JP2006098449A - Manufacturing device for electrooptical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an electrooptical device which is suitably made thin by etching. <P>SOLUTION: The manufacturing method includes the stages of: applying a plurality of sealants 11 for the electrooptical device onto a 1st mother substrate 104 and a sealant 21 for molding made of material having higher etching resistance than the sealants for the electrooptical device to enclose the plurality of sealants 11 for the electrooptical device; sticking the 1st mother substrate 104 and a 2nd mother substrate 103 arranged opposite the 1st mother substrate 104 across the sealants 11 for the electrooptical device and the sealant 21 for molding; curing the sealants 11 for the electrooptical device and the sealant 12 for molding on the 1st mother substrate 104 and 2nd mother substrate 103 which are stuck together; and etching the 1st mother substrate 104 and 2nd mother substrate 103 which are stuck with the cured sealants 11 for electrooptical device and sealant 21 for molding. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing an electro-optical device related to thinning of the electro-optical device.

In an electro-optical device, for example, a liquid crystal display device, a liquid crystal is sandwiched between a pair of substrates bonded with a sealing material. When such a liquid crystal display device is manufactured using, for example, a multi-surface liquid crystal dropping method, the liquid crystal display device is manufactured as follows. First, a plurality of sealing materials for liquid crystal display devices are formed on a single mother glass substrate, and the liquid crystal is dropped into a region surrounded by the sealing materials for each liquid crystal display device. Another mother glass substrate is overlaid on the mother glass substrate, and two mother glass substrates are bonded together with a sealing material for a liquid crystal display device to form a mother panel. Then, the mother panel is cut and cut into individual liquid crystal panels. Thereafter, a wiring board, a polarizing plate, and the like are arranged to manufacture a liquid crystal display device. Here, in particular, in a liquid crystal display device used for a portable device such as a mobile phone, it is desired to reduce the thickness and weight. For example, in the manufacturing process described above, the mother panel is immersed in an etching solution. By etching the outer surface of the substrate, the thickness of the substrate is reduced, and the liquid crystal display device is reduced in thickness and weight. At the time of this etching, a sealing material having a vent is made of the same material as the sealing material for the liquid crystal display device so as to surround the sealing material for the liquid crystal display device so that the inner surface of the mother panel is not etched by the etching solution. A sealing material is provided for sealing. The sealing material is applied after the two mother substrates are bonded together (for example, see Patent Document 1).
Japanese Patent No. 2722798 (page 2, right column, line 42 to page 3, right column, line 19, line 1)

  However, when a material having high resistance to an etching solution is used as a mold sealing material provided so as to surround the liquid crystal display device sealing material, this material is generally used as a liquid crystal display device sealing material. Has a problem in that the elution of the component into the liquid crystal is high. Further, for example, when the same material as the sealing material for liquid crystal display devices having low elution of components into the liquid crystal is used for the molding sealing material provided so as to surround the sealing material for liquid crystal display devices, such a seal is used. The material is generally weak in resistance to the etching solution. Therefore, while the mother panel is immersed in the etching solution, the sealing material provided so as to surround the sealing material for the liquid crystal display device is attacked by the etching solution, and the etching solution enters between the two mother substrates, There was a problem that the inner surface of the mother panel was etched. In addition, since the sealing material provided so as to surround the sealing material for the liquid crystal display device has a vent hole, in order to prevent an etchant from entering between the two mother boards through the vent hole during the etching process, a ventilation gas is provided. A sealing step for sealing the mouth was necessary.

  SUMMARY An advantage of some aspects of the invention is that it provides an electro-optical device manufacturing method suitable for thinning by etching.

  In order to achieve the above object, a method of manufacturing an electro-optical device according to the present invention includes a plurality of electro-optical device sealing materials on a first mother substrate, and the electro-optical device sealing materials surrounded by the electro-optical device sealing materials. The electro-optical device includes a step of applying a mold sealing material made of a material that is more resistant to etching than a sealing material for sealing, and the first mother substrate and the second mother substrate disposed opposite to the first mother substrate. A step of bonding via the sealing material for mold and the sealing material for mold; a step of curing the sealing material for electro-optical device and the sealing material for mold of the bonded first mother substrate and second mother substrate; Etching the first mother substrate and the second mother substrate bonded together by the cured electro-optical device sealing material and mold sealing material. And butterflies.

  According to such a configuration of the present invention, when the first mother substrate and the second mother substrate bonded together by the electro-optical device sealing material and the mold sealing material are etched, the first mother substrate is etched by the mold sealing material. In addition, the inner surface of the second mother substrate is not etched by the etching means, and the outer surface is uniformly etched in the substrate surface by the etching means. Further, the electro-optical device sealing material is not affected by the etching means. The electro-optical device manufactured by cutting the first mother substrate and the second mother substrate thus etched is stable in quality because the electro-optical device sealing material is not attacked by the etching means. Yes. In addition, since the substrate is etched uniformly within the substrate surface, an electro-optical device having a uniform thickness and a reduced thickness can be obtained. Moreover, since the resistance to the etching means of the electro-optical device sealing material can be ignored by using a material having high resistance to the etching means as the mold sealing material, there is a wide selection of materials for the electro-optical device sealing material. As a result, a high-quality electro-optical device can be obtained. That is, at present, the characteristics required as a sealing material for electro-optical devices, for example, the selection of a material in which the elution of components into the liquid crystal hardly occurs, the resistance to the etching means is inevitably weakened. When the same material as the electro-optical device sealing material is used as the molding sealing material for preventing the intrusion of the etching means, there is a problem that the molding sealing material is eroded by the etching means. Therefore, in the present invention, by using a material having a strong resistance to the etching means, which is different from the sealing material for the electro-optical device, as the sealing material for the mold, the sealing material for the electro-optical device is not affected by the etching means, In addition, an electro-optical device with high quality characteristics can be obtained by using a material that does not easily elute components into the liquid crystal as a sealing material for the electro-optical device.

  The electro-optical device sealing material is made of an epoxy acrylate resin, and the mold sealing material is made of a cresol novolac type epoxy resin.

  Thus, an epoxy acrylate resin can be used as a sealing material for an electro-optical device, and a cresol novolac type epoxy resin can be used as a sealing material for a mold.

  Further, the etching step is characterized by being immersed in an etching solution.

