JP2006100573A - Development support tool for vehicle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To materialize the miniaturization of the development support tool of an on-board electronic control unit. <P>SOLUTION: The development support tool (1) is connected to between the electronic control unit (3) and its control target (2), and has an interface unit (14) for transmitting/receiving electric signals between the both and for converting them. The interface unit (14) has a mother board (11), a plurality of boards (12) for each function formed independently for each process function or each control target, and a plurality of connectors (13) which are provided in the mother board (11) for mounting the plurality of boards (12) for each function so as to be attached to or detached from the mother board (11) individually. Each of the plurality of connectors (13) mounts the board (12) for each function in a direction substantially perpendicular to the mother board (11). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a vehicle development support tool, and more particularly to a development support tool for an electronic control unit mounted on a vehicle.

  Development support tools used for observing data input / output to / from controlled objects such as actuators include multiple processing functions. Each processing function is provided as an independent function module (function-specific board). The As a result, by replacing a certain function module with a function module having a different characteristic, it is possible to change the characteristic of the processing function and observe the data.

  Such a configuration having a plurality of functional boards is not related to the development support tool but is related to the configuration of the in-vehicle electronic control unit itself. For example, Japanese Patent Laid-Open No. 2001-282303 (Patent Document 1) Is disclosed.

JP 2001-282303 A

  By the way, the functions required for the electronic control unit are becoming more and more complex year by year, and the number of processing functions that should be provided by the development support tool is increasing. Furthermore, some development support tools do not specialize in a single control target, but can handle multiple control targets. In this case, multiple processing functions are prepared for each control target. As a result, the number is especially enormous. For this reason, the enlargement of the scale of the development support tool is a problem, and the miniaturization thereof is demanded.

  In this regard, Patent Document 1 described above merely discloses a configuration in which a plurality of functional boards are simply arranged side by side along the bottom of the casing, and no suggestion is given regarding a configuration for downsizing. Does not give.

  As described above, the present invention is intended to at least reduce the size of a development support tool for a vehicle, and further intends to solve problems derived from the downsizing. .

  One aspect of the present invention relates to a vehicle development support tool having an interface unit that is connected between an electronic control unit and an object to be controlled, and that exchanges electrical signals between the two and converts the electrical signals. The interface unit includes a mother A plurality of functional boards formed independently for each processing function or control target; and a plurality of functional boards that are provided on the mother board and are detachably mounted on the mother board individually. Each of the plurality of connectors has the function-specific board mounted in a direction substantially orthogonal to the mother board.

  According to this configuration, the development support tool can be downsized. In addition, since both surfaces of the function-specific substrate are always in contact with air, the heat dissipation effect is increased, and damage to the substrate due to heat generation can be prevented.

  According to a preferred embodiment of the present invention, the function-specific board is mounted in a direction substantially orthogonal to the mother board by inserting a plurality of signal pins provided on one end surface of the board into the connector. The plurality of signal pins are preferably arranged in a matrix.

  According to such a configuration, the frictional resistance of the connecting portion between the function-specific board and the connector increases, and the disconnection of the function-specific board from the connector can be prevented.

  Moreover, according to a preferred embodiment of the present invention, it is preferable that the mother board forms a circuit for individually short-circuiting the plurality of functional boards.

  As a result, only a specific function-specific board can be controlled, and a case where a certain function-specific board is deleted can be easily handled.

  By the way, when the function-specific substrate through which a strong current flows and the function-specific substrate through which a weak current flows are disposed adjacent to each other, the function-specific substrate through which a weak current flows may malfunction due to electrical noise. On the other hand, according to a preferred embodiment of the present invention, the plurality of functional boards are grouped on the basis of a current amount of a circuit formed on each functional board and arranged on the mother board. It is preferred that As a result, the occurrence of malfunction as described above can be prevented.

  According to a preferred embodiment of the present invention, a plurality of mother boards are arranged in a stacked manner, and a group having a large amount of circuit current formed on each functional board is arranged on the upper mother board. preferable.

  The greater the current that flows through the functional board, the greater the amount of heat generated by the functional board. When the function-specific substrate having a large calorific value is disposed on the lower mother substrate, the upper mother substrate is heated, and there is a risk that heat dissipation may be hindered. Thus, by disposing the function-specific substrate having a large amount of heat generation in the upper layer in this way, effective heat dissipation is realized.

  According to a preferred embodiment of the present invention, the plurality of functional boards are grouped for each processing function, and the functional boards in the same group have compatibility, while the functional boards in different groups It is preferable not to have compatibility.

