JP2005070141A - Optical waveguide structure with optical path conversion component and manufacturing method therefor and optical path conversion component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical waveguide structure with an optical path conversion component which can realize efficient transmission of an optical signal and is also of low costs. <P>SOLUTION: The optical waveguide structure 40 with an optical path conversion component includes a main surface 45, a core 43, clads 42, 44, and a hole part 46. The core 43 as an optical path in which the optical signal propagates is extended along the main surface 45. The clads 42, 44 surround the core 43. The hole part 46 is positioned on the way or at the end part of the core 43, and is open on the main surface 45. This optical waveguide structure 40 is provided with the optical path conversion component 51 having an optical path conversion component main body 52, and the optical path conversion component main body 52 is made of a light transmissive material and is inserted into the hole part 46 to form a part of the optical path, and also the optical path conversion component main body 52 is formed with a light reflecting body 55. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical waveguide structure with an optical path conversion component, a manufacturing method thereof, and an optical path conversion component.
[0002]
[Prior art]
In recent years, with the development of information communication technology represented by the Internet and the dramatic improvement in the processing speed of information processing apparatuses, there is an increasing need for transmitting and receiving large-capacity data such as images. An information transmission speed of 10 Gbps or higher is desirable to exchange such a large amount of data freely through an information communication facility, and great expectations are placed on optical communication technology as a technology that can realize such a high-speed communication environment. On the other hand, signals can be transmitted at high speeds even on signal transmission paths at relatively short distances, such as connections between wiring boards in equipment, connections between semiconductor chips in wiring boards, connections within semiconductor chips, etc. It has been desired in recent years. For this reason, it is considered that it is ideal to shift from a conventional metal cable or metal wiring to optical transmission using optical transmission means such as an optical fiber or an optical waveguide.
[0003]
In particular, optical waveguides have attracted attention in recent years because they have advantages such as a high degree of freedom in wiring compared to optical fibers. Therefore, recently, various optical waveguide structures having a structure in which the optical waveguide is arranged substantially parallel to the surface of the substrate have been proposed. In this type of optical waveguide structure, an optical element (light emitting element or light receiving element) is usually mounted in a state where a light receiving / emitting portion is disposed above the optical waveguide. In such an optical waveguide structure, an optical path changing unit that changes the direction of the light propagating through the core of the optical waveguide in a direction perpendicular to the substrate so that the light can be efficiently transmitted between the optical element and the optical element. Arranged on a waveguide or substrate.
[0004]
16 and 17 show an example of a conventional optical waveguide structure and its manufacturing method. In manufacturing the optical waveguide structure, first, the optical waveguide 101 having the core 102 and the clad 103 is prepared separately from the base material 106. Next, a V-shaped groove 104 is formed on one side surface of the optical waveguide 101 supported on the support plate 109 by dicing using a dicing blade. Thereafter, a metal film 105 is provided on the inner wall surface of the V-shaped groove 104 to form a concave optical path changing portion (see FIG. 16). Next, after such an optical waveguide 101 is transferred onto the main surface 107 of the substrate 106, an optical element 108 is mounted on the main surface 107, whereby an optical waveguide structure is completed. (See FIG. 17). A similar technique is also disclosed in the following patent document (see, for example, Patent Document 1).
[0005]
18, 19 and 20 show another example of a conventional optical waveguide structure and its manufacturing method. When manufacturing this optical waveguide structure, first, a convex optical path conversion component 112 is pasted on the main surface 107 of the prepared base 106 (see FIG. 18). Next, the optical waveguide 101 is formed so as to cover the convex optical path conversion component 112 by sequentially laminating the lower clad 103, the core 102, and the upper clad 103 on the main surface 107 of the substrate 106. (See FIG. 19). Then, by mounting the optical element 108 on the main surface 107, the optical waveguide structure is completed (see FIG. 20).
[0006]
FIGS. 21 to 24 show still another example of a conventional optical waveguide structure and its manufacturing method. In manufacturing the optical waveguide structure, first, the optical waveguide 101 is formed on the main surface 107 of the prepared base material 106 (see FIG. 21). In this case, a build-up method in which the lower clad 103, the core 102, and the upper clad 103 are sequentially stacked may be employed, or a method of pasting the optical waveguide 101 formed in advance in a layer shape may be employed. Also good. Next, a through hole 113 is formed at a predetermined location in the optical waveguide 101 by a technique such as etching. Then, the convex optical path conversion component 112 is attached to the surface of the portion exposed by the formation of the through hole 113 using the jig 114 (see FIG. 22). At that time, it is necessary to perform an alignment operation (alignment operation) between the optical path conversion component 112 and the optical waveguide 101 (particularly, the core 102) to align the optical axes of the two. Then, by joining the optical element 108 on the optical waveguide 101, the optical waveguide structure is completed (see FIGS. 23 and 24). A similar technique is also disclosed in the following patent document (see, for example, Patent Document 2).
[0007]
[Patent Document 1]
Japanese Patent Laid-Open No. 10-166167
[Patent Document 2]
JP-A-2002-82244 [0009]
[Problems to be solved by the invention]
However, in the case of the prior art shown in FIGS. 16 and 17, in addition to the need to form the V-shaped groove 104, the optical waveguide 101 on which the optical path changing portion is formed needs to be transferred onto the substrate 106. . Therefore, there is a drawback that the number of man-hours is large and complicated, and it is not suitable for improvement in productivity and cost reduction.
[0010]
In the case of the prior art shown in FIGS. 18 to 20, since the optical waveguide 101 is already formed with the convex optical path conversion component 112, the optical waveguide 101 is formed at the location where the optical path conversion component 112 is formed. When pushed up, the core 102 and the like are deformed so as to wave up and down. As a result, light easily leaks from the core 102 to the upper clad 103, and the light propagating through the core 102 has a drawback that it is difficult to reach the reflecting surface 115 of the optical path conversion component 112. In this case, since the optical transmission loss increases, it is impossible to realize efficient optical signal transmission.
[0011]
Further, in the case of the prior art shown in FIGS. 21 to 24, in order to attach the convex optical path conversion component 112, it is necessary to make the through hole 113 larger than the jig 114 by the thickness. is there. Therefore, as shown in FIG. 24, the distance between the cut end 116 of the core 102 (that is, the inner peripheral surface of the through hole 113) and the reflecting surface 115 of the convex optical path conversion component 112 is inevitably large ( (Several hundred μm or more). Therefore, as a result of an increase in the length of light passing through the gap 117 (air layer) without the core 102, the light spreads when passing through the gap 117, making it difficult for the light to reach the reflecting surface 115 of the optical path conversion component 112. There was a drawback. Therefore, there is a problem that light leakage occurs and light transmission loss increases. Therefore, efficient optical signal transmission could not be realized.