  Thus, an etching solution can be used as the etching means. According to such a configuration, when the first mother substrate and the second mother substrate bonded together by the electro-optical device sealing material and the mold sealing material are etched, the mold sealing material causes the first mother substrate and the second mother substrate to adhere to the first mother substrate and the second mother substrate. The etchant is prevented from entering between the two mother substrates. Therefore, the outer surfaces of the first mother substrate and the second mother substrate are uniformly etched in the substrate surface by the etching liquid, the inner surface is not etched, and the sealing material for the electro-optical device is affected by the etching liquid. There is nothing. The electro-optical device manufactured by cutting the first mother substrate and the second mother substrate thus etched is stable in quality because the sealing material for the electro-optical device is not attacked by the etching solution. Yes. In addition, since the substrate is etched uniformly within the substrate surface, an electro-optical device having a uniform thickness and a reduced thickness can be obtained. In addition, by using a material that is highly resistant to the etching solution as the mold sealing material, the resistance of the electro-optical device sealing material to the etching solution can be ignored. As a result, a high-quality electro-optical device can be obtained. That is, at present, the characteristics required as a sealing material for an electro-optical device, for example, the selection of a material that hardly causes the elution of components into the liquid crystal, the resistance to the etching solution is inevitably weakened. When the same material as the electro-optical device sealing material is used as the molding sealing material for preventing the intrusion of the etching solution, there is a problem that the molding sealing material is attacked by the etching solution. Therefore, in the present invention, the sealing material for the mold is different from the sealing material for the electro-optical device, and a material having a strong resistance to the etching solution is used, so that the sealing material for the electro-optical device is not affected by the etching solution, In addition, an electro-optical device with high quality characteristics can be obtained by using a material that does not easily elute components into the liquid crystal as a sealing material for the electro-optical device.

  In the curing step, the curing time of the electro-optical device sealing material is different from the curing time of the mold sealing material.

  According to such a configuration, for example, after the sealing material for the electro-optical device is cured, the sealing material for the mold is cured. Can be prevented. That is, when the electro-optical device sealing material is cured and the mold sealing material is uncured, the two mother substrates are fixedly bonded by the cured electro-optical device sealing material. In the two mother substrates in such a state, even if the mold sealing material protrudes between the two mother substrates and adheres to the outer surface of the mother substrate, the mold sealing material is not cured. Can be easily wiped off. Therefore, when the sealing material for mold adheres to the outer surface of the mother substrate, the adhered portion is not etched by the etching means, and the etching failure such that the mother substrate cannot be uniformly etched within the substrate surface occurs. It can be surely prevented.

  Further, the electro-optical device sealing material is visible light curable, and the mold sealing material is ultraviolet curable or thermosetting.

  As described above, materials having different curing means for the sealing material can be used as the materials for the electro-optical device sealing material and the mold sealing material. For example, the curing time of the electro-optical device sealing material and the mold sealing material can be used. The curing time of can be easily varied. That is, since the mold sealing material is not cured by irradiation with visible light, when the electro-optical device sealing material is cured by irradiation with visible light, it is not necessary to mask the sealing material for molding so that no visible light is applied to it. Since the sealing material for optical devices is not cured by UV irradiation or heating, when the sealing material for molds is cured by UV irradiation or heating, the sealing material for electro-optical devices is masked so that it is not exposed to ultraviolet rays, or the mother substrate is removed. There is no need for partial heating, and the curing time of the electro-optical device sealing material can be easily made different from the curing time of the mold sealing material.

  In the curing step, the sealing material for the mold is cured after the sealing material for the electro-optical device is cured.

  According to such a configuration, it is possible to reliably prevent the occurrence of etching failure by shifting the curing time of the electro-optical device sealing material and the curing time of the mold sealing material. That is, when the electro-optical device sealing material is cured and the mold sealing material is uncured, the two mother substrates are fixedly bonded by the cured electro-optical device sealing material. In the two mother substrates in such a state, even if the mold sealing material protrudes between the two mother substrates and adheres to the outer surface of the mother substrate, the mold sealing material is not cured. Can be easily wiped off. Therefore, when the sealing material for mold adheres to the outer surface of the mother substrate, the adhered portion is not etched by the etching means, and the etching failure such that the mother substrate cannot be uniformly etched within the substrate surface occurs. It can be surely prevented.

  The bonding step is performed in a vacuum.

  According to such a configuration, it is not necessary to provide an opening portion serving as a vent hole in the mold sealing material, and a sealing process for sealing the opening portion is not necessary, and the manufacturing cost can be reduced. For example, when two mother substrates are bonded together in the atmosphere, if there is no opening in the mold sealing material, the air pressure between the two mother substrates becomes high, and the mold sealing material or electro-optical device There is a risk that the sealing material will burst. For this reason, when bonding in atmospheric pressure, it is necessary to provide the opening part used as a vent hole in the mold sealing material. However, if such an opening is provided, the etching means enters between the two mother substrates during the etching process, and therefore a sealing process for sealing the opening is required. On the other hand, in the present invention, by performing bonding in the atmosphere, the mold sealing material can be formed in a shape having no opening, and the sealing step for sealing the opening can be eliminated. Manufacturing cost can be reduced.

  Further, in the application step, an outer peripheral seal material is further applied inside the plurality of electro-optical device seal materials and inside the mold seal material.

  According to such a configuration, when the first mother substrate and the second mother substrate are bonded together, the gap between the first mother substrate and the second mother substrate causes the sealing material for the electro-optical device and the sealing material for the mold. In addition, since it is held by the outer peripheral sealing material, almost uniform pressure can be applied within the substrate surface. As a result, a plurality of electro-optical devices having a uniform gap between two substrates in the substrate plane can be obtained stably. For example, when the bonding process is performed in a vacuum, the sealing material for the electro-optical device is double protected by the sealing material for the mold and the outer peripheral sealing material, and only the sealing material for the mold is formed. In comparison, it becomes easier to maintain a vacuum.

  The mold sealing material is formed on the inner side of the outer peripheral edges of the first mother substrate and the second mother substrate.

  According to such a configuration, the sealing material for molding protrudes from between the first mother substrate and the second mother substrate, and hardly adheres to the outer surface of the mother substrate. Therefore, when the sealing material for mold adheres to the outer surface of the mother substrate, the adhering portion is not etched by the etching means and the mother panel cannot be etched uniformly within the substrate surface. can do.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description of the embodiments, a simple matrix type liquid crystal display device is taken as an example of an electro-optical device, but the present invention is not limited to this. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure and the scale and number of each structure are different.

