JP2006096842A - Adhesion method using ultraviolet-curable resin and liquid injection head using the adhesion method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesion method using an ultraviolet-curable resin, wherein the uncured part which does not receive ultraviolet ray is cured when an adhering material and a material to be adhered are adhered, and also to prepare a liquid injection head prepared by using the above method. <P>SOLUTION: The adhesion method comprises steps of: attaching preliminary a primer 4 comprising a solvent containing metal ions, which react as a polymerization catalyst for an ultraviolet-curable resin 3, on at least one side of an adhering material 2 or a material 1 to be adhered; placing the above adhering material 2 on the material 1 to be adhered sandwiching the above ultraviolet-curable resin 3; irradiating with ultraviolet ray and then heat-treating. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for bonding a member to be bonded and an adhesive body by heat-curing a portion of the ultraviolet curable resin that is not exposed to ultraviolet rays.

  Conventionally, as a method of bonding an adhesive member and an adhesive body, various bonding methods using a thermosetting resin, an ultraviolet curable resin, or the like have been performed by combining the adherend member and the adhesive body (for example, Patent Documents 1 to 3). In particular, UV curable resins can selectively cure the resin, have a fast curing rate, and can add non-transparent materials by adding performance such as thermosetting and anaerobic curing. In recent years, application fields have spread rapidly due to such possibilities.

  However, in an ink jet recording head composed of a semiconductor element that is relatively heat-sensitive, a relatively low limit temperature is set so that the semiconductor element is not adversely affected by heat of the heat treatment. As shown in FIG. 2, when the semiconductor device 100 and the semiconductor element 200 are bonded, even if an ultraviolet curable resin with thermosetting property is used as an adhesive, sufficient heat treatment cannot be performed. However, there is a problem that the portion 500 that is not irradiated with ultraviolet rays is not cured.

JP-A-10-235875 JP 2001-018386 A JP 2003-238770 A

  In view of the above-described circumstances, the present invention uses an adhesion method that cures a portion that is not exposed to ultraviolet rays and is not cured when an adhesive member and an adherend are bonded using an ultraviolet curable resin, and an adhesion method thereof. It is an object of the present invention to provide a liquid ejecting head manufactured in the above manner.

A first aspect of the present invention for solving the above-mentioned problem is that a primer comprising a solvent containing a metal ion that acts in advance as a polymerization reaction catalyst for an ultraviolet curable resin is applied to at least one adhesive surface of an adhesive member or an adherend. In the bonding method, the adhesive member is placed on the adherend through the ultraviolet curable resin, and is subjected to heat treatment after being irradiated with ultraviolet rays.
In the first aspect, when the adhesive member and the adherend are bonded using the ultraviolet curable resin, the portion of the ultraviolet curable resin that is not irradiated with ultraviolet rays and is not cured can be cured by heat treatment. .

According to a second aspect of the present invention, in the first aspect, the solvent is an organic solvent having a saturated vapor pressure of 300 mmHg or more when measured at 60 ° C.
In the second aspect, since the organic solvent easily evaporates during the heat treatment, it is possible to prevent the thermosetting reaction interference of the ultraviolet curable resin by the organic solvent.

According to a third aspect of the present invention, in the first or second aspect, at least one of the adhesive member and the adherend is a semiconductor element or a semiconductor device.
In the third aspect of the present invention, the semiconductor element and the semiconductor device can be firmly bonded without causing an adverse effect due to the heat of the heat treatment.

According to a fourth aspect of the present invention, in any one of the first to third aspects, the adhesive surface of the adhesive member is brought into contact with the primer tank having a recess in which the primer is stored, by contacting the adhesive surface of the adhesive member. In the bonding method, the primer is attached.
In the fourth aspect of the present invention, the primer can be attached without complicating the manufacturing process only by adding the step of attaching the primer to the existing manufacturing process.

According to a fifth aspect of the present invention, in any one of the first to third aspects, the tip surface of the attachment tool to which the primer is supplied and the adhesive surface of the adhesive member are brought into contact with each other via the primer. In the bonding method, the primer is attached to the bonding surface of the bonding member.
In the fifth aspect of the present invention, the primer can be attached without complicating the manufacturing process only by adding the step of attaching the primer to the existing manufacturing process.

According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the ultraviolet curable resin is an acrylic ultraviolet curable resin.
In the sixth aspect, the acrylic ultraviolet curable resin can be cured at a low temperature when post-curing is used, so that it does not require time for adhesion.