[0012]
Furthermore, in the case of the prior art shown in FIGS. 21 to 24, the alignment work for attaching the convex optical path conversion component 112 to the correct position is very complicated, which is one cause of the high cost. It was.
[0013]
The present invention has been made in view of the above problems, and an object of the present invention is to realize an efficient transmission of an optical signal and to provide a low-cost optical waveguide structure with an optical path conversion component and a method for manufacturing the same. It is to provide an optical path conversion component.
[0014]
Another object of the present invention is to provide a low-cost optical waveguide structure with an optical path conversion component because the alignment operation between the core and the optical path conversion component can be omitted.
[0015]
[Means, actions and effects for solving the problems]
As a means for solving the above-mentioned problems, an optical path conversion component configured separately from the optical waveguide structure is made of a light-transmitting material and inserted into a hole provided in the optical waveguide structure. There is an optical path conversion component characterized in that it has an optical path conversion component main body that can form part of the optical path.
[0016]
Further, as another means for solving the above problems, a main surface, a core that extends along the main surface and serves as an optical path through which an optical signal propagates, a cladding that surrounds the core, and a midway or an end of the core An optical waveguide structure having a hole portion which is located and opened at the main surface, and an optical path conversion component having an optical path conversion component body which is made of a light transmitting material and which is inserted into the hole portion and constitutes a part of the optical path And an optical waveguide structure with an optical path conversion component.
[0017]
Therefore, according to the above invention, since the optical path conversion component main body can constitute a part of the optical path, the length of the light passing through the optical path conversion component main body is increased while the light does not have a core. The length passing through is reduced. Therefore, it becomes easy for light to reach the light reflection part of the optical path conversion component main body, and light leakage is prevented. In addition, since the optical path conversion component main body of the optical path conversion component is inserted into the hole provided in the optical waveguide structure, there is no inconvenience such as deformation of the core or the like due to pushing up of the optical path conversion component. Therefore, for example, light leakage from the core to the upper cladding is also prevented. From the above, as a result of being able to reflect light with high efficiency at the light reflection portion of the optical path conversion component body, light transmission loss is reduced, and efficient transmission of optical signals can be realized.
[0018]
In addition, unlike the case where a concave optical path changing part is processed and formed in a part of the optical waveguide structure itself, man-hours can be reduced in the manufacture of the optical waveguide structure with the optical path changing component, so that the productivity can be improved and reduced. Cost can be reduced. In addition, since the optical path conversion unit can be handled as a separate component from the optical waveguide structure, for example, when the optical path conversion component is defective, only the optical path conversion component can be replaced. That is, there is no need to replace the entire optical waveguide structure, which contributes to cost reduction.
[0019]
The optical waveguide structure has at least one main surface, and is specifically a plate-like or film-like member. Such an optical waveguide structure has a core that extends along the main surface and serves as an optical path through which an optical signal propagates, and a cladding that surrounds the core. The optical waveguide structure may be an inorganic optical waveguide structure configured using an inorganic material, or may be an organic optical waveguide structure configured using an organic material. Further, such an optical waveguide structure may exist alone without a support such as a substrate, or may exist in a state of being supported on a support such as a substrate. Good. An example of the inorganic optical waveguide structure is an optical waveguide structure made of quartz or the like. Examples of the organic optical waveguide structure include an optical waveguide structure made of a polymer material such as a photosensitive resin, a thermosetting resin, and a thermoplastic resin. Specific examples of the polymer material include polyimide resin such as fluorinated polyimide, epoxy resin, UV curable epoxy resin, PMMA (polymethyl methacrylate), deuterated PMMA, acrylic resin such as deuterated fluorinated PMMA, polyolefin-based Examples thereof include resins. Both the material forming the core and the material forming the clad preferably have translucency. The polymer material that forms the core is set to have a refractive index that is several percent higher than the polymer material that forms the cladding. The thickness of the core and the clad is preferably set to about several μm to several tens of μm. The organic optical waveguide structure as described above can be formed by a known method (selective mixing method, RIE method, direct exposure method, injection molding method, photobleaching method, etc.).
[0020]
The optical waveguide structure has a hole located in the middle or end of the core and opening in the main surface. The optical path conversion component main body of the optical path conversion component can be inserted into the hole. In this case, the hole may be a non-through hole that opens only on the main surface, or may be a through hole that opens on the main surface and the opposite side surface. The size, shape, and the like of the hole are not particularly limited, but are set to a size and shape that allow at least the optical path conversion component body of the optical path conversion component to be inserted without difficulty. In addition, the hole may be located in the middle or end of one core, or may be located in the middle or end of the plurality of cores so as to cross (straddle) the plurality of cores. Moreover, it is preferable that the shape of the hole when viewed from the direction orthogonal to the main surface is similar to the shape of the optical path conversion component main body when viewed from the direction orthogonal to the main surface. That is, compared to the case where the two have completely different shapes, it is easier to insert the optical path conversion component main body into the hole and the gap is less likely to occur between the two when the shapes are similar to each other. That is, when the shape of the hole when viewed from the direction orthogonal to the main surface is rectangular, the shape of the optical path conversion component main body when viewed from the direction orthogonal to the main surface is preferably rectangular. Alternatively, when the shape of the hole when viewed from the direction orthogonal to the main surface is circular, the shape of the optical path conversion component main body when viewed from the direction orthogonal to the main surface is preferably circular.
[0021]
The optical path conversion component has an optical path conversion component main body.
[0022]
The optical path conversion component body is made of a light transmissive material, specifically, a light transmissive inorganic material such as glass, a polyimide resin such as fluorinated polyimide, an epoxy resin, a UV curable epoxy resin, PMMA (polymethyl methacrylate), It consists of light-transmitting organic materials such as acrylic resins such as deuterated PMMA and deuterated fluorinated PMMA, and polyolefin resins. From the viewpoint of easy handling as a component, it is preferable to select a light-transmitting organic material.
[0023]
The optical path conversion component main body has a size and a shape that can be inserted into a hole provided in the optical waveguide structure. As a preferred example thereof, an optical path conversion component main body having an inclined surface and a substantially right-angled cross section can be cited. The inclined surface is located on the longest side in a substantially right triangle. In this case, the inclined surface substantially becomes a light reflecting portion of the optical path conversion component main body.
[0024]
Preferably, the height of the optical path conversion component main body is set to be substantially equal to the depth of the hole, and the width of the optical path conversion component main body is set to be approximately equal to the width of the hole. With such a configuration, the core and the optical path conversion component main body are simultaneously aligned by inserting the optical path conversion component main body into the hole. Therefore, complicated alignment work can be omitted, and further cost reduction can be achieved.
