JP2006091166A - Optical waveguide wiring substrate assembly, photoelectric hybrid substrate assembly, and optical coupling unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical waveguide wiring substrate assembly that facilitates connection of a waveguide element such as an optical fiber and that excels in flatness, and also to provide an optical coupling unit in which a waveguide element is connected to the optical waveguide wiring substrate assembly. <P>SOLUTION: This is an optical waveguide wiring substrate assembly 50 having an optical waveguide wiring substrate 30 and a connecting member 40. The optical waveguide wiring substrate is provided with a substrate end part 32 in which the end face 36 of a waveguide is exposed and formed. The connecting member is provided with a first connecting part 42 to which the substrate end part is connected and a second connecting part which has a waveguide 46 and which is connected with the end of a waveguide element 90 having an end part 96 with the waveguide end face 94 exposed and formed. In the optical waveguide wiring substrate assembly, a light guiding part 46 is installed between the first and second connecting parts, and the end faces 47, 48 of the light guiding part are exposed and formed in the first and second connecting parts. Also, in the assembly, the substrate end part is connected to the first connecting part, the end face of the waveguide and that of the light guiding part are optically connected. The invention further refers to the optical coupling unit in which a waveguide element is connected to the optical waveguide wiring substrate assembly. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optical waveguide wiring board assembly or an optical / electrical hybrid board assembly having an optical waveguide wiring board or an opto-electric hybrid board and a connecting member, and an optical junction unit.

Recently, in IC technology and LSI technology, in order to improve operation speed and integration, instead of high-density electrical wiring, optical wiring has been focused on between devices, between boards in devices, and on chips. Has been. Further, in the optical interconnection in the high-speed and large-capacity optical communication system, the processing of the transmitted optical signal is performed by an electronic device, and an optical-electric mixing device is required.
As an element for optical wiring, for example, Patent Document 1 discloses an array type photoelectric conversion element unit provided with a plurality of photoelectric conversion elements and a plurality of different lengths, and an end thereof is a mirror. An optical path conversion device including an array type optical waveguide unit in which an optical waveguide cut at 45 ° is formed and an optical coupling optical waveguide for coupling each photoelectric conversion element to the optical waveguide is described.

Furthermore, in recent years, the development of portable devices having a wireless communication function is remarkable, but there are problems of electromagnetic radiation noise (EMI) from electric boards, resistance to radio wave interference from the outside world, and signal disturbance (SI) due to incomplete connection. To address this, attempts have been made to change some of the electrical connections to optical connections that are fast and electromagnetically inductive.
For example, in the following Patent Document 2, an optical junction between an opto-electric hybrid board in which an optical waveguide board and an electric circuit board are laminated and an optical element such as a light-emitting element and a light-receiving element is provided. It is described that the optical pins of the chip are inserted into guide holes provided in the optical waveguide substrate. Further, in Patent Document 3 below, an opto-electric hybrid board in which an optical waveguide sheet and an optical element (light emitting element, light receiving element) with optical path changing means embedded in the core portion of the optical waveguide sheet are laminated on an electric circuit board. Is described.

By the way, if there is a substrate-like optical waveguide that can input and output light at an arbitrary position and can perform optical connection at a high density, it can be laminated with an electric circuit board to obtain light for an optical-electric mixing device. It becomes possible to easily manufacture the electric hybrid board.
However, a substrate-like optical waveguide that can input and output light at any position and can perform optical connection at high density has not been known so far. Therefore, an optical circuit board is simply laminated with an electric circuit board. There is also no known electrical hybrid board.

  In view of such a problem, the present inventors can input and output light at an arbitrary position, optical connection can be performed at high density, and can be manufactured by a method with excellent productivity. An optical waveguide wiring board on which substrates can be stacked was invented and filed (Japanese Patent Application No. 2004-87918). The optical waveguide wiring board has at least one optical path conversion means for converting an optical path in a plane parallel to the optical waveguide wiring board plane and / or a plane parallel to the optical waveguide wiring board plane in the optical circuit pattern. Optical path conversion means for converting an optical path in a direction having an angle is provided, and at the end face of the core and / or by an optical path conversion means for converting the optical path in a direction having an angle with respect to a plane parallel to the plane of the optical waveguide wiring board. It is possible to input / output light into or out of the optical waveguide wiring board.

If optical signals from this optical waveguide wiring board or an opto-electric hybrid board in which an electric circuit board is laminated can be directly input / output to / from another board, optical joining and / or electrical joining is unitized. However, no attempt has been made to unitize the optical input / output of the optical waveguide wiring board or the opto-electric hybrid board as described above.
JP 2003-114365 A JP 2003-131081 A JP 2003-57468 A

  The present invention has been made on the basis of the above-described requirements, and an object thereof is to provide an optical waveguide wiring board assembly and an opto-electric hybrid board assembly capable of easily connecting a waveguide element such as an optical fiber and having excellent flatness. The present invention also provides an optical junction unit and a photoelectric junction unit in which a waveguide element is connected to the optical waveguide wiring board assembly and the opto-electric hybrid board assembly.

The above-mentioned problems are solved by providing the following optical waveguide wiring board assembly, opto-electric hybrid board assembly, optical junction unit, and photoelectric junction unit.
(1) An optical waveguide wiring board assembly in which an optical waveguide wiring board and a connection member are joined, wherein the optical waveguide wiring board has a substrate end portion in which a waveguide end face is exposed, and the connection member includes: A first connection portion to which the substrate end portion is connected, and a second connection portion to which the end portion of the waveguide element having the waveguide portion and the end portion in which the end face of the waveguide portion is exposed is connected. A light guide portion is provided between the first connection portion and the second connection portion, and an end face of the light guide portion is exposed and formed at the first connection portion and the second connection portion, 1. An optical waveguide wiring board assembly, wherein an end portion of a substrate is connected to one connecting portion, and an end face of a waveguide and an end face of a light guide portion are optically bonded.

(2) In the above (1), the size and / or shape of the light guide section end face in the first connection section is different from the size and / or shape of the light guide section end face in the second connection section. An optical waveguide wiring board assembly as described.
(3) The optical waveguide wiring board assembly according to (1), wherein the light guide section end face pitch in the first connection section is different from the light guide section end face pitch in the second connection section.

(4) An optical waveguide wiring board assembly in which an optical waveguide wiring board and a connection member are joined, wherein the optical waveguide wiring board has a substrate end portion in which a waveguide end face is exposed, and the connection member is a substrate. A connecting portion to which the end portion is connected; and a holding portion to which the end portion of the waveguide element having a waveguide portion and an end portion in which the end face of the waveguide portion is exposed is held; An optical waveguide wiring board assembly, wherein the portion is connected to a connection portion of a connection member.