According to a seventh aspect of the present invention, there is provided a plurality of piezoelectric elements comprising a vibration plate provided on one side of a substrate on which a pressure generation chamber is formed, and a lower electrode, a piezoelectric layer and an upper electrode provided via the vibration plate. An element, a protective substrate bonded to the surface of the substrate on the piezoelectric element side and provided with a piezoelectric element holding portion that protects the piezoelectric element, and an adhesive member bonded to the protective substrate and the piezoelectric element A primer made of a solvent containing a metal ion that acts in advance as a polymerization reaction catalyst for an ultraviolet curable resin on at least one adhesive surface of the driver IC or the protective substrate. Adhering and mounting the driving IC on the protective substrate through the ultraviolet curable resin and irradiating with ultraviolet rays, followed by heat treatment to adhere to the protective substrate A liquid-jet head characterized.
In the seventh aspect, since the driving IC is firmly bonded to the protective substrate, it is possible to provide a liquid jet head that is less likely to be damaged.

Hereinafter, the best mode for carrying out the present invention will be described. The description of the present embodiment is an exemplification, and the present invention is not limited to the following description.
(Embodiment 1)
FIG. 1 shows an adhesion method using an ultraviolet curable resin according to an embodiment of the present invention. In the bonding method using the ultraviolet curable resin according to the present embodiment, as shown in FIG. 1B, the primer 4 is attached in advance on at least one bonding surface of the semiconductor device 1 or the semiconductor element 2 to cure the ultraviolet light. After placing the semiconductor element 2 on the semiconductor device 1 through the mold resin 3 and irradiating with ultraviolet rays, heat treatment at a relatively low temperature is performed so that the portion 5 that has not been cured even when irradiated with ultraviolet rays. This is a method of curing an ultraviolet curable resin. This method is clearly different from the method in which the primer 4 is previously mixed with the ultraviolet curable resin 3 and cured. A primer previously mixed with an ultraviolet curable resin is hard to be cured even when heat is applied, and an uncured ultraviolet curable resin cannot be cured by heat treatment at a relatively low temperature as in the present invention.

  Here, the primer 4 used in the present invention is made of an organic solvent containing a metal ion that functions as a polymerization reaction catalyst. The metal ion is not particularly limited as long as it is a polymerization reaction catalyst that accelerates the radical polymerization reaction or ion polymerization reaction of the ultraviolet curable resin 3 when heat-treated, but iron ion is particularly preferable. When iron ions are used as a polymerization reaction catalyst, the radical polymerization reaction can be further promoted. The organic solvent is not particularly limited, but is preferably a liquid at room temperature, more preferably an organic solvent having a saturated vapor pressure of 300 mmHg or higher when measured at 60 ° C., and particularly preferably methanol, ethanol, and acetone. When the saturated vapor pressure of the organic solvent is 300 mmHg or more, the organic solvent easily evaporates during the heat treatment, and it is possible to prevent the thermosetting reaction interference of the ultraviolet curable resin by the organic solvent.

  The ultraviolet curable resin 3 used in the present invention is not particularly limited as long as it is a thermosetting ultraviolet curable resin, but an acrylic thermosetting ultraviolet curable resin is preferable. An acrylic thermosetting UV curable resin has a feature that it can be cured at a low temperature when used together with post-cure.

  The semiconductor device 1 used in the present invention is not particularly limited. For example, the semiconductor device 1 may be adversely affected when the temperature is 65 ° C. or higher, such as an actuator chip for an ink jet recording head.

  The semiconductor element 2 used in the present invention is not particularly limited, but, for example, a semiconductor controller 2 that is adversely affected when the temperature is 65 ° C. or higher, such as a driver controller IC for an ink jet recording head.

  The temperature set by the heat treatment of the present invention is a temperature that does not affect the semiconductor device 1 and the semiconductor element 2 and is lower than the temperature at which the thermosetting ultraviolet curable resin 3 is cured. is there. For example, when an acrylic ultraviolet curable resin is used for the ultraviolet curable resin 3 and the driver controller IC is bonded to the actuator chip of the ink jet recording head, the temperature is 65 ° C.

  Below, the semiconductor device 1 is an actuator chip for an ink jet recording head, the semiconductor element 2 is a driver controller IC 2 for an ink jet recording head, and the ultraviolet curable resin 3 is an acrylic ultraviolet curable resin. The adhesion method using the ultraviolet curable resin of the invention will be specifically described.