[0025]
Even if the optical path conversion component includes only the optical path conversion component main body, it is possible to reflect the light and convert the optical path, but it is more preferable to form a light reflector on the optical path conversion component main body. According to this configuration, light can be efficiently reflected. The light reflector may be formed inside or on the surface of the optical path conversion component main body. Note that a structure in which a light reflector is formed on the surface of the optical path conversion component main body is easier to manufacture, which is advantageous for cost reduction. Specifically, the optical path conversion component main body has an inclined surface having a positional relationship inclined with respect to the extending direction of the core, and a metal film as the light reflector is formed on the surface of the inclined surface. It is preferable that Examples of the metal material used for forming the metal film include a glossy metal such as gold, silver, copper, nickel, and rhodium. This is because a glossy metal can reflect light efficiently and is suitable for use as an optical path conversion component. The metal film preferably reflects 90% or more of light, and particularly preferably totally reflects light. The metal film is formed on a part or all of the inclined surface. In that case, the formation area of the metal film is preferably set to be larger than at least the cross-sectional area of the core. The thickness of the metal film is appropriately set in view of the type of metal material to be used, the thin film formation method, and the like.
[0026]
The inclined surface may be flat or curved. If it is a flat inclined surface, it becomes easy to process and form the optical path conversion component main body. On the other hand, if the inclined surface is convexly curved, the light reflecting surface of the metal film is concave, so that a light condensing effect can be obtained. As a result, optical transmission loss is further reduced.
[0027]
It is preferable that the optical path conversion component further includes a support locking portion that supports the optical path conversion component main body and locks to the opening edge of the hole. According to this configuration, since the support locking portion serves as a stopper, the insertion depth of the optical path conversion component main body can be easily determined, and displacement in the depth direction can be prevented in advance. Further, if the support locking portion is provided, the optical path conversion component can be handled without touching the optical path conversion component main body or the light reflector by gripping the support locking portion. Therefore, the handleability as a part is also improved.
[0028]
Here, the shape and size of the support locking portion are not particularly limited, but for example, a flat plate shape larger than the base end surface of the optical path conversion component main body is preferable. The lower surface of the support locking portion (that is, the surface that supports the base end surface of the optical path conversion component main body) is preferably flat. Moreover, it is preferable that a part or all of the upper surface of the support locking portion (that is, the side surface opposite to the surface supporting the base end surface of the optical path conversion component main body) is flat. If there is a flat part on the upper surface, it will be easier to vacuum-suck, and the handling of the parts will improve.
[0029]
It is preferable that a stepped portion is provided at the opening edge of the hole portion, and the support locking portion is locked to the opening edge while being fitted into the stepped portion. According to this configuration, the protrusion amount of the optical path conversion component from the optical waveguide is reduced. Therefore, the optical element can be disposed close to the main surface of the optical waveguide structure. Therefore, as a result of the distance between the light receiving part or light emitting part of the optical element and the light reflector being reduced, the spread of light can be suppressed, and the transmission loss of light can be reliably reduced. It also contributes to overall thinning.
[0030]
It is preferable that the stepped portion is formed, for example, to a depth of the upper clad or slightly less than that. In a state where the support locking portion is fitted into the stepped portion, the upper surface of the support locking portion is preferably substantially flush with the main surface of the optical waveguide structure. In other words, in the above state, it is preferable that the protrusion amount of the upper surface of the support locking portion from the main surface of the optical waveguide structure is substantially zero.
[0031]
It is preferable that the optical path conversion component main body and the support locking portion are integrally formed using a common light transmissive material. For example, if the optical path conversion component main body is joined to the support locking portion, refraction or light leakage may occur at the joint interface between the two, leading to an increase in light transmission loss. However, when the optical path conversion component main body and the support locking portion are integrally formed using a common light-transmitting material, refraction and light leakage do not occur, and light transmission loss can be reliably reduced. .
[0032]
The gap between the inner wall surface of the hole and the optical path conversion component main body is preferably filled with an adhesive made of a light transmissive material. According to this configuration, the transmission loss of light can be reliably reduced by eliminating the gap. Suitable examples of the adhesive made of a light transmissive material include an epoxy resin adhesive and an acrylic resin adhesive.
[0033]
It is preferable that the refractive index of the adhesive is set to be a substantially intermediate value between the refractive index of the core and the refractive index of the optical path conversion component main body. Since the light leakage can be prevented by setting the refractive index of the adhesive to such a value, the transmission loss of light can be surely reduced.
[0034]
The optical path conversion component preferably further includes a microlens. For example, when a microlens is provided separately from the optical path conversion component, not only the number of components increases, but the distance between the optical waveguide structure and the optical element increases by the thickness of the microlens. In that respect, according to the above configuration, it is possible to avoid an increase in the number of components and an increase in the distance between the optical waveguide structure and the optical element. Further, since the light is condensed when passing through the microlens, it is possible to further reduce the light transmission loss. The microlens preferably has a diameter of 100 μm or less, and one or more microlenses are formed inside or on the upper surface of the support locking portion. Such a microlens is preferably integrally formed using a light-transmitting material common to the optical path conversion component main body and the support locking portion.
[0035]
Still another means for solving the above-described problems includes a main surface, a core that extends along the main surface and serves as an optical path through which an optical signal propagates, a clad that surrounds the core, and a midway or end portion of the core And an optical waveguide structure having a hole opening in the main surface, and an optical path conversion component having an optical path conversion component body made of a light transmissive material and constituting a part of the optical path. In the method of manufacturing an optical waveguide structure with an optical path conversion component, the optical waveguide structure having the hole is prepared in advance (optical waveguide structure manufacturing step), A step of preparing the optical path conversion component having the optical path conversion component main body in advance (optical path conversion component manufacturing step), and the optical path conversion component main body of the optical path conversion component are connected to the hole of the optical waveguide structure. Manufacturing method of the optical path conversion component with the optical waveguide structure which comprises a step of inserting (parts insertion step), there is.
[0036]
Therefore, according to said invention, the manufacturing method of the optical waveguide structure with an optical path conversion component can be manufactured comparatively simply and at low cost.
[0037]
In the optical waveguide structure manufacturing process, the hole is formed after the optical waveguide structure is manufactured by a known method (selective mixing method, RIE method, direct exposure method, injection molding method, photo bleaching method, etc.). . A well-known technique can be adopted as a method for forming the hole, and specific examples include drilling, punching, etching, and laser processing. Among these, it is particularly preferable to select etching processing or laser processing using photolithography. The reason is that according to these processing methods, even a fine hole can be formed relatively easily and with high accuracy.
[0038]
In the optical waveguide structure manufacturing process, a step portion is also formed as necessary. Such a stepped portion may be formed before the hole portion is formed, may be formed after the hole portion is formed, or may be formed simultaneously with the hole portion.