(5) The optical waveguide wiring board surface is changed by changing the direction of light to a direction having an angle with respect to the plane parallel to the optical waveguide wiring, the optical input / output unit, and the optical waveguide wiring board plane. At least one optical path conversion means A for optically connecting the optical input / output unit and the optical waveguide provided above and / or at least an optical path conversion means B for converting the direction of light in a plane parallel to the plane of the optical waveguide wiring board. The optical waveguide wiring board assembly according to any one of (1) to (4), wherein the optical waveguide wiring board assembly has one.

(6) An opto-electric hybrid board assembly in which an opto-electric hybrid board in which an electric circuit board is laminated on an optical waveguide wiring board and a connection member are joined,
The opto-electric hybrid board has a substrate end portion in which a waveguide end face is exposed,
The connection member includes an electrical wiring, a first connection portion to which the substrate end is connected, and an end portion of the waveguide element having a waveguide portion and an end portion in which the end surface of the waveguide portion is exposed. A second connection portion to be connected, a light guide portion is provided between the first connection portion and the second connection portion, and light is guided to the first connection portion and the second connection portion. The end face of the part is exposed and formed,
A substrate end is connected to the first connection portion, a waveguide end surface and a light guide portion end surface are optically bonded, and an electrical wiring of a connection member and an electrical wiring on an electrical circuit board are connected. An opto-electric hybrid board assembly.

(7) In the above (6), the size and / or shape of the light guide end face in the first connecting portion is different from the size and / or shape of the light guide end face in the second connecting portion. The opto-electric hybrid board assembly as described.
(8) The opto-electric hybrid board assembly according to (6), wherein a light guide end face pitch in the first connection portion and a light guide end face pitch in the second connection portion are different.

(9) An opto-electric hybrid board assembly in which an opto-electric hybrid board in which an electric circuit board is laminated on an optical waveguide wiring board and a connecting member are joined, wherein the end face of the waveguide is exposed in the optical waveguide wiring board The waveguide member has a substrate end portion, and the connection member includes an electrical wiring, a connection portion to which the substrate end portion is connected, a waveguide portion, and an end portion in which the waveguide end surface is exposed. The end portion has a holding portion to be held, the substrate end portion is connected to a connection portion of a connection member, and the electric wiring of the connection member and the electric wiring in the electric circuit board are connected. An opto-electric hybrid board assembly.

(10) An opto-electric hybrid board assembly in which an opto-electric hybrid board in which an electrical circuit board is laminated on an optical waveguide wiring board and a connection member are joined,
The opto-electric hybrid board has a light input / output unit on its surface,
The connecting member includes an electrical wiring, a first connecting portion to which an opto-electric hybrid board surface is connected, and the end of the waveguide element having a waveguide portion and an end portion where the waveguide end surface is exposed. The first connection part has a light input / output part at a position corresponding to the light input / output part on the surface of the opto-electric hybrid board, and the first connection part A light guide unit is provided between the light input / output unit and the second connection unit, and an end surface of the light guide unit is exposed and formed at the second connection unit. The light passing through the end face is parallel to the surface of the opto-electric hybrid board,
The optical input / output unit on the opto-electric hybrid board surface is connected to the optical input / output unit in the first connection unit, and the electrical wiring of the connection member and the electrical wiring on the electrical circuit board are connected. An opto-electric hybrid board assembly.

(11) The optical waveguide wiring board surface is changed by changing the direction of light to a direction having an angle with respect to the plane parallel to the optical waveguide wiring, the optical input / output unit, and the optical waveguide wiring board plane. At least one optical path conversion means A for optically connecting the optical input / output unit and the optical waveguide provided above and / or at least an optical path conversion means B for converting the direction of light in a plane parallel to the plane of the optical waveguide wiring board. The opto-electric hybrid board assembly according to any one of the above (6) to (10), comprising one.

(12) In the optical waveguide wiring board assembly according to any one of (1) to (5), the end of the waveguide element having an end portion having a waveguide portion and an exposed end surface of the waveguide portion. Optical junction unit with connected parts.
(13) In the opto-electric hybrid board assembly according to any one of (6) to (11), the end of the waveguide element having a waveguide section and an end section in which the waveguide section end face is exposed. Photoelectric junction unit with connected parts.

  The optical waveguide wiring board assembly and the opto-electric hybrid board assembly of the present invention can easily connect a waveguide element such as an optical fiber. Further, by using an optical junction unit or a photoelectric junction unit in which a waveguide element is connected to the assembly, optical junction or photoelectric junction between different substrates can be easily performed. In addition, the assembly and unit are excellent in flatness and are compact, so that they are unlikely to become obstacles when other elements, components, and the like are arranged around.

  An optical waveguide wiring board assembly and an opto-electric hybrid board assembly (hereinafter sometimes referred to collectively as an “assembly”) according to the present invention include an optical waveguide wiring board or an opto-electric hybrid board (hereinafter referred to as “optical waveguide wiring board”) as a connecting member. Etc.)) are connected via a first connection part (or connection part), and these assemblies have waveguide parts and end parts where the waveguide part end faces are exposed. The connection member is provided with a second connection portion or a holding portion in order to connect the waveguide element having the above.

First, a mode in which the substrate end portion where the waveguide end face is exposed is connected to the connection member will be described. (In the following description, the case where light is emitted from the optical waveguide wiring board to the connection member will be described. Of course, the light direction may be reversed.)
The connecting member may or may not have the light guide portion. The connection member having the light guide portion includes a first connection portion to which the substrate end portion is connected, and the end portion of the waveguide element having the waveguide portion and the end portion in which the waveguide end surface is exposed. A second connection portion to be connected, a light guide portion is provided between the first connection portion and the second connection portion, and light is guided to the first connection portion and the second connection portion. The end surface of the part is exposed and formed.
The light guide portion pitch on the side (first connection portion) connected to the optical waveguide wiring board or the like is formed to be the same as the waveguide pitch at the substrate end portion of the optical waveguide wiring board or the like, and is provided in the first connection portion. It is preferable that the shape and size of the end face of the light guide unit to be matched with the shape and size of the end face of the waveguide. In addition, the light guide portion pitch on the side to which the waveguide element is connected (second connection portion) is formed to be the same as the waveguide portion pitch at the end portion of the waveguide element, and the light guide portion provided in the second connection portion. The shape of the end face of the optical part is preferably matched with the shape and size of the end face of the waveguide part at the end of the waveguide element.