  (Electro-optical device)

  FIG. 1 is a schematic partial sectional view of a liquid crystal display device according to an embodiment of the present invention.

  As shown in FIG. 1, a liquid crystal display device 1 includes a liquid crystal panel 2 as an electro-optical panel, a pair of polarizing plates 5 provided so as to sandwich the liquid crystal panel 2, and a wiring substrate 10 mounted on the liquid crystal panel 2. And a circuit board (not shown) electrically connected to the wiring board 10.

  The liquid crystal panel 2 includes a rectangular first glass substrate 4, a rectangular second glass substrate 3 disposed opposite to the first glass substrate 4 with a gap, and the first glass substrate 4 and the second glass substrate 3. And a sealing material 11 (111) for a liquid crystal display device as a sealing material for an electro-optical device having a rectangular planar shape, and a first glass substrate 4, a second glass substrate 3, and a sealing material 11 for a liquid crystal display device. STN (Super Twisted Nematic) liquid crystal 6 as an electro-optical material held in a region surrounded by (111).

  When manufacturing the liquid crystal display device 1 by enclosing the liquid crystal 6 using the liquid crystal dropping method, the liquid crystal display device sealing material 11 has an unbroken planar shape. On the other hand, when the sealing material for a liquid crystal display device has a shape in which a portion serving as a liquid crystal injection port is opened and liquid crystal is sealed through the liquid crystal injection port, then the liquid crystal injection port is sealed with a sealing material. The device sealing material 111 has a planar shape having a cut at a portion serving as a liquid crystal injection port.

  On the 1st glass substrate 4, the segment electrode 7 provided in stripe form and the alignment film 9 provided on the segment electrode 7 are arrange | positioned. On the second glass substrate 3, a common electrode 8 provided in a stripe shape so as to intersect the segment electrode 7 in a plane and an alignment film 9 provided on the common electrode 8 are disposed.

  The first glass substrate 4 has a protruding portion 4 a that protrudes from the second glass substrate 3. A wiring board 10 is mounted on the overhanging portion 4 a, and signals are supplied from the circuit board (not shown) to the segment electrode 7 and the common electrode 8 via the wiring board 10.

  (Method for manufacturing electro-optical device)

  Next, a method for manufacturing the above-described liquid crystal display device 1 will be described.

  <First embodiment>

  A method for manufacturing the liquid crystal display device 1 according to the first embodiment will be described with reference to FIGS.

  FIG. 2 is a manufacturing flowchart of the liquid crystal panel 2 constituting the liquid crystal display device 1. 3 and 4 are perspective views of the manufacturing process of the liquid crystal panel 2. FIG. 5 is a cross-sectional view taken along line AA ′ of FIG. 3D, and is a cross-sectional view of the mother panel before etching.

  First, a plurality of, here six, segment electrodes 7 and alignment films 9 corresponding to six liquid crystal display devices 1 are formed on a first mother glass substrate 104 as a first mother substrate by a known method. Similarly, common electrodes 8 and alignment films 9 corresponding to six liquid crystal display devices 1 are formed on a second mother glass substrate 103 as a second mother substrate by a known method. Both the first mother glass substrate 104 and the second mother glass substrate 103 have a thickness of 0.5 mm.

  Next, as shown in FIG. 3A, the liquid crystal sealing regions of the six liquid crystal display devices 1 are defined on the surface of the first mother glass substrate 104 on which the segment electrode 7 and the alignment film 9 are formed. Then, the sealing material 11 for a liquid crystal display device is formed by screen printing in a rectangular shape without any breaks. Further, the mold sealing material 21 is formed in a rectangular shape without any breaks so as to surround the liquid crystal display device sealing material 11 slightly inside the outer peripheral edge of the first mother glass substrate 104, for example, about 1 mm from the substrate edge. Is applied by screen printing (S1). An epoxy acrylate resin is used as the sealing material 11 for the liquid crystal display device, and a cresol novolac type epoxy resin is used as the sealing material 21 for the mold. The cresol novolac type epoxy resin used for the mold sealing material 21 is more resistant to hydrofluoric acid, which is an etching liquid material used in the etching process described below, than the epoxy acrylate resin used for the liquid crystal display device sealing material 11. is there. Moreover, the epoxy acrylate resin used for the sealing material 11 for liquid crystal display devices is superior in that the elution of components into the liquid crystal hardly occurs compared to the cresol novolac type epoxy resin used for the sealing material 21 for mold. . As a method for applying the sealing material 11 for the liquid crystal display device and the sealing material 21 for the mold, a dispenser may be used in addition to screen printing. Here, as another method of applying a sealing material for a mold, after forming a mother panel by bonding two mother glass substrates only through a sealing material for a liquid crystal display device, the mold is manually molded on the end surface of the mother panel. There is a method in which a sealing material is applied and a boundary between two mother glass substrates is filled with a molding sealing material. However, in this case, since it is performed manually, it is difficult to adjust the amount of the mold sealing material to be applied. If the mold sealing material wraps around the outer surface of the mother panel, this part of the mold sealing material is wiped off. It becomes necessary and work efficiency is bad. On the other hand, in the present embodiment, the application amount can be controlled mechanically by using screen printing, a dispenser, etc., and since the coating is applied slightly inside the outer peripheral edge of the mother glass substrate, the sealing material for the mold is the mother panel. Since there is almost no adhesion to the outer surface, there is no need for a wiping process for the mold sealing material, and the work efficiency is good.

  After applying the sealing material 11 for the liquid crystal display device and the sealing material 21 for the mold, as shown in FIG. 3B, the liquid crystal 6 is dropped by the dispenser 60 into the region surrounded by the sealing material 11 for the liquid crystal display device (S2). .