[0039]
In the optical path conversion component manufacturing step, first, an optical path conversion component main body is formed. Then, if necessary, a light reflector may be formed at a predetermined location in the optical path conversion component main body. The optical path conversion component main body can be formed by a mold forming method using a light transmissive material, or can be performed by machining the light transmissive material. In this case, cost reduction can be achieved by using a transparent resin material. On the other hand, the light reflector can be formed by a technique such as thin film formation by applying a metal paste, thin film formation by metal sputtering, vapor deposition, CVD, or the like, or thin film formation by metal plating. Instead of such a thin film forming method, a method of attaching a minute metal plate may be employed. However, the thin film forming method is more advantageous for cost reduction than the metal plate attaching method. Among thin film formation methods, a technique using a metal paste that does not require a large-scale apparatus is advantageous for cost reduction.
[0040]
Accordingly, it is preferable to first form an optical path conversion component body using a transparent resin material, and then apply a metal paste on the surface of the inclined surface of the optical path conversion component body to form a light reflector made of a metal film. It is.
[0041]
In the optical path conversion component manufacturing process, a support locking portion and a microlens are formed as necessary. As a technique for forming the microlens, a conventionally known technique can be employed, and specifically, a dispensing method and a mold forming method can be exemplified. In this case, it is preferable to integrally form the optical path conversion component main body, the support locking portion, and the microlens using a common light transmissive material. More specifically, it is preferable to integrally form the optical path conversion component main body, the support locking portion, and the microlens by a mold forming method using a common transparent resin material. According to this method, an optical path conversion component having a microlens having a desired shape can be formed with high accuracy.
[0042]
The component insertion process is performed after the optical waveguide structure manufacturing process and the optical path conversion component manufacturing process. In this step, the optical path conversion component main body is inserted into the hole from the main surface side of the optical waveguide structure. In that case, a predetermined jig for supporting the optical path conversion component may or may not be used. Even if a jig is used, according to the method of the present invention, it is not necessary to insert a jig into the hole, so that it is not necessary to form a hole having a larger opening for the thickness of the jig. . Therefore, the distance between the end portion of the core and the light reflecting portion of the optical path conversion component can be reduced.
[0043]
In the method of the present invention, since the component insertion process is performed after the optical waveguide structure fabrication process and the optical path conversion component fabrication process, problems such as deformation of the core due to the push-up of the optical path conversion component are eliminated. be able to. Further, according to the method of the present invention, it is possible to omit the process of forming a concave optical path changing portion in a part of the optical waveguide structure itself and the process of transferring the optical waveguide structure. Therefore, since the man-hours can be reduced in manufacturing the optical waveguide structure with the optical path conversion component, it is possible to improve productivity and reduce costs.
[0044]
DETAILED DESCRIPTION OF THE INVENTION
[First Embodiment]
[0045]
Hereinafter, an optoelectric composite mounting wiring board 10 according to an embodiment embodying the optical waveguide structure 40 with an optical path conversion component of the present invention will be described in detail with reference to FIGS.
[0046]
FIG. 1 shows an optoelectric composite mounting wiring board 10 of the present embodiment. The ceramic substrate 11 constituting the opto-electric composite mounting wiring substrate 10 is a substantially rectangular plate member having an upper surface 12 and a lower surface 13. The ceramic substrate 11 is a so-called multilayer wiring board, and includes a conductor circuit 16 formed of a metal wiring layer on an upper surface 12 and an inner layer. The ceramic substrate 11 also includes a via-hole conductor (not shown), and the conductor circuits 16 having different layers are connected to each other via the via-hole conductor.
[0047]
Various electronic components are surface-mounted on the upper surface 12 of the ceramic substrate 11. More specifically, a surface emitting laser (Vertical Cavity Surface Emitting Laser, hereinafter referred to as “VCSEL21”), which is a kind of light emitting element (optical element), a driver IC 15, and a photodiode which is a kind of light receiving element (optical element). 31 and a receiver IC 17 are mounted on the surface. Note that the VCSEL 21, the driver IC 15, the photodiode 31, and the receiver IC 17 have solder bumps 23 on the lower surface side. These solder bumps 23 are bonded to a plurality of pads 14 provided on the upper surface 12 of the ceramic substrate 11. Other electronic components (not shown) are also bonded to the pad 14.
[0048]
The VCSEL 21 is mounted with the light emitting surface facing downward, and has a plurality of (here, two) light emitting units 22 arranged in a line in the light emitting surface. Accordingly, these light emitting portions 22 emit laser light having a predetermined wavelength in a direction orthogonal to the upper surface 12 of the ceramic substrate 11 (that is, the downward direction in FIGS. 1 and 2). The photodiode 31 is mounted with the light receiving surface facing downward, and has a plurality (two in this case) of light receiving portions 32 arranged in a line in the light receiving surface. Therefore, these light receiving parts 32 are configured to easily receive laser light from the lower side to the upper side in FIG.
[0049]
As shown in FIGS. 1 and 2, an optical waveguide structure 40 with an optical path conversion component is disposed on the upper surface 12 of the ceramic substrate 11. The optical waveguide structure 40 is a film-like organic optical waveguide structure, and includes a lower clad 42, a core 43, and an upper clad 44. The core 43 is a portion that substantially becomes an optical path through which an optical signal propagates, and is surrounded by a lower clad 42 and an upper clad 44. In the case of the present embodiment, the clads 42 and 44 and the core 43 are formed of transparent polymer materials having different refractive indexes, specifically, PMMA (polymethyl methacrylate) having different refractive indexes. Such PMMA has thermosetting properties. As shown in FIG. 3, in the case of the present embodiment, there are two cores 43 serving as an optical path, and they are formed so as to extend linearly and in parallel. The number of cores 43 may be one or may be three or more. The material forming the core 43 is set so that the refractive index is higher by several percent than the material forming the clads 42 and 44. The thickness of each of the clads 42 and 44 and the core 43 is set to about several tens of μm, and as a result, the thickness of the optical waveguide structure 40 is about 150 μm to 200 μm.
[0050]
As shown in FIGS. 1 to 3, in the middle of the core 43, an upper surface 45 (main surface) of the optical waveguide structure 40 and a hole 46 that opens at the lower surface are formed so as to penetrate therethrough. The hole 46 of the present embodiment is formed so as to cross (straddle) the two cores 43 (see FIG. 3). One hole 46 is located immediately below the light emitting part 22 of the VCSEL 21, and the other hole 46 is located immediately below the light receiving part 32 of the photodiode 31. The shape of the hole 46 when viewed from the direction orthogonal to the upper surface 45 of the optical waveguide structure 40 is a substantially rectangular shape, and the dimension of one side thereof is set to about 150 μm. Moreover, the depth of the hole 46 is set to about 150 μm to 200 μm.