  The connection member having no light guide portion is held by the end portion of the waveguide element having the connection portion to which the substrate end portion is connected and the end portion having the waveguide portion and the waveguide end surface exposed. It has a holding part to be done.

  The first connection part (including the connection part) and the second connection part are preferably formed as a part of the holding part for holding the end part of the optical waveguide wiring board or the like and the end part of the waveguide element. The holding part can be provided as, for example, a recess provided in the connection member. Further, it is preferable that the end portion of the optical waveguide wiring board is bonded to the connection member with an adhesive or the like after the end portion of the optical waveguide wiring board is connected to the first connection portion.

  In the assembly of the present invention, as described above, the connection member is bonded to the optical waveguide wiring board or the like in a state where the substrate end of the optical waveguide wiring board or the like is connected to the first connection part (including the connection part). For example, the optical waveguide wiring board and the connection member are bonded to each other by an adhesive or the like in the holding portion.

  In the case of an opto-electric hybrid board assembly, electrical wiring (including contacts) is provided on the connection member and connected to the electrical wiring of the electrical circuit board.

In the assembly of the present invention, the waveguide pitch and the shape / size of the waveguide end face at the end of the substrate such as an optical waveguide wiring board are the same as the waveguide pitch and the shape of the waveguide end face at the end of the waveguide element. Even when the size is different, the light guide portion of the connection member, the first connection portion and the second connection portion, the pitch and / or the shape / size of the end surface, the optical waveguide wiring board to be connected, etc. By changing correspondingly to the substrate end portion and the waveguide element end portion, the optical waveguide wiring board and the waveguide element can be easily optically joined.
Since the assembly as described above can guide the light from the optical waveguide wiring board to the waveguide element without changing the traveling direction, the flatness of the assembly is good, and other elements and components are surrounded by It is hard to become an obstacle at the time of placement.

Next, the opto-electric hybrid board assembly for connecting the optical input / output part of the opto-electric hybrid board having the optical input / output part on the surface thereof to the first connection part of the connection member will be described. The opto-electric hybrid board assembly is more optoelectric than connecting the end face of the substrate where the end face of the waveguide is exposed to the first connection portion based on the state of the electric wiring, factors such as an electric element or an optical element to be connected to the electric wiring. It may be more convenient to connect the light output part on the mixed substrate surface to the first connection part. In this case, a light output portion is provided on the surface of the opto-electric hybrid board, and a corresponding connecting member is used.
In the connection member in this aspect, the first connection portion has a light input portion at a position corresponding to the light output portion on the opto-electric hybrid board surface, and the light input portion of the first connection portion and the second connection A light guide part provided between the first light connecting part and the light input part of the first connection part and the end face of the light guide part exposed to the second connection part, and the light guide part formed on the second connection part. The light passing through the end face is parallel to the surface of the opto-electric hybrid board (including not only the case where it is completely parallel, but also the case where it has an angle that does not cause a major obstacle to disposing other elements and components). To be. In order to make the light passing through the end face of the light guide part formed in the second connection part parallel to the surface of the opto-electric hybrid board, an optical path conversion means (mirror or the like) may be appropriately provided on the connection member.

  In the present invention, the waveguide element is an optical fiber or the like.

The optical junction unit or the photoelectric junction unit of the present invention is obtained by connecting a waveguide element to the second connection portion (or holding portion) in the optical waveguide wiring board assembly or the opto-electric hybrid board assembly.
In an optical junction unit or a photoelectric junction unit provided with a light guide as a connecting member, the optical waveguide wiring board and the waveguide element are optically joined via the light guide. Further, when a connection member not provided with a light guide is used, the waveguide end face of the optical waveguide wiring board and the waveguide end face of the waveguide element are directly optically joined.

  Next, the optical waveguide wiring board assembly of the present invention will be described with reference to the drawings. FIG. 1 is a view showing an example of an optical waveguide wiring board assembly of the present invention. FIG. 1A is a perspective view of an optical waveguide wiring board 30 before assembling the assembly, and FIG. FIG. 1C is a perspective view of the optical waveguide wiring board assembly 50 in which the optical waveguide wiring board is bonded to the connection member. 1A to 1C will be described in the description of FIG.

2 shows a cross-sectional view of the optical waveguide wiring board, the connecting member, the optical waveguide wiring board assembly shown in FIG. 1, and an optical junction unit in which a waveguide element is connected to the optical waveguide wiring board assembly. In the figure, 30 is an optical waveguide wiring board, 32 is a substrate end portion where the waveguide end face 36 is exposed, 34 is a waveguide (core), 40 is a connection member, and 42 is a substrate end portion. The first connection part 44 is a second connection part to be connected to a waveguide element to be described later, 46 is a light guide part provided on the connection member, and 47 is a light guide part exposed to the first connection part. The light part end face 48 and the light guide part end face 48 exposed at the second connection part are shown. The first and second connection portions are formed as part of a recess that can hold the end portion of the optical waveguide wiring board and the end portion of the waveguide element.
2B shows an optical waveguide wiring in which the substrate end portion 32 of the optical waveguide wiring board 30 is connected to the first connecting portion 42 of the connecting member 40, and the optical waveguide wiring board 30 and the connecting member 40 are joined. A substrate assembly 50.
2C shows an optical junction unit in which a waveguide element to be connected to the optical waveguide wiring board assembly 50 is connected to the second connection portion 44 of the connection member 40. Reference numeral 92 denotes a waveguide portion, and 96 denotes an end portion of the waveguide element having the waveguide end face 94 exposed. Of course, the size and position of the recess are provided so that the end face of the light guide and the end face of the waveguide or the end of the waveguide when the end portion of the optical waveguide wiring board or waveguide element is inserted into the recess. is there.
2B and 2C, the substrate end 32 is connected to the first connection portion 42 of the connection member 40, and the waveguide end face 36 and the light guide end face 47 are directly optically bonded. Further, the end portion 96 of the waveguide element is connected to the second connection portion 44, and the waveguide portion end surface 94 and the light guide portion end surface 48 are directly optically joined.