Example 1
As shown in FIG. 1A, an acrylic ultraviolet curable resin 3 is attached to a portion to which the driver controller IC 2 on the actuator chip 1 is bonded. A method of attaching the primer 4 to the lower surface of the driver controller IC 2 will be described later. Thereafter, as shown in FIG. 1B, the driver controller IC 2 to which the primer 4 is attached is replaced with an actuator to which the acrylic ultraviolet curable resin 3 is attached. Place on the chip. Here, the primer 4 is a solvent in which iron ions and ethanol are mixed.

  Then, as shown in FIG. 1C, the actuator chip 1 on which the driver controller IC2 is mounted is irradiated with ultraviolet light having a wavelength of 200 to 400 nm from above the driver controller IC2. Then, the acrylic ultraviolet curable resin 3 in the portion 6 where the ultraviolet rays hit is cured by the ultraviolet rays. However, the acrylic ultraviolet curable resin 3 in the portion 5 shielded by the driver controller IC 2 exists without being cured because it is not exposed to ultraviolet rays.

  Thereafter, the actuator chip 1 on which the driver controller IC 2 is placed is placed in an oven and heat-treated at 65 ° C. for 90 minutes. Then, the iron ions contained in the primer 4 act as a catalyst for the radical polymerization reaction, and usually the acrylic ultraviolet curable resin 3 is cured even at 65 ° C. at which the acrylic ultraviolet curable resin 3 is not cured. Can do. Therefore, as shown in FIG. 1 (d), this heat treatment can also cure the acrylic ultraviolet curable resin 3 in the portion 5 that has not been cured because it is not exposed to ultraviolet rays. The cured portion 7 of the acrylic ultraviolet curable resin 3 cured by this heat treatment and the primer 4 present in the vicinity thereof are mixed with the acrylic ultraviolet curable resin 3 by this heat treatment. After the heat treatment, the primer 4 disappears as shown in FIG.

  As described above, since the acrylic ultraviolet curable resin 3 in the portion 5 that has not been cured by the conventional ultraviolet rays is cured, the actuator chip 1 and the driver controller IC 2 can be bonded more firmly. In addition, since the heat treatment is performed at a relatively low temperature, the actuator chip 1 and the driver controller IC 2 can be bonded without adversely affecting them.

  Next, a method for adhering the primer 4 to the lower surface of the driver controller IC 2 that is an adhesive member will be described. The apparatus shown in FIG. 2A includes an intermediate stage 11 having a recess that is a primer layer, a primer 12 stored in the recess of the intermediate stage 11, an arm 10 positioned above the intermediate stage, and an arm 10. The driver controller IC2 held in

  When this apparatus is operated, first, the arm 10 is lowered, and the lower surface of the driver controller IC 2 comes into contact with the surface of the primer 12 stored in the recess of the intermediate stage 11. Then, the arm 10 stops and then rises. Then, as shown in FIG. 2B, the primer 4 adheres to the lower surface of the driver controller IC2.

  Then, the driver controller IC 2 to which the primer 4 is adhered is conveyed while being held by the arm 10, and is placed on the actuator chip 1 to which the ultraviolet curable resin 3 is adhered, as shown in FIG. 2 (c). .

  Such a method of attaching the primer 4 to the driver controller IC 2 is a primer for the driver controller IC 2 without adding an additional operation to the operation configuration of the apparatus for bonding the driver controller IC 2 on the actuator chip 1 at present. 4 can be attached, the ink jet recording head according to the present invention can be manufactured in a time that is almost the same as the time required to manufacture the current ink jet recording head.

  Further, the primer 4 can be attached to the lower surface of the driver controller IC 2 also by the apparatus shown in FIG. The apparatus shown in FIG. 3A is located above the belt conveyor 21 in which the opening 24 is formed by being pushed up from below, the driver controller IC2 placed on the belt conveyor 21, and the driver controller IC2. The arm 10, the push-up pin 20 that is an attachment tool located on the vertical line of the arm 10 and below the belt conveyor 21, the primer 4 that flows into the recess 23 in which the push-up pin 20 is stored, and the primer 4 The structure portion 22 is formed so as to easily flow into the recess portion 23.

  When this apparatus is operated, the driver controller IC 2 is conveyed by the belt conveyor 21 so as to be positioned between the arm 10 and the push-up pin 20. Then, the belt conveyor 21 stops and the push-up pin 20 to which the primer 4 is attached rises.