[0051]
1 to 3 show an optical path conversion component 51 used in the present embodiment. The optical path conversion component 51 includes an optical path conversion component main body 52, a support locking portion 53, and a light reflector 54.
[0052]
The optical path conversion component main body 52 inserted into the hole 46 is a member having a substantially right-angled cross section, and in other words, a member having one shape when a rectangular parallelepiped is divided into two along the diagonal direction. It is. The shape of the optical path conversion component main body 52 when viewed from a direction orthogonal to the upper surface 45 of the optical waveguide structure 40 is substantially rectangular, and is equal to the shape of the hole 46 when viewed from the same direction. . The optical path conversion component main body 52 has an inclined surface 54 having an angle of 45 ° with respect to the extending direction of the core 43. The inclined surface 54 is flat and is located on the longest side in a substantially right triangle shape. The metal film 55 that is a light reflector is provided on the entire surface of the inclined surface 54. In this embodiment, the metal film 55 having a thickness of about 0.1 μm to 10 μm is formed using glossy rhodium. The metal film 55 can totally reflect light. The height of the optical path conversion component main body 52 is set to about 150 μm to 200 μm, which is substantially equal to the depth of the hole 46. The width of the optical path conversion component main body 52 is set to about 150 μm, which is substantially equal to the width of the hole 46. Therefore, the optical path conversion component main body 52 has a size and shape that can be inserted into the hole 46 without difficulty.
[0053]
The support locking portion 53 is a rectangular flat plate-shaped member larger than the base end surface of the optical path conversion component main body 52, and the dimension of one side thereof is set to about 300 μm. Accordingly, the outer peripheral portion of the support locking portion 53 protrudes from the base end portion of the optical path conversion component main body 52 to the side by about several tens of μm. The base end surface of the optical path conversion component main body 52 is supported at the center of the lower surface of the support locking portion 53. In addition, the lower surface outer peripheral part and the whole upper surface of the support latching part 53 are flat.
[0054]
The optical path conversion component main body 52 and the support locking portion 53 are integrally formed using a common light transmissive material (PMMA in the present embodiment). This configuration is suitable for reliably reducing light transmission loss due to refraction, light leakage, and the like. In addition, the optical path conversion component 51 of the present embodiment, which is mainly made of a resin material, is excellent in handleability because it is unlikely to break or chip.
[0055]
The optical path conversion component 51 having the above configuration is attached to the optical waveguide structure 40 in a state where the optical path conversion component main body 52 is inserted into the hole 46 from the upper surface 45 side of the optical waveguide structure 40. At the time of component insertion shown in FIG. 2, the outer peripheral portion of the lower surface of the support locking portion 53 is locked to the opening edge of the hole 46. Further, the gap between the inner wall surface of the hole 46 and the optical path conversion component main body 52 is completely filled with an adhesive 63 made of a light transmissive material. By using the adhesive 63, the optical path conversion component 51 is firmly fixed to the hole 46. In the present embodiment, a transparent acrylic resin adhesive is used as the adhesive 63. The elimination of the air gap in the hole 46 contributes to a reduction in light transmission loss. Further, the refractive index of the adhesive 63 is set so as to be a substantially intermediate value between the refractive index of the core 43 and the refractive index of the optical path conversion component main body 52. In this case, for example, it is preferable to set the refractive index of the core 43 to 1.495, the refractive index of the adhesive 63 to 1.490, and the refractive index of the optical path conversion component main body 52 to 1.485.
[0056]
The general operation of the opto-electric composite mounting wiring board 10 configured as described above will be briefly described.
[0057]
The VCSEL 21 and the photodiode 31 are operable by supplying power via the conductor circuit 16 of the ceramic substrate 11. When an electrical signal is output from the driver IC 15 to the VCSEL 21, the VCSEL 21 converts the input electrical signal into an optical signal (laser light) and then emits the optical signal toward the optical path conversion component 51. At this time, the optical signal enters the inside from the upper surface of the support locking portion 53 of the optical path conversion component 51, then passes through the optical path conversion component main body 52 and reaches the metal film 55 on the inclined surface 54. Therefore, the optical signal is converted in the traveling direction by about 45 °, then passes through the optical path conversion component main body 52, exits from the side surface, and enters the core 43. That is, in the present embodiment, the support locking portion 53 and the optical path conversion component main body 52 constitute a part of the optical path. Thereafter, the light propagates along the longitudinal direction of the core 43 and reaches the light path conversion component 51 on the light receiving side. In the light path conversion component 51 on the light receiving side, first, an optical signal enters the inside from the side surface of the optical path conversion component main body 52, passes through the optical path conversion component main body 52, and reaches the metal film 55 on the inclined surface 54. (See arrows in FIGS. 2 and 3). Therefore, after the optical signal is changed in the traveling direction by about 45 °, the optical signal further passes through the optical path conversion component main body 52 and the support locking portion 53 and is emitted from the upper surface of the support locking portion 53. Finally, the optical signal enters the light receiving portion 32 of the photodiode 31 (see the arrows in FIGS. 2 and 3). The photodiode 31 converts the received optical signal into an electrical signal and outputs it to the receiver IC 17. The receiver IC 17 returns it to the state of the original electric signal and outputs it.
[0058]
Next, a method for manufacturing the opto-electric composite mounting wiring board 10 having the above-described configuration will be described with reference to FIGS.
[0059]
First, the optical path conversion component 51 is prepared in advance by the following procedure (optical path conversion component manufacturing step). A substrate 61 made of PMMA as shown in FIG. 4 is prepared, and V-groove processing with a dicing blade is performed on one side surface of the substrate 61. As a result, a V-shaped groove 62 having an inclination angle of 45 ° is formed (see FIG. 5). Next, a paste containing rhodium is prepared, and the paste is applied to the inner surface of the V-shaped groove 62 and dried to be cured. As a result, a metal film 55 having a thickness of several μm is formed (see FIG. 6). And it cuts and removes the unnecessary part in the base material 61, It shape | molds in a desired shape. As a result, the optical path conversion component 51 is completed.
[0060]
The ceramic substrate 11 is prepared in advance by the following procedure. A raw material slurry is prepared by uniformly mixing and kneading alumina powder, organic binder, solvent, plasticizer, etc., and this raw material slurry is used to form a sheet with a doctor blade device to form a green sheet having a predetermined thickness. . A predetermined portion of the green sheet is punched, and a metal paste for forming a via-hole conductor is filled in the formed hole. Moreover, the printing layer used as the conductor circuit 16 later is formed by printing a metal paste on the surface of a green sheet. Then, the plurality of green sheets are laminated and integrated to form a green sheet laminate. The green sheet laminate is dried, degreased, and fired according to a known technique to obtain a ceramic substrate 11.
