fine movement top plate, the high-speed response controllability of the stage is improved, the settling time to the target position is shortened, and the positioning accuracy is improved. As a result, the throughput of the exposure apparatus and the exposure accuracy are improved. Improvement is possible.

Fourth Embodiment Also in the second and third embodiments described above, the centers of gravity of the movable parts of the assembled X and Y stages are made to substantially coincide with the driving force points of the X and Y linear motors, respectively, or It is preferable to adjust the driving force point to a lower position.
For example, as shown in FIG. 7 (a), to match the center of gravity G _x of X movable portion 71 made of X-slider 7 and X linear motor movable element 43 to the driving force point F _x X linear motor, further, FIG. 7 ( As shown in b), the Y stage movable unit composed of the X movable unit 71, the X linear motor 72, the Y slider 73, the mover of the Y linear motor 74, and the like when the X movable unit 71 is positioned at the scanning exposure center. The center of gravity G _y is made to coincide with the driving force point F _y of the Y linear motor 74. The driving force point F _y is a force point obtained by combining the driving force point J ₁ of the left Y linear motor 74 and the driving force point J ₂ of the right Y linear motor 74.
In general, the center of gravity _Gx of the X movable portion 71 is below the center as shown in FIG. 8A if the X movable portion 71 is a solid material. In order to make this coincide with the driving force point F _x that is generally at the center of the X movable portion 71 or bring it above the force point F _x , the center of gravity G _x of the X movable portion 71 must be increased. The method is shown in FIGS. 8 (b) and (c). FIG. 8B shows an example in which the upper thinned portions 81 and 82 of the X movable portion 71 are thinned and the lower thinned portions 83 and 84 are largely thinned. FIG. 8C shows an example in which a damping material is filled, in which an upper filling portion is filled with a heavy filling material 85 and a lower filling portion is filled with a heavy filling material 86.

Fifth Embodiment FIG. 9 shows a wafer stage according to a stage apparatus constituting an exposure apparatus according to a fifth embodiment of the present invention.
Portions that are the same as or correspond to those in FIGS. In the figure, 91 is an attaching / detaching fork for automatically attaching and detaching the chuck, and 92 is an X bar mirror.
FIG. 10 is a side view of the chuck 10 of this embodiment, and FIG. 11 is a side view of a conventional chuck. Moreover, FIG. 12 is the figure which looked up at the chuck | zipper 10 of a present Example from the lower side. In the figure, 101 is a thinned portion (or step), 121 is a lift pin through hole, and 122 is a wafer suction vacuum hole.
In order to automatically replace the chuck 10, the chuck has been conventionally used by a robot conveyance system. At that time, an attaching / detaching hand composed of two forks 91 enters between the stage top plate (fine movement top plate) 9 and the chuck 10 and lifts the chuck to perform an exchange operation. Since the chuck mounted on the stage top plate has a function for correcting the flatness of the wafer, it has to be thick enough to ensure sufficient rigidity.
Conventionally, the exchange fork has been exchanged by inserting a chuck attachment / detachment fork 91 from the outside into a gap formed by raising the stage top plate 9 as shown in FIG. However, in the future, in order to reduce the weight of the stage, it is necessary to reduce the height of the stage movable portion, and in particular, the chuck 10 located at the upper portion is highly required to be close to the center of gravity of the movable portion.

In this embodiment, the chuck can be brought close to the stage top plate while the space of the fork 91 is secured. That is, in this embodiment, a step 101 is partially provided on the back side of the chuck 10, and a space is provided between the stage top plate 9 and the chuck 10. The step 101 is provided in a direction (X-axis direction) orthogonal to the scanning exposure direction (Y-axis direction). Therefore, the fork 91 enters from a direction orthogonal to the scanning direction.
Therefore, according to this embodiment, the center of gravity of the chuck approaches the center of the stage movable part, and the dynamic characteristics of the stage are improved. That is, the moment of inertia is reduced and the control characteristics are improved. In addition, since the surface (image plane) of the wafer 62 approaches the stage top plate 9, the beam position for interferometer measurement at the image plane height is lowered, the required height of the bar mirrors 63 and 92 themselves is low, and the mass can be reduced. Thus, weight reduction can be achieved more effectively. Moreover, since the height of the bar mirrors 63 and 92 can be reduced, the unevenness on the stage top plate 9 can be reduced, and the occurrence of turbulence (turbulent flow) of air-conditioning air in the vicinity of the stage can be prevented.