  After the liquid crystal dropping step, as shown in FIG. 3C, the surface of the first mother glass substrate 104 on which the segment electrode 7, the alignment film 9, the liquid crystal display device sealing material 11 and the mold sealing material 21 are formed, The first mother glass substrate 104 and the second mother glass substrate 103 are stacked in a vacuum so that the surface of the second mother glass substrate 103 on which the common electrode 8 and the alignment film 9 are formed is opposed to each other, and the entire substrate is Pressure is applied in the thickness direction of the substrate and bonding is performed (S3). Thus, by bonding in a vacuum, the two mother glass substrates 103 and 104 can be bonded without the liquid crystal display device sealing material 11 and the mold sealing material 21 being ruptured. Therefore, the liquid crystal display device sealing material 11 is ruptured by the rupture of the liquid crystal display device sealing material 11 and the liquid crystal 6 leaks, or the mold sealing material 21 is ruptured and cracked, so that etching is performed in an etching process described later. The liquid does not enter between the two mother glass substrates.

  After the substrate bonding step, the liquid crystal display device sealing material 11 and the mold sealing material 21 are cured, and the first mother glass substrate 104 and the second mother glass substrate 103 are replaced with the liquid crystal display device sealing material 11 and the mold. The mother panel 50 ′ shown in FIG. 3D and FIG. 5 is formed by bonding with the sealing material 21 (S4). As shown in FIGS. 3D and 5, the mother panel 50 ′ before etching has a state in which a sealed space is formed by the first mother glass substrate 104, the second mother glass substrate 103, and the mold sealing material 21. It has become.

  Thereafter, the mother panel 50 'is immersed in an etching solution made of hydrofluoric acid, and the outer surface of the mother panel 50' is etched (S5). Thereby, the thickness of each of the first mother glass substrate 104 and the second mother glass substrate 103 is changed from 0.5 mm to 0.3 mm, and the entire thickness of the mother panel can be reduced. During the etching process, the mold sealing material 21 that is highly resistant to the etchant can prevent the etchant from entering between the first mother glass substrate 104 and the second mother glass substrate 103. Thus, the inner surface of the mother panel 50 is not etched. Further, the sealing material 11 for the liquid crystal display device is not attacked by the etching solution.

  Next, as shown in FIG. 4A, a mother panel 50 formed by laminating a first mother glass substrate 4 ″ and a second mother glass substrate 3 ″, whose thickness is reduced by etching, is cut along a cutting line 40. (S6), and as shown in FIG. 4B, the liquid crystal panel 51 is formed by bonding the first glass substrate 4 ′ and the second glass substrate 3 ′ to each other. Furthermore, after that, as shown in FIG. 4C, the second glass substrate 3 ′ is cut (S6) so that the first glass substrate 4 has a protruding portion protruding from the second glass substrate 3, A liquid crystal panel 2 is obtained.

  Thereafter, the wiring substrate 10 is connected to the liquid crystal panel 2 and a pair of polarizing plates 5 are arranged so as to sandwich the liquid crystal panel 2, thereby obtaining the liquid crystal display device 1 shown in FIG. 1.

  As described above, when the mother panel 50 is etched, the mold sealing material 21 prevents the etchant from entering between the first mother glass substrate 103 and the second mother glass substrate 104. In the state of the panel 2, only the surface opposite to the surface in contact with the liquid crystal 6 of each of the first glass substrate 3 and the second glass substrate 4 is etched, and the surface in contact with the liquid crystal 6 is not etched. Therefore, the thicknesses of the first glass substrate 4 and the second glass substrate 3 of the liquid crystal panel 2 manufactured as described above are uniformly thin in the substrate plane, and the liquid crystal display device in which the thickness reduction and the weight reduction are realized. 1 can be obtained. Further, since the liquid crystal display device sealing material 11 is not attacked by the etching solution, there is no problem that the liquid crystal 6 oozes out of the liquid crystal panel 2, and the liquid crystal display device 1 having good quality characteristics can be obtained.

  Further, by using a material having high resistance to the etching solution as the mold sealing material 21, the resistance of the liquid crystal display device sealing material 11 to the etching solution can be ignored. Therefore, the material selection of the liquid crystal display device sealing material 11 is selected. As a result, a high quality liquid crystal display device 1 can be obtained. That is, at present, characteristics required for a sealing material for a liquid crystal display device, for example, when trying to select a material in which elution of components into the liquid crystal is unlikely to occur, the resistance to an etchant is inevitably weakened. When the same material as the sealing material for the liquid crystal display device is used as the sealing material for the mold for preventing the intrusion of the etching solution, there is a problem that the sealing material for the mold is attacked by the etching solution. Therefore, in the present embodiment, the sealing material for the liquid crystal display device is different from the sealing material for the liquid crystal display device as the mold sealing material, so that the sealing material for the liquid crystal display device is not affected by the etching liquid. In addition, a liquid crystal display device with high quality characteristics can be obtained by using a material that does not easily dissolve into the liquid crystal as a sealing material for the liquid crystal display device.

  <Second Embodiment>

  A method for manufacturing the liquid crystal display device 1 according to the second embodiment will be described with reference to FIGS. 1 and 6 to 8.

  FIG. 6 is a manufacturing flowchart of the liquid crystal panel 2 constituting the liquid crystal display device 1. 7 and 8 are perspective views of the manufacturing process of the liquid crystal panel 2.

  First, a plurality of, here six, segment electrodes 7 and alignment films 9 corresponding to six liquid crystal display devices 1 are formed on a first mother glass substrate 104 as a first mother substrate by a known method. Similarly, common electrodes 8 and alignment films 9 corresponding to six liquid crystal display devices 1 are formed on a second mother glass substrate 103 as a second mother substrate by a known method. Both the first mother glass substrate 104 and the second mother glass substrate 103 have a thickness of 0.5 mm.

  Next, as shown in FIG. 7A, the liquid crystal sealing regions of the six liquid crystal display devices 1 are defined on the surface of the first mother glass substrate 104 on which the segment electrode 7 and the alignment film 9 are formed. The outer peripheral sealing material 31 is formed by screen printing so as to surround the liquid crystal display device sealing material 11 and the liquid crystal display device sealing material 11 in a rectangular shape without any break. Further, in a rectangular shape with no break, slightly inside the outer peripheral edge of the first mother glass substrate 104, for example, about 1 mm from the substrate edge so as to surround the liquid crystal display device sealing material 11 and the outer peripheral sealing material 31. The mold sealing material 21 is applied by screen printing (S1). The same material was used for the sealing material 11 for the liquid crystal display device and the outer peripheral sealing material 31, and a visible light curable epoxy acrylate resin was used. As the mold sealing material 21, an ultraviolet curable cresol novolac epoxy resin was used. The cresol novolac type epoxy resin used for the mold sealing material 21 is more resistant to hydrofluoric acid, which is an etching liquid material used in the etching process described below, than the epoxy acrylate resin used for the liquid crystal display device sealing material 11. is there. Moreover, the epoxy acrylate resin used for the sealing material 11 for liquid crystal display devices is superior in that the elution of components into the liquid crystal hardly occurs compared to the cresol novolac type epoxy resin used for the sealing material 21 for mold. . In addition, as a method for applying the sealing material 11 for the liquid crystal display device and the sealing material 21 for the mold, a dispenser may be used in addition to screen printing.