  For this reason, since the functional boards having the same processing function are compatible with each other, the experiment can be performed by replacing the functional boards, and convenience is improved. On the other hand, it is possible to prevent the function-specific board from functioning even if a certain group of function-specific boards is mistakenly attached to another group of connectors.

  For example, at least the input signals and the output signals are assigned to the signal pins at the same position among the functional boards in the same group, while the input signals or the output signals are different between the functional boards in different groups. What is necessary is just to make it the allocation position to a signal pin differ.

  This makes it possible to eliminate compatibility between functional boards in different groups, and even if a functional board in a group is mistakenly attached to a connector in another group, current flows through the functional board. Therefore, it is possible to prevent a failure due to an unintended strong current.

  Also, by making the shape of the connecting portion between the functional board and the connector different for each group, it is possible to eliminate the compatibility between the functional boards with different groups. By doing this, it is not possible to attach a board according to function of a certain group to a connector of another group, so that mistakes can be prevented in advance. This can also be realized by changing the arrangement pattern of signal connection portions in the function-specific board and the connector for each group. Or it is realizable also by making the number of the signals connected between the said board | substrate classified by function and the said connector differ for every group.

  As described above, according to the present invention, the development support tool can be downsized.

DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a block diagram showing a configuration of a vehicle development support tool in the present embodiment.

  In the figure, 3 is an electronic control unit (ECU), and 2 is an engine as a control target. The development support tool 1 is located between the ECU 3 and the engine 2. The engine 2 is an example of an object to be controlled. In an automobile, many other units such as a transmission and a brake can be controlled. The development support tool 1 in this embodiment can correspond to these plural control objects.

  The development support tool 1 includes an interface (I / F) unit 14 that connects the ECU 3 and the engine 2 and matches electrical characteristics such as a drive instruction signal from the ECU 3 and a sensor signal from the engine 2 side. . The I / F unit 14 includes a mother board 11 on which various functional boards can be mounted. Here, the function-specific substrate refers to a substrate formed independently for each processing function or for each control target. Moreover, as a processing function, a filtering function, a signal linearization function, a pulse shaping function, etc. are assumed, for example. A plurality of connectors 13 are arranged on the mother board 11 as shown in the figure, and a function-specific board indicated by 12 is attached thereto. The mounting of the function-specific board via the connector 13 is advantageous in that a special fixing process such as soldering is not required. As a result, by replacing a certain function-specific substrate with another function-specific substrate having different characteristics, it is possible to easily change the characteristics of the processing function and observe the data.

  For example, as shown in FIG. 3, it is more preferable that a circuit 20 for short-circuiting the function-specific board mounted on the connector 13 is provided in the vicinity of each connector 13. By simply attaching a short-circuit member (not shown) to the circuit 20, it is possible to pass through the function-specific substrate. Therefore, when it is desired to perform an experiment using only a specific function-specific substrate, it is not necessary to bother to unplug other unnecessary function-specific substrates from the connector 13, and the experiment can proceed smoothly.

  The configuration of the development support tool 1 in this embodiment is generally as described above. Next, mounting of the function-specific board on the mother board 11, that is, connection between the function-specific board 12 and the connector 13 will be described. .

  FIG. 2 is a diagram illustrating an example of a connecting portion between the function-specific board 12 and the connector 13. Each of the connectors 13 in this embodiment mounts the function-specific board 12 so as to stand in a direction substantially orthogonal to the mother board 11 (that is, a direction substantially perpendicular to the surface of FIG. 1). In FIG. 2, the function-specific board 12 has a plurality of signal pins 18 that are electrically connected to one end face facing the connector 13. On the other hand, the connector 13 has a plurality of pin receivers 19 that are respectively fitted to the plurality of signal pins 18 of the function-specific board 12. With this configuration, the function-specific board 12 is mounted in a direction substantially orthogonal to the mother board 11. Here, it is preferable that the plurality of signal pins 18 are arranged not only in one row but also in a plurality of rows, that is, in a matrix. In this case, it goes without saying that the plurality of pin receivers 19 are also provided in a matrix in conformity with the arrangement of the plurality of signal pins 18. In this way, by providing a plurality of rows of connecting portions between the function-specific substrate 12 and the connector 13, the frictional resistance of the connecting portion is increased, and the function-specific substrate 12 can be prevented from being detached from the connector 13.

  The development support tool 1 according to the present embodiment can reduce the scale of the apparatus by taking such a characteristic mounting form. In addition, since both surfaces of the function-specific substrate 12 are always in contact with air, the heat dissipation effect is increased, and the effect of preventing damage to the substrate due to heat generation can be obtained.

  On the other hand, since some problems have been clarified by adopting such a configuration, the countermeasures will be described below.