  FIG. 3 is a cross-sectional view showing another optical waveguide wiring board assembly. In this embodiment, the connection member 43 is not provided with the light guide portion, and the connection portion 43 to which the substrate end portion is connected and the end portion of the waveguide element are shown. A holding portion 45 for holding is provided. Also in this example, a recess for inserting the end portion of the optical waveguide wiring board is provided, a part of the recess constitutes a connection part, and the optical waveguide wiring board is joined to the recess. Further, the end portion of the waveguide element is formed by inserting the optical waveguide wiring board into the connecting member as a holding portion, and the end portion of the waveguide element is inserted and held in this holding portion. The size and position of the concave portion and the holding portion are such that when the end portion of the optical waveguide wiring board or the waveguide element is inserted into the concave portion or the holding portion, the end face of the light guide portion and the end face of the waveguide or the waveguide portion end face. In this way, the waveguide and the waveguide section are directly optically joined.

  Next, an example of the opto-electric hybrid board assembly of the present invention will be described. FIG. 4 shows an example of the opto-electric hybrid board assembly, in which the end of the substrate where the end face of the waveguide is exposed is connected to the first connecting part of the connecting member, and the electric wiring of the connecting member and the electric circuit board The electrical wiring is connected. In FIG. 4, the same reference numerals as those in FIG. 2 (A) denote the same elements, and 49 denotes a contact as an electrical wiring. Reference numeral 60 denotes an electric circuit board, 62 denotes an electric wiring, 70 denotes an opto-electric hybrid board in which the optical waveguide wiring board 30 and the electric circuit board 60 are laminated, and 80 denotes an opto-electric hybrid board assembly. In this example, an electrical wiring (including a contact) is provided on the connection member, and both the opto-electric hybrid board and the optical joining and electrical joining are performed.

FIG. 5 shows an example of another opto-electric hybrid board assembly according to the present invention. Instead of directly optically joining the light guide portion end face of the connection member to the waveguide end face, it is formed on the surface of the opto-electric hybrid board. On the other hand, an optical input / output unit is provided, and an optical input unit is formed at a position corresponding to the optical output unit of the opto-electric hybrid board on the first connecting unit of the connecting member, and optical bonding is performed here.
In FIG. 5, the same reference numerals as those in FIG. 2A denote the same components, 80 is an opto-electric hybrid board assembly, 70 is an opto-electric hybrid board, 30 is an optical waveguide wiring board, and 60 is an electric circuit board. , 40 denotes a connecting member. The optical waveguide wiring board 30 is provided with optical path changing means A (10) described later. In this example, the optical path is converted by 90 ° by the optical path conversion means A (10). For example, light guided through the waveguide 34 is subjected to 90 ° optical path conversion by the optical path conversion means A (10), and an opening (which may be filled with a waveguide material) provided in the electric circuit board 60 is provided. It is introduced into the connection member 40 through the light output part 72 of the mixed substrate and the light input part 42a provided in the first connection part 42, and again in the optical path conversion at 46b (for example, 45 ° mirror surface such as the optical path conversion means A). Then, the light is emitted from the light guide part end surface 48 in the second connection part 44 through the light guide part 46. The light emitted from the light guide end face 48 is parallel to the opto-electric hybrid board. In this embodiment, the waveguide 34 is also parallel.
The contact 49 in the connecting member 40 is joined to the electric wiring 62 of the electric circuit board.

Next, the optical waveguide wiring board and the opto-electric hybrid board used in the present invention will be described.
As the optical waveguide wiring board, any substrate provided with an optical input / output unit on the substrate end or on the substrate surface is used without limitation. For example, the optical waveguide wiring, the optical input / output unit, and the optical waveguide wiring substrate plane are parallel to each other. Optical path conversion means A (hereinafter simply referred to as “optical path conversion means A”) which optically connects the optical input / output unit and the optical waveguide provided on the optical waveguide wiring board surface by converting the direction of light to a direction having an angle with respect to the surface. And / or at least one optical path conversion means B that converts the direction of light in a plane parallel to the plane of the optical waveguide wiring board (hereinafter simply referred to as “optical path conversion means B”). Is preferably used.
Such an optical waveguide wiring board can input and output light at an arbitrary position, and can be optically connected at high density, and is suitable for use as an opto-electric hybrid board. In addition, the optical waveguide wiring board is manufactured by previously forming the optical path changing means A and / or B on the base material in advance and forming the optical waveguide thereon, so that the light with a high pattern density or a complicated pattern is produced. Circuit patterns can be produced with high productivity.

  The “light input / output part” is a part for inputting / outputting light to / from the optical waveguide wiring board. For example, the core end face of the optical waveguide exposed by cutting the optical waveguide wiring board perpendicularly to the surface thereof Alternatively, it may be an end face of an optical input / output opening provided on the surface of the optical waveguide wiring board, and the opening may be filled with a waveguide material (core material).

  In the optical waveguide wiring board of the present invention, the optical waveguide has a lower cladding part, a core part, and an upper cladding part, and the core part is surrounded by the lower cladding part and the upper cladding part.

The optical path conversion means A converts the optical path of incident light in a direction having an angle with respect to a plane parallel to the plane of the optical waveguide wiring board, and preferably has a reflection surface. The light reflecting surface may be a flat surface or a curved surface such as a concave surface. FIG. 6 shows an example of the optical path changing means A. In FIG. 6, 10 indicates an optical path changing means A, and 12 indicates a waveguide core.
In the case where the optical path changing means A is provided with a light reflecting surface, the shape may be any shape as long as it has a light reflecting surface having an angle with respect to at least the substrate plane. Good. Further, the shape may be selected in consideration of the ease of the manufacturing method. Examples of the shape include a triangular cross section and a trapezoidal shape.
Further, the optical path changing means A includes one that changes (branches) in two or more directions for one incident light. In addition, the matters described in paragraphs 0019 to 0021 of Japanese Patent Application No. 2004-87918 and the items shown in FIGS. (However, in this application, it is expressed as “optical path changing means B”.)

The optical path changing means B converts the traveling direction of light into one direction or a plurality of directions in a plane parallel to the plane of the optical waveguide wiring board, and preferably has a light reflecting surface. The reflecting surface may be a flat surface or a curved surface such as a concave surface. FIG. 7 shows an example of the optical path changing means B. In FIG. 7, 20 indicates an optical path conversion means B, and 12 indicates a waveguide core.
When the light path changing means B is provided with a light reflecting surface, the shape may be any shape as long as it has a light reflecting surface perpendicular to at least the substrate plane. Further, the shape may be selected in consideration of the ease of the manufacturing method. Examples of the shape include, but are not limited to, a triangular prism, a rectangular parallelepiped, and a cube.
The optical path changing means B includes one that changes (branches) one incident light in two or more directions. In addition, the items described in paragraphs 0016 to 0018 of Japanese Patent Application No. 2004-87918 and the items shown in FIGS. (However, in this application, it is expressed as “optical path changing means A”.)