[0061]
Further, the optical waveguide structure 40 is prepared in advance by the following procedure (optical waveguide structure manufacturing step). The lower clad 42 is first formed by applying 50 μm to 70 μm of a resin material (PMMA) for the lower clad 42 at a predetermined location on the upper surface 12 of the ceramic substrate 11 by a well-known method and drying it. In the same manner, the core 43 is applied and formed on the surface of the lower clad 42, and the upper clad 44 is applied and formed on the surfaces of the core 43 and the lower clad 42 (see FIG. 8). Thereafter, the entire ceramic substrate 11 is heated at a predetermined temperature for a predetermined time to cure the lower clad 42, the core 43 and the upper clad 44 constituting the optical waveguide structure 40.
[0062]
Next, a rectangular hole 46 is formed at two locations by performing laser drilling with a carbon dioxide laser on the optical waveguide structure 40 (see FIG. 9). Note that etching using photolithography may be performed instead of laser drilling. Specifically, after forming and drying the forming materials of the clads 42 and 44 and the core 43, a photomask is formed on the upper surface thereof, and the hole 46 is formed by performing exposure and development in this state, respectively.
[0063]
Subsequently, a component insertion process is performed according to the following procedure. First, the hole 63 is filled with the adhesive 63 (see FIG. 10), and in this state, the optical path conversion component main body 52 of the optical path conversion component 51 is inserted into the hole 46 (see FIG. 11). In this case, for example, the optical path conversion component main body 52 may be sucked and held by a vacuum chuck or the like. According to the present embodiment including the support locking portion 53, the optical path conversion component 51 can be handled without directly contacting the optical path conversion component main body 52 and the metal film 53. The height of the optical path conversion component main body 52 is set substantially equal to the depth of the hole 46, and the width of the optical path conversion component main body 52 is set approximately equal to the width of the hole 46. Therefore, by inserting the optical path conversion component main body 52 into the hole 46, the core 43 and the optical path conversion component main body 52 are simultaneously aligned. Therefore, complicated alignment work can be omitted, which is advantageous for cost reduction. In addition, the insertion of the optical path conversion component main body 52 can be easily determined and the displacement in the depth direction can be determined because the support locking portion 53 is a stopper that locks the opening edge of the hole portion 46 during insertion. Can be prevented in advance. Then, after the components are inserted, the entire ceramic substrate 11 is heated to a predetermined temperature to cure the adhesive 63, and the optical path conversion component 51 is firmly fixed to the hole 46.
[0064]
As a result, the optical waveguide structure 40 with a desired optical path changing part is completed. Then, if an optical element such as the VCSEL 21 is positioned and mounted on the pad 14 on the ceramic substrate 11, a further desired photoelectric composite mounting wiring substrate 10 is completed.
[0065]
Therefore, according to the present embodiment, the following effects can be obtained.
[0066]
(1) According to the present embodiment, since the optical path conversion component main body 52 can constitute a part of the optical path, the length of light passing through the optical path conversion component main body 52 is increased while the light is in the core. The length through which there is no space is reduced. Therefore, light easily reaches the metal film 55 of the optical path conversion component 51, and light leakage is prevented. Further, since the optical path conversion component main body 52 is inserted into the hole 46 provided in the optical waveguide structure 40, there is no inconvenience such as deformation of the core 43 and the like due to the optical path conversion component 51 being pushed up. . Therefore, for example, light leakage from the core 43 to the upper clad 44 can be reliably prevented. From the above, as a result of being able to reflect light with high efficiency by the metal film 55 of the optical path conversion component 51, light transmission loss is reduced, and efficient transmission of an optical signal can be realized.
[0067]
(2) According to the present embodiment, unlike the case where the concave optical path conversion part is processed and formed in a part of the optical waveguide structure 40 itself, the number of steps is small in manufacturing the optical waveguide structure 40 with the optical path conversion component. That's it. Thus, productivity can be improved and costs can be reduced. In addition, since the optical path conversion unit can be handled as a component separate from the optical waveguide structure 40, for example, when the optical path conversion component 51 is defective, only the optical path conversion component 51 can be replaced. . That is, it is not necessary to replace the entire optical waveguide structure 40, which contributes to cost reduction. In addition, by inserting the optical path conversion component main body 52 into the hole 46, the core 43 and the optical path conversion component main body 52 can be aligned at the same time. Therefore, complicated alignment work can be omitted, and further cost reduction can be achieved.
[Second Embodiment]
[0068]
Hereinafter, an optical waveguide structure 40 with an optical path conversion component of a second embodiment embodying the present invention will be described in detail with reference to FIGS. Here, differences from the above-described embodiment will be referred to, and description of common points will be omitted.
[0069]
As shown in FIG. 12, in this embodiment, a stepped portion 48 is provided on the opening edge of the hole 46 over the entire circumference. And the support latching | locking part 53 of the optical path conversion component 71 is latched by the opening edge in the state fitted in the level | step-difference part 48. FIG. The upper surface of the support locking portion 53 is substantially flush with the upper surface 45 of the optical waveguide structure 40. The depth dimension of the stepped portion 48 is about 20 μm to 50 μm, and is set slightly smaller than the thickness of the upper clad 44. The depth dimension of the stepped portion 48 is set substantially equal to the thickness of the support locking portion 53.
[0070]
The hole 46 having the stepped portion 48 as described above can be formed by the following method, for example. First, the optical waveguide structure 40 composed of three layers of the clads 42 and 44 and the core 43 is formed. Next, the region where the stepped portion 48 and the hole 46 are to be formed in the optical waveguide structure 40 is irradiated with laser light to form a non-penetrating recess. The depth of the recess is set slightly smaller than the thickness of the upper clad 44. Next, after setting the intensity of the laser light high, the region where the hole 46 is to be formed is irradiated with the laser light to form the hole 46 through. Of course, it is possible to form the hole 46 having the stepped portion 48 by using a conventionally known technique (for example, an etching method) other than the two-stage laser drilling.
[0071]
And according to the structure of this embodiment, the protrusion amount from the optical waveguide structure 40 of the optical path conversion component 71 becomes substantially zero. Therefore, the VCSEL 21 and the photodiode 31 can be disposed close to the upper surface 45 of the optical waveguide structure 40. Therefore, as a result of the distance between the light receiving unit 32 or the light emitting unit 22 and the metal film 55 that is a light reflector being reduced, the spread of light can be suppressed, and the light transmission loss can be reliably reduced. Moreover, this structure is preferable also when aiming at the thinning of the whole.
[0072]
FIG. 13 shows a modification of FIG. In the case of this modification, the stepped portion 48 is not provided over the entire periphery of the opening edge of the hole portion 46, and is provided only in a part. Correspondingly, the shape of the support locking portion 53 of the optical path conversion component 72 is slightly different from that of FIG. Even with such a configuration, it goes without saying that the same effects as those of FIG.