  After applying the sealing material 11 for the liquid crystal display device, the outer peripheral sealing material 31 and the sealing material 21 for the mold, as shown in FIG. 7B, the liquid crystal 6 is applied to the region surrounded by the sealing material 11 for the liquid crystal display device by the dispenser 60. It is dropped (S2).

  After the liquid crystal dropping step, as shown in FIG. 7C, the surface of the first mother glass substrate 104 on which the segment electrode 7, the alignment film 9, the liquid crystal display device sealing material 11 and the mold sealing material 21 are formed, The first mother glass substrate 104 and the second mother glass substrate 103 are stacked in a vacuum so that the surface of the second mother glass substrate 103 on which the common electrode 8 and the alignment film 9 are formed is opposed to each other, and the entire substrate is The mother panel 150 ′ shown in FIG. 7 (d) is obtained by applying pressure in the substrate thickness direction (S3). Thereafter, visible light is applied to the mother panel 150 ′ in a vacuum to cure the liquid crystal display device sealing material 11 and the outer peripheral sealing material 31 (S4). Thereby, the first mother glass substrate 104 and the second mother glass substrate 103 are bonded and fixed. At this time, since the mold sealing material 21 is not cured, it has fluidity. Next, the mother panel 50 ′ is moved from the vacuum to the atmosphere, and if the sealing material 21 for molding protrudes from the two substrates of the mother panel 150 ′ and adheres to the end surface and the outer surface of the mother panel 150 ′, The protruding mold sealing material 21 is wiped off (S5). Thereafter, the mold sealing material 21 is cured by irradiating the mother panel 150 'with ultraviolet rays (S6).

  As described above, by bonding two mother glass substrates in a vacuum, the air pressure between the two mother glass substrates is increased at the time of bonding, and the sealing material 11 for the liquid crystal display device, the outer peripheral sealing material 31 and the mold. The sealing material 21 does not rupture. Accordingly, the liquid crystal display device sealing material 11 is cracked by the rupture of the liquid crystal display device sealing material 11 and the liquid crystal 6 is leaked, or the mold sealing material 21 is ruptured and cracked, which will be described later. The etching solution does not enter between the two mother glass substrates.

  Further, by providing the outer peripheral sealing material 31 so as to surround the plurality of liquid crystal display device sealing materials 11, the liquid crystal display device sealing material 11, the outer peripheral sealing material 31, and the mold sealing material are provided between the two mother glass substrates. 21, the mother panel 150 ′ can be pressed almost uniformly within the substrate surface during pressure bonding. Accordingly, there is no variation in the gap between the first glass substrate 4 and the second glass substrate 3 between the plurality of liquid crystal display devices 1 manufactured by being cut from the same mother panel, and the liquid crystal display has a constant liquid crystal thickness. The apparatus can be obtained stably. Further, even in the individual liquid crystal display devices, the display characteristics are good because the gap between the first glass substrate 4 and the second glass substrate 3 is uniform within the substrate surface. Further, since the outer peripheral sealing material 31 and the mold sealing material 21 are formed in a double manner so as to surround the plurality of liquid crystal display device sealing materials 11, the vacuum is maintained even when the mother panel 150 'is brought out to atmospheric pressure. It's easy to do.

  In addition, the gap between the two mother glass substrates is fixed at a desired value by differentiating the curing timing of the sealing material 11 and the outer peripheral sealing material 31 for the liquid crystal display device and the sealing material 21 for the mold. Thus, the excess mold sealing material 21 that protrudes can be wiped off. Thereby, the outer surface of the mother panel 150 can be reliably etched uniformly within the substrate surface. That is, for example, the mold sealing material 21 remains at the end of the outer surface of the mother panel 150, in other words, the end of the surface of the first mother glass substrate 104 or the second mother glass substrate 103 opposite to the surface in contact with the liquid crystal 6. If it does, the area | region where this sealing material 21 for molds will not be etched at the time of the etching process mentioned later. And when this area | region overlaps with the part used as the liquid crystal display device 1, the liquid crystal display device which has non-uniform thickness in a substrate surface will be manufactured, and the display characteristic will be inferior. On the other hand, in this embodiment, even if the sealing material for liquid crystal display device 11 and the outer peripheral sealing material 31 and the sealing material for mold 21 are made different in curing time, even if the sealing material for mold protrudes. Since it can be surely wiped off and removed, the outer surface of the mother panel 150 can be uniformly etched in the substrate surface. In addition, since the sealing means for the liquid crystal display device and the peripheral sealing material and the sealing material for the mold use different materials for the sealing material, the curing time can be easily varied. That is, in this embodiment, since the mold sealing material is not cured by visible light irradiation, when the liquid crystal display device sealing material and the outer peripheral sealing material are cured by visible light irradiation, the mold sealing material is not exposed to visible light. There is no need to mask. Further, since the sealing material for liquid crystal display device and the outer peripheral sealing material are not cured by ultraviolet irradiation, it is not necessary to mask the sealing material for liquid crystal display device so that the sealing material for liquid crystal display device is not exposed to ultraviolet rays when curing the sealing material for mold. The curing time can be easily changed. In this embodiment, an ultraviolet curable resin is used as the mold sealing material, but a thermosetting resin may be used. Here, if there is no protrusion of the mold sealing material, or there is no influence during the etching process even if the mold sealing material protrudes, for example, the liquid crystal display device sealing material 11 and the outer peripheral sealing material 31, and the mold It is also possible to cure at the same time without shifting the time of curing with the sealing material 21 for use. Also in the first embodiment, as in this embodiment, the timing for curing the sealing material 11 for the liquid crystal display device and the timing for curing the mold sealing material 21 are shifted to provide a wiping process for the mold sealing material. May be.