  It is preferable to form a light reflecting film on the reflecting surfaces of the optical path changing means A and B. Examples of the light reflection film include metals such as Au and Al, and films having a so-called metallic luster such as TiN.

As a material constituting the optical waveguide of the present invention, a known core material and clad material are used.
Further, when the so-called opto-electric hybrid board is manufactured by laminating the optical waveguide wiring board of the present invention on the electric circuit board, the core and the clad material can withstand the soldering temperature when the opto-electric hybrid board is manufactured. Therefore, it is preferable to use a heat resistant material. The heat resistant temperature is about 280 ° C., preferably about 300 ° C. For example, examples of the heat resistant material include polyimide, epoxy acrylic, polysilane, and the like, but are not limited thereto.

Further, as the material constituting the optical path changing means A and B, an optically excellent material having a reflection characteristic is preferable. The same applies when the reflecting surface is concave.
Furthermore, the material constituting the optical path changing means A and B needs to have the same heat resistance as the clad and the core.

[Opto-electric hybrid board]
The opto-electric hybrid board of the present invention is obtained by laminating an electric circuit board on an optical waveguide wiring board. An electric circuit board such as a printed circuit board is used as the electric circuit board. For the lamination of the optical waveguide wiring board and the electric circuit board, a so-called build-up technique in which an electric circuit board is formed on the optical waveguide board can be used in addition to a lamination method such as soldering and bonding. Further, when the electrical circuit board is laminated on the optical waveguide wiring board, an opening is formed at a position corresponding to the optical input / output part provided on the optical waveguide wiring board.
Further, the optical device or the optical device and the electric device can be further connected on the opto-electric hybrid board in which the optical waveguide wiring board and the electric circuit board are laminated. As an optical device, in addition to a single optical device such as VCSEL / LED / PD, a so-called optical multichip module (MCM) that integrates an LSI and an optical I / O device can be cited as an electrical device. These include all elements normally mounted on PWBA, from passive elements such as chip capacitors to large-scale semiconductor elements such as LSI / multichip modules.

Next, a method for manufacturing an optical waveguide wiring board will be described.
[Method of manufacturing optical waveguide wiring board]
The optical waveguide wiring board of the present invention is manufactured by the following manufacturing method, for example. The first method is to produce a mold in which at least one first pit corresponding to the optical path changing means A and / or at least one second pit corresponding to the optical path changing means B is formed on the mold substrate. Next, a resin base material in which the optical path conversion means A and / or the optical path conversion means B are manufactured is manufactured by filling the pits of the mold with a resin and transferring the shape of the pits, and then on the resin base material This is a method for producing an optical waveguide wiring.
In the second method, at least one of the optical path conversion means A and / or at least one of the optical path conversion means B is formed on the base material, and then the optical path conversion means A is formed. This is a method for producing an optical waveguide wiring on the top.

<First method>
First, the first method will be described. First, to produce a mold in which at least one first pit corresponding to the optical path changing means A and / or at least one second pit corresponding to the optical path changing means B is formed on the mold substrate, For example, an etching mask having an opening corresponding to the shape of the bottom surface of the optical path changing means A or the like (for example, a positive photoresist layer is produced by exposure and development through a photomask) is provided on the mold substrate, Next, there is a method of forming pits by etching.
In addition, machining methods such as cutting are also effective. A silicon (100) substrate is used as the mold substrate, and a normal metal plate, an Al block, or the like is used in the mechanical method.
In addition, when a silicon (100) substrate is used as the mold substrate in the above method, pits having inclined surfaces can be easily produced by performing anisotropic etching.

Next, a resin base material on which the optical path changing means A and the like are formed is produced by filling the pits of the mold produced as described above with resin and transferring the shape of the pits. As a specific manufacturing method, a curable resin is applied and cured on the pit forming surface of the mold to form a cured layer, and the cured layer and the mold are separated from each other, or the pit forming surface of the mold is heated. The shape of the pits may be transferred by pressing a softened resin base material and pressing in a softened state.
As the curable resin, a thermosetting resin, an ultraviolet curable resin, an electron beam curable resin, or the like is used. When the optical waveguide wiring board of the present invention is used for an opto-electric hybrid board (when a soldering process is required in the assembly process), it is preferable to use a curable resin having heat resistance. The heat resistant temperature is about 280 ° C. or higher, preferably 300 ° C. or higher. For example, polyimide or the like is used. Examples of the resin base material that is softened by heating include a polyimide base material having heat resistance as described above.
In addition, the mold can be reinforced by attaching another supporting substrate to the resin layer or the resin substrate as described above. You may perform hardening of resin and joining of a support base material simultaneously. As the support base material, for example, a resin substrate is used.

  Furthermore, a reflective film for improving the optical mirror characteristics can be formed on the surface of the resin base material on which the optical path changing means A and the like are produced. The reflective film is a nitride film such as gold, gold alloy, or TiN, and is formed by an ion plating method, a sputtering method, or the like. The reflection film can be omitted, for example, when the optical path conversion means A and B are made of Al or Si and the reflection characteristics at the reflection portion are good.

  Next, optical waveguide wiring is formed on the resin base material on which the optical path changing means A and the like are formed. The optical waveguide has a lower cladding, a core, and an upper cladding. The lower clad is formed by applying a liquid containing a clad material. After forming the lower cladding, the extremely thin cladding material adhering to the exposed surface of the optical path changing means A or the like may be removed by oxygen plasma or the like.

Next, a core is formed on the lower cladding. The core has a pattern corresponding to the optical circuit pattern. The core is formed by forming a core material layer on the lower clad and patterning it by a usual method to form the core. As the patterning method, for example, 1) a photo bleaching method, 2) a reactive ion etching method (RIE method), 3) a direct exposure method, or the like is used.
The photobleaching method uses an organic polysilane material (such as “Gracia” manufactured by Nippon Paint Co., Ltd.), and only the core portion is not exposed to ultraviolet rays, causing a change in refractive index between the exposed and unexposed portions (ultraviolet rays). This is a method in which the refractive index of the exposed portion is reduced), and there is no need to remove the exposed portion.
In the reactive ion etching method of 2), a photoresist (negative type) is applied on the layer of the core material, exposed and developed using a photomask, and the resist layer is left on the core portion, which is reacted. In this method, the non-core portion is removed using a reactive ion etching method, and the photoresist on the core portion is removed. In this method, when a silicon-containing resist is used as a mask material, etching can be easily performed with normal oxygen plasma.
The direct exposure method 3) is a method in which a photosensitive material is used as a core material, which is directly exposed through a photomask, and then developed and patterned.