[Third Embodiment]
[0073]
Hereinafter, an optical waveguide structure 40 with an optical path conversion component of a third embodiment embodying the present invention will be described in detail with reference to FIG. Here, differences from the above-described embodiment will be referred to, and description of common points will be omitted.
[0074]
In the case of the optical path conversion component 81 of this embodiment, the inclined surface 54 of the optical path conversion component main body 52 is curved in a convex shape, and a metal film 55 is formed on the surface of the inclined surface 54. Therefore, the light reflection surface (that is, the surface in contact with the optical path conversion component main body 52) in the metal film 55 is concave. Therefore, when the light is reflected by such a light reflecting surface, a condensing effect is obtained, and reflected light having a small spot area can be obtained. Therefore, according to the configuration of the present embodiment, it is possible to further reduce the transmission loss of light.
[Fourth Embodiment]
[0075]
Hereinafter, an optical waveguide structure 40 with an optical path conversion component according to a fourth embodiment embodying the present invention will be described in detail with reference to FIG. Here, differences from the above-described embodiment will be referred to, and description of common points will be omitted.
[0076]
The optical path conversion component 91 of the present embodiment includes microlenses 92 having a diameter of about 30 μm to 80 μm at two locations in the substantially central portion of the upper surface of the support locking portion 53. These microlenses 92 are integrally formed by a mold forming method using a light-transmitting material (here, PMMA) common to the optical path conversion component main body 52 and the support locking portion 53.
[0077]
Therefore, for example, on the light receiving side of the optical waveguide structure 40, the light reflected by the metal film 55 and whose traveling direction is changed upward is condensed when passing through the microlens 92. As a result, it is possible to obtain reflected light with a small spot area. Therefore, according to the configuration of the present embodiment, the amount of light that can be incident on the light receiving unit 32 of the photodiode 31 is increased, and the light transmission loss can be further reduced.
[0078]
Also, according to this configuration, unlike the case where the micro lens is provided separately from the optical path conversion component 91, the number of components is increased and the distance between the optical waveguide structure 40 and the optical element (VCSEL 21 and photodiode 31). Can be avoided. This also contributes to a reduction in light transmission loss.
[0079]
In addition, you may change embodiment of this invention as follows.
[0080]
In the optical path conversion parts 51, 71, 72, 81, 91 of the above embodiments, only one light reflector such as the metal film 55 is provided for one part. However, the present invention is not limited to this, and two or more light reflectors can be provided.
[0081]
In each of the above embodiments, the optical path conversion components 51, 71, 72, 81, 91 are firmly fixed to the hole 46 by using the adhesive 63 when performing the component insertion process. However, the component insertion step may be performed without using the adhesive 63, and in this case, the correction work becomes easier.
[0082]
In each of the above embodiments, the hole 46 is formed after the optical waveguide structure 40 is formed on the ceramic substrate 11. However, after the hole 46 is formed in the optical waveguide structure 40, the optical waveguide structure is formed. 40 may be disposed on the ceramic substrate 11. Alternatively, after the hole 46 is formed in the optical waveguide structure 40 and the optical path conversion components 51, 71, 72, 81, 91 are inserted and held in the hole 46, the optical waveguide structure 40 with the optical path conversion component is mounted. It may be arranged on the ceramic substrate 11. In addition, the board | substrate which supports the optical waveguide structure 40 with an optical path conversion component does not necessarily need to be the ceramic substrate 11, For example, a resin substrate, a metal substrate, a glass substrate etc. may be sufficient.
[0083]
In each of the above embodiments, the light reflector made of the metal film 55 is formed on the inclined surface of the optical path conversion component main body 52. However, the present invention is not limited to this, and a metal body that is not in the form of a film, such as a minute metal plate or a minute metal lump, may be attached to the inclined surface 54 of the optical path conversion component main body 52.
[0084]
Next, in addition to the technical ideas described in the claims, the technical ideas grasped by the embodiment described above are listed below.
[0085]
(1) An optical path conversion component configured separately from the optical waveguide structure, which is made of a light-transmitting material, and can be inserted into a hole provided in the optical waveguide structure. An optical path conversion component comprising: an optical path conversion component main body that can constitute a portion; and a light reflector formed on the optical path conversion component main body.
[0086]
(2) An optical path conversion component configured separately from the optical waveguide structure, which is made of a light-transmitting material, and can be inserted into a hole provided in the optical waveguide structure. An optical path conversion component main body that can constitute a portion, a light reflector formed on the optical path conversion component main body, a support locking portion that supports the optical path conversion component main body and can be locked to the opening edge of the hole portion. The optical path conversion component main body and the support locking portion are integrally formed using a common light transmissive material.
[0087]
(3) An optical path conversion component configured separately from the optical waveguide structure, which is made of a light-transmitting material, can be inserted into a hole provided in the optical waveguide structure, and An optical path conversion component main body that can constitute a portion, a light reflector formed on the optical path conversion component main body, a support locking portion that supports the optical path conversion component main body and can be locked to the opening edge of the hole portion. A microlens formed on the optical path conversion component main body, and the optical path conversion component main body, the support locking portion, and the microlens are integrally formed using a common light-transmitting material. Characteristic optical path conversion component.
[0088]
(4) An optical path conversion component formed separately from the optical waveguide structure, which is a member having a substantially right-angled cross section made of a light-transmitting material, and in a hole provided in the optical waveguide structure An optical path comprising: an optical path conversion component main body that can be inserted into the optical path, and can constitute a part of the optical path; and a light reflector made of a metal film formed on a surface of the inclined surface of the optical path conversion component main body Conversion parts.
[0089]
(5) An optical path conversion component formed separately from the optical waveguide structure, which is a member having a substantially right-angled cross section made of a light-transmitting material, and in a hole provided in the optical waveguide structure An optical path conversion component body that can be inserted into the optical path, and can constitute a part of the optical path, a light reflector made of a metal film formed on the inclined surface of the optical path conversion component body, and a base of the optical path conversion component body It is a flat plate-like member that supports the end surface, and has a flat portion on the upper surface, and the outer peripheral portion has a support locking portion that can be locked to the opening edge of the hole portion. Optical path conversion parts characterized by
[0090]
(6) In the manufacturing method according to claim 5, a step of preparing the optical waveguide structure having the hole and the stepped portion in advance, the optical path conversion component main body, the light reflector, and the support member A step of preparing the optical path conversion component having a stop portion in advance, and inserting the optical path conversion component main body of the optical path conversion component into the hole of the optical waveguide structure, and the support locking portion And a step of locking the step with the step portion. A method of manufacturing an optical waveguide structure with an optical path conversion component.