Sixth Embodiment FIG. 13 is a view of the chuck 10 according to the exposure apparatus of the sixth embodiment of the present invention as seen from below.
The chuck 10 is configured to be thin as a whole, and concentric annular ribs 131 to 134 and a radial rib 135 are provided on the back surface and are reinforced by a combination of these ribs. In other words, the back surface of a conventional chuck having a sufficient thickness is thinned to reduce the weight of the chuck while maintaining the wafer flatness correction force by the chuck.
Conventional wafer chucks have a disc shape in accordance with the exposure substrate. A wafer having a warp was sucked and held by vacuum suction so that the entire surface of the wafer was flattened to have a flatness of about 1 μm or less. As the material, a ceramic material was used in order to ensure higher rigidity. As described above, the conventional wafer chuck has used a ceramic material having a low specific gravity. However, with the increase in the speed of the stage, in particular, the wafer chuck arranged at the position farthest from the center of gravity of the stage is accompanied by the movement of the stage. There is a problem that its own inertial force becomes an excitation source of pitching behavior.

In the present embodiment, this influence is reduced, thereby achieving high-speed and high-precision stage setting and positioning control.
The amount of wafer warpage is about 100 μm in the process of manufacturing semiconductor devices. The warped shape is a bowl-shaped or bowl-shaped deformed shape, which is mainly a secondary deformation or a tertiary deformation. As the flat surface correction ability of the chuck, the ability of about fifth order deformation is required. The required flatness is 0.5 μm or less after correction, and the deformation must be corrected to approximately 1/200.
First, the minimum chuck thickness is estimated as follows.
If the Young's modulus of the wafer is Ew, the thickness is tw, the Young's modulus of the chuck is Ec, the thickness is tc, and the target plane correction magnification is 1 / n,
Ec · tc ³ / (Ew · tw ³ )> n
Tc (chuck thickness) that satisfies the above is required.
In order to reduce the weight, some reinforcement is required in order to reduce the thickness below the chuck thickness tc indicated by the above equation.

Therefore, in this embodiment, a rib is formed on the back surface (the surface opposite to the wafer holding surface) of the chuck so as to have sufficient strength to correct the wafer warp. The gap between adjacent ribs is the same as or larger than the maximum angle of view of the exposure apparatus. That is, assuming that the maximum angle of view of the exposure apparatus is S, the substrate (wafer) radius is R, and the rib pitch in the radial direction is γ,
S ≦ γ ≦ R
It is said.
This is better if the rib spacing is smaller in order to simply improve the flatness correction capability. However, it is because it is better to widen the rib pitch in order to reduce the weight.
In addition, the ribs may be arranged in the form of polygonal ribs such as lattice ribs and honeycomb ribs, or ribs having steps in a circle, in addition to the concentric ring and radial combination.
Further, by disposing the rib on the surface opposite to the wafer attracting surface, the deformation neutral axis can be brought close to the attracting surface, and the amount of deformation in the planar direction at the time of flattening can be minimized.

Seventh Embodiment FIG. 14 shows the structure of a chuck according to an exposure apparatus of the seventh embodiment of the present invention.
In the figure, 141 is a rib formed in parallel on the back surface of the chuck in a direction orthogonal to the scanning direction at the time of exposure. An arrow 142 is the scanning direction during exposure.
In order to reduce the weight of the stage, it is particularly important to reduce the weight of the chuck located above the movable part. A rib structure is effective as a means for reducing the weight of the chuck.
In the vicinity of the rib, the rigidity is high and the flat surface correcting ability is high. However, the portion other than the vicinity of the rib has a problem that the flat surface correcting ability deteriorates.
On the other hand, when the exposure apparatus is a scanning exposure apparatus, since the focus is always adjusted, even if there is some waviness on the wafer, the adverse effect can be avoided by the focus driving operation, but it is orthogonal to the scanning direction. When waviness or deformation exists in the direction, it becomes a factor that causes image distortion during scanning exposure.
Therefore, in this embodiment, focusing on the rib and the scanning direction and arranging the rib direction in a direction orthogonal to the scanning direction, the weight reduction of the chuck and the maintenance of the flatness correction capability are achieved at the same time.

(Example of micro device manufacturing)
Next, an example of a device manufacturing method using the above-described exposure apparatus will be described.
FIG. 15 shows a flow of manufacturing a microdevice (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, etc.). In step 1 (circuit design), a device pattern is designed. In step 2 (reticle production), a reticle on which the designed pattern is formed is produced. On the other hand, in step 3 (substrate manufacture), a substrate is manufactured using a material such as silicon or glass. Step 4 (substrate process) is called a pre-process, and an actual circuit is formed on the substrate by lithography using the prepared reticle and substrate. The next step 5 (assembly) is referred to as a post-process, and is a process for forming a semiconductor chip using the substrate produced in step 4, and includes an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. including. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. Through these steps, the semiconductor device is completed and shipped (step 7).