  Among these, the photobleaching method using an organic polysilane material only needs to expose the layer made of the core material, and does not require a development or etching step, and the manufacturing process is simple. In addition, since the organic polysilane material has a heat resistance of about 300 ° C., it is particularly useful when an opto-electric hybrid board is manufactured.

Next, an upper clad is formed on the core. The formation method of the upper cladding is the same as the formation method of the lower cladding.
The surface of the upper clad may be flattened by polishing or the like. Further, flatness may be obtained by multilayer coating of the cladding layer instead of polishing.

In the following, a silicon (100) substrate (Si substrate) is used as a mold substrate, a mold in which first pits and second pits are formed by anisotropic etching is produced, and light redirecting means is used using the mold. An example of a method of producing a resin base material on which A and B are formed and then producing an optical waveguide on the resin base material will be described with reference to the drawings.
(Process for producing a mold in which first and second pits are formed)
FIG. 8 is a conceptual diagram showing a process until the first pit is formed on the mold substrate. FIG. 8A shows a Si substrate 102 provided with a protective film 104 for protecting the Si substrate from anisotropic etching, which is a subsequent process. As the protective film 104, for example, a Si ₃ N ₄ film or a SiO ₂ film can be used. In the case of using the Si ₃ N ₄ film during the process performed on the Si ₃ N ₄ film, it is preferable to laminate a polysilicon film on the membrane so as not to damage the membrane, always do not need. As a method for depositing the protective film, known methods such as a plasma CVD method and a low pressure CVD method can be used, and there is no particular limitation. The SiO ₂ film can be formed by a thermal oxidation method or a CVD method. In FIG. 8A, the protective film is depicted as being provided on one side, but it is necessary to protect the back side from the etching solution, and it is necessary to provide it on both sides.

Next, a positive photoresist is applied on the protective film, and a light transmitting portion corresponding to the bottom shape of the light direction changing means (for example, the light direction changing means A has a triangular prism shape as shown in FIG. 1A). In this case, exposure and development are performed through a photomask provided with the bottom shape of the rectangle, and the photoresist layer is removed in a shape corresponding to the bottom shape in the photoresist layer 106 to form an opening (FIG. 8B). )reference).
In addition, when the bottom shape of the light direction changing means is rectangular, it is preferable that the corners of the four corners are rounded without making the shape of the opening of the photomask an accurate rectangle. Thereby, in the process shown in FIG. 8D below, the opening shape of the protective film 104 becomes a rectangle with R at four corners, and an anisotropic etching described later (see FIG. 8F) is performed. The generation of cracks can be prevented. (If R is not applied, the protective films at the four corners remain like ridges (etched to the bottom of the ridge) during etching, and cracks may occur.)

  Thereafter, isotropic dry etching or the like is performed on the substrate in the state of FIG. 8B to remove the protective film in a shape corresponding to the opening (see FIG. 8C). Is peeled off (see FIG. 8D). Resist stripping is performed with a mixture of hot sulfuric acid and hydrogen peroxide.

Thereafter, first pits P1 (pits corresponding to the light direction changing means A) are formed by anisotropic etching (see FIG. 8E). An anisotropic etching solution is used for the anisotropic etching. The anisotropic etching solution contains alkalis such as ethylenediamine and KOH. Specifically, a mixed solution of ethylenediamine and pyrocatechol or a mixed solution of KOH and isopropyl alcohol is used, but any material capable of crystal anisotropic etching of silicon may be used.
When such anisotropic etching is performed, pits having an accurate inclination of 45 ° are formed due to crystal anisotropy.

Next, the protective film 104 is removed (see FIG. 8F). When the protective film is a Si ₃ N ₄ film, for example, hot phosphoric acid is used. When the protective film is a SiO ₂ film, a hydrofluoric acid aqueous solution is used. In this way, the first pit is formed on the Si substrate.

Next, as shown in FIG. 9A, an etching mask 114 is formed in order to produce the second pit (light direction changing means A). Etching mask may be produced by exposing the photoresist is developed to also prepare a SiO ₂ film by a film deposition method such as thermal oxidation or CVD, the SiO ₂ film by photolithography, the light direction (If the light direction conversion means shown in FIG. 3, right-angled triangle) shape of the bottom of the conversion means B may be prepared by the method of the SiO ₂ film which opens in a shape corresponding to. When the following dry etching is used, it is not necessary to provide R at the corner.
Thereafter, etching is performed using a dry etching method, for example, a reactive ion etching method (RIE method) to form the second pit P2 (see FIG. 9B). Next, the etching mask 114 is removed to obtain a mold 100 (see FIG. 9C). When the etching mask is an SiO ₂ film, an aqueous hydrofluoric acid solution is used, and when the etching film is a resist film, hot sulfuric acid and This is performed using a mixed solution of hydrogen peroxide, etc. A Si substrate (mold) on which first and second pits are formed is obtained.

  Since the depth of the first and second pits by etching corresponds to the height of the light direction changing means A and B, the depth is the thickness of the lower clad, core, and upper clad formed in a later step. And the above relationship is preferable.

(Process for producing a resin base material on which the light direction changing means A and the light direction changing means B are formed)
With reference to FIGS. 10A to 10C, a process for producing a resin base material on which the light direction changing means A and the light direction changing means B are formed will be described.
As shown in FIG. 10A, a curable resin 220a is applied to the mold manufactured as described above. In the case where the curable resin is formed to be thin, it is preferable to stack the support base material 222 as shown in FIG. 10B for reinforcement. Next, the applied curable resin is cured to form a cured layer 220. When peeled from between the cured layer 220 and the mold 100, the resin base material 200 on which the light direction changing means A indicated by reference numeral 10 and the light direction changing means B indicated by 20 are formed is obtained (see FIG. 10C). ). Although not shown, a reflective film for improving the optical mirror characteristics can be formed on the surface of the resin base material on which the light direction changing means A and B are manufactured.

(Process for producing an optical waveguide on a resin base material on which an optical direction changing means is formed)
Next, as shown in FIGS. 11A to 11C, an optical waveguide is formed on the resin base material on which the light direction changing means is formed. FIG. 11A shows a process for producing a lower clad, FIG. 11B shows a process for producing a core, and FIG. 11C shows a process for producing an upper clad. 11A, 220 is a hardened layer, 10 is a light direction changing means A, 20 is a light direction changing means B, 330 is a lower clad, and in FIG. 11B, 332 is a core. 11 (C), 334 indicates an upper cladding. Through these steps, the optical waveguide wiring board 300 of the present invention is manufactured.