  First, the function-specific board 12 having a relatively weak current is easily affected by electromagnetic noise. Therefore, when the high current function-specific substrate 12 and the weak current function-specific substrate 12 are disposed adjacent to each other, the weak current function-specific substrate 12 may malfunction due to electromagnetic noise.

  Therefore, in the present embodiment, the function-specific substrates 12 are grouped and arranged based on the amount of current of a circuit formed there. For example, as shown in FIG. 4, the functional boards 12 are divided into a group of high-current (for example, 500 mA or more) functional boards 12 (high-power group) and a weak current (for example, less than 500 mA) of functional boards 12. Grouped into groups (light power groups) and arranged on the mother board 11 for each group. By doing so, the weak current function-specific substrate 12 becomes less susceptible to electromagnetic noise from the strong current function-specific substrate 12, and can prevent the occurrence of malfunction as described above.

  Moreover, as shown in FIG. 4, if the distance between the connectors 13 located at the boundary between the low-power group and the high-power group is made longer than the distance between the connectors 13 in the same group, the above-mentioned It will be possible to more reliably prevent the occurrence of such a malfunction.

  By the way, in order to reduce the scale of the apparatus, the area of the mother substrate 11 should be reduced. On the other hand, as shown in FIG. 5, it is one solution to employ a configuration in which the mother substrate 11 is divided into a plurality of parts and these are arranged in a stacked manner. In this case, you may make it divide a hierarchy for every control object. For example, the lowermost first level may be for the engine, the upper second level may be for the transmission, and the like.

  Alternatively, the hierarchy may be divided for each group as described above. In this case, a group with a large amount of current may be arranged on the upper mother board 11. This is because as the amount of current flowing through the function-specific substrate 12 increases, the heat generation amount of the function-specific substrate 12 increases, and when the function-specific substrate 12 having a large heat generation amount is disposed on the lower mother substrate 11, the upper mother substrate 11 is heated. This is because smooth heat dissipation may be hindered. Thus, by disposing the function-specific substrate 12 having a large heat generation amount in the upper layer in this way, effective heat dissipation is realized.

  Next, when mounting the function-specific board 12 during an experiment using the development support tool 1, there may be a case where the function-specific board 12 is mounted on the connector 13 at an incorrect position. In particular, in the development support tool, there is a desire to conduct experiments under various experimental conditions by frequently replacing the functional boards 12 or by replacing the functional boards 12 with each other. A mistake of attaching to the connector 13 at the position is likely to occur. Such a mistake may cause a failure in some cases, and some countermeasure should be taken against this mistake. However, if the function-specific boards 12 cannot be interchanged at all, a plurality of function-specific boards 12 having different characteristics must be prepared for each connector 13, resulting in an enlargement of the development support tool. It will be connected.

  Therefore, in this embodiment, the function-specific substrates 12 are arranged in groups for each processing function, and here, the function-specific substrates 12 in the same group are compatible with each other, while the functions are different in the groups. The substrates 12 are not compatible with each other. For this reason, while the functional boards 12 in the same group can be interchanged, even if the functional boards 12 of a certain group are mistakenly attached to the connectors 13 of other groups, the functional boards 12 do not function. can do.

  Various means can be considered as means for eliminating the compatibility between the functional boards 12 in different groups. For example, the function-specific boards 12 in the same group share at least the positions where the input signals and the output signals are assigned to the signal pins, but the function-specific boards 12 in different groups have input signals or output signals. What is necessary is just to make the allocation position to a signal pin differ.

  An example is shown in FIG. FIG. 2A shows an example of pin assignment of the function-specific boards 12 in a certain group. Here, pin number 1 is assigned to digital input, pin number 2 is assigned to analog input, pin number 16 is assigned to digital output, and pin number 21 is assigned to analog output. On the other hand, (B) shows an example of pin assignment of the board 12 according to function of another group. Here, the pin number 1 is a digital input, and this is common to (A). The analog input is assigned to pin number 4, the digital output is assigned to pin number 17, and the analog output is assigned to pin number 25, and the assignment position of the input signal or output signal is different from (A).

  In this way, even if a group of functional boards 12 are mistakenly attached to the connector 13 of another group, no current flows through the functional boards 12, and an unintended strong current flows through the functional boards 12. Can be prevented. Furthermore, it is not necessary to manufacture the function-specific substrate 12 and the connector 13 with different shapes for each group, and the development support tool 1 can be easily created.

  FIG. 7 shows an example in which compatibility between functional boards 12 in different groups is eliminated by making the shape of the connecting portion of the functional board 12 and the connector 13 different for each group. ing. In the illustrated example, a convex portion is provided on the side surface of the connector 13, and a connecting portion having a convex portion corresponding to the position of the convex portion of the connector 13 is also provided on the function-specific substrate 12. Since the position of the convex portion is different between the A group and the B group, the function-specific board 12 cannot be attached to the connector 13 of another group.