  After the mold sealing material 21 curing step, the mother panel 150 ′ is immersed in an etching solution made of hydrofluoric acid, and the outer surface of the mother panel 150 ′ is etched to obtain the mother panel 150 having a reduced thickness (S 7). Thereby, the thickness of each of the first mother glass substrate 104 and the second mother glass substrate 103 is changed from 0.5 mm to 0.3 mm, and the entire thickness of the mother panel can be reduced. During the etching process, the mold sealing material 21 having high resistance to the etching solution can prevent the etching solution from entering between the first mother glass substrate 104 and the second mother glass substrate 103, and the etching solution. Therefore, the inner surface of the mother panel 150 is not etched.

  Next, as shown in FIG. 8A, a mother panel 150 in which a first mother glass substrate 4 ″ and a second mother glass substrate 3 ″, whose thickness has been reduced by etching, are bonded together, is cut along a cutting line 41. (S8), and cut into individual liquid crystal panels 51 formed by bonding the first glass substrate 4 ′ and the second glass substrate 3 ′ as shown in FIG. 8B. Furthermore, after that, as shown in FIG. 8C, the second glass substrate 3 ′ is cut (S8) so that the first glass substrate 4 has a protruding portion protruding from the second glass substrate 3, A liquid crystal panel 2 is obtained.

  Thereafter, the wiring substrate 10 is connected to the liquid crystal panel 2 and a pair of polarizing plates 5 are arranged so as to sandwich the liquid crystal panel 2, thereby obtaining the liquid crystal display device 1 shown in FIG. 1.

  As described above, the outer peripheral sealing material 21 may be provided inside the molding sealing material 21 so as to surround the plurality of sealing materials 11 for the liquid crystal display device. Therefore, a liquid crystal display device having a uniform liquid crystal thickness within the substrate surface can be stably obtained. Similarly to the first embodiment, when the mother panel 150 ′ is etched, the mold sealing material 21 causes the etchant to enter between the first mother glass substrate 103 and the second mother glass substrate 104. Therefore, in the state of the liquid crystal panel 2, only the surface opposite to the surface in contact with the liquid crystal 6 of each of the first glass substrate 3 and the second glass substrate 4 is etched, and the surface in contact with the liquid crystal 6 is etched. Absent. Therefore, the thicknesses of the first glass substrate 4 and the second glass substrate 3 of the liquid crystal panel 2 manufactured as described above are uniformly thin in the substrate plane, and the liquid crystal display device in which the thickness reduction and the weight reduction are realized. 1 can be obtained. Further, since the liquid crystal display device sealing material 11 is not attacked by the etching solution, there is no problem that the liquid crystal 6 oozes out of the liquid crystal panel 2, and the liquid crystal display device 1 having good quality characteristics can be obtained.

  Further, by using a material having high resistance to the etching solution as the mold sealing material 21, the resistance of the liquid crystal display device sealing material 11 to the etching solution can be ignored. Therefore, the material selection of the liquid crystal display device sealing material 11 is selected. As a result, a high quality liquid crystal display device 1 can be obtained. That is, at present, characteristics required as a sealing material for liquid crystal display devices, for example, when trying to select a material that does not easily cause elution of components into liquid crystal, the resistance to an etchant is inevitably weakened. When the same material as the sealing material for a liquid crystal display device is used as the sealing material for the mold for preventing the intrusion of the etching solution, there is a problem that the sealing material for the mold is attacked by the etching solution. Therefore, in the present embodiment, the sealing material for the liquid crystal display device is different from the sealing material for the liquid crystal display device as the mold sealing material, so that the sealing material for the liquid crystal display device is not affected by the etching liquid. In addition, a liquid crystal display device with high quality characteristics can be obtained by using a material that does not easily elute components into the liquid crystal as a sealing material for the liquid crystal display device.

  <Third embodiment>

  In the above-described embodiment, the liquid crystal is sealed by dropping the liquid crystal, but the present invention is not limited to this. For example, the present invention is applied to a case where the sealing material has a shape in which a portion serving as a liquid crystal injection port is opened and the liquid crystal injection port is sealed with a sealing material after the liquid crystal is injected through the liquid crystal injection port. Hereinafter, a third embodiment will be described with reference to FIGS. 1 and 9 to 11.

  FIG. 9 is a manufacturing flowchart of the liquid crystal panel 2 constituting the liquid crystal display device 1. 10 and 11 are perspective views of the manufacturing process of the liquid crystal panel 2.

  First, a plurality of, here six, segment electrodes 7 and alignment films 9 corresponding to six liquid crystal display devices 1 are formed on a first mother glass substrate 104 as a first mother substrate by a known method. Similarly, common electrodes 8 and alignment films 9 corresponding to six liquid crystal display devices 1 are formed on a second mother glass substrate 103 as a second mother substrate by a known method. Both the first mother glass substrate 104 and the second mother glass substrate 103 have a thickness of 0.5 mm.

  Next, as shown in FIG. 10A, the liquid crystal sealing regions of the six liquid crystal display devices 1 are defined on the surface of the first mother glass substrate 104 on which the segment electrode 7 and the alignment film 9 are formed. A substantially rectangular sealing material 111 for a liquid crystal display device having a liquid crystal inlet 111a portion opened is formed by screen printing. Further, a mold seal is formed in a rectangular shape without any breaks so as to surround the plurality of sealing materials 111 for the liquid crystal display device, slightly inside the outer peripheral edge of the first mother glass substrate 104, for example, about 1 mm from the substrate edge. The material 21 is applied by screen printing (S1). An epoxy acrylate resin is used as the sealing material 111 for the liquid crystal display device, and a cresol novolac type epoxy resin is used as the sealing material 21 for the mold. The cresol novolac type epoxy resin used for the mold sealing material 21 is more resistant to hydrofluoric acid, which is an etching liquid material used in the etching process described later, than the epoxy acrylate resin used for the liquid crystal display device sealing material 111. is there. In addition, the epoxy acrylate resin used for the sealing material 111 for the liquid crystal display device is superior to the cresol novolac type epoxy resin used for the molding sealing material 21 in that the elution of components into the liquid crystal is less likely to occur. Yes. In addition, as a method for applying the sealing material 111 for the liquid crystal display device and the sealing material 21 for the mold, a dispenser may be used in addition to screen printing.