  As described above, the basic portion of the optical waveguide wiring board of the present invention is manufactured. The optical waveguide wiring board manufactured in this way is further provided with an opening for optical connection. This will be described in the following description of a specific example of manufacturing an opto-electric hybrid board.

  In the first method, instead of producing a resin substrate using a mold made of a Si substrate, the mold is subjected to electroforming (for example, Ni electroforming), and then metal plating (for example, Ni plating) is performed again. A metal mold having excellent durability can also be produced.

<Second method>
Next, the second method will be described. In the second method, at least one light direction changing means A and / or light direction changing means B is prepared in advance, and this is fixed to a predetermined position on the substrate by adhesion or the like. The light direction changing means A or the light direction changing means B can be produced by precision machining. Alternatively, a silicon substrate having an inclined surface formed by anisotropic etching can be used.
Next, an optical waveguide corresponding to the optical circuit pattern is formed on the resin substrate. The method for manufacturing the optical waveguide is performed in the same manner as the first method.

A more specific manufacturing method of the optical waveguide wiring board used in the present invention and an illegal manufacturing of the opto-electric hybrid board will be described. In the following, an example in which the optical path conversion means A and B are manufactured one by one is shown. However, when a large number of optical path conversion means A and B are manufactured, the same type of optical path conversion means can be manufactured at once.
(Production Example 1)
A Si ₃ N ₄ film and a polysilicon film were deposited in this order on a Si substrate having a thickness of 650 μm using a plasma CVD method to form a protective film. A positive photoresist was applied on the protective film, exposed and developed, and the resist layer was removed into a 400 × 200 μm rectangle to form an opening. One side of the opening was perpendicular to the line connecting the first pit and the second pit formed below. Moreover, R was attached to the four corners of a rectangle. Thereafter, the protective film was removed in a shape corresponding to the opening by reactive ion etching. Next, the resist layer was removed using a mixed solution of hot sulfuric acid and hydrogen peroxide. Thereafter, the Si substrate was etched using an anisotropic etchant composed of a mixture of ethylenediamine and pyrocatechol until the pit depth reached 100 μm. A pit having a slope of about 45 ° was formed. Next, the protective film was removed using hot phosphoric acid. First pits (having the cross-sectional shape shown in FIG. 8F) corresponding to the optical path changing means A were formed.

  A positive photoresist was applied onto the Si substrate on which the first pits were formed, exposed and developed, the resist layer was removed into a 100 × 100 μm square, an opening was formed, and an etching mask was produced. . One side of the square opening was formed at an angle of 45 ° with respect to a line (light transmission direction) connecting the first pit and the second pit formed by the following etching. Reactive ion etching was performed through the etching mask, and the Si substrate was etched until the pit depth reached 100 μm. A second pit corresponding to the optical path changing means B was formed. Next, the resist layer was removed with a mixture of hot sulfuric acid and hydrogen peroxide. The obtained one was used as a mold used in the following steps.

  Using the mold as a master, a polyimide plate (Upilex manufactured by Ube Industries, Ltd.) is heated to about 280 ° C. and pressed in a softened state, and the first and second pit shapes are transferred to change the optical path. Means A and B were obtained. On top of this, Au was deposited to a thickness of 1 μm by a vacuum deposition method to obtain a reflective film. A resin base material on which the optical path changing means A and B were formed was obtained.

  On the resin base material on which the optical path changing means was formed, a clad gracia manufactured by Nippon Paint Co., Ltd. was applied to form a lower clad. Next, a core was formed on the lower cladding. The core pattern was such that the light passed between the optical path conversion means A and B, changed by 90 ° by the optical path conversion means B, and emitted from the end of the optical waveguide wiring board. The core was manufactured using Nippon Paint Co., Ltd. core gracia, which was exposed to a pattern shape (the non-exposed portion becomes the core). An upper clad was formed by applying a coating gracia made by Nippon Paint Co., Ltd. on the core. The thickness of the core was set to 50 μm so that the optical path changing means A and B appeared above the core.

An etching mask was formed by applying a positive resist on the upper clad and developing it by exposure, and etching was performed on the upper clad to form an opening (optical connection port). The position of the opening was such that incident light from the opening was reflected by the reflecting surface of the optical path changing means A and transmitted through the core (see FIG. 12A).
A printed circuit board (having an opening at the same position) is laminated on the optical waveguide wiring board provided with the opening (see FIG. 12B), and the opening is filled with the organic polysilane material used for the core ( (See FIG. 12C).
Solder was printed on the printed circuit board in advance, and then optical MCM was mounted with a high-precision mounter and connected through a solder reflow process (see FIG. 12D). An opto-electric hybrid board was obtained by the above process.
The light input to the optical waveguide wiring board from the optical output port of the optical MCM is optical path converted by the optical path changing means A and transmitted through the core, and the direction is changed by 90 ° by the optical direction changing means B. Output from the edge.

FIG. 1A is a perspective view of an optical waveguide wiring board, FIG. 1B is a perspective view of a connecting member of a connecting member, and FIG. ) Shows a perspective view of the optical waveguide wiring board assembly. 2A is a cross-sectional view of the optical waveguide wiring board assembly shown in FIG. 1, FIG. 2A is a cross-sectional view of the optical waveguide wiring board and the connecting member before connection, and FIG. 2B is a cross-sectional view of the optical waveguide wiring board assembly. FIG. 2C is a diagram showing a cross section of an optical junction unit in which a waveguide element is connected to an optical waveguide wiring board assembly. It is sectional drawing which shows the other optical waveguide wiring board assembly of this invention. It is sectional drawing which shows an example of the opto-electric hybrid board assembly of the present invention. It is sectional drawing which shows another example of the opto-electric hybrid board assembly of the present invention. It is a figure which shows an example of the optical path conversion means A in this invention. It is a figure which shows an example of the optical path changing means B in this invention. It is a figure which shows the process until it forms the 1st pit corresponding to the light direction conversion means A using anisotropic etching in Si substrate. It is a figure which shows the process until it forms the 2nd pit corresponding to the light direction conversion means B in the Si substrate in which the 1st pit was formed, and produces a type | mold. It is a figure which shows the process until producing the resin base material in which the light direction conversion means A and B were formed using the type | mold. It is a figure which shows the process of forming a lower clad, a core, and an upper clad on a resin base material. It is a figure which shows the process until producing an opto-electric hybrid board using an optical waveguide wiring board.