  FIG. 8 shows an example in which compatibility between the functional boards 12 in different groups is eliminated by changing the arrangement pattern of the signal connection portions in the functional boards 12 and the connectors 13 for each group. Yes. In the illustrated example, the connector 13 of the A group is provided at a position where the pin receiver of the second row is offset with respect to the pin receiver of the first row, whereas the connector 13 of the B group has such a connector. There is no offset.

  Further, FIG. 9 shows another example in which the arrangement pattern of signal connection portions on the function-specific board 12 and the connector 13 is different for each group. In the figure, a black circle indicates that no pin receiver is provided.

  FIG. 10 shows an example in which the number of signals connected between the function-specific board 12 and the connector 13 is different for each group, thereby eliminating compatibility between the function-specific boards 12 in different groups. Is shown. In this example, the number of pin receivers of the connector 13 and the number of signal pins of the function-specific board 12 are different for each group.

  By taking the structure illustrated in FIG. 7 to FIG. 10, the shape of the connecting portion of the functional board 12 and the connector 13 or the arrangement pattern of the signal pin of the functional board 12 and the pin receiver of the connector 13 or its Since the numbers are different, it is easy to visually discriminate between the same group and another group, and even if the function-specific board 12 is mistakenly attached to the connector 13 of another group, it is structurally different. Since the function-specific board 12 cannot be mounted on the group connector 13, it is possible to prevent a mounting error when the function-specific board 12 is mounted.

It is a block diagram which shows the structure of the development assistance tool in embodiment. It is a figure which shows an example of the connection part of the board according to function and connector in an embodiment. It is a figure explaining the circuit for short circuit in an embodiment. It is a figure explaining grouping of the board according to function in an embodiment. It is a figure which shows the example of the development assistance tool of multiple hierarchy structure in embodiment. It is a figure which shows the example from which the position of an input / output terminal differs for every group of the board | substrate classified by function. It is a figure which shows the example which varied the shape of the connection part of a board according to a function and a connector for every group. It is a figure which shows the example which varied the arrangement pattern of the connection part of the signal in the board according to a function and a connector for every group. It is a figure which shows another example which made the arrangement pattern of the connection part of the signal in the board according to a function and a connector differ for every group. It is a figure which shows the example which varied the number of the signals connected between the board according to function and a connector for every group.

Explanation of symbols

1 Development support tool 2 Engine (control target)
3 Electronic Control Unit 11 Mother Board 12 Function Board 13 Connector 14 Interface Unit

Claims (10)

A vehicle development support tool that has an interface unit that is connected between an electronic control unit and its controlled object, and that exchanges electrical signals between the two and converts them.
The interface unit is
A mother board,
A plurality of functional boards formed independently for each processing function or control target;
A plurality of connectors that are provided on the mother board, and that individually attach the plurality of functional boards to the mother board;
Have
Each of the plurality of connectors mounts the function-specific board in a direction substantially orthogonal to the mother board.   The function-specific board is mounted in a direction substantially orthogonal to the mother board by inserting a plurality of signal pins provided on one end surface of the board into the connector, and the plurality of signal pins are arranged in a matrix. The vehicle development support tool according to claim 1, wherein the vehicle development support tool is arranged in a shape.   The vehicle development support tool according to claim 1, wherein the mother board forms a circuit for individually short-circuiting the plurality of functional boards.   The plurality of functional boards are grouped on the basis of a current amount of a circuit formed on each functional board and arranged on the mother board. Vehicle development support tool.   5. The vehicle according to claim 4, wherein the plurality of mother boards are arranged in a stacked manner, and a group having a large amount of circuit current formed on each functional board is arranged on an upper mother board. Development support tool.   The plurality of functional boards are grouped for each processing function, and the functional boards in the same group have compatibility, while the functional boards in different groups do not have compatibility. Item 6. The vehicle development support tool according to any one of Items 1 to 5. While the functional boards in the same group share at least the input signal and output signal assignment positions to the signal pins,
The vehicle development support tool according to claim 6, wherein the assignment positions of the input signal or the output signal to the signal pins are different between the functional boards of different groups.   The vehicle development support tool according to claim 6, wherein a shape of a connecting portion between the functional board and the connector is different for each group.   The vehicle development support tool according to claim 6, wherein the function-specific board and the connector each have a different signal connection portion arrangement pattern for each group.   The vehicle development support tool according to claim 6, wherein the number of signals connected between the functional board and the connector is different for each group.

Images