  Then, the opening pin 24 is formed in the belt conveyor 21 by the raised push pin 20, and the driver controller IC 2 placed on the belt conveyor 21 is pushed up by the push pin 20.

  Then, the pushed-up driver controller IC 2 comes into contact with the arm 10. Therefore, the push-up pin 20 stops and then descends. Then, as shown in FIG. 3B, the driver controller IC2 is held by the arm 10 and the primer 4 adheres to the lower surface.

  After that, as shown in FIG. 4, it is transported above the actuator chip 1 and placed on the actuator chip 1.

  Even when such a method of attaching the primer 4 to the driver controller IC2 is used, the time required for manufacturing the current ink jet recording head is almost the same as the method of attaching the primer 4 to the driver controller IC2 described above. The inkjet printer head according to the present invention can be manufactured in a short time.

(Example 2)
As shown in FIG. 5A, the primer 4 is attached to the portion on the actuator chip 1 where the driver controller IC 2 is to be bonded. Here, the primer 4 is the same as that used in Example 1.

  Next, as shown in FIG. 5B, an acrylic ultraviolet curable resin 3 is further applied on the portion of the actuator chip 1 where the primer 4 is adhered.

  Then, as shown in FIG. 5C, after the driver controller IC 2 to be bonded to the actuator chip 1 is placed on the acrylic ultraviolet curable resin 3, as in Example 1, the wavelength range is 200 to The actuator chip 1 is irradiated with ultraviolet rays of 400 nm from above the driver controller IC2. Then, the acrylic ultraviolet curable resin 3 in the portion 6 irradiated with ultraviolet rays is cured by the ultraviolet rays. However, the acrylic ultraviolet curable resin 3 in the portion 5 shielded by the driver controller IC 2 is not cured because it is not exposed to ultraviolet rays.

  Thereafter, by performing the same heat treatment as in Example 1, as shown in FIG. 5 (d), the acrylic ultraviolet curable resin 3 in the portion 5 that was present without being cured can be cured. Also in this example, after the heat treatment, the primer 4 does not exist as shown in FIG.

  As described above, in this embodiment as well as in the first embodiment, the acrylic UV curable resin 3 in the portion 5 that has not been cured because it has not been hit by ultraviolet rays is cured. And the driver controller IC2 can be bonded together, and since the heat treatment is performed at a relatively low temperature, the actuator chip 1 and the driver controller IC2 can be bonded without adversely affecting them.

(Other examples)
In the first and second embodiments, the primer 4 is attached to one of the adhesion surfaces of the actuator chip 1 or the driver controller IC 2. However, the primer 4 may be adhered to both the adhesion surfaces of the actuator chip 1 and the driver controller IC 2. Good. In this case, it is possible to cure the portion of the acrylic ultraviolet curable resin 3 that has not been cured by the irradiation of ultraviolet rays by a shorter heat treatment.

  Further, when the above-described bonding method using an ultraviolet curable resin is used, an ink jet recording head in which an actuator chip 1 as an adherend and a driver controller IC 2 as an adhesive member are bonded as shown in FIG. Can be manufactured.

  The ink jet recording head 30 shown in FIG. 6 includes an actuator chip 1 and a driver controller IC 2. The actuator chip 1 communicates with the nozzle plate 41 having a plurality of nozzle openings 47 and the nozzle openings 47. A flow path forming substrate 43 in which a pressure generating chamber 42 is formed, a lower electrode 52 provided on the upper side of the flow path forming substrate 43 via an elastic film 50 and an insulator film 51, a piezoelectric layer 53, and the driver controller 2. A plurality of piezoelectric elements 44 composed of upper electrodes 54 to be connected; a protective substrate 46 having a piezoelectric element holding portion 45 that is bonded to the surface of the flow path forming substrate 43 on the piezoelectric element 44 side and protects the piezoelectric elements 44; It is made up of. The actuator chip 1 and the driver controller IC 2 are bonded by the bonding method using the ultraviolet curable resin described above.

  In the ink jet recording head 30 of this embodiment, ink is taken into the reservoir 48 provided between the flow path forming substrate 43 and the protective substrate 46 from an external ink supply means (not shown), and the nozzle 48 is opened from the reservoir 48. After filling the inside with ink up to 47, a driving voltage is applied between the lower electrode film 52 and the upper electrode film 54 corresponding to the pressure generating chamber 42 in accordance with a driving signal from the driver controller IC2, and elasticity is obtained. By bending and deforming the film 50, the insulator film 51, the lower electrode film 52, and the piezoelectric layer 53, the pressure in each pressure generating chamber 42 increases, and ink droplets are ejected from the nozzle openings 47.