  After the application of the sealing material 111 for the liquid crystal display device and the sealing material 21 for the mold, as shown in FIG. 10B, the segment electrode 7, the alignment film 9, the sealing material 111 for the liquid crystal display device, and the mold of the first mother glass substrate 104 The first mother glass substrate 104 and the second mother glass substrate 103 are arranged such that the surface on which the sealing material 21 is formed faces the surface on which the common electrode 8 and the alignment film 9 of the second mother glass substrate 103 are formed. Are stacked in a vacuum, and the entire substrate is pressed and bonded in the substrate thickness direction (S2). Thus, by bonding in a vacuum, the two mother glass substrates can be bonded without the liquid crystal display device sealing material 111 and the mold sealing material 21 being ruptured. Accordingly, the liquid crystal display device sealing material 111 is cracked by the rupture of the liquid crystal display device sealing material 111, and the liquid crystal 6 leaks when the liquid crystal display device 1 is formed, or the mold sealing material 21 is ruptured and cracked. As a result, the etching solution does not enter between the two mother glass substrates in the etching process described later.

  After the substrate bonding step, the sealing material 111 for the liquid crystal display device and the sealing material 21 for the mold are cured (S3), and the first mother glass substrate 104 and the second mother glass substrate 103 are bonded to the sealing material 111 for the liquid crystal display device. And a mold sealing material 21 to form a mother panel 250 'shown in FIG. As shown in FIG. 10C, the mother panel 250 ′ before etching is in a state where a sealed space is formed by the first mother glass substrate 104, the second mother glass substrate 103, and the mold sealing material 21. .

  Thereafter, the mother panel 250 ′ is immersed in an etching solution made of hydrofluoric acid, and the outer surface of the mother panel 250 ′ is etched (S4). Thereby, the thickness of each of the first mother glass substrate 104 and the second mother glass substrate 103 is changed from 0.5 mm to 0.3 mm, and the mother panel 250 having a reduced thickness can be obtained. During the etching process, the mold sealing material 21 that is highly resistant to the etchant can prevent the etchant from entering between the first mother glass substrate 104 and the second mother glass substrate 103. Therefore, the inner surface of the mother panel 250 is not etched.

  Next, as shown in FIG. 10D, the mother panel 250 formed by bonding the first mother glass substrate 4 ″ and the second mother glass substrate 3 ″, whose thickness is reduced by etching, is cut along the cutting line 42. Is cut along a line (S5) and cut into strip-shaped mother panels 251 as shown in FIG. The strip-shaped mother panel 251 has a liquid crystal injection port 111a at its end face. Next, the strip-shaped mother panel 251 is carried into a vacuum container (not shown) in which the liquid crystal tank 61 in which the liquid crystal 6 is stored is accommodated, and the strip-shaped mother panel 251 is immersed in the liquid crystal tank 61. The vacuum vessel is evacuated in the absence, and the region surrounded by the liquid crystal display device sealing material 111 is also evacuated to a reduced pressure state. Then, when the inside of the vacuum container is in a reduced pressure state, as shown in FIG. 10 (d), the strip-shaped mother panel 251 is immersed so that the liquid crystal inlet 111 a contacts the liquid crystal 6 stored in the liquid crystal tank 61, Thereafter, the reduced pressure state in the vacuum vessel is released to return to the normal pressure state. Thereby, the liquid crystal is injected into the region surrounded by the sealing material 111 for the liquid crystal display device through the liquid crystal injection port 111a (S6).

  After the liquid crystal injection step, the liquid crystal injection port 111a is sealed with a sealing material 112 as shown in FIG. After that, as shown in FIG. 11 (b), the strip-shaped mother panel 251 is secondarily cut (S8) along the cutting line 43, and the individual first glass substrates as shown in FIG. 11 (c). 4 'and the second glass substrate 3' are cut into a liquid crystal panel 252 formed by bonding. Further, after that, as shown in FIG. 11 (d), the second glass substrate 3 ′ is secondarily cut (S 8) so that the first glass substrate 4 has a protruding portion protruding from the second glass substrate 3. Thus, the liquid crystal panel 2 is obtained.

  Thereafter, the wiring substrate 10 is connected, and the pair of polarizing plates 5 are arranged so as to sandwich the liquid crystal panel 2, thereby obtaining the liquid crystal display device 1 shown in FIG. 1.

  As described above, even when the liquid crystal display device sealing material 111 having the liquid crystal injection port 111a is used, the present invention can be applied, and when the mother panel 250 ′ is etched, as in the first embodiment, Since the sealing material 21 prevents the etchant from entering between the first mother glass substrate 103 and the second mother glass substrate 104, the first glass substrate 3 and the second glass substrate in the state of the liquid crystal panel 2. 4 Only the surface opposite to the surface in contact with each liquid crystal 6 is etched, and the surface in contact with the liquid crystal 6 is not etched. Therefore, the thicknesses of the first glass substrate 4 and the second glass substrate 3 of the liquid crystal panel 2 manufactured as described above are uniformly thin in the substrate plane, and the liquid crystal display device in which the thickness reduction and the weight reduction are realized. 1 can be obtained. Further, since the liquid crystal display device sealing material 111 is not affected by the etching solution, there is no problem that the liquid crystal 6 oozes out of the liquid crystal panel 2 and the liquid crystal display device 1 with good quality characteristics can be obtained.

  Also in the present embodiment, as in the second embodiment, the outer peripheral sealing material 31 may be provided so as to surround the liquid crystal display device sealing material 111 and to the inside of the molding sealing material 21. Similarly to the second embodiment, a step of wiping off the sealing material for mold may be provided by making the timing of curing of the sealing material 111 for the liquid crystal display device different from the timing of curing of the sealing material 21 for mold.

  Further, by using a material having a high resistance to the etching solution as the mold sealing material 21, the resistance of the liquid crystal display device sealing material 111 to the etching solution can be ignored. Therefore, the material of the liquid crystal display device sealing material 111 is selected. As a result, a high quality liquid crystal display device 1 can be obtained. That is, at present, characteristics required for a sealing material for a liquid crystal display device, for example, when trying to select a material in which elution of components into the liquid crystal is unlikely to occur, the resistance to an etchant is inevitably weakened. When the same material as the sealing material for the liquid crystal display device is used as the sealing material for the mold for preventing the intrusion of the etching solution, there is a problem that the sealing material for the mold is attacked by the etching solution. Therefore, in the present embodiment, the sealing material for the liquid crystal display device is different from the sealing material for the liquid crystal display device as the mold sealing material, so that the sealing material for the liquid crystal display device is not affected by the etching liquid. In addition, a liquid crystal display device with high quality characteristics can be obtained by using a material that does not easily dissolve components into the liquid crystal as a sealing material for the liquid crystal display device.