FIG. 16 shows a detailed flow of the substrate process.
In step 11 (oxidation), the surface of the substrate is oxidized. In step 12 (CVD), an insulating film is formed on the substrate surface. In step 13 (electrode formation), an electrode is formed on the substrate by vapor deposition. In step 14 (ion implantation), ions are implanted into the substrate. In step 15 (resist process), a resist is applied to the substrate. In step 16 (exposure), the reticle circuit pattern is arranged in a plurality of shot areas on the substrate by the exposure apparatus described above, and printing exposure is performed. In step 17 (development), the exposed substrate is developed. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the substrate. By using the production method of the present embodiment, it is possible to manufacture a high-precision device that has been difficult to manufacture with high productivity, that is, at low cost.

(Scope of invention)
In the above description, the example in which the present invention is mainly applied to a wafer stage in a step-and-scan type exposure apparatus has been described. However, the present invention is not limited to this and is applied to a reticle stage. Also good.
It is also effective in a wafer stage of a step-and-repeat type exposure apparatus in which the wafer stage moves at a high speed step, and can also be applied to a general stage apparatus.

1 is a perspective view showing a stage device constituting an exposure apparatus of a first embodiment of the present invention. It is sectional drawing of the stage surface plate of the apparatus of FIG. It is sectional drawing of the X slider of the apparatus of FIG. It is sectional drawing of X slider which concerns on the stage apparatus which comprises the exposure apparatus of the 2nd Example of this invention. It is sectional drawing of the state which attached the fine movement top plate to the X slider of FIG. It is sectional drawing which shows the fine movement top plate which concerns on the stage apparatus which comprises the exposure apparatus of the 3rd Example of this invention. It is sectional drawing which shows the stage apparatus based on the stage apparatus which comprises the exposure apparatus of the 4th Example of this invention. It is sectional drawing of the X slider of the apparatus of FIG. It is a perspective view which shows the stage apparatus which comprises the exposure apparatus of the 5th Example of this invention. It is sectional drawing which shows the structure of the chuck | zipper part of the apparatus of FIG. It is sectional drawing of the prior art example corresponding to the chuck | zipper part of FIG. It is a perspective view of the chuck | zipper of the apparatus of FIG. It is sectional drawing which shows the chuck | zipper concerning the exposure apparatus of the 6th Example of this invention. It is sectional drawing which shows the chuck | zipper concerning the exposure apparatus of the 7th Example of this invention. It is a figure which shows the flow of manufacture of a microdevice. It is a figure which shows the detailed flow of the wafer process in FIG.

Explanation of symbols

1: Stage surface plate, 2: Y linear motor, 3: Y guide, 4: Y stage, 5: X linear motor, 6: X guide, 7: X stage, 8: Air pad, 9: Fine movement stage, 10: Wafer chuck, 21, 31, 32, 33, 61, 81, 82, 83, 84: thinning part, 41: X bottom plate, 42: X lateral air pad, 43: X linear motor movable element, 51: radial guide, 52: lightening non face (broad flat surface), 62: wafer, 63: Y bar mirror, 64: air-conditioning air, 71: X movable _{unit, G} x: the center of gravity of the X movable portion, 72: X linear _{motors, F} x: Driving force point of X linear motor, 73: Y slider, 74: Y linear motor, G _y : Center of gravity of Y movable portion, F _y : Driving force point of X linear motor, 85, 86: Damping material, 91: Desorption fork, 92: X Bami -101: Step (thickening part), 121: Lift pin through hole, 122: Wafer suction vacuum hole, 131-134: Concentric annular rib, 135: Radial rib, 141: Parallel rib, 142: Exposure Stage scanning direction.

Claims (4)

A chuck for adsorbing and holding a substrate, a stage on which the chuck is mounted, and means for exposing the substrate held on the chuck,
The chuck has a rib structure on the back side of the surface that adsorbs the substrate,
An exposure apparatus characterized in that the interval between the ribs is set to be not less than a maximum exposure angle of view to the substrate and not more than a radius of a maximum size of the substrate to be held. An exposure apparatus that performs exposure while moving a moving body in a predetermined direction,
A chuck for adsorbing and holding a substrate, a stage on which the chuck is mounted, and means for exposing the substrate held by the chuck,
The chuck has a rib structure on the back side of the surface that adsorbs the substrate,
An exposure apparatus, wherein a plurality of the ribs are formed along a direction orthogonal to the predetermined direction.   A device manufacturing method, comprising: a step of preparing an exposure apparatus according to claim 1 or 2; and a manufacturing process including a step of exposing a substrate using the exposure apparatus. 4. The device manufacturing method according to claim 3, further comprising a step of applying a resist to the substrate before exposure and a step of developing after exposure.

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