[0091]
(7) In the manufacturing method of claim 11, in the step of preparing the optical waveguide structure having the hole in advance, the hole is formed by etching using photolithography or laser processing, In the step of preparing the optical path conversion component having the optical path conversion component main body in advance, a light reflector made of a metal film is formed on the surface of the optical path conversion component main body. A method for manufacturing a waveguide structure.
[0092]
(8) In the manufacturing method of claim 11, in the step of preparing the optical path conversion component having the optical path conversion component main body in advance, the optical path conversion component main body is first formed using a transparent resin material, and then A method of manufacturing an optical waveguide structure with an optical path conversion component, wherein a light reflector made of a metal film is formed by applying a metallic paste containing a glossy metal on a surface of an inclined surface of an optical path conversion component body .
[Brief description of the drawings]
FIG. 1 is an overall cross-sectional view showing a photoelectric composite mounting wiring board according to a first embodiment embodying the present invention.
FIG. 2 is a partial schematic cross-sectional view showing an optical waveguide structure with an optical path conversion component in the first embodiment.
FIG. 3 is a partial perspective view showing an optical waveguide structure with the optical path conversion component.
FIG. 4 is a schematic cross-sectional view showing a base material as a starting material in the manufacturing process of the optical path conversion component.
FIG. 5 is a schematic cross-sectional view showing a state in which V-groove processing is performed on a base material in the manufacturing process of the optical path conversion component.
FIG. 6 is a schematic cross-sectional view showing a state in which a metal film is formed in a V-shaped groove in the manufacturing process of the optical path conversion component.
FIG. 7 is a schematic cross-sectional view showing an optical path conversion component completed by cutting in the manufacturing process of the optical path conversion component.
FIG. 8 is a partial schematic cross-sectional view showing an optical waveguide structure before forming a hole.
FIG. 9 is a partial schematic cross-sectional view showing an optical waveguide structure after forming a hole.
FIG. 10 is a partial schematic cross-sectional view showing a state when an optical path conversion component is inserted into a hole.
FIG. 11 is a partial schematic cross-sectional view showing a state where an optical path conversion component is inserted into a hole.
FIG. 12 is a partial schematic cross-sectional view showing an optical waveguide structure with an optical path conversion component in a second embodiment.
FIG. 13 is a partial schematic cross-sectional view showing an optical waveguide structure with an optical path conversion component in a modification of the second embodiment.
FIG. 14 is a partial schematic cross-sectional view showing an optical waveguide structure with an optical path conversion component in a third embodiment.
FIG. 15 is a partial schematic cross-sectional view showing an optical waveguide structure with an optical path conversion component in a fourth embodiment.
FIG. 16 is a schematic cross-sectional view for explaining a problem of the first prior art.
FIG. 17 is a schematic cross-sectional view for explaining a problem of the first prior art.
FIG. 18 is a schematic sectional view for explaining a problem of the second prior art.
FIG. 19 is a schematic cross-sectional view for explaining a problem of the second prior art.
FIG. 20 is a schematic sectional view for explaining a problem of the second prior art.
FIG. 21 is a schematic sectional view for explaining a problem of the third prior art.
FIG. 22 is a schematic sectional view for explaining a problem of the third prior art.
FIG. 23 is a schematic sectional view for explaining a problem of the third prior art.
FIG. 24 is a schematic sectional view for explaining a problem of the third prior art.
[Explanation of symbols]
40 ... Optical waveguide structure with optical path conversion component 42 ... Lower clad 43 ... Core 44 ... Upper clad 45 ... Upper surface 46 as main surface ... Hole 48 ... Stepped portions 51, 71, 72, 81, 91 ... Optical path Conversion part 52 ... Optical path conversion part main body 53 ... Support locking part 54 ... Inclined surface 55 ... Metal film 63 as a light reflector ... Adhesive 92 ... Microlens

Claims (12)

A main surface, a core that extends along the main surface and serves as an optical path through which an optical signal propagates, a cladding that surrounds the core, and a hole that is located in the middle or at an end of the core and that opens in the main surface An optical waveguide structure having
An optical waveguide structure with an optical path conversion component, comprising: an optical path conversion component having an optical path conversion component main body that is made of a light transmissive material and is inserted into the hole and forms a part of the optical path. The optical waveguide structure with an optical path conversion component according to claim 1, wherein the optical path conversion component includes a light reflector formed on the optical path conversion component main body. The height of the optical path conversion component main body is set to be substantially equal to the depth of the hole, and the width of the optical path conversion component main body is set to be approximately equal to the width of the hole. An optical waveguide structure with an optical path conversion component as described in 1. The said optical path conversion component is further equipped with the support latching | locking part latched in the opening edge of the said hole while supporting the said optical path conversion component main body. Optical waveguide structure with optical path conversion components. The optical path according to claim 4, wherein a stepped portion is provided at an opening edge of the hole portion, and the support locking portion is locked to the opening edge while being fitted into the stepped portion. Optical waveguide structure with conversion parts. 6. The optical waveguide structure with an optical path conversion component according to claim 4, wherein the optical path conversion component main body and the support locking portion are integrally formed using a common light-transmitting material. The gap between the inner wall surface of the hole and the optical path conversion component main body is filled with an adhesive made of a light transmissive material, according to any one of claims 1 to 6. Optical waveguide structure with optical path conversion components. 8. The optical path conversion component according to claim 7, wherein the refractive index of the adhesive is set so as to be a substantially intermediate value between the refractive index of the core and the refractive index of the optical path conversion component main body. Optical waveguide structure with The optical path conversion component main body has an inclined surface having a positional relationship inclined with respect to the extending direction of the core, and a metal film as the light reflector is formed on the surface of the inclined surface. The optical waveguide structure with an optical path conversion component according to claim 2, wherein the optical waveguide structure has an optical path conversion component. The optical waveguide structure with an optical path conversion component according to any one of claims 1 to 9, wherein the optical path conversion component further includes a microlens. A main surface, a core that extends along the main surface and serves as an optical path through which an optical signal propagates, a cladding that surrounds the core, and a hole that is located in the middle or at an end of the core and that opens in the main surface With an optical path conversion component comprising: an optical waveguide structure having an optical path conversion component having an optical path conversion component body made of a light transmissive material and inserted into the hole portion to constitute a part of the optical path In the manufacturing method of the optical waveguide structure of
Preparing the optical waveguide structure having the hole in advance;
Preparing the optical path conversion component having the optical path conversion component body in advance;
Inserting the optical path conversion component main body of the optical path conversion component into the hole of the optical waveguide structure, and a method of manufacturing an optical waveguide structure with an optical path conversion component. An optical path conversion component configured separately from the optical waveguide structure,
An optical path conversion component comprising an optical path conversion component main body made of a light transmissive material, which can be inserted into a hole provided in the optical waveguide structure and can constitute a part of the optical path.

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