  In each of the embodiments described above, all the sealing materials are formed on one of the two mother glass substrates. For example, a sealing material for a liquid crystal display device is provided on one of the mother glass substrates. The sealing material may be provided on a separate mother glass substrate, such as applying and applying a mold sealing material on the other mother glass substrate.

  (Electronics)

  Next, an electronic apparatus provided with the above-described liquid crystal display device 1 will be described.

  FIG. 12 is a schematic configuration diagram showing the overall configuration of the display control system of the electronic apparatus according to the present embodiment.

  The electronic device 300 includes, for example, a liquid crystal panel 2 and a display control circuit 390 as a display control system as shown in FIG. 12. The display control circuit 390 includes a display information output source 391, a display information processing circuit 392, a power supply circuit 393, and the like. A timing generator 394 and the like are included.

  Further, the liquid crystal panel 2 has a drive circuit 361 for driving the display area G.

  The display information output source 391 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. It has. Further, the display information output source 391 is configured to supply display information to the display information processing circuit 392 in the form of a predetermined format image signal or the like based on various clock signals generated by the time generator 394.

  The display information processing circuit 392 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is supplied to the drive circuit 361 together with the clock signal CLK. The driving circuit 361 includes a scanning line driving circuit, a data line driving circuit, and an inspection circuit. The power supply circuit 393 supplies a predetermined voltage to each component described above.

  Such an electronic device 300 can be reduced in thickness and weight.

  Specific electronic equipment includes touch panels, projectors, liquid crystal televisions, viewfinder type, monitor direct view type video tape recorders, car navigation systems, pagers, electronic notebooks that are equipped with liquid crystal display devices in addition to mobile phones and personal computers. Calculators, word processors, workstations, videophones, POS terminals and the like. And it cannot be overemphasized that the liquid crystal display device 1 mentioned above is applicable as a display part of these various electronic devices, for example.

  Note that the electro-optical device of the present invention is not limited to the above-described example, and it is needless to say that various modifications can be made without departing from the gist of the present invention. Moreover, you may combine each example mentioned above in the range which does not deviate from the summary of this invention.

  For example, each of the above-described electro-optical devices is a liquid crystal display device having a liquid crystal panel, but may be various electro-optical devices such as a plasma display and an organic EL display, and can be reduced in thickness and weight. . In the above embodiment, the passive matrix liquid crystal display device is described as an example. However, the present invention may be applied to an active matrix liquid crystal display device using thin film transistor elements or thin film diode elements as switching elements.

1 is a schematic cross-sectional view of a liquid crystal display device according to an embodiment. FIG. 4 is a manufacturing flowchart of the liquid crystal display device according to the first embodiment. Manufacturing process perspective view of the liquid crystal display device concerning a 1st embodiment (the 1). Manufacturing process perspective view of the liquid crystal display device concerning a 1st embodiment (the 2). FIG. 4 is a schematic cross-sectional view of a mother panel cut along a line AA ′ in FIG. The manufacturing flowchart figure of the liquid crystal display device concerning 2nd Embodiment. Manufacturing process perspective view of the liquid crystal display device concerning 2nd Embodiment (the 1). Manufacturing process perspective view of the liquid crystal display device concerning 2nd Embodiment (the 2). FIG. 10 is a manufacturing flowchart of a liquid crystal display device according to a third embodiment. Manufacturing process perspective view of the liquid crystal display device concerning 3rd Embodiment (the 1). Manufacturing process perspective view of the liquid crystal display device concerning 3rd Embodiment (the 2). 1 is a schematic configuration diagram showing an overall configuration of a display control system of an electronic device according to an embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Liquid crystal display device, 6 Liquid crystal, 11, 111 Sealant for liquid crystal display devices, 21 Seal material for molds, 31 Outer periphery seal material, 50 ', 150', 250 'Mother panel, 103 2nd mother glass substrate, 104 1st Mother glass substrate, 300 electronic devices

Claims (9)

A plurality of electro-optical device sealing materials on a first mother substrate; and a mold sealing material that surrounds the plurality of electro-optical device sealing materials and is made of a material that is more resistant to etching than the electro-optical device sealing material. A step of applying
Bonding the first mother substrate and the second mother substrate disposed opposite to the first mother substrate via the electro-optical device sealing material and the mold sealing material;
Curing the electro-optical device sealing material and the mold sealing material of the bonded first mother substrate and second mother substrate;
Etching the first mother substrate and the second mother substrate bonded together by the cured sealing material for the electro-optical device and the sealing material for the mold, and a method for manufacturing the electro-optical device.   2. The method of manufacturing an electro-optical device according to claim 1, wherein the electro-optical device sealing material is made of an epoxy acrylate resin, and the mold sealing material is made of a cresol novolac type epoxy resin.   The method of manufacturing an electro-optical device according to claim 1, wherein the etching step is immersed in an etching solution.   4. The electro-optical device according to claim 1, wherein in the curing step, a curing time of the electro-optical device sealing material is different from a curing time of the mold sealing material. 5. Manufacturing method.   5. The electro-optical device sealing material is visible light curable, and the mold sealing material is ultraviolet curable or thermosetting. 6. Manufacturing method of the electro-optical device.   The said hardening process hardens the said sealing material for molds, after hardening the said sealing material for electro-optical devices, The Claim 1 characterized by the above-mentioned. Manufacturing method of electro-optical device.   The method of manufacturing an electro-optical device according to claim 1, wherein the bonding step is performed in a vacuum.   8. The coating step according to claim 1, further comprising: applying an outer peripheral sealing material that surrounds the plurality of electro-optical device sealing materials and is inside the molding sealing material. A method for manufacturing an electro-optical device according to one item.   9. The electro-optic according to claim 1, wherein the mold sealing material is formed on an inner side than outer peripheral edges of the first mother substrate and the second mother substrate. Device manufacturing method.

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