  As described above, according to the bonding method described above, the ink jet recording head 30 in which the actuator chip 1 and the driver controller IC 2 are more firmly bonded can be obtained, and the actuator chip 1 and the driver controller IC 2 can be bonded. Since the temperature of the heat treatment is relatively low, the actuator chip 1 and the driver controller are free from the adverse effects caused by the difference in the coefficient of thermal expansion of the constituent materials caused by the heat treatment or the adverse effects due to the expansion of the internal space when the internal space is provided. An ink jet recording head 30 made of IC2 can be obtained.

  The present invention relates to a method of heat-curing a portion of an ultraviolet curable resin that is not exposed to ultraviolet rays to bond the adherend and the adherend, but is not an ultraviolet curable resin and is cured by an X-ray or an electron beam. This photocurable resin can also be used when the member to be bonded and the bonded body are bonded by heat curing.

2 is a conceptual diagram of an adhesion method according to Embodiment 1. FIG. It is a conceptual diagram of the method to which the primer which concerns on Embodiment 1 is made to adhere. It is a conceptual diagram of the method to which the primer which concerns on Embodiment 1 is made to adhere. It is a conceptual diagram of the method to which the primer which concerns on Embodiment 1 is made to adhere. 5 is a conceptual diagram of an adhesion method according to Embodiment 2. FIG. It is a conceptual diagram of an ink jet recording head manufactured by an adhesion method. It is a conceptual diagram when the conventional semiconductor device and the semiconductor element are adhere | attached.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Semiconductor device (actuator chip), 2 Semiconductor element (driver controller IC), 3 UV curable resin (acrylic UV curable resin), 4 Primer, 5 Uncured part of acrylic UV curable resin, 6 Acrylic UV Cured part of curable resin, 7 Cured part of acrylic UV curable resin cured by heat treatment, 10 Arm, 11 Intermediate stage, 12 Primer, 20 Push-up pin, 21 Belt conveyor, 22 Structure part, 23 Recessed part, 24 Open Mouth, 30 ink jet recording head 30, 41 nozzle plate, 42 pressure generating chamber, 43 flow path forming substrate, 44 piezoelectric element, 45 piezoelectric element holding portion, 46 protective substrate, 47 nozzle opening, 50 elastic film, 51 insulator film , 52 bottom Electrode, 53 piezoelectric layer, 54 upper electrode

Claims (7)

A primer made of a solvent containing a metal ion that acts as a polymerization reaction catalyst for an ultraviolet curable resin is attached in advance to at least one adhesive surface of an adhesive member or an adherend, and the adhesive member is attached via the ultraviolet curable resin. A bonding method characterized by performing heat treatment after being placed on an adherend and irradiated with ultraviolet rays. The bonding method according to claim 1, wherein the solvent is an organic solvent having a saturated vapor pressure of 300 mmHg or more when measured at 60 ° C. 3. The bonding method according to claim 1, wherein at least one of the bonding member and the adherend is a semiconductor element or a semiconductor device. 4. The primer according to claim 1, wherein the primer is attached to the adhesive surface of the adhesive member by bringing the adhesive surface of the adhesive member into contact with a primer tank having a recess in which the primer is stored. Bonding method. 4. The primer according to claim 1, wherein a contact surface of the adhesive member is contacted with a tip surface of an attachment tool to which the primer is supplied and an adhesive surface of the adhesive member via the primer. A bonding method characterized by adhering. 6. The bonding method according to claim 1, wherein the ultraviolet curable resin is an acrylic ultraviolet curable resin. A vibration plate provided on one side of the substrate on which the pressure generating chamber is formed, a plurality of piezoelectric elements including a lower electrode, a piezoelectric layer, and an upper electrode provided via the vibration plate, and the piezoelectric element of the substrate A protective substrate that is bonded to the side surface and is provided with a piezoelectric element holding portion that protects the piezoelectric element, and a drive IC that is an adhesive member bonded to the protective substrate and drives the piezoelectric element. The drive IC attaches a primer made of a solvent containing a metal ion that acts as a polymerization reaction catalyst for the ultraviolet curable resin in advance to at least one adhesive surface of the drive IC or the protective substrate. The driving IC is mounted on the protective substrate and irradiated with ultraviolet rays, and then heat-treated, thereby being adhered to the protective substrate. De.

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