Explanation of symbols

10 Optical path conversion means A
20 Optical path changing means B
30 Optical waveguide wiring substrate 32 Substrate edge 34 Waveguide (core)
36 Waveguide end face 40 Connection member 42 First connection part 44 Second connection part 46 Light guide part 47 Light guide part end face 48 in the first connection part Light guide part end face 49 in the second connection part Contact 50 Optical waveguide Wiring board assembly 60 Electric circuit board 62 Electric wiring 70 Opto-electric hybrid board 80 Opto-electric hybrid board assembly 90 Waveguide element

Claims (13)

  An optical waveguide wiring board assembly in which an optical waveguide wiring board and a connection member are joined, wherein the optical waveguide wiring board has a substrate end portion in which a waveguide end face is exposed, and the connection member includes a substrate end portion. And a second connection portion to which the end portion of the waveguide element having the waveguide portion and the end portion where the end surface of the waveguide portion is exposed is connected. The light guide is provided between the first connection and the second connection, and the end face of the light guide is exposed at the first connection and the second connection. An optical waveguide wiring board assembly characterized in that a substrate end is connected to a portion and a waveguide end face and a light guide end face are optically bonded.   2. The optical waveguide according to claim 1, wherein a size and / or shape of a light guide end face in the first connection portion is different from a size and / or shape of a light guide end face in the second connection portion. Wiring board assembly.   2. The optical waveguide wiring board assembly according to claim 1, wherein a light guide portion end surface pitch in the first connection portion is different from a light guide portion end surface pitch in the second connection portion.   An optical waveguide wiring board assembly in which an optical waveguide wiring board and a connection member are joined, wherein the optical waveguide wiring board has a substrate end portion in which a waveguide end face is exposed, and the connection member has a substrate end portion. A connecting portion to be connected; and a holding portion to hold the end portion of the waveguide element having a waveguide portion and an end portion in which the end face of the waveguide portion is exposed, and the substrate end portion is connected An optical waveguide wiring board assembly connected to a connecting portion of members.   The optical waveguide wiring board is provided on the surface of the optical waveguide wiring board by converting the direction of light into a direction having an angle with respect to a plane parallel to the plane of the optical waveguide wiring, the optical input / output unit, and the optical waveguide wiring board. And at least one optical path conversion means A for optically connecting the optical input / output unit and the optical waveguide and / or at least one optical path conversion means B for converting the direction of light in a plane parallel to the plane of the optical waveguide wiring board. The optical waveguide wiring board assembly according to any one of claims 1 to 4, wherein the optical waveguide wiring board assembly is provided. An opto-electric hybrid board assembly in which an opto-electric hybrid board in which an electric circuit board is laminated on an optical waveguide wiring board and a connecting member are joined,
The opto-electric hybrid board has a substrate end portion in which a waveguide end face is exposed,
The connection member includes an electrical wiring, a first connection portion to which the substrate end is connected, and an end portion of the waveguide element having a waveguide portion and an end portion in which the end surface of the waveguide portion is exposed. A second connection portion to be connected, a light guide portion is provided between the first connection portion and the second connection portion, and light is guided to the first connection portion and the second connection portion. The end face of the part is exposed and formed,
A substrate end is connected to the first connection portion, a waveguide end surface and a light guide portion end surface are optically bonded, and an electrical wiring of a connection member and an electrical wiring on an electrical circuit board are connected. An opto-electric hybrid board assembly.   The size and / or shape of the light guide part end surface in the said 1st connection part differs from the size and / or shape of the light guide part end surface in a 2nd connection part, The photoelectricity of Claim 6 characterized by the above-mentioned. Mixed board assembly.   7. The opto-electric hybrid board assembly according to claim 6, wherein a light guide part end face pitch in the first connection part is different from a light guide part end face pitch in the second connection part.   An opto-electric hybrid board assembly in which an opto-electric hybrid board in which an electric circuit board is laminated on an optical waveguide wiring board and a connecting member are joined, wherein the optical waveguide wiring board has an end portion on which a waveguide end face is exposed. And the connecting member has an end portion of the waveguide element having an electrical wiring, a connecting portion to which the end portion of the substrate is connected, and an end portion in which the end face of the waveguide portion is exposed. A holding portion to be held, the substrate end is connected to the connecting portion of the connecting member, and the electric wiring of the connecting member is connected to the electric wiring of the electric circuit board Electric hybrid board assembly. An opto-electric hybrid board assembly in which an opto-electric hybrid board in which an electric circuit board is laminated on an optical waveguide wiring board and a connecting member are joined,
The opto-electric hybrid board has a light input / output unit on its surface,
The connecting member includes an electrical wiring, a first connecting portion to which an opto-electric hybrid board surface is connected, and the end of the waveguide element having a waveguide portion and an end portion where the waveguide end surface is exposed. The first connection part has a light input / output part at a position corresponding to the light input / output part on the surface of the opto-electric hybrid board, and the first connection part A light guide unit is provided between the light input / output unit and the second connection unit, and an end surface of the light guide unit is exposed and formed at the second connection unit. The light passing through the end face is parallel to the surface of the opto-electric hybrid board,
The optical input / output unit on the opto-electric hybrid board surface is connected to the optical input / output unit in the first connection unit, and the electrical wiring of the connection member and the electrical wiring on the electrical circuit board are connected. An opto-electric hybrid board assembly.   The optical waveguide wiring board is provided on the surface of the optical waveguide wiring board by converting the direction of light into a direction having an angle with respect to a plane parallel to the plane of the optical waveguide wiring, the optical input / output unit, and the optical waveguide wiring board. And at least one optical path conversion means A for optically connecting the optical input / output unit and the optical waveguide and / or at least one optical path conversion means B for converting the direction of light in a plane parallel to the plane of the optical waveguide wiring board. The opto-electric hybrid board assembly according to any one of claims 6 to 10, wherein the opto-electric hybrid board assembly is provided.   The optical waveguide wiring board assembly according to any one of claims 1 to 5, wherein the end portion of the waveguide element having the waveguide portion and the end portion where the end surface of the waveguide portion is exposed is connected to the optical waveguide wiring board assembly. Optical junction unit.   12. The optical-electrical hybrid substrate assembly according to claim 6, wherein the end portion of the waveguide element having the waveguide portion and the end portion where the end surface of the waveguide portion is exposed is connected to the opto-electric hybrid board assembly. Photoelectric junction unit.

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